JP2002244146A - Method for internal connection of flat panel display provided with opaque substrate, and device formed by the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for internal connection of a flat panel display having an opaque substrate, and to provide a device formed by the method. SOLUTION: A flat display panel consisting of a glass plate, a silicon substrate and a liquid crystal material 90 supplied to the space between the substrates is disposed on a printed board 98, having a plurality of conducive pads in the edge part, and a conductive adhesive is applied between a plurality of transparent conductive traces 94 and a plurality of metal leads 86 and the plurality of conductive pads. The flat display is optically aligned from the lower side of the panel through the glass plate. The printed board is pressed to the protruding part of the glass plate, so that the plurality of conductive pads on the printed board are electrically connected to the metal leads on the edge of the silicon substrate 82, through the transparent conductive traces 94 on the glass plate and through the conductive adhesive applied between them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an internal connection method for a flat panel display having an opaque substrate and an apparatus formed thereby, and more particularly to an internal connection for an LCD panel having an opaque substrate to a printed circuit board. Method and
It relates to an apparatus formed by the method.

[0002]

2. Description of the Related Art In recent years, LCDs (Liquid crys) have been developed.
tal display panels have become widely used instead of CRTs in electrical display equipment. LCD
The panel is first assembled by filling a liquid crystal material between the LCD substrate and the transparent glass cover plate. The LCD substrate includes various devices for performing switching or electrical on / off, thereby controlling various pixels formed on the LCD panel.

[0003] After the assembly of the LCD panel is completed, the panel is connected to an external circuit to receive an electric signal, whereby an image is formed in the panel. The electrical connection to the LCD panel can be provided by different technologies. One of the traditional techniques for providing an electric signal to an LCD panel is a flexible printed circuit board (F) to which various electric parts are welded.
This is a technology that uses PCB). FPCB is produced by sandwiching a conductive copper layer between two flexible polyimide cover layers. The flexibility of the FPCB is effective for installing LCD panels. FIG. 1 shows a state in which an LCD panel 10 of a traditional design is connected to a printed board 14 by an FPCB 12, and a surface mount (SMT) type IC chip 16 is mounted on the upper surface of the printed board 14.

[0004] Another traditional technique for coupling an LCD to a PCB is shown in FIG.
AB (tape automated bondin)
g) technology is used. In the TAB bonding technique, a TAB section 20 is used to connect the LCD panel 10 and the printed circuit board 14. TAB
Section 20 comprises a TAB tape 22,
The tape 22 has an IC chip 16 penetrating the bonding position and connected thereto. The TAB connection technology has the advantage of a compact package, which improves the circuit density and reduces the lead pitch to 60 μm.
TAB also uses TCP (tape carrier pa)
Known as cage), a finely patterned, thin metal, such as silver or tin plated with copper foil, is used in place of the wire to connect the metal chip to the corresponding gold-plated bump, which bump is formed on the chip. It is formed on an aluminum pad. TAB is compatible with small pitch internal wiring of high input / output ULSI devices, and TAB enables smaller pits and longer span bonding than wire bonding. However, TAB bonding techniques have the disadvantage that they are usually too costly to manufacture.

[0005] Yet another technique for connecting an LCD panel to a printed circuit board is shown in FIG.
(Hip on glass) technology is used. COG
In the technology, the IC chip 16 is directly connected to the LCD panel 10 with the solder bumps 24 and the anisotropic conductive film (anisot).
(a conductive conductive film) 26. Detailed cross-sectional views of the anisotropic conductive film 26 are as shown in FIGS. FIG.
In FIG. 7, the TAB tape 22 having the conductive pad 28 formed thereon is disposed above the anisotropic conductive film 30 including the electrically conductive member 32 embedded in the insulating composition 34. Below the anisotropic conductive film 30 is the LCD substrate 10 on which the conductive elements 36 are formed. TAB tape 22, anisotropic conductive film 30,
Then, the LCD substrate 10 is heated and pressurized (see FIG. 5), and the electrically conductive member 32 is
, Whereby the TAB tape 22 is in electrical communication with the LCD substrate 10. Notably, the conductive element 26 is selectively formed only where the electrically conductive member 32 is compressed. The conductive element 36 on the LCD substrate 10 is usually formed of an ITO thin film.

[0006] As shown in FIG. 3, the COG technique further connects the LCD substrate 10 to a printed circuit board (not shown) with a flexible printed circuit board (not shown). COG
The technology therefore relies on solder bumps 24 and anisotropic conductive films formed on the IC chip for electrical communication.

[0007] Each of the three traditional techniques for forming TFT-LCD assemblies has advantages and disadvantages. For example, the first technology using SMT / FPCB can increase the circuit density and achieve a compact package without the expense of using difficult TAB technology and high material cost. In the TAB and COG methods, rework of the assembly, such as removing defective ICs from the LCD substrate, is impossible or very difficult. For example, the only way to remove an IC chip bonded to an LCD substrate is to forcefully press the IC chip to break its connection with the LCD substrate. This was a difficult process and often resulted in the destruction of the entire assembly.

