JP3186965B2 - Camera head device for electronic endoscope - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a camera head device used for an electronic endoscope, wherein an image pickup device is connected to an objective optical system member via a prism.

[0002]

2. Description of the Related Art FIG. 6 shows the structure of a camera head device provided at the distal end of a conventional electronic endoscope device.
6 shows the configuration of the image sensor and the circuit board of FIG. In the figure, an objective optical system member 1 having a lens group for capturing image light of an object to be observed is provided at a distal end portion F of an endoscope while being held by a holding member 2. This holding member 2
Is connected to a prism 3, which is
It is connected to a solid-state imaging device, for example, an interline type CCD (Charge Coupled Device) 5 via a cover glass 4. The CCD 5 is disposed parallel to the optical axis 100 of the objective optical system member 1, and the image light captured by the objective optical system member 1 is changed in direction by the prism 3, Image on the surface. Then, the formed image light is converted into an image signal by the CCD 5.

Further, the CCD 5 is electrically connected to a signal line 7 via a circuit board 6. That is, as shown in FIG. 7, in the interline type CCD 5, connection terminals (pads) 8 are provided on the upper surface so as to be arranged in a direction perpendicular to the optical axis 100 of the objective optical member 1. Can be These terminals 8 are connected to terminals (pads) 10A provided on the circuit board 6 by bonding wires 9. A signal line 7 is connected to a terminal (pad) 10B on the input / output side of the circuit board 6. Therefore, the image signal obtained by the CCD 5 is output to a monitor or the like via the signal line 7. Note that a resin filler is filled in the connection portion of the bonding wire 9 and the like so as to bury the bonding wire 9 for airtightness maintenance and the like.

[0004]

However, in an electronic endoscope, it is a major problem to reduce the diameter of the insertion end portion. Particularly, in an endoscope for bronchi, an endoscope for digestive organs is used. There is a strong demand for smaller diameters. For this reason, the present applicant has paid attention to the space in which the bonding wires 9 protruding above the surface of the CCD 5 are provided. That is, as shown in FIG. 6, in order to dispose the bonding wire 9 and the resin filler, the CCD 5 is used.
Between the holding member 2 and t1 in the radial direction of the distal end portion.
A minute interval is necessary, and reducing this interval t1 can reduce the diameter.

The present invention has been made in view of the above points, and an object of the present invention is to provide a camera head device for an electronic endoscope that can reduce the diameter of an insertion end.

[0006]

In order to achieve the above object, the present invention has a lens group for capturing an inside of an object to be observed.
Objective optical member is held by the holding member which, coercive
In a camera head device for an electronic endoscope, an image pickup device is connected to a holding member via a prism, and connection terminals are arranged on an upper surface of the image pickup device in a direction perpendicular to an optical axis of the objective optical system member . A vacant area where the terminal is not arranged is set in the middle of the connection terminal row on the upper surface of the image sensor, and the holding member of the objective optical system member is arranged close to the vacant area.

[0007] According to the configuration operation of the above, the imaging device is placed for example on a circuit board, and the terminals on the terminal and the circuit board of the upper surface of the imaging element are connected by a bonding wire. And
A prism is connected to the upper surface of the image sensor through a cover glass, and the prism converts the optical path (optical axis) of the objective optical system member into a right angle direction and guides it to the image sensor. . In such a member arrangement, the objective optical system section
The rear end (bottom surface) of the material holding member overlaps above the image sensor, and the rear end of the holding member is disposed on an empty area provided in the middle of the connection terminal row. Since the wire is not bonded in this empty area, the holding member can be arranged close to the upper surface of the image sensor, and as a result, the diameter can be reduced by the space required for wire bonding. become.

[0008]

FIG. 1 shows the configuration of a camera head device provided at the distal end of an electronic endoscope according to an embodiment. FIG. 2 shows the members of FIG. The disassembled state is shown, and FIG. 3 shows the configuration of the imaging element and the circuit board. 1 and 2, an objective optical system member 12 having a lens group for capturing image light of an object to be observed is held by a holding member 13 at a distal end portion F of the endoscope. The front surface of the prism 14 is fixed with an adhesive or the like.

The holding member 13 is used for the objective optical system member 12.
And the prism 14 so as to optically connect them in a predetermined relationship, and also to focus.
That is, the holding member 13 holds the objective optical system member 12 movably back and forth, and an adjustment screw 15 is provided on a side surface thereof, and the objective optical system member 12 can be fixed by the adjustment screw 15 at a focused position. It has become. The thickness of the bottom surface 13A at the rear end of the holding member 13 is smaller than the thickness of the other outer peripheral wall in order to minimize the length in the radial direction (details will be described later).

The prism 14 is connected via a cover glass 16 to a solid-state image sensor, for example, an interline type CCD (Charge Coupled Device) 17.

The CCD 17 is connected to the circuit board 18 by wire bonding as shown in FIG. That is, in the drawing, the CCD 17 is mounted on a circuit board 18, and on the upper surface of the CCD 17,
The connection terminals (pads) 19 are arranged in a direction perpendicular to the optical axis 100 of the objective optical member 12, and an empty area 200 where the terminals 19 are not formed is set in the middle of this arrangement. The terminal 19 is connected to the bonding wire 2
With 0, the terminal (pad) 21A provided on the circuit board 18 is connected. Then, at the connection portion of the bonding wire 20, a resin-made filler 22 is filled so as to bury the bonding wire 20 for maintaining airtightness or the like. The signal line 23 is connected to the input / output terminal (pad) 21B on the circuit board 18 by soldering or the like.

