TW476122B - Assembling method of non-transparent flat display panel - Google Patents

Abstract

This invention provides an assembling method of non-transparent flat display panel, capable of simultaneously forming flat display panel and connecting with printed circuit board. A silicon wafer is provided, which is coated with an alignment layer. Plural spacers are set up on the silicon wafer and the wafer is diced into many dies. Frame seal is placed at the edge of a die. At least one metal lead is formed at the edge of the die and these metal leads are electrically connected to many thin film transistors. A glass substrate is combined with the die by using frame seal for being connected to a printed circuit board by using connecting device and conductive material, such as silver paste, anisotropic conductive film or anisotropic conductive adhesive. When the printed circuit board and the flat display panel are combined, individual metal leads on the printed circuit board and on the silicon substrate are connected to the plural transparent electrodes on the glass substrate. Because the glass substrate is fully exposed and the flat panel display module allows the occurrence of optical penetration, the inventive structure can be applied to conventional alignment device such as charge coupled device and conventional connecting device.

Description

V. Description of the invention (1)

5 -1 Field of the Invention: The present invention relates to a method for forming an element, a method for interconnecting a flat panel with a special panel and a printed circuit board, and a liquid crystal display having an opaque substrate, and an element formed by the method. 5-2 Background of the Invention: In recent years, 'liquid crystal display (LCD) panels have been widely used to replace cathode ray tubes (CRT) in electronic display applications. An LCD panel is formed by filling a liquid crystal material between an LCD substrate and a transparent glass panel, where a 1 (: 1) substrate contains at least a plurality of switches for controlling a plurality of pixels on the LCD panel, or Say electronic switching element. When the LCD panel is assembled, the LCD panel must be connected to external circuits to receive signals and generate images accordingly. There are several ways to electrically connect the LCD panel. A common known technique is to use a so-called flexible printed circuit board (FPCB). The flexible printed circuit board provides an LCD through a number of different electronic components soldered to it. The signal required for the panel, the structure of the flexible printed circuit board is usually a copper conductive layer and a flexible polyurethane cover layer on the two sides, and the flexibility of FPCB is on the LCD surface and the board. Assembly

476122 V. Description of the invention (2) The process is very helpful. As shown in FIG. 1A, the LCD panel 10 is connected to a printed circuit board (PCB) 14 through FPCB 12, and there are some surface mount technology (SMT) methods on the surface of the printed circuit board 14. Integrated circuits (1C) chip (Chip) 16. Another common conventional technique is to bond the LCD panel to the PCB, as shown in FIG. 1B, using tape automated bonding (TAB). In the case of using the automatic tape and tape joining technology, the tape and tape area 20 is applied to connect the LCD panel 10 and the PCB 14, and the tape and tape area 20 includes at least a tape 22 and a product located on the tape 22 and connected to the bump 24. Circuit chip 16. The advantage of TAB technology is that it can provide a high-density mounting structure so that the circuit density can be improved and the lead pitch (丨 e pi tch) can be as small as 60 // m. TAB, also known as tape carrier package (TCP), uses thin metal with fine patterns (such as copper pigs plated with gold or tin) to replace traditional wire bonding technology and connects metal wires to the corresponding Gold-plated bumps on aluminum pads of integrated circuits. For a large-scale integrated circuit with a large number of outputs / inputs, TAB that can provide a small pitch connection is a more suitable technology. In particular, τ AB can provide a smaller pitch and a longer path than wire bonding. Span bonding. However, the production cost of TAB technology is usually higher. Another conventional technology for joining LCD and PCB is the chip on glass (COG) technology as shown in Fig. 1c. In cog technology

476122 V. Description of the invention (3) 'Integrated circuit wafer 16 is directly attached to LCD panel 10 by bump 24 and anisotropic conductive film (ACF) 26, and the second Figures A and B are schematic diagrams of the ACF in more detail. As shown in FIG. 2A, conductive pads 28 are formed on the top of the TAB tape 22, and the TAB tape 22 is placed above the ACF 30. The ACF 30 also contains Some conductive particles (32). Below the ACF 30 is an LCD panel 10, and there are some conductive elements 36 on top of the LCD panel 10. After the TAB tape 22, the ACF30 and the LCD panel 10 are thermally pressed together, as shown in FIG. 2B, these conductive particles 32 provide an electrical connection between the conductive pad 28 and the conductive circuit unit 36, thereby making the TAB The band 22 is also electrically connected to the LCD panel 10. It must be noted that the electrical conduction between the conductive circuit unit 36 and the conductive pad 28 occurs only when the conductive particles 32 are compressed, that is, the electrical conduction is only established anisotropically and selectively . Generally, the conductive circuit unit 36 on the LCD panel 10 is an indium tin oxide (ITO) film. As shown in the first figure C, the COG technology can use a flexible printed circuit board (not shown in the figure) to connect the LCD panel and the printed circuit board (not shown in the figure). At this time, the COG technology relies on the bonding of the bump 24 (located on the integrated circuit chip) and the ACF to provide an electrical connection. … All the techniques that are known to form TFT-LCD assemblies have their own advantages and disadvantages. For example, for technologies using SMT / FpcB

