JP6070933B2 - Optical device and method for manufacturing optical device - Google Patents

Description

  The present invention relates to an optical device that emits or detects visible light and a method for manufacturing the same.

  Optical devices using photodiodes and light emitting diodes have been put into practical use. For example, it is used as a light detection means in fields such as automatic lighting control of lighting devices, backlight brightness control of liquid crystal displays, backlight control of mobile phone keypads, and dark field switching control of surveillance cameras. . In addition, a proximity sensor is configured in combination with a light emitting element, and it is also used for measuring the presence or absence of an object and a distance.

  FIG. 11 is a schematic cross-sectional view showing a package structure 30 of this type of optical device (FIG. 3 of Patent Document 1). A solid-state imaging device 32 is mounted on a ceramic substrate 31 serving as a base. The ceramic substrate 31 has a multilayer structure of three layers or more, and a predetermined number of conductive films 33a are patterned between the layers. One end of each conductive film 33a is disposed in the vicinity of the peripheral portion of the solid-state imaging device 32 on the ceramic substrate 31, and a bonding wire 34 drawn from the electrode portion of the solid-state imaging device 32 is connected thereto. On the other hand, the other end of each conductive film 33a is exposed on the outer surface of the ceramic substrate 31, and a side conductive film 33b is formed on the exposed portion. Then, the lead terminals 35 are brazed to the side conductive films 33b so as to extend perpendicularly to the back side direction of the ceramic substrate 31. Further, a sealing glass 36 is bonded to the upper end portion of the ceramic substrate 31, and the solid-state imaging device 32 is hermetically sealed by the sealing glass 36.

  FIG. 12 is a schematic cross-sectional view showing the package structure of another optical device (FIG. 2 of Patent Document 1). The solid-state imaging device 41 mainly includes a base substrate 42, a solid-state imaging device 43, a resin frame 44, and a transparent plate 45. The base substrate 42 has a flat plate structure made of a ceramic substrate. The solid-state image sensor 43 is composed of a CCD element and is mounted at the center of the base substrate 42. On both sides of the base substrate 42, concave portions 46 having a semicircular shape in plan view are formed at predetermined intervals. A conductive film 47 made of a thick film conductive material having a U-shaped cross section is formed on the base substrate 42 via the surface of each recess 46. One end portion 47a of the conductive film 47 is disposed in the vicinity of the peripheral portion of the solid-state imaging device 43, and the other end portion 47b of the conductive film 47 extends to a surface opposite to the element mounting surface of the base substrate 42, and the extended portion. Is exposed to the substrate surface to form an electrode portion for external connection. A plurality of electrode portions are formed on the periphery of the upper surface of the solid-state imaging device 43, and the electrode portions and one end portion 47 a are connected by a bonding wire 48. The resin frame 44 is formed so as to surround the solid-state imaging device 43 on the base substrate 42. The transparent plate 45 is joined to the upper end portion of the resin frame 44 in a state where a predetermined space is secured between the transparent plate 45 and the element mounting surface of the base substrate 42. This describes that the manufacturing process is greatly simplified as compared with the conventional hollow package structure.

Japanese Patent Laid-Open No. 10-144898

  In the optical device package structure 30 shown in FIG. 11, a stepped recess is formed in a multilayer ceramic substrate, and a solid-state imaging device 32 is mounted on the bottom of the recess to secure a space for hermetic sealing. Yes. Therefore, the manufacturing process of the ceramic substrate 31 becomes complicated, and there is a problem that the material cost and processing cost of the ceramic substrate 31 are increased.

  In the package structure of the solid-state imaging device 41 shown in FIG. 12, the upper end portion of the resin frame 44 is formed flat, and the hollow portion formed between the transparent plate 45 and the base substrate 42 is hermetically sealed. Is difficult. That is, when the transparent plate 45 is heated while being pressed toward the base substrate 42, the resin frame 44 is softened and it becomes difficult to form a hollow portion having a predetermined height. In addition, when an ultraviolet curable resin is used as the resin frame 44 instead of the thermosetting resin, the transparent plate 45 having a filter function for cutting ultraviolet rays cannot be used.

  The present invention has been made in view of the above problems, and provides a method for manufacturing an optical device that can reduce the number of components, provide a thin and lightweight optical device, and can be manufactured in a simple process. The purpose is to do.

