JP4938936B2 - Solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fixed imaging device used in an electronic endoscope apparatus, and more particularly to miniaturization of a solid-state imaging device disposed at a distal end of an insertion portion that is inserted into a body cavity.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic endoscope apparatus in which a solid-state image sensor is arranged at the distal end of a body cavity insertion portion of an endoscope apparatus has been put into practical use by downsizing a solid-state image sensor and increasing the number of pixels. This electronic endoscope apparatus displays a subject image signal imaged and generated by a solid-state imaging device as an image on a monitor so that many people can observe the subject or record and store the subject image signal in various signal recording devices. It is also used for internal observation of structural parts including fields.
[0003]
A body cavity to be observed with a medical electronic endoscope device has a complicated shape and numerous dimensions, and is equipped with a solid-state image sensor to be inserted into the body cavity and a drive control circuit for driving and controlling the solid-state image sensor. There is a demand for downsizing of the circuit board.
[0004]
However, since the drive control circuit configuration for driving and controlling the solid-state imaging device differs depending on the driving conditions of the solid-state imaging device, the shape of the circuit board is also different. For this reason, conventionally, a solid-state image sensor corresponding to a circuit board on which a drive control circuit for the solid-state image sensor is mounted has been manufactured. However, manufacturing a solid-state imaging device corresponding to a circuit board is complicated and causes a cost increase.
[0005]
For this reason, Japanese Patent No. 2902734 discloses a solid-state imaging device in which an imaging device chip of a solid-state imaging device is used as a general purpose and a plug side having an external input / output terminal for connecting the circuit board and the imaging device chip can be manufactured according to the circuit board. Is disclosed.
[0006]
In Japanese Patent No. 2902734, in addition to the relationship between the image sensor chip and the plug, a cover glass is attached to the front surface of the solid-state image sensor via a transparent adhesive layer. This cover glass is provided to protect the imaging surface of the solid-state imaging device.
[0007]
[Problems to be solved by the invention]
In the cover crow provided on the front surface of the solid-state image sensor disclosed in Japanese Patent No. 2902734, the foil-shaped lead wire extends in the direction of the side surface and the back surface through a bump on the opposite side of the image-capturing surface of the solid-state image sensor. It is mounted via a transparent adhesive layer on the existing foil-shaped lead wire.
[0008]
However, when the miniaturization of the solid-state imaging device is promoted, the foil-shaped lead wire is extended only from one side of the solid-state imaging device without extending the foil-shaped lead wire from the opposite sides of the solid-state imaging device. Become.
[0009]
Thus, for the purpose of downsizing, when a foil-shaped lead wire is extended from one side of the solid-state image sensor and the cover glass is disposed on the front surface of the solid-state image sensor, one end of the cover crow is connected to the solid-state image sensor. It is installed on a foil-like lead wire provided via a bump provided on one side, and the other end of the cover glass is arranged on one side of the solid-state imaging device where the bump and the foil-like lead wire are not arranged. Become. That is, the cover crow is not arranged in a state parallel to the imaging surface of the solid-state imaging device, and the cover glass surface is inclined with respect to the imaging surface.
[0010]
As described above, when the light beam of the observation unit obtained by the objective optical system arranged in front of the imaging surface of the solid-state imaging device is incident on the imaging surface, the observation unit This light beam is refracted in an unintended direction by the cover glass, and a good light beam from the observation section can be incident on the imaging surface. For this reason, there is a problem that an image defect such as distortion occurs in an image captured and generated by the solid-state imaging device.
[0011]
The present invention relates to a solid-state imaging device in which observation light from an observation unit is incident on a solid-state imaging device in which inner leads, which are foil-shaped lead wires, are arranged from one side of the solid-state imaging device in order to reduce the size of the solid-state imaging device. An object of the present invention is to provide a solid-state imaging device in which unintentional refraction caused by a cover glass disposed in front of an imaging surface of an element is eliminated and a captured image defect does not occur.
[0012]
[Means for Solving the Problems]
  The solid-state imaging device of the present invention is an image pickup surface side of a solid-state imaging device formed in a substantially quadrilateral shape.NeighborhoodA bonding pad row made up of a plurality of bonding pads arranged on the bump, a bump arranged on the bonding pad row, and a substantially uniform height from the imaging surface of the solid-state imaging device arranged on the bump. A solid-state imaging device comprising: a plurality of inner leads having an upper surface; height adjusting means disposed on opposite sides of the bonding pad row; and a cover glass disposed on the inner lead upper surface and height adjusting means. InThe height adjusting means isThe imaging surface of the solid-state imaging device has a height equal to the height to the top surfaces of the plurality of inner leads, and theConsists of a configuration that is not electrically connected to the internal circuit of the solid-state image sensor,coverGaThe lath end surface and the imaging surface are parallel to each other.
[0013]
  Further, the height adjusting means of the solid-state imaging device of the present invention is fixed to a bonding pad that is not electrically connected to an internal circuit of the solid-state imaging device.
  Further, the height adjusting means of the solid-state imaging device of the present invention is, DaIt is a me bump.
[0014]
  Further, the height adjusting means of the solid-state imaging device according to the present invention includes a plurality of height adjustment means provided on one side of the imaging surface side of the solid-state imaging device.AbovebondingpadIt is the step part extended from the said cover glass to the edge | side side which opposes a row | line | column.
  Furthermore, the height adjusting means of the solid-state imaging device according to the present invention includes a plurality of height adjustment units provided on one side of the imaging surface side of the solid-state imaging element.AbovebondingpadIt is a step part extended from the base | substrate opposing side of the said solid-state image sensor which opposes a row | line | column.
[0015]
In the solid-state imaging device of the present invention, on one side of the imaging surface side of the solid-state imaging device, bonding pads connected to the inner leads via the bumps are arranged on the row. On the opposite side of the bonding pad row, a height adjustment member having a height equal to the height of the upper surface of the inner lead on the bump, for example, a position where a dummy bump that does not act electrically is within the projected area of the solid-state imaging device. The cover glass is arranged on the upper surface of the height adjusting member and the inner lead.
