JP3207319B2 - Photoelectric conversion device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for manufacturing a photoelectric conversion element.

[0002]

2. Description of the Related Art Photoelectric conversion elements are widely used for industrial purposes. Above all, CCDs (solid-state imaging devices) have a wide range of applications, and cameras using CCD devices are widely used from consumer use to industrial use. Among them, particularly for medical use, a small-diameter camera has been put to practical use for an endoscope.
Although this camera has a minimum diameter of 8 mm, miniaturization greatly affects its commercial value, so it is urgently necessary to develop an ultra-small camera of 8 mm or less in the future. Among them, the CCD element is the core of the camera body, and its packaging technology is the most important development theme.

[0003] The CCD package of the current general-purpose camera is:
Ceramic package using wire bonding,
It is widely used because of its excellent mass productivity and low cost. However, there is a limit from the viewpoint of miniaturization, and each company is developing an alternative mounting method.

A conventional method which has already been put to practical use among them will be described with reference to FIGS. FIG. 23 shows a COG (Chip On Glass) method developed by the applicant. In this mounting method, first, as shown in FIG.
1 is prepared (step a), and a gold thick film wiring layer 234 (step b) is formed on the flat portion 232 and the end surface 233 of the optical glass 231 for connection to the CCD element and external drawing of wiring. Next, a low-melting metal paste typified by, for example, an indium-lead alloy is printed by a screen printing method on the connection portion with the CCD element and melted by heating to form a projection (bump) 235 (step c). . On the other hand, the CCD element 23
6 are prepared (step d), and gold ball bumps 237 are formed on the connection pads of the CCD element 236 by using a wire bonding method (step e).

Next, the low-melting metal bump 235 formed on the optical glass 231 and the gold ball bump 237 on the CCD element 236 are connected by thermocompression bonding at a temperature lower than the heat resistance temperature (150 ° C.) of the CCD (step f). ). Then, in order to improve the mechanical strength of the connection portion, a resin 238 is filled and sealed in the bump connection portion and the inside of the CCD pixel (step g). After that, the external connection electrode 239 pulled out to the end face of the optical glass
Is connected to the flexible substrate 340 (step h). At that time, a method of thermocompression bonding using, for example, an adhesive sheet having anisotropic conductivity is used.

The advantage of the COG method is that the alignment accuracy between the CCD and the optical glass is excellent, and it can be within 10 μm.

Next, another conventional example will be described with reference to FIG. FIG. 24 shows an SP-TAB (Single Point TA).
B) The law. First, the CCD element 2415 (step a)
TAB tape 2 with gold plated bumps pre-formed
417, small heater tool 2 for bonding
Using 418, an electrode pad of the CCD is connected to each pin by ultrasonic and thermocompression bonding for each pin (step b). Similar to the COG method, the small heater tool 2418 realizes connection by performing thermocompression bonding at or below the heat resistance temperature (150 ° C.) of the CCD. This mounting method uses TAB tape 2 after CCD mounting.
The greatest advantage is that the characteristics of the CCD can be confirmed on the 417. Next, the optical adhesive 2 is applied to the upper surface of the CCD 2415.
After applying 419 (step c), the optical glass 2411
Is precisely bonded to the upper surface of the CCD (step d). The bonding accuracy at this time is about ± 20 μm. afterwards,
It is also a great advantage that the external connection leads can be easily pulled out on the back surface of the CCD by bending the TAB tape 2417 from the outside of the CCD connection portion (step e).

However, the conventional method has a problem to be solved. First, in the COG method, it is necessary to perform screen printing in order to draw out the wiring layer to the end face of the optical glass 231. However, printing defects such as disconnection at an edge portion are apt to occur, which causes a decrease in yield. Further, a step of connecting a flexible substrate for external connection after mounting the CCD package is required, and the manufacturing process is complicated.

[0009] In the SP-TAB method, it is particularly difficult to bond the optical glass 2411 and the adhesive 2419.
A simple method is desired. This is technically difficult because it requires holding the optical glass 2515 on top of the thin TAB leads 2517 on both sides of the CCD, as seen in FIG. In addition, since connection with the electrode portion of the CCD is performed by thermocompression bonding for each pin, the mounting time is long and inefficient.