  The optical device of the present invention includes a lead frame, an optical chip bonded to one surface of the lead frame, a translucent substrate installed on the other surface side of the lead frame, the optical chip, and the optical device. A resin material that seals an outer peripheral portion between the optically transparent substrate, and the optical chip has an optically active region on the surface of the lead frame and an electrode pad on the outer peripheral side of the optically active region. And the electrode pad is bonded to the lead frame.

  Further, a bank is provided between the electrode pad and the optically active region and is disposed so as to surround the optically active region.

  Further, the bank is composed of a protrusion provided on the translucent substrate.

  The translucent substrate has a metal film formed on the surface on the lead frame side, and the metal film and the lead frame are bonded to each other.

  In addition, a protruding electrode is formed on the electrode pad, and the lead frame and the electrode pad are bonded via the protruding electrode.

  Further, the resin material is formed so as to cover a side surface of the translucent substrate, a side surface of the optical chip, and a back surface of the optical chip opposite to a surface on which the optical active region is formed. did.

  Further, the resin material has a light shielding property to block light (not to transmit).

  The translucent substrate has a filter function of transmitting light having a specific wavelength.

  In addition, the outer lead protruding outward from the resin material of the lead frame is bent in a direction perpendicular to the surface of the optical chip.

  Further, the outer leads of the lead frame protruding outward from the resin material of the lead frame are collectively arranged in a direction parallel to the surface of the optical chip.

  The optical device manufacturing method of the present invention includes a protruding electrode forming step in which a protruding electrode is formed on an electrode pad formed on the outer peripheral surface of the optical chip on the surface of the optical chip, and an optical device through the protruding electrode on the lead frame. An optical chip mounting step of mounting a chip, a translucent substrate installation step of installing a translucent substrate on the opposite side of the lead frame from the optical chip, and between the optical chip and the translucent substrate. A resin material filling step of filling a resin material on the outer peripheral side of the optically active region and a resin material solidifying step of solidifying the resin material are provided.

  Further, a metal film is formed on a surface of the translucent substrate facing the lead frame, and a joining step for joining the metal film and the lead frame is provided.

  Further, a bank installation step of installing a bank between the optically active area and the electrode pad and surrounding the optically active area is provided.

  The optical chip mounting step is a step of mounting a plurality of optical chips on the lead frame, and includes a cutting and separating step of cutting and separating into individual optical devices after the resin material curing step.

  An optical device of the present invention includes a lead frame, an optical chip bonded to one surface of the lead frame, a translucent substrate installed on the other surface side of the lead frame, an optical chip, and a translucent substrate And a resin material for sealing the outer peripheral portion between the two. Further, the optical chip includes an optically active region on the surface of the lead frame and an electrode pad on the outer peripheral side of the optically active region, and the electrode pad is bonded to the lead frame. Accordingly, since the base substrate for fixing the optical chip is omitted, the thickness of the optical device can be reduced and the weight can be reduced. Further, an ultraviolet cut optical filter substrate can be used. Furthermore, since the number of constituent members is reduced, the manufacturing process is simplified, and an optical device can be manufactured at a low cost.

It is a cross-sectional schematic diagram showing the basic composition of the optical device of the present invention. It is a cross-sectional schematic diagram of the optical device which concerns on 1st embodiment of this invention. It is a cross-sectional schematic diagram of the optical device which concerns on 2nd embodiment of this invention. It is a cross-sectional schematic diagram of the optical device which concerns on 3rd embodiment of this invention. It is a cross-sectional schematic diagram of the optical device which concerns on 4th embodiment of this invention. It is a typical perspective view of the optical device which concerns on 5th embodiment of this invention. It is a typical perspective view of the optical device which concerns on 6th embodiment of this invention. It is process drawing showing the basic manufacturing method of the optical device of this invention. It is explanatory drawing of each manufacturing process of the optical device which concerns on 7th embodiment of this invention. It is explanatory drawing of each manufacturing process of the optical device which concerns on 7th embodiment of this invention. It is a cross-sectional schematic diagram which shows the package structure of a conventionally well-known optical device. It is a cross-sectional schematic diagram which shows the package structure of a conventionally well-known optical device.

