JPH1176156A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small imaging device whose connection strength and assembling efficiency are enhanced, while solving the problem of device expansion that may result from the installation of a plurality of electronic parts. SOLUTION: An imaging part 22 includes a rectangular solid imaging device chip 27, having a light receiving part 27a provided at approximately the center of its end face facing an objective optical part 21, and a circuit board 30 made from a hard material such as ceramics which is, bonded to the surface of the first end of the solid imaging device chip 27, with an adhesive 28 and a signal processing IC 29 of an electronic part is placed in a recess part 30a. A laminated structure is formed by a first TAB tape 31 which is connected to the solid imaging device chip 27 and on which a peripheral circuit part 33 of a peripheral electronic part mounted on one side thereof is folded toward the surface of the first end of the circuit board 30 to be arranged and a second TAB tape 32 connected to the solid imaging device chip 27 and folded same as the first TAB tape 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device used for an endoscope and the like, and more particularly, to a miniaturized imaging device.

[0002]

2. Description of the Related Art In recent years, an objective optical system and an image pickup device having a solid-state image pickup device chip and a circuit board have been arranged in the distal end portion of an endoscope insertion section, and an endoscope observation image has been converted to an electric image. Electronic endoscopes that obtain signals are widely used. There is a high demand for miniaturization of an imaging device mounted in a small space such as the distal end portion of the insertion portion of the endoscope, and it is desired that the imaging device has an area as small as possible in the direction of the imaging surface and as short as possible in the vertical direction. ing.

[0003] Since the objective optical system and the image pickup device are built in the distal end portion of the insertion portion of the electronic endoscope, there is a hard portion due to these components. Therefore, as the length of the imaging device becomes shorter, the length of the distal end hard portion can be made shorter, thereby reducing the pain on the patient at the time of insertion.

Various techniques for reducing the size of such an imaging device have been proposed, and Japanese Patent Application Laid-Open No. 5-115435 discloses a solid-state imaging device chip 1 as shown in FIG.
The cover glass 172 is adhered to the light receiving surface of the base 71 through a transparent resin 173, and the peripheral circuit component 174, the signal processing IC 17
Separate TAB tapes 176a, 1
One end of 76b is connected to protruding electrodes 177 formed on two sides facing the solid-state imaging device chip 171.
A signal transmission cable 178 is connected to the other end of each of the B tapes 176a and 176b. Thereafter, the inner lead 179 is bent to the side opposite to the light receiving section of the solid-state image sensor chip 171. The area around the bent portion was sealed.

[0005]

However, according to the technology disclosed in the solid-state imaging device disclosed in Japanese Patent Application Laid-Open No. 5-115435, the peripheral circuit component 174 and the signal processing IC 175 shown in FIG. Since it is arranged in the vertical direction with respect to 171, the length of the rigid portion of the endoscope insertion portion, which is the length in the longitudinal direction of the imaging device, becomes longer, causing a pain to the patient.

Since the inner space formed by bending the two TAB tapes 176a and 176b becomes hollow, there arises a problem in terms of durability when used as an endoscope, and the signal transmission cable 178 is connected one by one to the protruding electrode. However, there is a disadvantage that the assembling efficiency is poor due to the structure of the above.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and solves the problem of increasing the size by mounting a plurality of electronic components, as well as improving the connection strength and assembling efficiency. It is intended to provide a device.

[0008]

According to the present invention, there is provided a solid-state imaging device comprising: a solid-state imaging device chip having an imaging surface disposed at an imaging position of an objective lens system; A circuit board on which electronic components are housed and mounted, and a TA that electrically connects the solid-state imaging device chip and the circuit board and at least has peripheral circuit electronic components.
B, and a TAB tape connected to the solid-state imaging device chip is bent to dispose the circuit board, the electronic components, and the peripheral circuit electronic components in a laminated structure at the rear of the back of the solid-state imaging device chip. Has been established.

According to this configuration, a plurality of electronic components arranged on the TAB tape are stacked and arranged at a position behind and behind the solid-state image sensor chip, so that the size of the imaging device is reduced and the efficiency of assembly is increased. Is easily achieved.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to an embodiment of the present invention. FIG. 1 is an explanatory diagram showing the entire configuration of an endoscope device, FIG. 2 is an explanatory diagram showing the entire configuration of an imaging device, and FIG. FIG. 3 is a diagram illustrating an imaging unit that performs the operation.

As shown in FIG. 1, an endoscope apparatus 1 according to the present embodiment includes, for example, an endoscope 2 for obtaining an observation image of a part to be inspected, and a light source apparatus for supplying illumination light to the endoscope 2. 3
A video processor 4 for controlling the endoscope 2 and performing signal processing on an image signal obtained by the endoscope 2, and a monitor 5 for receiving a video signal output from the video processor 4 and displaying an observation image It is mainly composed of

The endoscope 2 includes a distal end portion 6 provided with an illumination optical system and an observation optical system, a bending portion 7 connected to the distal end portion 6 and capable of bending in, for example, up, down, left and right directions. It has an elongated insertion section 9 composed of a flexible section 8 connected to the bending section 7 and having flexibility. An operation section 10 is provided at the base end side of the insertion section 9. A universal cord 11 in which a light guide or the like is inserted is extended from a side portion 10.

The endoscope 2 has a universal cord 11.
And is detachably connected to the light source device 3 via a light guide connector 11a provided at an end of the signal cable 12 extending from a side of the light guide connector 11a. The video processor 4 is detachably connected to the video processor 4 via the electric connector 12a.

Illumination light emitted from a lamp (not shown) provided in the light source device 3 is transmitted through the light guide connector 11a, the universal cord 11, the operation section 10 of the endoscope 2, and the insertion section 9. The light is guided to the distal end portion 6 via the guide, and is irradiated toward the inspection target site. The image of the inspection target portion obtained by being illuminated by the illumination light is formed on a solid-state image sensor chip, which will be described later, provided at the distal end portion 6, converted into an electric signal, and transmitted to the video processor 4. Then, after the video processor 4 generates a video signal, the video signal is transmitted to the monitor 5, and an observation image is displayed on a monitor screen.

[0015] As shown in FIG.
Is provided with an imaging device 20 serving as an observation optical system.
The imaging device 20 includes an objective optical unit 2 which is an objective lens system.
1 and an imaging unit 22. The objective optical unit 21 includes a plurality of lenses 23,.
3 is fixedly arranged at a predetermined position. At the base end side of the outer peripheral surface of the lens fixing frame 24, an image pickup element fixing frame 26 in which a first protective glass 25 constituting the image pickup unit 22 is disposed at the base end is fitted.

