JP2009251249A - Wafer-like optical device and manufacturing method thereof, electronic element wafer module, sensor wafer module, electronic element module, sensor module, and electronic information apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To more securely prevent an excessive adhesive from flowing into a lens side when a lens module of wafer level is bonded. <P>SOLUTION: A plurality of lenses 2 are disposed on a substrate 1 and a liquid stopping means 4 of stopping an adhesive from flowing into the side of the lenses 2 when the lens module is bonded to another lens module 10 is provided at respective peripheries of the plurality of lenses 2, so when the lens modules 10 are bonded together, the adhesive is stopped from flowing to the side of the lenses 2, thereby improving the yield. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a plurality of lenses for condensing incident light, or a wafer-like optical device comprising a plurality of optical elements for directing or reflecting outgoing light, or bending and guiding incident light in a predetermined direction, and a method for manufacturing the same. Corresponding to each lens, an imaging element having a plurality of light receiving units that photoelectrically convert image light from a subject to image, or a light emitting element for generating outgoing light corresponding to each optical functional element, and Electronic element wafer module in which a plurality of light receiving elements for receiving incident light are integrated (integrated), an electronic element module manufactured by batch cutting from this electronic element wafer module, and photoelectric conversion of image light from a subject An imaging device having a plurality of light-receiving portions for imaging and a lens for imaging incident light on the imaging device are formed into a plurality of modules (integrated). For example, a digital camera such as a digital video camera and a digital still camera, an image input camera such as an in-vehicle camera, a scanner, etc., in which an image input device such as an in-vehicle camera is used as an image input device such as an in-vehicle camera. The present invention relates to an electronic information device such as a facsimile, a camera-equipped mobile phone device and a portable terminal device (PDA), or a pickup device using the electronic element module in an information recording / reproducing unit.

  The sensor module as a conventional electronic element module of this type is mainly used as a camera module in a mobile phone device with a camera, a portable terminal device (PDA), a card camera, etc., ceramics, glass-filled epoxy resin, etc. A solid-state imaging chip having an imaging element as an electronic element having a plurality of light-receiving units that photoelectrically convert image light from the subject and image the subject on the mounting substrate, and forming incident light on the imaging device And a holder member to which a condenser lens for fixing is fixed. In this case, the solid-state imaging chip is disposed on the mount substrate and wire-bonded.

  On the other hand, recently, there is a demand for a method of performing batch processing at the wafer level for the purpose of reducing the production cost of camera modules, lenses, etc. In this case, it is necessary to manufacture the lens at the wafer level.

  For bonding wafer-level lens substrates with multiple lenses, heat or ultraviolet light (UV) is used to cure the adhesive between them and bond the two lens substrates. It is necessary to prevent the adhesive to enter into each lens.

  An example of a liquid stopping method for preventing the adhesive from flowing into one side is disclosed in Patent Document 1.

  FIG. 13 is a longitudinal sectional view schematically showing a conventional bonded disc disclosed in Patent Document 1. As shown in FIG.

  The conventional disk 100 is a disk-shaped disk such as a DVD, a Blu-ray disk, or an HD-DVD that reads and writes information. Large holes 103 and 104 for attaching the discs are respectively provided in the central portions of the two disk-like disc substrates 101 and 102. Annular recesses 105 and 106 are provided on the outer peripheral side of the disc mounting holes 103 and 104, respectively. These two disk substrates 101 and 102 are arranged opposite to each other and bonded together with an adhesive 107.

In such a manufacturing method limited to a disc such as a DVD, Blu-ray disc, or HD-DVD, when the two disc substrates 101 and 102 are bonded to each other by the annular recesses 105 and 106, the center portion Even if the adhesive 107 flows into the disk mounting holes 103 and 104 on the side, the adhesive 107 flows into and accumulates in the annular recesses 105 and 106 and overflows to the disk mounting holes 103 and 104. Protruding out is prevented.
JP 2006-244595 A

  If excess adhesive flows into the lens when bonding the wafer-level lens substrate, the adhesive may have a black light-blocking function, and the condensing function of the lens is greatly impaired. It is difficult to control the coating amount of the lens, and the plurality of lenses mounted on the lens substrate are small in size with a diameter of about 3 mm (2 mm to 5 mm). If excessive adhesive protrudes to the lens side, the lens may be covered. With this, the function as a lens cannot be achieved at all. As described above, when excess adhesive flows into the lens side, the optical efficiency of the solid-state imaging device is significantly lowered, and the yield is lowered.

