JPH0884278A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE: To simplify the assembling work and attain ease of assembling with excellent job performance. CONSTITUTION: A board 2 on which a solid-state image pickup element 1 is mounted is formed nearly to be a disk and a window 3 used to intake an incident light from an objective lens 8 is made to the middle of the board 2. The solid-state image pickup element 1 is mounted to the board in the middle by a flip chip 4 opposite to the window 3 of the board 2 in the face-down way. The solid-state image pickup element 1 and the board 2 are aligned so that the center of the board 2 and the optical center of the image pickup area of the solid-state image pickup element 1 are in matching with each other. The board 2 with the solid-state image pickup element 1 mounted is inserted in a lens frame 6 formed cylindrically together with the objective lens 8 and fixed in a way that the center of the board 2, the optical center of the solid-state image pickup element 1 and an optical axis of the objective lens are aligned to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device arranged at the tip of an electronic endoscope.

[0002]

2. Description of the Related Art In recent years, a solid-state image pickup device having a solid-state image pickup device such as a CCD has been widely used in video cameras, endoscopes and the like. For example, a small solid-state imaging device is provided at the tip of the insertion portion of an endoscope to capture an image of an observation site, and the resulting image signal is processed by an electrical signal with a video processor or the like to generate an endoscope observation image. Various electronic endoscopes that are designed to be displayed on a monitor have come to be used.

Various types of solid-state image pickup devices have been proposed as such solid-state image pickup devices arranged at the distal end of the endoscope. For example, for downsizing, a bare chip of a solid-state image sensor is mounted on a substrate by a flip chip with the imaging area side facing the substrate by a face-down method, and the substrate and the lens frame of the objective optical system are coupled to form an imaging unit. A composition is proposed. FIG. 8 shows an example of the solid-state imaging device having such a configuration.

The solid-state image pickup device 51 is a flip chip 52.
Is mounted on one surface of the substrate 53. The solid-state imaging device 51 is attached by a so-called face-down method with the imaging area facing the substrate 53 side, and the electrode pads of the solid-state imaging device 51 and the pad portion provided on the substrate 53 are electrically connected and fixed. ing. A window 54 is formed in the center of the substrate 53, and the window 54 faces the image pickup area of the solid-state image pickup element 51 and opens. On the other surface of the substrate 53,
A lens frame 56 accommodating the objective lens 55 is adhesively fixed with an adhesive or the like. The light flux passing through the objective lens 55 is focused on the image pickup area of the solid-state image pickup device 51, picked up by the solid-state image pickup device 51, and converted into an image signal of an electric signal.

[0005]

In the configuration shown in FIG. 8, the substrate 53 on which the solid-state image pickup device 51 is mounted and the lens frame 56 on which the objective lens 55 is provided are fixed by combining them with their optical centers aligned. There is a need to. However,
In the assembly process, it is not easy to adjust the optical axis of the objective lens and the optical center of the solid-state image sensor so that the substrate and the lens frame are fixed to each other, and there is a problem that the adjustment work takes time.

The present invention has been made in view of these circumstances, and an object of the present invention is to provide a solid-state image pickup device capable of simplifying the assembling work, having good workability, and capable of being easily assembled. I am trying.

[0007]

A solid-state image pickup device according to the present invention is a solid-state image pickup device including an image pickup unit in which a solid-state image pickup element is mounted on a substrate by a flip chip in a face-down manner, and the substrate is formed into a substantially circular shape. Then, a window that allows light from the objective optical system to pass through is provided in the central portion, and the solid-state imaging device is arranged so that the imaging area faces the window and the center of the substrate coincides with the optical center of the solid-state imaging device. A substantially cylindrical lens frame which is arranged in the central portion of the substrate and accommodates the substrate and the objective optical system is provided, and the substrate and the objective optical system are fitted in the lens frame.