The imaging section 22 has a solid-state imaging element chip 27 having a rectangular shape and a light receiving section 27a provided at a substantially central portion on the distal end surface side of the objective optical section 21, and a base end surface side of the solid-state imaging element chip 27. A circuit board 30 made of a hard material such as a ceramic, in which a signal processing IC 29 as an electronic component is disposed in a recess 30a.
A first peripheral circuit component 33 connected to the solid-state imaging device chip 27 and mounted on one surface side, the peripheral circuit component 33 being bent toward the base end surface side of the circuit board 30;
It is mainly composed of a TAB tape 31 and a second TAB tape 32 connected to the solid-state imaging device chip 27 and bent and arranged like the first TAB tape 31.

Note that connection portions (not shown) having a plurality of terminals serving as input / output portions are provided in rows on the upper and lower portions of the light receiving portion 27a of the solid-state imaging device chip 27 as shown in the drawing. . The number of TAB tapes is not limited to two, but may be two or more. further,
A signal transmission cable 34 extends from the base end of the imaging device 20 toward the video processor 4.

Referring to FIG. 3, the configuration of the image pickup section 22 will be specifically described. As shown in FIG. 2A, the signal processing IC 29 is provided at the center of the base end face side of the circuit board 30 which is integrally adhered and fixed to the base end face side of the solid-state image sensor chip 27.
A concave portion 30a for arranging the projection electrode 3 is provided on the wiring pattern formed in the concave portion 30a.
The signal processing IC 29 is face-down bonded to 0b to electrically connect the signal processing IC 29 to the circuit board 30. Further, a light receiving unit 27a provided substantially at the center of the front end surface side of the solid-state imaging device chip 27 is provided.
A second protective glass 35 is integrally adhered and fixed to a front surface of the first substrate by a transparent resin 36 (see FIG. 2).

An inner lead 31a is provided on one surface side of the first TAB tape 31, and the peripheral circuit component 33 is attached to the inner lead 31a by a conductive adhesive 3a.
7, the end of the inner lead 31 a protruding from the front end of the TAB tape 31 is arranged in a row below the light receiving section 27 a provided on the front end of the solid-state image sensor chip 27. Are provided with a plurality of protruding electrodes 38 which serve as electrical contacts with a plurality of connection portions provided in the plurality.

An inner lead 32a is provided on one side of the second TAB tape 32.
The distal end of the inner lead 32a protruding from the distal end side of the AB tape 32 is connected to a plurality of connection portions provided in a row above the light receiving portion 27a provided on the distal end surface side of the solid-state imaging device chip 27. A plurality of protruding electrodes 38 serving as electric contacts are provided.

The first TAB tape 31 and the second
The TAB tape 32 is provided with a first bent portion, which is a mountain-folded portion, which is bent at a substantially right angle on the opposite side to the light receiving portion 27a at a position indicated by an arrow A in the drawing, and has a TAB tape.
The position of the tape 31 indicated by the arrow B1 and the TAB tape 32
A second bent portion, which is a mountain-folded portion similar to the first bent portion, is provided at a position indicated by arrow B2. Further, the TAB tapes 31 and 32 are provided with a connection space 39 for connecting to connection wiring (not shown) provided on the side surface of the circuit board 30. An isotropic or isotropic conductive member 40 is provided so as to be electrically and mechanically connected.

As shown in FIG. 2B, the circuit board 30 having the signal processing IC 29 disposed in the recess 30a is integrally bonded and fixed, and the second protective glass 35 is integrally formed on the front surface of the light receiving section 27a. With the protruding electrode 38 provided on the first TAB tape 31 fixed to the tip end surface of the solid-state imaging device chip 27 that is fixed and adhered, the first TAB tape 31 is fixed.
When the first bent portion and the second bent portion are bent, the peripheral circuit component 33 mounted on the first TAB tape 31 is positioned substantially at the center of the base end surface side of the circuit board 30 and the TAB tape 31 The total length of the TAB tape 31 and the position of the peripheral circuit component 33 are set so that the base end of the TAB tape does not protrude from the range indicated by the dimension C.

Further, the first bent portion and the second bent portion of the second TAB tape 32 are fixed in a state where the protruding electrodes 38 of the second TAB tape 32 are fixed to the front end side of the solid-state imaging device chip 27. Like the first TAB tape 31, the entire length of the TAB tape 32 is set so that the base end of the second TAB tape 32 does not protrude from the range indicated by the dimension C when the portion is bent.

As shown in FIG.
Is connected to one end of a signal transmission cable 34. The end surface of the signal transmission cable 34 is flattened by polishing or the like so as to expose only the conductor portion provided in the signal transmission cable 34, and then is connected to the second TAB tape 32 via the conductive member 40. It is electrically connected. Further, an adhesive 28 is applied as a reinforcing member around a connection portion between the second TAB tape 32 and the signal transmission cable 34. Further, when the first bent portion and the second bent portion of the second TAB tape 32 are bent, a connection portion between the second TAB tape 32 and the signal transmission cable 34 is mounted around the first TAB tape 31. The arrangement position of the connection portion is set so as to be arranged substantially at the center of the upper surface side of the circuit component 33.

Then, the peripheral circuit component 33 mounted on the first TAB tape 31 is
7 is bent so as to be located substantially at the center on the back side of the circuit board 30 bonded and fixed to the base end face of the first T.
While the AB tape 31 is integrally bonded and fixed to the circuit board 30 with an adhesive 28, the second TAB tape 32 is bent, and then the second TAB tape 32 is attached to the first TAB.
The circuit board 30, the signal processing IC 29, and the peripheral circuit component 33 are integrally fixed on the upper surface of the peripheral circuit component 33 mounted on the tape 31 with an adhesive 28.
Are arranged in a stacked structure behind the back surface of the solid-state imaging device chip 27. As a result, the second protective glass 35,
Light receiving section 27a, solid-state image sensor chip 27, circuit board 3
0, the signal processing IC 29, the peripheral circuit component 33, and the signal transmission cable 34 are arranged in a laminated structure to constitute the imaging unit 22 of the imaging device 20 shown in FIG. Reference numeral 41
Is a sealing resin member.

