JP4709661B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging device including a prism that guides an optical image to a light receiving unit by changing an optical path of an optical axis of an objective optical system.

  Conventionally, various apparatuses have been developed that electronically capture a subject image using a solid-state image sensor. An imaging device using a CCD (charge coupled device) is also used for an electronic endoscope device or the like.

Japanese Unexamined Patent Publication No. 2000-125161 is disclosed as an application of a conventional imaging device to an endoscope apparatus. According to this imaging device, the optical axis of the objective optical system provided at the distal end portion of the endoscope is bent at a substantially right angle by the prism, and the light receiving portion of the solid-state imaging device disposed substantially parallel to the longitudinal axis of the insertion portion. This is a configuration for guiding an optical image. The solid-state imaging device is fixed to the front end side of a circuit board that is arranged substantially parallel to the solid-state imaging device on which electrical components are mounted. A plurality of signal lines are connected to the base end side of the circuit board.
JP 2000-125161 A

However, in the imaging device disclosed in Patent Document 1, a solid-state imaging device having a light receiving portion is disposed on the distal end side of a circuit board on which electronic components are mounted, and a signal line is connected to the proximal end side of the circuit board. It was a configuration. For this reason, when the length dimension of a circuit board becomes long, the malfunction that the rigid length of a solid-state imaging device becomes long arises. In order to solve this problem, there is a technique in which a flexible substrate is connected to the solid-state imaging device, and the flexible substrate is bent and routed around the back surface of the prism. However, in this technique, the assembly work is complicated, and there is a problem that it is difficult to stably secure the outer shape of the imaging device.The present invention has been made in view of the above circumstances, and the assembly workability, It is another object of the present invention to provide an imaging device that is excellent in reliability, downsized, and shortened.

The imaging apparatus of the present invention includes a prism that changes its optical path so as to guide the optical axis of the objective optical system disposed on the incident surface side to the light receiving unit of the image sensor disposed on the output surface side, and a proximal side from this prism A plurality of substrates of different sizes that are stacked and mounted and electrically connected to the image sensor, wherein the plurality of substrates that are stacked and mounted have a length dimension of the substrate disposed on the upper layer side, A plurality of substrates that are set to be longer than the length dimension of the substrate disposed on the lower layer side, and the prism-side end surfaces of the plurality of substrates that are stacked and mounted are arranged along the slope of the prism, and the plurality of substrates A signal cable connected to any one of the circuit boards, and an adhesive fixing part for fixing the slope of the prism and the plurality of boards .

  According to this configuration, a plurality of circuit boards are arranged in a stacked state in a space formed on the prism base end side.

  According to the present invention, it is possible to realize a small-sized imaging apparatus that is excellent in assembling workability and reliability, has a short hard length, and is small.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 5 relate to an embodiment of the present invention, FIG. 1 is a diagram for explaining the configuration of an imaging device disposed at the distal end of an endoscope, and FIG. 2 is a perspective view for explaining the configuration of a relay board. 3 is a perspective view illustrating the configuration of the mounting substrate, FIG. 4 is a diagram illustrating another configuration example of the imaging apparatus, and FIG. 5 is a diagram illustrating another configuration example of the imaging apparatus.

  As shown in FIG. 1, the distal end portion 10 constituting the insertion portion 2 of the endoscope 1 includes a distal end rigid portion 11 and a distal end cover portion 12. The distal end hard portion 11 is made of a hard member. The distal end cover portion 12 is made of, for example, resin, and is integrally provided on the distal end side of the distal end hard portion 11 by adhesion or the like. The distal end cover portion 12 is a protective member that prevents the distal rigid portion 11 from directly contacting a body cavity wall or the like. The distal end rigid portion 11 and the distal end cover portion 12 are each provided with an imaging hole 21, which is a through hole, an illumination hole 22, and a treatment instrument channel hole 23 in parallel to the longitudinal direction of the insertion portion. .