  On the other hand, in the above conventional configuration, although it is configured so that excess adhesive does not protrude from the center hole side of the disk, it is at the wafer level where a plurality of small lenses targeted by the present invention are mounted. The lens substrate and a single disk-shaped disk such as a DVD, Blu-ray disc, HD-DVD or the like having a diameter of about 100 mm are completely different in configuration and function, and the technical field is also completely different. The lens substrate of the present invention does not have a large center hole like the above prior art disk.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and a wafer-like optical device that can more reliably prevent an excessive adhesive from flowing into the lens side in bonding of a wafer level lens substrate. Manufacturing method thereof, electronic element wafer module using the wafer-like optical device, sensor wafer module in which the electronic element using the wafer-like optical device is a solid-state image sensor, and individual electronic elements cut together from the electronic element wafer module It is an object to provide an electronic information device such as a camera-equipped mobile phone device that uses a module, an individual sensor module cut together from the sensor wafer module, and an electronic element module such as the sensor module as an image input device in an imaging unit. And

  In the wafer-like optical device of the present invention, a plurality of optical elements are disposed on a substrate, and the optical elements are bonded to the periphery of each of the plurality of optical elements when bonded to another wafer-like optical device. Liquid stopping means for preventing the inflow of the agent is provided, and thereby the above object is achieved.

  Further, preferably, a bonding tab is provided around each of the plurality of optical elements in the wafer-like optical device of the present invention, and the liquid stopper is provided in the tab on the optical element side. ing.

  Further preferably, the liquid stopper in the wafer-like optical device of the present invention is provided on the inner peripheral side of the rib part, and the outer peripheral side of the rib part is used as an adhesive region by the adhesive.

  Further, preferably, as a liquid stopper in the wafer-like optical device of the present invention, a cross-sectional shape of the bonding rib portion is configured to have a taper shape that decreases toward the outside from the optical element side.

  Further preferably, the liquid stopper in the wafer-like optical device of the present invention is constituted by a spiral or annular recess or projection.

  Further preferably, the cross-sectional shape of the concave portion or the convex portion in the wafer-like optical device of the present invention is any of a hemispherical shape, a triangular shape, an isosceles triangular shape, a square shape, a rectangular shape and a trapezoidal shape.

  Further preferably, the liquid stopper in the wafer-like optical device of the present invention is configured in any of a circular shape, an elliptical shape, a rectangular shape, a pentagonal shape, a hexagonal shape, and a polygonal shape in a plan view that is double or more or two or more rounds. Yes.

  Further, preferably, as a liquid stopper in the wafer-like optical device of the present invention, at least two layers from the rib portion toward the optical element side are prevented in order to prevent the adhesive from overflowing to the optical element side. Or the recessed part or convex part of 2 rounds is arrange | positioned.

  Further preferably, the optical element in the wafer-like optical device of the present invention is any one of a lens, a mirror optical element, a waveguide means, a prism, and a hologram element.

  Further preferably, the optical element in the wafer-like optical device of the present invention is made of a transparent thermosetting resin material or a photocurable resin material.

  Further preferably, in the wafer-shaped optical device of the present invention, the other wafer-shaped optical device of the present invention and each optical element position thereof are vertically aligned and bonded with an adhesive, and the liquid stopper The means are arranged vertically opposite to each other, or arranged vertically shifted from each other.

  Further, preferably, as the liquid stopper in the wafer-like optical device of the present invention, a recess is provided on the upper side with respect to the lower recess, or on the upper side with respect to the lower recess. A convex portion that can be inserted into the concave portion is provided.

  The method for producing a wafer-shaped optical device according to the present invention includes a resin molding step of resin-molding the wafer-shaped optical device according to the present invention, and aligning each optical element position between the resin-molded wafer-shaped optical devices, The liquid stopping means includes a bonding step in which the liquid stoppers are arranged opposite to each other or are shifted from each other and bonded together with an adhesive, whereby the above object is achieved.

  Preferably, the bonding step in the method for manufacturing a wafer-like optical device according to the present invention includes a nanoimprint method on the outside of the liquid stopping means, on at least one surface of the wafer-like optical devices, An adhesive application step of applying an adhesive by either a screen printing method or a dispensing method; and an adhesive curing step of curing the adhesive in a state where the wafer-like optical devices are opposed to each other and the adhesive is sandwiched between them. Have

  Further preferably, in the method of manufacturing a wafer-like optical device according to the present invention, the adhesive coating step includes at least the second concave portion or convex portion from the innermost circumference among the concave portions or convex portions formed as the liquid stopping means. The adhesive is applied to the outside.

  An electronic element wafer module of the present invention includes an electronic element wafer in which a plurality of electronic elements having through electrodes are disposed, a resin adhesive layer formed in a predetermined region on the electronic element wafer, and the electronic element wafer. A transparent cover member covered and fixed on the resin adhesive layer, and the one or laminated wafers of the present invention bonded and fixed on the transparent cover member so as to correspond to each of the plurality of electronic elements And the above-mentioned object can be achieved.

  Preferably, the electronic element in the electronic element wafer module of the present invention is an imaging element having a plurality of light receiving sections that perform image conversion by photoelectrically converting image light from a subject.

  Further preferably, the electronic element in the electronic element wafer module of the present invention has a light emitting element for generating outgoing light and a light receiving element for receiving incident light.

  The electronic element module of the present invention is cut from the electronic element wafer module of the present invention one by one or plural pieces, thereby achieving the above object.