[0010] Further, as a problem common to the COG and SP-TAB methods, there is a void (cavity) in a CCD image area. In other words, resin sealing is performed after the package is mounted, but the gap between the CCD element and the optical glass is relatively large (20 to 50 μm) except for the connection part of the electrode pad. Resin enters. Then, the microlens effect for condensing formed on the surface of the CCD is optically lost, and there is a disadvantage that the characteristics of the CCD are deteriorated.

[0011]

SUMMARY OF THE INVENTION The above-mentioned conventional COG
According to the method, not only the yield was lowered, but also the manufacturing process was complicated. The SP-TAB method has a long mounting time and is inefficient. A problem common to the COG and SP-TAB methods is the porosity of the CCD image area.
There was an inconvenience that the CD deteriorated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a CCD device mounting structure which is simple and has excellent performance while utilizing the advantages of the COG and SP-TAB methods, and which compensates for the disadvantages of both, and a method of manufacturing the same. .

[0013]

In order to solve the above-mentioned problems, a photoelectric conversion element mounting apparatus according to the present invention connects a photoelectric conversion element and a wiring board by face-down bonding using an anisotropic conductive film. Use means.

Further, the substrate has an opening, and a dummy pattern or the like is provided on an outer peripheral portion of the photoelectric conversion element other than the connection pattern.

Further, the electronic component can be mounted, the bent portion of the wiring substrate is removed, and the back surface of the substrate bonded to the optical glass is roughened.

[0016]

As a result, the alignment accuracy between the photoelectric conversion element and the wiring board is remarkably improved. In addition, the mounting method allows all pins to be connected at one time, and enables batch bonding.
The problem of the P-TAB method is solved. Also, by using a TAB tape, the method of drawing out external leads, which has been a problem of the conventional COG method, can be simplified. In addition, a cavity in which the sealing resin does not exist on the light receiving surface can be easily formed, and the above problem is solved.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a CCD according to an embodiment of the present invention.
FIG. 2 is a front view illustrating a configuration of a mounting device. In FIG. 1, a TAB tape 102 is bonded to one surface of an optical glass 101 with an adhesive 103. The optical glass 101 transmits light. The thickness of the optical glass 101 is determined by optical design, and is, for example, 1 mm. An optical low-pass filter may be used as the optical glass 101, and this function may be used in combination. Further, glass in which an infrared cut filter or the like and the low-pass filter are laminated may be used. Optical glass 1
01 is not limited to this as long as it is a light-transmitting member, and may be an inorganic material such as quartz or silicon or an organic material such as polyethylene.

The TAB tape 102 is formed by forming a plurality of copper leads 105 on an insulating sheet 104 as shown in FIG. The TAB tape 102 can be freely bent. The insulating sheet 104 is made of, for example, polyimide, polyamide, polyester, or phenol.
It consists of a composite substrate of glass epoxy resin and paper / glass substrate. The thickness T104 of the insulating sheet 104 is, for example, 10
It is about 0 μm. The insulating sheet 104 has, for example, a rectangular opening 106. The opening 106 is provided in the optical glass 1.
It is formed in order to allow the light that has entered through 01 to pass through.
The copper lead 105 is connected to two opposite sides 10 of the opening 106.
7 and 108 are formed at regular intervals on the insulating sheet 104. In other words, the adjacent copper lead 105
The insulating sheet 104 always exists between them. The copper lead 1 is placed on the insulating sheet 104 on the other two sides 109 and 110 other than the two opposite sides 107 and 108 of the opening 106.
05 are not formed, but these two sides 109, 11
The copper leads 105 may be formed on the zero insulating sheet 104. The thickness of the copper lead 105 is, for example, about 35 μm.

The width of the copper lead 105 is, for example, 100 μm
It is about. Instead of the TAB tape 102, a substrate that cannot be bent freely may be used. These substrates are preferably black. This can prevent reflection,
Unnecessary radiation can be prevented from entering. In this case, a black substrate may be used, or a black paint may be applied to the substrate.

The adhesive 103 is, for example, an adhesive such as epoxy acrylate, modified acryl, or epoxy. For example, an adhesive that is cured by heat, ultraviolet light, or both is used. The thickness of the adhesive 103 is, for example, about 10 to 20 μm.

