JP3230801B2 - Endoscope - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solid-state imaging device.
Endoscope .

[0002]

2. Description of the Related Art In recent years, by inserting an elongated insertion portion into a body cavity, it is possible to observe internal organs in the body cavity or to perform various treatments using a treatment tool inserted into a treatment tool channel as necessary. Endoscopes are widely used.

Further, as disclosed in Japanese Patent Application Laid-Open No. 63-272180, an electronic endoscope having a solid-state imaging device provided at the distal end of an insertion section is also used. The solid-state imaging device often includes a solid-state imaging device such as a CCD and an IC chip for driving the solid-state imaging device and amplifying an output signal.

In the endoscope, it is desired to reduce the diameter of the insertion section for reasons such as reduction of the pain of the patient. Therefore, the solid-state imaging device provided at the distal end of the insertion section of the electronic endoscope is also downsized. Is desired.

In such a small-sized solid-state imaging device, a lead connecting a solid-state imaging device, an IC chip, a circuit board, and the like is extended as an external input / output terminal, and a space between these circuit components is sealed with a sealing resin. Generally, it is configured to stop, fix and protect. In many cases, thin leads are used as the leads to save space.

[0006]

[SUMMARY OF THE INVENTION In the solid-state imaging device as described above, the solid Taking the lead serving as an external input and output terminal
When extending from the light receiving surface of the image element chip to the back side,
When electronic components are provided on the back side of the body image sensor chip
In order to reduce the size of the device,
It is necessary to narrow the gap between the tip and the lead or electronic component.
However, if the distance is reduced, insulation between the above members can be achieved.
There was a problem that it disappeared .

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been made in various parts of the apparatus while keeping the apparatus compact .
It is an object to provide a solid-state imaging device capable of achieving insulation .

[0008]

According to a first aspect of the present invention, there is provided an endoscope comprising: an objective lens system provided at a distal end portion; and a solid-state image sensor chip provided at a rear side of the objective lens system. When this solid was connected to the light-receiving surface of the image sensor chip, a lead which extends rearward from the solid-state imaging element chip side, and an insulating member provided on a rear surface of the solid-state imaging device chip, wherein the solid-state imaging device Provided close to the back of the chip
Is, an electronic part connecting the the lead and electrically, characterized by comprising a <br/> sealing resin for integrally fixing said electronic component and the solid-state imaging element chip. Claims
2. The endoscope according to 2, further comprising: a side insulating member provided between a side of the solid-state imaging device chip and the lead ;
It is characterized by having.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to a first embodiment of the present invention, and FIG. 1 is a diagram showing a solid-state imaging device;
2A is a cross-sectional view, FIG. 2B is a plan view, FIG. 2 is a cross-sectional view showing a distal end side of an endoscope insertion section as an example, and FIG. 3 is an explanatory view showing the entire endoscope system.

As shown in FIG. 3, the endoscope 1 includes an elongated and flexible insertion section 2 and a large-diameter operation section 3 connected to the rear end of the insertion section 2. I have. A flexible universal cord 4 extends laterally from the operation unit 3,
A connector 5 is provided at an end of the universal cord 4. The connector 5 is connected to a light source device 6. A signal code 7 extends from the connector 5, and a connector 8 is provided at an end of the signal code 7. This connector 8 is connected to a video processor 9. A monitor 10, a VTR deck 11, a video printer 12, a video disk 13, and the like are connected to the video processor 9.

The insertion section 2 includes, in order from the distal end, a rigid distal end 2a, a bendable bending portion 2b, and a flexible tube 2c having flexibility.

As shown in FIG. 2, the distal end portion 2a has a distal end member 14, and a distal end cover 15 is attached to the distal end member 14. This tip component 1
An illumination window, an observation window, an air supply / water supply port, and a forceps channel port are provided on the front cover 4 and the front cover 15.

A light distribution lens (not shown) is mounted inside the illumination window, and a light guide (not shown) made of a fiber bundle is connected to the rear end of the light distribution lens. The light guide is inserted through the insertion section 2, the operation section 3 and the universal cord 4 and connected to the connector 5. Then, illumination light emitted from a light source lamp in the light source device 6 is incident on an incident end of the light guide.

An image pickup section 18 having an objective optical system 16 and a solid-state image pickup device 17 is provided inside the observation window. The signal line 22 connected to the solid-state imaging device 17 via the circuit board 21 having the peripheral IC chip 19 on the connection side is connected to the insertion section 2, the operation section 3, the universal cord 4, the connector 5, and the signal cord 7. And is connected to the connector 8.

The solid-state imaging device 17 is driven by a video processor 9 connected via the connector 8, and an output signal of the solid-state imaging device 17 is processed by the video processor 9 for a video signal. It has become. A video signal from the video processor 9 is input to the monitor 10, VTR deck 11, video printer 12, video disk 13, and the like.