  The sensor wafer module of the present invention includes a sensor wafer having a plurality of sensor chip portions having through electrodes, a resin adhesive layer formed in a predetermined region on the sensor wafer, and covering the sensor wafer, the resin adhesive layer A transparent cover member fixed on the surface of the wafer-like optical device according to the present invention, which is mounted and bonded and fixed on the transparent cover member so as to correspond to each of the plurality of imaging elements. An imaging device having a plurality of lens modules and the laminated wafer-like optical device according to the present invention, wherein each of the plurality of sensor chip units includes a plurality of light receiving units that photoelectrically convert image light from a subject. The above object is achieved by this.

  The sensor module of the present invention is cut from the sensor wafer module of the present invention one by one or more, and thereby the above object is achieved.

  The electronic information device of the present invention uses an electronic element module cut from the electronic element wafer module of the present invention as a sensor module in an imaging unit, thereby achieving the above object.

  The electronic information device of the present invention uses an electronic element module cut from the electronic element wafer module of the present invention for an information recording / reproducing unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, a plurality of optical elements, for example, lenses are arranged on the substrate, and the adhesive is prevented from flowing into the lens side when being bonded to another wafer-like optical device around each of the plurality of lenses. Liquid stop means is provided.

  In other words, when bonding lens modules as at least two or more wafer-level optical elements, liquid stoppers such as liquid stopper grooves are arranged around the lens arranged on the substrate in large numbers, and excess adhesive is removed. The movement is stopped by capturing in the stop groove, and the two lens substrates (lens modules) are bonded. At this time, the liquid stop groove (liquid stop means) disposed around the lens is formed in a spiral shape or an annular shape, and the liquid stop groove is formed at least twice around the lens to prevent the adhesive from entering. . As a result, it is possible to more reliably prevent excess adhesive from flowing into the lens when the wafer level lens substrate is bonded.

  As described above, according to the present invention, a plurality of lenses are arranged on the substrate, and the adhesive is prevented from flowing into the lens side when being bonded to another wafer-like optical device around each of the plurality of lenses. Since the liquid stopper is provided, the adhesive can be prevented from flowing into each lens side when the lens substrate as the optical element substrate is bonded, thereby improving the yield.

  Hereinafter, a lens module as a wafer-like optical device and a manufacturing method thereof according to the first embodiment of the present invention and a sensor wafer module as Embodiment 2 of an electronic element wafer module using the lens module as the wafer-like optical device will be described. In this case, the third embodiment of an electronic information device such as a mobile phone device with a camera, for example, in which the sensor module obtained by collectively cutting the sensor wafer module is used as an image input device in the imaging unit will be described in detail with reference to the drawings. Explained.

(Embodiment 1)
1A and 1B are a plan view and a partially enlarged view schematically showing a configuration example of a main part of a lens module according to Embodiment 1 of the present invention.

  In FIG. 1, a lens module 10 as a wafer-like optical device according to the first embodiment includes a transparent resin disc-like substrate 1 and a plurality of transparent resin lenses 2 (condensing lenses) as a plurality of optical elements. ) Are arranged in a matrix in the matrix direction, and a liquid stopper means is an adhesive inflow prevention means for preventing inflow of the adhesive for bonding to the lens 2 side around each of the plurality of lenses 2 (outside). Each is provided. Around the plurality of lenses 2, a rib portion 3 for bonding the lens modules 10 to each other is provided, and a liquid stopper 4 is provided on the rib portion 3 on the lens 2 side. The liquid stopper 4 includes a liquid stopper groove, and includes a spiral recess 4a or an annular recess 4b to prevent the adhesive from overflowing to the lens 2 side. In the spiral recess 4a or the annular recess 4b, in order to prevent the adhesive from overflowing to the lens 2 side reliably, double or more recesses are disposed at any location facing the lens 2 side. Reference numerals 21a and 21b are enlarged views of the lens plates cut from the lens module 10 and separated into individual pieces.

  Here, a method of bonding two lens modules 10 having the above configuration will be described in detail.

  First, in manufacturing a plurality of lenses 2 on the substrate 1 in the resin molding process, a spiral or annular recess having two or more rounds (here 2) around each lens 2 by a lens mold. 4a and 4b (groove parts) are molded simultaneously with the molding of each lens 2. The spiral or annular concave portions 4a and 4b (groove portions) around the lens may be present at both or one of the opposing positions of the two lens modules 10 (10a and 10b). When the concave portions 4a and 4b exist in both the upper and lower portions of the two lens modules 10, the upper lens module 10a in FIG. 3 has a spiral or annular concave portion 4a and 4b (around the lens 2). 4 is provided on the lower surface side, and the lower lens module 10b in FIG. 4 is provided with spiral or annular recesses 4a and 4b (groove portions) around the lens on the upper surface side. The recesses 4a and 4b of the means are positioned so as to face each other.

  Next, in the bonding process of the upper lens module 10a and the lower lens module 10b, the positions of the lenses 2 are aligned with each other for the upper and lower lenses, and the recesses 4a and 4b of the liquid stopper are formed. They are bonded together with an adhesive 5 so as to face each other. In this case, an adhesive application process and an adhesive curing process are performed.