[0008]

The solid-state image pickup device is arranged in the central portion of the substrate so that the center of the substantially circular substrate and the optical center of the solid-state image pickup device coincide with each other, and the substrate and the objective optical system are arranged in a substantially cylindrical lens frame. The optical axis of the objective optical system and the optical center of the solid-state image sensor coincide with each other.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal axis direction sectional view showing the configuration of the main part of the solid-state imaging device according to the first embodiment of the present invention.

The solid-state image pickup device of this embodiment is composed of CCD, CM.
A substrate 2 for mounting a bare chip of a solid-state imaging device 1 made of D or the like is provided. The substrate 2 is composed of a printed circuit board made of glass epoxy resin or the like, has a substantially circular shape, and has a window 3 at the center for taking in incident light from the objective optical system.

The solid-state image pickup device 1 is mounted in a central portion of the substrate 2 by a flip chip 4 with its image pickup area facing the substrate 2 side, and is provided on each terminal of the solid-state image pickup device 1 and the substrate 2. The fixed electrode part is electrically connected and fixed. The imaging area of the solid-state imaging device 1 is arranged so as to face the window 3 of the substrate 2 and is exposed from the opening of the window 3. A cover glass 5 is sealed and fixed by an adhesive or the like to the portion of the window 3 on the surface of the substrate 2 opposite to the solid-state image sensor 1. By providing this cover glass 5, it is possible to prevent dust from adhering to the image pickup area and to provide a moisture-proof structure that keeps the solid-state image pickup element airtight.

The solid-state image pickup device 1 and the substrate 2 are the substrate 2
Of the solid-state image sensor 1 and the optical center of the imaging area of the solid-state image sensor 1 are aligned. This solid-state image sensor 1
Positioning and fixing of the substrate 2 and the substrate 2 can be easily and automatically performed by pattern recognition, for example.

The substrate 2 on which the solid-state image pickup device 1 and the cover glass 5 are mounted is inserted together with the substrate 2 into a cylindrical lens frame 6 made of a conductive member such as metal to form the lens frame 6.
It is fitted and fixed inside. The lens frame 6 has a stepped portion whose inner diameter is narrowed on the rear end side and has a key-shaped cross section, and the inner peripheral surface of the lens frame 6 has a substantially outer peripheral side surface portion of the disk-shaped substrate 2. Then, the substrate 2 is positioned in the lens frame 6 by contacting the rear surface of the substrate 2 on which the solid-state imaging device 1 is provided on the stepped portion.

Further, in the lens frame 6, a space tube 7 for holding a predetermined space between the solid-state image pickup device 1 and the objective optical system is inserted in front of the substrate 2, and the rear end surface of the space tube 7 covers the substrate 2. It is in contact with the front surface provided with the glass 5. Further, an objective lens 8 is fitted in front of the spacing tube 7 in the lens frame 6, and a rear surface of the objective lens 8 is in contact with a front end surface of the spacing tube 7. The objective lens 8 has a front edge portion made of an adhesive. Adhesive fixed.

In this embodiment, in the lens frame 6, the substrate 2 and the objective lens 8 are fitted to the inner peripheral surface of the lens frame 6, and the fitting makes the centers thereof coincide with each other. Therefore, the optical axis of the objective lens 8 and the optical center of the solid-state image pickup device 1 fixed to the substrate 2 coincide with each other only by assembling them in the lens frame 6 without any special adjustment.

By thus aligning the optical axis of the objective optical system with the optical center of the solid-state image sensor, the brightness of the image becomes uneven, the image becomes blurred or distorted, and part of the image is vignetted. You can prevent problems such as

The lens frame 6 and the interval tube 7 have their inner surfaces accommodated in a black color to prevent unnecessary diffuse reflection of light rays.

