JPH09307087A - Solid-state image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify and miniaturize inspection after mounting. SOLUTION: In the connection of a flexible substrate 15 and a rigid substrate 16, an electronic part 41 is mounted on an electronic parts mounting land 31, a solid-state image pickup element 14 is mounted on a bare chip mount part 25, a bump 42 is made on a bump land 33 on the rigid substrate 16 and it is position-adjusted with the second conductor pad 27 of the flexible substrate 15. The solid-state image pickup element 14 is wire-bonded with a first conductor pad 24 by bonding wires 43. At the same time, the bump 42 is press-fixed, the second conductor pad 27 and the bump land 33 are bump-joined and they are electrically conducted. The projection part 21 of the flexible substrate 15 is cut by a cut line adjusted to the end face of the rigid substrate 16 after inspection such as operation checking terminates by using the inspection pad 22 of the flexible substrate 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device, and more particularly to a solid-state image pickup device characterized by a substrate portion of a solid-state image pickup element built in a tip of an endoscope.

[0002]

2. Description of the Related Art Conventionally, a solid-state image pickup device for picking up an image of a subject is mounted on a substrate made of ceramic or the like, and connected by wire bonding to a wiring pattern on the substrate. If an inspection section is provided to confirm the operation of the solid-state imaging device after it is mounted, the size of the board will increase. Therefore, it is conceivable to cut an extra inspection portion after the inspection is completed, but since it is provided on a hard substrate, it cannot be cut, resulting in an increase in size and an increase in size of the apparatus itself.

Therefore, in order to cut the inspection part, Japanese Patent Laid-Open No. 63-167322 discloses a solid-state image pickup device in which the substrate is a flexible substrate and the shape after mounting the solid-state image pickup device is miniaturized. ing.

Further, Japanese Patent Application Laid-Open No. 63-167322 discloses a solid-state image pickup device in which a solid-state image pickup device mounting portion, a signal line connecting conductor land, and an inspection portion are wired on the same substrate.

[0005]

However, in the above-mentioned Japanese Patent Laid-Open No. 63-167322, the wiring is extended from the solid-state image sensor mounting portion and the inspection land is provided via the signal line connecting conductor land. .

That is, in the conventional solid-state image pickup device, as shown in FIG. 23A, the signal line connecting conductor land 3 is provided on the substrate 302 on which the solid-state image pickup element 301 is mounted.
03 is provided, and the conductor land 3 for connecting the signal line is provided.
By connecting a signal line (not shown) to 03, an external video processor (not shown) is connected. Note that FIG. 23B shows a side surface of the solid-state imaging device of FIG.

The substrate 302 is a rigid substrate made of ceramic or the like, and is provided with an electronic component 305 and the signal line connecting conductor lands 303, and the electronic component 305 and the solid-state image pickup are provided on the substrate 302 via a bonding wire 306. The element 301 is the electronic component 305 and the substrate 302.
And the solid-state imaging element 301 and the signal line connecting conductor land 303 are connected. A wiring portion sealing resin 308 is applied to the bonding wire 306 for insulation.

The signal line connecting conductor land 30 is provided.
3 is connected to the inspection land 310 by a wiring pattern 309 so that it can be connected to a terminal of an inspection device (not shown), and the substrate 30 including these portions.
The length of 2 is L.

As described above, in the case of the conventional solid-state imaging device, since the inspection land 310 passes through the signal line connecting conductor land 303, the position of the inspection land 310 is set at the set position of the signal line connecting conductor land 303. There is a problem that it is limited, complicated and may be large, and the inspection is carried out in this shape, so that the handling during the inspection becomes troublesome.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a solid-state image pickup device which can simplify the inspection after mounting and can be downsized.

[0011]

A solid-state image pickup device of the present invention is a solid-state image pickup device comprising a solid-state image pickup element, a flexible substrate and a rigid substrate, wherein a part of the flexible substrate is projected from the rigid substrate. The projection portion is provided, an inspection pad for the solid-state image sensor is provided on the projection portion, and a circuit pattern is provided on both the flexible substrate and the rigid substrate.