[0008] The current process of forming a TFT-LCD assembly is often used in the manufacture of low cost structures such as the SMT / FPCB method and small LCD panels. For example, in application to a large LCD panel such as a notebook personal computer, a TAB bonding method is usually used.
The COG method is also limited to small LCD panel applications due to its difficult recovery and repair. Thus, the TAB process and the COG process are the same as the TFT-LCD.
There are two main methods of assembling the assembly. Overall,
The TAB method makes it easy to recover and repair the IC chip by removing the IC chip from the TAB tape, and furthermore, because of its compact size, enables a high-density package with a pitch of up to 60 μm. However, the TAB process requires complicated manufacturing steps, namely, IC bonding, tape formation, inner lead bonding, encapsulation (en
capsulation), outer lead bonding, and anisotropic conductive film processes. Another disadvantage of the TAB process is that during the anisotropic conductive film process,
It has a thermal expansion problem, which causes a mismatch between the leads. TAB tape also absorbs humidity to form dimensional instability. Also, elaborate equipment is required for the TAB process, which has increased its manufacturing costs.

In the COG process, the necessary manufacturing steps are simplified, that is, only the IC bumping and the anisotropic conductive film process are required, and further, there is no thermal expansion problem and a small pitch such as 50 μm can be achieved. But,
Nevertheless, the compact size LCD package is difficult. This difficulty is illustrated in FIGS.
FIG. 6 is a cross-sectional view of the LCD package 40, which shows an LCD substrate 10, shown as a lower glass panel, an upper glass panel 42, an IC chip (or driver chip) 1.
6, including an anisotropic conductive film layer 26 and a printed circuit board (or FPCB) 14. The driver chip 16 has a plurality of solder bumps 44 formed on an active surface thereof, and the solder bumps 44 are connected to the second plurality of conductive leads 26 such as ITO leads formed on the upper surface 48 of the lower glass panel 10. To form an electrical connection. Electrical communication is formed by the use of the anisotropic conductive film layer 26, and the anisotropic conductive film layer 26 is formed together with the electrically conductive member 50. A third plurality of conductive pads 52 are disposed between the printed circuit board 14 and the lower glass panel 10 for communication with an external circuit, for example, a circuit on the printed circuit board 14. A plan view of the LCD package 40 is shown in FIG.

As shown in FIGS. 6 and 7, the lower glass panel 10 of the LCD package 40 is typically provided in an area wider than the upper glass panel 42, thereby leaving an exposed edge area 60. Are required for fixing the driver chip 16 and the printed board 14. This extra edge portion (ie, exposed edge area 60)
Therefore, it could not be ruled out, which made the LCD package bulky and therefore not suitable for special applications requiring a compact LCD package. Therefore, this technique of connecting a driver chip and external PCB circuitry to an LCD package needed to be improved to produce a more compact LCD panel.

More recently, flat panel display packages have been developed in which one of the glass panels has been replaced by an opaque panel, such as a silicon substrate. The formed display module is LCOS
(Liquid crystal on silico
n) Known as modules. In a typical LCOS module, the internal connection between the liquid crystal and the printed circuit board is made by wire bonding or an anisotropic conductive film disposed on silicon. Typical LCOS
Module 70 is shown in FIG. The LCOS module 70 is composed of a glass substrate 54, a silicon substrate 56, and a liquid crystal material 58 filled between them. A spacer 62 keeps a constant distance between the two substrates. Adhesive beads 64 are provided along the periphery of glass substrate 54 to seal and hold liquid crystal material 58. LCD
When the panel 66 is used for internal connection to a substrate such as a printed circuit board 68, the silicon substrate 56
8 is adhered. The IC chip 72 is fixed on the upper surface of the printed board 68 and provides a driver circuit for the LCD panel 66. An electrical internal connection is thus formed by the bonding wires 74 between the LCD panel 66 and the printed circuit board 68. Bonding pad 76 and metal trace 7
8 is further provided to complete such an internal connection.

In the LCOS module 70 shown in FIG. 8, a wire bonding technique is used to enable the production of an LCD module by a reliable automated process. However, the throughput of this process is low due to the time required for wire bonding. Other processing and design issues include those that cannot be aligned with existing alignment equipment designed to align modules with transparent baseplates, as well as heat dissipation due to the inability to attach a heat sink directly to the silicon substrate. There is a problem that is low. These processing and design limitations have severely limited the application of LCOS modules.

[0013]

SUMMARY OF THE INVENTION The main object of the present invention is to provide an internal connection method for a flat panel display having an opaque substrate, which method has no disadvantages and problems in the conventional internal connection method. It is in.

It is another object of the present invention to provide a method for interconnecting a flat display panel with an opaque substrate without using a wire bonding technique.

It is yet another object of the present invention to provide a method for interconnecting a flat display panel with an opaque substrate by using a glass panel larger than the opaque panel in forming a liquid crystal panel.

It is another object of the present invention to provide a method for interconnecting a flat display panel having an opaque substrate by utilizing an anisotropic conductive film in the internal connection of a liquid crystal panel to a printed circuit board.