A connection pin 9 electrically connected to the solid-state image pickup device 1 extends on the rear surface of the substrate 2, and a connection substrate 10 as a second substrate is connected to an end of the connection pin 9. And is arranged substantially parallel to the substrate 2. Connection board 1
Reference numeral 0 is a printed circuit board having a circuit pattern for signal transmission formed of glass epoxy resin or the like, and a core wire of a signal cable 11 for transmitting a drive signal to the solid-state image sensor 1 and an output signal from the solid-state image sensor 1. 11a are connected by soldering or the like. Although not shown, an impedance conversion circuit that converts the impedance of the output signal of the solid-state imaging device 1 is provided and is arranged on either the substrate 2 or the connection substrate 10.

The overall shield 12 of the signal cable 11 is electrically connected to the end of the lens frame 6, and a conductor 13 such as annealed copper wire is wound around this connection to fix the end of the overall shield 12. ing. This shields the entire imaging unit of FIG. Comprehensive shield 1
2 is also electrically connected to the shield of each core wire 11a of the signal cable 11. A portion including the solid-state image sensor 1, the connection substrate 10, and the core wire 11a inside the general shield 12 is sealed by a sealing member 14 such as a soft resin or an adhesive. By making the sealing member 14 flexible, the end portion of the signal cable 11 is provided with some degree of freedom to disperse the stress applied to the cable. Signal cable 11
A connector portion (not shown) is provided at the end portion on the proximal side, and is connected to the camera control unit via this connector portion.

The outer peripheral portion from the lens frame 6 to the front end portion of the signal cable 11 including the total shield 12 is covered with a coating tube 15 of an insulating member made of a heat shrink tube or the like to maintain insulation from the outside. ing.

When assembling the image pickup unit having such a structure, first, the solid-state image pickup device 1 is mounted on the substrate with the center of the substrate 2 and the optical center of the image pickup area of the solid-state image pickup device 1 being matched by pattern recognition or the like. The cover glass 5 is attached to one surface of the substrate 2 by a face-down method, and the cover glass 5 is sealed and fixed to a portion of the window 3 where the imaging area of the solid-state imaging device 1 is exposed in the central portion of the other surface of the substrate 2. Then, the substrate 2 on which the solid-state imaging device 1 is mounted is fitted into the lens frame 6 with the cover glass 5 side facing outward (front side), and then the lens frame 6 is inserted.
The interval tube 7 and the objective lens 8 are fitted inside and the front peripheral portion of the objective lens 8 is adhesively fixed.

On the other hand, on the rear surface side of the board 2 on which the solid-state image pickup device 1 is mounted, a connection board 10 is arranged via connection pins 9, and the core wire 11a of the signal cable 11 is connected to the connection board 10. And the general shield 12 of the signal cable 11
And the shield of each core wire 11a are electrically connected to each other, the total shield 12 is connected to the end portion of the lens frame 6, and the conductor 1 is connected to this connection portion.
While tightening and fixing by winding 3
Solid-state image sensor 1 inside the integrated shield 12, connection board 1
A portion including 0 and the core wire 11 a is sealed with the sealing member 14.
After that, the outer peripheral portion from the lens frame 6 to the front end portion of the signal cable 11 is covered with the covering tube 15.

According to the structure of this embodiment, the optical axis of the objective lens 8 and the solid state fixed to the substrate 2 are simply assembled by assembling the substrate 2 on which the solid-state image pickup device 1 is mounted and the objective lens 8 in the lens frame 6. The optical center of the image sensor 1 can be easily aligned with each other, and the work of adjusting the optical axis can be eliminated. Therefore, the work at the time of assembling can be simplified, the workability is good, and the assembling can be easily performed.

2 and 3 relate to a second embodiment of the present invention. FIG. 2 is a perspective view showing a structure of a substrate on which a solid-state image pickup device is mounted, and FIG. 3 is a longitudinal view showing a structure of a main part of the solid-state image pickup device. It is an axial sectional view.