(Basic configuration of optical device)
FIG. 1 is a schematic cross-sectional view showing a basic configuration of an optical device 1 of the present invention. The optical device 1 includes a lead frame 2, an optical chip 3 bonded to one surface of the lead frame 2, a translucent substrate 4 installed on the other surface side of the lead frame 2, an optical chip 3, And a resin material 5 that seals the outer peripheral portion between the transparent substrate 4. The optical chip 3 includes an optically active region 6 on the surface on the lead frame 2 side and an electrode pad 7 on the outer peripheral side of the optically active region 6, and the electrode pad 7 and the lead frame 2 are bonded to each other. . The translucent substrate 4 may be bonded to the other surface of the lead frame 2 or may be fixed away from the other surface.

  The lead frame 2 can be mounted on the electrode pad 7 by Philip chip bonding via the protruding electrode 9. The protruding electrodes 9 can be formed by stud bumps or plated bumps made of Au, Ag, Cu, Sn, Pb solder or the like. The optical chip 3 can be a light receiving element made of a photodiode, an image sensor, or the like, or a bare chip on which a light emitting element such as an LED is formed. The lead frame 2 can be formed by punching or etching a metal plate such as a copper alloy material or an iron nickel alloy material. The translucent substrate 4 may be made of a glass material such as soda lime glass or borosilicate glass, or a translucent plastic material such as epoxy resin, acrylic resin, or polyimide resin. A filter function that transmits light of a specific wavelength can be imparted to the translucent substrate 4. For example, by mixing phosphate glass into the translucent substrate 4, spectral characteristics close to the visibility characteristics can be imparted. In addition, an optical interference film may be formed on the surface of the translucent substrate 4.

  As the resin material 5, a thermosetting resin or an ultraviolet curable resin can be used. For example, a resin material 5 made of epoxy resin, engineering plastic, or the like can be filled between the optical chip 3 and the translucent substrate 4 so as to surround the optically active region 6. The resin material 5 hermetically seals the optically active region 6 and adheres and fixes the translucent substrate 4, the lead frame 2, and the optical chip 3. A light-shielding material, for example, a black pigment, is mixed into the resin material 5 to make it light-shielding, and noise light incident from the lateral direction or the back direction can be blocked.

  Since the optical device 1 directly joins the optical chip 3 to the lead frame 2, the optical device 1 does not require a base substrate and can be formed to be light and extremely thin. Further, since a thermosetting resin can be used as the resin material 5, the ultraviolet cut type translucent substrate 4 can be used. This will be specifically described below.

(First embodiment)
FIG. 2 is a schematic cross-sectional view of the optical device 1 according to the first embodiment of the present invention. The same portions or portions having the same function are denoted by the same reference numerals. As shown in FIG. 2, the optical device 1 includes a lead frame 2, an optical chip 3 bonded to one surface of the lead frame 2, and a translucent substrate installed on the other surface side of the lead frame 2. 4. The optical chip 3 includes an optically active region 6 on the surface on the lead frame 2 side and electrode pads 7 in the vicinity of the four corners on the outer peripheral side of the optically active region 6. Further, a bank 8 is provided between the electrode pad 7 and the optically active region 6 and is disposed so as to surround the optically active region 6.

  By installing the bank 8, the resin material 5 can be prevented from flowing into the optically active region 6 when the resin material 5 is filled. Furthermore, the gap between the translucent substrate 4 and the optical chip 3 can be prevented from shrinking beyond the height of the bank 8. A gap may be formed between the bank 8 and the optical chip 3 or between the bank 8 and the translucent substrate 4, and unless the resin material 5 flows over the bank 8 into the optically active region 6. Good. The bank 8 can use a glass material, a plastic material, a metal material, or the like. In addition, since the configuration of the lead frame 2, the optical chip 3, the translucent substrate 4, the resin material 5, the protruding electrode 9, and the like is the same as the description in the basic configuration of the optical device, the description thereof is omitted.

