JP2003045236A - Anisotropy conductive film and connection method of integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect the electrodes without bringing about short-circuiting between the adjoining electrodes as the connection resistance between the electrodes is made small in the connection method of the anisotropy conductive film and the integrated circuit device using the same. SOLUTION: An anisotropy conductive film is formed by dispersing conductive particles 2 in the thermosetting resin 1 and by pasting the ultraviolet-hardening resin 3 on both sides of the thermosetting resin 1, and the ultraviolet resin is hardened by ultraviolet rays in advance of thermo-compression bonding and a barrier of the hardened ultraviolet resin material is formed so that the conductive particles may not enter into the adjoining electrodes at the time of thermo- compression bonding, thereby, short-circuiting by migration is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film used when an electrode derived from a display panel or the like and an electrode of an integrated circuit device can be connected, and a method of connecting an integrated circuit device using the anisotropic conductive film.

[0002]

2. Description of the Related Art In recent years, a plasma display device (hereinafter referred to as PDP), which is one of the display devices, has a large PDP panel and a high display dot in response to a demand for higher capacity of display information and higher image quality. As the definition becomes higher, the number of terminals of the package of the integrated circuit device is increased due to the increase of the signal lines due to the high resolution, and the package mounting area in the peripheral portion of the PDP panel is reduced due to the narrow frame, so that the package of the integrated circuit device and the PDP is reduced. -The electrodes of (4) have a narrow pitch, and the electrode terminals tend to be miniaturized.

An anisotropic conductive film has been conventionally used for connecting the electrodes of the PDP panel and the electrodes of the package of the integrated circuit device which is the driver IC.

FIGS. 5A and 5B are views for explaining an example of a conventional anisotropic conductive film and a driver-IC connecting method using the anisotropic conductive film. This anisotropic conductive film is, for example, as shown in FIG. 5A, in which conductive particles 21b having conductivity are dispersed in a thermosetting resin 21a having an insulating property.

To connect the electrode 6b of the driver-IC 6 and the electrode 9b of the panel 9, the anisotropic film 21 is used.
The substrate 6a and the substrate 9a are opposed to each other, and the temperature is heated to 180 to 200 ° C. by a thermocompression bonding jig, and the pressure is applied to 20 to 30 kg per square centimeter. As shown in, thermosetting resin 2
1a is fluidized and a part of the conductive particles 21b is converted into electrodes 6b, 9
The remaining conductive particles 21b that flowed between b and stayed between the electrodes 6b and 9b were collected by pressure, and the electrodes 6b and 9b were electrically connected.

[0006]

In the above-mentioned connecting method, the viscosity of the thermosetting resin 21a, which is the adhesive of the anisotropic conductive film 21, is drastically reduced by the pressure and heat applied during the adhesion so that the thermosetting resin 21a becomes fluid. However, most of the conductive particles 21b between the electrodes 6b and 9b are extruded, move out of the electrode connection site, do not contribute to the electrical connection, and the connection resistance between the electrodes increases. .

Further, in recent years, as the resolution of the liquid crystal panel has become higher and the electrodes have become finer and the pitch of the electrodes has become narrower, so-called migration tends to occur between the electrodes. That is, the conductive particles 21 extruded from between the electrodes facing each other.
There is a problem that b enters between the adjacent electrodes and the adjacent electrodes are short-circuited.

In order to prevent this short circuit, a method of previously adhering an insulating material between adjacent electrodes can be considered, but the process becomes complicated and the manufacturing cost becomes high. In particular, when the electrodes have a narrow pitch, it becomes difficult to attach the insulating member.

Therefore, an object of the present invention is to provide an anisotropic conductive film having a small connection resistance between electrodes and causing no short circuit between adjacent electrodes, and an integrated circuit device connection method using the same. .

[0010]

The first feature of the present invention is to:
An anisotropic conductive film having a thermosetting resin member having a plurality of conductive particles dispersed therein, and an ultraviolet curable resin member applied on both surfaces of the thermosetting resin member.

A second feature of the present invention is an anisotropic conductive film which is another thermosetting resin member in which a plurality of conductive particles and a plurality of ultraviolet curable resin blocks are dispersed. It is desirable that the ultraviolet curable resin mass is larger than the conductive particles. Further, it is desirable that the ultraviolet curable resin block has a spherical shape.

A third feature of the present invention is to provide a substrate on which electrodes derived from a display panel are formed, and a substrate on which electrodes derived from an anisotropic conductive film and an integrated circuit device, which are the first feature, are formed. Stacking so as to sandwich the anisotropic conductive film, and positioning so that the electrodes of the display panel and the electrodes of the integrated circuit device are aligned with each other; thereafter, both the display panel and the integrated circuit device adjacent to each other. A step of irradiating the portion of the ultraviolet curable resin interposed between the electrodes with ultraviolet rays to cure the portion, and thereafter, the substrate of the integrated circuit device, the anisotropic conductive film and the substrate of the display panel which are stacked And a step of thermocompression-bonding the integrated circuit device.