The second embodiment is an example in which the shape of the substrate on which the solid-state image sensor is mounted is changed. The substrate 21 used in this embodiment is formed in a disk-shaped substrate as in the first embodiment by cutting out a part of the outer peripheral portion. In the example of FIG. 2, two portions on the outer peripheral portion of the substrate are cut out by parallel straight lines, and the shape viewed from the front has a substantially elliptical outer shape formed by connecting an arc and a parallel straight line. .

Similar to the first embodiment, the substrate 21 is mounted with the solid-state image pickup device 1 in a face-down manner so as to face the window provided in the central portion thereof, and the side flat surface 2 of the cutout portion of the outer peripheral portion.
An electrode 22 for a connection terminal is provided on 1a. The electrode 22 is electrically connected to the electrode portion of the mounting surface of the solid-state image sensor 1 and is electrically connected to each terminal of the solid-state image sensor 1. The side surface 21a on which the electrode 22 is provided is 2
It is not limited to those placed facing each other, but 1 on the side surface of the substrate.
It may be provided in three or more places.

FIG. 3 shows the configuration of the main part of the solid-state image pickup device of this embodiment. The substrate 21, on which the solid-state imaging device 1 and the cover glass 5 are mounted, the interval tube 7, and the objective lens 8 are fitted and disposed in the lens frame 6 as in the first embodiment, and are arranged as an optical axis of the objective lens 8. The center of the substrate 21 and the optical center of the solid-state image sensor 1 are aligned and assembled.

On the rear side of the board 21, a connection board 23 made of a flexible printed board as a second board.
a and 23b are provided, and the contact portions at the end portions of the connection substrates 23a and 23b are connected to the electrodes 22 on the side flat surface 21a of the substrate 21 by soldering or the like. Connection board 23
a and 23b are provided with circuit patterns for signal transmission,
It is configured to be electrically connected to the solid-state image sensor 1 to transmit a drive signal to the solid-state image sensor 1 and an output signal from the solid-state image sensor 1. These connection boards 23a, 23b
Are elongated and extend to a rear unillustrated connector portion, and are bent at a plurality of positions so that their rear surfaces are close to and parallel to each other. That is, in this embodiment, the connection boards 23a and 23b are used to transmit signals instead of the signal cables of the first embodiment, and the proximal ends of the connection boards 23a and 23b are connected via the connector section. It is designed to be connected to the camera control unit.

When two or more side planes 21a of the substrate 21 are provided, the electrodes 22 of the substrate 21 are divided into an input portion and an output portion and are arranged on different surfaces, and the connection substrates 23a and 23b are provided.
Is divided into an input side and an output side. In the example of FIG. 3, the connection board 23a is the input side and the connection board 23b is the output side. An impedance conversion circuit 24 that converts the impedance of the output signal of the solid-state image sensor 1 is provided on the output-side connection board 23b. When the input side and the output side are separated, the input side is not limited to the connection board, and either the connection board or the signal cable may be provided.

Then, from the lens frame 6 to the connection board 23a,
The outer periphery of the front end of 23b is covered with a coating tube 15 of an insulating member such as a heat-shrinkable tube, and the solid-state image sensor 1 and the connection substrate 23a inside the coating tube 15 on the rear side of the substrate 21. A portion including a front end portion of 23b is sealed by a sealing member 14 such as a soft resin or an adhesive.

Also in such a structure, as in the first embodiment, by only assembling the objective lens 8 and the substrate 21 on which the solid-state image pickup device 1 is mounted in the lens frame 6, the substantially circular substrate 21 and objective lens are assembled. The optical axis of the objective lens 8 and the optical center of the solid-state imaging device 1 fixed to the substrate 21 can be easily coincided with each other by fitting 8 and 8 to the inner peripheral surface of the lens frame 6, and the work at the time of assembly can be performed. It can be simplified and easily assembled. Further, in the present embodiment, since the signal is transmitted by the flexible printed circuit board, the cost can be reduced by the simplification of the configuration, and the work of assembling the signal cable and the connection substrate becomes unnecessary, so that the assembling workability is improved. It can be further improved.