4/6122 V. Description of Invention (4)

Technically, the circuit density can be increased to form a high-density structure, but the cost of the materials used is higher and the TAB technology is more complicated. For TAB and COG technologies, some rework steps in assembly (such as removing defective integrated circuit wafers from LCI substrates) are difficult. For example, the only possible way to remove the integrated circuit that has been bonded to the LCD substrate is to apply a shear force to push the integrated circuit chip and thereby break the connection between the integrated circuit chip and the LCD substrate, which is difficult. The manufacturing process can easily lead to the destruction of the entire assembly. In the existing manufacturing technology of TFT-LCD assembly, the SMT / FPCB method is usually used to form a low-cost assembly, such as a product using a small-sized LCI panel, in the application of a large-sized LCD panel (such as a notebook computer), Generally, the TAB bonding method is used; and the COG method, because it is not easy to be reworked and repaired, is only applied to small-sized LCD panels; therefore, the TAB program and the COG program are two methods commonly used to form a TFT-LCD. In summary, since the TAB method is easier to remove the integrated circuit chip from the TAB tape, the TAB method is easier to rework and repair ’and because of its small size, it can also provide a high-density package with a pitch of 60 microns. However, the tab process includes more complicated steps, such as integrated circuit wafer bonding, tape and reel manufacturing, inner pin bonding, sealing, outer pin bonding, and ACF processes. Moreover, another disadvantage of the TAB process is that the problem of 'therma 1 eXpans i on' in the ACF process may cause misalignment of the wire bond. The TAB belt may also absorb moisture and cause instability in its dimensions. Since the TAB process may require complex equipment, the overall process cost will further increase

476122 V. Description of the invention (5) In the f0G program, the required process steps are simple, for example, only integrated circuit wafer bumping (IC bumping) and ACF processes are required. There is no thermal expansion problem and the foot can reach 50 microns. Pitch, it is no longer difficult to achieve a high-density LCD structure, see Figure 3a and Figure 3-6. As shown in Figure 38, the cross-section of the LCD package (packag, e) 40 includes at least the lower glass substrate 10 (that is, the LCD panel), the upper glass substrate 42, the integrated circuit chip (or driver chip) 16, and Square conductive film (ACF) 26 and printed circuit board (or flexible printed circuit board) 1 4. The driving chip 16 is electrically connected to the majority of the conductive pads 46 (such as the IT0 electrode) on the top surface 48 of the lower glass substrate 10 through the majority of the bumps 44 located in its active area. The sexual connection is through an anisotropic conductive film 26 containing a large number of conductive particles 50. In order to connect to the external circuit, such as the circuit of PCB14, PCB14 is electrically connected to the lower glass substrate 10 through some conductive pads 52. Here, the third figure b is a top view of the LCD structure. As shown in Figures 2A and 3B, the area of the glass substrate 10 under the LCD package 40 is usually larger than the area of the upper glass substrate 42, and the uncovered area 60 can be used to connect the driving chip 16 and the PCB. . However, since the uncovered area 60 cannot be eliminated, the size of the entire LCD package 40 cannot be further reduced, and this method is not suitable for compact LCD packages. That is, in order to manufacture a compact LCD package, the conventional LCD package technology must be modified to connect the driver chip to the external PCB circuit.

