JP4940731B2 - Solid-state imaging device and portable imaging device - Google Patents

Description

  The present invention relates to a solid-state imaging device using a solid-state imaging device such as a CCD or CMOS, and more specifically, a so-called chip-on-glass (Chip) in which an imaging surface of a solid-state imaging device is opposed to a glass substrate and connected to the glass substrate. on Glass) structure solid-state imaging device.

The solid-state imaging device as described above is arranged such that a glass substrate provided with necessary terminals and a microlens on the imaging surface face the glass substrate, and are connected to the terminals of the glass substrate by Au bumps or the like. And a rectangular solid-state imaging device. A photo-curing resin layer such as an epoxy resin is formed between the solid-state imaging device and the glass substrate to ensure the mechanical strength of the connection and prevent the entry of dust from the outside. At this time, if microlenses made of silicon resin or the like are filled with the resin layer, the optical properties of the microlenses are impaired because the refractive indexes of the microlenses are approximated. Therefore, after making the microlens face the glass substrate with a predetermined interval, a resin layer is provided between the glass substrate and the solid-state imaging device excluding the microlens installation area to form a sealed space. Is sealed in this sealed space. In this sealed space, air substantially the same as the external pressure is sealed (for example, Patent Document 1).
Japanese Patent Laid-Open No. 7-233104

  However, when the air sealed in the sealed space expands or contracts due to a change in temperature in the usage environment of the solid-state imaging device or the influence of heat generated by the solid-state imaging device, the solid-state imaging device that forms the sealed space In addition, since both the glass substrate and the resin layer are made of a hard material, there is a possibility that an excessive stress is applied to these members. If it does so, distortion will generate | occur | produce in a glass substrate or a solid-state image sensor, and there is a concern that an optical characteristic may fall, or each member may be damaged depending on the case.

  Therefore, an object of the present invention is to realize a solid-state imaging device that is less likely to cause such distortion and breakage.

The solid-state imaging device of the present invention is arranged such that a glass substrate provided with a required terminal and a microlens on the imaging surface facing the glass substrate with a predetermined interval and connected to the terminal of the glass substrate A solid-state imaging device comprising: an insulative member filled between the glass substrate and the solid-state imaging device excluding the microlens, wherein the microlens is sealed in a sealed space. The insulating member is provided with an opening through which the air enters and exits as the air in the sealed space expands and contracts, and has elasticity that spans the opening from the glass substrate to the solid-state imaging device. A film is provided, and the air in the sealed space is sealed by the film .

  In this way, since the opening of the insulating member is closed to allow the expansion and contraction of the air in the sealed space to allow, the temperature change occurs when the solid-state imaging device is used, and the air in the sealed space expands or Even if it shrinks, the air in the sealed space can enter and exit from the opening, and the glass substrate and the solid-state imaging device can be hardly deformed or damaged. In addition, since the opening is closed, there is no possibility that dust or the like enters the sealed space that seals the microlens.

  Note that the air in the sealed space is preferably in a condition close to the outside air environment when the solid-state imaging device is actually used, and the air from which dust or the like is excluded as much as possible is sealed at substantially the same pressure as the outside air pressure. In addition, the means for closing the opening needs to be able to cope with the entry and exit of air in the sealed space. In addition to directly covering with a flexible film, for example, communicating with an air damper may be considered.

  Further, the opening of the insulating member may be closed by an elastic film. In this case, expansion and contraction of the air in the sealed space can be permitted by expansion and contraction of the elastic film, and deformation and breakage of members around the imaging surface can be effectively prevented with a simple configuration. In addition, as a film | membrane which has elasticity, thin flexible materials, such as a film and rubber | gum, are preferable, for example.

  In addition, as for the way of providing the opening, after sealing the entire periphery of the solid-state imaging device with an insulating member, a hole may be made in a part of the insulating member, or the whole shape may be rectangular without sealing. The insulating member may not be formed on only a part of the periphery of the solid-state imaging device, for example, only one side. The film having elasticity is preferably a film having an adhesive layer formed on one side so that it can be easily formed and attached.

  In another solid-state imaging device of the present invention, a glass substrate provided with a required terminal, and a microlens on the imaging surface facing the glass substrate with a predetermined distance therebetween, and a terminal of the glass substrate A solid-state imaging device connected to the solid-state imaging device, wherein an insulating member is filled between the solid-state imaging device excluding the microlens and the glass substrate, and the microlens is sealed in a sealed space. An air holding layer surrounded by an elastic film is formed at least partially, and the insulating member is provided with an opening through which the air enters and exits as the air expands and contracts in the sealed space. The sealed space communicates with the air holding layer through the opening.

  In this way, since the air holding layer is configured to be surrounded by at least an elastic film, the volume of the air holding layer can be increased or decreased by expansion and contraction of the elastic film. Since the sealed space communicates with the air retaining layer, the volume of the air retaining layer can be increased or decreased according to the expansion and contraction of air in the sealed space, and the expansion and contraction of air in the sealed space can be allowed. become. Also, by increasing the volume of the air retention layer or increasing the elastic film's expansion / contraction rate, the allowable amount of air increase / decrease is increased, and the risk of deformation or breakage of the glass substrate or solid-state imaging device can be further reduced. it can.

  As a specific means for forming the air retaining layer, for example, a film having an adhesive layer formed on the periphery of one surface is used, and this film is attached to a glass substrate while taking in a predetermined amount of air, so that at least a glass substrate and An air retaining layer surrounded by the film is formed.

  As described above, according to the solid-state imaging device of the present invention, the opening of the insulating member is closed to allow the expansion and contraction of the air in the sealed space. In addition, it is possible to provide a solid-state imaging device with excellent performance without causing the members around the imaging surface to be deformed or damaged, and without having to worry about dust entering the imaging surface.