FIG. 4 shows the configuration of a modification of the second embodiment.
This modification is a combination of the configuration of the flexible printed circuit board of the second embodiment provided with the connection board and the configuration of the first embodiment provided with the signal cable. The signal cable is provided at the rear end side of the connection board. Is an example in which is connected to connect with the connector section.

The connection boards 25a and 25b, which are flexible printed boards and are connected to the same board 21 as that of the second embodiment, on which the solid-state image pickup device 1 is mounted, have a predetermined length so as to extend rearward from the board 21 by a predetermined amount. Is formed and provided. An impedance conversion circuit 24 that converts the impedance of the output signal of the solid-state imaging device 1 is provided on the connection board 25b on the output side.

The core wire 26a of the signal cable 26 is connected to the rear ends of the connection boards 25a and 25b by solder 27. The proximal side of the signal cable 26 is connected to a connector portion (not shown). Core wire 26 of the signal cable 26
The shield 28 of a is formed so as to be exposed on the rear side of the connection portion with the connection board, and is brought into contact with the general shield 29 of the signal cable 26 to be electrically connected. A conductor wire 30 such as annealed copper wire is wound around the conducting portion between the shield 28 of the core wire and the general shield 29, and the end portion of the general shield 29 is fixed.

In the structure of this modification, the connection board 2
5a and 25b are not limited to flexible printed boards, but may be printed boards of glass epoxy resin.

Since the signal cable has better signal transmission characteristics than the flexible printed circuit board, this modification can further improve the reliability and performance of the solid-state image pickup device having the configuration of the second embodiment. .

By the way, in a solid-state imaging device, when a bare chip of a solid-state imaging device is mounted on a base member such as a substrate or a package, so-called wire bonding is used to connect each terminal of the solid-state imaging device and an electrode of the base member with a bonding wire. There is a configuration using. FIG. 5 shows a configuration example using wire bonding for mounting the solid-state imaging device. The bare chip of the solid-state imaging device 31 is the package 3
Bonding pads 31a provided on both side ends of the solid-state imaging device 31 and bonding pads 32a of a package 32 provided corresponding to these are connected by bonding wires 33, which are arranged in the recesses for storage of two.

Usually, the image forming area 35 of the objective optical system is the same as or larger than a circle whose diameter is the diagonal of the image pickup effective area 34 of the solid-state image pickup device 31. As shown in the configuration of FIG. 5, the bonding wire 33 is formed in the imaging area 35.
Is present, the incident light 36 as shown on the right side of FIG.
Will hit the bonding wire 33 and will be irregularly reflected, causing problems such as flare. Therefore, conventionally, it is necessary to provide a light shielding member such as a mask on the optical system side of the wire bonding portion.

FIG. 6 shows a first configuration example in which the occurrence of flare can be prevented in a solid-state image pickup device using wire bonding for mounting the solid-state image pickup device without providing a light shielding member.

Solid-state image sensor 41 in the first configuration example
In the same manner as in the example of FIG. 5, the bonding pads 41a are provided on both side ends of the bare chip, and the bonding wire 33
Are connected to the bonding pads of the package by these.
The symbol “a” is arranged outside the circle whose diameter is the diagonal of the effective imaging area 34 (that is, the imaging area 35 of the objective optical system).

By providing the bonding pad outside the circle whose diameter is the diagonal of the effective imaging area 34 in this way, it is possible to prevent irregular reflection of incident light from the objective optical system, and it is not necessary to provide a light shielding member. It is possible to prevent flare from occurring.

Next, FIG. 7 shows a second configuration example in which the occurrence of flare can be prevented in a solid-state image pickup device using wire bonding for mounting the solid-state image pickup element without providing a light shielding member.