Page 8 476122 V. Description of the invention (6) Recently, a flat-panel display structure that replaces a glass panel with an opaque panel such as a silicon substrate has been gradually applied. This module is usually called a monocrystalline liquid crystal light valve (liquid crystal on silicon (LCoS). In a typical monocrystalline liquid crystal light valve module, the connection between the liquid crystal and the printed circuit board is provided by wire bonding or an anisotropic conductive film on the silicon surface. As shown in the fourth figure, the typical single crystal silicon liquid crystal light valve module 70 is composed of a glass substrate 54, a silicon substrate 56 and a liquid crystal material (1 i quid crystal material) in between. The 'spacers' 62 formed by 58 are used to maintain a certain gap between the two substrates, and the sealant 64 is located around the glass substrate 54 and is used to seal and maintain the liquid crystal material 58. When the liquid crystal display panel 66 is connected to a substrate such as a printed circuit board 68, the silicon substrate 56 is adhesively bonded to the printed circuit board 68. The integrated circuit chip 72 is adhered to the top of the printed circuit board 6 to provide a driving circuit required for the liquid crystal display panel 66. At this time, the electrical connection between the liquid crystal display panel 66 and the printed circuit board 68 is basically provided by wire bonds 74, and can also be provided by the metal wires 78 and the bonding pads 76. As shown in the fourth figure, the monocrystalline silicon liquid crystal light valve module (1 iquidcrysta 1 substrate module) 70, even if the wire bonding technology has matured to form a monocrystalline silicon liquid crystal light valve module by automated procedures, the production of the entire process The rate will still decrease due to the longer time consumption of the wire bonding process. Other difficulties include the process and design. This module is not easy to use.

476122

The alignment of the alignment device of the transparent substrate and the thermal dissipation caused by the difficulty in forming a heat sink on the silicon substrate are not good. These process and design limitations greatly limit the potential of monocrystalline silicon liquid crystal light valve modules. '5-3 Object and Summary of the Invention: A main object of the present invention is to provide a method for assembling a flat display panel having a non-transparent substrate and avoiding the lack of conventional assembling methods. Another object of the present invention is a method for assembling a flat display panel having a non-transparent substrate and avoiding the lack of conventional wire bonding technology. Another object of the present invention is to provide a method for assembling a flat display panel having a non-transparent substrate, wherein the flat display has both a non-transparent substrate and a glass substrate having a larger area than the non-transparent substrate.

Another object of the present invention is to provide a method for assembling a flat display having a non-transparent substrate, in which the liquid crystal panel is simultaneously connected to a printed circuit board through an anisotropic conductive film. Another object of the present invention is to provide a method for assembling a flat panel display having a non-transparent substrate and a flexible printed circuit board, in which anisotropic conduction is performed.

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Adhesive is used to connect the circuit board and the LCD panel. It is an object of the present invention to provide a method

Ulre bond) can be electrically connected to the printed circuit. Module. The present invention also provides a flat panel display module. The flat panel uses an anisotropic-electric film or anisotropic conductive adhesive to connect the flat panel between the flat panel and the printed circuit board. A display panel is printed. An object of the present invention is to provide a flat display module. The flat display module can be aligned with a display panel and a printed circuit board by using a conventional bonding device. + m t Μ The present invention proposes a method for assembling a flat display with an opaque substrate and a printed circuit board, and a corresponding flat display module. A preferred embodiment of the present invention is a method for assembling a flat display with an opaque substrate, including at least the following steps: providing a flat display, the flat display is composed of a glass substrate, a silicon substrate, and a liquid crystal located between the glass substrate and the substrate Made of materials, where the length of the glass substrate is longer than the length of the Shi Xi substrate, so that part of the glass substrate in the longitudinal direction is not covered by the silicon substrate, and a protrusion is formed on at least one side of the glass substrate

Page 11 476122 V. Description of the invention (9) (overhang); Provide most metal wires, these metal wires are located on the edge of the part of the silicon substrate that is not covered by the liquid crystal material, and these metal wires are electrically connected to most of the thin film electrical Crystal (thin film transistor); provide transparent conductive traces (transparent conductive traces) on this overhang of the glass plate; provide a printed circuit board with most conductive pads on the edge of the printed circuit board; place a flat display so that the glass substrate Above and facing downwards, the silicon substrate and the printed circuit board are juxtapped; a conductive adhesive is placed between the transparent wires, the metal wires and the conductive pads; the display panel and the printed circuit board are aligned flat, and the alignment method is It is carried out from the bottom of the flat display " indicator through the glass substrate; and both the printed circuit board and the overhang of the glass substrate are pressed, so that these conductive pads on the printed circuit board can pass through the conductive adhesive and the glass substrate. These transparent wires are electrically connected to the metal wires on the Shixi substrate. The method for assembling a flat display with an opaque bottom plate may further include any one of the following steps or restrictions: Ultraviolet (UV) curing of the conductive adhesive from one end of the glass substrate; the conductive adhesive is one of the following: silver paste (Silver paste), electrically conductive rubber, anisotropic conductive film, anisotropic conductive adhesive, metal bumps, and solder balls 11 s); the material of the transparent wire is indium tin oxide (丨 11 (1 丨 11111-yan 11-(^ 丨 (16); the printed circuit board is a flexible printed circuit board); the charge surface Hop yuan