Another object of the present invention is to provide an anisotropic conductive element between a substrate and a liquid crystal panel.
FPCB (flexi) of a flat display panel having an opaque substrate using a passive adhesive
ble printed circuit boar
d) to provide a method of internal connection.

Another object of the present invention is to provide a flat display module formed by a flat panel electrically connected to a printed circuit board without wire bonding.

Still another object of the present invention is to form a flat panel electrically connected to a printed circuit board by utilizing an anisotropic conductive film or anisotropic conductive bonding between the flat panel display and the printed circuit board. An object of the present invention is to provide a flat panel display module.

It is another object of the present invention to provide a flat panel display module formed by a flat panel electrically connected to a printed circuit board processed by a known bonder or alignment equipment.

[0021]

According to a first aspect of the present invention, there is provided a method for interconnecting a flat panel display having an opaque substrate, the method comprising a glass plate, the length of which is longer than that of a silicon substrate; Providing a flat display panel comprising the glass plate, a silicon substrate, and a liquid crystal material filled therebetween, wherein at least one side of the silicon substrate protrudes in the horizontal direction; A plurality of TFTs on the edge portions not covered by
Forming a plurality of metal leads in electrical communication with the substrate, forming a plurality of transparent conductive traces on the protruding portion of the glass plate, and providing a printed circuit board having a plurality of conductive pads formed on an edge portion. Placing the flat display panel on the printed circuit board with the glass plate facing down, the silicon substrate facing up, the plurality of transparent conductive traces and the plurality of metal leads, the plurality of conductive Disposing a conductive adhesive between the pads; and optically aligning the flat display panel through a glass plate from below the panel;
The printed circuit board is pressed against the projecting portion of the glass plate to electrically connect the plurality of conductive pads on the printed circuit board to metal leads on an edge portion of the silicon substrate, Electrically connecting the transparent conductive traces and a conductive adhesive disposed therebetween to form a flat panel display having an opaque substrate. The invention of claim 2 includes a step of curing the conductive adhesive by projecting ultraviolet light from the glass plate side, wherein the inside of the flat panel display having an opaque substrate according to claim 1 is provided. The connection method is used. The invention according to claim 3 includes a step of selecting the conductive adhesive from the group consisting of a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, a metal bump, and a solder ball. Claim 1
The internal connection method of a flat panel display provided with an opaque substrate described in (1). The invention according to claim 4 is based on the IT
The method for interconnecting a flat panel display with an opaque substrate according to claim 1, comprising providing a plurality of transparent conductive traces composed of O. According to a fifth aspect of the present invention, there is provided a method of connecting a flat panel display having an opaque substrate according to the first aspect, including the step of providing a printed board which is a flexible printed board. According to a sixth aspect of the present invention, there is provided the method for interconnecting a flat panel display with an opaque substrate according to the first aspect, further comprising the step of optically aligning the flat display panel with a printed circuit board using a CCD. . The invention of claim 7 includes providing a silicon wafer having a plurality of TFTs formed on a plurality of dies, and coating and buffing an alignment layer of a polyimide material on the top surface of the silicon wafer. Arranging a plurality of spacers having a predetermined thickness on the wafer; separating a plurality of dies from the wafer to perform a reliability test; and Arranging a frame seal along one perimeter, forming a plurality of metal leads on an edge portion of the die to electrically connect to a plurality of TFTs, and including an area larger than the die. Disposing a glass plate and consequently forming a projecting portion of the die; and applying a plurality of transparent conductive traces to the projecting portion of the die. Placing a printed circuit board having a plurality of conductive pads formed on an edge portion, and turning the die and the glass plate upside down with a frame seal therebetween, with the glass plate facing down. Placing the die upward on the printed circuit board; placing a conductive material between the plurality of transparent conductive traces and the plurality of metal leads and the plurality of conductive pads; and Aligning a die and a glass plate with the printed circuit board; pressing the printed circuit board against a protruding portion of the glass plate to form a plurality of conductive pads on the printed circuit board and a plurality of metal leads on the die; Electrically conducting through a plurality of transparent conductive traces on the glass plate and a conductive material disposed therebetween. A step of connecting to, characterized in that it comprises the steps of: seal frame seal filled with a liquid crystal material between the glass plate and the die, and the method of coupling to form printed board flat display panel. The invention according to claim 8 further comprises a step of annealing the conductive material with ultraviolet light projected from the glass plate side, wherein the flat display panel according to claim 7 is formed and bonded to a printed circuit board. And how to do it. According to a ninth aspect of the present invention, there is provided a method of forming a flat display panel according to the seventh aspect of the present invention, comprising the step of providing the printed board in the form of a flexible board. The invention according to claim 10 includes a step of aligning the glass plate with the die and the printed board by using a CCD.
And forming a flat display panel and bonding it to a printed circuit board. The invention of claim 11 is
The flat display panel according to claim 7, further comprising a step of pressing the printed circuit board between the upper platen and the glass plate toward the projecting portion of the glass plate. And how to do it. According to a twelfth aspect of the present invention, there is provided a method of forming a flat display panel according to the seventh aspect of the present invention, comprising attaching a heat sink to the die to enhance a heat dissipation function. 13. The method of claim 7, further comprising the step of providing the frame seal with an ultraviolet light curable polymeric material. And The invention according to claim 14 includes the step of selecting the conductive material from the group consisting of a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, a metal bump, and a solder ball. A method of forming a flat display panel according to claim 7 and bonding it to a printed circuit board. The invention according to claim 15 is a flat panel display module formed by electrically connecting a flat panel to a printed circuit board, wherein the flat panel display module is composed of a glass plate, a silicon substrate, and a liquid crystal material filled therebetween. A flat panel, wherein the glass plate has a length greater than the length of the silicon substrate, so that at least one side of the glass plate protrudes in the horizontal direction, and the edge portion of the silicon substrate which is not covered with the liquid crystal material. A plurality of metal leads, a plurality of transparent conductive traces on a protruding portion of the glass plate, and a plurality of conductive pads on an edge portion are formed on and electrically connected to the plurality of TFTs. A printed circuit board,
Wherein the flat panel has the glass plate facing down with respect to the printed circuit board, the silicon substrate facing up, and a conductive material and a plurality of transparent conductive traces and a plurality of metal leads arranged in the middle, the plurality of metal leads; And a plurality of conductive pads on the printed circuit board, wherein the plurality of conductive pads on the printed circuit board are connected to a plurality of metal leads on an edge portion of the silicon substrate, a plurality of transparent conductive traces on the glass plate, and A flat panel display module formed by electrically connecting a flat panel to a printed circuit board, wherein the flat panel display module is electrically connected through the conductive material. According to a sixteenth aspect of the present invention, there is provided a flat panel display module formed by electrically connecting the flat panel to a printed circuit board according to the fifteenth aspect, wherein the transparent conductive trace is made of ITO. I have. The conductive material for connecting the flat panel to the printed circuit board may include a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, a metal bump, and a solder ball. A flat panel display module formed by electrically connecting the flat panel according to claim 15 to a printed circuit board is further selected. The invention according to claim 18 is characterized in that the printed board is a flexible printed board.
A flat panel display module formed by electrically connecting the flat panel according to claim 15 to a printed circuit board is provided. A flat panel display module formed by electrically connecting a flat panel to a printed circuit board according to claim 15, wherein the conductive material is an ultraviolet light curable material. And The invention according to claim 20 is characterized in that a heat sink for enhancing heat radiation is attached to the silicon substrate.
5 is a flat panel display module formed by electrically connecting the flat panel to a printed circuit board.