  In the adhesive application process, as shown in FIG. 4, the liquid is applied to at least one of the upper lens module 10a and the lower lens module 10b (here, the upper surface of the lower lens module 10b). An adhesive 5 is applied to the bonding cord 3 opposite to the lens 2 side of each recess 4a and / or 4b of the stopping means. That is, the outer portion (outer peripheral side) of the two lens modules 10 (10a and 10b) other than the inner side of the double (or two-round) recesses 4a and / or 4b arranged around the lens 2 of one or both. The adhesive 5 is applied to the bonding core 3) by appropriately measuring the coating amount by any one of the nanoimprint method, the screen printing method, and the dispensing method.

  The adhesive 5 is applied in such a manner that the adhesive 5 is moved from the nozzle 7 of the inkjet 6 which is a dispensing device as shown in FIG. It is applied to the outside of the annular recesses 4a and 4b (grooves) while accurately controlling the amount of the adhesive 5. The rib part 3 has a step on the scribe line. However, if the rib part 3 has no step on the scribe line, the adhesive 5 is discharged onto the scribe line in a grid pattern and applied quickly. Also good.

  Further, the upper lens module 10a and the lower lens module 10b are aligned to face each other. In this case, the position of the lens module 10 (lens substrate) to be bonded with the periphery of the lens 2 as a sight is determined, and alignment is performed so that the two lenses 2 do not shift. After the alignment of the two lens substrates is completed, the upper and lower plates of the sticking equipment are lowered, and the adhesive 5 is stretched over the entire sticking surface and pasted.

  That is, from the state in which the adhesive 5 is sandwiched as shown in FIG. 6, pressure is applied to the upper lens module 10a and the lower lens module 10b as shown in FIG. . At this time, the adhesive 5 spreads on the upper surface of the bonding collar 3 around the lens 2 and fills the recesses 4a and / or 4b outside the liquid stopper 4, while the next inner liquid stopper. 4 flows into the respective recesses 4a and / or 4b, but the liquid flow of the adhesive 5 stops in each of the inner recesses 4a and / or 4b. The amount of the adhesive 5 is such that the liquid flow stops quantitatively. This prevents the adhesive 5 from protruding to the lens 2 side. As described above, the liquid stopper 4 of the present invention has a larger number of adhesives 5 than the adhesive 5 necessary for bonding, and the recesses 4a and / or 4b (liquid stopper) outside the liquid stopper 4 prepared in advance. Groove), and has an effect of stopping entering the lens 2 side.

  In the adhesive curing step, the resin material of the adhesive 5 may be either a UV curable type or a thermosetting type. As shown in FIG. 8, UV irradiation or heating treatment is performed in a state where the pressing is sufficiently performed to cure the adhesive. That is, the upper lens module 10a and the lower lens module 10b are bonded and pressurized, and heat or ultraviolet rays UV, here ultraviolet rays UV, are irradiated from above the upper lens module 10a made of a transparent resin ( Alternatively, the adhesive 5 may be cured by irradiating from below the lower lens module 10b made of a transparent resin, or from both upper and lower surfaces.

  As described above, according to the first embodiment, the plurality of lenses 2 are arranged on the substrate 1, and the lens 2 is disposed around each of the plurality of lenses 2 when being bonded to another lens module 10. Since the liquid stopping means 4 for preventing the inflow of the adhesive is provided, the inflow of the adhesive to each lens 2 side is prevented when the lens module 10 is bonded, so that the yield can be improved.

  In addition, although the spiral or annular recess 4a or 4b has been described as the liquid stopper in the first embodiment, the present invention is not limited to this, or together with this, as shown in FIG. As shown in FIG. 9 (b), the inner peripheral portion and the outer peripheral portion may have a concave portion that is connected (communication). Alternatively, as shown in FIG. 9C, the annular concave portion 4e may be a quadrangular annular shape in plan view, or may be a convex portion instead of the spiral or annular concave portions 4a to 4e. .

  In addition, although the isosceles triangle has been described as the cross-sectional shape of the concave portion of the liquid stopper 4 of the first embodiment, the shape is not limited to this, but may be any of a hemisphere, a triangle, a square, a rectangle, and a trapezoid. Good. Similarly, the cross-sectional shape of the convex portion of the liquid stopper 4 may be any of a hemispherical shape, an isosceles triangular shape, a triangular shape, a square shape, a rectangular shape, and a trapezoidal shape.

  In the first embodiment, the lens module 10 and another lens module 10 and the positions of the lenses 2 are vertically aligned and bonded together with the adhesive 5, and the liquid stoppers 4 are disposed to face each other. However, the liquid stoppers 4 may be arranged so as to be displaced from each other in the vertical position.

  Moreover, in the said Embodiment 1, although the case where the recessed part 4a was opposingly arranged by the upper side with respect to the lower recessed part 4b was demonstrated as the liquid stop means 4, it does not restrict to this but FIG.10 (a). As shown in the figure, rib (wall) convex portions 4f may be provided on the upper side of the lower concave portion 4g as dams that can be inserted (fit) into the lower concave portion 4g. . The opening size of the lower concave portion 4g is configured to be larger than the protruding size of the convex portion 4f.