[0016]
As a result, the inner lead can be arranged on one side of the imaging surface of the solid-state imaging device, so that the solid-state imaging device can be downsized, and the imaging surface of the solid-state imaging device and the cover glass surface are arranged in parallel. Therefore, it is possible to display an image of an observation site without distortion.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view showing a configuration of an embodiment of a solid-state imaging device according to the present invention, and FIG. 2 is an explanatory diagram for explaining an electronic endoscope system using the solid-state imaging device according to the present invention. FIG. 4 is a cross-sectional view illustrating an image pickup apparatus using the solid-state image pickup device according to the present invention, and FIG. 4 is a cross-sectional view illustrating the configuration of a signal cable connected to the solid-state image pickup device according to the present invention.
[0018]
The entire configuration of the electronic endoscope system will be described with reference to FIG.
The electronic endoscope system 1 includes an electronic endoscope 2 having an imaging unit, a light source device 3 that supplies illumination light to a light guide provided in the electronic endoscope 2, an electronic endoscope 2 and a connection cable. 4 is connected to the video processor 5 to drive and control the image pickup means of the electronic endoscope 2, and to process the image signal generated by the image pickup means and the subject image signal output from the video processor 5. The monitor 6 displays a subject image.
[0019]
The electronic endoscope 2 includes a flexible elongated insertion portion 7, an operation portion 8 connected to the proximal end side of the insertion portion 7, and a flexibility extending from a side portion of the operation portion 8. Connecting cord 9, a connector portion 10 provided at an end portion of the connecting cord 9 and detachably connected to the light source device 3, and provided on a side portion of the connector portion 10 and connected to the video processor 5. The connected cable 4 has an electrical connector portion 11 that can be detachably connected.
[0020]
The electrical connector portion 11 is provided with a ventilation portion (not shown) that communicates with the inside and outside of the electronic endoscope 2.
[0021]
The connecting portion between the insertion portion 7 and the operation portion 8 is provided with an insertion portion-side bending prevention member 12 having an elastic member that prevents sudden bending of the connection portion, and the operation portion 8 and the connection cord 9 is provided with a similar operation part side folding prevention member 13, and a connection part between the connecting cord 9 and the connector part 10 is provided with a similar connector part side folding prevention member 14.
[0022]
The insertion portion 7 includes a flexible flexible tube portion 15, a bending portion 16 that is provided on the distal end side of the flexible tube portion 15 and can be bent by operation of the operation portion 8, and an optical system of an observation site. It comprises an imaging device 18, which will be described later, and a distal end portion 17 on which an illumination optical system and the like are disposed. In addition, although not shown in the drawing, the liquid or gas is ejected from the distal end portion 17 in order to eject the cleaning liquid or the cleaning gas toward the optical member on the outer surface of the observation site optical system by the air supply operation and the water supply operation. A water supply / air supply nozzle having a water supply / air supply channel, and a suction port which is a distal end side opening of the treatment instrument channel for inserting the treatment instrument arranged in the insertion portion 7 and sucking the liquid in the body cavity Is provided. In addition, a liquid supply port is provided that opens toward the observation site and ejects liquid.
[0023]
The connector unit 10 includes a gas supply base 21 that is detachably connected to a gas supply source (not shown) built in the light source device 3, and a water supply tank that is detachably connected to a water supply tank 22 that is a liquid supply source. A pressure cap 23 and a liquid supply cap 24 are provided. Further, a suction base 25 connected to a suction source (not shown) for sucking the liquid in the body cavity from the suction port of the distal end portion 17 is provided, and a water supply means (not shown) for feeding water from the liquid delivery port An injection cap 26 is provided for connection to the.
[0024]
Further, the connector portion 10 is provided with a ground terminal cap 27 for returning the leakage current to the high frequency treatment device when a high frequency leakage current is generated in the electronic endoscope 2 when the high frequency treatment is performed. It has been.
[0025]
The operation unit 8 includes an air / water supply operation button 28 for operating an air supply operation and a water supply operation, a suction operation button 29 for operating the suction operation, and a bending operation for performing the bending operation of the bending unit 16. A knob 30, a plurality of remote switches 31 for remotely operating the video processor 5, and a treatment instrument insertion port 32 which is an opening inserted through the treatment instrument channel are provided.
[0026]
A waterproof cap (not shown) for sealing the electrical connector portion 11 in a liquid-tight manner can be detachably connected to the electrical connector portion 11 of the electronic endoscope 2.
[0027]
Next, with reference to FIG. 3, the imaging device 18 constituting the optical system of the observation site disposed at the distal end portion 17 of the electronic endoscope 2 will be described.
[0028]
The imaging device 18 is roughly composed of an objective lens unit 67 and a solid-state imaging device unit 68. The objective lens unit 67 includes a plurality of objective lenses 33, an optical diaphragm 65 and a brightness diaphragm 19 for preventing flare of the objective lens 33, and a spacing tube 66 for keeping the plurality of objective lenses 33 at a predetermined inter-lens distance. Is interposed in the objective lens frame 34.
[0029]
The solid-state imaging device unit 68 has a solid-state imaging device frame 64 fitted to the objective lens frame 34 of the objective lens unit 67. The rearmost lens 26 and the solid-state imaging device 37 are made of an ultraviolet curable adhesive or the like. They are joined and arranged. The detailed configuration of the solid-state imaging device 37 will be described later.
A flexible substrate 58 provided with a connection line extending from the solid-state imaging device 37 and electrically connected to the solid-state imaging device of the solid-state imaging device 37 includes a plurality of electronic components 44 and a plurality of signal cables 50. The signal line 46 is connected to a circuit board 45 having a plurality of connection electrodes 120.
