JPH09294717A - Imaging device assembly for electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To promote the diameter reduction of top end part of an endoscope by reducing an imaging device assembly in its heightwise direction and to shorten the top end part. SOLUTION: On the image pickup plane side of a CCD 20, two 1st circuit boards 21A and 21B are almost vertically connected and arranged, on the upside of these 1st circuit boards 21A and 21B, a 2nd circuit board 26 protruding and arranging objective optical members 15 and 17 at its opening part is connected and arranged and a signal line 27 is connected to this 2nd circuit board 26. Thus, the circuit boards 21 and 26 can be arranged within a height D3 of the assembly and the diameter reduction is enabled. Besides, since the 2nd circuit board 26 to connect the signal line 27 is separated upward from the CCD 20, a metallic pipe 29A of a treatment instrument inserting channel 29 is shortened and the connection part with a synthetic resin tube 29B can be moved forward rather than the conventional case so that the endoscope can be shortened as a result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device assembly for an electronic endoscope, and more particularly to a structure of an image pickup device assembly for connecting and arranging a circuit board to a solid-state image pickup device.

[0002]

2. Description of the Related Art FIG. 7 shows the configuration of a conventional electronic endoscope tip portion.
An objective lens system 2 for catching an object to be observed is arranged.
A prism 3 is connected to the rear side of the objective lens system 2,
Below the prism 3, a CCD (Ch
An image pickup device package 5 having a large coupled device 4 therein is arranged.

FIG. 8 shows the CCD 4 and the package 5.
As shown in the figure, the package 5 has a box shape in which the CCD 4 is housed, and the upper surface opening is covered with the protective glass 6. The input / output terminals formed in front of and behind the image pickup surface S of the CCD 4 and the terminals inside the package 5 are connected by a bonding wire 7. The terminals on the package 5 side and the terminals 8 at the ends in the figure are connected to each other. They are connected by a wiring pattern formed inside. Further, as shown in FIG. 7, a circuit member 9 required for driving the CCD 4 is mounted on the lower side of the package 5, and the signal (transmission) line 10 is connected to the terminal 8.
Is connected.

Further, as shown in FIG. 7, the light guide 1 is provided on the opposite side and the front side (not shown) of the objective lens system 2.
1 is arranged, and below the package 5,
A treatment instrument insertion channel 12 for guiding various treatment instruments into the body to be observed is provided. This treatment instrument insertion channel 1
2 is configured to connect a synthetic resin (Teflon or the like) tube 12B to the metal tube 12A.
The length LA of the rigid portion of the tip portion 1 is almost determined.

According to the above arrangement, the objective lens system 2
The inside of the object to be observed captured by the CCD 4 is imaged by the CCD 4, and the video signal obtained by this imaging is transmitted from the package 5 to the signal line 1.
It is taken out through 0 and displayed on a monitor or the like.
Then, the treatment instrument insertion channel 12 is passed through with the treatment instrument introduced from the insertion port such as the operating portion, and various treatments can be performed by guiding the treatment instrument into the observed body.

[0006]

However, in the structure inside the tip portion of the conventional electronic endoscope, as described above, C is used.
Since the CD 4 is housed in the package 5 serving as a circuit board, and the circuit member 9 is arranged below the package 5, there is a problem in that it is not possible to reduce the diameter of the endoscope. That is, as shown in FIG. 7, the endoscope diameter D
1 is determined by the height D2 of the image pickup device assembly from the objective lens system 2 to the package 5 and the diameter of the treatment instrument insertion channel 12, and if the height of the image pickup device assembly can be reduced, for example. Therefore, the diameter can be reduced.

As described with reference to FIG. 7, the treatment instrument insertion channel 12 has a structure in which the soft synthetic resin tube 12B is connected to the metal tube 12A, but as shown in the figure, the synthetic resin tube is formed. Since 12B rises on the outer circumference of the metal pipe 12A, the two pipes are connected at a position where there is no hindrance to the connection of the signal line 10 on the rear side of the package 5. The length of the metal tube 12A determines the length LA of the hard portion, that is, the length LA of the tip portion 1. Therefore, it is desired that the length of the metal tube 12A be as short as possible. If it can move, the tip 1 can be shortened.