  A distal end bending piece 14 constituting the bending portion 13 of the insertion portion 2 is fixedly provided on the proximal end side of the distal end rigid portion 11. In addition, on the proximal end side of the distal end cover portion 12, a distal end rigid portion 11, a distal end bending piece 14, and a curved rubber 15 that covers a plurality of bending pieces (not shown) connected to the distal end bending piece 14 are provided. ing. A flexible tube portion (not shown) constituting the insertion portion 2 is connected to the proximal end side of the bending portion 13.

  For example, a pipe-shaped base 24 made of metal is inserted and fixed in the treatment instrument channel hole 23 formed in the distal end rigid portion 11. The base end portion of the base 24 protrudes from the base end surface of the distal end hard portion 11 by a predetermined amount. The base end portion of the base 24 is connected to a flexible channel tube 25 made of, for example, resin that constitutes a treatment instrument insertion channel. The channel tube 25 is inserted through the insertion portion 2 and extended toward the operation portion (not shown), and a base end portion thereof communicates with a treatment instrument insertion port provided in the operation portion (not shown). Therefore, a treatment instrument such as forceps inserted from the treatment instrument insertion port passes through the channel tube 25, the base 24, and the treatment instrument channel hole 23 and protrudes from the distal end portion 10.

  The illumination hole 22 formed in the distal end rigid portion 11 includes a recess 22a and a communication hole 22b communicating with the recess 22a. An illumination optical unit 31 is provided in the recess 22a, the communication hole 22b has a diameter smaller than that of the recess 22a, and the tip of the light guide fiber 32 is disposed.

  The illumination optical unit 31 includes an illumination lens frame 33 and a plurality of optical lenses 34 disposed in the illumination lens frame 33. The distal end surface of the light guide fiber 32 faces the proximal end surface of the optical lens 34 disposed on the proximal end side of the illumination optical unit 31. The proximal end portion of the light guide fiber 32 is detachably attached to a light source device (not shown) provided at the proximal end portion of a universal cord (not shown) that is inserted through the insertion portion 2 and extends from an operation portion (not shown). The endoscope connector is connected to the connector. Therefore, illumination light of an illumination lamp (not shown) provided in the light source device is transmitted through the light guide fiber 32 and is emitted from the distal end side of the illumination optical unit 31 to the outside.

  The imaging hole 21 formed in the distal end rigid portion 11 is composed of a recess 21a and, for example, a stepped attachment hole 21b. An imaging device 40 is disposed in the imaging hole 21. The imaging device 40 includes an objective optical unit 41 that is an objective optical system, a prism 42, a CMOS image sensor (hereinafter abbreviated as CMOS) 43 that is an image sensor, and a plurality of substrates 51, 52, 53, 61, and 62. , 71 and a signal cable 80 having a plurality of signal lines 81, 82, 83, 84,.

  The objective optical unit 41 includes an objective lens frame 44 and a plurality of optical lenses 45 arranged in the objective lens frame 44. The optical axis of the objective optical unit 41 is substantially parallel to the longitudinal direction of the insertion unit. The distal end side of the objective lens frame 44 is integrally fixed to the mounting hole 21b. The base end side of the objective lens frame 44 is disposed in a loosely fitted state in the recess 21a.

  The prism 42 changes the optical path of the optical axis at a substantially right angle. A centering lens 45 a disposed on the base end side of the objective optical unit 41 is disposed on the incident surface 42 a side of the prism 42. On the other hand, a cover glass 46 is disposed on the emission surface 42 b side of the prism 42. According to this configuration, an optical image that has passed through the objective optical unit 41 and is incident on the prism 42 from the incident surface 42a is optically path-converted within the prism 42 at a substantially right angle and is emitted from the emission surface 42b.

  The CMOS 43 is a single rectangular silicon chip. An image area 43a, which is a light receiving portion, is provided on the front end side, which is one surface of the CMOS 43, and a circuit portion 43b, such as a PGA or A / D conversion circuit, is provided on the base end side. The CMOS 43 is disposed so that the image area 43 a is parallel to the optical axis of the objective optical unit 41. The cover glass 46 is fixed with, for example, a UV curable adhesive so as to completely cover the image area 43a. A plurality of electrodes (not shown) are provided on the surface side of the CMOS 43 and around the circuit portion 43b so as to surround the circuit portion 43b.