Page 12 476122

5. Description of the invention (10) (Charge coupled device (CCD)) to align the flat display and the printed circuit board. 〃

The present invention further includes a method for simultaneously forming a flat display and bonding to a printed circuit board. The method includes at least the following steps: a silicon wafer is provided, and a plurality of thin film transistors are present on the silicon wafer, and the thin film transistors are divided in On a plurality of wafers; an alignment layer (aHgnment Uyer) is coated on the silicon wafer and the surface of the alignment layer is frictionally oriented; the alignment layer is formed by aligning high-quality materials in a preferred direction; and a plurality of spacers are installed. On the surface of the wafer, the thickness of any of the spacers is predetermined; a book is cut and the reliability of each wafer is tested; a frame seal is placed on the edge of any wafer; at least one metal wire is formed ^ any The edges of the wafer are electrically connected to these thin wires: crystals; a glass substrate is placed on the wafer, where the surface of the glass substrate is 于 面积 to the area of the wafer so that some of the glass substrates form overhangs; 1 transparent conductive wire (transport conductive trac) on the overhang; refers to the brush circuit board, there are most conductive pads on the edge of this printed circuit board; The base is reversed, so that the wafer and the glass substrate are made of frame glue Qiu 51 i ^ with the glass substrate above and facing down, and the silicon substrate and printed electrical material between these transparent wires, these metal conductive green conductive pads Aligning the glass substrate to the wafer is opposite to the printed circuit 4. The alignment method is performed from the bottom of the glass substrate; pressing the printed circuit ^ and the overhang of the glass substrate makes these conductions on the printed circuit board through conductive Adhesives are electrically connected to these transparent wires on the glass substrate

476122 V. Description of the invention (11) These metal wires which are connected to this wafer by nature; and filling the liquid crystal material between the glass substrate and the wafer, where the liquid crystal material is also surrounded by the frame glue. The method for simultaneously forming a flat display and bonding it to a printed circuit board may further include any one of the following steps or restrictions: curing the conductive adhesive with ultraviolet rays from one end of the glass substrate; the printed circuit board is a flexible printed circuit board; using charge coupling Components to align the glass substrate, wafer and printed circuit board; the glass substrate and the upper thermal head are used to press the printed circuit board and the overhang; the heat sink is installed behind the crystal to enhance the heat dissipation of the wafer; the material of the frame glue is The external molecular solidified south molecular material; the conductive material is one of the following: silver paste, conductive rubber, anisotropic conductive film, anisotropic conductive adhesive, metal bumps and solder balls. The method includes a flat display module formed by electrically connecting a flat plate and a printed circuit board. The flat display module includes at least the following units: a flat plate (f 1 atpane 1). The flat plate is made of a glass substrate and a stone substrate. And the liquid crystal material between the glass substrate and the Shixi substrate, and the length of the glass substrate is longer than the length of the silicon substrate, so that the glass substrate in the longitudinal direction (long + itudinal direction) is not covered by the silicon substrate And at least one side of the glass substrate is formed with a cantilever; a plurality of metal leads (metal leads) are located on the edge of the portion of the silicon substrate that is not covered by the liquid crystal material, and these metal leads are electrically conductive Connected to a plurality of thin film transistors; a plurality of transparent conductive lines, which are located on the convex portion of the glass substrate

Page 14 476122 V. Description of the invention (12) = ·; a printed circuit board, the edge pad of this printed circuit board, and the configuration of the flat board are two pass through the glass substrate; the board and the printed circuit board are juxtaposed, the flat board By brushing the circuit board in Shixi, printed electricity; these transparent wires bonded to the printing material and the glass substrate: these metal wires that are conductive. Electroplating is shown on a silicon substrate. The flat material made of ν mold Y is still combined. Two oxides = 2: Ming β V electrical rubber, anisotropic conductive film, anisotropic conductive bumps, and solder balls; printed circuits The board is a polymer material that is cured by ultraviolet rays; there are: sheet, this heat sink is used to enhance the heat dissipation of the chip. Government ..., 5-4 Invention Detailed Description The present invention discloses assembling (or connecting) a flat display (fUt dispUy 叩) with an opaque substrate (non-transparent). A method with a printed circuit board, and the use of L ... 夂Uiat panel display module) formed by this method.

