JP6099541B2 - Endoscope and endoscope manufacturing method - Google Patents

Description

  The present invention relates to an endoscope in which an imaging unit that images the inside of a subject is provided at the distal end of an insertion portion that is inserted into the subject, and an endoscope manufacturing method.

  Conventionally, endoscopes have been widely used for various examinations in the medical field and the industrial field. For example, a medical endoscope apparatus inserts an insertion portion of a flexible endoscope having an elongated shape with a solid-state imaging device provided at the tip into a body cavity of a subject such as a patient. Therefore, an in-vivo image in a body cavity can be acquired without incising the subject, and further, a treatment tool can be projected from the distal end of the insertion portion as necessary, so that it is widely used.

  In such an endoscope apparatus, it is required to reduce the diameter of the insertion portion of the endoscope. Therefore, a cable including a signal line for driving a solid-state image sensor, a signal line for power supply, and a signal line for transmitting an output signal from the solid-state image sensor, an electronic component, or the like can be accommodated within the projection area of the solid-state image sensor. Thus, a configuration has been proposed in which the solid-state imaging device is reduced in diameter (see, for example, Patent Document 1).

JP 2000-199863 A

  When a cable, an electronic component, or the like is disposed so as to be within the projected area of the solid-state imaging device as in the technique described in Patent Document 1, a cable connection portion on the circuit board, a mounting portion of the electronic component, a wiring pattern, etc. Installation area is limited, and cable connection parts and electronic parts mounting parts will be densely arranged. Considering connection and mounting work of cables and electronic parts, further wiring and electronic parts etc. Densification is difficult.

  The present invention has been made in view of the above, and an object of the present invention is to provide an endoscope that realizes a thinner insertion portion and a method for manufacturing the endoscope.

  In order to solve the above-described problems and achieve the object, an endoscope according to the present invention includes a solid-state imaging device having a light receiving unit and an element terminal on one surface, and the one of the solid-state imaging devices. A rigid substrate provided on the opposite side of the surface and having a notch formed on the surface, a flexible substrate connected to the element terminal at the tip and facing the notch, and the flexible And a second cable connected to the cutout portion. The first cable is connected to a surface of the conductive substrate facing the cutout portion, and the second cable is connected to the cutout portion.

  In the endoscope manufacturing method according to the present invention, a notch portion is formed on the surface of the solid-state imaging device having the light receiving portion and the element terminal on one surface, on the opposite side of the one surface. A step of connecting a hard substrate, a step of connecting a first cable to the notch, a step of connecting a second cable to the flexible substrate, and a tip of the flexible substrate as the element. Connecting the flexible substrate and the hard substrate so that a surface of the flexible substrate connected to the second cable faces the notch, and a step of connecting to the terminal; It is provided with.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the endoscope which implement | achieves diameter reduction of an insertion part, and an endoscope can be provided.

FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention. FIG. 2 is a partial cross-sectional view of the distal end of the endoscope shown in FIG. FIG. 3 is a partial cross-sectional view of the imaging unit according to Embodiment 1 of the present invention. FIG. 4 is a plan view of the multilayer substrate according to the first embodiment of the present invention. FIG. 5 is a schematic diagram for explaining a manufacturing process of the imaging unit according to the first embodiment of the present invention. FIG. 6 is a schematic diagram of a flexible substrate and a solid-state imaging device according to Modification 1 of Embodiment 1 of the present invention. FIG. 7A is a schematic diagram for explaining a manufacturing process of the imaging unit according to the second modification of the first embodiment of the present invention. FIG. 7B is a schematic diagram for explaining a manufacturing process of the imaging unit according to the second modification of the first embodiment of the present invention. FIG. 8A is a plan view of an imaging unit according to Embodiment 2 of the present invention. FIG. 8B is a plan view of the imaging unit according to Embodiment 3 of the present invention.

  In the following description, an endoscope apparatus including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

(Embodiment 1)
FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention. As shown in FIG. 1, the endoscope apparatus 1 includes an endoscope 2, a universal cord 5, a connector 6, a light source device 7, a processor (control device) 8, and a display device 10.

  The endoscope 2 takes an in-vivo image of the subject and outputs an imaging signal by inserting the insertion portion 3 into the body cavity of the subject. The cable inside the universal cord 5 extends to the distal end of the insertion portion 3 of the endoscope 2 and is connected to an imaging unit provided at the distal end portion 3 b of the insertion portion 3.