  Embodiments of the present invention will be described with reference to FIGS.

  The solid-state imaging device according to the present embodiment has a configuration as shown in FIG. 1, where 1 is a glass substrate on which a required terminal 2 is provided on one main surface, and 3 is mounted and arranged on one main surface of the glass substrate 1. The solid-state imaging device composed of a CCD or CMOS or the like, 4 is an Au bump for electrically connecting the terminal 12 of the solid-state imaging device 3 and the terminal 2 of the glass substrate 1, and 6 is a micro of the solid-state imaging device 3. It is a sealing resin layer as an insulating member that forms a sealed space 7 between the lens 5 and the glass substrate 1 surface.

  The terminal 2 of the glass substrate 1 includes an external connection electrode 2a, an electrode 2c connected to the terminal 12 of the solid-state imaging device 3 via the bump 4, and a wiring 2b that connects both the electrodes 2a and 2c. .

  The solid-state imaging device 3 includes a microlens 5 on the light receiving surface, and is mounted and arranged with the formation surface of the microlens 5 facing the glass substrate 1.

  The sealing resin layer 6 is formed, for example, by supplying a photocurable epoxy resin and irradiating light such as ultraviolet rays from the glass substrate side. A sealing space 7 is formed by the sealing resin layer 6, the solid-state imaging device 3, and the glass substrate 1, and the microlens 5 is sealed. In addition, the sealing resin layer 6 mechanically and firmly fixes the solid-state imaging device 3 and prevents dust from entering from the outside. In the sealed space 7, air from which dust or the like has been removed as much as possible is sealed at a pressure substantially equal to the external pressure.

  In the present embodiment, the air holding layer 8 is formed by providing the film 10 that is attached to the glass substrate 1 while covering the entire solid-state imaging device 3 and taking in predetermined air, and the sealing resin A through hole 9 is provided in the layer 6.

  The film 10 is made of a material such as a substantially rectangular PET formed larger than the size of the solid-state imaging device 3, covers the solid-state imaging device 3 from the upper surface, and takes a predetermined amount of air into the glass substrate 1. The outer peripheral portion is pasted to form the air retaining layer 8. The film 10 can be attached easily and firmly by using an off-the-shelf product on which an adhesive surface has been formed in advance, but the film 10 is attached so that dust does not enter the air retaining layer 8 from the outside. After that, it is preferable that a sealing agent 11 such as an adhesive is formed on the periphery of the film 10 to be surely sealed.

  As shown in FIG. 5, the through-hole 9 is provided so as to penetrate one place of the sealing resin layer 6 formed at the peripheral edge of the solid-state imaging device 3, and the sealed space 7 and the air holding layer 8 are formed. Communicate. The through-hole 9 only needs to be open at any part of the sealing resin layer 6. For example, the sealing resin layer may not be formed on only one side of the rectangular solid-state imaging element 3, or a solid The sealing resin layer 6 may be formed only at a predetermined number of places on the periphery of the image sensor 3.

  In the solid-state imaging device having the above configuration, the air holding layer 8 can permit the expansion and contraction of the gas in the sealed space 7 due to the flexibility of the film 10. Therefore, a temperature change occurs when the solid-state imaging device is used, and even if the air in the sealed space 7 expands or contracts, the members around the imaging surface (the glass substrate 1 and the solid-state imaging device 3) may be deformed or damaged. It can be difficult. Further, since the air retaining layer 8 communicates with the sealed space 7 and is blocked from the external space, there is no possibility that dust or the like enters the sealed space 7 that seals the microlens 5.

  Of course, the present invention is not limited to the above-described embodiment, and can be applied to all other uses.

  The air retaining layer 8 can take any other form as long as it communicates with the opening 9 and can be installed at any position.

  In addition, if the area of the film 10 is increased, a larger amount of change in the volume of the air holding layer 8 can be ensured, and the expansion and contraction of the air in the sealed space 7 can be dealt with more reliably. . On the contrary, even if the opening of the through hole 9 is simply closed with the film 10 without providing the air retaining layer 8, the expansion and contraction effect of the film 10 is exhibited, and the expansion and contraction of the air in the sealed space 7 can be dealt with. .

  Further, the through hole 9 is not limited to the configuration in which the hole is formed in the sealing resin layer 6. For example, a duct penetrating the sealing resin layer 6 may be separately provided.

  The present invention is suitable as a solid-state imaging device built in various portable imaging devices that are extremely small and have a large temperature change depending on the usage environment.

Sectional drawing of the solid-state imaging device concerning embodiment of this invention AA sectional view of FIG. The top view which shows the terminal side of the glass substrate of the solid-state imaging device which concerns on the same embodiment The top view which shows the imaging surface side of the solid-state image sensor of the solid-state imaging device concerning the embodiment The top view which shows the state except the film of the solid-state imaging device concerning the embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Terminal 3 Solid-state image sensor 4 Bump 5 Micro lens 6 Sealing resin layer 7 Sealing space 8 Air holding layer 9 Through hole 10 Film 11 Sealing agent 12 Terminal

Claims (2)

A glass substrate provided with a required terminal; and a solid-state imaging device arranged so that a microlens on the imaging surface faces the glass substrate with a predetermined interval and connected to the terminal of the glass substrate. A solid-state imaging device in which an insulating member is filled between the solid-state imaging element excluding the microlens and the glass substrate, and the microlens is sealed in a sealed space,
The insulating member is provided with an opening through which the air enters and exits as the air in the sealed space expands and contracts, and an elastic film that spans the opening from the glass substrate to the solid-state imaging device. The solid-state imaging device is characterized in that air in the sealed space is sealed by the film . A portable imaging device comprising the solid-state imaging device according to claim 1.

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