  Furthermore, as a liquid stopper, as shown in FIG. 10B, the cross-sectional shape of the bonding rib portion 3 may be configured as a tapered portion 4h that decreases as it goes outward from the lens 2 side. By the taper-shaped portion 4h, when the adhesive 5 on the rib portion 3 is pressed, the force spreads outward so that the possibility of protruding to the lens 2 side is suppressed. A concave portion 4i (stepped portion) is provided along the outer peripheral side of the lens 2 on the inner peripheral edge of the bonding hook portion 3, and even if the concave portion 4i (stepped portion), Even if the upper adhesive 5 protrudes to the lens 2 side, the adhesive 5 is prevented from protruding to the lens 2 side by being stored in the recess 4i (stepped portion).

  Furthermore, in Embodiment 1 described above, the groove or rib structure of the liquid stopping means has been described as a circular shape in plan view of about double or two rounds, but is not limited to this, or together with this, an ellipse, square, pentagon, 6 It may be configured as either a square or a polygon. The groove (cross-sectional concave portion) or rib (cross-sectional convex portion) structure of the liquid stop means is not limited to double or double, but is triple or triple, quadruple or quadruple, or even multiple or multiple Also good.

  Furthermore, in the first embodiment, the lens 2, particularly the condenser lens, has been described as the optical element. Furthermore, in addition to the lens 2, the optical element may be any of a mirror optical element, a waveguide means, a prism, and a hologram element.

  Furthermore, in Embodiment 1 described above, the lens 2 as an optical element and the peripheral edge 3 of the periphery are integrally formed of a transparent photocurable resin material. Instead of the curable resin material, a transparent thermosetting resin material may be used.

  Here, as Embodiment 2 of the electronic element module manufactured by cutting the electronic element wafer module of the present invention as a batch, an imaging element having a plurality of light receiving portions that photoelectrically convert image light from a subject, and incident One or a plurality of lens modules (which may include the lens module 10 of the first embodiment described above) for imaging light on an image sensor are cut into a plurality of modules (integrated). A case where the present invention is applied to a sensor module manufactured in a batch will be described in detail with reference to FIG.

(Embodiment 2)
FIG. 11 is a longitudinal cross-sectional view illustrating an exemplary configuration of a main part of a sensor module according to Embodiment 2 of the present invention.

  In FIG. 11, the sensor module 50 according to the second embodiment is provided with an imaging element 51 a including a plurality of light receiving units, which are photoelectric conversion units (photodiodes) corresponding to a plurality of pixels, as an electronic element on the wafer chip surface. The through-hole 51b is provided between the front surface and the back surface of the through-wafer 51, which is conductive, the resin adhesive layer 52 formed on the periphery of the imaging element 51a of the through-wafer 51, and the cover that covers the resin adhesive layer 52 A glass plate 53 as glass, and a lens plate 20 provided on the glass plate 53 and laminated with a plurality of lens plates 21b, 22 and 23 as optical elements for condensing incident light on the image sensor 51a; The lens adhesive layers 55 and 56 for adhering and fixing these lens plates 21b, 22 and 23, and the lens plates 21b, 22 and 23 A central portion of the uppermost lens plate 21b as a circular light inlet, and a light shielding member 57 that shields the other surface portions and the side surfaces of the lens plates 21b, 22 and 23 and the glass plate 53. On the through wafer 51, the glass plate 53 and the lens plate 20 are vertically aligned by the resin adhesive layer 52 and the lens adhesive layers 55 and 56, etc., aligned in this order. The sensor module 50 according to the second embodiment includes a through wafer 51, a resin adhesive layer 52, a glass plate 53, and a plurality of lens plates 20 (from a plurality of lens modules including the lens module 10 according to the first embodiment). The wafer-level sensor wafer module to which the lens adhesive layers 55 and 56 are bonded together is cut, and then a light shielding member 57 is attached to the wafer-level sensor wafer module from the upper side to manufacture the wafer individually. .

  The sensor wafer module is provided with a plurality of imaging elements 51a (a plurality of light receiving portions constituting a plurality of pixels for each imaging element) on each surface side of the sensor wafer provided with the plurality of through wafers 51 before cutting. ) Are arranged in a matrix, and the thickness of the through wafer 51 is 100 to 200 μm, and a plurality of through holes 51b penetrating from the back surface of the through wafer 51 under the front surface pads are formed. The side wall and the back surface side of the through hole 51b are covered with an insulating film, and a wiring layer having a contact with the pad is formed to the back surface through the through hole 51b. Solder resist is formed on the wiring layer and the back surface, and the solder ball is formed on the wiring layer by opening the solder resist and exposing the solder ball to the outside. Each layer can be formed by various techniques such as photolithography, etching, plating, and CVD methods used in ordinary semiconductor processes. After the wafer is cut, a sensor substrate (sensor chip portion as an electronic element chip portion) having an element region at the center is formed as the through wafer 51.