  The connector 6 is provided at the base end of the universal cord 5, is connected to the light source device 7 and the processor 8, and is a predetermined signal as an imaging signal (output signal) output from the imaging unit of the distal end portion 3 b connected to the universal cord 5. In addition to processing, the imaging signal is converted from analog to digital (A / D conversion) and output as an image signal.

  The light source device 7 is configured using, for example, a white LED. The pulsed white light that is turned on by the light source device 7 becomes illumination light that is emitted toward the subject from the distal end of the insertion portion 3 of the endoscope 2 via the connector 6 and the universal cord 5.

  The processor 8 performs predetermined image processing on the image signal output from the connector 6 and controls the entire endoscope apparatus 1. The display device 10 displays the image signal processed by the processor 8.

  An operation unit 4 provided with various buttons and knobs for operating the endoscope function is connected to the proximal end side of the insertion unit 3 of the endoscope 2. The operation unit 4 is provided with a treatment instrument insertion port 4a for inserting a treatment instrument such as a biological forceps, an electric knife and an inspection probe into the body cavity of the subject.

  The insertion portion 3 is connected to the distal end portion 3b where the imaging unit is provided, the bending portion 3a which is connected to the proximal end side of the distal end portion 3b and can be bent in the vertical direction, and the proximal end side of the bending portion 3a. And a flexible tube portion 3c. The bending portion 3a is bent in the vertical direction by the operation of a bending operation knob provided in the operation portion 4, and can be bent in, for example, two directions, up and down, as the bending wire inserted into the insertion portion 3 is pulled and loosened. It has become. Note that the vertical direction here coincides with the vertical direction of the image displayed on the display device 10. Moreover, the up-down direction in this specification is a direction orthogonal to the direction (longitudinal direction) in which the insertion portion 3 extends, and is a direction opposite to each other.

  The endoscope 2 is provided with a light guide 32 (FIG. 2) that transmits illumination light from the light source device 7, and the illumination light is irradiated toward the subject.

  Next, the configuration of the distal end portion 3b of the endoscope 2 will be described in detail. FIG. 2 is a partial cross-sectional view of the distal end of the endoscope 2. FIG. 3 is a partial cross-sectional view of the imaging unit according to Embodiment 1 of the present invention. FIG. 4 is a plan view of the multilayer substrate according to the first embodiment of the present invention.

  2 and 3 are cross-sectional views taken along a plane orthogonal to the substrate surface of the imaging unit provided at the distal end portion 3b of the endoscope 2 and parallel to the optical axis direction of the imaging unit. It is. FIG. 2 illustrates a distal end portion 3b of the insertion portion 3 of the endoscope 2 and a part of the bending portion 3a. In FIG. 2, the upward direction (UP) corresponds to the upward direction of the curved portion 3a and the upward direction of the image displayed on the display device 10, and the downward direction (DOWN) corresponds to the downward direction of the curved portion 3a and the display. This corresponds to the downward direction of the image displayed on the device 10. FIG. 4 shows members disposed on the multilayer substrate 14, but members indicated by broken lines indicate members disposed on the surface of the flexible substrate 16 disposed to face the multilayer substrate 14. .

  As shown in FIG. 2, the bending portion 3 a can be bent in the vertical direction as the upper bending wire 35 and the lower bending wire 36 inserted into the bending tube disposed inside the cladding tube 30 a are pulled and loosened. An imaging unit is provided inside the distal end portion 3b extending to the distal end side of the curved portion 3a. The cladding tube 30a is made of a flexible member so that the bending portion 3a can be bent.

  The imaging unit includes a lens unit 11 and a solid-state imaging device 13 disposed on the proximal end side of the lens unit 11, and is bonded to the inside of the distal end portion body 30b with an adhesive. The tip portion main body 30b is formed of a hard member for forming an internal space for accommodating the imaging unit. The distal end portion 3 b where the distal end portion main body 30 b is disposed is a hard portion of the insertion portion 3. The length (hard length) of the hard portion is from the distal end of the insertion portion 3 to the proximal end of the distal end portion main body 30b.

  The lens unit 11 has a plurality of objective lenses and a lens holder that holds the objective lens, and the tip of the lens holder is fixed to the tip portion main body 30b by being inserted and fixed inside the tip portion main body 30b. Is done.