(Second embodiment)
FIG. 3 is a schematic cross-sectional view of the optical device 1 according to the second embodiment of the present invention. The difference from the first embodiment is that the bank 8 is constituted by the ridges 10 provided on the translucent substrate 4, and the other points are the same as in the first embodiment. Hereinafter, differences from the first embodiment will be described. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 3, the translucent substrate 4 includes a protrusion 10 provided between the electrode pad 7 and the optically active region 6 so as to surround the optically active region 6. The ridge 10 can be formed by molding the translucent substrate 4. The ridge 10 functions as the bank 8 in the first embodiment. It is possible to prevent the resin material 5 from flowing into the optically active region 6 when the resin material 5 is filled. Further, it is possible to prevent the gap between the translucent substrate 4 and the optical chip 3 from being narrowed beyond a certain level. Furthermore, since it is not necessary to install and align the bank 8 separately from the translucent substrate 4, the manufacturing process is simplified. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

(Third embodiment)
FIG. 4 is a schematic cross-sectional view of the optical device 1 according to the third embodiment of the present invention. The difference from the second embodiment is that the lead frame 2 and the translucent substrate 4 are joined via the metal film 11, and other configurations are the same as those of the second embodiment. Hereinafter, differences from the second embodiment will be described. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 4, the translucent substrate 4 has a metal film 11 formed on the surface on the lead frame 2 side, and the metal film 11 and the lead frame 2 are joined. For the metal film 11, a metal material made of Au, Ag, Pt, Ni, Cu, Cr, or the like can be used. For example, a three-layer structure of Au / Ni / Cr composed of Cr with a thickness of 600 mm, Ni with a thickness of 2000 mm, and Au with a thickness of 1500 mm can be formed. The metal film 11 and the lead frame 2 can be connected by ultrasonic bonding or solder bonding. For example, the bonding surface of the lead frame 2 can be made of Au or Sn, and the lead frame 2 and the metal film 11 can be brought into close contact with each other, pressurized while being heated, and ultrasonic waves can be applied to bond the metals together. Further, the metal film 11 can be formed by applying nano silver by a printing method or a dispensing method.

  Further, the bonding between the translucent substrate 4 and the lead frame 2 and the bonding between the lead frame 2 and the optical chip 3 can be performed simultaneously. Even in this case, since the protrusions 10 are formed on the translucent substrate 4, the gap between the translucent substrate 4 and the optical chip 3 can be kept constant. As described above, since the space between the lead frame 2 and the optical chip 3 and the space between the lead frame 2 and the translucent substrate 4 are fixed by metal-to-metal bonding in addition to the resin material 5, the mechanical strength of the optical device 1 is increased. Will improve. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

(Fourth embodiment)
FIG. 5 is a schematic cross-sectional view of an optical device 1 according to the fourth embodiment of the present invention. The difference from the third embodiment is that the resin material 5 is formed so as to cover the back surface of the optical chip 3, and the other configuration is the same as that of the third embodiment. Hereinafter, differences from the third embodiment will be mainly described. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 5, the resin material 5 covers the side surface of the translucent substrate 4, the side surface of the optical chip 3, and the back surface of the optical chip 3 opposite to the surface on which the optically active region 6 is formed. Formed. Thereby, since the back surface and side surface of the optical chip 3 are completely covered with the resin material 5, the optical chip 3 can be protected from contaminants. In addition, a black pigment or the like can be mixed into the resin material 5 to provide the resin material 5 with a light blocking property that does not transmit light. Thereby, noise light incident on the optically active region 6 from the outside and noise light emitted outside can be shielded. Since other configurations are the same as those of the third embodiment, description thereof is omitted. In addition, in 1st embodiment to 3rd embodiment, if the resin material 5 is installed in the back surface of the optical chip 3, the effect similar to this embodiment can be acquired.

(Fifth embodiment)
FIG. 6 is a schematic perspective view of the optical device 1 according to the fifth embodiment of the present invention. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 6, the optical device 1 includes a main body 1a and an outer lead 2a protruding from the main body 1a. The outer lead 2 a is a portion that protrudes outward from the resin material 5 of the lead frame 2. The main body 1a is a portion obtained by removing the outer lead 2a from the optical device 1. The main body 1a has the configuration of any of the first to fourth embodiments already described.

  The main body 1a has a quadrangular cubic shape in plan view as viewed from the vertical direction of the translucent substrate 4. Two outer leads 2a project from the cube-shaped side surface Sa, and the other two outer leads 2a project from the opposite side surface Sb. The other two outer leads 2a are bent and extended along the side surfaces Sc and Sd orthogonal to the side surface Sb, and are arranged in the same direction as the two outer leads 2a protruding from the side surface Sa. That is, the four outer leads 2 a are collectively arranged in one direction in a plane parallel to the surface of the optical chip 3. In other words, the four outer leads 2 a are formed in a line in a plane whose outer end is parallel to the surface of the optical chip 3. With this configuration, the outer leads 2a can be erected and assembled in a row on the circuit board, so that the area of the optical device 1 occupying the circuit board is reduced, and the degree of integration of elements on the circuit board is improved.