[0022]

DETAILED DESCRIPTION OF THE INVENTION The present invention describes a method for interconnecting a flat panel display with an opaque substrate to a printed circuit board and a flat panel display module formed by the method.

In a preferred embodiment, the method for interconnecting a flat display panel with an opaque substrate is implemented by the following operation steps. First, a flat display panel is provided. This flat display panel is composed of a glass panel, a silicon substrate, and a liquid crystal material filled therebetween. The glass panel is longer than the length of the silicon substrate, so that at least one side of the glass panel is exposed in the horizontal direction.
Next, a plurality of metal leads are provided on an edge portion of the silicon substrate that is not covered with a liquid crystal material that is in electrical communication with the plurality of TFTs. Additionally, a plurality of transparent conductive traces are provided on exposed portions of the glass panel. And
Provided is a printed circuit board having a plurality of conductive pads formed on an edge portion of the board. Subsequently, the flat display panel is arranged with the glass panel facing downward and the printed circuit board facing upward. A conductive adhesive is disposed between the plurality of transparent conductive traces, the plurality of metal leads, and the plurality of conductive pads. The flat display panel is optically aligned with the printed circuit board through the glass panel from below the panel. Then, the printed circuit board is pressed against the exposed portion of the glass panel, and a plurality of conductive pads on the printed circuit board are arranged on metal leads on the edge portion of the silicon substrate, and the transparent conductive traces on the glass panel and between them. Electrically connected via the conductive adhesive.

The internal connection method of the flat display panel having the opaque substrate further includes a step of curing the conductive adhesive by projecting ultraviolet light from the glass panel side, or a silver paste, a conductive elastomer, an anisotropic conductive film,
Selecting a conductive adhesive from the group consisting of anisotropic conductive adhesive, metal bumps and solder balls. The method may further comprise providing a plurality of transparent conductive traces formed of ITO, or providing a printed circuit board, which may be an FPCB, or optically connecting a flat panel display to the printed circuit board by a charge coupled device (CCD). To match.