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4 / DIZZ V. Description of the invention (13) The present invention provides a new method, i ^ Tong i 戌 戌 禋 禋 禋 new method, by using a glass station r 1 in the LCoS module (bonder equipment) and Align two ffl, i: & person / to use. The invention also provides a new structure, so that the glue material of the board and the printed circuit board can be cured through the transparent glass [T, i L 梂 ^ line. Another advantage of this structure is that the heat sink can be directly formed on the stone substrate which is not covered by the printed circuit board. In the structure proposed by the present invention, several signal lines or a plurality of metal leads on a silicon substrate (silicon — ^ rate) can pass through a conductive material (eiectricaiiy material), such as Silver paste, conductive rubber, anisotropic conductive film, or anisotropic conductive adhesive follow most of the signal lines extending to the glass substrate. The conductive material can be used to join the glass substrate with the printed circuit board (or flexible printed circuit board) to form a flat display module. When the toad electrical material is silver-poor or anisotropic conductive adhesive, the conductive material can be applied to the silicon substrate by means of coating (dispensing means); when the conductive material is conductive rubber, mechanical holding method (mechanicai n ^ ans) the conductive material is applied to the silicon substrate; when the conductive material is an anisotropic electrical film, the conductive material can be applied to the Shi Xi substrate by adhesive means; when the conductive material is a metal bump bumps ) ^ The conductive material can be applied to the substrate using bump ping means, and when the conductive material is solder balls, the conductive material can be known by stencH printing means Add on silicon substrate. Here, these programs can be in the package

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V. Description of the invention (14)

A sealant or a frame seal is performed before the glass substrate is formed. These conductive materials can be formed over transparent wires (such as ITO electrodes on a glass substrate). By using an existing alignment device such as a charge-coupled device to penetrate a transparent glass substrate to ensure the alignment of the glass substrate and the silicon substrate, a flat display can be formed at the same time during the bonding process of the printed circuit board. The present invention provides a variety of manufacturing advantages, such as using existing anisotropic conductive film technology to bond a printed circuit board (or flexible printed circuit board) to a glass substrate. For example, an existing alignment device such as a CCD can be used through a glass substrate. Therefore, it is not necessary to use an expensive device that can be used through an opaque substrate. In addition to silicon substrates, the method proposed by the present invention can also be applied to arsenic substrates, ceramic substrates, printed circuit boards, plastic plates or opaque flexible films (non-tranSparent flexible fUm). Furthermore, the structure of the present invention allows the back surface of the Shixi substrate to be completely exposed, so that the heat sink can be easily formed on the silicon substrate. Referring to the fifth figure, this is a block diagram 80 of the proposed method of the present invention. In this f method, first, a wafer having a plurality of dies and having been cleaned is provided, and a plurality of thin film transistors are present on each wafer. Then, an alignment layer (such as polyimide) is coated on the round surface, and is baked, cured, and rubbed to form a layer with a specific orientation, so as to regulate (predetermine) Direction of the subsequently formed liquid crystal material. Then install (or adhere) a plurality of wafers before separating each wafer (d i e s)

Page 17 476122 V. Description of the invention (15) The spacers are on silicon wafers, and the reliability and quality of each wafer are tested. After the wafer passes the test procedure, a package or a sealant is formed around the wafer, and an upper glass plate is mounted on the silicon substrate to press the glass substrate onto the sealant. At the same time, a conductive material is formed between the glass substrate and the printed circuit board to join both the glass substrate and the printed circuit board into a module. Next, the liquid crystal material is filled between the glass substrate and the silicon substrate and sealed. Finally, the entire module is encapsulated and stored to power the assembly needs of the sub-product. -The top view of the silicon substrate 82 used in the present invention is shown in the sixth figure. On the top of the Shixi substrate 82 is an array region 84 of a thin film transistor for driving a liquid crystal panel. On one side of the silicon substrate 82 are a plurality of metal wires µ for providing electrical connection with each thin film transistor (not shown) located on the Shi Xi substrate. The seventh figure is a plan view of a glass substrate 88 longer than the silicon substrate 82. On the top of the glass substrate 88 is an area 90 having an area equivalent to the array area 84 in the sixth figure. The area 90 can be used to form a liquid crystal panel and a frame seal 92 surrounding the (LCD field) area 90. A plurality of transparent wires 94 made of indium-tin-oxide (ιτ〇) are formed on one side of the glass substrate 88, so that the transparency of the glass substrate 88 does not prevent light from passing through the glass plate. Any interference was encountered in the CCD alignment procedure shot up from the bottom of the 88, as shown in Figure 8.