(Sixth embodiment)
FIG. 7 is a schematic perspective view of the optical device 1 according to the sixth embodiment of the present invention. The difference from the fifth embodiment is the shape of the outer lead 2a, and the other points are the same as in the fifth embodiment. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 7, the main body 1 a has a quadrangular cubic shape in plan view when viewed from the vertical direction of the translucent substrate 4. Two outer leads 2a project from the cube-shaped side surface Sa, and the other two outer leads 2a project from the opposite side surface Sb. Each outer lead 2 a is bent in a direction perpendicular to the surface of the optical chip 3. With this configuration, the height of the optical device 1 can be kept low when the optical device 1 is assembled to a circuit board. Therefore, it is suitable for portable devices and products that require thinning.

  In the fifth and sixth embodiments described above, the example of the four outer leads 2a has been described. However, a larger number of outer leads 2a, that is, a number of lead frames 2 may be formed. .

(Basic optical device manufacturing method)
FIG. 8 is a process diagram showing a basic manufacturing method of the optical device of the present invention. The basic manufacturing method of the optical device of the present invention includes a lead frame preparing step S0 for preparing a lead frame, a protruding electrode forming step S1 for forming a protruding electrode on the electrode pad of the optical chip, and an optical for mounting the optical chip on the lead frame. Chip mounting step S2, translucent substrate installation step S3 for installing a translucent substrate on a lead frame opposite to the optical chip, resin material for filling a resin material between the optical chip and the translucent substrate A filling step S4 and a resin material solidifying step S5 for solidifying the filled resin material are provided. Note that S0 to S4 do not represent the process order of each process. The lead frame preparation step S0 may be performed after the optical chip mounting step S2, or the optical chip mounting step S2 may be performed after the translucent substrate installation step S3.

  This will be specifically described. In the lead frame preparation step S0, a metal plate is formed on a comb-like electrode by a punching method or an etching method. In the protruding electrode forming step S1, protruding electrodes are formed on electrode pads formed on the outer peripheral surface of the optical chip from the optically active region. The protruding electrode is formed by vapor deposition, sputtering, plating, or ball bonder. In the optical chip mounting step S2, the optical chip is mounted on the lead frame via the protruding electrodes. It can be mounted by flip chip bonding between the lead frame and the protruding electrode. In the translucent substrate installation step S3, the translucent substrate is installed on the side of the lead frame opposite to the optical chip. In the resin material filling step S4, the resin material is filled between the optical chip and the translucent substrate and on the outer peripheral side of the optically active region. The resin material can be filled by injection molding. In the resin material solidification step S5, the filled resin material is solidified and integrated.

  Since a base substrate for mounting the optical chip is not required, the optical device can be reduced in weight and can be formed extremely thin. Furthermore, it is not necessary to mount an optical chip on the base substrate, and the manufacturing process is simplified. Hereinafter, the present invention will be described in detail with reference to the drawings.

(Seventh embodiment)
9 and 10 are explanatory diagrams of each manufacturing process of the optical device 1 according to the seventh embodiment of the present invention. In the present embodiment, a protrusion that functions as a bank is formed on a translucent substrate. The same portions or portions having the same function are denoted by the same reference numerals.

  FIG. 9 (S0) is an explanatory diagram of the lead frame preparation step S0. A plate body made of a copper alloy material or an iron nickel alloy material is formed on the opposing comb-like electrodes by a punching method or an etching method. FIG. 9 (S1) is an explanatory diagram of the protruding electrode forming step S1. An optically active region 6 is formed at the center of the surface of the optical chip 3, and an electrode pad 7 is formed on the outer peripheral surface of the optically active region 6. A protruding electrode 9 is formed on the surface of the electrode pad 7. The optical chip 3 uses a bare chip made of a semiconductor substrate on which a light receiving element such as a photodiode and a light emitting element such as an LED are formed. The optically active region 6 is a light receiving surface or a light emitting surface, and the electrode pad 7 is formed on the same surface as the optically active region 6.