A CCD 112 is connected to the TAB tape 102 via an anisotropic conductive film 111. As shown in FIG. 3, the anisotropic conductive film 111 is formed not only along the sides 107 and 108 where the copper leads 105 exist but also along the other two sides 109 and 110 other than the sides 107 and 108. It is more preferable to form them. The anisotropic conductive film 111 formed as described above has a function of T
It also has a function of mechanically connecting the AB tape 102 and the CCD 112 and a function of sealing a hollow portion formed by the opening 106 and the like from the outside.

The anisotropic conductive film 111 is preferably black. Thereby, reflection can be prevented, and incidence of unnecessary radiation can be prevented.

The CCD 112 has, for example, 410,000 pixels. The size of the CCD 112 is, for example, 4 × 4 mm. C
The thickness of the CD 112 is, for example, 0.6 mm. CCD1
12, on the surface of the copper lead 105, as shown in FIG.
Corresponding to the electrode pad 1 along the two sides of the CCD 112.
17 is formed. The copper leads 105 may be formed along the four sides, and the electrode pads 117 may be formed along the four sides of the CCD 112.

The size of each electrode pad 117 is, for example, 1
It is about 00 μm × 100 μm. Each electrode pad 117
Are formed with bumps 113. Each bump 113
Is 90 μm, for example. The height of each bump is, for example, 30 μm. Each of the copper leads 105 and the corresponding bump 113 are electrically connected via conductive particles contained in the anisotropic conductive film 111. On the light receiving surface of the CCD 112, a micro lens 115 is formed. CCD11
2 receives light through the optical glass 101, the opening 106, and the microlens 115.

On the optical glass 101, an anisotropic conductive film 1
A sealing resin 116 is formed so as to cover 11. The sealing resin 116 is, for example, a phenol or epoxy-based sealing resin, for example, a type of sealing resin that is cured by heat, ultraviolet light, or a combination thereof. Sealing resin 116
Reinforces the electrical and mechanical connections between the TAB tape 102 and the CCD 112. However, in this CCD mounting device, the sealing resin 116 may be omitted. This is because the anisotropic conductive film 111 has the function of the sealing resin 116 already. If the sealing resin 116 is omitted, the manufacturing process can be simplified. The alignment accuracy between the CCD 112 and the optical glass 101 is within 10 μm, which is equivalent to the COG method.

FIG. 5 is a diagram showing a method of manufacturing the CCD mounting device shown in FIG. First, a copper lead 105 is formed on an insulating sheet 104 by using an etching method or the like (Step 501).

The adhesive 103 is formed on the surface of the TAB tape 102 formed in step 501 on which the copper leads 105 are not formed by using screen printing or the like (step 502).

Next, the optical glass 101 and the TAB tape 1
02 with an adhesive 103 (step 50).
3). In step 503, as shown in FIG. 6, pressure is applied from above the copper lead 105 using a pressing tool 601,
Ultraviolet rays 602 are irradiated from the back surface of the optical glass 101.
Thereby, the optical glass 101 and the TAB tape 102 can be bonded in a short time of several seconds to several tens of seconds. That is, the working time required for bonding can be significantly reduced as compared with the case where the copper leads 105 are bonded one by one.

An anisotropic conductive film 111 is formed on the TAB tape 102 by screen printing or the like (step 5).
04). The anisotropic conductive film 111 is formed using a paste-like material by a dispenser method, a screen printing method, or the like.
It is applied on the TAB tape 102. Further, the anisotropic conductive film 111 is made of a frame-shaped film-like material made of TAB tape 1.
02.

From the pixel area of the CCD 112 to the CCD 11
The distance to the chip end of No. 2 is about 0.3 to 0.5 mm, and since the coating width is narrow, it is difficult to form a frame-shaped anisotropic conductive film. Therefore, an anisotropic conductive paste is suitable. When applying with a dispenser, for example, an anisotropic conductive paste having a viscosity of 10,000 to 25000 cps is used. At this time, when the diameter of the dispensing portion of the dispenser is about 0.2 mm, the application pressure is 1.5 to 3.0 kg, and the application speed is 1 to 3 mm / sec, the portion applied on the TAB tape 102 has a width of 0 mm. An optimum coating amount can be obtained when the height is 0.2 mm and the height is 60 to 90 μm. In the screen printing method, for example, a screen of 250 mesh is used, and the printing pressure is 2 to 2.
With 3 kg, the above optimum amount of coating can be obtained.