[0030]
As shown in FIG. 4, the signal cape 50 is formed by bundling a plurality of signal wires 46 around an intervening 60 made of a fiber such as Kevlar, and a tape 47 made of PTFE or the like is spirally coated on the outer periphery thereof. ing. A shield conductor 48 made of a tin-plated copper alloy is formed on the outer periphery of the tape 47, and an insulator 49 made of PFA is coated on the outer periphery of the shield conductor 48.
[0031]
On the outer periphery of the signal cable 50, a cable protection 51 for preventing breakage due to interference from the built-in object of the electronic endoscope 2 is bound by a silk thread 52 so as not to come off.
[0032]
After the solid-state image pickup device 37, the circuit board 45, and the signal line 46 are connected, moisture or the like does not enter the periphery of the electrical components that include the solid-state image pickup device 37, the circuit board 45, and the signal line 46. A sealing resin 53 made of an epoxy resin is filled. The sealing resin 53 is filled in a shield frame 54 fitted to the outer periphery of the solid-state imaging device frame 64, so that moisture prevention and impact protection of the electrical component parts are achieved.
[0033]
A heat shrinkable tube 55 is covered over the outer periphery of the shield frame 54 and the cable protection 51.
[0034]
The solid-state imaging device unit 68 and the objective lens unit 67 having such a configuration are adjusted so that the imaging surface of the solid-state imaging device 37 is positioned at the imaging position of the objective lens unit 67, and then the objective lens frame 34 and the solid-state imaging device. The imaging device 18 is generated by fitting and fixing to the device frame 64. The imaging device 18 is fitted in an observation hole formed in an insulating cover and a distal end constituent member that constitutes the distal end portion 17 of the insertion portion 7 of the electronic endoscope 2 and is fixed by an adhesive.
[0035]
Next, a detailed configuration of the solid-state imaging device 37 will be described with reference to FIG.
The solid-state imaging device 39 used in the solid-state imaging device 37 includes a plurality of solid-state imaging devices 39 provided in a matrix on the imaging surface 20 on one side of the imaging surface 20 of the substantially quadrilateral solid-state imaging device 39 in order to reduce the size. A plurality of bonding pads 56 are provided in which connection lines for scanning and driving the photoelectric charge elements in the horizontal and vertical directions are formed in rows. An Au bump 57 is disposed on the bonding pad 56, and a flexible substrate 58 having an inner lead 42 is connected to the bump 57.
[0036]
The flexible substrate 58 includes an inner lead 42 formed in a foil shape connected to the bonding pad 56 via the bump 57, and an outer lead 43 connected to the circuit substrate 45 on the polyimide tape 41. It is a substrate that can be bent and formed with a foil.
[0037]
The inner lead 42 of the flexible substrate 58 is bent and connected to the bump 57 and is reinforced and fixed with an adhesive 35, and the curved portion of the inner lead 42 is covered with a sealing resin 40. Thus, the solid-state imaging device 39 is securely connected and fixed.
[0038]
Dummy bumps 59 are arranged on the dummy bump bonding pads 36 provided on the side of the imaging surface 20 of the solid-state imaging device 39 opposite to the side where the bonding pads 56 and the bumps 57 are arranged. This dummy bump bonding pad 36 is not electrically connected to the internal circuit wiring of the solid-state imaging device 39. The dummy bump 59 is a height adjusting member having a height h equal to the height h from the imaging surface 20 to the upper surface of the bump 57 and the inner lead 42. The dummy bump 59 may be formed of a member having electrical insulation, and may be bonded and fixed on the dummy bump bonding pad 36 with an adhesive 35.
[0039]
When the cover glass 38 is placed and bonded and fixed on the dummy bump 59 and the inner lead 42, the cover glass 38 can be disposed in parallel with the imaging surface 20 of the solid-state imaging device 39. Thereby, the transmitted light from the observation site that has passed through the cover glass 38 is incident on the imaging surface 20 of the solid-state imaging device 39 at an intended incident angle.
[0040]
The dummy bump 59 is accommodated within the projected area of the imaging surface 20 of the solid-state imaging device 39, and the cover glass 38 is made of an ultraviolet curable adhesive in the vicinity of the dummy bump 59 and the inner lead 42, or The imaging surface 20 is fixed so as not to be covered with an epoxy adhesive.
[0041]
As described above, the solid-state imaging device 37 of the present invention has the bump 57 on one side of the imaging surface 20 of the solid-state imaging element 39 and the inner lead 42 disposed on the bump 57, thereby Miniaturization can be realized. Furthermore, an electrical action which is a height adjusting member having a height h equal to the height h to the upper surface of the inner lead 42 on the bump 57 and the bump 57 on one side of the solid-state image pickup device 39 on the imaging surface 20 side. By disposing dummy bumps 59 not to be provided on the opposite side and disposed so as to be within the projected area of the solid-state imaging device 39, the end surface of the cover glass 38 is disposed on the inner leads 42 and the dummy bumps 59. The cover glass 38 can be installed in parallel with the imaging surface 20 of the solid-state imaging device 39, so that the solid-state imager 37 can be downsized and a good image can be obtained.
[0042]
Next, a first other embodiment of the solid-state imaging device according to the present invention will be described with reference to FIGS. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
First, as shown in FIG. 5, the cover glass 70 provided on the front surface of the imaging surface 20 of the solid-state imaging device 39 is connected to the bonding pads 56 and the bumps 57 provided on one side of the imaging surface 20 of the solid-state imaging device 39. A stepped portion 69 that has a height h equal to the height h up to the upper surface of the inner lead 42 and is in contact with the side of the imaging surface 20 of the solid-state imaging device 39 that faces the side where the bump 57 is placed. Is formed. One end of the cover glass 70 is placed on the upper surface of the inner lead 42 connected to the bump 57 of the imaging surface 20, and the step portion 69 of the cover glass 70 is a projected area of the opposite side of the imaging surface 20. It is placed so that it can be housed inside and fixed with an adhesive. Thereby, the imaging surface 20 and the cover glass 70 are installed in parallel.