As described above, a TAB tape having a bent portion provided with at least one of a peripheral circuit electronic component and a signal transmission cable, in which a signal processing IC is provided in the recess and a signal processing IC is provided in the recess, is used as a solid-state imaging device. By configuring the imaging unit of the imaging device by connecting to the chip, the circuit board, the signal processing IC, and the peripheral circuit components have a laminated structure behind the back surface of the solid-state imaging device chip, and the second protective glass, the light receiving unit, and the solid-state imaging device Element chip, circuit board, signal processing I
C, peripheral circuit components, and signal transmission cables are arranged in a stacked state in the optical axis direction of the objective optical unit, and the length of the imaging unit on which a plurality of electronic components are mounted is shortened in the optical axis direction to reduce the length of the imaging device. The size can be reduced.

Further, since the TAB tape provided with at least one of the peripheral circuit electronic parts and the signal transmission cable is alternately bent and adhesively fixed around the back side of the solid-state image sensor chip, the image pickup section can be assembled. In addition, the efficiency and reliability of the assembling work can both be greatly improved.

As shown in FIG. 4, a peripheral circuit component 33 is disposed via a conductive member 40 in a concave portion 30a of a circuit board 30 constituting the imaging section 22 of the present embodiment, and a first T
The signal processing IC 29 is mounted on the AB tape 31 with the protruding electrodes 30b.
When the first TAB tape 31 is folded while face-down bonding is performed through
The circuit board 30 and the signal processing IC 29 are bonded to the adhesive 28
To be integrally bonded and fixed. Thus, the same operation and effect as those of the above embodiment can be obtained. The same members are given the same reference numerals and the description is omitted.

Further, as shown in FIG. 5, in the present embodiment, the circuit board 3 in the configuration of the image pickup section 22 shown in FIG.
The circuit board 30 and the solid-state image sensor chip 27 are integrally adhered and fixed with an adhesive 28 with the concave portion 30a of 0 facing the solid-state image sensor chip 27 side. Thus, the same operation and effect as those of the above-described embodiment can be obtained.

Further, as shown in FIG. 6, in the present embodiment, the first
An H-shaped circuit board 30H having a substantially H-shaped cross section provided with the concave portion 30a and the second concave portion 30c is provided. In the first concave portion 30a of the H-type circuit board 30H, peripheral circuit components 33 are provided.
Are electrically connected via a conductive member 40, while a signal processing IC 29 is face-down bonded through a protruding electrode 30b in the second recess 30c, and the periphery of the signal processing IC 29 is recessed. And is sealed by a sealing resin 41 so as not to protrude. Then, the solid-state image sensor chip 27 and the H-type circuit board 30H are adhered and fixed by an adhesive 28 such that the mounting surface of the peripheral circuit component 33 is arranged on the base end surface side of the solid-state image sensor chip 27. .

The solid-state image pickup device chip 27 has the first TAB tape 31A and the second TAB tape 31A in the same manner as in the above-described embodiment.
However, the TAB tape 31A does not have the peripheral circuit component 33 mounted thereon, and is not provided with the second bent portion. The length dimension is set shorter than the first TAB tape 31. Specifically, the base end of the TAB tape 31A and the base end surface of the H-type circuit board 30H are at the same position. Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

As described above, the circuit board is divided into the first concave portion and the second concave portion.
H-type circuit board having a first concave portion and a first concave portion, and a peripheral circuit component and a signal processing I
By storing and arranging C and bending and arranging the second TAB tape, the same operation and effect as in the above-described embodiment can be obtained.

Hereinafter, an example of the configuration of an image pickup apparatus which is reduced in size will be described. The same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. By the way, in order to reduce the size of the imaging device, in the present embodiment, the cable fixing portion is configured as follows.

In this embodiment, FIGS. 7A and 7B
As shown in FIG.
, A signal transmission cable 56 is electrically and mechanically connected. The socket 53 is attached to a signal transmission cable 56.
Line part 54 having a plurality of simple lines 54
a, a signal line portion 56 including a plurality of coaxial lines 55a on the base end side
a. The socket 53 has a built-in resistor 52 for impedance matching, and the resistor 52 is connected in series with a simple Vout line.

The simple line portion 54a is connected to the signal line portion 56a.
And the simple line portion 5
The length of 4a is about 50 mm to 200 mm.

As described above, by attaching the socket to the signal transmission cable and connecting the simple line and the coaxial line with the socket, the fixed portion of the signal transmission cable is reduced in size, thereby reducing the size of the entire imaging apparatus. Can be. Also,
By setting the length of the simple line portion to about 50 mm to 200 mm, the coaxial line portion does not hit the curved portion of the endoscope (not shown), and the bending resistance can be greatly improved.

By the way, in this embodiment, the signal transmission cable and the solid-state image sensor chip are connected as follows in order to reduce the size of the image pickup apparatus.

In this embodiment, as shown in FIG. 8B, the sheath 61 of each signal line in the signal transmission cable 34 is stripped to a required length to expose the insulator 62, and the tip of the insulator 62 is exposed. The portion is peeled off to expose the cable core wire 63, and a bump is formed at the end of the exposed cable core wire 63, and the protruding electrode 38 is crimped to the bump.

As shown in FIG. 3A, a circuit board 30 having a peripheral circuit component 33 mounted in a recess 30a is bonded and fixed to the base end surface of the solid-state image sensor chip 27 with an adhesive 28. A signal processing IC 29 is connected to the circuit board 30 via a protruding electrode 30b (not shown).
Is electrically connected to

The exposed cable core 63 of the signal transmission cable 34 is connected to the signal processing IC 29 and the recess 30.
a, a circuit board 30 on which a peripheral circuit component 33 is mounted, disposed on a side of the solid-state imaging device chip 27, and electrically connected to a connection portion provided on the solid-state imaging device chip 27 via a protruding electrode 38. I have. Further, the cable core 63 and the circuit board 30 are electrically and mechanically connected via the conductive member 40.

Then, the second protective glass 35 is placed on the transparent resin 3.
After being fixed to the front surface of the light receiving section 27a through the intermediary 6, the image pickup section 22 is formed by sealing with a sealing resin 41.

As described above, by directly connecting the cable core of the signal transmission cable to the connection portion of the solid-state imaging device chip, the rigid length can be reduced, and the wiring member such as TAB tape and the substrate can be used. It becomes unnecessary and cost can be reduced.

By reducing the shape of the solid-state imaging device chip in order to reduce the size of the imaging section of the imaging device, the level of a signal output from the solid-state imaging device chip becomes different. In other words, as shown in FIG. 9A, the signal output from the first solid-state image sensor chip 71 is amplified by the buffer IC 72, and the signal level becomes, for example, "1" at the d section and is transmitted to the CCU 73. Had become.