Next, the TAB tape 102 and the bump 1
13 and the CCD 112 on which the TAB tape 102 is formed.
The copper lead 105 and the bump 113 are aligned and connected via the anisotropic conductive film 111 (step 5).
05). The connection by the anisotropic conductive film 111 is performed by heating and pressing. The anisotropic conductive film 111 is formed, for example, by adding gold particles having a diameter of about 1 to
Use what is dispersed about 30%.

Finally, the sealing resin 116 is formed so as to cover the anisotropic conductive film 111 by heating, irradiation of ultraviolet rays, or both (step 506).

The TAB tape 102 and the CCD 112
May be connected by an anisotropic conductive film 111, and then the optical glass 101 and the TAB tape may be bonded by an adhesive 103.

The TAB tape 102 of the CCD mounting apparatus shown in step 506 of FIG. 1 or FIG. 5 is folded as shown in FIG.
At 12, the diagonal including the drawn-out portion of the TAB tape 102 is about 7 mm, and an ultra-small camera having a camera housing diameter of 8 mm is realized.

In the CCD mounting apparatus of this embodiment, since a large number of copper leads 105 formed on the insulating sheet 104 are collectively adhered to the optical glass 101, the step of adhering these can be simplified. it can.

When the copper leads 105 are collectively bonded to the optical glass 101 at one time, the copper leads 105 are bent as shown in FIG. 8A, and short-circuit defects 801 occur due to contact between the adjacent copper leads 105. Or copper lead 105
There is a possibility that a connection failure may occur between the device and the CCD 112.
Therefore, in the mounting apparatus of this embodiment, as shown in FIG. 8B, the TAB tape 102 in which the copper leads 105 are formed on the insulating sheet 104 at regular intervals, in other words, the insulating sheet is always provided between the adjacent copper leads 105. 104 is present, and an insulating sheet 104
Is bonded to the optical glass 101, so that the copper lead 1 shown in FIG.
No bending of 05 occurs. In addition, in the case of such a structure, since the insulating sheet 104 is always present between the adjacent copper leads 105, when connecting the TAB tape 102 and the CCD 112 using the anisotropic conductive film 111, there is a difference. The isotropic conductive film 111 tends to adhere to the insulating sheet 104 and the copper leads 105. Therefore, it is possible to prevent the anisotropic conductive film 111 from flowing into the opening 106 of the TAB tape 102 and the like. In addition, in the case of such a structure, the insulating sheet 104 and the copper lead 105 partially exist between the bump 113 and the optical glass 101, so that the distance between the bump 113 and the optical glass 101 becomes two.
It becomes narrow to about 0 to 30 μm. This also prevents the anisotropic conductive film 111 from flowing into the opening 106 of the TAB tape 102 and the like.

As shown in FIG. 8B, when the insulating sheet 104 is formed, the distance G82 between the insulating sheet 104 and the CCD 112 is reduced.
1 is the sum of the height of the bump 113 and the thickness of the copper lead 105, and is about 65 μm. If the coating thickness of the anisotropic conductive film 111 is smaller than that, the CCD 1
Partial opening 815 that cannot seal 12 is likely to occur.
Therefore, when the copper lead 105 is formed as a dummy lead as shown in FIG.
2 is an interval of only the bump height, which can be reduced to about 30 μm. Therefore, the amount of the anisotropic conductive film applied is reduced to prevent the anisotropic conductive film from entering the opening 106, and it is easy to achieve complete sealing between the anisotropic conductive film and the CCD. Is obtained.

The anisotropic conductive film 111 is a TAB tape 102
There is an advantage that the space in the hollow portion can be reliably secured if it can be prevented from flowing into the opening 106 or the like. That is, the anisotropic conductive film 111 in the pixel area of the CCD 112
Of the micro lens 115 formed on the surface of the CCD 112 can be prevented from deteriorating, and the characteristics of the CCD can be prevented from deteriorating.