A fourth feature of the present invention is to provide a substrate on which electrodes derived from a display panel are formed, and a substrate on which anisotropic conductive films and electrodes derived from an integrated circuit device, which are the second feature, are formed. Stacking so as to sandwich the anisotropic conductive film, and positioning so that the electrodes of the display panel and the electrodes of the integrated circuit device are aligned with each other; thereafter, both the display panel and the integrated circuit device adjacent to each other. Irradiating the ultraviolet curable resin block interposed between the electrodes with ultraviolet rays to cure the ultraviolet resin block,
Thereafter, the method of connecting integrated circuit devices includes the step of thermocompressing the stacked substrate of the integrated circuit device, the anisotropic conductive film, and the substrate of the display panel.

In the method of connecting integrated circuit devices having the third and fourth characteristics, it is preferable that the ultraviolet rays are emitted from the display panel side.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an anisotropic conductive film according to an embodiment of the present invention. As shown in FIG. 1, this anisotropic conductive film comprises a thermosetting resin 1 in which a plurality of conductive particles 2 are dispersed, and an ultraviolet curable resin 3 applied on both sides of the thermosetting resin 1. Has been done.

The conductive particles 2 are metal particles such as solder and nickel, and are used in PDP panels and driver-ICs.
The same material as the electrode is desirable. For example, if the electrodes are silver-plated, nickel particles may be silver-plated. Furthermore, the ultraviolet curable resin 3 is a photocurable polymer resin containing a photopolymerizable polymerization agent. For example, the polymer-based resin preferably has a urethane acrylic resin as a main component, while the thermosetting resin 1 is an epoxy-based resin such as polyvinyl butyral.

2 (a) to 2 (c) are views for explaining a method of connecting an integrated circuit device for connecting a lead of an IC and an electrode of a panel substrate by using the anisotropic conductive film of FIG. Is. Next, a method of connecting the IC lead, which is the electrode of the integrated circuit device, and the electrode of the PDP panel using the anisotropic conductive film of FIG. 1 will be described with reference to FIG.

First, as shown in FIG. 2A, the anisotropic conductive film 10 is placed on the panel substrate 4 which is a transparent glass plate on which the electrodes 7 are formed. Subsequently, the IC substrate 5 is placed on the anisotropic conductive film 10, and the electrodes 7 of the panel substrate 4 are placed.
The IC lead 6 on the IC substrate 5 is aligned with the IC lead 6 on the same position.

Next, as shown in FIG. 2B, ultraviolet (UV) light is irradiated from the side of the panel substrate 4 which is a transparent substrate. As a result, between the adjacent electrodes 7 and the IC lead
The portion of the ultraviolet curable resin 3 between the terminals 6 is cured and the cured portion 3a
To form.

Next, the IC substrate 5 and the panel substrate 4 are heated and pressed by a thermocompression bonding device to melt and thin the thermosetting resin 1. As a result, the thermosetting resin 1 increases in fluidity, and some conductive particles 2 flow between the adjacent electrode 7 and the adjacent IC lead, but are present between the opposing electrode 7 and the IC lead 6. The conductive particles 2 are aggregated, and
As shown in (c), the molten thermosetting resin 1 is cured by maintaining the heating temperature, and the conductive particles 2 aggregated electrically connect the IC lead 6 facing the electrode 7 to each other.

On the other hand, the adjacent electrode 7 and the adjacent IC
The conductive particles 2 flowing between the leads are hardened in advance by the hardened portion 3a, which serves as a barrier, and the adjacent electrode 7 and the adjacent IC
It does not enter between the leads 6. Then, these conductive particles 2 remain in the resin cured between the adjacent electrode 7 and the adjacent IC lead 6.

FIG. 3 is a sectional view showing an anisotropic conductive film according to another embodiment of the present invention. As shown in FIG. 3, this anisotropic conductive film is composed of a resin mass 8 formed of a plurality of conductive particles 2 and an ultraviolet curable resin and a thermosetting resin 1 in which the plurality of conductive particles 2 are dispersed. ing.

The conductive particles 2 are metal particles such as solder and nickel, and are used in PDP panels and driver-ICs.
The same material as the electrode is desirable. For example, if the electrodes are silver-plated, nickel particles may be silver-plated. Further, the resin block 8 of the ultraviolet curable resin is preferably a photocurable polymer resin containing a photopolymerizing polymerization agent and is also a thermoplastic resin. On the other hand, as the thermosetting resin 1, an epoxy resin is used as described above.

FIGS. 4A to 4C are views for explaining a method of connecting an integrated circuit device in which the leads of the IC are connected to the electrodes of the panel substrate by using the anisotropic conductive film shown in FIG. Is. Next, a method of connecting the IC lead which is the electrode of the integrated circuit device and the electrode of the PDP panel using the anisotropic conductive film of FIG. 3 will be described with reference to FIG.

First, as shown in FIG. 4A, the anisotropic conductive film of FIG. 3 is placed on the panel substrate 4 on which the electrodes 7 are formed. Subsequently, the IC substrate 5 is placed on the anisotropic conductive film 10, and the electrodes 7 of the panel substrate 4 and the ICs of the IC substrate 5 are mounted.
Positioning is performed so that the positions of the leads 6 match.