However, when the solid-state image sensor chip is downsized and is changed to the second solid-state image sensor chip 74, the signal output from the second solid-state image sensor chip 74 is amplified by the buffer IC 72, but is amplified by the d section. Is changed to "0.5" and cannot be transmitted to the CCU 73. In this case, the signal must be changed to the buffer IC 75 so that the signal can be transmitted to the CCU 73. That is, the buffer IC to be arranged near the solid-state imaging device chip must be redesigned each time in accordance with the change in the output signal level from the solid-state imaging device chip, and thus there is a problem that the development schedule and the development cost are increased. . Therefore, there has been a demand for an imaging apparatus that can use a common buffer IC regardless of the output signal level from the solid-state imaging element chip.

In this embodiment, as shown in FIG. 9B, the output level of the signal amplified by the buffer IC 72 and output to the portion e is changed from "1" regardless of the output signal level of the solid-state image sensor chip 74. An output level adjusting I which is set so as to have a small value and has an external variable resistor 76a for variable output between the buffer IC 72 and the CCU 73.
C76 is provided so that the output level of the signal output from the output level adjusting IC 76 can be adjusted to "1" which can be transmitted to the CCU 73 by appropriately changing the value of the external resistor 76a.

As described above, by providing the output level adjusting IC capable of changing the output between the buffer IC and the CCU disposed near the solid-state image sensor chip, the output signal level of the solid-state image sensor chip can be reduced. Regardless,
A common buffer IC can be arranged near the solid-state imaging device chip. With this, regardless of the signal output level from the solid-state imaging device chip, a signal of a predetermined output level can be input to the CCU to perform signal processing, so that development man-hours and costs can be reduced, and
The size of the solid-state imaging device chip can be reduced, and the entire imaging device can be reduced in size.

As shown in FIG. 10A, in the mounting structure of the image pickup device using the TAB method, the solid-state image pickup device chip 27 has a thickness equal to the thickness of the inner lead attachment portion of the TAB tape 77 from the outer peripheral surface of the solid-state image pickup device chip 27. There is a problem in that the external dimensions of the (A) become large (dimension A). For this reason, there has been a demand for an imaging unit 22 having a configuration in which the TAB tape 77 does not become larger than the outer dimensions of the solid-state imaging device chip 27.

As shown in FIG. 10C, in this embodiment, the TA of the solid-state image sensor chip 27A in a wafer state is set.
A substantially circular through-hole 78 is formed on the outer peripheral surface on which the B tape 77 is disposed by using a drill, laser, etching, or the like, and then cut with a dicing saw to form a grooved solid-state image sensor chip 27A. . The groove 78a is coated with an insulating resin (not shown) in order to prevent a short circuit between the grooved solid-state image sensor chip 27A and the TAB tape 77.

Then, as shown in FIG.
The tip of the B-tape 77 has a grooved solid-state image sensor chip 27
After fixing to the connection portion A, the grooved solid-state imaging device chip 2
The TAB tape 77 is arranged in the groove 78a of 7A.
As a result, the inner lead does not protrude from the side peripheral surface of the grooved solid-state imaging device chip 27A, so that the width of the side portion is smaller than the above-described size A. The width dimension of the circuit board 30 is reduced by forming the groove 78a in the solid-state imaging device chip 27A.

As described above, by forming the groove for accommodating the inner lead of the TAB tape on the side surface of the solid-state imaging device chip in advance, after fixing the TAB tape to the connection portion of the solid-state imaging device chip, the inner lead is connected. Since the inner lead does not protrude from the side peripheral surface of the grooved solid-state image sensor chip by accommodating in the groove, the relationship of the width of the side of the image pickup unit is set to A> A1, and the size of the image pickup device is reduced. Can be achieved.

In the image pickup apparatus, since the signal transmission cable is a coaxial multi-core cable formed by twisting a large number of coaxial cables, a bump projection is formed on the cable end face, and the projection provided on the cable end face is connected to the HIC board. And so on. However, when a load is applied to the joint, the joint between the cable and the board may come off, so use adhesive or heat-shrink tubing to strengthen the joint between the cable and the board. Part was provided. However, there is a problem in that the provision of the reinforcing portion increases the outer dimensions, complicates the structure, and increases the number of assembly steps. For this reason, a connection structure between a cable and a board, which is unlikely to cause a problem due to a load applied to the connection portion, has been desired.

As shown in FIG. 11A, in this embodiment, in the embodiment, a reinforcing pipe 81 with an engaging portion is caulked on the outer peripheral surface side of the signal transmission cable 34, and the cable cores 63,. The end face is polished so that the end face 81 is flush with the end face and the core wire 63 is uniformly exposed.

After the end surface of the signal transmission cable 34 with the pipe 81 whose end surface is polished is brought into contact with a protruding electrode 30b formed by wire bonding, etching or the like provided on the circuit board 30, a connecting portion (not shown) is connected to the contact portion. A constituent jig is arranged, and a shrinkable adhesive 82 is filled in the jig and molded and cured. Then, due to the curing shrinkage stress when the adhesive 82 is cured, the protruding electrode 30b and the core wire 63 on the end face of the signal transmission cable 34 are brought into a pressed contact state and are always electrically connected. Therefore, when a load is applied to the contact portion, the projecting electrode 30b and the core wire 63
A degree of freedom in the lateral direction is generated at a contact portion with the protrusion, and the relative position between the protruding electrode 30b and the core wire 63 shifts to reduce the load.

The shape when the adhesive 82 is molded and hardened is not limited to the shape of the above-described embodiment. For example, as shown in FIG. Also, the U-shape improves the fitting property. Instead of filling the jig with the adhesive and curing the jig to form the connection portion, a contact connection portion for connecting the cable and the substrate with an elastic member having high contraction stress may be formed.

As described above, when forming the connecting portion for electrically connecting the cable and the board, the projecting electrode of the board and the core wire of the end surface of the signal transmission cable are brought into close contact with each other due to the contraction stress of the member forming the connecting portion. Thereby, the degree of freedom in the lateral direction is generated in the contact portion between the protruding electrode and the core wire, and the load applied from the outside can be reduced to prevent the occurrence of a failure in the electrical connection portion, The durability of the mechanical connection can be greatly improved.

Further, compared with the conventional method of reinforcing the joint, the amount of the heat shrinkable tube and the adhesive can be reduced, and the number of steps can be reduced.