Further, in the CCD mounting apparatus of this embodiment, since the TAB tape 102 is used for bonding to the optical glass 101, the bonding surface is widened and the bonding strength is improved.

Next, another embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view of the CCD mounting apparatus of this embodiment, and FIG. 10 is a front view thereof. The CCD mounting apparatus shown in these figures is the same as the CC mounting apparatus shown in FIG.
Different from D mounting device.

First, the CCD mounting apparatus of this embodiment is
The configuration is different from the CCD mounting apparatus shown in FIG. 1 in that a TAB tape 901 mounts an electronic component 902. The electronic component 902 includes, for example, a capacitor, a resistor, a transistor, or an IC. Electronic components 902 may be mounted on both sides of the TAB tape 901. TAB tape 9
The copper lead 903 pulled out from 01 is used, for example, for connection to an inspection pad or a main board or a cable. In this manner, the TAB tape 901 is
By mounting No. 02, high-density mounting of the CCD mounting device becomes possible, and a smaller camera can be realized. In this case, before the step of connecting the TAB tape 901 and the CCD 112, it is better to mount the electronic component 902 on the TAB tape 901 and perform an inspection. This is the CCD 112
Is mounted before the mounting of the electronic component 902, the CCD 1
Reference numeral 12 denotes an electronic component 902 with soldering due to low heat resistance.
This is because a failure due to thermal destruction of the CCD 112 or the like is likely to occur in the mounting process. Thereby, the yield of the CCD 112, which is relatively expensive, can be improved.

If a low-temperature mounting process other than soldering, for example, using a conductive paste connection, may be performed after the CCD 112 is mounted. Also, the CCD 112 and the TAB tape 901
When they are connected by an anisotropic conductive film, it is also possible to simultaneously connect the CCD drive processing IC and other electronic components 902.

Second, the CCD mounting apparatus of this embodiment is
The TAB tape 901 has an insulating sheet 9 at its bent portion.
The configuration is different from that of the CCD mounting apparatus shown in FIG. The removing unit 905 includes:
As shown in FIG. 11, the TAB tape 901 is
06 can be stored at a sharper angle. Thereby, the diameter D906 of the camera housing 906 can be made smaller.

Third, the CCD mounting apparatus of this embodiment is
The configuration differs from the CCD mounting apparatus shown in FIG. 1 in that the TAB tape 901 has dummy leads 907. The dummy lead 907 is provided on the insulating sheet 904 on two sides 909 and 910 where the copper lead 903 is not formed among the four sides of the opening 908, in parallel with the sides 909 and 910. For example, when the anisotropic conductive film 111 is formed along four sides as shown in FIG.
It can be prevented from flowing into the opening 908 of the B tape 901 or the like. The dummy lead 907 may be formed along the sides 911 and 912 where the copper lead 903 as shown in FIG. 12 is formed. Also in this case, the anisotropic conductive film 111 is formed in the opening 908 of the TAB tape 901 similarly to the case described above.
Can be prevented. The dummy lead 907 is
It may be provided on the optical glass 101. Further, the dummy lead 907 is formed of the TAB tape 901 and the optical glass 101.
May be provided in both.

Fourth, the CCD mounting apparatus of this embodiment is
Adhesive surface 91 of TAB tape 901 with optical glass 101
The point that the surface is roughened is the CCD shown in FIG.
The configuration differs from the mounting device. By performing the roughening treatment on the bonding surface 913 in this manner, the bonding strength between the TAB tape 901 and the optical glass 101 is improved. FIG. 16 is a diagram illustrating an example of the rough surface processing. As shown in the figure, the copper foil 1605 on one side of the substrate 1606 on which the copper foils 1604 and 1605 are formed on both sides of the base 1601 via adhesives 1602 and 1603 is removed by etching.
The adhesive 1603 remains on the surface from which the copper foil 1605 has been removed, and the adhesive 1603 serves as a rough surface.
The roughened surface also serves to prevent reflection of light incident on the CCD 112.