In the solid-state image pickup device of the present invention, the solid-state image pickup element and the flexible substrate are electrically connected to each other, and the flexible substrate and the rigid substrate are electrically connected to each other, thereby simplifying the inspection after mounting. , It is possible to reduce the size.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

1 to 6 relate to an embodiment of the present invention, and FIG. 1 is a configuration diagram showing a configuration of a distal end portion of an endoscope, FIG.
1 is a configuration diagram showing a configuration of a flexible substrate on which a solid-state image sensor is mounted before being attached to the image pickup unit in FIG. 1, and FIG. 3 is a configuration showing a configuration of a rigid substrate before mounting the flexible substrate of FIG. FIG. 4 is a configuration diagram showing a configuration of the rigid substrate after mounting the flexible substrate of FIG. 2, FIG. 5 is a diagram showing a shape of a first modified example of the flexible substrate of FIG. 2, and FIG. FIG. 9 is a diagram showing the shape of a second modification of the flexible substrate of FIG. 2.

As shown in FIG. 1, inside the distal end portion of the endoscope 1, an objective optical system, which is provided with a light guide 2 for irradiating illumination light to an observation site (not shown), is configured to enter light from the observation site. A solid-state imaging device 5 according to the present embodiment, which is a combination of the system 3 and an imaging unit 4 that captures an image of an observation site by the objective optical system 3, is provided.

The objective optical system 3 is composed of a lens group 6 composed of a plurality of lenses and a lens frame 7 for supporting the lens groups 6, and is attached to a distal end constituent member 8 of the endoscope 1. It is inserted into the hole 9 and fixed by the fixing screw 10.

A filter 12 is attached to the rear end of the lens frame 7 via a spacer 11, and the filter 12
The prism 13 is joined to the.

The prism 13 refracts the incident light from the objective optical system 3 at a substantially right angle. A solid-state image pickup device 14 is provided in the refracted optical axis direction, and the distal end portion of the endoscope is provided. It is located substantially parallel to the axis of 1.

A signal line connecting conductor land 17 is provided on a rigid substrate 16 on which a solid-state image pickup device 14 is mounted and a flexible substrate 15 to be described later is mounted. By connecting the signal line 18, it is connected to an external video processor (not shown).

FIG. 2A shows a flexible substrate 15 on which the solid-state image pickup device 14 before being mounted on the image pickup section 3 is mounted, and FIG. 2B shows its side surface.

As shown in FIG. 2A, the flexible substrate 15 is made of a flexible material such as a polyimide resin, and the projecting portion 21 on the flexible substrate 15 is used for operation inspection. Pattern 2 to be electrically connected to the inspection pad 22 of
First conductor pad 2 connected to the solid-state image sensor 14 and the solid-state image sensor 14
4 is provided, and a bare chip mounting portion 25 on which the solid-state imaging device 14 is mounted is provided.

Further, as shown in FIG.
As shown in FIG. 2, the second conductor pad 27 electrically connected by the through hole 26 is provided on the back surface of the flexible substrate 15 at the same position as the first conductor pad 24.

FIG. 3A shows the rigid substrate 16 before the flexible substrate 15 is mounted, and FIG. 3B shows the side surface thereof.

As shown in FIG. 3, on the rigid substrate 16,
An electronic component mounting land 31 and a signal line connecting conductor land 17 for connecting the signal line 18 for connection to a peripheral device such as a video processor (not shown) are provided. Bump lands 33 to be connected to are provided.

The electronic component mounting land 31, the bump land 33, and the signal line connecting conductor land 17 are connected by an internal wiring 34 provided inside the rigid substrate 16.

FIG. 4A shows the rigid substrate 16 after mounting the flexible substrate 15, and FIG. 4B shows the side surface thereof.

In connecting the flexible substrate 15 and the rigid substrate 16, as shown in FIG. 4A, the electronic component 41 is mounted on the electronic component mounting land 31, and the bare chip mounting portion 25 is mounted.
The solid-state imaging device 14 is mounted on the upper side, and the bumps 42 are mounted on the bump lands 33 on the rigid substrate 16 and aligned with the second conductor pads 27 on the flexible substrate 15 as shown in FIG. 4B. I do.