By the way, in the structure of the conventional imaging device, TA
In the mounting structure of the imaging device using the B method, there is a problem that the outer dimensions of the solid-state imaging device chip are increased from the outer peripheral surface of the solid-state imaging device chip by the thickness of the inner lead attachment portion of the TAB tape. Therefore, there has been a demand for an imaging device in which the outer dimensions of the imaging device are substantially the same as the outer dimensions of the circuit board.

As shown in FIG. 12A, in this embodiment, after the solid-state image sensor chip 85 and the circuit board 86 are bonded, the conductive ink 87 is applied to the edges and side surfaces of the solid-state image sensor chip 85 and the circuit board 86. And an insulating resin 88 for preventing short circuit is printed, coated or applied, and then the insulating resin 88 is irradiated with a light beam 89 such as laser, infrared ray, ultraviolet ray or the like as shown in FIG. Thus, a connection portion (not shown) of the solid-state imaging device chip 85 and a connection portion (not shown) of the circuit board 86 are electrically connected.

The irradiating section for irradiating the light beam may be either a conductor or an insulator.

As described above, by drawing out the input / output portion with the conductive ink, the projection electrode and the reinforcing resin provided on the substrate for connecting the solid-state imaging device chip and the circuit board are unnecessary, and the width of the imaging portion is reduced. Is substantially equal to the width dimension of the circuit board, so that the imaging device can be reduced in size.

By the way, in this embodiment, in order to reduce the size of the imaging device, FIGS. 13 (a), 13 (b), (C),
As shown in (d), in the present embodiment, the cross-sectional shape of the circuit board is formed in a substantially L shape, a substantially T shape, or the like. As shown in FIG. 1A, in this embodiment, the circuit board 9 is used.
1 is formed in an L-shape, and a concave portion 91a for disposing the signal processing IC 29 is provided in a part of the outer peripheral surface side. The signal transmission cable 34 is arranged in the space A of the circuit board 91, and the signal transmission cable 34 is integrally fixed to the circuit board 91 by a cable fixing member 95. The signal processing IC 29 is electrically connected via the protruding electrode 30b.

As shown in FIG. 6B, in this embodiment, the circuit board 92 is formed in a T shape, the signal processing IC 34 is arranged in the lower space D, and the signal is transmitted to the upper space A. The cable 34 is arranged.

As shown in FIGS. 9C and 9D, in the present embodiment, a notch 94 is formed in the central substrate 93 shown in FIG. The transmission cable 34 is arranged, and the signal transmission cable 34 is integrally fixed to the board by the cable fixing member 72.

In the above-described embodiment, after the protective glass 35 is adhered to the solid-state image sensor chip 60, the input / output terminal (not shown) of the solid-state image sensor chip 27 and the TAB tape 77 are connected via the protruding electrodes 38. Connected.

As described above, the circuit board is L-shaped or T-shaped.
By providing a space for placing electronic components and signal transmission cables on a circuit board, the rigid length can be reduced and the bending resistance of the signal transmission cables can be improved. Can be.

In this embodiment, the connection between the signal transmission cable and the circuit board is configured as follows in order to reduce the size of the image pickup apparatus.

As shown in FIG. 14A, one end of the signal transmission cable 34 has a flattened cut surface, and the cable cores 1 located at the centers of the plurality of coaxial wires 101, respectively.
02 and the shield 103 arranged so as to surround the periphery of the cable core wire 102 are uniformly exposed.

As shown in FIG. 7B, device holes 105 of a TAB tape 104, which will be described later, are aligned with cable cores 102 of a plurality of coaxial lines 101 provided in the signal transmission cable 34. It has become.

As shown in FIG.
The TAB tape 104 to be connected to is formed with two layers of inner leads, that is, a first inner lead 106 and a second inner lead 107 with an insulator 108 interposed therebetween. The first
Inner lead 106 and second inner lead 107
Are provided with a first protruding electrode 109 and a second protruding electrode 110 having different diameters, respectively.
02 and the shield 103 and the first inner lead 106
And the second inner lead 107 are electrically connected.

At this time, specifically, for example, the diameter of the first protrusion electrode 109 is about 30 μm, and the diameter of the second protrusion electrode 110 is about 90 μm.
That is, the inner leads 106 and 107 and the insulator 1
08 in consideration of the thickness dimension of each layer.
By adjusting the diameter of 10, a reliable conduction is achieved.

As described above, by providing the inner leads of the two-layer structure on the TAB tape and connecting the inner leads provided on the two layers to the cable core and the shield of the coaxial cable, respectively, the wiring space can be greatly reduced. Thus, the size of the imaging device can be reduced. In addition, by appropriately setting the diameter of the two types of projecting electrodes in accordance with the thickness of the inner lead and the insulator, the two types of projecting electrodes can be connected to the shield and the cable core in a single operation. As a result, the connection between the electrode and the coaxial line can be quickly performed in a stable state, and the reliability of the connection portion is greatly improved.

By cutting the solid-state imaging device chip as follows, it is possible to reduce the size of the imaging device.

As shown in FIG. 15, in the present embodiment, the solid-state image sensor chip patterns 112a, 11a of the solid-state image sensor chip 112 arranged on the silicon wafer 111 are provided.
2b is asymmetric with respect to the vertical direction in the figure,
These are made into one block, are arranged at equal intervals so that the chip shape becomes the same shape at the time of scribing, and cut out is performed by a slice line shown below.

That is, the scribe line is represented by reference numeral 11
A scribe line 1 for simultaneously chamfering a vertical cutting line 3a and a horizontal cutting line 113b at the same angle with respect to two sides of the solid-state image sensor chip patterns 112a and 112b on the silicon wafer 111 at a plurality of locations.
14a and 114b.

As described above, by arranging the solid-state image sensor chip patterns vertically on the silicon wafer so as to be able to chamfer two sides of the plurality of solid-state image sensor chips simultaneously, the chamfering operation is simplified. As a result, the work efficiency can be improved, and a chamfered portion is formed in each solid-state image sensor chip, so that the chip size of the solid-state image sensor chip can be reduced and the size of the image pickup apparatus can be reduced.

By the way, when connecting the solid-state imaging device chip, the signal processing circuit section, and the signal transmission cable, one coaxial line was drawn out from the signal transmission cable and connected to each other. However, there is a problem that the hard length becomes longer. In addition, since the coaxial wires are pulled out one by one and processed, the number of man-hours is large, and a great deal of time is required for the connection work. For this reason, there has been a demand for an image pickup apparatus that can be easily connected and reduced in size.