[0043]
Further, as shown in FIG. 6, a stepped portion 71 extended from the base of the solid-state imaging device 72 on a side opposite to one side of the imaging surface 20 provided with the bonding pads 56, bumps 57, and inner leads 42. The solid-state imaging device 72 is provided. The height of the stepped portion 71 is formed to be the same height h as the height h formed by the bonding pad 57 and the inner lead 42. The end surface of the cover glass 73 is placed and fixed on the upper surface of the inner lead 42 and the upper surface of the stepped portion 71 of the solid-state image sensor 72 so that the imaging surface 20 and the cover glass 73 are installed in parallel.
[0044]
As described above, the step 69 or 71 that is the height adjusting means of the cover glass 70 or 73 does not protrude from the imaging surface 20 of the solid-state image sensor 39 or 72, and the cover glass 70 or 73 and the solid-state image sensor 39. , 72 can be integrally formed to achieve downsizing of the solid-state imaging device. In addition, the imaging surface 20 and the end faces of the cover glasses 70 and 73 can be easily arranged in parallel, and the number of members constituting the solid-state imaging device and the number of assembly steps can be reduced, thereby providing an inexpensive solid-state imaging device. can do.
[0045]
Next, a second other embodiment of the solid-state imaging device according to the present invention will be described with reference to FIG. FIG. 7A is a plan view of the solid-state imaging device as viewed from the surface, and FIG. 7B is a side view of the solid-state imaging device as viewed from the side. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0046]
Bonding pads 56, bumps 57, and inner leads 42 of the flexible substrate 58 are disposed on one side of the imaging surface 20 of the solid-state imaging device 39, and dummy bumps 59 that are height adjustment members are provided on the opposite sides of the imaging surface 20. And a cover glass 123 formed so as to cover the flexible substrate 58 having the solid-state image pickup device 39 and the inner lead 42 of the solid-state image pickup device 122. The cover glass 123 is provided with the solid-state image pickup device 122. After fixing in parallel with the imaging surface 20 of the device 122, the outer shape of the cover glass 123 is directly fitted and fixed by the shield frame 124. Thereby, the above-described solid-state imaging device frame 64 (see FIG. 3) becomes unnecessary, and the external shape of the imaging device 125 can be reduced in size.
[0047]
The angle of view and focus adjustment of the objective lens unit 67 of the imaging device 18 shown in FIG. 3 are performed by fitting the objective lens frame 34 of the objective lens unit 67 and the solid-state imaging device frame 64 of the solid-state imaging device unit 68. Is done by adjusting. However, when moisture enters between the plurality of objective lenses 33 of the objective lens unit 67, the objective lens frame 34 is removed from the solid-state imaging device frame 64, and the plurality of objective lenses frame 34 is removed from the removed objective lens frame 34. The objective lens 33 is further removed, cleaned, and reassembled. It is desired that the objective lens 33 can be removed and cleaned and reassembled easily and efficiently.
[0048]
For this purpose, an objective lens unit for realizing the desire for easy cleaning of the objective lens 30 and focus adjustment will be described with reference to FIGS.
[0049]
The objective lens unit 67a will be described with reference to FIG. A first objective lens frame 78 and a second objective lens frame 79 in which a flange portion 77 having the same surface as the end surface of the insulating cover 76 is formed on the distal end side are mounted in the observation hole 75 of the distal end component member 74. . In the first objective lens frame 78, a first objective lens 80 and a second objective lens 81 are arranged to constitute a front group objective lens frame unit 82.
[0050]
In the second objective lens frame 79, a rear group objective lens frame unit 84 in which a plurality of objective lenses 83 after the first and second objective lenses 80 and 81 are arranged is configured. Yes. The front group objective lens frame unit 82 and the rear group objective lens unit 84 are fixed at a position maintaining a predetermined distance in the observation hole 75 of the tip constituting member 74, and the objective lens unit 67a is generated. Yes.
[0051]
In addition, a tool groove 85 is formed in a part on the tip side of the tip constituent member 74. The insulating cover 76 is formed with a jig hole 85a for inserting a jig into the tool groove.
[0052]
In the objective lens unit 67a having such a configuration, when moisture enters between the first objective lens 80 and the second objective lens 81 and field clouding occurs, the tip of the insulating cover 76 is passed through the jig hole 85a. A jig is inserted into a tool groove 85 provided on the distal end side of the component member 74 (indicated by an arrow in the figure), the front group objective lens frame unit 82 is removed from the observation hole 75 of the distal component member 74, and the first The objective lens 80 and the second objective lens 81 are cleaned or replaced. As a result, the front group objective lens unit 82 can be easily repaired, and the adjustment of the fitting and fixing position of the front group objective lens unit 82 to the observation hole 75 of the front-end component member 74 can be performed at the time of reassembly. Angle and focus can be adjusted easily.
[0053]
Next, another embodiment of the objective lens unit 67 will be described.versusThe object lens unit 67b will be described with reference to FIG. The first objective lens 86 is fixed to an observation hole 88 formed in the insulating cover 87. The objective lens system 89 subsequent to the first objective lens 86 is held and fixed in an objective lens frame 91 attached in the tip constituting member 90.
[0054]
That is, the first objective lens 86 and the insulating cover 87 to which the first objective lens 86 is fixed are moved and adjusted in the optical axis direction with respect to the tip constituent member 90 to which the objective lens frame 91 is fixed. The focus adjustment and the angle of view adjustment by the objective lens 89 can be easily executed.
[0055]
Further, in the objective lens unit 67b having such a configuration, when the first objective lens 86 is clouded in the field of view or is damaged and has an image defect, the first objective lens 86 is configured with the tip configuration together with the insulating cover 87. Remove from the member 90, clean the first objective lens 86, or reattach the insulating cover 87 with the replaced first objective lens 86 fixed to the tip component member 90, and repair by newly adjusting the focus and angle of view. Work becomes easy.