The present invention further provides a method of forming a flat panel display and bonding to a printed circuit board. It is performed by the following steps. First, a silicon substrate having TFTs formed on a plurality of dies is provided. The alignment layer of polymeric material on the silicon substrate is then coated and buffed. A plurality of spacers having a set thickness are provided on the wafer. Separate multiple dies from wafer and test for reliability. A frame seal is placed around one of the dies. A plurality of metal leads on the edge of the die are formed to be electrically connected to the plurality of TFTs. A glass plate having an area larger than the die is placed and exposed from the die. A plurality of transparent conductive traces are formed on exposed portions above the die. A printed circuit board having a plurality of conductive pads formed on an edge portion of the board is provided. The glass plate is turned upside down with the die with the frame seal in between so that the glass plate is facing down, and the die is facing up and placed on the printed circuit board. Arrange a plurality of transparent conductive traces, a plurality of metal leads, a plurality of conductive pads, and a conductive material. The glass plate is aligned with the die and the printed circuit board from below the glass panel. The printed circuit board is pressed against the exposed part of the glass plate, and the conductive pads on the printed circuit board are electrically connected to the metal leads on the die via the transparent conductive traces on the glass plate and the conductive material. Connect electrically. Then, a liquid crystal material is filled between the glass plate and the die between the dies and accommodated by a frame seal.

The method of forming a flat display panel and bonding to a printed circuit board according to the present invention further includes the step of annealing the conductive material by ultraviolet light projection. The ultraviolet light is projected from the glass plate side. Alternatively, the method includes providing a printed circuit board in the form of an FPCB, or aligning a glass plate with the die and the printed circuit board using a CCD. The method of the present invention may further comprise the step of compressing the printed circuit board between the top plate and the glass plate toward the exposed portion of the glass plate, or attaching a heat sink to the die to enhance heat dissipation, Providing a frame seal of polymeric material. The method further includes selecting a conductive adhesive from the group consisting of a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, a metal bump, and a solder ball.

The present invention further provides a flat panel display module (FPD module). The F
The PD module is formed by electrically connecting a flat panel to a printed circuit board, which includes a glass plate, a silicon substrate, and a liquid crystal material filled therebetween. The glass plate has a length greater than the length of the silicon substrate, so that at least one side of the glass plate is exposed in the horizontal direction. The metal leads on the edge of the silicon substrate are not covered with a liquid crystal material that is in electrical communication with the TFTs. There are a plurality of transparent conductive traces on exposed portions of the glass plate, and the printed circuit board has a plurality of conductive pads formed on edge portions of the substrate. The flat panel is bonded to the printed circuit board with the glass plate facing down and the silicon substrate facing up.
This is achieved by a conductive material, a plurality of transparent conductive traces, a plurality of metal leads, and a plurality of conductive pads disposed therebetween. The plurality of conductive pads on the printed circuit board
The plurality of metal leads on the edge portion of the silicon substrate are electrically connected to the plurality of transparent conductive traces on the glass plate through a conductive material.

In a flat panel display module formed by electrically connecting a flat panel to a printed circuit board, a plurality of transparent conductive traces are
It is formed of TO. The conductive material is used to bond a flat panel to a printed circuit board and is selected from the group consisting of a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, metal bumps, and solder balls. The printed circuit board may be an FPC. The conductive material can be a UV-curable material. The flat panel display module further includes a heat sink fixed to the silicon substrate to enhance heat dissipation.

[0029]

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for interconnecting a flat panel display to a printed circuit board. The display panel includes an opaque substrate and a flat panel display module formed by the method.

The novel method of the present invention allows for the use of existing bonder equipment and CCD type alignment equipment because glass substrates are used in LCoS modules. The novel configuration of the present invention further allows the adhesive used to connect the liquid crystal panel to the printed circuit board to be cured by ultraviolet light projected through the transparent glass substrate. A further advantage of the novel arrangement of the present invention is that the heat sink can be directly attached to a silicon substrate that is completely exposed and not covered by the substrate.

In the novel structure of the present invention, the plurality of signal lines or metal leads on the silicon substrate are formed by using a conductive material such as silver paste, conductive elastomer, anisotropic conductive film, or anisotropic conductive adhesive. And is extended to the signal line on the glass substrate. The conductive material allows the connection between the glass plate and the printed circuit board or FPCB to form a flat panel display module. In applying a conductive material to a silicon substrate, distributing means for silver paste or anisotropic conductive adhesive, bonding means for conductive elastomer, mechanical means for anisotropic conductive film, bumping means for metal bumps, soldering Stencil printing means is used for the ball. These processes are performed before the sealing or frame seal is provided on the glass substrate. Various conductive materials are provided on the transparent conductive traces, for example, ITO electrodes are provided on a glass plate. Existing alignment equipment, eg CCD
The apparatus is used to ensure alignment between the glass plate and the silicon substrate through the transparent glass plate, and a flat panel display is simultaneously formed during the printed circuit board bonding process.

The present invention includes a number of processing advantages, such as the ability to bond a printed circuit board or FPC to a glass plate using one of the well-established techniques of anisotropic conductive films. The method of the present invention utilizes existing equipment, for example, alignment equipment such as a CCD through a glass plate. Thus, there is no need to use new expensive equipment for alignment through the opaque substrate. The method of the present invention can be applied to, for example, a GaAs substrate, a ceramic substrate, a printed circuit board, a plastic board, or another opaque flexible film in addition to a silicon substrate. Furthermore, the novel structure of the present invention completely exposes the back side of the silicon substrate so that a heat sink can be easily attached thereto.

