JP3253517B2 - Electronic endoscope image sensor assembly - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device assembly of an electronic endoscope, and more particularly to a structure of an image pickup device and a flexible circuit board having a portion extending outside the side surface of the image pickup device. About.

[0002]

2. Description of the Related Art FIG. 8 shows a structure of an image pickup device assembly (without an objective optical system member) conventionally incorporated in a distal end portion of an electronic endoscope or the like. This is applied to the electronic endoscope. In the figure, a charge coupled device (CCD) 1 serving as an image pickup device is housed in a package 2 made of ceramic or the like (also a circuit board), and a cover glass 3 is arranged so as to close an opening on the upper surface thereof.

A color filter, a micro lens, and the like are formed on an imaging surface on the upper surface of the CCD 1. A plurality of input / output terminals E are arranged at both front and rear ends outside the imaging surface,
On the package 2 side as well, the terminal F
Are formed in an array, and these terminals E and F are connected by a bonding wire 4. The terminal F is connected to a terminal G at an end by a conductor pattern (partly passing under the CCD 1) in the package 2, and a signal line 5 from an external circuit is connected to the terminal G. Connected.

In the image pickup device assembly having such a structure,
The package 2 and the cover glass 3 serving as a lid make C
By storing the CD 1 in an airtight state, the color filter on the imaging surface on the CCD 1 can be protected.
By providing a space between the upper surface of 1 and the cover glass 2, the function of the microlens on the imaging surface of the CCD 1 can be maintained. Then, the video signal obtained by the CCD 1 is taken out to the outside via the signal line 5, whereby an image of the inside of the body to be observed can be displayed on a monitor or the like.

[0005]

In the above-described conventional image pickup device assembly, since the package 2 accommodating the CCD 1 is provided, the size of the image pickup device cannot be reduced. There is a problem that the reduction and the shortening cannot be promoted. That is, the package 2 as shown in FIG.
In order to be a box made of ceramic etc. that stores CD1,
The assembled body becomes large by at least the thickness of the box body wall. The thickness of the bottom wall or the side wall is an obstacle to reducing the diameter of the distal end of the endoscope, and the thickness of the front and rear walls is an obstacle to shortening the axial length of the distal end of the endoscope.

[0006] From the above, the details will be described later,
Instead of the package 2, a flexible circuit board is arranged on the upper surface side of the image sensor, and the flexible circuit board is provided with a portion that extends outside the side surface of the image sensor, and an image forming device that forms a wiring pattern on the extended portion. An element assembly is proposed.

However, in such a flexible circuit board, there is a problem in arrangement and handling of a portion extending outside the side surface of the image pickup device, and assembling into a distal end portion of an endoscope where the arrangement space is limited is efficient. In order to perform well and to handle it as one assembled part, it is desirable to arrange the extended portion at an optimum determined position.

The present invention has been made in view of the above points, and an object of the present invention is to provide a flexible circuit board having an extended portion on the outside of a side surface of an image sensor in a favorable state fixed to the image sensor. It is an object of the present invention to provide an image pickup device assembly for an electronic endoscope that can be arranged and contribute to a reduction in the diameter and length of the endoscope.

[0009]

According to a first aspect of the present invention, an image pickup device assembly for an electronic endoscope is provided at an end of the electronic endoscope. And a flexible circuit board which is arranged on the upper surface side of the image sensor and has a part of a wiring pattern provided outside the side surface of the image sensor, and a lateral end of the flexible circuit board. The flexible circuit board is disposed from the upper surface side to the lower surface via the side surface of the image sensor, and the side end portion is fixed by the engaging device. It is characterized by the following. The invention according to a second aspect is characterized in that the flexible circuit board is provided with a notch at a bent portion at an outer peripheral corner of the imaging element to assist bending.

According to the above arrangement, the laterally extending portion of the flexible circuit board is arranged along the outer peripheral surface of the image sensor, that is, from the upper surface to the lower surface via the side surface, and is engaged at the lower surface, for example. The state is fixed. Therefore, the extension is not placed at an undefined position, and handling of the assembled body becomes easy.

According to the configuration of the second aspect, the flexible circuit board is easily bent at the outer peripheral corner of the image pickup device due to the presence of the cut, and the cut serves as an index of bending.