FIG. 13 is a front view of a CCD mounting apparatus according to another embodiment. The CCD mounting apparatus shown in the drawing differs from the CCD mounting apparatus shown in FIG. 1 in that a flexible tape 1302 protruding from a multilayer substrate 1301 is used for connection with the CCD 112. As described above, by using the composite substrate 1301, the density of the CCD mounting device can be increased.

FIG. 14 shows a CCD according to still another embodiment.
It is a front view of a mounting device. The CCD mounting device shown in the figure is
For example, an opening 1402 is provided in, for example, a substantially central portion of a TAB tape 1401 having a substantially rectangular shape, and a CCD is provided in the opening 1402.
1 (not shown) is different from the CCD mounting apparatus shown in FIG. In FIG. 14, reference numeral 1403 denotes a dummy lead, and reference numeral 1404 denotes a copper lead.

FIGS. 15A and 15B are plan views of a CCD mounting apparatus according to another embodiment. In the CCD mounting apparatus shown in FIG. 15A, as shown in FIG. 3, when the anisotropic conductive film 111 is formed along the sides 107, 108, 109 and 110, a part of the anisotropic conductive film 111 is anisotropic. An anisotropic conductive film non-formed portion 1501 in which the conductive film 111 is not formed is provided. The portion 1501 where the anisotropic conductive film is not formed is the anisotropic conductive film 1
When thermocompression-bonding 11 to the TAB tape 102, the gas generated in the bonding process is released, or the air trapped in the cavity 106 is thermally expanded to release gas so that no mechanical stress is applied to the connection. Further, it is provided to replace the air in the cavity 106 with nitrogen gas after mounting the CCD 112 and to remove foreign substances such as dust mixed in the cavity 106 by vacuum suction or air blow. The portion 1501 where the anisotropic conductive film is not formed is composed of the TAB tape 102 and the CCD 1
After bonding with the sealing resin 12, the sealing is performed with, for example, a sealing resin. In addition, the degassing portion 1501 for the same purpose is shown in FIG.
As shown in (b), a part of the insulating sheet 104 may be deleted.

Next, another embodiment of the present invention will be described. In this embodiment, a CCD 1702 having an electrode pad 1701 formed only along one side as shown in FIG. 17 is used as the CCD. When the electrode pad 1701 is formed only along one side, the lead of the copper lead 105 becomes 1
Direction, which facilitates mounting of peripheral parts, connection with camera cables and the like, and assembly process.

Next, another embodiment of the present invention will be described. In this embodiment, as shown in FIG.
The electrode pad of the copper lead 1801 and the electrode pad of the copper lead 1802 are routed to each other via the copper lead 1804 to achieve efficient circuit connection. This is a case where the wiring pattern has a single layer. As shown in FIG.
The TAB tape 1803 has a multi-layer structure, and each layer has a line 19.
01, and each line 1901 can be connected to the copper lead 1801 and the copper lead 1802 through the through hole 1902. The copper lead 1804 also performs the function of a dummy lead.

FIG. 20 is a sectional view of a CCD mounting apparatus according to another embodiment. When connecting the CCD 112 and the copper lead 105 with the anisotropic conductive film 111,
The dam frame 20 is placed on the insulating sheet 104 at the end of the copper lead 105 so that
19 is formed. The dam frame 2019 is, for example, a copper lead 1.
After forming 05, an insulating paste such as epoxy may be formed by a screen printing method. Alternatively, a resist solution can be applied and formed by a photoetching method. Further, the dam frame may be formed around the pixel area on the CCD 112. At this time, it is necessary to manage the height of the dam frame to be lower than the bump so as not to alienate the bump connection. In addition, when an elastic material such as a silicone material is used, stress can be reduced at the time of bump connection. Further, a material that is insoluble in the anisotropic conductive film 111 is desirable.

FIG. 21 is a view for explaining another manufacturing method according to the present invention. First, the optical glass 101 and the TAB tape 102 are bonded (Step 2101), and the TAB tape 102 is bent in advance (Step 210).
2). In parallel with this, gold ball bumps 2110 are formed on the electrode pads of the CCD 112. After that, the CCD 112
A support glass plate 2111 for positioning is attached to the back side of the substrate (step 2104).