  The protruding electrode 9 can be formed by vapor deposition, sputtering, plating, or ball bonder. Au, Ag, Ni, Cu, solder, or the like can be used as the protruding electrode 9. For example, Au stud bumps can be formed by a ball bonder. Specifically, the tip of the Au wire is melted to form an Au ball, and the Au ball is ultrasonically bonded to the electrode pad 7 to cut the Au wire. For example, if a stud bump is formed using Au wire having a diameter of 25 μm, the height of the protruding electrode 9 can be set to about 60 μm.

  FIG. 9 (S2) is an explanatory diagram of the optical chip mounting step S2, in which the upper diagram is a schematic plan view seen from the vertical direction of the surface of the optical chip 3, and the lower diagram is a schematic sectional view. The optical chip 3 is mounted on the lead frame 2 by flip chip joining the lead frame 2 and the protruding electrode 9. Specifically, the lead frame 2 and the protruding electrode 9 are brought into close contact with each other, pressurized and heated to apply ultrasonic waves, and the lead frame 2 and the protruding electrode 9 are flip-chip bonded. The lead frame 2 and the optical chip 3 may be connected by solder bonding instead of ultrasonic bonding.

  FIG. 10 (S3) is explanatory drawing of translucent board | substrate installation process S3. The upper diagram is a schematic sectional view, and the lower diagram is a schematic plan view. The translucent substrate 4 is installed on the side of the lead frame 2 opposite to the optical chip 3. A protrusion 10 is formed on the surface of the translucent substrate 4, and the protrusion 10 is placed toward the optical chip 3 side. The ridge 10 surrounds the optically active region 6 of the optical chip 3, and the top of the ridge 10 may contact the surface of the optical chip 3 or there may be a gap. In short, it is only necessary to prevent the resin material 5 filled thereafter from entering the optically active region 6. The translucent substrate 4 can use a glass material, a plastic material, or the like. The ridge 10 can be formed by molding a substrate material. Further, the light-transmitting substrate 4 can be provided with a filter function that transmits light of a specific wavelength.

  FIG. 10 (S4) is an explanatory diagram of the resin material filling step S4. The resin material 5 is formed with the side surfaces of the optical chip 3 and the translucent substrate 4, the gap between the optical chip 3 and the translucent substrate 4, and the optically active region 6 of the optical chip 3. It is formed on the back surface opposite to the front surface. As the resin material 5, a thermosetting or ultraviolet curable adhesive can be used. It is preferable that the resin material 5 has a light blocking property to block light by mixing a black pigment or the like. By using the light-shielding resin material 5, it is possible to prevent noise light from entering the optically active region 6 or emitting noise light from the optically active region 6. Next, in the resin material solidification step S5, the resin material 5 is solidified by heating or irradiation with ultraviolet rays. Next, the support part of the lead frame 2 is cut to form the outer leads 2a separated into four.

  Thus, since the optical device 1 is formed so that the lead frame 2 is sandwiched between the optical chip 3 and the translucent substrate 4, a base substrate for mounting the optical chip 3 becomes unnecessary, and the optical device 1 can be It can be made lighter and thinner. In addition, the manufacturing process is simplified and the cost can be reduced.

  Instead of forming the protrusions 10 on the translucent substrate 4, a bank 8 is formed separately from the translucent substrate 4, and between the optically active region 6 and the electrode pad 7, A bank installation step of installing so as to surround the optically active region 6 can be provided. Moreover, the joining process of joining the lead frame 2 and the translucent board | substrate 4 can be provided after translucent board | substrate installation process S3. Further, a metal film 11 (see FIG. 4) is formed in advance on the surface of the translucent substrate 4 facing the lead frame 2, and after the translucent substrate installation step S3, the metal film 11 and the lead The frame 2 can be joined between metals. The metal film 11 uses a metal material made of Au, Ag, Pt, Ni, Cu, Cr or the like. For example, a three-layer structure made of Au / Ni / Cr is used. The lead frame 2 and the metal film 11 are brought into close contact with each other, the light-transmitting substrate 4 is pressed while being heated, and ultrasonic waves are applied to bond them. Thereby, the optical chip 3, the lead frame 2, and the translucent board | substrate 4 can be joined firmly. As the translucent substrate 4, it is preferable to use a glass having a thermal expansion coefficient close to that of the semiconductor substrate of the optical chip 3.