  The resin adhesive layer 52 is formed at a predetermined location on the penetrating wafer 51 by a normal photolithography technique, and a glass plate 53 is adhered thereon. In addition to the photolithography technique, the resin adhesion layer 52 is formed by using a screen printing technique or a dispensing technique. can do. The resin adhesive layer 52 has a shallow groove (air path) formed on a part of the surface on the side to which the glass plate 53 is fixed. This groove can be formed simultaneously with the photolithographic technique when the resin adhesive layer 52 is formed. The resin thickness is about 30 μm to 300 μm, and the depth of the groove is about 3 μm to 20 μm. When the upper surface of the semiconductor is covered with the glass plate 53, the groove seals the internal space of the sensor region in which the imaging element 51a as the electronic element on the through wafer 51 is provided, so that condensation does not occur there. However, when dicing into individual modules later, cutting water, slurry, etc. enter the inner space of the sensor area and have a space area in the middle so that it is difficult to adhere to the sensor surface. It has a structure. The groove (air path) for making the space region semi-sealed has a certain distance by making it an oblique straight line, an S-shape or a maze (here, an oblique straight line), or a combination thereof. I will let you.

  Further, here, the resin adhesive layer 52 is not only formed with a groove for communicating with the outside from the space region on each of the plurality of image pickup devices 51a, but also with another space region that communicates with the space region. A groove for communicating with the outside is further formed through the space region. The resin adhesive layer 52 is disposed for each image sensor 51a, and is disposed on a region other than the region of the image sensor 51a and on a region other than the dicing region between the adjacent image sensors 51a. Not limited to the groove of the resin adhesive layer 52, other air paths may be provided, and the material structure can communicate with the inside in terms of material (material particles are coarse or moisture can be passed through the outside and the inside as an air path) Material).

  The lens plate 20 is a transparent resin lens plate, which may include one cut from the lens module 10 of the first embodiment, and has the same configuration as that of the first embodiment. The lens plate 20 is composed of a lens region having a lens function, and a rib portion 3 (bonding rib portion) around the lens as a spacer portion having a spacer function, and the whole is formed of the same type of resin material. Has been.

  As described above, the molding upper mold and the molding lower mold may be glass molds or metal molds. The second embodiment has a structure in which three formed lens plates 21b, 22 and 23 are bonded together at the rib portion. Adhesive members 55 and 56 are used for the bonding, but the adhesive members 55 and 56 may have a light shielding function.

  The plurality of lens plates 54 as optical elements are the aberration correction lens 23, the diffusion lens 22, and the condenser lens 21b (or 21a) (in the case of a single lens), the lens plate 20 is in the center portion. A lens region is provided, and a flange portion as a lens peripheral portion, which is a spacer portion having a predetermined thickness, is provided on the outer peripheral side of the lens region, and provided on each outer peripheral side of the lens plate 20. In addition, the spacer portions (the rib portions 3) having a predetermined thickness are arranged in this order from the bottom. The spacer portion (the rib portion 3) has a positioning function, and the positioning function is constituted by a tapered concave portion and a convex portion or an alignment make. The adhesive layers 55 and 56 that adhere the three lens plates 20 may also serve as a light shielding function, and the adhesive layers 55 and 56 may contain a solid that determines a space.

Next, a completed product using this electronic element module is referred to as Embodiment 3, and the sensor module 50 of Embodiment 2 is used as an imaging unit, or another electronic element module is used as an information recording / reproducing unit, for example. The device will be described in detail as a third embodiment with reference to the drawings.
(Embodiment 3)
FIG. 12 is a block diagram illustrating a schematic configuration example of an electronic information device using the sensor module 50 according to Embodiment 2 of the present invention as an imaging unit as Embodiment 3 of the present invention.

  In FIG. 12, an electronic information device 90 of the third embodiment includes a solid-state imaging device 91 that obtains a color image signal by performing various signal processing on the imaging signal from the sensor module 50 of the second embodiment, and the solid-state imaging device 91. A memory unit 92 such as a recording medium that can record data after the predetermined color image signal is processed for recording, and a liquid crystal display after the color image signal from the solid-state imaging device 91 is processed for predetermined display Display means 93 such as a liquid crystal display device which can be displayed on a display screen such as a screen, and a transmission / reception device which can perform communication processing after performing predetermined signal processing for color image signals from the solid-state imaging device 91 for communication Communication means 94 and image output means 95 such as a printer. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic device having an image input device such as an image input camera, a scanner, a facsimile, a camera-equipped mobile phone device and a personal digital assistant (PDA) is conceivable.

  Therefore, according to the third embodiment, based on the color image signal from the solid-state imaging device 91, it is displayed on the display screen, or is printed out on the paper by the image output device 95. (Printing), communicating this as communication data in a wired or wireless manner, performing a predetermined data compression process in the memory unit 92 and storing it in a good manner, or performing various data processings satisfactorily Can do.

  Note that the electronic information device 90 is not limited to the electronic information device 90 of the third embodiment, and may be an electronic information device such as a pickup device using the electronic element module of the present invention for an information recording / reproducing unit. The optical element of the pickup device in this case is an optical functional element (for example, a hologram optical element) that causes the outgoing light to go straight and output, and also bends the incident light and makes it incident in a predetermined direction. Further, the electronic elements of the pickup device include a light emitting element (for example, a semiconductor laser element or a laser chip) for generating emitted light and a light receiving element (for example, a photo IC) for receiving incident light.