[0056]
Next, another embodiment of the objective lens unit 67 will be described.versusThe object lens unit 67c will be described with reference to FIG. A solid-state imaging device 94 is attached and fixed to the rear end side of the observation hole 93 formed in the tip constituent member 92. An objective lens unit 97 including an objective lens frame 96 on which a plurality of objective lenses 95 are held and fixed is attached and fixed to the front end side of the observation hole 93. The objective lens unit 97 has a flange 98 formed on the objective lens frame 96, and the flange 98 is fitted into an observation hole step 99 provided in the observation hole 93 of the tip component member 92. It has come to be. The observation hole step portion 99 is larger than the width of the flange 98 of the objective lens frame 96 so that a plurality of spacers 100 can be interposed when the flange 98 is fitted to the observation step portion 99. It has become.
[0057]
An insulating cover 101 is attached to the front end side of the flange 98 of the objective lens frame 96 so as to be sandwiched between the front end constituent member 92, and the objective lens unit 97 is attached and fixed to the front end constituent member 92.
[0058]
When the objective lens unit 67c having such a configuration causes field fogging or damage to the objective lens 95, the objective lens unit 97 can be removed from the observation hole 93 by removing the insulating cover 101. After the objective lens unit 97 is cleaned or replaced, the focus and angle of view of the solid-state imaging device 94 and the objective lens unit 97 are adjusted by adjusting the number and thickness of the spacers 100 when the objective lens unit 97 is remounted in the observation hole 93. Adjustment can be performed and the efficiency of repair work can be improved.
[0059]
Next, another embodiment of the objective lens unit 67 will be described.versusThe object lens unit 67d will be described with reference to FIG. On the outer periphery of the first objective lens frame 103 on which the first objective lens 102 is disposed, a projecting member 105 having a projecting projection 104 having a predetermined pitch is disposed. The first objective lens frame 103 is housed and disposed inside a tip constituent member 107 in which a concave groove 106 that engages with the protrusion 104 is formed. A second objective lens frame in which a second objective lens 108 is disposed inside the tip constituting member 107.160Is fixed at a position maintaining a predetermined distance from the first objective lens 102.
[0060]
The convex protrusion 104 and the concave groove 106 are both formed in a screw shape.
[0061]
When the first objective lens 102 of the objective lens unit 67d having such a structure is clouded or damaged, the first objective lens frame 103 having the protrusions 104 is rotated to move the arrow in the figure. The lens is moved in the direction opposite to the lens optical axis direction, and is taken out from the tip constituting member 107, and the first objective lens 102 installed in the taken out first objective lens frame 103 is cleaned or replaced. After cleaning or replacement, the first objective lens frame 103 on which the first objective lens 102 is installed is mounted again in the tip component member 107, and the protrusion 105 is engaged with the groove 106 while the first objective lens frame 103 is engaged with the groove 106. By adjusting the position by rotating the first objective lens frame 103 and moving it in the optical axis direction indicated by the arrow in the figure, it is possible to adjust the focus and the angle of view by changing the sphere R of the first objective lens 102. Thus, the efficiency of repair work can be improved. Further, the protruding member 105 may be formed of an elastic member and mounted so as to be pushed into the groove portion 106.
[0062]
Next, an objective lens unit 67e which is another embodiment of the objective lens unit 67 will be described with reference to FIG. The first objective lens 109 has an adhesive in an objective lens frame 111 in which an adhesive stopper 110 is formed at a position where a predetermined distance necessary for focus / angle adjustment from the rear end surface of the first objective lens 109 is secured. It is fixed at 121. The first objective lens 109 is connected to the objective lens frame 111.InThe adhesive 121 to be fixed is fixed to the objective lens by the adhesive stopper 110.frameThe adhesive is prevented from flowing out to the objective lens group after the first objective lens 109 arranged in the lens 111.
[0063]
The objective lens unit 67 having such a configuration.eIf the first objective lens 109 is clouded or the first objective lens 109 is scratched, the first objective lens 109 can be cleaned and replaced when the first objective lens 109 is cleaned. Since the position can be adjusted and fixed within the range up to the adhesive stopper 110, it is possible to improve the repair work when the first objective lens 109 is cleaned or replaced. Therefore, the time for repair work can be shortened, and the efficiency of the repair work can be improved.
[0064]
Next, an objective lens unit 67f, which is another embodiment of the objective lens unit, will be described with reference to FIG. On the front side of the objective lens frame 112, a flat plate-like second objective lens 113 and a first objective lens 114 having a thickness substantially the same as that of the second objective lens 113 and having a lens outer shape larger than that of the second objective lens 113. Is arranged. A plurality of objective lenses 115 are arranged on the rear side of the objective lens frame 112.
[0065]
Further, the outer peripheral position of the objective lens frame 112 where the second objective lens 113 is disposed is engaged with a fixing screw 117 that is screwed into a screw hole 117 a that penetrates from the outer surface to the inner surface of the tip component member 116. A fixing groove 118 is provided.
[0066]
When the objective lens frame 112 is mounted in the tip constituent member 116, the tip of the fixing screw 117 is brought into contact with the fixing groove 118 to fix the objective lens frame 112 at a predetermined position.
[0067]
In the objective lens unit 67f having such a configuration, the first objective lens 114 and the second objective lens 113 have the same thickness, but the outer shape of the first objective lens 114 is larger than that of the second objective lens 113. The first objective lens 114 is more easily broken or broken than the second objective lens 113. Therefore, when the first objective lens 114 and the second objective lens 113 are clouded in the field of view or the first objective lens 114 is damaged, only the first objective lens 114 can be destroyed and replaced. Therefore, it became possible to improve the efficiency of repair work.
[0068]
Further, by forming a fixing groove 118 to be engaged with a fixing screw 117 provided on the tip component member 116 on the outer peripheral surface of the objective lens frame 112 on which the second objective lens 113 having a small lens outer shape is arranged, the objective lens frame The outer shape of 112 can be formed small.
[0069]
Next, in the electronic endoscope, the optical axis center of the observation optical system of the electronic endoscope apparatus according to appendix 13 is aligned with the center of the electric mask for monitoring and displaying the image of the observation site imaged and generated by the electronic endoscope apparatus. The endoscope system will be described.