The solid-state image sensor 14 and the first conductor pad 24
Are bonded by the bonding wire 43. At the same time, the bumps 42 are pressure-bonded, and the second conductor pads 27 and the bump lands 33 are bump-bonded and electrically connected.

Here, a wiring portion sealing resin 44 is applied to the bonding wire 43 for insulation, and the other is sealed with a fixing sealing resin 45.

Then, the inspection pad 2 of the flexible substrate 15
After completion of inspections such as operation check using 2, the rigid substrate 16
The projecting portion 21 of the flexible substrate 15 is cut along a cutting line that matches the end face of the. By doing so, the flexible substrate 15 and the rigid substrate 1
The total length of the substrate consisting of 6 and 6 is L '.

As described above, in this embodiment, in the operation check, the position of the inspection pad 22 can be arbitrarily set, and further, the wire bonding and the bump bonding can be performed simultaneously, so that the work can be simplified.

Further, since the protruding portion 21 is cut after the operation check, the protruding portion 21 can be made shorter than the conventional substrate length (L) shown in FIG. 23, so that the solid-state image pickup device can be made compact. You can

The flexible substrate 15 is not limited to the shape shown in FIG. 2, but may be a flexible substrate 15a as a first modified example having a shape shown in FIG. ,
Flexible substrate 15 as a second modification of the shape shown in FIG.
It may be b.

[Additional Notes] (Additional Statement 1-1) In a solid-state imaging device comprising a solid-state imaging device, a flexible substrate, and a rigid substrate, a protrusion protruding from the rigid substrate is provided in a part of the flexible substrate. The solid state image pickup device, the flexible substrate, and the flexible substrate are provided with circuit pads on both the flexible substrate and the rigid substrate while providing the inspection pad of the solid state image pickup device on the protrusion. A solid-state imaging device, wherein a flexible substrate and the rigid substrate are electrically connected to each other.

(Appendix 1-2) The solid according to Appendix 1-1, characterized in that the projecting portion of the flexible substrate can be cut after the operation test of the solid-state image pickup device is performed. Imaging device.

By the way, an endoscope in which a solid-state image pickup device such as SID is incorporated in the distal end portion of the insertion portion of an endoscope for observing the inside of a body cavity is known as disclosed in, for example, Japanese Patent Publication No. 7-22571. Is.

In this endoscope, a solid-state image pickup device is provided so as to be substantially parallel to the central axis of the distal end forming portion, an objective optical system is provided on one side of the solid-state image pickup device, and the optical axis is a prism. Is bent at a substantially right angle and guided to the solid-state image sensor.

Since other internal components are present at the tip,
Japanese Patent Publication No. 7-22571 discloses that the optical axis of the objective optical system and the center axis of the image area are decentered in order to use a part of the image area of the solid-state image sensor.

However, as described above, the conventional structure adopts a structure in which the optical axis of the objective system and the center of the image area are decentered. Therefore, at the time of assembly, a positioning adjustment plate for positioning the prism and the image area is used. Since it is necessary to perform work, there is a problem that the work time is complicated and the number of man-hours is increased.

Therefore, an embodiment of a solid-state image pickup device capable of easily aligning the prism and the image area will be described.

7 to 13 relate to an embodiment of a solid-state image pickup device capable of easily aligning a prism and an image area, and FIG. 7 is a configuration diagram showing a configuration of a distal end portion of an endoscope, 8 is an explanatory view for explaining an image area of the solid-state image sensor of FIG. 7, FIG. 9 is a cross-sectional view showing a cross section taken along the line AA of FIG. 7, and FIG. 10 is a tip portion of the prism of FIG. FIG. 11 is a second explanatory diagram for explaining the alignment of the parts and the like, FIG. 11 is a second explanatory diagram for explaining the alignment of the front end of the prism of FIG. 7 and the front end of the solid-state imaging device, and FIG. FIG. 13 is a third explanatory view illustrating the alignment between the tip of the prism and the tip of the solid-state image sensor, and FIG. 13 is the fourth view illustrating the alignment between the tip of the prism and the tip of the solid-state image sensor in FIG. 7. FIG.