In this embodiment, as shown in FIG. 16C, a signal processing IC is
122 and peripheral circuit parts 123 are mounted. Sign 1
24 is an inner lead.

As shown in FIG.
The inner lead 124 protruding toward the distal end of the solid-state imaging device chip 27 is connected to the connecting portion provided on the solid-state imaging device chip 27 via the protruding electrode 38, and the first bent portion A and the second bent portion are provided. After being bent at the portion B, the solid-state imaging device chip 27 and the TAB tape 121 are integrally fixed by the sealing resin 41.

The end surface of the signal transmission cable 34 electrically connected to the TAB tape 121 fixed to the solid-state image sensor chip 27 is flattened by polishing or the like. TAB tape 121
Is electrically connected and fixed to the cable connecting surface 121a via the conductive member 40.

The signal processing IC 1 of the TAB tape 121
The electronic component mounting portion 121b on which the component 22 and the peripheral circuit component 123 are mounted is disposed so as to cover the outer peripheral surface of the signal transmission cable 34 as shown in FIG. It is arranged and fixed along the outer peripheral surface.

As described above, the TAB tape is formed in a substantially T shape, the component mounting portion and the cable connection surface are provided on the TAB tape, and the signal transmission cable formed by flattening the end surface is electrically connected to the TAB tape. By connecting to
It is not necessary to pull out the wires from the signal transmission cable one by one, so that the rigid length can be shortened, and the work of pulling out the lead wires one by one from the signal transmission cable and stripping the coating is unnecessary. Therefore, the assembling time can be significantly reduced. As a result, it is possible to use a signal transmission cable having a reduced diameter, and it is possible to further reduce the diameter of the insertion portion.

Further, by arranging the component mounting portion of the TAB tape along the outer peripheral surface of the signal transmission cable, the rigid length can be reduced and the size of the imaging device can be reduced.

As described above, when connecting the solid-state imaging device chip, the signal processing circuit section, and the signal transmission cable, one coaxial line was drawn out from the signal transmission cable and connected. The problem that the hard length becomes longer by the length, the problem that the man-hour for drawing out and processing the coaxial cable increases and the work takes a lot of time, and furthermore, the signal transmission cable is arranged behind the signal processing IC As a result, there is a problem that the hard length becomes longer. For this reason, there has been a demand for an imaging device that has a small hard length and achieves miniaturization.

As shown in FIGS. 17A, 17B, and 17C, in this embodiment, the adhesive 131 is applied to the circuit board 30 on which the peripheral circuit components 123 are mounted in advance on the back surface of the solid-state image sensor chip 27. Then, a TAB tape 77 is connected to the solid-state imaging device chip 27 via the protruding electrode 38, and the solid-state imaging device chip 27 is bent and arranged along the outer peripheral surface of the solid-state imaging device chip 27. At 40, they are electrically connected.

The end surface of the signal transmission cable 34 is flattened by polishing or the like, and the distal end of the signal transmission cable 34 is fitted into a recess 30 a formed in the circuit board 30. It is electrically connected and fixed to the circuit board 30 via the conductive member 40.

The signal processing IC 122 includes the signal transmission cable 3
4, and electrically connected to the circuit board 30 via the protruding electrodes 30b. Note that the center position of the signal transmission cable 34 is attached at a position eccentric with respect to the center position of the optical axis.

As described above, the end portion of the signal transmission cable is fitted into the concave portion formed on the circuit board, and the end surface portion is electrically connected and fixed via the conductive member, thereby reducing the length of the hard portion. By forming a portion, the imaging device can be shortened.

By the way, since the solid-state imaging device chip has conventionally been formed in a square shape due to processing, when the imaging device is constituted by using this rectangular solid-state imaging device chip, the imaging device itself also has a square shape. . For this reason, when incorporating the imaging device into the distal end of the scope, it interferes with other built-in components, such as a light guide, and causes an increase in the outer diameter. Therefore, an imaging device that does not interfere with the built-in object has been desired.

As shown in FIGS. 18A and 18B, in this embodiment, side through holes 135 are formed at four corners of the solid-state
Is wired to this side through hole 135,
The circuit board 30 and the conductive member 136 are electrically connected.

By forming side through holes at the four corners of the solid-state image pickup device chip, empty spaces can be provided at the four corners, so that the light guide can be provided as shown by the arrow E in FIG. It is possible to avoid interference with the insertion portion 141 and to reduce the outer diameter of the distal end portion of the insertion portion by avoiding the interference as indicated by the arrow F. Reference numeral 142 denotes an objective lens, reference numeral 143 denotes a treatment tool insertion port, and reference numeral 144 denotes a scope tip.

Further, by using the side through holes provided in the solid-state imaging device chip as input / output terminals, the number of input / output terminals to be drawn out by providing a pad portion can be reduced, and the number of input / output terminals is 4 pins or less. 4 in case
Connection to the circuit board can be made possible only by the side through holes provided at the corners. This eliminates the need for TAB bonding via the protruding electrodes, thereby reducing the number of assembly steps.

By the way, when connecting the solid-state imaging device chip, the signal processing circuit section, and the signal transmission cable, one coaxial line is drawn out from the signal transmission cable and connected, and therefore, the length of the lead line is required. In addition, there is a problem that the hard length becomes longer, and after connecting the coaxial line of the signal transmission cable to the circuit board, the components from the coaxial cable to the signal cable are fixed with an adhesive.
However, in order to securely and stably hold with an adhesive, a fixed length is required, and there has been a problem that the hard length becomes longer.

As shown in FIG. 19, in the present embodiment, the signal processing IC
9 is mounted and fixed, two independent TAB tapes 77a and 77b are connected to the solid-state imaging device chip 27 via the protruding electrodes 38, and these TAB tapes 77a and 77b are bent and the circuit board 30 is bent. 30 is electrically connected to the side surface of the device 30 via a conductive member 40.

The flattened distal end surface of the signal transmission cable 34 is electrically connected to the TAB tape 77b via a conductive member 40. At this time, the TAB tape 77b is bent at a substantially right angle so as to be located on the back surface of the circuit board 30, and the adhesive 14 is attached to the circuit board 30.
5 glued.

Then, as described above, the TAB tape 77b
Circuit board 1 with a hole in signal transmission cable 34 connected to
46, the perforated circuit board 146 is pressed against the connection portion of the signal transmission cable 34 and the TAB tape 77, and electrically connected to the TAB tape 77 via the conductive member 40. At 41, they are integrally fixed.