In the conventional electronic endoscope, there is a type in which the above-mentioned package 5 is not used and the above-mentioned CCD 4 is connected on a flat circuit board, but in this case as well, the thickness of the circuit board is increased. However, since the circuit member is attached to the lower side of the circuit board, the same problem occurs.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce the size of the image pickup element assembly in the height direction thereof to promote the reduction of the diameter of the distal end portion of the endoscope. (EN) Provided is an image pickup device assembly of an electronic endoscope capable of shortening a distal end portion by moving a connecting portion between a metal tube and a synthetic resin tube in a treatment instrument insertion channel to the front side. Especially.

[0010]

In order to achieve the above-mentioned object, an image pickup device assembly of an electronic endoscope according to a first aspect of the present invention is an objective arranged at the tip of the electronic endoscope. An optical system member and a solid-state image sensor having an image pickup surface optically connected to the objective optical system member, and an input / output terminal provided on the image pickup surface side, and a terminal connection to the input / output terminal of the solid state image sensor. A first circuit board arranged substantially perpendicular to the image pickup surface and having a predetermined circuit pattern formed thereon, and terminal-connected to the first circuit board above the image pickup surface of the solid-state image pickup element;
And a second circuit board for forming a predetermined circuit pattern and connecting the signal transmission line. According to a second aspect of the present invention, a circuit member for driving the solid-state image sensor is arranged on the first circuit board, and an opening for projecting the objective optical system member on the second circuit board. Is provided.

According to the above arrangement, the first circuit board is vertically arranged on the upper side (imaging surface) of the solid-state image pickup device, and the second circuit board is horizontally connected on the upper side of the first circuit board. Since the bottom of the package and the circuit member are not arranged below the solid-state image sensor, the size of the image sensor assembly in the height direction can be reduced accordingly. Also,
Since the circuit board moves to the upper side of the solid-state image sensor and there is no one that directly extends to the rear side of the solid-state image sensor, the metal tube and the synthetic resin of the treatment instrument insertion channel arranged below the solid-state image sensor are made. It is possible to move the connecting portion of the tube to the front side as compared with the conventional case.

[0012]

1 to 4 show the structure of an image pickup element assembly of an electronic endoscope (tip portion) which is a first example of the embodiment. FIG. 1 shows the tip portion. 2 is the front side of FIG. In FIG. 1, an objective lens system 15 including a plurality of lenses is fixedly arranged at a tip portion 14 by a fixing member 16, a prism 17 is connected to the objective lens system 15, and a protective glass 19 is provided to the prism 17. A CCD 20 which is a solid-state image sensor is attached.

3 and 4 show the construction of an image pickup element assembly including the above-mentioned objective optical lens system 15 and CCD 20, and the above-mentioned protective glass 19 has, for example, a simultaneous electronic endoscope. When the imaging surface S of the CCD 20 is made airtight in a mirror or the like, an opening hole 19A is formed as shown in FIG. That is, by adhering the protective glass 19 between the lower surface of the prism 17 and the upper surface of the CCD 20 with an adhesive or the like, the inside of the opening hole 19A can be made airtight, and thereby, on the imaging surface S. It is possible to favorably protect the color filter, the microlens, and the like formed in the above. However, the opening hole 19A is not formed when it is not necessary to make it airtight by a frame sequential method or the like.

Input / output terminals H are provided at the front and rear ends of the upper surface of the CCD 20, and the two front and rear first circuit boards 21A and 21B are connected to the front and rear terminals H of the CCD 20. Mounted vertically on the CCD 20. The first circuit boards 21A and 21B are made of a hard synthetic resin material, have a terminal connected to the terminal H at the lower end, and have an terminal I (FIG. 3) provided at the upper end. A wiring pattern for connecting the upper terminal I and the lower terminal is formed inside or on the surface. Further, a plurality of circuit members 23 for driving the CCD 20 are provided on the first circuit boards 21A and 21B, and a semicircle for disposing the objective lens system 15 on the front side first circuit board 21A. A notch 24 having a shape is formed.