The imaging unit includes a solid-state imaging device 13 that generates an electrical signal according to incident light, such as a CCD or a CMOS, a flexible flexible substrate 16 that extends from the solid-state imaging device 13 in the optical axis direction, and a plurality of conductor layers. A hard laminated substrate (hard substrate) 14 and a cover glass 12 that adheres to the solid-state image sensor 13 in a state of covering the light-receiving surface (light-receiving portion) of the surface of the solid-state image sensor 13 are provided.
In order to reduce the diameter of the distal end portion 3b of the endoscope 2, it is preferable that the cross-sectional area of the imaging unit orthogonal to the optical axis direction is as small as possible, including the multilayer substrate 14, the electronic component 15, and the cables 33 and 34. The entire image pickup unit is disposed so as to be within a projection region obtained by projecting the solid-state image pickup device 13, the cover glass 12, and the flexible substrate 16 in the optical axis direction. The solid-state imaging device 13 has a light receiving surface (light receiving portion) on its surface and an element terminal (lower electrode) disposed on the same surface as the light receiving surface.

  The image of the subject 9 imaged by the lens unit 11 is detected by the solid-state imaging device 13 disposed at the imaging position of the lens unit 11 and converted into an imaging signal. The imaging signal (output signal) is sent to the processor 8 via the flexible substrate 16, the laminated substrate 14, the electronic component (second chip) 15, and the cable 33a (when the cable 33a is used as an output signal line). Is output.

  A cutout portion 14 a is provided on the surface (opposing surface) of the multilayer substrate 14 of the imaging unit that faces the flexible substrate 16. The cutout portion 14a is formed with a component connection land (terminal) 18a, a cable connection land 18 (terminal) b, and a board connection land (terminal) 18c. One or more electronic components 15 are mounted on the cutout portion 14a on the upper surface among the plurality of electronic components constituting the drive circuit of the solid-state imaging device 13 on the multilayer substrate 14. Note that one or more electronic components may be embedded in the multilayer substrate 14 so as to be mounted therein. In the present embodiment, for example, the electronic component 15 constituting the transmission buffer (second chip) of the solid-state image sensor 13 is mounted on the component connection land 18a. The members (electronic component 15 and cables 33a to 33c) arranged in the cutout portion 14a are arranged so as to avoid the members (cables 34a and 34b) arranged on the flexible substrate 16.

  The cable connection land 18b is electrically and mechanically connected to the cable 33a, the cable 33b, and the conductor at the tip of the cable 33c. The laminated substrate 14 is formed with vias that electrically connect the plurality of conductor layers. Note that electronic components other than the electronic components that constitute the drive circuit of the solid-state imaging device 13 may be mounted on the multilayer substrate 14. Further, the electronic component 15 may not be disposed in the cutout portion 14a, and only the cable 33 may be disposed. Conversely, only the electronic component 15 may be disposed and the cable 33 may not be disposed.

  In the present embodiment, the cable 33a is used as an output signal signal line for transmitting the output signal of the solid-state imaging device 13. The cable 33b and the cable 33c are used as power signal lines for supplying power to the solid-state imaging device 13. The cable 33a has a larger diameter than the cables 33b and 33c and the cables 34a and 34b.

  In addition, it is preferable that the height H of the notch portion 14a is equal to or greater than the maximum diameter (including the outer skin) of the cable having the largest diameter (the cable 33a in the present embodiment). By doing in this way, the cable (cable 33a in this embodiment) having the thickest diameter comes into contact with the surface (facing surface) facing the laminated substrate 14 of the flexible substrate 16, and the flexible substrate 16 is substantially straight. Can be arranged in a shape. Note that the cable 34 connected to the flexible substrate 16 may be a cable having the maximum diameter. In that case, the flexible substrate 16 can be disposed substantially linearly by the cable 34 having the maximum diameter coming into contact with the bottom surface of the cutout portion 14a of the laminated substrate 14.

  In the first embodiment, the stacking direction of the stacked substrate 14 is a direction orthogonal to the longitudinal direction of the insertion portion 3 of the endoscope 2 (a direction parallel to the light receiving surface of the solid-state imaging device 13). It may be the longitudinal direction of the insertion portion 3 of the endoscope 2 (the direction perpendicular to the light receiving surface of the solid-state imaging device 13).