Next, as shown in FIG. 4B, ultraviolet (UV) light is irradiated from the side of the panel substrate 4 which is a transparent glass substrate. As a result, between the adjacent electrodes 7 and I
The resin block 8 formed of the ultraviolet curable resin between the C leads 6 becomes a cured resin block 8a. Here, it is desirable that the resin lump 8 be spherical in order to improve fluidity at the time of thermocompression bonding described later. The resin mass 8 is preferably larger than the conductive particles 2 so as not to stay between the electrode 7 and the IC lead 6.

Next, the IC substrate 5 and the panel substrate 4 are pressurized while being heated by a thermocompression bonding apparatus and heated to 150 ° C. or more to melt the thermosetting resin 1 into a liquid state. The hardened resin mass 8a in the liquid thermosetting resin 1 is pushed out by the sandwiching pressure,
As shown in FIG. 4C, the space 12 is retained by being held between the adjacent electrode 7 and the adjacent IC lead, and is deformed by pressure contact to fill the space 12.

On the other hand, the uncured resin block 8 is melted by the pressure contact force of the electrode 7 and the IC lead 6 heated to 150 ° C. or more and flows out into the space 12. The conductive particles 2 in the liquid thermosetting resin 1 remain between the electrode 7 and the IC lead 6 and are aggregated by the pressurization to electrically connect the electrode 7 and the IC lead 6 to each other, and the heating temperature is increased. By maintaining the above, the liquid thermosetting resin is cross-linked and cured.

[0030]

As described above, according to the present invention, the anisotropic conductive film is formed by dispersing the conductive particles in the thermosetting resin film and appropriately containing the ultraviolet curable resin member before the thermocompression bonding. To cure the UV resin member,
By forming a barrier of the cured resin member so that conductive particles do not enter between adjacent electrodes during thermocompression bonding, short circuit due to migration is prevented, yield is improved, connection resistance can be reduced, and display quality is improved. There is an effect.

Further, since the anisotropic conductive film containing the ultraviolet curable resin member can be made as a single body, it is easy to handle, and the thermocompression bonding process is simple, and the connection cost can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an anisotropic conductive film according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing an IC re-assembly using the anisotropic conductive film of FIG.
FIG. 6 is a diagram for explaining a method of connecting an integrated circuit device that connects a battery and an electrode of a panel substrate.

FIG. 3 is a sectional view showing an anisotropic conductive film according to another embodiment of the present invention.

FIG. 4 is a schematic diagram of an IC releasable using the anisotropic conductive film of FIG.
FIG. 6 is a diagram for explaining a method of connecting an integrated circuit device that connects a battery and an electrode of a panel substrate.

FIG. 5 is a diagram for explaining a conventional anisotropic conductive film and a driver-IC connection method using the anisotropic conductive film.

[Explanation of symbols]

1 thermosetting resin 2 Conductive particles 3 UV curable resin 4 panel board 5 IC board 6 IC lead 7 electrodes 8 resin blocks 10 Anisotropic conductive film

Claims (7)

[Claims] 1. An anisotropic conductive material comprising a thermosetting resin member having a plurality of conductive particles dispersed therein, and an ultraviolet curable resin member applied to both surfaces of the thermosetting resin member. the film. 2. An anisotropic conductive film, which is another thermosetting resin member having a plurality of conductive particles and a plurality of ultraviolet curable resin lumps dispersed therein. 3. The anisotropic conductive film according to claim 2, wherein the ultraviolet curable resin mass is larger than the conductive particles. 4. The anisotropic conductive film according to claim 2, wherein the ultraviolet curable resin block has a spherical shape. 5. The anisotropic conductive film is sandwiched between a substrate on which an electrode derived from a display panel is formed and the anisotropic conductive film according to claim 1 and a substrate on which an electrode derived from an integrated circuit device is formed. Stacking and positioning so that the electrodes of the display panel and the electrodes of the integrated circuit device are aligned with each other, and thereafter, the ultraviolet curing interposed between both electrodes of the adjacent display panel and the integrated circuit device. Irradiating the resin portion with ultraviolet rays to cure the portion, and thereafter thermocompressing the stacked substrate of the integrated circuit device, the anisotropic conductive film, and the substrate of the display panel A method for connecting an integrated circuit device, comprising: 6. The anisotropic conductive film is sandwiched between a substrate on which an electrode derived from a display panel is formed and the anisotropic conductive film according to claim 2 and a substrate on which an electrode derived from an integrated circuit device is formed. Stacking and positioning so that the electrodes of the display panel and the electrodes of the integrated circuit device are aligned with each other, and thereafter, the ultraviolet curing interposed between both electrodes of the adjacent display panel and the integrated circuit device. A step of irradiating the resin block with ultraviolet rays to cure the ultraviolet resin block, and thereafter, a step of thermocompression-bonding the substrate of the integrated circuit device, the anisotropic conductive film and the substrate of the display panel which are stacked. A method of connecting an integrated circuit device, comprising: 7. The method for connecting integrated circuit devices according to claim 5, wherein the ultraviolet rays are emitted from the display panel side.