4 / blZZ V. Description of the invention (16) As shown in the eighth figure, the current day% 4 days include: Shixi substrate 82, glass fu 28 and ^ surface ^ / device module 100 to spoon Ifi々 V «said from 2, magic binding adhesive (sealing adhesive) 2 on the top of the Shixi substrate 82 are most metal wires, such as

The top of the SnYL // glass substrate 88 is most transparent wires 94, " In the transparent wire 94 series, so that the transparency of the glass substrate 88 will not be affected by any interference, so that during the assembly process of the f module 100 ... The optical material is processed from the edge of the glass substrate using a conventional alignment device (such as ⑽). The new structure (flat display module 100) proposed by Shen Bian is a large one for joining the printed circuit board 98, the glass substrate 88 and the Shi Xi substrate μ. The material 9 6 can be optically ( Cured, as with ultraviolet light. The conductive material 96 is usually one of the following: silver paste, conductive rubber: anisotropic conductive film, anisotropic conductive #, metal bumps and solder balls. The conductive material 96 is located on the glass substrate 88 and the silicon substrate 82. In between, the conductive material 96 is usually one of the following: silver paste, conductive rubber, anisotropic conductive film, and anisotropic conductive adhesive. When the conductive material 96 is located between the glass substrate 88 and the printed circuit board 98, the conductive material 96 is usually a metal bump or a solder ball. The ninth figure shows the flat display module 100 of the present invention after the upper mold platen 102 has been removed and the bonding process (commpressing bonding process) is completed. As shown in the ninth figure, the heat sink

Page 19 476122 V. Description of the invention (17) (heat sink) 106 may be formed on the backside 108 of the silicon substrate 82 to further enhance thermal dissipation. It must be noted that the bonding of the heat sink 106 can only be formed in the new structure proposed by the present invention, because the back side 108 of the silicon substrate 82 is completely exposed at this time; as far as the conventional technology is concerned, as shown in the fourth figure As usual, there is no such space for the heat sink 106 to be formed. The new structure proposed by the present invention also allows the plurality of metal wires 86 on the silicon substrate 82 to be electrically connected to the printed circuit board 98 through the conductive material 96/104 and the plurality of transparent wires 94 (transparent electrodes) on the glass substrate 88. . The electrical connection established here does not cause any loss in the alignment process performed by the CCD device from the bottom of the glass substrate 88, as shown in FIG. 8, especially in the flat display module 100 and the printed circuit board. 98 assembly process. The present invention proposes a method for simultaneously forming a frame adhesive for a flat display and bonding it to a printed circuit board in the same bonding apparatus (single apparatus) = single compression process (compressi asnMing pr cess). The alignment can be obtained by using optical devices such as CCDs from below the glass substrate. A method for assembling a flat display panel with an opaque substrate and a printed circuit board, and a flat display module formed by the method, according to the above description and referring to the fifth to ninth drawings Show

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^ 12LL V. Description of the invention (18) When the present invention is based on the following: When the content is implemented, it must be noted that the above is not to limit its scope to express the essence to be described, and furthermore, When this issue date is ^ Six_ Note that when the above-mentioned preferred embodiments are well known, many changes that must be invented can make use of the disclosed content to make the above, which is only for women The application & is the preferred embodiment of this article \ 'is not intended to limit the scope of Iri; and all other patents that do not depart from the scope of the present invention:纟 Changes or modifications' should be included in the following application drawings for a brief explanation: In the figure, the cross section of the surface-adhesive integrated circuit shown in Xi Λ is shown in Figure 2. The flexible printed circuit board is connected to the liquid crystal display panel; The road system shows through the second picture-for "1" a conventional method how to use a tape to automatically join the tape to connect the Japanese. 4 cross-section schematic diagram of the non-panel and the printed circuit board; Schematic cross section ·,