Next, it is inserted into a camera housing (not shown),
By precisely press-fitting the optical glass 101 at the lower part on the TAB tape 102 side and the supporting glass plate 2111 on the CCD 112 side, the bump 113 and the TAB tape 102 are fitted.
Can be electrically connected (step 210).
5).

Pressing is performed by applying a contact pressure of 5 to the supporting glass plate 2111 attached to the back surface of the CCD 112 using silicon rubber or the like.
About 0 gf / bump enables a sufficient connection. FIG.
Although FIG. 2 is a plan view, this can be realized by using a portion 2112 where the two glass plates 101 and 2111 are on a straight line and on an arc other than the lead portion of the TAB lead as a positioning reference. This embodiment has the greatest advantage that a defective CCD can be completely replaced without damaging a member such as a TAB tape when a failure occurs during mounting of the CCD element.

In the above-described embodiment, CC is used as the photoelectric conversion element.
Although D is used, for example, a C-MOS type image sensor, an optical sensor, or the like may be used. In addition, optical pickups such as laser diodes and semiconductor lasers and LED elements,
The present invention is also applicable to connection between a circuit board and an optical lens or an element such as an optical glass or an optical sensor.

[0056]

As described above, according to the photoelectric conversion element mounting apparatus and the method of manufacturing the same of the present invention, a small-sized photoelectric conversion element module which can be mounted by a simple manufacturing process can be realized.

[Brief description of the drawings]

FIG. 1 is a front view of a CCD mounting device for explaining an embodiment of the present invention.

FIG. 2 is a perspective view of the TAB tape shown in FIG.

FIG. 3 is a plan view of the TAB tape shown in FIG. 1;

FIG. 4 is a front view of the CCD shown in FIG. 1;

FIG. 5 is a process chart of the CCD mounting apparatus according to one embodiment of the present invention.

FIG. 6 is an explanatory diagram for explaining adhesion between a TAB tape and optical glass.

FIG. 7 is an explanatory view of a step after FIG. 5;

FIG. 8 is an explanatory diagram for explaining the effect of the present invention.

FIG. 9 is a plan view of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 10 is a front view of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 11 is an explanatory diagram for explaining effects of the present invention.

FIG. 12 is a plan view of a TAB tape according to another embodiment of the present invention.

FIG. 13 is a front view of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 14 is a plan view of a TAB tape according to another embodiment of the present invention.

FIG. 15 is a plan view of a TAB tape according to another embodiment of the present invention.

FIG. 16 is a front view of a TAB tape according to another embodiment of the present invention.

FIG. 17 is a plan view of a CCD according to another embodiment of the present invention.

FIG. 18 is a plan view of a TAB tape according to another embodiment of the present invention.

FIG. 19 is a plan view of a TAB tape according to another embodiment of the present invention.

FIG. 20 is a plan view of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 21 is a process chart of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 22 is a front view of a CCD mounting apparatus according to another embodiment of the present invention.

FIG. 23 is a process chart showing a conventional COG method.

FIG. 24 is a process chart showing a conventional SP-TAB method.

FIG. 25 is a top view showing a bonded portion of an optical glass and an adhesive by a conventional SP-TAB method.

[Explanation of symbols]

101: Optical glass, 102, 1401: TAB tape, 103: Adhesive, 104: Insulating sheet, 105, 9
03, 1801, 1802, 1804: Copper lead, 10
6, 908, 1402: opening, 111: anisotropic conductive film, 112, 1701: CCD, 113: bump, 11
5 micro lens, 116 sealing resin, 117, 17
01 ... electrode pad, 901, 1803 ... TAB tape,
Reference numeral 902: electronic component, 904: insulating sheet, 905: removed part, 906: camera housing, 907, 1403: dummy lead, 1301: multilayer substrate, 1302: flexible tape, 1501: unformed part of anisotropic conductive film, 1601 , 1
606: substrate, 1602, 1603: adhesive, 160
4, 1605: copper foil, 1901: line, 1902: through hole, 2019: dam frame, 2110: gold ball bump, 2111: supporting glass plate.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazunari Oi 8 Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture Inside Toshiba Multimedia Technology Research Institute (72) Inventor Masanobu Kimura 8 Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Toshiba Corporation Multimedia Technology Research Institute (72) Inventor Shuichi Sugi 3-3-9, Shimbashi, Minato-ku, Tokyo Toshiba A-V E Corporation (56) References JP-A-2-278872 (JP, A) JP-A-5-6989 (JP, A) JP-A-1-95553 (JP, A) JP-A-4-207707 (JP, A) JP-A-7-183329 (JP, A) JP-A-2 -1003967 (JP, A) JP-A-6-188403 (JP, A) JP-A-1-57862 (JP, U) JP-A-1-121956 (JP, U) (58) Fields investigated (Int. . ^7, DB name) H01 L 21/60 H01L 23/02 H01L 23/12 H01L 27/14 H04N 5/335