  The plurality of substrates 51, 52, 53, 61, 62, 71 have a rectangular shape or a square shape. In the present embodiment, the first relay board 51, the second relay board 52, and the third relay board 53, the first mounting board 61, the second mounting board 62, the cable connection board 71, It has. The first mounting board 61 and the second mounting board 62 constitute a video processing dedicated DSP.

  The plurality of substrates 51, 52, 53, 61, 62, 71 are on the surface side of the CMOS 43 and on the circuit unit 43 b, the first relay substrate 51, the first mounting substrate 61, and the second relay substrate 52. The second mounting board 62, the third relay board 53, and the cable connection board 71 are stacked and mounted on the surface of the CMOS 43 substantially in parallel. In this configuration, the cable connection board 71 to which the signal lines 81 and the like are connected is disposed on the uppermost layer that is the position farthest from the CMOS 43.

  The substrates 51, 52, 53, 61, 62, 71 that are stacked and mounted on the front surface side of the CMOS 43 align the positions of the base end surfaces of the substrates 51, 52, 53, 61, 62, 71 and the base end surface of the CMOS 43. It is arranged to match. The length dimension of the cable connection board 71, that is, the length dimension in the insertion portion longitudinal axis direction, is set to a predetermined dimension L so that the front end surface of the cable connection board 71 is disposed in the vicinity of the slope 42c of the prism 42. ing.

  The third relay substrate 53 and the second mounting substrate 62 have the same dimensions. The length dimension is set to a length (L−a) shorter than the cable connection board 71 by a dimension so that the tip surface of the second mounting board 62 is disposed in the vicinity of the slope 42 c of the prism 42. The second relay substrate 52 and the first mounting substrate 61 have the same dimensions. The length dimension is set to a length (b) that is shorter than the third relay board 53 by b dimension so that the front end surface of the first mounting board 61 is disposed in the vicinity of the slope 42c of the prism 42. ing. Further, the length dimension of the first relay board 51 is set to be shorter than the second relay board 52 and the first mounting board 61 by a dimension c (Labc). The distal end surface of the first relay substrate 51 is located on the proximal end side of the prism 42.

  The configuration of the relay board will be described with reference to FIG. The relay boards 51, 52, and 53 have the same configuration, although the size of the outer shape, the size of the square holes, the number of through holes, and the positions of the through holes are different. Therefore, the configuration of the relay board will be described with reference to the third relay board 53 shown in FIG.

The third relay substrate 53 shown in the figure is made of, for example, ceramic, and is provided with a square hole 53a having a predetermined size at the center. As shown in FIG. 1, the first relay board 51 includes a square hole 51a, and the second relay board 52 includes a square hole 52a. Electronic components 55, 56, etc. are arranged in the square holes 51a, 52a, 53a.

  Around the square hole 53a, there are provided a plurality of through electrodes 54 that are electrically connected to the cable connection substrate 71 disposed on the front surface side and the second mounting substrate 62 disposed on the rear surface side. . The through electrode 54 includes a through hole 54a and a conductor 54b filled in the through hole 54a.

  In the through electrodes 54 provided on the respective relay substrates 51, 52 and 53, the number of through electrodes 54 provided on the base end side is larger than the number of the through electrodes 54 provided on the prism side which is the front end side. This stabilizes the stacked mounting state on the base end side of the substrate during stacked mounting.

  The second relay substrate 52 is provided with a through electrode 54 that electrically connects the second mounting substrate 62 disposed on the front surface side and the first mounting substrate 61 disposed on the back surface side. The first relay substrate 51 is provided with a through electrode 54 that electrically connects the first mounting substrate 61 disposed on the front surface side and the CMOS 43 disposed on the back surface side.

  The relay boards 51, 52, and 53 electrically connect the CMOS 43 and the first mounting board 61, the first mounting board 61 and the second mounting board 62, and the second mounting board 62 and the cable connection board 71. In addition to the function to perform, the spacing between the CMOS 43 and the first mounting substrate 61, the spacing between the first mounting substrate 61 and the second mounting substrate 62, and the spacing between the second mounting substrate 62 and the cable connection substrate 71, respectively. A spacer function is provided which is set at a predetermined interval and enables mounting of the electronic components 55, 56 and the like.