FIG. 9 is a block diagram 80 of the method of the present invention. In the present invention, a plurality of dies are formed on a wafer, and a plurality of TFTs are formed on each of the dies. The wafer is provided and cleaned. An alignment layer coat, such as a polyimide material, is coated on top of the wafer, baked and cured, and then buffed to achieve the desired alignment within the layer. The alignment layer causes the liquid crystal material disposed next to follow the alignment of the alignment layer. Then several spacers,
Individual dies are attached before they are separated from the wafer. After the dies are separated, they are tested for reliability and quality control purposes. After the die has passed such a functional test, a seal or frame seal is placed around the periphery of the die, and the top glass plate is assembled to the silicon substrate by pressing the glass plate over the frame seal. Similarly, a conductive material is provided between the glass plate and the printed circuit board for connection between the two and thereby forming the module. The liquid crystal material is then filled into the cavity formed between the glass plate and the silicon substrate, and then the inlet is sealed to enclose the liquid crystal material. Finally, the module is encapsulated and stored for use in electrical equipment assembly.

FIG. 10 is a plan view of a silicon substrate 82 used in the novel structure of the present invention. The upper surface of the silicon substrate 82 is an array area for TFTs,
T is used to drive a liquid crystal panel formed on the top. On one side of the silicon substrate 82, a plurality of metal leads 86 are provided, which provide electrical communication with a plurality of TFTs (not shown) formed on the silicon substrate.

FIG. 11 is a similar view of a glass substrate 88 which has a longer length than the silicon substrate 82. 90, which is indicated by reference numeral 90 on the upper surface of the glass plate,
The liquid crystal panel is formed in a frame seal 92 having a size similar to that of the array area 84 of No. 0 and arranged on the periphery of the LCD view area (position 90). At one end of the glass substrate 88, a plurality of transparent conductive traces 94 formed of ITO, ie, transparent ITO electrodes, are disposed so that the transparency of the glass substrate 88 can be transmitted to the module in a CCD alignment procedure such that light is directed upward from the glass substrate 88 to the module. Not be disturbed when it is done. This is shown in FIG.

As shown in FIG. 12, the flat panel display module 100 of the present invention is a silicon substrate 82, a glass substrate 88, and a space between both of them, and a frame seal 92, that is, the two substrates are integrally connected. It is formed by a liquid crystal material 90 held by a seal adhesive. A plurality of metal leads 86 are formed on the upper surface of the silicon substrate. This is as also shown in FIG. A plurality of transparent conductive traces 94 or ITO traces are arranged on the upper surface of the glass substrate 88. The transparent conductive traces 94 do not impair the transparency of the glass substrate 88, and allow for optical alignment from the glass substrate side during the combination using traditional alignment equipment of a CCD.

Flat panel display module 1
A further advantage achieved by the novel structure of the present invention is that the conductive material 96 used to connect the printed circuit board 98, the glass substrate 88 and the silicon substrate 82 together.
Can be cured by optical means, for example, ultraviolet light. The conductive material 96 is appropriately selected from the group consisting of silver paste, conductive elastomer, anisotropic conductive film, anisotropic conductive adhesive, metal bumps, and solder balls. Between the glass substrate 88 and the silicon substrate 82, suitable conductive materials are selected from silver paste, conductive elastomer, anisotropic conductive film, and anisotropic conductive adhesive. Metal bumps and solder balls are more suitable for use between printed circuit board 98 and glass substrate 88.

FIG. 13 shows the flat panel display module 100 after the upper mold platen 102 has been removed following the press-fit connection process. As shown in FIG. 13, a heat sink 106 is connected to the lower surface 108 of the silicon substrate 82 to enhance the heat dissipation function. It should be particularly noted that the attachment of such a heat sink 106 is made possible only by the novel structure of the present invention, and it can be seen from the comparison with the traditional structure shown in FIG. 108 is completely exposed. The novel structure of the present invention is therefore a metal lead 8 on a silicon substrate 82.
6 can be electrically connected to a printed circuit board 98 through conductive materials 96 and 104 and a plurality of transparent electrodes 94 formed on a glass substrate 88. According to the method of the present invention, the flat panel display module 100
During the alignment process using the CCD device under the glass substrate 88 as shown in FIG. it can.

The present invention therefore provides a method for subsequently forming a frame seal for a flat panel display and connecting it to a printed circuit board by a single pressure assembly process in the same bonder device. On the other hand, alignment of various components is performed by optical means, for example, CC from the outside of the glass substrate.
D is advantageously achieved.

The method for internally connecting a flat display panel having an opaque substrate to a printed circuit board and the flat panel display module formed by the method according to the present invention can be implemented by referring to FIGS. .

The above description of the invention does not limit the scope of the invention, and any modification or alteration of details that can be made based on the invention falls within the scope of the invention.