As shown in FIG. 7, the distal end portion 51 of the endoscope is
It is composed of a cylindrical tip tube 52 and a tip forming member 53 fitted to the front end thereof. A solid-state imaging device 54 is provided inside the cylindrical tip tube 52.

The solid-state image pickup device 54 has a lens frame 55 for supporting a lens group 55a forming an objective optical system 55.
b is provided, and the lens frame 55b is inserted into a mounting hole 56 provided in the tip forming member 53 and fixed by a fixing screw 57. Further, the lens frame 5
A filter 59 is attached to the rear end portion of 5b via a spacer 58, and a prism 60 as an optical element is provided in a joined state on the filter 59 to refract the optical axis from the objective optical system 55 at a substantially right angle. It is supposed to do.

A solid-state image pickup device 61 such as an SID described later is provided in the optical axis direction refracted by the prism 60. The solid-state image pickup device 61 is positioned substantially parallel to the axis of the endoscope distal end portion 51. ing.

The solid-state image pickup device 61 will be described in detail. The solid-state image pickup device 61 and the color filter array 63 are bonded to a ceramic substrate 62 in this order. Then, as shown in FIG. 8, a large number of leads 64 are arranged in parallel at equal intervals on the upper and lower ends of the substrate 62.
4 is bonded to the bonding pad 66 of the solid-state imaging device 61 via a plurality of bonding wires 65. Each bonding wire 65 is insulated by an adhesive for attaching the color filter array 63 to the solid-state image pickup device 61.

Further, the lead 67 on the solid-state image pickup device 61.
Are connected to the leads 64 respectively, and returning to FIG. 7, the bonding wires 69 are connected to the electronic components 68 on the substrate 62.
Are electrically connected via. In the board 62, the electronic component 68 is electrically connected to the cable 71 via the signal line connecting conductor land 70 on the rear side of the board 62. As shown in FIG. 9 which is a cross-sectional view taken along the line AA of FIG.
The first color filter array 63 is fixed to the prism 60 with an adhesive 72.

Since the used image area 74 uses only a part of the image area 73, the resolving power is lower than that of the image area 73 using the entire image area 73, but an endoscope using a solid-state image sensor is used. Since the resolving power can be much higher than that of an endoscope using an image guide fiber, a practically sufficient resolving power can be obtained by using only a part of the image area 73.

In this embodiment, the image area 73 of the solid-state image pickup device 61 has an aspect ratio of 3: 4,
The vertical 480 pixels and the horizontal 640 pixels are used. With this configuration, the solid-state image sensor 61 can be used for a consumer TV camera as well, so that the solid-state image sensor 61 can be manufactured at low cost due to the effect of mass production.

In addition, when it is used for consumer use, it may be provided separately from the medical package of this embodiment. In this case, even if the solid-state image pickup device 61 is common to the consumer use, the mass production effect is large. .

Further, the used image area 74 of the image area 73 has a diameter of 400 pixels and is eccentric to the upper left from the center of the image area 73 as shown in FIG. As a result, the prism 60 can be decentered to the left side with respect to the center of the solid-state image sensor 61 as shown in FIG. 9, and the right space (forceps insertion port 7
5) can be widened, and the distal end portion 51 of the endoscope can be thinned accordingly.

Here, the alignment of the tip portion 60a of the prism 60 and the tip portion 61a of the solid-state image pickup device 61, etc., is performed by a positioning adjustment plate which is a separate component when the solid-state image pickup device 61 or the substrate 62 is joined (see FIG. (Not shown).

That is, as shown in FIG. 10, first, an adhesive 72 for the prism 60 and the color filter array 63.
At the time of bonding by, the surface alignment of the tip 60a of the prism 60 and the tip 63a of the color filter array 63 is performed. Further, even when the color filter array 63 and the solid-state image sensor 61 are joined, the tip portion 61a of the solid-state image sensor 61 is formed.
And the front end portion 63a of the color filter array 63 are face-matched to each other, and even when the solid-state imaging device 61 and the substrate 62 are joined, the front end portion 61a of the solid-state imaging device 61 and the front end portion 62 of the substrate 62.
Align a with a.