[0070]
2. Description of the Related Art Conventionally, in an electronic endoscope system, as shown in FIGS. 2 and 3, an image signal of an observation site imaged and generated by an imaging device 18 provided at a distal end portion 17 of an insertion portion 7 of an electronic endoscope 2 is After being supplied to the video processor 5 and subjected to predetermined image signal processing, an observation image is displayed on the monitor 6 based on the image signal.
[0071]
The position adjustment of the objective lens 33 built in the objective lens unit 67 forming the observation optical system constituting the imaging device 18 and the solid-state imaging device 37 built in the solid-state imaging device unit 68 are fixedly mounted. This is done by adjusting the fitting state of the frame members 34 and 64.
[0072]
The setting of the center of the optical axis of the observation optical system including the objective lens 33 arranged in the objective lens unit 67 of the imaging device 18 is set to the center of the effective pixel area of the solid-state imaging device 39 of the solid-state imaging device 37 for ease of work. It is set to match.
[0073]
However, since the solid-state imaging device 37 is attached and fixed to the solid-state imaging device frame 64 or is fixed to the shield frame 54 with the sealing resin 53, the accuracy of the mounting and fixing position of the solid-state imaging device 37 is increased. Therefore, it is difficult to match the center of the observation optical system of the objective lens 33 and the center of the effective pixel of the solid-state image sensor 39, and an image defect such as a declination has occurred in the image displayed on the monitor 6.
[0074]
Further, the image of the observation region displayed on the monitor 6 is one image outside the quadrilateral of the effective pixel area of the solid-state image sensor 39 for image processing such as contour emphasis in the image signal processing of the video processor 5. In order to use the portion, the effective pixel area of the solid-state image sensor 39 cannot be displayed.
[0075]
Therefore, the pixel area used for the signal processing such as contour enhancement is not masked in the image signal processing of the piedo processor 5 so that the pixel region is not displayed on the monitor 6. In this electrical mask, the size of a part of the outer side of the quadrilateral of the effective pixel area used for image processing differs depending on the top, bottom, left, and right, so that the center of the image of the observation region displayed on the monitor 6, that is, The center of the electric mask is not coincident with the center of the effective pixel region, and the center of the electric mask is shifted from the center of the observation optical system if the center of the observation optical system is coincident with the center of the effective pixel region. There is a problem that image defects such as the above occur.
[0076]
Therefore, the electronic endoscope system according to Supplementary Note 13 does not have a declination or the like by matching the center of the observation optical system with the center of the electric mask when the shape of the electric mask is projected onto the effective pixel region instead of the center of the effective pixel region. A good image can be obtained.
[0077]
Therefore, it is necessary to join the center of the rearmost objective lens of the observation optical system to the cover glass of the solid-state imaging device at a position that coincides with the center of the electric mask when the electric mask shape is projected onto the effective pixel region.
[0078]
Specifically, as shown in FIG. 14, the plurality of objective lenses 129 interpose an optical aperture 131 and a spacing tube 132 for maintaining a predetermined spacing distance between the objective lens 129 and the objective lens frame 130. It is fixed in a letting state.
[0079]
The solid-state imaging device 128 includes a solid-state imaging device 133, a cover glass 135 that covers the imaging surface 134 of the solid-state imaging device 133, and connection electrodes 127 and 136 arranged on the back surface of the solid-state imaging device 133.
[0080]
The rearmost objective lens 137 is fitted on the front surface of the cover glass 135 and the final rear end of the objective lens frame 130 to which the objective lens 129 is fixed so that the optical axis thereof coincides with the objective lens 129. It is fixed. The objective lens 129, the rearmost objective lens 137, and the cover glass 135 that are fitted and fixed to the objective lens frame 130 are bonded and fixed with an ultraviolet curable adhesive.
[0081]
A circuit board 142 on which a plurality of electronic components 141 are mounted is connected to the connection electrode 136 of the solid-state imaging device 128. A plurality of signal lines 46 are connected to the rear side of the circuit board 142 and the connection electrode 127.
[0082]
A sealing frame 143 made of an epoxy resin is filled in a shield frame 144 around the solid image processor 128, the circuit board 142, and the signal line 46 so that moisture or the like does not enter. The outer periphery of the frame 144 is covered with a heat shrinkable tube 145.
[0083]
The imaging device 146 configured in this manner is mounted and fixed with an adhesive in an insulating cover having an observation hole that forms the distal end portion 17 of the electronic endoscope 2 described in FIG. Other than the imaging device 146, the endoscope system is the same as that shown in FIG.
[0084]
Next, a mounting position relationship between the cover glass 135 and the rearmost objective lens 137 provided in the solid-state imaging device 128 of the imaging device 146 will be described with reference to FIGS. 15 and 16.
[0085]
The solid-state imaging device 128 is located at a position where the center of the rearmost objective lens 137 coincides with the center of the display pixel region 147 when the shape of the electric mask 138 is projected onto the effective pixel region 134 (that is, the center of the electric mask 138). By joining to the cover glass 135, the center of the observation optical system composed of the plurality of objective lenses 129 and the center of the electric mask 138 on which the endoscopic observation image is displayed on the monitor 6 can be matched. Therefore, it is possible to obtain a good image with no declination or the like.
[0086]
Next, the relationship among an electric mask, a solid-state imaging device, a cover glass, and a rearmost objective lens for obtaining a high-resolution image will be described with reference to FIG.
[0087]
In order to obtain a high-resolution image, it is necessary to form a display pixel area 151 in which the shape of the electric mask 150 displayed on the monitor 6 is projected to the maximum in the effective pixel area 149 of the solid-state imaging device 152. At this time, the outer diameter of the rearmost objective lens 153 is the image height.ISince the size corresponding to 1 is required, the configuration is larger than that of the solid-state imaging device 152.