  The configuration of the mounting board will be described with reference to FIG. The mounting boards 61 and 62 have the same configuration, although the size of the outer shape, the type and number of electronic components to be mounted, and the number and position of electrodes are different. Therefore, the configuration of the mounting board will be described with reference to the second mounting board 62 shown in FIG.

  The second mounting substrate 62 shown in the figure is made of, for example, ceramic, and a ceramic capacitor and electronic components 55 and 56 such as transistors are mounted in the center of the substrate. A plurality of front surface electrodes 57, a mounting pad (not shown) and a wiring pattern (not shown) are provided on the front surface side of the second mounting substrate 62, and a plurality of back surface electrodes (not shown) are provided on the back surface side (not shown). And a wiring pattern (not shown). The position of the surface electrode 57 provided on the surface side of the second mounting substrate 62 corresponds to the position of the through electrode 54 provided on the third relay substrate 53 laminated on the mounting substrate 62. That is, in a state where the third relay substrate 53 is stacked and mounted on the surface side of the second mounting substrate 62, the electronic components 55 and 56 are disposed in the square holes 53a, and the through electrode 54 and the surface electrode 57 are electrically connected. Will be in a continuous state.

  On the other hand, the position of the back surface electrode provided on the back surface side (not shown) of the second mounting substrate 62 is different from the position of the surface electrode 57 provided on the front surface side. Specifically, the positions of the plurality of back surface electrodes provided on the back surface side of the mounting substrate 62 correspond to the positions of the through electrodes 54 provided on the second relay substrate 52.

  As shown in FIG. 1, in the first mounting substrate 61, electronic components 55 and 56 are mounted on the front surface side and the back surface side, respectively. The position of the surface electrode (not shown) provided on the front surface side of the first mounting substrate 61 corresponds to the position of the through electrode 54 provided on the second relay substrate 52. On the other hand, the position of the back surface electrode (not shown) provided on the back surface side of the first mounting substrate 61 is a position different from the front surface electrode, and the through electrode provided on the first relay substrate 51. This corresponds to position 54.

  Therefore, in a state where the second relay substrate 52 is stacked and mounted on the surface side of the first mounting substrate 61, the electronic component 55 is disposed in the square hole 52a, and the through electrode 54 and the surface electrode are electrically connected. It will be in the state. On the other hand, in a state where the first mounting substrate 61 is stacked and mounted on the front surface side of the first relay substrate 51, the electronic component 56 is disposed in the square hole 51a, and the through electrode 54 and the back electrode are electrically connected. It becomes a state. The through electrode 54 provided in the first relay substrate 51 is in electrical continuity with the electrodes provided in the periphery of the circuit portion 43 b in a state where the first relay substrate 51 is stacked and mounted on the CMOS 43.

  Although illustration is omitted, on the surface of the cable connection board 71, signal line connection pads are provided on which signal lines 81, 82, 83, 84 constituting the signal cable 80 are arranged and connected. On the other hand, a back electrode is provided on the back surface of the cable connection board 71 at a position corresponding to the through electrode 54 of the third relay board 53. The signal line connection pad and the back electrode are electrically connected via a through electrode or a wiring pattern (not shown).

  Further, the plurality of signal lines 81, 82, 83, 84 are coaxial lines or simple lines, and the signal cable 80 is constituted by a coaxial line or simple lines twisted and bundled together with an insulating tube. The signal cable 80 extended from the imaging device 40 is inserted into the insertion portion 2 and extended toward the operation portion (not shown), and its base end portion is detachable from an observation device (not shown) having a display portion. It is arranged on a video connector (not shown) to be connected. Accordingly, power is supplied from the observation device to the imaging device 40 via the signal line, while the video signal output from the imaging device 40 via the signal line is input to the observation device, so that An endoscopic image is displayed on the display unit.