Claims (13)

(57) [Claims] 1. A and the light-transmitting member, wherein the contact wear translucent member, insulating sheet and thereon
A wiring board that includes a plurality of formed leads and is bendable; and is disposed to face the translucent member, and is electrically connected to the wiring board using an insulating adhesive. A photoelectric conversion device, comprising: a photoelectric conversion element comprising: an insulating adhesive formed in a continuous ring surrounding a light receiving surface of the photoelectric conversion element. 2. The photoelectric conversion device according to claim 1, wherein the outside of the insulating adhesive surrounding the light receiving surface of the photoelectric conversion element is sealed with a resin. 3. The photoelectric conversion device according to claim 1, wherein one or both of the portions of the wiring substrate that are exposed to light with the insulating adhesive are blackened. 4. The communication device according to claim 1, wherein one or both of the insulating adhesive and the wiring board formed around the light receiving surface of the photoelectric conversion element are provided with a communication part in a part thereof. 3. The photoelectric conversion device according to claim 1. 5. The photoelectric conversion device according to claim 1, wherein an adhesive surface of the light transmitting member or the wiring substrate is roughened. 6. The photoelectric conversion device according to claim 5, wherein the bonding surface of the wiring substrate is roughened by etching a pattern to leave the bonding surface. 7. The photoelectric conversion device according to claim 1, wherein the translucent member is an optical glass and also serves as an optical low-pass filter. 8. A light-transmitting member, wherein the contact wear translucent member, insulating sheet and thereon
A multi- layer wiring board including a plurality of leads formed and bendable, and a photoelectric conversion element electrically connected to an arbitrary layer of the multi-layer wiring board using an insulating adhesive. The photoelectric conversion device, comprising: an insulating adhesive formed in a continuous ring surrounding a light receiving surface of the photoelectric conversion element. 9. The photoelectric conversion device according to claim 1, wherein the wiring substrate has an opening facing a light receiving surface of the photoelectric conversion element. 10. An insulating sheet having an opening communicating with opposing first and second main surfaces, and formed on the insulating sheet.
A plurality of leads and a bendable wiring board; a light-transmitting member adhered to the wiring board at the periphery of the opening on the first main surface side; and a light-transmitting member facing the light-transmitting member. Light receiving surface, and the second
And a photoelectric conversion element electrically connected to the wiring board by using an insulating adhesive at the periphery of the opening on the main surface side of the opening, and the insulating adhesive continuously surrounds the opening. A photoelectric conversion device characterized by being formed as described above. 11. An insulating sheet and a light-transmitting member ,
Includes multiple leads formed on it and can be folded
A first step of bonding the Do wiring substrate, a second step of forming an insulating adhesive to the connection pad of the electrode pad or the wiring substrate of the photoelectric conversion element, the wiring photoelectric conversion element of the first step And a third step of connecting to the substrate. 12. The walking insulating adhesive is communicating portion is provided in a part on the wiring substrate, and a pre-Symbol wiring board and the photoelectric conversion element using the insulating adhesive The method according to claim 11, further comprising: a fourth step of sealing the communication portion with a resin after the connection. 13. walk electrode pad of the photoelectric conversion element is absolutely
Including an edge sheet and a plurality of leads formed thereon.
A first step of forming seen, and the insulating adhesive to the connection pads of the wiring substrate foldably, a second step of connecting the photoelectric conversion element to the wiring substrate of the first step, translucent And a third step of bonding the conductive member and the wiring board.