Page 21 476122 V. Description of the invention (19) The second diagram is a schematic diagram showing the bonding of a TAB tape to a liquid crystal display substrate with an anisotropic conductive film; the first diagram B shows the units of the second diagram A in a lamination process. And the schematic diagram after the electrical connection between the TAB band and the LCD grave panel is established; Figure 2A is a cross-sectional schematic diagram showing the arrangement relationship between the printed circuit board and the driver chip located in the liquid crystal and display panel in the conventional technology A third B diagram shows a schematic top view of the situation shown in the third A diagram; the fourth diagram is an enlarged cross-sectional diagram of a conventional single-crystal silicon liquid crystal light valve module, and the fifth diagram is a basic flowchart of the present invention; The sixth figure is an enlarged top view of a plurality of metal wires formed on the surface of the substrate in the present invention; the seventh figure is an enlarged top view of a plurality of transparent wires formed on the surface of a glass substrate in the present invention; the eighth figure This is a magnified horizontal m-plane diagram of the procedure for bonding a liquid crystal panel to a printed circuit board without using wire bonds.

Page 22 476122 V. Description of the invention (20); and The ninth diagram is an enlarged cross-sectional view of the present invention in which a liquid crystal panel, a printed circuit board and a heat sink are bonded to each other. Symbols of the main parts • 10 LCD panel 12 Flexible printed circuit 14 Printed circuit board 16 Wafer 20 Tape and strip area 22 Tape and strip 24 Bump 26 Anisotropic conductive film 28 Conductive pad-30 Anisotropic conductive film 32 Conductive particles 36 conductive circuit unit 40 LCD structure 42 upper glass substrate 44 bump 46 conductive pad 48 top surface 50 conductive particle

Page 23 476122 V. Description of the invention (21) 52 conductive pad 54 glass substrate 56 silicon substrate 58 liquid crystal material 60 uncovered area 62 spacer 64 frame adhesive 66 liquid crystal display panel 68 printed circuit board 0 monocrystalline silicon liquid crystal light valve module 72 Integrated circuit chip 76 Bonding pad 78 Metal wire 80 Block diagram 82 Silicon substrate 84 Thin film transistor array area 86 Metal wire 88 Glass substrate 90 Viewable area 92 Frame adhesive 94 Transparent wire 96 Conductive material 98 Printed circuit board 100 Flat display module

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Claims (1)