A flat plate-shaped second circuit board 2 having an opening 26A formed above the first circuit boards 21A and 21B.
6 is arranged horizontally (substantially parallel to the imaging surface S). That is, on the lower surface of the second circuit board 26, the first circuit board 21A,
A terminal i connected to the upper terminal I of 21B and a terminal j connected to the terminal i via a wiring pattern (not shown) are formed, and a signal is supplied to the terminal j as shown in FIG. The line 27 is connected. And the above-mentioned opening 26A
Is an opening for projecting the upper part of the objective lens system 15 and the prism 17 from the second circuit board 26.
6A makes it possible to dispose the second circuit board 26 within the height of the objective optical system member.

Further, as shown in FIG. 1, the above CC
Below the D20, in order to draw out a treatment tool such as forceps,
A treatment instrument insertion channel 29 including a metal tube 29A and a soft synthetic resin tube 29B is arranged. As shown in FIG. 2, light guides (irradiation windows) 30 are arranged on the left and right sides of the objective lens system 15, respectively.
On the diagonally lower side, an injection nozzle 31 for supplying air or water to the entrance window of the objective lens system 15 is provided.

The first example has the above-described structure. As described above, the assembly of the first example has the two first circuit boards 21A and 21B mounted vertically to the image pickup surface S side of the CCD 20 as described above. The second circuit board 2 is provided above the first circuit board 21A, 21B.
By attaching 6, it is assembled as shown in FIG. Therefore, in this first example, the first circuit board 21
A, 21B and the second circuit board 26 are C in the objective optical system member.
It will fit within the height D3 of the assembled CD20. This height D3 is higher than the height D2 of the conventional configuration shown in FIG. 7, in which the thickness of the bottom surface of the package 5, the air gap between the upper surface of the CCD 4 and the protective glass 6 and the height of the circuit member 9 are increased. Is reduced, and as a result, the dimension of the total can be reduced even in the diameter D4 of the endoscope (FIG. 1).

Further, according to the above-mentioned treatment instrument insertion channel 29, the length of the metal pipe 29A is the same as that of the conventional metal pipe 10A.
(Fig. 7). That is, in this example, the circuit board 26 connecting the signal line 27 is the CCD 2
Since the package 5 serving as a circuit board does not extend to the rear side below the prism 17 as shown in FIG. 7, the metal tube 29A and the synthetic resin tube 29 are arranged apart from 0 in the upper side.
The raised portion, which is the connection portion of B, can be moved to the front side as compared with the conventional case. Therefore, the metal pipe 29A can be made shorter than the length of the metal pipe 12A in FIG.
As a result, the hard portion length LB of the tip portion (hard portion) 14 becomes shorter than the conventional LA.

FIG. 5 shows the configuration of the second example of the embodiment. In this second example, the circuit board is formed in an arch shape. That is, as shown in FIG. 5, two semi-circular first circuit boards 33A and 33B are provided on the front and rear sides of the CCD 20.
Is arranged vertically on the upper surface of the terminal and both terminals are connected. Then, the objective lens system 1 is attached to the first circuit board 33A on the front side.
5, a circular hole 34 for arranging 5 is formed, and as shown in the figure, a circuit member 35 is mounted inside the first circuit board 33B, for example, and an upper terminal I connected to a lower terminal on the upper end face. Is formed.

On the other hand, the arch-shaped second circuit board 3 fitted to the upper arc-shaped end surfaces of the first circuit boards 33A and 33B.
6 are arranged, and terminals i and j are formed on the second circuit board 36 as in the first example.

According to the structure of the second example, a part of the upper side of the first circuit boards 33A and 33B and a part of the upper side of the second circuit board 36 slightly project from the top of the objective lens system 15. However, it can be applied when there is a margin above the objective lens system 15. That is, since the objective lens system 15 is arranged at the center of the endoscope as much as possible, there is often a margin above the objective lens system 15, and it can be used in such a case.

FIG. 6 shows a third example of the embodiment. This third example has a configuration in which the input / output terminals of the solid-state image sensor are arranged on the left and right. That is, in the example of FIG.
Input / output terminals K are arranged on the left and right sides of the CCD 38 assembled to the objective lens system 15 and the prism 17 through the protective glass 37, as shown in the figure.
The first circuit board 39A, 39
B is provided vertically. This first circuit board 39A, 39
A terminal I is formed at the upper end of B, and the circuit member 4
0 is provided.