[0042]

According to the present invention, there is provided an internal connection method for a flat panel display having an opaque substrate, which has no disadvantages or problems in the conventional internal connection method.

The present invention also provides a method for interconnecting a flat display panel with an opaque substrate without using wire bonding techniques.

The present invention further provides a method for interconnecting a flat display panel with an opaque substrate by using a glass panel larger than the opaque panel in forming a liquid crystal panel.

The present invention further provides a method of interconnecting a flat display panel with an opaque substrate by utilizing an anisotropic conductive film in the internal connection of a liquid crystal panel to a printed circuit board.

Also, according to the present invention, anisotropic conduction between the substrate and the liquid crystal panel.
e) FPCB (flexible prism) of a flat display panel having an opaque substrate using an adhesive.
It provides a method of internal connection to an integrated circuit board).

The present invention also provides a flat display module formed by a flat panel electrically connected to a printed circuit board without wire bonding.

The present invention also provides a flat panel display module in which a flat panel is electrically connected to a printed circuit board by utilizing an anisotropic conductive film or anisotropic conductive bonding between the flat panel display and the printed circuit board. Is provided.

The present invention also provides a flat panel display module formed by a flat panel electrically connected to a printed circuit board processed by a known bonder or alignment equipment.

[Brief description of the drawings]

FIG. 1 is a structural diagram showing an integrated circuit mounted on a printed circuit board and connection to an LCD panel by an FPCB according to a known technique.

FIG. 2 is a view showing a connection structure of an LCD panel to a printed circuit board using a TAB tape according to a known technique.

FIG. 3 shows a conventional technology using COG technology.
It is a connection structure display figure of the C chip to the LCD substrate.

FIG. 4 is a view showing a bonding of an TAB tape to an LCD substrate using an anisotropic conductive film in a known technique.

FIG. 5 is a structural display diagram after the components of FIG. 4 are heated and pressed to achieve electrical connection between the TAB tape and the LCD substrate.

FIG. 6 is a cross-sectional view showing a bonding structure for connecting a printed circuit board and a driver chip to an LCD panel in a known technique.

FIG. 7 is a plan view of the LCD panel combined according to FIG. 6;

FIG. 8 shows a known LCOS (liquid crystal);
FIG. 3 is an enlarged cross-sectional view of a (on silicon) module.

FIG. 9 is a block diagram illustrating the process flow of the method of the present invention.

FIG. 10 is an enlarged plan view of a silicon substrate having a plurality of metal leads formed on an upper surface according to the present invention.

FIG. 11 is an enlarged plan view of a glass substrate having a plurality of transparent conductive traces on a top surface according to the present invention.

FIG. 12 is an enlarged sectional view showing a bonding process of a liquid crystal panel to a printed circuit board without using wire bonding according to the present invention.

FIG. 13 is an enlarged sectional view showing a liquid crystal panel connected to a printed circuit board and a heat sink according to the present invention.

[Explanation of symbols]

 82 Silicon substrate 86 Metal lead 88 Glass substrate 84 Array area 92 Frame seal 94 Transparent conductive trace 100 Flat panel display module 90 Liquid crystal material 98 Printed circuit board 96 Conductive material 102 Upper mold platen 106 Heat sink

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/14 H05K 1/14 C F term (Reference) 2H090 JB04 LA01 LA02 LA03 LA04 2H092 GA46 GA48 GA50 GA53 GA55 HA04 MA22 NA25 NA27 NA29 PA02 PA03 PA04 PA06 5E344 AA02 AA22 AA26 BB02 BB03 BB04 BB11 BB12 BB13 CC11 CC13 CC25 CD02 CD04 DD06 EE02 EE11 EE21 5G435 AA17 BB12 CC09 EE42 KK02 KK03 KK05 KK09 KK10

Claims (20)