The second configuration example is an example in which a bonding pad 45a is provided on the back surface of the bare chip of the solid-state image pickup element 45 (the surface opposite to the image pickup area 47).
Reference numeral 5 is attached to the window of the substrate 46 so that the imaging area 47 faces it, and is fixedly adhered by an adhesive or the like. Board 46
On the surface on which the solid-state image sensor 45 is mounted, bonding pads 46a are provided in the vicinity of the pads corresponding to the bonding pads 45a of the solid-state image sensor 45. The bonding pad 45a of the solid-state image sensor and the bonding pad 46a of the substrate And are bonded by the bonding wire 33.

Since the bonding pad is provided on the back surface of the solid-state image sensor in this way, the incident light 36 from the objective optical system enters the image-pickup area 47 of the solid-state image sensor 45 as it is and is scattered by the bonding wire 33. Therefore, it is possible to prevent irregular reflection of incident light. Therefore, it is possible to prevent flare from occurring without providing a light shielding member.

[Appendix] As described in detail above, according to the embodiment of the present invention, the following configuration can be obtained.
That is, (1) In a solid-state imaging device including an imaging unit in which a solid-state imaging device is mounted on a substrate by a flip chip in a face-down method, the substrate is formed in a substantially circular shape, and light from an objective optical system is provided in a central portion. A window through which the solid-state imaging device is provided is disposed in the central portion of the substrate so that the imaging area faces the window and the center of the substrate coincides with the optical center of the solid-state imaging device. A solid-state imaging device comprising: a substantially cylindrical lens frame that houses an objective optical system; and the substrate and the objective optical system fitted in the lens frame.

(2) The solid-state image pickup device according to the above (1), wherein a cover glass is provided in the window of the substrate, and the cover glass, the substrate, and the solid-state image pickup element are sealed with a resin or an adhesive.

(3) The solid-state image sensor is a CCD (Char
ge Coupled Device).

(4) The solid-state image sensor is a CMD (Char
ge Modulation Device).

(5) The solid-state image pickup device as set forth in (1) above, wherein the substrate is a printed circuit board made of glass epoxy resin.

(6) The solid-state image pickup device according to the above item (1), wherein the substrate is a glass substrate.

(7) The solid-state image pickup device according to the above-mentioned item (1), wherein the lens frame is made of a conductive member and has an inner surface subjected to black treatment.

(8) The solid-state image pickup device according to the above (1), wherein the lens frame and a general shield of a signal cable connected to the solid-state image pickup element are electrically connected.

(9) The solid-state image pickup device according to the above (1), wherein a connection portion between the substrate and the signal cable connected to the solid-state image pickup element is sealed with a soft resin.

(10) The solid-state image pickup device according to the above (1), wherein an outer peripheral portion from the lens frame to the outer skin of the signal cable connected to the solid-state image pickup element is covered with an insulating member.

(11) The solid-state image pickup device according to item (10), wherein the insulating member is a heat-shrinkable tube.

(12) The solid-state image pickup device according to the above (1), wherein a second substrate for connection, which is connected to the substrate or the solid-state image pickup device, is provided behind the substrate.

(13) The solid-state image pickup device according to the above (12), wherein an impedance conversion circuit for converting the impedance of the output of the solid-state image pickup device is provided on the second substrate.

(14) The substrate provided with the solid-state image pickup device is formed into a shape having a cutout portion in which a part of the outer shape is cut out, and the second substrate is connected to the side surface of the cutout portion of the substrate. The solid-state imaging device according to the supplementary note (12), which is provided with a connection terminal.

(15) The solid-state image pickup device according to the above (14), wherein the connection terminals are separated on the input side and the output side and respectively provided on different side surfaces of the substrate.

(16) The solid-state image pickup device as set forth in (14), wherein the second substrate is a flexible printed circuit board.

(17) The solid-state image pickup device according to the above (14), wherein the second substrate is a printed circuit board made of glass epoxy resin.

(18) The solid-state image pickup device according to item (16), wherein the second substrate is arranged by being bent into a plurality of surfaces.