[0088]
On the other hand, in order to reduce the diameter of the distal end portion 17 of the electronic endoscope 1 using the solid-state image pickup device 152, the outer diameter of the observation optical system combined with the solid-state image pickup device 152 is reduced, and the last end objective The lens 155 and the solid-state imaging device 155 need to have the same outer dimensions or less as shown in FIGS.
[0089]
For that purpose, the image height in FIG.ILess than 1imageHeightI2 is formed, and the last end objective lens 155 having the center of the display pixel area 154 different from the center of the effective pixel area 149 is set to be within the projection area of the solid-state imaging device 152. It is necessary to coincide with the center of the objective lens 155.
[0090]
As described above, by aligning the center of the observation optical system and the center of the electric mask at a position different from the center of the effective pixel region, a plurality of observation images can be obtained with one solid-state imaging device, and the imaging device Can be downsized.
[0091]
[Appendix]
According to the embodiment of the present invention described in detail above, the following configuration can be obtained.
[0092]
(Additional remark 1) The bonding pad row | line | column which consists of several bonding pads arrange | positioned at the piece of the imaging surface side of the solid-state image sensor formed in the substantially quadrilateral shape, the bump arrange | positioned on this bonding pad row | line | column, A plurality of inner leads having an upper surface aligned at a substantially uniform height from the imaging surface of the solid-state imaging device, height adjusting means disposed on opposite sides of the bonding pad row, and the inner leads In a solid-state imaging device composed of a cover glass disposed on the upper surface and the height adjusting means,
A height adjustment means having a height equal to the height to the top surfaces of the plurality of inner leads is provided on the imaging surface of the solid-state imaging device, so that the end face of the cover crow and the imaging surface are parallel to each other. A solid-state imaging device.
[0093]
(Supplementary note 2) The solid-state imaging device according to supplementary note 1, wherein the height adjusting means is a dummy bump.
[0094]
(Supplementary note 3) The solid-state imaging device according to supplementary note 1, wherein the solid-state imaging element is used in an electronic endoscope apparatus.
[0095]
(Additional remark 4) The said height adjustment means is the step part extended from the said cover glass to the side opposite to the some bonding row | line | column provided in the one side of the imaging surface side of the said solid-state image sensor, It is characterized by the above-mentioned. The solid-state imaging device according to appendix 1.
[0096]
(Additional remark 5) The said height adjustment means is a step part extended from the opposing side of the said solid-state image sensor which opposes the some bonding row | line | column provided in the one side of the imaging surface side of the said solid-state image sensor. The solid-state imaging device according to appendix 1.
[0097]
(Additional remark 6) The bonding pad row | line | column which consists of several bonding pads arrange | positioned at the piece of the imaging surface side of the solid-state image sensor formed in the substantially quadrilateral shape, the bump arrange | positioned on this bonding pad row | line | column, A plurality of inner leads having an upper surface aligned at a substantially uniform height from the imaging surface of the solid-state imaging device, height adjusting means disposed on opposite sides of the bonding pad row, and the inner leads In a solid-state imaging device composed of a cover glass disposed on the upper surface and the height adjusting means,
An image pickup apparatus characterized in that an outer peripheral surface of the cover crow is directly fitted and fixed by a shield material.
[0098]
(Appendix 7) A solid-state image sensor frame that fits and fixes a solid-state image sensor formed in a substantially quadrilateral shape and a cover glass;
An objective lens frame for fitting and fixing a plurality of objective lenses for guiding observation light of an observation site to the solid-state imaging device;
A tip component member covered with an insulating cover for fixing the solid-state imaging element frame and the objective lens frame;
Insulating cover member having an observation hole for fitting and storing the tip constituent member and taking observation light from the observation site into the objective lens;
A tool groove provided around the observation hole of the insulating cover member;
An electronic endoscope characterized in that a jig is inserted into the tool groove so that the objective lens frame can be removed.
[0099]
(Additional remark 8) The solid-state image sensor frame which fits and fixes the solid-state image sensor and cover glass formed in the substantially quadrilateral,
An objective lens frame for fitting and fixing a second objective lens composed of a plurality of objective lenses for guiding observation light of an observation site to the solid-state imaging device;
A tip component member covered with an insulating cover for fixing the solid-state imaging element frame and the objective lens frame;
Insulating cover member having an observation hole for fitting and storing the tip constituent member and taking observation light from the observation site into the objective lens;
A first objective lens coaxial with the second objective lens fixed in the observation hole of the insulating cover;
And adjusting the focus of the first and second objective lenses by adjusting the position of the insulating cover member and the tip component member, to which the first objective lens is fixed, in the optical axis direction. A featured electronic endoscope.
[0100]
(Supplementary Note 9) A flange provided on the outer periphery of the objective lens frame;
An observation hole step provided on an inner periphery of the tip component member and having a built-in flange of the objective lens frame;
A plurality of spacers interposed between the observation hole step portion and the flange;
The electronic endoscope according to appendix 8, wherein focus adjustment is performed with an objective lens installed in the objective lens frame by the number of inserted spacers.
[0101]
(Supplementary Note 10) The objective lens frame includes a first objective lens frame for storing and fixing the first objective lens, and a second objective lens frame for storing and fixing the second objective lens. Protrusions installed on the outer periphery of the objective lens frame and formed with convex thread portions at predetermined intervals using an elastic member, and recessed screw portions that fit into the projection portions of the first objective lens frame are formed. And an insulating cover for storing and fixing the second objective lens frame,
And the focus adjustment of the first objective lens and the second objective lens can be performed by adjusting the fitting position of the protrusion of the first objective lens frame and the recess of the insulating cover. The electronic endoscope as described.
[0102]
(Supplementary Note 11) The objective lens frame is provided with a first objective lens and a second objective lens that are housed and fixed, and is provided on an incident side of an observation hole in which the first objective lens of the objective lens frame is housed and fixed. An adhesive stopper having a predetermined dimensional distance;
The objective lens unit according to appendix 8, wherein the first objective lens performs focus adjustment of the objective lens within a dimensional distance to the adhesive stopper.