By adopting such a face-to-face structure, the B portion of the tip surface of the conventional solid-state imaging device shown in FIG. 11 can be shortened, and the rigid length of the endoscope tip can be shortened. .

As shown in FIG. 12, not only at the front end side but also when the prism 60 and the color filter array 63 are joined by the adhesive 72, the side end portion 60b of the prism 60 and the side end portion 63b of the color filter array 63 are joined. The surface alignment of the solid-state imaging device is performed, and the side end portion 61b of the solid-state imaging device 61 and the side end portion 63b of the color filter array 63 are surface-aligned even when the color filter array 63 and the solid-state imaging device 61 are joined. Even when the element 61 and the substrate 62 are joined together, the side edges 61b of the solid-state imaging element 61 and the side edge 62b of the substrate 62 may be face-to-face. That is, the face-to-face may be adopted not only in one direction but also in multiple directions.

As shown in FIG. 12, the side edges are also face-to-face and assembled as shown in FIG. 13, so that the space of the forceps insertion port 75 becomes wider than that of FIG. 9, and the forceps insertion port 75 is directed toward the center. The outer diameter of the tip can be reduced.

As described above, in the present embodiment, the used image area 74 of the solid-state image pickup device 61 is changed to the image area 7.
Since the prism 60 and the solid-state imaging device 61 or the substrate 63 are easily aligned with each other, the working time is shortened.

Further, since the ends of the prism 60 and the solid-state image pickup device 61 or the substrate 63 are face-to-face, the diameter can be reduced.

[Additional remarks] (Additional remark 2-1) In a solid-state imaging device provided at the tip of an endoscope and having an objective optical system including a prism and a solid-state imaging device, an end face of the prism and an end face of the solid-state imaging device. A solid-state image pickup device characterized in that at least one side thereof is matched.

(Additional Item 2-2) The solid-state imaging device according to Additional Item 2-1 is characterized in that an end surface of a substrate on which the solid-state imaging element is mounted and an end surface of the prism are at least one surface.

On the other hand, it is important to reduce the size of the image pickup device built in the tip of the electronic endoscope. Furthermore, high-density mounting is being promoted.

Generally, in order to transmit the electric signal of the image pickup device, a flexible substrate to be connected to the device is used, a wiring pattern is provided, electronic parts are mounted in a limited space, and a cable is wired. In order to
It is bent.

However, the size of the flexible substrate is increased in order to increase the density. In particular, the length of the imaging device becomes long. Further, since the circuit wiring on the board is bent, there is a risk of disconnection.

Therefore, an embodiment of a solid-state image pickup device in which the length of the image pickup device is shortened and the diameter is reduced so that the wiring on the substrate is not broken will be described.

14 to 16 relate to an embodiment of a solid-state image pickup device capable of preventing the disconnection of the wiring on the substrate by shortening and narrowing the length of the image pickup device, and FIG. 14 is a solid-state image pickup device. 15 is an explanatory diagram for explaining the image area of the solid-state image pickup device of FIG. 14, and FIG. 16 is a configuration diagram showing the structure of the TAB tape of FIG.

As shown in FIG. 14A, the solid-state image pickup device 101 provided in the distal end portion of the endoscope is provided with a lens frame 102 for supporting a lens group (not shown) forming the objective optical system. There is. Further, the lens frame 102
A filter 103 is attached to the rear end portion, and a prism 104 as an optical element is provided in a joined state on the filter 103 so that the optical axis from the objective optical system is refracted at a substantially right angle. A solid-state image sensor 105 is provided in the optical axis direction refracted by the prism 103.

As shown in FIG. 15, when the left side of the solid-state image sensor 105 is used as the endoscope tip and the image pickup apparatus tip,
The image area 105a is provided on the front end side, and the bump land 106 is provided on the rear end side.

Returning to FIG. 14A, the solid-state image sensor 105
Via the bump 107, to the upper bump land 106,
The connection terminal 109 of the TAB tape 108 made of a flexible circuit board is joined to the filter 10
3 has a structure in which the lens system in which the prism 3 and the prism 104 are joined together is joined to the solid-state image sensor 105.