476122 VI. Scope of patent application Patent scope: 1. A method of assembling a flat display with an opaque substrate 'at least includes the following steps: providing a flat display panel, the flat display panel is composed of a glass substrate, a Shixi substrate and A liquid crystal material between the glass substrate and the Shixi substrate, wherein a length of the glass substrate is greater than a length of the silicon substrate so that at least one side of the glass substrate is partially convex in a longitudinal direction. Provide a plurality of metal wires, the metal wires are located at the edge of the portion of the silicon substrate that is not covered by the liquid crystal crystal material, and the metal wires are electrically connected to a plurality of thin film transistors; a plurality of transparent wires are provided On the overhang of the glass plate; Provide a printed circuit board with a plurality of conductive pads on the edge of the printed circuit board; Place the flat display panel so that the glass substrate is above and facing and the silicon substrate and the print The circuit boards are juxtaposed; a conductive adhesive is placed on the transparent wires, the metals guide the Between the conductive pads; one-to-one alignment between the flat display panel and the printed circuit board, the alignment method is performed through the bottom of the flat display panel through the glass substrate; and ^ joining the printed circuit board and the The projections on the glass substrate 基板 Ξ: the conductive pads on the f circuit board can be electrically connected to the silicon substrate via the conductive adhesive: the transparent wires on the soil board ϋ Page 26 Ma 22 $, Patent scope Some metal wires. 2. The method according to item 1 of the scope of patent application, further comprising the step of curing the conductive adhesive with ultraviolet rays from one end of the glass substrate. 3. The method described in item 1 of the scope of patent application, the conductive adhesive is one of the following: silver paste, conductive rubber, anisotropic conductive film, anisotropic conductive adhesive, metal bumps and solder balls. 4. The method as described in item 1 of the scope of patent application, the material of these transparent wires is indium tin oxide. ] The method according to item 1 of the scope of patent application, the printed circuit board is a flexible printed circuit board. 6. The method as described in the first item of the patent application, which uses a charge coupled device to align the flat display panel and the printed circuit board. 7. · A method for forming a flat display panel and bonding it to a printed circuit board at the same time, including at least: providing a silicon wafer on which there are a plurality of thin film transistors, and the thin film transistors are distributed in the majority On each wafer, an alignment layer is coated on the silicon wafer and the surface of the alignment layer is frictionally oriented. The alignment layer is formed by arranging a polymer material in a preferred direction; 476122 VI. Application for a patent: Install a plurality of spacers on the surface of the silicon wafer, and any one of the spacers has a predetermined thickness; cut the wafers and test the reliability of the wafers; place a frame of glue on any The edge of the wafer; forming at least one metal wire on the edge of any of the wafers, and electrically connecting the metal wires to the thin film transistors; placing a glass substrate on the wafer, wherein the area of the glass substrate is larger than the area The area of the wafer makes part of the glass substrate form a bump; forming a plurality of transparent wires on the bump; providing a printed circuit board with a plurality of conductive pads on the edge of the printed circuit board; placing / setting the wafer and The glass substrate is such that the wafer and the glass substrate are connected by the frame glue, and the glass substrate is above and facing downward and the silicon substrate is juxtaposed with the printed circuit board; a conductive material is placed on the transparent wires, Between the metal wires and the conductive pads; align the glass substrate to the wafer and the printed circuit board, and The quasi-mode is performed from the bottom of the glass substrate; the two sides of the edge printed circuit board and the overhang of the glass substrate are pressed together, so that the conductive pads on the edge printed circuit board can pass through the conductive adhesive and the glass substrate The transparent wires are electrically connected to the metal wires on the wafer; and a liquid crystal material is filled between the glass substrate and the wafer, the liquid crystal Page 28 6. Scope of patent application The material is also surrounded by the frame rubber. 8 · If the patent scope is applied for ultraviolet heating 9 · If the patent scope is for flexible printed circuit board 10 · For patent scope] | To align the glass substrate 11 · For patent scope E 1 2 · If you apply for a patent in May [on the chip to enhance the 1 1 · If you apply for a patent [outline curing polymer 1 4 · If you apply for a patent # 1: Silver paste, conductive rubber bumps and solder The method of item 7 further includes the step of conducting an adhesive from one end of the glass plate. The method of item 7, wherein the printed circuit board is the method of item 7, which uses a charge-coupled element, the chip, and the printed circuit board. The method of item 7 further includes using the glass substrate to wash the printed circuit board and the overhang. The method of item 7 includes the method of installing and dissipating heat from the heat sink. The method of item I of item J is that the frame material is made of purple material. Glue, gold 476122 6. Scope of patent application ^ 1 5 · —A flat display module that is a combination of a flat display and a printed circuit board that are electrically connected, at least including: a flat panel, the flat panel is made of a glass substrate, A silicon substrate and a liquid crystal material located between the glass substrate and the silicon substrate, wherein a length of the glass substrate is longer than a length of the silicon substrate so that a portion of the glass substrate in the longitudinal direction is not covered by the glass substrate. The silicon substrate is covered and a protrusion is formed on at least one side of the glass substrate; a plurality of metal wires are located at edges of a portion of the silicon substrate not covered by the liquid crystal material, and the metal wires are electrically conductive. Connect and seal a plurality of thin film transistors; a plurality of transparent wires, which are located on the overhangs of the glass substrate; there are a plurality of conductive-printed circuit board pads on the edge of the printed circuit board; and the configuration of the flat panel is The glass substrate is above and facing down, the silicon, the board is juxtaposed with the printed circuit board, and the flat board is A V-line, a conductive material-bonded board between the metal wires and the conductive pads, wherein the conductive pads on the printed circuit board can be electrically connected to the transparent wires on the glass substrate by the material: To the metal wires on the Shixi substrate. Close These transparent 1 6 · For the flat display module of item 5 of the patent, the material of the lead wire is indium tin oxide. Page 30 476122 6. Application for patent scope 1 7. For the flat display module and group of item 15 for patent application, the conductive material is one of the following: silver paste, conductive rubber, anisotropic conductive film, anisotropic Conductive adhesive, metal bumps and solder balls. 1 8. The flat display module according to item 15 of the patent application scope, wherein the printed circuit board is a flexible printed circuit board. 1 9. If the flat display module of item 15 of the patent application scope, the conductive material is a polymer material cured by ultraviolet rays. 20. The flat display module according to item 15 of the patent application scope further includes a heat sink located on the silicon substrate, and the heat sink is used to enhance heat dissipation. Page 31