[0103]
(Supplementary Note 12) At the tip of the observation hole of the objective lens frame, a first objective lens having at least a large external dimension is accommodated and disposed, and the same as the first objective lens on the rear side of the first objective lens. A second objective lens having a thickness and a small outer diameter is housed and disposed, and a fixing groove is provided on the outer periphery of the objective lens frame to fit a tip of a fixing screw. 9. The electronic endoscope according to claim 8, further comprising a screw hole through which the fixing screw is screwed and advanced from a side surface of the tip constituent member to be fitted and fixed.
[0104]
(Additional remark 13) In the electronic endoscope system comprised by the electronic endoscope by which the imaging device by which the solid-state imaging device was arrange | positioned in the imaging position of the observation optical system was arrange | positioned at the front-end | tip part, a video processor, and a monitor,
An electron characterized in that an optical axis center of an observation optical system coincides with an electric mask center displayed on a monitor, and the coincident optical axis center and electric mask center are different from an effective image area center of a solid-state imaging device. Endoscopesystem.
[0105]
(Supplementary note 14) The electronic endoscope system according to supplementary note 13, wherein the center of the last objective lens of the observation optical system coincides with the center of the electric mask.
[0106]
【The invention's effect】
The solid-state imaging device of the present invention has a bonding pad, a bump provided on one side of the imaging surface of the solid-state imaging device, and a dummy bump for height adjustment having a height equivalent to the height dimension to the inner lead on the opposite side. By placing the cover glass on the inner lead and the dummy bump, the cover crow and the imaging surface of the solid-state image sensor can be set easily and reliably in parallel, and the observation light incident on the imaging surface of the solid-state image sensor The unintended refraction can be eliminated, and an image without distortion of the observation site can be displayed.
[Brief description of the drawings]
FIG. 1 is a side view showing a configuration of an embodiment of a solid-state imaging device according to the present invention.
FIG. 2 is an explanatory diagram for explaining an electronic endoscope system using a solid-state imaging device according to the present invention.
FIG. 3 is a cross-sectional view illustrating an imaging apparatus using a solid-state imaging element according to the present invention.
FIG. 4 is a cross-sectional view illustrating the configuration of a signal cable connected to the solid-state imaging device of the present invention.
FIG. 5 is a side view illustrating a first other embodiment of the solid-state imaging device of the present invention.
FIG. 6 is a side view illustrating a first other embodiment of the solid-state imaging device of the present invention.
7A and 7B show a second embodiment of the solid-state imaging device of the present invention, in which FIG. 7A is a plan view and FIG. 7B is a side view.
FIG. 8 is a side view illustrating repair of an objective lens and lens focus adjustment of the solid-state imaging device according to the present invention.
FIG. 9 is a side view illustrating repair of an objective lens and lens focus adjustment of the solid-state imaging device according to the present invention.
FIG. 10 is a side view for explaining repair of an objective lens and lens focus adjustment of the solid-state imaging device of the present invention.
FIG. 11 is a side view illustrating repair of an objective lens and lens focus adjustment of the solid-state imaging device of the present invention.
FIG. 12 is a side view illustrating repair of an objective lens and lens focus adjustment of the solid-state imaging device of the present invention.
FIG. 13 is a side view illustrating repair of an objective lens and lens focus adjustment of the solid-state imaging device of the present invention.
FIG. 14 is a cross-sectional view illustrating an embodiment of a solid-state imaging device according to the second invention.
FIG. 15 is an explanatory diagram illustrating an electronic mask used in the solid-state imaging device according to the second invention.
FIG. 16 is an explanatory diagram for explaining an arrangement positional relationship of a cover glass, an electronic mask, an objective lens, and the like of the solid-state imaging device according to the second invention.
FIG. 17 is an explanatory diagram for explaining another positional relationship between the cover glass, the electronic mask, the objective lens, and the like of the solid-state imaging device according to the second invention.
FIG. 18 is an explanatory diagram for explaining another positional relationship between the cover glass, the electronic mask, the objective lens, and the like of the solid-state imaging device according to the second invention.
[Explanation of symbols]
1 ... Electronic endoscope system
2 ... Electronic endoscope
3. Light source device
4. Connection cable
5 ... Video processor
6 ... Monitor
20: Imaging surface
35 ... Adhesive
36 ... Bond pad for dummy bump
37. Solid-state imaging device
38 ... cover glass
39 ... Solid-state image sensor
40: Sealing resin
41 ... Polyimide tape
42 ... Inner lead
43 ... Outer lead
56 ... Bonding pad
57 ... Bump
58 ... Flexible substrate

Claims (5)

A bonding pad row composed of a plurality of bonding pads disposed on one side of the imaging surface side of the solid-state imaging device formed in a substantially quadrilateral, a bump that is disposed in the bonding pad on the columns, are disposed on the bumps A plurality of inner leads having an upper surface aligned at a substantially uniform height from the imaging surface of the solid-state imaging device; height adjusting means disposed on opposite sides of the bonding pad row; In a solid-state imaging device composed of a cover glass disposed on the thickness adjusting means,
The height adjusting means has a height equal to the height to the upper surface of the plurality of inner leads on the imaging surface of the solid-state image sensor, and is not electrically connected to an internal circuit of the solid-state image sensor A solid-state imaging device, characterized in that the end face of the cover glass and the imaging surface are parallel to each other.   The solid-state imaging device according to claim 1, wherein the height adjusting unit is fixed to a bonding pad that is not electrically connected to an internal circuit of the solid-state imaging device.   The solid-state imaging device according to claim 2, wherein the height adjusting unit is a dummy bump.   The height adjusting means is a step portion extended from the cover glass on a side facing the plurality of bonding pad rows provided on one side of the imaging surface of the solid-state imaging device. Item 2. The solid-state imaging device according to Item 1.   The height adjusting means is a step portion extended from a substrate-facing side of the solid-state imaging device facing a plurality of the bonding pad rows provided on one side of the imaging surface of the solid-state imaging device. The solid-state imaging device according to claim 1.

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