  Although not described in detail in the first embodiment, a plurality of optical elements, for example, lenses 2 are arranged on the substrate, and a separate wafer-like optical device is provided around each of the plurality of lenses 2. A liquid stopper 4 is provided to prevent the adhesive 5 from flowing into the lens 2 when the lens module 10 is bonded. Further, a bonding core 3 is provided around each of the plurality of lenses 2, and a liquid stopper 4 is provided in the lens 3 on the lens 2 side. This liquid stop means 4 is provided on the inner peripheral side of the rib portion 3, and the outer peripheral side of the rib portion 3 is used as an adhesive region by the adhesive 5. Thus, the object of the present invention can be achieved, which can improve the yield by preventing the adhesive from flowing into each lens side when the lens module is bonded.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-3 of this invention, this invention should not be limited and limited to this Embodiment 1-3. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 3 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to a plurality of lenses for condensing incident light, or a wafer-like optical device comprising a plurality of optical elements for directing or reflecting outgoing light, or bending and guiding incident light in a predetermined direction, and a method for manufacturing the same. Corresponding to each lens, an imaging element having a plurality of light receiving units that photoelectrically convert image light from a subject to image, or a light emitting element for generating outgoing light corresponding to each optical functional element, and Electronic element wafer module in which a plurality of light receiving elements for receiving incident light are integrated (integrated), an electronic element module manufactured by batch cutting from this electronic element wafer module, and photoelectric conversion of image light from a subject An imaging device having a plurality of light-receiving portions for imaging and a lens for imaging incident light on the imaging device are formed into a plurality of modules (integrated). For example, a digital camera such as a digital video camera and a digital still camera, an image input camera such as an in-vehicle camera, a scanner, etc., in which an image input device such as an in-vehicle camera is used as an image input device such as an in-vehicle camera. In the field of electronic information equipment such as a facsimile, a mobile phone device with a camera and a portable terminal device (PDA) or a pickup device using this electronic element module for an information recording / reproducing unit, a plurality of lenses are disposed on a substrate, Around each of the multiple lenses, there is a liquid stopper that prevents the inflow of adhesive to the lens side when bonding with another lens module. The inflow of the adhesive is prevented and the yield can be improved.

It is the top view and partial enlarged view which show typically the example of a principal part structure of the lens module which concerns on Embodiment 1 of this invention. It is the longitudinal cross-sectional view which shows typically the principal part structural example which shows the upper use of the lens module of FIG. 1, and a principal part enlarged view. It is the longitudinal cross-sectional view which shows typically the principal part structural example which shows the downward use of the lens module of FIG. 1, and a principal part enlarged view. It is the longitudinal cross-sectional view and principal part enlarged view which show typically the adhesive agent application | coating process at the time of bonding of the lens module of FIG. It is a figure for demonstrating the dispensing method in the adhesive agent application process of FIG. It is the longitudinal cross-sectional view and principal part enlarged view which show typically the alignment process at the time of bonding of the lens module of FIG. It is the longitudinal cross-sectional view and principal part enlarged view which show typically the press process at the time of bonding of the lens module of FIG. It is the longitudinal cross-sectional view and principal part enlarged view which show typically the adhesive agent hardening process at the time of bonding of the lens module of FIG. (A)-(c) is a top view which shows typically the shape of the liquid stop means of the lens module of FIG. (A) And (b) is a longitudinal cross-sectional view which shows typically the other shape of the liquid stop means of the lens module of FIG. It is a longitudinal cross-sectional view which shows the principal part structural example of the sensor module which concerns on Embodiment 2 of this invention. As Embodiment 3 of this invention, it is a block diagram which shows the schematic structural example of the electronic information apparatus which used the sensor module 50 of Embodiment 2 of this invention for the imaging part. It is a longitudinal cross-sectional view which shows typically the conventional bonding disc currently disclosed by patent document 1. FIG.

Explanation of symbols

1 Substrate 2 Lens 2 (Condenser lens)
DESCRIPTION OF SYMBOLS 3 Kobo part 4 Liquid stop means 4a Spiral recessed part 4b Annular recessed part 4c Annular recessed part which has a connection recessed part 4d The rectangular recessed part 4e in a planar view 4e The annular recessed part 4f in a planar view 4f Rib-like convex part 4g Lower concave portion 5 Adhesive 6 Inkjet 7 Nozzle 10, 10a, 10b Lens module 50 Sensor module 51 Through wafer 51a Image sensor 51b Through hole 52 Resin adhesive layer 53 Glass plate 20, 21a, 21b, 22, 23 Lens plate 55 56 Adhesive layer (adhesive)
57 light-shielding member 90 electronic information device 91 solid-state imaging device 92 memory unit 93 display means 94 communication means 95 image output means

Claims (23)