As shown in FIG. 2, the prism 14 is placed on the upper surface of the CCD 17 via a cover glass 16 as shown in FIG.
When the bottom surfaces are arranged and each member is assembled with an adhesive or the like, the result is as shown in FIG. In this manner, the image light captured by the objective optical system member 12 is changed in direction by the prism 14 and forms an image on the surface of the CCD 17.

In such an assembling, the bottom surface 13A at the rear end of the holding member 13 is provided in the empty area 200 provided in the middle of the arrangement of the terminals 19 on the CCD 17 at the front end side.
It is arranged on the upper side, and becomes an arrangement state as shown in FIG. As shown in the figure, since the bonding wire 20 is not provided in the empty area 200, it can be seen that the bottom surface portion 13A can be arranged close to the upper surface of the CCD 17.

Also, as shown in FIG.
The interval between 3A and the upper surface of the CCD 17 is t2, and it can be understood that the interval t2 is extremely small as compared with the conventional interval t1 shown in FIG. Therefore, the radial length of the endoscope can be reduced by the interval t1 required for wire bonding, and the diameter can be reduced. In addition, the side surface of the holding member 13 is cut from both sides so that the bottom side becomes thinner as shown in FIG. 4, thereby facilitating the placement of the holding member 13 in the empty area 200.

In this example, as described above, since the thickness of the bottom surface portion 13A at the rear end of the holding member 13 is made smaller than the thickness of the other outer peripheral wall, the empty region 200 is provided. In addition to the reduction in diameter due to this, the diameter is further reduced by the reduced thickness.

It is to be noted that the C
The object image formed on the imaging surface of the CD 17 is converted into an image signal by the CCD 17 and taken out from the signal line 23 via the circuit board 18 so that it can be displayed on a monitor or the like.

In the above embodiment, the holding member 1 shown in FIG.
3 is arranged close to the upper surface of the CCD 17, but when there is no such a holding member 13, the holding frame of the objective optical system member 12 is arranged on the upper surface of the CCD 17 as a holding member.

FIG. 5 shows another example of an apparatus having a different connection configuration between the image pickup device and the circuit board. As shown in the figure, a circuit board 25 is provided on the upper surface side of the CCD 24 by using bumps. It is implemented by a method such as COG (Chip On Grass). That is, an empty area 200 is provided on the upper surface of the CCD 24 to form a row of terminals 26. The circuit board 25 is made of a rigid board made of synthetic resin or the like, and has an opening 300 corresponding to the empty area 200 and a CCD 2.
4 have openings 301 corresponding to the imaging regions. The circuit board 25 is provided with terminals 27A corresponding to the terminals 26 of the CCD 24 and terminals 27B for connecting signal lines.

The terminal 26 of the CCD 24 and the terminal 27A of the circuit board 25 are connected via bumps, and a cover glass is adhered on the circuit board 25. The holding member of the system member is disposed in the empty area 200 in the same manner as described above. Therefore,
Also in the configuration of FIG. 5, it is possible to arrange the holding member close to the upper surface of the CCD 24.

[0020]

As described above, according to the present invention,
In the middle of the connection terminals arranged in a direction perpendicular to the optical axis of the objective optical system member , set an empty area where the terminals are not arranged,
Since the holding member for holding the objective optical system member is arranged above the empty area, the holding member can be arranged close to the upper surface of the imaging element to which no wire is bonded. Therefore, the diameter of the distal end portion of the endoscope can be reduced by the space required for wire bonding.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a configuration of a camera head device for an electronic endoscope according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a state in which the member of FIG. 1 is disassembled.

FIG. 3 is a perspective view showing a configuration of a CCD and a circuit board of FIG. 1;

FIG. 4 is a sectional view taken along line II of FIG. 1, showing a connection state of the holding member, the CCD and the circuit board of FIG. 1;

FIG. 5 is a perspective view illustrating a configuration of an apparatus having a different connection method between an image sensor and a circuit board.

FIG. 6 is a side sectional view showing a configuration of a conventional camera head device for an electronic endoscope.

FIG. 7 is a perspective view showing a configuration of a CCD and a circuit board of FIG. 6;

[Explanation of symbols]

1,12 ... objective optical system member, 2,13 ... holding member, 3,14 ... prism, 5,17 ... CCD, 6,18 ... circuit board, 8, 10A, 10B, 19, 21A, 21B, 26, 2
7A, 27B: terminal, 9, 20, bonding wire, 22: filler, 100: optical axis, 200: free space.

Claims (1)

(57) [Claims] A lens group for capturing an inside of an object to be observed;
Objective optical member is held by the holding member which, coercive
In a camera head device for an electronic endoscope, an image pickup device is connected to a holding member via a prism, and connection terminals are arranged on an upper surface of the image pickup device in a direction perpendicular to an optical axis of the objective optical system member . A camera for an electronic endoscope, wherein an empty area in which the terminal is not arranged is set in the middle of a connection terminal row on the upper surface of the image sensor, and a holding member of the objective optical system member is arranged close to the empty area. Head device.