As shown in FIG. 16, the TAB tape 108 is provided with a wiring pattern 111 for disposing the electronic component 110, and the wiring pattern 111 is provided on the back surface thereof.
Signal line connecting conductor land 11 electrically connected to
2 are provided.

Further, a connection terminal 113 for electrically connecting to the bump land 106 is provided, and is connected to the electronic component 110 via the wiring pattern 111.

Bending lines 114 are provided on the TAB tape 108 for incorporation into the solid-state image pickup device, whereby the TAB tape 108 is bent at the bending portions 115 and 11.
6 and the plane portion 117.

Returning to FIG. 14A again, the bump-bonded TAB tape 108 is bent toward the prism 104 at the connection terminal 113, and the substrate bottom bending line 118 on the TAB tape 108 (see FIG. 16). The plane portion 117 is arranged so that the mounting surface of the electronic component 110 is substantially parallel to the slope of the prism 104.

At this time, the electronic component 110 on the TAB tape 108 is set between the prism 104 and the TAB tape 108.

FIG. 14 is a sectional view taken along line CC of FIG.
As shown in (b), the TAB tape 108 is bent along the bending line 114 on the TAB tape 108, and the bent portions 115 and 116 are arranged on the side surfaces of the prism 104.

After the positioning is completed, in order to fix the respective constituent members, an adhesive 119 is applied to the space between the inclined surface of the prism 104 and the flat portion 117 of the TAB tape 108 and the prism 104.
Is applied and fixed in the space between the side surface of the and the bent portions 115 and 116.

As the adhesive 119, an ultraviolet curable resin which is cured by ultraviolet rays is used.

After the adhesive 119 is cured, the TAB tape 10
The signal line 1 is attached to the signal line connecting conductor land 112 on the rear surface side of FIG.
20 is connected.

As described above, in the structure of the present embodiment, the TAB tape 108 is directly bumped onto the solid-state image sensor 105.
Since the connection is made via 07, the substrate required for supporting and fixing the solid-state image pickup device in the related art is not required, and thus the size and the diameter can be reduced.

Further, the bending of the connection terminal 113 after the connection between the bump 107 and the connection terminal 113 is performed by folding back a flexible substrate having a wiring pattern, which is generally performed, in order to make the image pickup device as small as possible. Damage to the pattern due to work or the like is mitigated and pattern disconnection is prevented.

[Additional remarks] (Additional remark 3-1) In a solid-state image pickup device which is provided at the tip of an endoscope and has an objective optical system including a prism and a solid-state image pickup element, a solid-state image pickup element is provided behind the light-receiving section. A bonding pad row is provided, and wiring on a flexible substrate on which driving electronic components are mounted is electrically connected to the pad row, and the flexible substrate is bent toward the light-receiving portion side on the solid-state image sensor, and is also connected to the prism side surface. A solid-state imaging device, characterized in that a surplus portion of the flexible substrate is bent and adhered, and a signal line is connected to an upper portion behind the flexible substrate.

(Additional Item 3-2) The additional component 3-1 is characterized in that the electronic component on the flexible substrate is disposed between the prism and the flexible substrate.
3. The solid-state imaging device according to item 1.

The solid-state image pickup device according to each of the above-described embodiments is arranged, for example, in the tip portion of the endoscope.

That is, as shown in FIG. 17, the endoscope 1
The solid-state image pickup device 152 is provided at the tip of the endoscope 51.
The signal line 155 is inserted through the insertion portion 153 of 51 and the universal cable 154, and is connected to the rear system.

The signal line 155 is covered with a first shield 156 in order to block the radiated electromagnetic wave.

In the universal cable 154, a ground wire 157 is arranged so as to equalize the electric potentials in the endoscope in order to prevent electric shock to the patient due to use of an electric knife, for example. The connector part 154a provided in the
Is connected to the terminal 158.

As shown in FIG. 18, which is the first electrical connection diagram of FIG. 17, the solid-state image pickup device 15 is normally used.
The signal of the solid-state image sensor 160 in 2 is connected to the circuit board 163 in the video processor 162 via the core wire 161 in the signal wire 155.