  The inner leads 17 of the flexible substrate 16 are electrically connected to the element terminals of the solid-state imaging device 13 and covered with a sealing resin (adhesive), whereby the solid-state imaging device 13 and the flexible substrate 16 are connected. The flexible substrate 16 is a flexible printed circuit board, and extends from the solid-state image sensor 13 in the optical axis direction of the solid-state image sensor 13. That is, the flexible substrate 16 is disposed substantially linearly on the base end side along a side surface (lower side surface in the present embodiment) orthogonal to the light receiving surface of the solid-state imaging device 13.

  On the surface (facing surface) of the flexible substrate 16 facing the laminated substrate 14, a substrate connection land (terminal) 19 a for electrically connecting the flexible substrate 16 and the laminated substrate 14, and cables 34 (34 a and 34 b). ) Are connected to the cable connection lands (terminals) 19b to which the conductors at the tips of the two are electrically and mechanically connected. The board connection land 19 a is connected to the board connection land 18 c of the multilayer substrate 14. A cable 34a and a cable 34b are connected to the cable connection land 19b. The members (cables 34a and 34b) arranged on the flexible substrate 16 are arranged so as to avoid the members (electronic component 15 and cables 33a to 33c) arranged in the notch portion 14a. It is possible to arrange the electronic component 15 on the facing surface of the flexible substrate 16.

  In the present embodiment, the cable 34 a and the cable 34 b are used as drive signal signal lines that supply a drive signal to the solid-state imaging device 13. The signal of the cable 34 (34a and 34b) connected to the flexible substrate 16 may be routed through the laminated substrate 14 via the substrate connection lands 18c and 19a, or may be routed through the laminated substrate 14. Instead, it may be input to the solid-state imaging device 13.

  The flexible substrate 16 is connected to the element terminal of the solid-state image pickup device 13 via the inner lead 17, and then bent so as to wrap around the lower side surface of the solid-state image pickup device 13. Connected to. Therefore, in order to prevent a short circuit between the inner lead 17 and the solid-state image sensor 13, it is preferable to previously form an insulating resin 40 on the lower side surface of the solid-state image sensor 13 and its peripheral part.

  FIG. 5 is a schematic diagram for explaining a manufacturing process of the imaging unit according to the first embodiment of the present invention. In the first embodiment, before the flexible substrate 16 is bent and connected to the laminated substrate 14, the cables 34 a and 34 b are mounted on the facing surface of the flexible substrate 16, and the cable 33 and the electronic device are mounted on the cutout portion 14 a of the laminated substrate 14. The component 15 is mounted.

  Specifically, first, the multilayer substrate 14 is connected to the back surface of the surface having the light receiving portion of the solid-state imaging device 13. Thereafter, at least one of the cables 33 and 34 and the electronic component 15 is mounted on each of the notched portions 14a of the multilayer substrate 14 and the surfaces of the flexible substrate 16 facing the multilayer substrate 14. In the example shown in FIG. 5, the electronic component 15 is connected to the component connection land 18 a formed in the cutout portion 14 a of the multilayer substrate 14 by solder or the like, and the cables 33 a to 33 c are formed in the cutout portion 14 a of the multilayer substrate 14. The cable connection land 18b is connected by solder or the like. The cables 34a and 34b are connected to a cable connection land 19b formed on the surface of the flexible substrate 16 facing the laminated substrate 14 by soldering or the like. Further, the periphery of the lower side surface of the solid-state imaging device 13 is covered with an insulating resin 40 in advance. Thereby, a short circuit between the flexible substrate 16 and the solid-state imaging device 13 can be prevented. Furthermore, the inner leads 17 of the flexible substrate 16 are connected to the element terminals of the solid-state imaging device 13 to obtain the state shown in FIG.

  Next, as shown by an arrow in FIG. 5, the flexible substrate 16 is bent along the insulating resin 40, and the substrate connecting land 18c and the substrate connecting land 19a are connected, whereby the flexible substrate 16 and the laminated substrate 14 are connected. Connect electrically. In this way, the state shown in FIG. 3 is obtained.

  As described above, since the cables 33a to 33c and the cables 34a and 34b are connected to different substrates, they are not affected by the heat of the other solder. Normally, if the distance between each cable is narrowed, the solder of the adjacent cable may be melted due to the heat of the solder when connecting the cables. However, as in this embodiment, the adjacent cables are different from each other. By connecting to the surface, it is possible to prevent the solder from being melted by the connection of adjacent cables.

  As described above, according to the first embodiment, since the electronic component 15 and the cables 33 and 34 are arranged separately on the two surfaces of the facing surface of the flexible substrate 16 and the cutout portion 14a of the multilayer substrate 14, the imaging unit The installation area of the electronic component 15 and the cables 33 and 34 can be increased while arranging the solid-state imaging device 13, the cover glass 12, and the flexible substrate 16 so as to fit within the projection area projected in the optical axis direction. .