[0012]

1 and 2 show a state in which an image pickup device assembly of an electronic endoscope according to a first embodiment of the present invention is disposed at a distal end portion. The image sensor is used simultaneously. In the figure, an objective optical system member 11 for capturing an object to be observed is connected to a prism 12 within a distal end portion 10, and a CCD (Charge C) serving as an image sensor is provided below the prism 12 via a cover glass 13.
Oupled Device) 14 is provided, and the CCD 1
A flexible circuit board 15 is provided on the outer periphery of the fourth.
Light guides 16 for irradiating the object to be observed with light are arranged on both left and right sides of the objective optical system member 11, and a treatment instrument insertion channel for guiding forceps for treating a diseased part under the CCD 14. In addition, an air / water supply pipe 18 for supplying air or water to the affected area is provided.

FIG. 3 shows the structure of the CCD 14 and the flexible circuit board 15. As shown in FIG. 3A, the circuit board 15 is provided with an opening 19 for arranging the CCD 14.
A strip-shaped terminal h is formed integrally from the front and rear ends toward the inside. This terminal h is a thin metal plate,
14 are connected to a plurality of input / output terminals H provided at the front and rear ends, for example, by a TAB (Tape Automated Bonding) method. That is, one of the terminals h or H is used as a protruding electrode, and both terminals are connected by crimping (bump connection) (the terminal H is shown in a see-through state). At the rear end of the flexible circuit board 15, a terminal K for connecting a signal line is provided.

Extending portions 15A and 15B are provided on both left and right sides of the flexible circuit board 15, respectively.
A conductor pattern 20 is formed in the inside of each of 5A and 15B, for example, in a sandwich shape, and the conductor pattern 20 connects between the terminal h and the terminal K. Cuts 21 and 22 for assisting the bending are formed at the front and rear ends of the extending portions 15A and 15B.
Reference numerals 1 and 22 are provided at intervals of the thickness t of the CCD 14 so as to correspond to the outer peripheral corners of the CCD 14.

The left and right extending portions 15A, 15B
Are provided with cutouts 23, 24 for engaging the ends with each other. That is, this cut 2
3, 24 are in a positional relationship such that they can be engaged with each other,
In addition, they are formed near the centers of the extending portions 15A and 15B in a cutting direction substantially perpendicular to the outer line.

FIG. 3B shows a state where FIG. 3A is viewed from the front side.
5 connects the terminal h integrated therewith to the terminal H on the upper surface of the CCD 14, so that it is arranged at the upper surface position of the CCD 14 as shown. And this CC
On the upper surface of D14, cover glass 13
Are bonded in an airtight state with an adhesive. Thereby, the above C
A gap corresponding to at least the thickness of the terminal h is generated between the imaging surface of the CD 14 and the cover glass 13, and the function of the microlens formed on the imaging surface of the CCD 14 in the simultaneous type is not hindered. Can be sufficiently protected.

A first example of the embodiment has the above configuration.
The assembly of the assembly will be described with reference to FIGS. As described above, the CCD 14 is terminal-connected to the flexible circuit board 15 by the TAB method or the like,
The cover glass 13 is adhered to the upper surface of the CCD 14 in an airtight state. This assembled state is shown in FIG. 4, and in the next step, the prism 12 attached to the objective optical system member 11 is connected on the cover glass 13 as shown in the figure.

In the circuit board 15, the left and right extending portions 15A and 15B are bent downward as shown by the arrows using the cuts 21 and 22, and further bent toward the lower surface, thereby extending the extending portions. 15A and 15B are bent and arranged along the side corners of the CCD 14. Thereafter, the extending portions 15A and 15B arranged to the lower side are cut into the above-described cuts 2.
The fixed state is established by the engagement of 3, 24.

That is, as shown in FIG. 5 (A), the cuts 23 and 24 are engaged and pushed in the direction of the arrow as shown in FIG.
As shown in (B), if the end portions of the extension portions 15A and 15B are alternately overlapped, the extension portion 15
A and 15B can be fixed on the lower surface of the CCD.