  A plurality of optical elements disposed on the substrate, and a liquid stopper that prevents the adhesive from flowing into the optical element side when the optical elements are bonded to each other around each of the plurality of optical elements. A wafer-like optical device.   2. The wafer-like optical device according to claim 1, wherein a bonding portion is provided around each of the plurality of optical elements, and the liquid stopper is provided on the optical portion side. .   The wafer-like optical device according to claim 2, wherein the liquid stopping means is provided on an inner peripheral side of the rib part, and an outer peripheral side of the rib part is used as an adhesive region by the adhesive.   The wafer-like optical device according to claim 2 or 3, wherein the liquid stopper is configured such that a cross-sectional shape of the bonding rib portion is tapered as it goes outward from the optical element side.   The wafer-like optical device according to any one of claims 1 to 3, wherein the liquid stopper is formed of a spiral or annular concave portion or convex portion.   The wafer-like optical apparatus according to claim 5, wherein a cross-sectional shape of the concave portion or the convex portion is any one of a hemispherical shape, a triangular shape, an isosceles triangular shape, a square shape, a rectangular shape, and a trapezoid shape.   7. The liquid stopping means according to any one of claims 1, 5, and 6, wherein the liquid stopping means is configured in any of a circular shape, an elliptical shape, a quadrilateral shape, a pentagonal shape, a hexagonal shape, and a polygonal shape in a plan view having two or more or two or more rounds. The wafer-like optical device as described.   In order to prevent the adhesive from overflowing to the optical element side as the liquid stopping means, at least double or double concave or convex portions are arranged from the rib portion toward the optical element side. The wafer-like optical device according to claim 1.   The wafer-like optical apparatus according to claim 1, wherein the optical element is any one of a lens, a mirror optical element, a waveguide unit, a prism, and a hologram element.   The wafer-like optical device according to claim 1, wherein the optical element is made of a transparent thermosetting resin material or a photocurable resin material.   The wafer-like optical device according to any one of claims 1 to 10, the other wafer-like optical device according to any one of claims 1 to 10, and the position of each optical element aligned vertically to form an adhesive. A wafer-like optical device in which the liquid stoppers are disposed so as to face each other in the vertical direction or are displaced from each other in the vertical direction.   As the liquid stopper, a concave portion is provided on the upper side with respect to the lower concave portion, or a convex portion that can be inserted into the concave portion is provided on the upper side with respect to the lower concave portion. The wafer-like optical device according to claim 11.   A resin molding step of resin-molding the wafer-like optical device according to any one of claims 1 to 10, and aligning each optical element position between the resin-molded wafer-like optical devices, and the liquid stopping means are mutually connected A method for manufacturing a wafer-like optical device, comprising: a bonding step in which the wafers are arranged to face each other or are shifted from each other and bonded together with an adhesive. The bonding step includes
An adhesive application step of applying an adhesive by any one of a nanoimprint method, a screen printing method, and a dispensing method on the outer side of the liquid stopping unit with respect to at least one of the wafer-like optical devices;
The method for manufacturing a wafer-shaped optical device according to claim 13, further comprising an adhesive curing step of curing the adhesive in a state where the wafer-shaped optical devices are opposed to each other and the adhesive is sandwiched therebetween.   The wafer according to claim 14, wherein in the adhesive application step, the adhesive is applied to at least the second concave or convex portion from the innermost circumference among the concave or convex portions formed as the liquid stopper. Method for manufacturing a cylindrical optical device. An electronic element wafer on which a plurality of electronic elements having through electrodes are disposed;
A resin adhesive layer formed in a predetermined region on the electronic element wafer;
A transparent cover member covering the electronic element wafer and fixed on the resin adhesive layer;
11. One or a plurality of laminated wafer-like optical devices according to any one of claims 1 to 10, which are bonded and fixed on the transparent cover member so as to correspond to the plurality of electronic elements, respectively. An electronic element wafer module comprising the laminated wafer-like optical device described in 1.   The electronic device wafer module according to claim 16, wherein the electronic device is an image pickup device having a plurality of light receiving portions that pick up an image by photoelectrically converting image light from a subject.   The electronic element wafer module according to claim 16, wherein the electronic element includes a light emitting element for generating outgoing light and a light receiving element for receiving incident light.   The electronic element module cut | disconnected from the electronic element wafer module in any one of Claims 16-18 for every one or plurality. A sensor wafer provided with a plurality of sensor chip portions having through electrodes;
A resin adhesive layer formed in a predetermined region on the sensor wafer;
A transparent cover member covering the sensor wafer and fixed on the resin adhesive layer;
11. One or a plurality of laminated lenses as the wafer-like optical device according to claim 1, mounted on the transparent cover member so as to correspond to the plurality of imaging elements, and fixed by adhesion. A module, and the laminated wafer-like optical device according to claim 11 or 12,
Each of the plurality of sensor chip units is a sensor wafer module provided with an imaging device having a plurality of light receiving units that photoelectrically convert image light from a subject to image.   The sensor module cut | disconnected from the sensor wafer module of Claim 20 for every one or plurality.   An electronic information device using an electronic element module cut from the electronic element wafer module according to claim 17 as a sensor module in an imaging unit.   An electronic information device using an electronic element module cut from the electronic element wafer module according to claim 18 in an information recording / reproducing unit.