An air / water supply tube (not shown) is connected to the air / water supply port. The air / water supply tube is inserted through the insertion section 2, the operation section 3, and the universal cord 4 and connected to the connector 5. A forceps channel tube 24 is connected to the forceps channel opening via a channel connection pipe 23.
The forceps channel tube 24 is inserted through the insertion section 2 and connected to a forceps insertion port (not shown) provided in the operation section 3.

The bending portion 2b has a bending tube formed by rotatably connecting a plurality of substantially cylindrical joint pieces 25, 26,... With a joint shaft 27. The outer periphery of the bending tube is , Curved rubber 28. A flexible tube 2c is connected to the rear end of the rearmost joint piece.

For example, four angle wires 29 for bending operation are inserted into the insertion portion 2, and the distal end of the angle wire 29 is fixed to the foremost joint piece 25 by a wire guide 30. I have. In addition, 2
Wire receivers 31 are provided at predetermined intervals on the inner peripheral portion of the joint pieces subsequent to the second joint piece 26.
The angle wire 29 is inserted therein. The angle wire 29 is pushed and pulled by an angle operation knob provided on the operation section 3, whereby the bending section 2b is bent in the up / down / left / right directions.

Next, the image pickup section 18 will be described in detail. A first lens frame 32 is fixed to an observation through-hole formed in the distal end component member 14 and the distal end cover 15 by an imaging unit fixing screw 33. On the first lens frame 32, an objective front lens 35 constituting the objective optical system 16 is mounted. Inside the first lens frame 32,
The second lens frame 36 is fixed, and the second lens frame 3
6, another lens system of the objective optical system 16 is mounted.
An element frame 37 is connected to the rear end of the second lens frame 36, and the solid-state imaging device 17 is fixed to the element frame 37.

The external input / output terminal 3 of the solid-state imaging device 17
8 is connected to a circuit board 21 on which electronic components are mounted. The signal line 22 is connected to the board 21 via a cable fixing member 41. This signal line 22
Is a coaxial cable, a cable core wire 22a is connected to the board 21, and a shield wire 22b is electrically connected to a shield member 42 covering the solid-state imaging device 17 and the circuit board 21 by a conductive adhesive. . The cable core wire 22a and the shield wire 22b are covered with an insulating tube 2c and a covering tube 22d, respectively.

The connection between the outer periphery of the shield member 42 and the signal line 22 is covered with an insulating heat-shrinkable tube 43.

Next, the configuration of the solid-state imaging device 17 will be described with reference to FIGS. 1 (A) and 1 (B).

In the solid-state imaging device 17, a solid-state imaging device chip 52 and an IC chip 53 for processing signals of the device chip are arranged adjacently on a base 51 made of, for example, a Kovar plate or the like. TAB whose tip side is placed and joined on a base film 56 via a bump 54
(Tape Automated Bonding) The connection is made by a lead 55, while a part of the base film 56 and the lead 55 serving as the external input / output terminal 38 are left and sealed integrally with a sealing resin 57. The external input / output terminals 38 including the leads 55 form flat lands on the base film 56. In addition, the solid-state imaging device chip 52
A cover glass 58 is fixed thereon, and the cover glass 58 is also integrally sealed with the resin 57.

The TAB lead 55 is connected to the image sensor chip 52 and the IC chip 5 in terms of signals.
3, image sensor chip 52 and external input / output terminal 38, image sensor chip 52 and IC chip 53 and external input / output terminal 38,
The IC chip 53 and the external input / output terminal 38 are connected to appropriate positions via bumps 59 as necessary. Further, the TAB leads 55 are all bump-connected to the image pickup element chip 52 side to prevent unevenness. That is, the image sensor chip 52 has bump pads that are meaningless in terms of signals, and pads that are meaningless in terms of signals may also be provided on the IC chip 53 side. Note that reference numeral 70 is a storage area.

The solid-state imaging device 17 having this configuration can be formed extremely thin and small, and is therefore suitable for being housed and arranged in a small space such as the endoscope end where small size is required.

FIGS. 4 and 5 relate to a second embodiment of the present invention. FIG. 4 is a sectional view of the solid-state imaging device, and FIG. 5 is a view taken in the direction of the arrow V in FIG.

The solid-state imaging device 17 of this embodiment has a solid-state imaging device chip 52 having a cover glass 58 bonded to the front surface.
Which performs signal processing of the element chip 52 in the vicinity of the back side of
The C chip 53 is provided. Note that an insulating material (such as an insulating tape or an insulating paint) 61 is provided on the side surface (on the side of the bonding pad) and the back surface of the imaging element chip 52.

A bonding pad is formed on the front edge of the image sensor chip 52, and an inner lead 63 made of, for example, a TAB tape, copper foil, or the like is connected to one side of the bonding pad via a bump 62. 6
Numeral 3 extends to the back surface side via the side of the element chip 52 on which the insulating material 61 is provided, and is connected to the IC chip 53 via a bump 64. Leads as external input / output terminals 38 made of, for example, TAB tape, copper foil, etc. are connected to the two rows of bonding pads of the image sensor chip 52 via bumps 62, and extend in the direction of the back surface. Further, the IC chip 53 is connected to a lead as an external input / output terminal 38 made of a TAB tape, a copper foil, or the like via a bump 64 and extends rearward. Then, the imaging element chip 52, the IC chip 53 and the inner leads 6
3. The solid state imaging device 17 is formed by sealing the inner side of the external input / output terminal 38 with a sealing resin 65 (at least the front surface of the imaging element chip is a transparent resin).