  Here, an assembly procedure of the imaging device 40 will be described.

  First, in assembling the imaging device 40, an objective optical unit 41, a prism 42, and a CMOS 43 are prepared. In the objective optical unit 41, a plurality of optical lenses 45 other than the centering lens 45a are provided. In the CMOS 43, the image area portion 43a of the CMOS 43 is previously closed with a cover glass 46, and substrates 51, 61, 52, 62, 53, and 71 are stacked and mounted in advance on the circuit portion 43b.

  Next, the emission surface 42b side of the prism 42 is bonded and fixed to the cover glass 46 using, for example, a UV curable adhesive. At that time, with the side surface of the prism 42 being held, the emission surface 42b is arranged on the cover glass 46 from the front end side of the CMOS 43, and the image area 43a is centered.

  Next, a centering lens 45a is centered and bonded and fixed at a predetermined position on the incident surface 42a side of the prism 42 fixed to the CMOS 43. Thereafter, the centering lens 45 a is bonded and fixed to the objective lens frame 44. As a result, the objective optical unit 41 is integrally attached to the prism 42.

  Next, the signal lines 81, 82, 83, 84 of the signal cable 80 are arranged on the signal line connection pads provided on the surface of the cable connection board 71 and fixed by soldering. Thereafter, the slope 42c located on the base end side of the prism 42, the first relay board 51, the first mounting board 61, the second relay board 52, the second mounting board 62, the third relay board 53, And an adhesive 85 is poured between the front end face of the cable connection board 71. Thus, the prism 42, the first relay board 51, the first mounting board 61, the second relay board 52, the second mounting board 62, the third relay board 53, and the cable connection board 71 are formed. It is fixed integrally.

  Thereafter, a shield frame 96 is joined to the base end portion of the objective lens frame 44, and an insulating filler 97 is sealed inside the shield frame 96. Further, the shield frame 96 is covered with an insulating cover 98. At this time, the distal end side of the insulating cover 98 is disposed on the objective lens frame 44, and the proximal end side is disposed on the insulating tube surface of the signal cable 80.

  In this manner, by arranging a plurality of substrates on which electronic components are mounted in a stacked manner on the base end side of the prism, it is possible to realize high-density mounting and shorten the rigid length of the imaging device. In addition, it is possible to prevent the hard length from becoming longer by aligning the base end surfaces of the respective substrates. Furthermore, by disposing the front end surface of the mounting substrate along the slope of the prism, the mounting area of the mounting substrate stacked above can be increased and the mounting density can be improved.

  Moreover, by mounting electronic components that generate heat on a circuit board that is stacked and mounted, the image sensor and the circuit board that mounts the electronic components that generate heat can be separated from each other, and an excessive temperature rise of the image sensor can be suppressed. .

  Furthermore, the mechanical strength can be strongly stabilized by integrally bonding and fixing the back surface of the prism and the front end surface of the laminated substrate.

  In addition, the connection surface to which the signal line of the signal cable is connected is the uppermost substrate having the largest mounting area and the most spaced from the image sensor. As a result, it is possible to improve the soldering workability, and more reliably prevent the heat during soldering from being transmitted to the image sensor, thereby improving the reliability of the imaging device. .

  Note that the imaging device is not limited to the one provided in the electronic endoscope, and the imaging device may be provided in, for example, a camera connected to the eyepiece portion of the optical endoscope. Good.

Another configuration example of the imaging apparatus will be described with reference to FIG.
As shown in the figure, the imaging apparatus 40A of this embodiment includes the objective optical unit 41, the prism 42, the CCD 43A, the CCD fixed substrate 47, the plurality of mounting substrates 63 and 64, and the plurality of signal lines 85 (not shown). , 86, 87,... In addition, the code | symbol 43c is an imaging surface and the code | symbol 46A is a cover glass. The cover glass 46A is fixed with, for example, a UV curable adhesive so as to completely cover the imaging surface 43c.