Thus, as shown in FIG.
The flexible circuit board 15 is arranged from the upper surface of the CCD 14 to the lower surface via the side surface. As can be seen from this figure, since the circuit board 15 is arranged and fixed along the outer peripheral surface of the CCD 14, the extension portions 15A and 15B do not protrude toward other members. Therefore, the light guide 1
It does not affect the arrangement of the treatment instrument insertion channel 17 or the treatment instrument insertion channel 17 and does not impair the degree of freedom of arrangement of these members. In addition, there is an advantage that handling as one assembly is easy. Furthermore, in such an assembly, CC
Since the D package is not required, the size of the imaging element can be reduced, which contributes to the reduction in the diameter and the length of the endoscope.

FIG. 6 shows a second example of the engagement means for engaging the end of the extended portion of the flexible circuit board. In the second example, as shown in the figure, extending portions 15A, 15B
An engaging member 27 provided with two insertion grooves 26 for engaging the ends of the CCD 14 is bonded to the lower surface of the CCD 14. According to this, the ends of the extending portions 15A and 15B can be inserted into the insertion groove 26 and fixed.

FIG. 7 shows a third example of the engaging means for engaging the end of the extended portion of the flexible circuit board. In this third example, as shown in the figure, an engaging member 29 having a hook-like projection 28 formed on a plate-like member is adhered to the lower surface of the CCD 14, while one end of each of the extending portions 15A and 15B of the circuit board 15 is attached. An engagement hole 30 is formed in the portion so as to engage with the hook-shaped protrusion 28. According to this, the extension portions 15A, 15B
Can be fixed by fitting the engaging hole 30 at the end of the hook-shaped projection 28 as shown by the arrow.

In the above embodiment, the simultaneous type image pickup device has been described. However, the present invention can be applied to a frame sequential type.

[0024]

As described above, according to the first aspect of the present invention, a flexible circuit board in which a part of a wiring pattern is provided outside the image sensor is disposed on the upper surface of the image sensor. Since the side portion of the circuit board is arranged from the upper surface of the image sensor to the lower surface via the side surface and is fixed by the engaging means, the flexible circuit board can be fixed along the outer peripheral surface of the image sensor with a favorable arrangement. And, consequently, it is possible to contribute to reducing the diameter and length of the endoscope.

According to the second aspect of the present invention, since the flexible circuit board is provided with a cut in a bent portion at an outer peripheral corner of the image pickup device, bending is facilitated, and the cut is formed by bending. It also serves as an index and can improve workability.

[Brief description of the drawings]

FIG. 1 is a front view showing a state in which an image pickup device assembly according to a first example of an embodiment of the present invention is disposed at a distal end portion of an electronic endoscope.

FIG. 2 is a side view of FIG. 1, in which members other than an imaging element assembly are omitted.

3A and 3B are diagrams showing a configuration of a CCD and a flexible circuit board according to the embodiment, wherein FIG. 3A is a plan view and FIG. 3B is a view of FIG.

FIG. 4 is an exploded perspective view showing the image pickup device assembly of the embodiment.

FIG. 5 is an explanatory diagram illustrating an engagement state of an end of the flexible circuit board according to the embodiment.

FIG. 6 is a front view showing a second example of the engaging means for engaging the end of the extending portion of the flexible circuit board of the embodiment.

FIG. 7 is a front view showing a third example of the engaging means for engaging the end of the extending portion of the flexible circuit board of the embodiment.

FIG. 8 is a side sectional view showing a conventional image pickup device assembly without an objective optical system member.

[Explanation of symbols]

 1,14 ... CCD, 3,13 ... Cover glass, 15 ... Flexible circuit board, 15A, 15B ... Extending part, 19 ... Opening, 21,22,23,24 ... Cut, 26 ... Insertion groove, 27,29 ... Engaging member, 28 ... hook-shaped projection, 30 ... engaging hole.

Claims (2)

(57) [Claims] 1. An image pickup device disposed at a distal end portion of an electronic endoscope via an objective optical system member, and disposed on an upper surface side of the image pickup device, and a part of a wiring pattern is provided outside a side surface of the image pickup device. A flexible circuit board, and engaging means for engaging both lateral sides of the flexible circuit board. The side of the flexible circuit board is arranged from the upper surface of the image sensor to the lower surface via the side surface. An image pickup device assembly of an electronic endoscope in which the side end portions are fixed by the engaging means. 2. The electronic endoscope according to claim 1, wherein the flexible circuit board is provided with a notch at a bent portion at an outer peripheral corner of the imaging element for assisting the bending. A mirror imager assembly.