In this configuration, the image pickup device chip 52 and the IC chip 53 are connected to each other by the inner lead 63 made of a thin copper foil or the like, and the inner lead 63 is bent toward the back surface of the device chip 52. The element chip 52
Since the IC chip 53 is arranged on the back side of the device, the solid-state imaging device 17 has a volume as close as possible to the element chip 52, achieving miniaturization.
3 is connected with the shortest distance and is entirely sealed with resin, so that it is hardly affected by external noise.

FIG. 6 is a sectional view showing a modification of the second embodiment of the present invention. In this modified example, two IC chips 53 are arranged on the back surface of an element chip 52,
The function and effect are the same as in the second embodiment.

FIG. 7 is a sectional view according to a third embodiment of the present invention. In this embodiment, for example, when the leads connected to the solid-state imaging device chip 52 as shown in FIG. 4 are formed like a metal (copper) foil, they are made of a polyimide film or the like so that the plurality of leads do not fall apart. The reinforcing plate 66 is connected transversely, and the reinforcing plate 66 is buried in the resin 65 as it is.

When the leads serving as the external input / output terminals are made of thin foils, the leads may be broken apart or may be easily broken at the roots of the leads protruding from the sealing resin, resulting in disconnection or the like. However, by connecting the leads with an insulating reinforcing plate 66 and embedding a part of the leads in the sealing resin 65 as in this configuration, breakage of the leads,
Disconnection and the like can be prevented. In this configuration, since the thin reinforcing plate 66 is provided inside the lead on the back surface side of the solid-state imaging device chip 52, the cross-sectional area parallel to the light receiving surface of the solid-state imaging device does not increase.

Therefore, according to this embodiment, it is possible to improve the mounting strength of the lead while keeping the solid-state imaging device small. In addition, in the present embodiment, it is not necessary to increase the number of parts, so that an increase in cost can be prevented.

FIG. 8 is an explanatory view showing an image pickup device mounting table of an inspection device for inspecting a solid-state image pickup device.

The imaging device mounting table 71 shown in the figure is formed to have a diameter to which the external input / output terminal 38 of the imaging device 17 is fitted.
A magnetic electrode 72 is formed on a side surface connected to the terminal 38. Therefore, the external input / output terminal 3 of the image sensor 17
Even if the terminal 8 is thin and elastic, such as a copper foil, the terminal 38 can be easily brought into contact with the electrode 72 of the mounting table 71 for inspection.

[0036]

As described above, according to the present invention, there is an effect that it is possible to achieve insulation at each part of the device while keeping the device small.

[Brief description of the drawings]

FIG. 1 is a diagram showing a solid-state imaging device according to a first embodiment of the present invention, where (A) is a cross-sectional view and (B) is a plan view.

FIG. 2 is a cross-sectional view showing a distal end side of an endoscope insertion section as an example.

FIG. 3 is an explanatory diagram showing the entire endoscope system.

FIG. 4 is a cross-sectional view of a solid-state imaging device according to a second embodiment of the present invention.

FIG. 5 is a view in the direction of arrow V in FIG. 4;

FIG. 6 is a sectional view showing a modification of the second embodiment of the present invention.

FIG. 7 is a sectional view of a solid-state imaging device according to a third embodiment of the present invention.

FIG. 8 is an explanatory diagram showing an imaging device mounting table of the inspection device for inspecting the solid-state imaging device.

[Explanation of symbols]

 Reference Signs List 17 solid-state imaging device 38 external input / output terminal 52 imaging element chip 53 IC chip 54, 64 bump 55, 63 lead 57, 65 resin 66 reinforcing plate

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hisao Yabe 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside O-Limpus Optical Industry Co., Ltd. (72) Inventor Hiroshi Hasegawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo In Olympus Optical Co., Ltd. (56) References JP-A-63-272180 (JP, A) JP-A-63-303580 (JP, A) JP-A-58-173255 (JP, A) 171234 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 27/14-27/148 H04N 5/335

Claims (2)

(57) [Claims] 1. An object lens system provided at a front end portion, a solid-state imaging device chip provided behind the objective lens system, and a solid-state imaging device chip side portion connected to a light receiving surface of the solid-state imaging device chip. A lead extending rearward from the substrate, an insulating member provided on the back surface of the solid-state imaging device chip, and a lead provided close to the back surface of the solid-state imaging device chip.
An endoscope comprising: an electronic component electrically connected to the lead; and a sealing resin for integrally fixing the solid-state imaging device chip and the electronic component. 2. The endoscope according to claim 1 , further comprising a side insulating member provided between a side portion of the solid-state imaging device chip and the lead.