  The CCD fixing substrate 47 is made of ceramic and is formed in a substantially inverted L shape, and includes a thin plate-like sensor fixing portion 47a and a prismatic mounting substrate connecting portion 47b. The mounting board connecting portion 47b is configured to protrude from the surface of the sensor fixing portion 47a by a predetermined amount. The surface of the mounting board connecting portion 47b is substantially parallel to the surface of the sensor fixing portion 47a.

  The CCD 43A is placed at a predetermined position on the surface side of the sensor fixing portion 47a constituting the CCD fixing substrate 47. An electrode (not shown) provided on the CCD 43A is electrically connected to an electrode (not shown) provided on the surface of the sensor fixing portion 47a via the bonding wire 48. Further, the periphery of the bonding wire 48 is sealed and fixed by a sealing resin 49a.

  On the cover glass 46A covering the image pickup surface 43c of the CCD 43A, the emission surface 42b of the prism 42 is bonded and fixed with a UV curable adhesive in the centered state. As a result, the mounting board connecting portion 47b is positioned on the base end side of the prism.

  Electronic components 55 and 56 are mounted on the first mounting board 63 and the second mounting board 64, respectively. The length dimension of the mounting board connecting portion 47b in the longitudinal axis direction, the length dimension of the first mounting board 63, and the length dimension of the second mounting board 64 are the mounting board connecting portion 47b, the first mounting board 63, The length is set in the order of the second mounting board 64.

  The first mounting board 63 is mounted on the front surface side of the mounting board connecting portion 47b through, for example, bumps 50. A second mounting board 64 is mounted on the surface side of the first mounting board 63 via bumps 50. Then, a sealing resin 49 b is filled in the connection portion by the bump 50.

  The position of the base end surface of the first mounting substrate 63 stacked and mounted on the mounting substrate connecting portion 47b matches the position of the base end surface of the second mounting substrate 64. Further, the base end surfaces of the substrates 63 and 64 coincide with the base end surfaces of the mounting board connecting portion 47b. Therefore, the front end surface of the first mounting substrate 63 and the front end surface of the second mounting substrate 64 are disposed substantially along the slope of the prism 42.

  The electronic component 55 mounted on the first mounting board 63 is, for example, disposed on the back surface between the inclined surface of the prism 42 and the front end side surface of the mounting board connecting portion 47b. On the other hand, the electronic component 56 mounted on the second mounting substrate 64 is disposed, for example, on the prism 42 side on the surface side. Further, a signal line connection pad (not shown) is provided at the base end portion on the surface side of the second mounting substrate 64. Then, the signal lines 85, 86, 87 of the signal cable 80 </ b> A are soldered and fixed to the front surface side base end portion of the second mounting substrate 64.

  Also in the present embodiment, the slope 42c located on the proximal end side of the prism 42, the distal end surface of the first mounting substrate 63, the distal end surface of the second mounting substrate 64, and the distal end side surface of the mounting substrate connecting portion 47b. An adhesive 85 is poured between the prism 42, the first mounting board 63, the second mounting board 64, and the mounting board connecting portion 47b. The mounting boards 63 and 64 are provided with a wiring pattern (not shown) or a connection pad portion.

  According to this configuration, by appropriately setting the protruding height dimension of the mounting board connecting portion, the arrangement position of the mounting board stacked and mounted on the mounting board connecting portion is separated from the surface of the sensor fixing portion by a predetermined distance. Can do. Thus, by setting the protruding height so that the mounting area of the mounting board is increased, the imaging device can be configured with a small number of mounting boards. Other operations and effects are the same as those in the above-described embodiment.

Another configuration example of the imaging apparatus will be described with reference to FIG.
As shown in the figure, the imaging device 40B of this embodiment includes the objective optical unit 41, the prism 42, the CCD 43B, the hybrid substrate 90, the cable connection substrate 93, and a plurality of signal lines 85, 86, 87, not shown. Are mainly composed of a signal cable 80A having. Reference numeral 43d is an imaging surface, and reference numeral 46B is a cover glass.

  The hybrid substrate 90 includes a flexible substrate 91 and a hard substrate 92. The hard substrate 92 is made of ceramic, and is formed in a prismatic shape having a substantially L-shaped cross section and a convex portion 92a.

  An opening 91 a is formed on the distal end side of the flexible substrate 91. The flexible substrate 91 is electrically connected to the CCD 43B. In the connected state, the opening 91a is disposed on the imaging surface 43d. Thus, the imaging surface 43d is exposed without being blocked by the flexible substrate 91.

  The cover glass 46B is bonded and fixed to the front surface side of the flexible substrate 91 so as to completely cover the opening 91a. Then, the imaging surface 43d is completely covered with the cover glass 46B. On the cover glass 46B fixed to the flexible substrate 91 so as to cover the imaging surface 43c of the CCD 43B, the emission surface 42b of the prism 42 is bonded and fixed in a state of being centered. As a result, the hard substrate 92 is positioned on the proximal end side of the prism 42, and the distal end surface of the convex portion 92a of the hard substrate 92 is disposed in the vicinity of the inclined surface 42c.

The cable connection board 93 is stacked and mounted on the upper surface of the hard board 92 via the bumps 50. Then, a sealing resin 94 is filled in a connection portion by the bump 50. The base end face of the cable connection board 93 and the base end side face of the hard board 92 coincide with each other. The front end surface of the cable connection board 93 is disposed in the vicinity of the inclined surface 42 c of the prism 42. Also in the present embodiment, the slope 42 c positioned on the proximal end side of the prism 42, the distal end surface of the cable connection substrate 93, the distal end side surface of the convex portion 92 a of the rigid substrate 92, and the distal end side surface of the rigid substrate 92 are arranged. The prism 85, the cable connection board 93, and the hard board 92 are integrally fixed by pouring the adhesive 85 into the board, and the flexible board 92 is disposed substantially parallel to the longitudinal axis. An electronic component is mounted on the flexible substrate 91 or the hard substrate 92. The hard substrate 92 is provided with a wiring pattern (not shown).
According to this configuration, it is possible to obtain the same operations and effects as the above-described embodiment.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

The figure explaining the structure of the imaging device arrange | positioned at the front-end | tip part of an endoscope The perspective view explaining the composition of a relay substrate A perspective view explaining the configuration of the mounting board FIG. 6 illustrates another configuration example of an imaging device 3A and 3B illustrate another configuration example of an imaging device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Endoscope 2 ... Insertion part 10 ... Tip part 40 ... Imaging device 41 ... Objective optical part 42 ... Prism 43 ... CMOS 43a ... Image area part 43b ... Circuit part 44 ... Lens frame 45 ... Optical lens 46 ... Cover glass 51 ... first relay board 52 ... second relay board 53 ... third relay board 55 ... electronic component 56 ... electronic component 61 ... first mounting board 62 ... second mounting board 71 ... cable connection board 80 ... signal cable

Claims (5)

A prism that changes the optical path so as to guide the optical axis of the objective optical system disposed on the incident surface side to the light receiving unit of the image sensor disposed on the exit surface side;
A plurality of substrates of different sizes that are stacked and mounted on the base end side from the prism and are electrically connected to the image sensor, wherein the plurality of substrates that are stacked and mounted are arranged on the upper layer side A plurality of substrates in which the prism-side end surfaces of the plurality of substrates to be stacked and mounted are arranged along the slope of the prism. When,
A signal cable connected to any one of the plurality of boards, and
An adhesive fixing part for fixing the slope of the prism and the plurality of substrates;
An imaging apparatus comprising:   2. The image sensor according to claim 1, wherein the image sensor includes an image area portion that is the light receiving portion and a circuit portion on one silicon chip, and the plurality of substrates are stacked and mounted on the circuit portion. Imaging device.   The imaging apparatus according to claim 1, wherein the image sensor and the plurality of substrates that are stacked and mounted are connected via another substrate. Each of the proximal end face of the plurality of substrates to be stacked and mounted, the imaging device according to the stacked mounting to coincide claims 1, wherein any one of claims 3. In the plurality of substrates to be stacked and mounted, the imaging device according to any one of claims 1 to 4, characterized in that for connecting the signal cable to a circuit board arranged in the uppermost layer.

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