A large number of core wires 161 are included in the signal wire 155.
Is present, signals having various driving frequencies are flowing in each core wire 161, and interference due to noise radiated from the signal wire is considered. Therefore, the second shield 164 is covered over each core wire 161 to serve as a coaxial cable. There is. That is, the core wire 161 and the second shield 164 form the coaxial wire 165, and a large number of them form the signal wire 155. Here, although each coaxial line 165 is shielded by the second shield 164, it is further covered by the third shield 166 because there is leaking noise.

Since noise is present on the second shield 164 and the third shield 166, it is connected to the ground 167 so as not to affect the signal system of the system to escape the noise.

Since some noise cannot be suppressed even by the second shield 164 and the third shield 166, the outer periphery of the signal line 155 is covered with the first shield 156 through the switching unit 168, as described above. Grand 167
The noise emission is suppressed by connecting to.

As shown in FIG. 19, which is the second electrical connection diagram of FIG. 17, when the electric knife is used, the switching unit 1
Set 68 to OPEN.

Next, the opening / closing structure of the switching unit 168 will be described.

As shown in FIG. 20, the opening / closing operation of the switching unit 168 is performed at the terminal 158. Specifically, the terminal 15
8 is provided with an opening 171 around the center line,
2 is threaded and is embedded in the connector portion 154a.

An insulating member 173 is inserted into the opening 171, and a contact rod head 175 of a contact rod 174 inserted into the opening 171 is threaded in the same direction as the terminal head 172. For example, the terminal head 172 has a right-hand thread, and the contact rod head 175 has a right-hand thread.

An elastic member 176 is interposed between the contact surface 190 and the terminal 158.

A fixing cover 177 is provided to prevent the contact rod 174 from coming off, and a contact portion 178 is incorporated therein, and the ground wire 157 is connected to the contact portion 178.

The fixing cover 177 is fixed to the terminal 158 so as to push up the contact rod 174 inserted into the opening 171.

At the connecting portion on the side of the electric knife to be connected to the terminal head 172, as shown in FIG.
A screw in the same direction as the terminal head 172 is cut into the opening 181 in the base of the base. A protrusion 182 in the base in the opening 181 in the base
Is provided, and the opening 183 in the protrusion is threaded in the same direction as the contact rod head 175. Further, the base 180 is configured to be electrically connected to the electric knife connection cord 184.

Then, as shown in FIG. 22, when the electric knife is used, the base 180 is attached to the terminal head 172. For mounting, the threaded portion of the terminal head 172 in the same direction as the threaded portion of the opening 181 in the base is screwed. When screwed,
The threaded portion of the opening 183 in the protrusion is screwed with the contact rod head 175.

Since the screw portion of the opening 181 in the mouthpiece is in the opposite direction, the screw portion of the opening 183 in the protrusion engages with the screw portion of the contact rod head 175 as it is screwed in, and the mouthpiece 180 contacts downward. The rod 174 moves upward.

As a result of this movement, as shown in FIG. 22, a clearance 192 is generated between the contact surface 190 and the contact surface 191, and it becomes electrically non-conductive.

Thus, in the state of FIG. 18, the signal line 15
Since the radiation noise from No. 5 is released to the ground 167, unnecessary radiation noise is reduced.

Furthermore, when the electric knife shown in FIG. 19 is used, the outer surface is floated with respect to the scope GND, so that the circuit is safe and prevents electric shock.

[0102]

As described above, according to the solid-state image pickup device of the present invention, the solid-state image pickup element and the flexible substrate are electrically connected to each other, and the flexible substrate and the rigid substrate are electrically connected to each other. There is an effect that the inspection can be simplified and the size can be reduced.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a configuration of an endoscope distal end portion according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a configuration of a flexible substrate on which a solid-state image sensor is mounted before being mounted on the image capturing section of FIG.

FIG. 3 is a configuration diagram showing a configuration of a rigid substrate before mounting the flexible substrate of FIG.

4 is a configuration diagram showing a configuration of a rigid substrate after mounting the flexible substrate of FIG.