  Further, according to the first embodiment, the drive signal signal lines (cables 34 a and 33 b) are arranged on the opposing surface of the flexible substrate 16, and the output signal signal line is provided in the cutout portion 14 a of the laminated substrate 14. By arranging the (cable 33a), it becomes possible to separate the path of the drive signal and the output signal, and to reduce crosstalk of these signals. It should be noted that by making the output signal signal line have the thickest diameter, it is also possible to suppress attenuation of the output signal due to long-distance transmission.

  In addition, since the electronic component 15 and the cables 33 and 34 are arranged separately on the opposing surface of the flexible substrate 16 and the cutout portion 14a of the multilayer substrate 14, only one of the flexible substrate 16 and the multilayer substrate 14 is disposed. Compared to the arrangement in FIG. 4, the electronic component 15 and the cables 33 and 34 can be arranged at a high density in plan view as shown in FIG. 4.

  In the first embodiment, before the flexible substrate 16 is bent and connected to the multilayer substrate 14, the cables 34 a and 34 b are mounted on the opposing surface of the flexible substrate 16, and the cable 33 and the electronic component are formed in the cutout portion 14 a of the multilayer substrate 14. Since 15 is mounted, it is possible to secure a working space when mounting each component, improving workability and realizing further higher density of the components as compared with the prior art.

  In the first embodiment, the solid-state imaging device 13 and the multilayer substrate 14 are connected, the cables 33 and 34 are connected to the multilayer substrate 14 and the flexible substrate 16, and then the flexible substrate 16 is bent. It is possible to work in a larger and easier-to-handle state than holding 13 etc. alone.

  In the first embodiment, the solid-state imaging device 13 and the multilayer substrate 14 are connected, the cables 33 and 34 are connected to the multilayer substrate 14 and the flexible substrate 16, and then the flexible substrate 16 is bent. It is housed inside the imaging unit. Therefore, it is possible to prevent a short circuit due to contact with a component or the like disposed outside the imaging unit. Therefore, it becomes possible to omit or simplify insulation sealing and the like, and it is possible to reduce the size and the diameter of the endoscope distal end portion and improve workability.

(Modification 1 of Embodiment 1)
FIG. 6 is a schematic diagram of a flexible substrate and a solid-state imaging device according to Modification 1 of Embodiment 1 of the present invention. In the first modification, two flexible boards 16a and 16b are prepared instead of the flexible board 16 of the first embodiment. According to the first modification of the first embodiment, the same effect as that of the first embodiment can be obtained.

  A cable connection land 19b is provided on the surface of the flexible substrate 16a facing the laminated substrate 14. The cable connection land 19b is directly connected to the element terminal 13p of the solid-state imaging device 13 via the inner lead 17a without passing through the laminated substrate 14. Therefore, signals transmitted through the cables 34 a and 34 b connected to the cable connection land 19 b are directly input to or output from the solid-state image sensor 13 without passing through the multilayer substrate 14.

  A substrate connection land 19a is provided on the surface of the flexible substrate 16b facing the laminated substrate 14, and the substrate connection land 19a is connected to the element terminal 13p of the solid-state imaging device 13 through the inner lead 17b. ing. Therefore, signals and power transmitted by the cables 33a to 34c connected to the multilayer substrate 14 side are input to the solid-state imaging device 13 from the multilayer substrate 14 via the substrate connection land 19a and the flexible substrate 16b, or solid-state imaging. Output from the element 13.

(Modification 2 of Embodiment 1)
7A and 7B are schematic diagrams for explaining a manufacturing process of the imaging unit according to Modification 2 of Embodiment 1 of the present invention. In the first embodiment, the flexible substrate 16 and the solid-state imaging device 13 are connected by the inner lead 17. However, in the second modification, the flexible substrate 16 c and the solid-state imaging device 13 are connected by the wire bonding 20. According to the second modification of the first embodiment, the same effect as in the first embodiment can be obtained.

  In the second modification, before connecting the flexible substrate 16c and the solid-state imaging device 13, the electronic component 15 is connected to the component connection land 18a formed in the cutout portion 14a of the multilayer substrate 14 by solder or the like. 33a to 33c are connected to the cable connection land 18b formed in the cutout portion 14a of the laminated substrate 14 by solder or the like. The cables 34a and 34b are connected to a cable connection land 19b formed on the surface of the flexible substrate 16c facing the laminated substrate 14 by soldering or the like.