Then, the first circuit boards 39A, 39B
A second circuit board 41, which is flat and has an opening 41A formed therein, is horizontally provided on the upper side of the second circuit board 41, and the lower surface of the second circuit board 41 is also connected to the terminal I in the same manner. i, a terminal j for connecting the signal line 27 and a wiring pattern are formed.

According to the third example, the first circuit boards 39A and 39B and the second circuit board 41 are also provided in the image pickup device assembly of the type in which the input / output terminals are arranged on the left and right sides of the CCD 38. The objective optical system member and the solid-state image sensor are assembled within the height D3 (FIGS. 1 and 4), and the same effect as in the case of the first example can be obtained.

In the first circuit boards 21A, 21B, 33A, 33B, 39A, 39B of the above-described respective embodiments, terminals (I) are provided on the upper and lower end faces, but these terminals are located at the upper and lower end portions. It may be provided on the side surface. Further, the present invention is not limited to the electronic endoscope shown in the above example, but can be applied to other connection structures of the solid-state imaging device and the circuit board in other electronic endoscopes.

[0026]

As described above, according to the present invention,
A first circuit board is connected and arranged substantially vertically to the image pickup surface side of the solid-state image pickup device, and a second circuit board is connected and arranged on the first circuit board above the image pickup surface of the solid-state image pickup device. Since the signal transmission line is connected to the circuit board, the circuit board can be placed within the height where the solid-state image sensor is mounted on the objective optical system member. It is possible to reduce the diameter of the distal end portion of the endoscope by making the diameter smaller.

Further, since the second circuit board is arranged on the upper side apart from the solid-state image pickup device, the connecting portion between the metal tube and the synthetic resin tube in the treatment instrument insertion channel can be moved to the front side, and the tip portion. Can be shortened.

[Brief description of drawings]

FIG. 1 is a side view of a tip portion of an electronic endoscope showing a configuration of an image pickup element assembly according to a first example of an embodiment of the present invention.

FIG. 2 is a front view of the tip portion of FIG.

FIG. 3 is a perspective view showing a configuration of an image pickup element assembly according to a first example.

FIG. 4 is a side view of the assembly shown in FIG. 3 [FIG. (A)] and CC.
It is a top view of FIG.

FIG. 5 is a perspective view showing a configuration of an image pickup element assembly according to a second example of the embodiment.

FIG. 6 is a perspective view showing a configuration of an image pickup element assembly according to a third example of the embodiment.

FIG. 7 is a side view showing a configuration of a conventional electronic endoscope tip portion.

8 is a perspective view showing a configuration (a state in which a protective glass is seen through) of a solid-state imaging device and a package arranged in FIG. 7. FIG.

[Explanation of symbols]

1, 24 ... Tip part, 2, 15 ... Objective lens system, 4, 20, 38 ... CCD, 5 ... Package, 6, 19, 37 ... Protective glass, 12, 29 ... Treatment tool insertion channel, 21A, 21B, 33A, 33B, 39A, 39B ...
1st circuit board, 26, 36, 41 ... 2nd circuit board, H, I, K, i, j ... Terminal, S ... Imaging surface.

Claims (2)

[Claims] 1. An objective optical system member arranged at a distal end portion of an electronic endoscope, and a solid state in which an image pickup surface is optically connected to the objective optical system member, and an input / output terminal is provided on the image pickup surface side. An image pickup element, a first circuit board which is arranged substantially perpendicular to the image pickup surface while being connected to an input / output terminal of the solid state image pickup element, and on which a predetermined circuit pattern is formed, and the solid state image pickup for the first circuit board. An image pickup element assembly of an electronic endoscope, comprising: a second circuit board which is terminal-connected above the image pickup surface of the element and which forms a predetermined circuit pattern and connects a signal transmission line. 2. A circuit member for driving the solid-state imaging device is arranged on the first circuit board, and an opening for projecting the objective optical system member is provided on the second circuit board. The image pickup element assembly of the electronic endoscope according to claim 1, wherein: