JPH0990243A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device capable of improving assembly workability by easily and surely molding a flexible board. SOLUTION: An image pickup part 18 constituted by integrating an objective optical system 14 and a solid-state image pickup element 17 is incorporated and fixed in a tip main body frame 22 forming the tip hard part 6 of an electronic endoscope. Folded parts 61 and 48 are formed on the flexible circuit board 43 which is connected to the element 17 and coaxial cables 19a and 19b and on which a chip capacitor 49 is mounted. They are respectively folded by 180 deg. and by 45 deg. along land parts 47b and 48b, and fixed by soldering, whereby the folded parts 47 and 48 holding a bent shape are easily molded and assembly work is simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus in which the assembling property of an image pickup section of an electronic endoscope is improved.

[0002]

2. Description of the Related Art In recent years, with the aim of reducing the diameter and size of electronic endoscopes, high-density mounting has been promoted in the image pickup section on which electronic components are mounted. As an example thereof, Japanese Patent Laid-Open No. 4-197
As disclosed in 334, the flexible substrate is bent to mount electronic components and route cables in a limited space at the tip of the endoscope.

In particular, in FIG. 3, the flexible substrate is folded back by 180 °, and further, the flexible substrate is folded along the prism by 1 °.
It is shown that the space is three-dimensionally folded by bending at 35 °.

[0004]

However, in consideration of this assembling work, if the flexible substrate is folded back by 180 °, the circuit may be broken, and 1
It may be difficult to solder the cable in an unstable state while bending it by 35 °.

The present invention has been made in view of the above points, and it is an object of the present invention to provide an image pickup apparatus capable of easily and surely setting a flexible substrate in a molding state and improving assembly workability.

[0006]

According to the present invention, an objective optical system, an image sensor arranged at its image forming position, and a flexible substrate on which electronic parts are mounted, bent and connected to the image sensor are provided. In the image pickup device, by providing a soldering land portion on the bent portion of the flexible board and forming a molding means for fixing the land portion by soldering, the bent portion of the flexible board is soldered in a simple and short time. The work can be formed into a shape that maintains the bent state, and the subsequent work such as soldering of the cable is easy because the bent portion is fixed.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below with reference to the drawings. (First Embodiment) FIGS. 1 to 5 relate to a first embodiment of the present invention, and FIG. 1A shows a distal end portion (hard tip end portion) of an insertion portion including the first embodiment. The configuration is shown in a cross section along the insertion direction, FIG. 1B is a cross section taken along the line AA of FIG. 1A, FIG. 2 shows the entire videoscope, and FIG. 3 is a cable to a flexible printed circuit board. FIG. 4A is a wiring diagram, FIG. 4A shows the appearance before the flexible printed circuit board is bent, and FIG. 4B shows the appearance before the flexible printed circuit board is bent.
FIG. 5A is a plan view showing the configuration of the image pickup section, and FIG. 5B is a perspective view showing the image pickup section.

As shown in FIG. 2, a videoscope (or electronic endoscope) 1 incorporating the image pickup apparatus of the first embodiment 1
Is an elongated and flexible insertion portion 2, a wide operation portion 3 formed at the rear end of the insertion portion 2, a universal cord portion 4 extended from the operation portion 3, and the universal cord It is composed of a scope connector section 5 provided at the end of the section 4.

The insertion portion 2 is formed at the distal end portion of the rigid distal end hard portion 6 and at the rear end of the distal end rigid portion 6, and is provided with a bendable bending portion 7 and a rear end of the bending portion 7. To a front end of the operation portion 3 from a flexible portion (soft portion) 8. The operation portion 3 is provided with an angle knob 8a, and by performing an operation of rotating the angle knob 8a, the bending portion 7 can be bent in the vertical and horizontal directions.

The scope connector portion 5 is provided with a light guide entrance end 9 and an electric contact portion 10. By connecting the light guide entrance end 9 to a light source device (not shown), illumination light is supplied from a lamp in the light source device, and the supplied illumination light is transmitted to the exit end side by the light guide bundle 11 (see FIG. 1). To do. The light guide bundle 11 is inserted into the universal cord portion 4, the operating portion 3, and the insertion portion 2, and the emitting end is fixed to the illumination window 12 of the tip portion 6 and emits the illumination light transmitted through the illumination window 12. ,
Illuminate an object such as an affected area.

An observation window 13 is formed adjacent to the illumination window 12, and the observation window 13 has a lens frame 15 as shown in FIG.
An objective optical system 14 (forming an optical image of an illuminated object) is attached via a, 15b, and 15c. On the rear side of the objective optical system 14, the lens frame 15c and the element frame 1 are provided.
6 is attached, and a solid-state image pickup device 17 such as a CCD as an image sensor having a photoelectric conversion function is attached to the element frame 16 to form an image pickup unit 18, that is, the image pickup apparatus according to the first embodiment. ing.

The image pickup section 18 has a coaxial cable 19a,
One end of 19b is connected, and these coaxial cables 19a and 19b are inserted through the insertion part 2, the operation part 3 and the universal cord part 4 and the other end is connected to the electric contact part 10. The contact portion 10 is connected to a camera control unit (or a video processor) via a scope cable (not shown), performs signal processing on the solid-state image sensor 17, generates a video signal, and displays an image of an object on a monitor (not shown). .

A forceps insertion port 20 is provided near the tip of the operating portion 3. The forceps insertion port 20 communicates with a channel tube 21a forming an internal forceps insertion channel 21. By inserting, the distal end side of the forceps can be projected from the distal end opening of the forceps insertion channel 21 and a treatment for medical treatment can be performed.
The tip of the channel tube 21a is connected to a forceps insertion pipe 23a fixed to the rear end side of the forceps insertion hole 23 provided in the tip body frame 22 as shown in FIG.

As shown in FIG. 1, the tip end side of the tip body frame 22 is provided with an air / water feed nozzle 24 via a nozzle protection member 25.
A tip cover 26 that covers the tip body frame 22 is attached. The air / water feed nozzle 24 communicates with an air / water feed hole 27 provided in the tip body frame 22, and an air / water feed pipe 28 is attached to the rear end of the air / water feed hole 27. The tip of an air supply / water supply tube 29 is connected to the water supply pipe 28, and by supplying air or water through the air supply / water supply tube 29, from the air supply / water supply nozzle 24 to the air supply / water supply nozzle 24. Opposing objective optical system 14
The outer surface of the first lens 30 is sprayed with air or water so that dirt and the like can be removed.

A cooling horizontal conduit 31 and a cooling vertical conduit 32 for cooling the image pickup section 18 are formed on the rear end side of the tip body frame 22, and a cooling tube 33 is connected to the cooling vertical conduit 32. The cooling water can flow through the cooling tube 33. A first bending piece 34 is fixed to the outer peripheral surface on the rear end side of the tip body frame 22, and a second bending piece (not shown) is rotatably connected to the rear end of the first bending piece 34. A bending portion rubber 35 is attached to the outer circumference of these bending pieces.

The objective optical system 14 and the solid-state image pickup device 17
The image pickup unit 18 in which the above are integrated is an image pickup unit insertion hole 36 formed in the tip body frame 22 (see FIG. 1B, 3 in FIG. 1A).
6a and 36b) is inserted from the rear of the tip body frame 22 and fixed to the tip body frame 22 with a screw or the like (not shown).

A field lens 37 and an infrared cut filter 38 for cutting infrared light are provided on the image plane side on the rear side of the objective optical system 14 so that the optical axis (parallel to the longitudinal direction of the insertion section 2) is oriented at a right angle. The prisms 39 to be changed are sequentially arranged so as to form an image on the solid-state image pickup device 17 (so-called horizontal placement) arranged in parallel with the longitudinal direction (or axial direction) of the insertion portion 2.

The front shapes of the field lens 37 and the infrared cut filter 38 are substantially the same as the front shape of the prism 39, and as shown in FIG. 1B which is a cross section taken along the line AA of FIG. It is a hexagonal shape that is scraped off. Also,
The shield frame 40 attached to the rear end of the element frame 16 and the rear end of the imaging section insertion hole 36 have substantially the same shape, but the shield frame 40 at the rear end of the element frame 16 is larger than the prism 39, and the rear end of the element frame 16 is The shield frame 40 is fitted, and the imaging unit insertion hole 3
The rear end of 6 is formed to be larger than the insulating heat-shrinkable tube 41 covered with the shield frame 40.

The field lens 37, the infrared cut filter 38, and the prism 39 are adhered by an ultraviolet curable adhesive.

As shown in FIGS. 5A and 5B, the back surface of the solid-state image pickup device 17 is adhesively fixed to the front end side of the ceramic substrate 42, and the flexible circuit board 4 is attached to the rear end thereof.
3. The IC chip 44 is also adhered. Solid-state imaging device 17, flexible circuit board 43, solid-state imaging device 17 and IC
The chips 44, 44 and the flexible circuit board 43 are directly wire-bonded via the bonding wires 45.

Further, the prism 39 and the solid-state image pickup device 17, which are arranged so as to overlap with the light receiving surface of the solid-state image pickup device 17, are adhered to each other by, for example, an ultraviolet curing adhesive which is cured by ultraviolet rays. Make sure that the positional relationship is as shown below.

That is, the prism 39 is the solid-state image pickup device 1
The front end side and the left side (when viewed from the front end) are adhered and fixed to 7, and the prism 39 is housed inside together with the solid-state image sensor 17 with respect to the ceramic substrate 42. At this time, the light receiving portion (or photoelectric conversion portion) 46 of the solid-state image pickup device 17 is entirely covered by the prism 39. The wire bonding portion (hatched portion in FIG. 5A) and the solid-state imaging device 17 are sealed so that the entire surface is covered with resin.

As shown in FIG. 1, the flexible circuit board 4
3 is bent 180 degrees by a bending fixing portion 47, is further bent 45 degrees in the opposite direction by a bending fixing portion 48 in the middle of this bending side, and extends obliquely upward along the slope of the prism 39.

Lands 47b and 48b (only one on the front side is shown in FIG. 1A) are provided on the bent portions, respectively, and soldering is performed on the lands 47b and 48b. By fixing it to the bent shape, the coaxial cable 19a,
Forming means suitable for assembly or mounting to connect with 19b.

The flexible circuit board 43 has a circuit as shown in FIG. 4, which will be described later, and a total of eight chip capacitors 49.
Has been implemented. The chip capacitor 49 is arranged on the side (rear end side) opposite to the prism 39 with respect to the bending fixing portion 48.

Flexible circuit board 43 and prism 3
9. The space surrounded by the ceramic substrate 42 is filled with resin to be reinforced mechanically and moisture resistant. The flexible circuit board 43 has the same width as the ceramic board 42, and the front end side is cut out by the length of the IC chip 44.
Is formed. Flexible circuit board 4
When 3 is adhered to the ceramic substrate 42, the widths thereof are matched with each other, and the tip side is aligned with the IC chip 44.

The prism 39, the solid-state image pickup device 17, and the ceramic substrate 42 are attached to each other while accurately positioning them by using alignment marks provided on the solid-state image pickup device 17 (not shown).

FIG. 3 shows the wiring situation. Coaxial cable 19
a has three coaxial core wires 50 and four single wires 51, and the coaxial cable 19b has two coaxial core wires 50 and five single wires 51.
have. The coaxial cable 19a is positioned above the coaxial cable 19b and in the distal direction,
The coaxial cables 19a and 19b are placed inside both ends of the chip capacitors 49 arranged in two rows.

At the front end side of the total shielded wire 52 of the coaxial cables 19a and 19b, it floats as shown in FIG. 3, but at the rear end not shown, it is connected to the housing of the camera control unit and grounded as GND. Single line 5
1 is connected to one electrode of the chip capacitor 49 and an analog ground pad 54 provided at the end of the flexible circuit board 43, the core wire 59 of the coaxial core wire 50 to the signal pad 53, and the coaxial shield wire 51 to the analog ground pad 54. Alternatively, they are collectively connected to the digital ground pad 55.

FIG. 4 shows a circuit of the flexible circuit board 43. The flexible circuit board 43 is a five-layer tape having circuits on both sides. 4A is the front surface and FIG. 4B is the back surface. The surface where the solid-state imaging device 17 and the IC chip 44 are bonded is the back surface, and the portions indicated by reference numerals 47a and 47b that form the bending fixing portions 47 at both ends of the circuit (the bending fixing portions 47 are formed by fixing them by soldering. Land area).

One land portion 47a for forming the bent fixing portion 47 is electrically connected to the analog ground 56, and the land portion 47b is provided on the power supply pattern. The flexible circuit board 43 is bent by 180 ° along the line, but if the cream solder is applied after bending and a soldering iron is applied from both sides,
The land portions 47a and 47b can instantly fix the shape (bent shape of 180 °).

That is, the bending fixing portion 47 of FIG.
Shows the flexible circuit board 43 along the line C-C connecting the lands shown in FIG.
It is bent by 0 ° and fixed by solder to form a bent fixing portion 47.

The surface shown in FIG. 4A is the chip capacitor 4.
9 is a mounting surface on which the coaxial cables 19a and 19b are mounted, and the land portion 4 is formed in the same manner as the bending fixing portion 47.
By bending at 45 ° along the line B-B connecting 8a and 48b and soldering, it can be fixed in a shape along the prism 39, and the bending fixing portion 48 can be formed.

In this way, a pair of land portions 47a, 4 is provided at both ends along the bending portion of the flexible circuit board 43.
By providing 7b and 48a, 48b respectively,
It is a feature of the present embodiment that a forming means that can be easily formed into a shape capable of high density is formed by bending and soldering.

Further, since it is bent (bent) and fixed with solder instead of being folded back, the possibility of pattern breakage due to folding back is eliminated. The folding and fixing parts 47 and 48 may be formed in an order suitable for assembling or mounting the image pickup part 18.

For example, mounting the chip capacitor 49, I
The connection with the C44 and the solid-state imaging device 17 by wire bonding is performed before bending as shown in FIG. 4A, and then, the land portions 48a, 48b and the land portion 47 are formed.
a and 47b, the shape is fixed by bending and soldering, and then the coaxial cables 19a and 19b are fixed.
Connect with b.

After molding in this way, the coaxial cable 19
Even if the flexible circuit board 43 is connected to a and 19b, since the flexible circuit board 43 retains the molded shape, it is easy (unlike the connection in a state where it is simply bent and not fixed) and Connection by soldering can be performed in a short time. (On the other hand, if you try to connect it just by bending it and not fixing it, the flexible circuit board exerts a restoring force that tries to return to the original planar state, so you can do the connection work. Also, if you connect the coaxial cable before bending it and then bend it, the circuit pattern may peel off.

Further, since the bent portions 47 and 48 are fixed, it is possible to eliminate the fear of peeling or cutting of the pattern at the bent portions 47 and 48 when the flexible substrate 43 is stressed.

The chip capacitor 49 is placed in the chip capacitor pad 58 at the portion shown by the dotted line and soldered. All the chip capacitors 49 are connected to the analog ground 56 and the digital ground 57 so that one electrode on the center side of the flexible circuit board 43 is grounded.

The chip capacitors 49 are arranged in two rows and fixed, and a single wire 51 is directly soldered to the upper side of the outer electrode as shown in FIG. Conduction is ensured by through holes 62 on both surfaces of the flexible circuit board 43.

The shaded area in FIG. 4A is covered with polyimide, and the circuit is exposed only in the areas other than the shaded area. The chip capacitor 49 can be easily soldered by applying cream solder to the connection portion and performing hot air reflow with all the chip capacitors 49 mounted.

The land portion for wiring the coaxial cables 19a and 19b is at the right end in FIG. 4A, and the signal pad 53 and the GND (analog ground pad 54 or digital ground pad 55) are wired alternately. Digital ground pad 55, analog ground pad 5
4 has a width more than twice that of the signal pad 53.

Returning to FIG. 1, the image pickup portion insertion hole 36 is a substantially hexagonal hole (reference numeral 36) in which a front end side is a circular hole (a portion indicated by reference numeral 36a) and a rear end side is chamfered at both corners from a quadrangle to an upper side.
(a portion indicated by b), and the rear end side is formed large.

In particular, the solid-state image pickup device 1 is provided below the prism 39.
7. Since the ceramic substrate 42 is attached, this portion occupies a larger space than the front. The cooling horizontal conduit 31 is provided in the front portion of the image capturing section insertion hole 36. A cooling vertical pipe 32 is provided along the insertion direction perpendicular to the cooling horizontal pipe 31 and further from the cooling vertical pipe 32 to the cooling tube 33.
Connected.

The cooling tube 33 is connected to a pump (not shown) and sends cooling water to the tip of the electronic endoscope 1. The cooling water is recirculated like a pump → cooling tube 33 → cooling vertical conduit 32 → cooling horizontal conduit 31 → cooling vertical conduit 32 → cooling tube 33 → pump. The cooling vertical pipe 32 has an image pickup section insertion hole 36.
It is formed outside b.

The lens frames 15a and 15c are connected in an insulated state via an insulating frame 60.
A peripheral groove is provided on the outer peripheral surface of the lens frame 15b outside 0, and a watertight O-ring 61 is housed therein.

According to the above construction, even when the flexible circuit board 43 is bent and mounted in a complicated shape, the flexible circuit board 43 can be molded by a simple operation of soldering, so that the assembling workability is improved. Also, by bending, a narrow space can be effectively used, and the rigid length of the endoscope distal end portion can be shortened.

When directly soldering to the capacitor, wiring is provided only at both ends of the flexible circuit board 43, so that the wiring work is not hindered even if the cable is brought to the front. Therefore, it also contributes to shortening the hard length. When soldering a coaxial wire to the end of the flexible circuit board 43,
Since many GND pads are prepared, the core wire and the shield wire can be arranged close to each other, and workability is good.

Furthermore, since it is not necessary to put together a large number of shielded wires, soldering itself is easy. By disposing a non-coaxial ground line between the signal lines, an effect of reducing crosstalk can also be obtained. Analog GND and Digital G
Since ND is divided, it is effective for noise suppression,
The circuit pattern is simple because they are placed together. Furthermore, since a wide GND is provided in the center of the capacitor mounting portion, it is efficient in terms of wiring space, easy to design, and advantageous in terms of noise.

The cooling pipe is arranged near the solid-state image pickup device 17 and the IC chip 44, and is arranged so as to surround the solid-state image pickup device 17, so that the cooling efficiency is good, and the cooling horizontal pipe is provided in front of the solid-state image pickup device 17. Therefore, do not increase the diameter. further,
Since the cooling pipe line is provided directly on the tip body frame and is close to the light guide, high heat of the tip portion is avoided, and as a result, a good image can be obtained.

Further, since the prism and the substrate are arranged in front of the front end face of the solid-state image pickup device 17, it is easy to fill the resin between them, resulting in an improvement in moisture resistance.

Further, from the front end face of the prism, the solid-state image pickup device 1
Since there is a distance of up to 7, flare is less likely to occur due to less influence of reflection from the front facet of the prism.

(Second Embodiment) FIGS. 6 to 8 relate to a second embodiment of the present invention, and FIG. 6 shows a sectional view of an image pickup section as a main part of the second embodiment. , FIG. 7 shows the appearance of the flexible circuit board, FIG. 7 (A) shows the back surface which is the wiring surface, and FIG. 7 (B) shows the mounting surface.
FIG. 8 shows a cable wiring diagram to the flexible circuit board.

As shown in FIG. 6, the solid-state image pickup device 17 is arranged perpendicular to the optical axis of the objective optical system 14. The color filter 71 is directly adhered and fixed on the light receiving surface of the solid-state image pickup device 17 (this so-called vertical installation), and the infrared cut filter 38 and the color filter 71 are also positioned and directly adhered and fixed. ing.

A bonding pad row is provided on one side of the solid-state image pickup device 17 (one side located at the lower end in FIG. 6), and the flexible circuit board 43 is bump-bonded there. The bonding portion 65 formed by the bump bonding is adhesively fixed, then bent by 90 °, and further sealed and fixed with resin. The flexible circuit board 43 includes an IC chip 44 and a chip capacitor 4
9 is mounted, bent 180 ° at the bending fixing portion 47, and fixed by soldering.

FIG. 7A shows a wiring surface before being bent. Two GNDs (that is, a digital ground pad 55 and an analog ground pad 54) are provided on this wiring surface, and the others are signal pads 53. And Figure 7
It is bent by 180 ° so that this wiring surface is on the outside along the line D-D in (B), and is fixed by soldering. After being fixed by this soldering, the coaxial cable 19 is connected to the upper end as shown in FIG. In this case, the coaxial cable 19 can be connected by soldering easily and in a short time because it is in a state of being molded and maintaining its shape.

Further, the chip capacitor 49 and the IC chip 44 are mounted on the mounting surface of the flexible circuit board 43 shown in FIG. 7B (the portion mounted by the dotted line is shown). The analog ground 56 and the chip capacitor pad 58 are laid out so that the three chip capacitors 49 are arranged in a horizontal row, and the analog ground 56 is located close to one side (left side when viewed from the tip).

Further, the land portions 47a and 47b forming the bending fixing portion 47 are provided at both ends of the flexible circuit board 43 along the line DD, and one land portion 47a uses a part of the analog ground 56. The other land portion 47b uses a part of the digital ground 57.

FIG. 8 shows a connecting portion of the coaxial cable 19 to the flexible circuit board 43. As shown in this figure, it has six coaxial core wires 50 and one single wire 51. Also,
The three coaxial core wires 50 on the upper side of the drawing are connected with the coaxial shield wire 64 to the analog ground pad 54, and the coaxial shield wires 64 of the lower three coaxial core wires 50 are connected to the digital ground pad 55 together. . According to the above configuration, the same effect as that of the first embodiment can be obtained.

[Supplementary Notes] In an imaging device including an objective optical system, an image sensor arranged at an image forming position thereof, and a flexible substrate on which electronic components are mounted and bent and connected to the image sensor, a soldering land is provided on a bent portion of the flexible substrate. An imaging device, wherein a forming unit is provided, and a molding unit for fixing the land portion by soldering is formed.

2. In Appendix 1, an image pickup apparatus having a prism at the rearmost side of the objective optical system, wherein the image sensor is arranged parallel to the optical axis.

3. The image pickup device according to appendix 2, wherein the image sensor and a part of the flexible substrate are arranged on a base substrate, and the flexible substrate is bent approximately 180 ° and fixed by soldering.

4. An image pickup device comprising an image sensor and a substrate mounted with a plurality of chip capacitors connected to the image sensor, wherein the chip capacitors are arranged side by side, and the pads on the same side are grounded.

(Background of Supplementary Note 4) The present embodiment relates to an improvement in the assembling property and the structure of the electronic endoscope image pickup section. Normally, one of the chip capacitors mounted on the board is G
Although it is connected to the ND, conventionally, when mounting a plurality of chip capacitors, the layout has not been made in consideration of the direction of the GND pad and the directionality of the chip capacitors themselves. Therefore, the space in the distal end of the endoscope is efficiently used, and the wiring of the circuit board is facilitated. In order to achieve this purpose, the structure of Appendix 4 is adopted.

5. In Appendix 4, the image pickup device is characterized in that the chip capacitors are arranged in two rows and the inside of the substrate is used as a common ground. 6. In Appendix 4, a linear cable is connected to an electrode on the side opposite to the ground side of the chip capacitor. 7. The image pickup device according to appendix 5, wherein a cable is arranged between both outsides of the two rows of chip capacitors.

8. In an electronic endoscope having an image sensor, a coaxial cable having a plurality of coaxial lines, and a substrate connected to the two and having electronic components mounted thereon, a plurality of pads for grounding are provided on pads for connecting the coaxial cables on the substrate. An imaging device characterized by the above.

(Background of Supplementary Note 8) Supplementary note 8 relates to improvement of the assembling work in the electronic endoscope imaging section. Conventionally, when connecting a coaxial cable to an HIC or the like in an endoscope imaging unit, a plurality of coaxial shielded wires are bundled and connected to a single GND pad provided on the HIC, or combined into another member other than the IC. I was connected. However, if the number of cables is further increased, the positions of the connection pads of the coaxial core wire and the shield wire may be separated, which may make connection work difficult. For this reason, the structure of Supplementary Note 8 is provided with the object of providing a substrate having a simple pattern that simplifies the work at the time of connecting the cables and reduces crosstalk.

9. The image pickup device according to appendix 8, wherein the ground pads are analog and digital. 10. In Appendix 8, the image pickup device is characterized in that, when the pads are arranged in a row, the signal pads and the ground pads are alternately arranged. 11. In Appendix 9, when there are a plurality of analog ground pads and a plurality of digital ground pads, they are arranged in a group.

12. In an electronic endoscope having an objective optical system having a vertical prism, a horizontal image sensor, and a tip body frame for fixing the objective optical system, an electronic endoscope parallel to an objective optical system insertion hole provided in the tip body frame and on both sides thereof. And a cooling tube connected to the two cooling vertical conduits, a horizontal cooling conduit that connects the two conduits on the distal side of the image sensor, and a cooling tube connected to the two cooling conduits. Electronic endoscope.

(Background of Supplementary Note 12) Since the electronic endoscope has electronic parts such as CCD and IC at the tip, the temperature of the tip may rise and the image may deteriorate. Therefore, there was a technique of providing a mechanism for forcibly cooling the periphery of the image pickup unit, but it was necessary to provide a duct or the like for exclusive use for cooling, which often led to an increase in the diameter of the endoscope tip. . For this reason, the structure of Supplementary Note 12 is provided for the purpose of efficiently cooling the imaging unit and obtaining a good image without thickening the distal end of the endoscope.

[0071]

As described above, according to the present invention, the objective optical system and the image sensor arranged at the image forming position thereof,
In an image pickup device comprising a flexible substrate on which electronic components are mounted, bent and connected to an image sensor, a soldering land portion is provided on the bent portion of the flexible substrate, and the land portion is fixed by soldering. Since the means is formed, the bent portion of the flexible board can be formed into a shape that maintains the bent state by a simple and short-time work such as soldering, and the bent portion can be used for the subsequent work such as soldering of the cable. It is easy to do because it is fixed.

[Brief description of drawings]

FIG. 1A is a cross-sectional view taken along the insertion direction showing the configuration of the distal end side of an insertion section including the first embodiment, and FIG.
Is a cross-sectional view taken along the line AA of FIG.

FIG. 2 is a perspective view showing the entire video scope.

FIG. 3 is a cable wiring diagram to a flexible printed circuit board.

FIG. 4 (A) is a front view of the appearance of the flexible printed circuit board before being bent, and FIG. 4 (B) is a rear view of the appearance of the flexible printed board before being bent.

5A is a plan view showing an imaging portion, FIG.
FIG. 3 is a perspective view showing an image pickup section.

FIG. 6 is a cross-sectional view showing an image pickup unit as a main part of the second embodiment.

FIG. 7 (A) shows a back surface which is a wiring surface of a flexible circuit board, and FIG. 7 (B) shows a front surface to be mounted.

FIG. 8 is a wiring diagram of a cable to a flexible circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Videoscope (electronic endoscope) 2 ... Insertion part 6 ... Hard tip part 13 ... Observation window 14 ... Objective optical system 16 ... Element frame 17 ... Solid-state image sensor 18 ... Imaging part 19a, 19b ... Coaxial cable 22 ... Tip Main body frame 39 ... Prism 40 ... Shield frame 42 ... Ceramic substrate 43 ... Flexible circuit board 44 ... IC chip 47, 48 ... Bending fixing part 47a, 47b, 48a, 48b ... Land part

Claims (1)

[Claims] 1. An imaging device comprising an objective optical system, an image sensor arranged at an image forming position thereof, and a flexible substrate on which an electronic component is mounted and which is bent and connected to the image sensor. An imaging device, wherein a land portion for soldering is provided on the portion, and a molding means for fixing the land portion by soldering is formed.