[Claims] 1. A method for interconnecting a flat panel display with an opaque substrate, the method comprising: forming a glass plate, wherein the length is longer than a silicon substrate, and at least one side of the glass plate protrudes in a horizontal direction. Providing a flat display panel composed of a glass plate, a silicon substrate, and a liquid crystal material filled therebetween; and over an edge portion of the silicon substrate not covered by the liquid crystal material, Forming a plurality of metal leads in electrical communication with the plurality of TFTs; forming a plurality of transparent conductive traces on the protruding portion of the glass plate; and a print having a plurality of conductive pads formed on an edge portion. Providing a substrate, with the glass plate facing down and the silicon Disposing the flat display panel on the printed circuit board with the board facing upward; disposing a conductive adhesive between the plurality of transparent conductive traces, the plurality of metal leads, and the plurality of conductive pads; Optically aligning the flat display panel through the glass plate from below the panel; and pressing the printed circuit board against a protruding portion of the glass plate to form the flat display panel on the printed circuit board. Electrically connecting a plurality of conductive pads to metal leads on edge portions of the silicon substrate by transparent conductive traces on the glass plate and a conductive adhesive disposed therebetween; A method for interconnecting a flat panel display with an opaque substrate, comprising: 2. The method according to claim 1, further comprising the step of projecting ultraviolet light from the glass plate side to cure the conductive adhesive. . 3. The method according to claim 1, wherein the conductive adhesive is a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive,
2. The method of claim 1, further comprising the step of selecting from a group consisting of metal bumps and solder balls. 4. The method for interconnecting a flat panel display with an opaque substrate according to claim 1, comprising providing a plurality of transparent conductive traces made of ITO. 5. The method according to claim 1, further comprising providing a printed circuit board to be a flexible printed circuit board.
An internal connection method for a flat panel display comprising the opaque substrate according to claim 1. 6. The method of claim 1, further comprising the step of optically aligning the flat display panel with the printed circuit board using a CCD. 7. A plurality of TFs formed on a plurality of dies.
Providing a silicon wafer with T; coating and buffing an alignment layer of a polyimide material on the top surface of the silicon wafer to achieve proper alignment of the alignment layer; and providing a predetermined thickness on the wafer. Providing a plurality of spacers comprising: separating a plurality of dies from the wafer and performing a reliability test; arranging a frame seal around one of the plurality of dies; a plurality of metal leads Forming on the edge portion of the die and electrically connecting to the plurality of TFTs; and disposing a glass plate having an area larger than the die to form a protruding portion of the die. Disposing a plurality of transparent conductive traces on the protruding portion of the die; Providing a printed circuit board on which the die is formed and placing the die and the glass plate together with a frame seal therebetween with the glass plate facing down and the die facing up on the printed circuit board with the frame seal therebetween. Disposing a conductive material between the plurality of transparent conductive traces and the plurality of metal leads, and the plurality of conductive pads; aligning a glass plate to the die and the printed circuit board from below a glass plate; Squeezing the printed circuit board against a protruding portion of the glass plate to expose a plurality of conductive pads on the printed circuit board to a plurality of metal leads on the die and a plurality of transparent conductive traces on the glass plate. And electrically connecting via a conductive material disposed therebetween, the glass plate and the die. Method characterized by comprising the steps of: seal frame seal filled with liquid crystal material, which bind to form printed board flat display panel during. 8. The method according to claim 7, further comprising annealing the conductive material with ultraviolet light projected from the glass plate side. . 9. The method as claimed in claim 7, further comprising providing the printed circuit board in the form of a flexible board. 10. The method of claim 7, further comprising the step of aligning the glass plate with the die and a printed circuit board by a CCD. 11. The flat display panel according to claim 7, further comprising a step of pressing the printed circuit board between the upper platen and the glass plate toward the projecting portion of the glass plate. And bonding to the printed circuit board. 12. The method of claim 1, further comprising: attaching a heat sink to the die to enhance a heat dissipation function.
A method for forming and bonding a flat display panel according to claim 7 to a printed circuit board. 13. The method according to claim 7, further comprising providing the frame seal with an ultraviolet light curable polymeric material. 14. The conductive material, a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive,
The method of claim 7, further comprising selecting from a group consisting of metal bumps and solder balls. 15. A flat panel display module formed by electrically connecting a flat panel to a printed circuit board, comprising: a glass plate, a silicon substrate, and a liquid crystal material filled therebetween. A flat panel having a length greater than the length of the silicon substrate, so that at least one side of the glass plate protrudes in the horizontal direction; and a flat panel on the edge of the silicon substrate that is not covered by the liquid crystal material. Formed and multiple TFTs
A plurality of metal leads in electrical communication with the substrate, a plurality of transparent conductive traces on the protruding portion of the glass plate, and a printed circuit board having a plurality of conductive pads formed on edges thereof; However, with the glass plate facing downward with respect to the printed circuit board and the silicon substrate facing upward,
An intermediate conductive material and a plurality of transparent conductive traces and the plurality of metal leads are coupled to the printed circuit board by the plurality of conductive pads, and the plurality of conductive pads on the printed circuit board are connected to an edge of the silicon substrate. Electrically connecting the flat panel to the printed circuit board, wherein the flat panel is electrically connected to the plurality of metal leads on the portion through the plurality of transparent conductive traces on the glass plate and the conductive material. A flat panel display module formed by doing so. 16. The flat panel display module according to claim 15, wherein the transparent conductive trace is made of ITO. 17. A conductive material for connecting the flat panel to the printed circuit board is selected from the group consisting of a silver paste, a conductive elastomer, an anisotropic conductive film, an anisotropic conductive adhesive, a metal bump, and a solder ball. A flat panel display module formed by electrically connecting the flat panel according to claim 15 to a printed circuit board. 18. The flat panel display module formed by electrically connecting a flat panel to a printed circuit board according to claim 15, wherein the printed circuit board is a flexible printed circuit board. 19. The flat panel display module formed by electrically connecting a flat panel to a printed circuit board according to claim 15, wherein the conductive material is an ultraviolet light curable material. 20. The heat sink according to claim 1, wherein a heat sink for enhancing heat radiation is attached to the silicon substrate.
A flat panel display module formed by electrically connecting the flat panel according to claim 5 to a printed circuit board.