  Further, in the translucent substrate installation step S3, the protruding electrode 9 of the optical chip 3 is brought into close contact with one surface of the lead frame 2, and the other surface is brought into close contact with the metal film 11 of the translucent substrate 4 to mount the optical chip. By performing step S2, the optical chip 3 and the translucent substrate 4 can be bonded to the lead frame 2 at the same time. In this case, the ridges 10 and the banks 8 can be opened by forming the ridges 10 on the translucent substrate 4 in advance or by inserting a bank between the translucent substrate 4 and the optical chip 3. It is possible to prevent the space surrounding the optically active region 6 from being crushed.

  In addition, a plurality of optical devices 1 can be formed simultaneously. That is, a plurality of optical chips 3 are mounted on the lead frame 2 in the optical chip mounting step S2, and the light-transmitting substrate 4 having an outer shape corresponding to the plurality of optical chips 3 is mounted on the lead frame 2 in the light transmitting substrate installation step S3. Installed on the opposite side of the chip 3. Further, in the resin material filling step S4, the resin material is filled between the plurality of optical chips 3 and the translucent substrate 4 and on the outer peripheral side of each optically active region 6, and after the resin material solidifying step S5, cutting is performed. In the separation step, the individual optical devices 1 are cut and separated. Thereby, the some optical device 1 can be manufactured simultaneously.

DESCRIPTION OF SYMBOLS 1 Optical device, 1a Main body part 2 Lead frame, 2a Outer lead 3 Optical chip 4 Translucent substrate 5 Resin material 6 Optical active area 7 Electrode pad 8 Bank 9 Projection electrode 10 Projection 11 Metal film 12 Main body part Sa, Sb , Sc, Sd side

Claims (12)

A lead frame;
An optical chip bonded to one surface of the lead frame;
A translucent substrate installed on the other surface side of the lead frame;
A resin material for sealing an outer peripheral portion between the optical chip and the translucent substrate,
The optical chip includes an optically active region on the surface of the lead frame side and an electrode pad on the outer peripheral side of the optically active region, and the electrode pad is bonded to the lead frame ,
The translucent substrate is a metal film is formed on the surface side of the lead frame, the metal film and the optical device lead frame Ru are bonded.   The optical device according to claim 1, further comprising a bank disposed between the electrode pad and the optically active region and surrounding the optically active region.   The optical device according to claim 2, wherein the bank includes a protrusion provided on the translucent substrate. Wherein the projecting electrode on the electrode pads are formed, the optical device according to any one of claims 1 to 3, wherein the lead frame and the electrode pads are bonded through the protruding electrode. The resin material is formed to cover a side surface of the translucent substrate, a side surface of the optical chip, and a back surface opposite to a surface on which the optical active region of the optical chip is formed. 5. The optical device according to any one of 4 . The optical device according to any one of claims 1 to 5 having a light shielding property of the resin material which does not transmit light. The optical device according to any one of claims 1 to 6, wherein said light-transmissive substrate having a filter function of transmitting light of a specific wavelength. The optical device according to any one of claims 1 to 7 , wherein an outer lead protruding outward from the resin material of the lead frame is bent in a direction orthogonal to the surface of the optical chip. The optical device according to any one of claims 1 to 7 , wherein outer leads protruding outward from the resin material of the lead frame are collectively arranged in a direction parallel to the surface of the optical chip. A protruding electrode forming step of forming a protruding electrode on an electrode pad formed on the outer peripheral surface of the optical chip than the optically active region;
An optical chip mounting step of mounting the optical chip through the protruding electrode to the lead frame,
A translucent substrate installation step of installing a translucent substrate on the opposite side of the lead frame from the optical chip;
A metal film is formed on the surface of the translucent substrate facing the lead frame, and a bonding step of bonding the metal film and the lead frame;
A resin material filling step of filling a resin material between the optical chip and the translucent substrate and on the outer peripheral side of the optically active region;
And a resin material solidifying step for solidifying the resin material. The method for manufacturing an optical device according to claim 10 , further comprising a bank installation step of installing a bank between the optically active area and the electrode pad and surrounding the optically active area. The optical chip mounting step is a step of mounting a plurality of the optical chip to the lead frame,
After the resin material solid step, method for producing an optical device according to claim 10 or 11 comprising a cutting and separating step of cutting into individual optical devices.

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