(19) The solid-state image pickup device according to appendix (16), wherein the other end of the second substrate is extended to a connector portion and connected to a connector terminal.

(20) The solid-state image pickup device according to the above (16) or (17), wherein the other end of the second substrate is connected to a signal cable extending to a connector section.

(21) The solid-state imaging device according to the above (20), wherein the general shield of the signal cable and the shield of each core are electrically connected to each other at the connection portion between the second substrate and the signal cable. apparatus.

(22) A solid-state image pickup device comprising an image pickup unit in which the solid-state image pickup device is mounted on a base member made of a substrate or a package, and the solid-state image pickup device and the base member are connected by wire bonding. A solid-state imaging device, wherein a bonding pad for connecting a bonding wire is arranged outside a circle whose diameter is a diagonal of an effective imaging area of the solid-state imaging device.

(23) A solid-state image sensor is mounted on a substrate,
In a solid-state imaging device including an imaging unit in which the solid-state imaging device and the substrate are connected by wire bonding,
A solid-state imaging device, wherein a bonding pad for connecting a bonding wire in the solid-state imaging device is arranged on a back surface of the solid-state imaging device opposite to an imaging effective area.

[0068]

As described above, according to the present invention, it is possible to provide a solid-state image pickup device which can simplify the assembling work, has good workability, and can be easily assembled.

[Brief description of drawings]

FIG. 1 is a sectional view in a longitudinal axis direction showing a configuration of a main part of a solid-state imaging device according to a first embodiment of the present invention.

2 and 3 relate to a second embodiment of the present invention, and FIG. 2 is a perspective view showing a configuration of a substrate on which a solid-state image sensor is mounted.

FIG. 3 is a longitudinal cross-sectional view showing the configuration of the main part of the solid-state imaging device.

FIG. 4 is a cross-sectional view in the longitudinal axis direction showing a configuration of a solid-state imaging device according to a modified example of the second embodiment, which is behind the solid-state imaging device.

FIG. 5 is an explanatory diagram showing a configuration example of a conventional solid-state imaging device configured by using wire bonding for mounting a solid-state imaging device.

FIG. 6 is a front view showing a first configuration example capable of preventing the occurrence of flare in a solid-state imaging device using wire bonding for mounting a solid-state imaging device without the need to provide a light-shielding member.

FIG. 7 is a side sectional view showing a second configuration example capable of preventing flare from occurring in a solid-state image pickup device using wire bonding for mounting a solid-state image pickup element without providing a light shielding member.

FIG. 8 is a cross-sectional view in the longitudinal axis direction showing a configuration example of an imaging unit which is a conventional technique in which a solid-state imaging device is mounted on a substrate by a face-down method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor 2 ... Substrate 4 ... Flip chip 5 ... Cover glass 6 ... Lens frame 7 ... Space tube 8 ... Objective lens 10 ... Connection board 11 ... Signal cable 12 ... General shield 14 ... Sealing member 15 ... Coated tube

Front page continued (72) Inventor Wataru Ono 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Shinji Yamashita 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Kogyo Co., Ltd. (72) Inventor Katsuyuki Saito 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Ichiro Funabashi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optics Kogyo Co., Ltd. (72) Masao Uehara 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Hideki Koyanagi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optics Industry Co., Ltd.

Claims (1)

[Claims] 1. A solid-state image pickup device comprising an image pickup unit in which a solid-state image pickup element is mounted on a substrate by a flip chip in a face-down manner, wherein the substrate is formed into a substantially circular shape, and light from an objective optical system is provided in a central portion. A window through which the solid-state image sensor is provided is arranged in the central part of the substrate so that the image pickup area faces the window and the center of the substrate coincides with the optical center of the solid-state image sensor. A solid-state imaging device comprising: a substantially cylindrical lens frame that houses an objective optical system; and the substrate and the objective optical system fitted in the lens frame.