  Thereafter, the flexible substrate 16 c to which the cables 34 a and 34 b are connected is placed on the work table 50, and the flexible substrate 16 c and the element terminal of the solid-state imaging device 13 are connected by the wire bonding 20. Next, as shown in FIG. 7B, the imaging unit is arranged by arranging the surface of the flexible substrate 16c to which the cables 34a and 34b are connected and the surface of the laminated substrate 14 to which the cables 33a to 33c are connected. Finalize.

(Embodiment 2)
FIG. 8A is a plan view of an imaging unit according to Embodiment 2 of the present invention. In the second embodiment, two flexible substrates 16d are used instead of the flexible substrate 16 and the laminated substrate 14 of the first embodiment. The flexible substrate 16d is disposed on the left and right side surfaces of the solid-state image sensor 13, and is connected to the element terminal 13p of the solid-state image sensor 13 via the inner leads 17d.

(Embodiment 3)
FIG. 8B is a plan view of the imaging unit according to Embodiment 3 of the present invention. In the third embodiment, two flexible substrates 16 d and 16 e are used instead of the flexible substrate 16 and the laminated substrate 14 of the first embodiment. The flexible substrate 16d is disposed on the left side surface (or right side surface) of the solid-state image sensor 13, and is connected to the element terminal 13p of the solid-state image sensor 13 via the inner lead 17d. Similar to the flexible substrate 16 of the first embodiment, the flexible substrate 16e is disposed on the lower surface of the solid-state image sensor 13, and is connected to the element terminal 13p of the solid-state image sensor 13 via the inner lead 17e.

DESCRIPTION OF SYMBOLS 1 Endoscope apparatus 2 Endoscope 3 Insertion part 3a Bending part 3b Tip part 3c Flexible tube part 4 Operation part 4a Treatment tool insertion port 5 Universal cord 6 Connector 7 Light source apparatus 8 Processor 9 Subject 10 Display apparatus 11 Lens unit 12 Cover glass 13 Solid-state imaging device 13p Element terminal 14 Laminated substrate 14a Notch 15 Electronic component 16, 16a, 16b, 16c, 16d, 16e Flexible substrate 17, 17a, 17b, 17d, 17e Inner lead 18a Component connection land 18b, 19b Cable connection land 18c, 19a Board connection land 20 Wire bonding 30a Cladding tube 30b Tip body 32 Light guide 33a, 33b, 33c, 34a, 34b Cable 35 Upper bending wire 36 Lower bending wire 40 Insulating resin

Claims (5)

A solid-state imaging device having a light receiving portion and an element terminal on one surface;
A hard substrate provided on the opposite side of the one surface of the solid-state imaging device and having a notch formed on the surface;
A flexible substrate connected to the element terminal at the tip and having a surface facing the notch;
A first cable connected to a surface of the flexible substrate facing the notch,
A second cable connected to the notch,
An endoscope characterized by comprising: The first cable is a cable that transmits either a drive signal or an output signal of the solid-state imaging device,
The endoscope according to claim 1, wherein the second cable is a cable that transmits the other of the drive signal and the output signal of the solid-state imaging device. Further comprising a cover glass fixed to the solid-state imaging device so as to cover the light receiving unit,
The flexible substrate is disposed substantially linearly on the base end side along a side surface perpendicular to the one surface of the solid-state imaging device,
A projection in which the hard substrate projects the solid-state image sensor, the cover glass, and the flexible substrate on a surface perpendicular to the optical axis of the solid-state image sensor on the opposite side of the one surface of the solid-state image sensor. The endoscope according to claim 1, wherein the endoscope is disposed in a plane. The endoscope according to any one of claims 1 to 3, wherein the first cable is electrically connected to the solid-state imaging device without passing through the hard substrate. A step of connecting a hard substrate having a notch formed on the surface thereof on the opposite side of the one surface of the solid-state imaging device having a light receiving portion and an element terminal on one surface;
Connecting a second cable to the notch,
Connecting a first cable to the flexible substrate;
Connecting the tip of the flexible substrate to the element terminal;
Connecting the flexible substrate and the hard substrate such that a surface of the flexible substrate to which the first cable is connected is opposed to the notch,
An endoscope manufacturing method comprising the steps of:

Images