The TAB tape 77a is attached to the circuit board 3
0 is electrically connected to the side surface of the perforated circuit board 146 via the conductive member 40.

As described above, by fixing the perforated circuit board through the signal transmission cable, the fixing strength can be improved as compared with the case of fixing the resin, and the fixing length of the imaging section can be shortened. Thus, the imaging device can be shortened.

By the way, in an image pickup apparatus using a microlens, it is necessary to secure at least 50 μm of an air layer between the image pickup apparatus and the protective glass in order to maximize its performance. For this reason, conventionally, spacers larger than the chip outer shape,
Although an air space is secured by using a sealing frame, a package, or the like, there is a problem that the outer dimensions of the imaging device are increased. For this reason, miniaturization of an imaging device using a microlens has been desired.

As shown in FIG. 20, in this embodiment, the micro lenses 152 of the number corresponding to the number of pixels of the light receiving elements 151 of the solid-state image sensor chip 27 are arranged on the upper surface of each light receiving element 151. At this time, the micro lens 15 located closest to the edge portion of the lens chip
2 so as to surround the entire circumference adjacent to the microlens 2.
A microlens dummy 153 formed by setting the height dimension higher than 52 is provided. Specifically, the height dimension of the microlens dummy 153 at this time is such that the air layer between the protective glass 35 and the microlens 152 is 50 mm.
It is formed to be about μm. At this time, each height dimension of the micro lens is set according to necessary optical performance and the like.
It may be changed depending on the arrangement position.

The micro lens dummy 153
Is a dummy to the last, and if there is no optical hindrance, the light receiving element 1
51 may be arranged. The microlens dummy 153 and the protective glass 35 are bonded and sealed with an adhesive, and the adhesive at this time may be transparent or opaque.

As described above, by providing the microlens dummy having a height dimension higher than that of the microlens so as to be adjacent to the microlens and to surround the entire circumference, a special sealing frame, member, or package can be used. In addition, it is possible to reduce the external dimensions of the imaging device by performing sealing utilizing the performance of the microlens without increasing the external dimensions, thereby reducing the size of the imaging device.

By the way, in order to reduce the size of the image pickup device, the protruding electrodes provided on the inner leads of the TAB tape were directly connected to the bare chip of the solid-state image pickup device chip. At this time, since the bonding portion is on the same plane as the light receiving portion of the solid-state imaging device chip, there is a problem that light rays incident on the solid-state imaging device chip are vignetted. For this reason, by increasing the chip size, it is possible to prevent light rays incident on the solid-state imaging device chip from being vignetted. However, this has been a factor that hinders downsizing of the imaging device.
For this reason, there has been a demand for an imaging apparatus that prevents vignetting of incident light without increasing the chip size.

As shown in FIG. 21, in the image pickup apparatus of this embodiment, the incident light range of the incident light passing through the objective lens and entering the solid-state image pickup device chip 27 gradually widens outward along the optical axis. The adjustments have been made to keep going. A glass substrate 156 on which a conductor 155 for double-sided connection is wired is electrically connected to the front surface of the solid-state imaging device chip 27 via a projecting electrode 157, and a projecting electrode is provided on the incident surface side of the glass substrate 156. TAB tapes 31 and 32 are electrically connected to each other via 38. At this time,
As shown by a1 and a2 in the figure, both the protruding electrodes 157 and the protruding electrodes 38 are arranged so as to be located outside the range of the incident light beam.

As described above, since the protruding electrodes are respectively arranged outside the range of the incident light beam from the objective lens system toward the solid-state imaging device chip and used as connection portions, the projection electrodes are incident on the light-receiving portion of the solid-state imaging device chip. It is possible to prevent the vibrating light from being vignetted, and to reduce the outer dimensions of the solid-state imaging device chip. In addition, it is possible to prevent an incident light beam from being vignetted, and to provide an efficient image pickup apparatus utilizing all the light receiving units.

Conventionally, the solid-state imaging device chip, the signal processing IC, and the circuit wiring board have been separately manufactured, and these have been assembled as one imaging device by bonding, soldering, bonding, or the like. For this reason, various problems have occurred, such as an increase in the outer shape of the imaging device, an increase in the number of assembly steps, and a decrease in the reliability of the connection portion. For this reason, there has been a demand for an image pickup device that has a reduced number of assembly steps, a high reliability of the connecting portion, and a small size.

As shown in FIG. 22, the image pickup unit 2 of the present embodiment
2 is a hybrid solid-state imaging device chip 160 provided with a light receiving section 161, a signal processing section 162, and a solder land section 163 on a substrate.
The protective glass 35 is bonded and fixed to the front surface of the light receiving section 161. Then, the coaxial line 3 of the signal transmission cable 34 preliminarily processed to a required length dimension.
4a is further stripped and the cable core 63
The cable core wire 63 and the coaxial line 34a which have been adjusted are respectively bent and exposed to the solder land portion 163 of the hybrid solid-state imaging device chip 160 by the conductive member 40 such as solder. After mechanically / mechanically connecting and fixing, the back surface of the hybrid solid-state imaging device chip 160 and the coaxial line 3
4a are integrally fixed using a sealing resin 41.

As described above, by forming the light receiving portion, the signal processing portion, and the solder land portion on the same substrate, it is possible to dispose each member at a fine interval, thereby reducing the size of the imaging device. Can be. Also, the electrical connection of the imaging device can be completed simply by connecting the signal transmission cable to the hybrid solid-state imaging device chip, so that the number of assembly steps can be reduced and the number of connection steps can be reduced to improve reliability. I can do it.

The connection between the cable core wire and the solder land may be made by using a protruding electrode. Further, in this embodiment, an example of the vertical arrangement is shown, but the arrangement may be horizontal.

The configuration of the above-described imaging device is not limited to an imaging device used for an endoscope, but can be applied to a product using a solid-state imaging device chip. Also,
The present invention is not limited to only the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[Appendix] According to the above-described embodiment of the present invention, the following configuration can be obtained.

(1) A solid-state image pickup device chip having an image pickup surface disposed at an image-forming position of an objective lens system, and an electronic component which is disposed close to the back surface of the solid-state image pickup device chip and accommodated therein. A circuit board, electrically connecting the solid-state imaging device chip to the circuit board, and a TAB tape provided with at least peripheral circuit electronic components, and bending the TAB tape connected to the solid-state imaging device chip to form the circuit. An image pickup apparatus, wherein a substrate, the electronic component, and the peripheral circuit electronic component are arranged in a laminated structure at a position behind and behind the solid-state image sensor chip.