5 is a diagram showing the shape of a first modification of the flexible substrate of FIG.

FIG. 6 is a diagram showing the shape of a second modification of the flexible substrate of FIG.

FIG. 7 is a configuration diagram showing a configuration of an endoscope distal end portion according to an embodiment of a solid-state imaging device capable of easily aligning a prism and an image area.

FIG. 8 is an explanatory diagram illustrating an image area of the solid-state image sensor of FIG.

9 is a cross-sectional view showing a cross section taken along line AA of FIG. 7.

FIG. 10 is a first explanatory diagram for explaining alignment of the tip portion of the prism of FIG. 7 and the tip portion of the solid-state image sensor.

FIG. 11 is a second explanatory diagram for explaining alignment of the tip portion of the prism of FIG. 7 and the tip portion of the solid-state imaging device.

FIG. 12 is a third explanatory diagram for explaining alignment of the tip portion of the prism of FIG. 7 and the tip portion of the solid-state imaging device.

FIG. 13 is a fourth explanatory diagram for explaining alignment of the tip portion of the prism of FIG. 7 and the tip portion of the solid-state image sensor.

FIG. 14 is a configuration diagram showing a configuration of a solid-state imaging device according to an embodiment of the present invention, in which the length of the imaging device can be reduced and the diameter thereof can be reduced to prevent disconnection of wiring on a substrate.

15 is an explanatory diagram illustrating an image area of the solid-state image sensor of FIG.

16 is a structural diagram showing the structure of the TAB tape shown in FIG.

FIG. 17 is a configuration diagram showing a configuration of an endoscope apparatus including the solid-state imaging device according to each embodiment.

18 is a first electrical connection diagram showing electrical connection during normal use of the endoscope apparatus of FIG.

FIG. 19 is a second electrical connection diagram showing electrical connection when the electric scalpel of the endoscope device of FIG. 17 is used.

20 is a configuration diagram showing a configuration of the terminal of FIG.

21 is a configuration diagram showing the configuration of a connecting portion on the electric scalpel side to which the terminals of FIG. 19 are connected.

22 is an explanatory view for explaining the connection between the terminal of FIG. 19 and the connecting portion of FIG. 20.

FIG. 23 is a configuration diagram showing a configuration of a substrate on which a conventional solid-state image sensor is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Endoscope 2 ... Light guide 3 ... Objective optical system 4 ... Imaging part 5 ... Solid-state imaging device 6 ... Lens group 7 ... Lens frame 8 ... Tip constituent member 9 ... Mounting hole 10 ... Fixing screw 11 ... Spacer 12 ... Filter 13 ... Prism 14 ... Solid-state image sensor 15 ... Flexible substrate 16 ... Rigid substrate 17 ... Signal line connecting conductor land 18 ... Signal line 21 ... Projection part 22 ... Inspection pad 23 ... Wiring pattern 24 ... First conductor pad 25 ... Bare chip mounting portion 26 ... Through hole 27 ... Second conductor pad 31 ... Electronic component mounting land 32 ... Signal line connecting conductor land 33 ... Bump land 34 ... Internal wiring 41 ... Electronic component 42 ... Bump 43 ... Bonding wire 44 ... Wiring portion sealing resin 45 ... Fixing sealing resin

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] June 11, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0098

[Correction method] Change

[Correction contents]

Since it is in the same direction as the threaded portion of the opening 181 in the mouthpiece, as it is screwed in, the threaded portion of the contact rod head 175 meshes with the threaded portion of the opening 183 in the protrusion, and the die 180 contacts downward. The rod 174 moves upward.

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 14

Claims (1)

[Claims] 1. A solid-state imaging device comprising a solid-state imaging device, a flexible substrate, and a rigid substrate, wherein a part of the flexible substrate is provided with a protrusion protruding from the rigid substrate, and the protrusion is provided with the solid part. An inspection pad for the image sensor is provided, and circuit patterns are provided on both the flexible substrate and the rigid substrate, and the solid-state image sensor and the flexible substrate, and the flexible substrate and the rigid substrate are provided. A solid-state imaging device characterized by being electrically connected to each other.