(2) The imaging device according to Appendix 1, wherein at least two TAB tapes are provided on the side surfaces of the solid-state imaging device chip and the circuit board, and are alternately bent to form a laminated structure.

(3) The imaging device according to attachment 1, wherein a TAB tape is disposed at the rearmost end of the laminated structure, and a signal transmission cable is connected to the TAB tape so as to be located behind and behind the solid-state imaging device chip.

(4) The protective glass, the solid-state image sensor chip, the circuit board, the signal processing IC,
2. The imaging device according to claim 1, wherein the TAB tape, peripheral circuit components, the TAB tape, the cable fixing member, and the signal transmission cable have a laminated structure.

(5) Appendix 4 in which the distal end surface of the signal transmission cable is formed flat and electrically connected to the TAB tape.
An imaging device according to any one of the preceding claims.

(6) Electronic components are mounted on a TAB tape,
5. The imaging device according to claim 4, wherein the TAB tape is bent along an outer periphery of the signal transmission cable, and the mounting portion is fixed to a side of the signal transmission cable.

(7) The imaging device according to attachment 1, wherein a cutout is formed in at least one corner of the solid-state imaging device chip.

(8) The imaging device according to attachment 7, wherein the cutout portion is an electrical connection portion.

(9) The image pickup apparatus according to appendix 1, wherein a distal end portion of the signal transmission cable is electrically connected to a concave end surface formed in the circuit board.

(10) A board connected to the solid-state image sensor chip, a signal transmission cable having a cable end face electrically connected to the board, and an electric signal from the solid-state image sensor chip mounted on the board. An image pickup apparatus comprising: a signal processing unit for processing the signal; and a circuit board for fixing the signal transmission cable, wherein the circuit board for fixing the cable is a penetration type.

(11) In an image pickup apparatus provided with a plurality of microlenses in front of a light receiving section of a solid-state image pickup device chip,
An imaging apparatus, wherein the height of each of the plurality of microlens chips is set to a predetermined height according to a distance from the optical axis of the light receiving unit.

(12) The imaging device according to attachment 11, wherein a microlens dummy having a height higher than the plurality of microlenses is provided around the entire outer periphery of the plurality of microlenses.

(13) In an image pickup apparatus having an objective optical system for causing light to gradually enter from the center of the optical axis toward the outside toward the light-receiving surface of the solid-state image sensor chip, a light beam incident on the solid-state image sensor chip is An imaging device provided with electrical contacts outside the range of incident light.

(14) A signal line lead-out terminal of the solid-state imaging device chip, a signal transmission cable electrically connected to the solid-state imaging device chip, and an electric signal from the solid-state imaging device chip are electrically processed. An image pickup apparatus comprising: a signal processing unit; a light receiving unit, a signal processing unit, and a solder land formed on the same substrate of the solid-state image sensor chip; and a signal transmission cable directly connected to the solid-state image sensor chip. .

[0125]

As described above, according to the present invention, it is possible to solve the problem that the size is increased by mounting a plurality of electronic components, and to improve the connection strength and the assembling efficiency. Can be provided.

[Brief description of the drawings]

FIG. 1 to FIG. 3 relate to an embodiment of the present invention,
FIG. 1 is an explanatory diagram showing the entire configuration of the endoscope apparatus.

FIG. 2 is an explanatory diagram showing an overall configuration of an imaging apparatus.

FIG. 3 illustrates a configuration of an imaging unit.

FIG. 4 is a diagram illustrating another configuration of the imaging unit.

FIG. 5 is a diagram illustrating another configuration of the imaging unit.

FIG. 6 is a diagram illustrating still another configuration of the imaging unit.

FIG. 7 is a diagram illustrating a configuration of a cable fixing unit of the imaging device that has been reduced in size.

FIG. 8 is an explanatory diagram showing an example of connection between a signal transmission cable and a solid-state imaging device chip of an imaging device that has been downsized.

FIG. 9 is an explanatory diagram illustrating a configuration of an imaging device that is not affected by an output level of a signal output from a solid-state imaging device chip;

FIG. 10 is a diagram illustrating a mounting structure of an imaging device using a TAB method that is reduced in size.

FIG. 11 is an explanatory view showing an example of a connection structure between a cable and a board.

FIG. 12 is an explanatory diagram illustrating an example of a mounting structure of an imaging device that is reduced in size.

FIG. 13 is an explanatory diagram illustrating a configuration example of a circuit board of an imaging device that is reduced in size.

FIG. 14 is an explanatory diagram illustrating an example of a connection structure between a cable and a substrate of an imaging device that has been reduced in size.

FIG. 15 is an explanatory diagram showing an example of cutting a solid-state image sensor chip of an image pickup device with a reduced size;

FIG. 16 is an explanatory diagram showing another example of a connection structure between a cable and a substrate of an imaging device that has been reduced in size.

FIG. 17 is an explanatory view showing another example of a connection structure between a cable and a substrate of an imaging device that has been reduced in size.

FIG. 18 is an explanatory diagram illustrating a configuration example of an imaging device that does not interfere with internal components.

FIG. 19 is an explanatory view showing still another example of a connection structure between a cable and a substrate of an imaging device that has been reduced in size.

FIG. 20 is an explanatory diagram showing a configuration example for reducing the size of an imaging device using a microlens.

FIG. 21 is an explanatory diagram illustrating a configuration example of an imaging device that is reduced in size and that prevents vignetting of an incident light beam.

FIG. 22 is an explanatory diagram showing another example of a mounting structure of an imaging device that is reduced in size.

FIG. 23 is an explanatory diagram illustrating a configuration of an imaging unit of a conventional imaging device.

[Explanation of symbols]

 Reference Signs List 20 imaging device 21 objective optical unit 22 imaging unit 27 solid-state imaging device chip 30 circuit board 31 first TAB tape 32 second TAB tape

Claims (1)

[Claims] 1. A solid-state imaging device chip having an imaging surface arranged at an image-forming position of an objective lens system, and a circuit disposed close to a back surface of the solid-state imaging device chip and containing and mounting electronic components. A circuit board that electrically connects the solid-state imaging device chip and the circuit board, and includes a TAB tape provided with at least peripheral circuit electronic components; and bending the TAB tape connected to the solid-state imaging device chip to form the circuit board. An image pickup device, wherein the electronic component and the peripheral circuit electronic component are arranged in a laminated structure at a position behind and behind the solid-state image sensor chip.