JP3237839B2 - Solid-state imaging device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device having an improved volume when handled and mounted.

[Prior art] In recent years, by inserting an elongated insertion portion into a body cavity,
2. Description of the Related Art Endoscopes (scopes or fiberscopes) capable of diagnosing and examining internal organs and the like are widely used. In addition to being used for medical purposes, it is also used for observing and inspecting an object in a pipe of a boiler, a machine, a chemical plant, or the like, or in a machine, for industrial use.

Further, various types of electronic endoscopes and video camera devices using a solid-state imaging device such as a solid-state imaging device such as a charge-coupled device (CCD) as an imaging unit are also used.

As the solid-state imaging device described above, the present applicant has
As disclosed in Japanese Patent Application Laid-Open No. 63-272180, a device having an external terminal group to which a signal cable is directly connected and an external terminal group to which the signal cable is connected via an electric circuit board or the like is proposed.

The solid-state imaging device includes a package in which the solid-state imaging device is sealed with ceramic or the like, and a lead connected to the solid-state imaging device and extending from the package. When this solid-state imaging device is used in, for example, an electronic endoscope, the solid-state imaging device is often arranged on the distal end side of an insertion portion of the electronic endoscope.

[Problems to be Solved by the Invention] However, as described above, when the solid-state imaging device is provided at the distal end of the insertion portion, the solid-state imaging device is downsized to reduce the outer diameter at the distal end of the insertion portion. Is desired.

Further, even as described above, there is a demand for a solid-state imaging device that is easy to handle at the time of inspection and mounting, even if the solid-state imaging device is downsized.

The present invention has been made in view of the above points, and has as its object to provide a small-sized solid-state imaging device that is easy to handle for inspection and the like.

[Means for Solving the Problems] A solid-state imaging device according to the present invention includes a lead set including a base film and a plurality of foil leads formed on the base film, and the lead set is directed rearward from a side surface. A solid-state imaging device chip extended and a reinforcing member disposed behind the solid-state imaging device chip and having a side surface detachably attached to the lead assembly.

[Operation] With the above-described configuration, a plurality of foil-shaped leads are reinforced by a reinforcing member, and the reinforcing member is removed during mounting to reduce the size.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

1 to 3 relate to an embodiment of the present invention. FIG. 1 (A) is a side view of the solid-state imaging device, and FIG. 1 (B) is a cross section taken along line AA 'of FIG. 1 (A). FIG. 2 is an explanatory diagram showing the entire configuration of the endoscope system, and FIG. 3 is a cross-sectional view of the distal end side of the endoscope insertion section.

As shown in FIG. 2, the endoscope 1 includes an elongated and flexible insertion section 2 and a large-diameter operation section 3 connected to the rear end of the insertion section 2. A flexible universal cord 4 extends laterally from the operation unit 3, and a connector 5 is provided at an end of the universal cord 4. The connector 5 is connected to the light source device 21. A signal code 22 extends from the connector 5, and a connector 23 is provided at an end of the signal code 22. The connector 23 is connected to a video processor 24. The video processor 24 is connected to a monitor 25, a VTR deck 26, a video printer 27, a video disk 28, and the like.

The insertion portion 2 includes, in order from the distal end, a rigid distal end portion 7, a bendable bending portion 8, and a flexible tube 9 having flexibility.

As shown in FIG. 3, the tip portion 7 is a tip component member.
10, and a tip cover 41 is attached to the tip component member 10. This tip component 10 and tip cover 41
Are provided with an illumination window, an observation window, an air supply / water supply port, and a forceps channel port.

A light distribution lens (not shown) is mounted inside the illumination window, and a light guide (not shown) made of a fiber bundle is connected to the rear end of the light distribution lens. The light guide is inserted through the insertion section 2, the operation section 3 and the universal cord 4 and connected to the connector 5. Then, illumination light emitted from a light source lamp in the light source device 21 is incident on an incident end of the light guide.

Further, inside the observation window, an imaging unit 30 having an objective optical system 43 and a solid-state imaging device unit set 31 is provided. The solid-state imaging device group 31 includes a solid-state imaging device 70 arranged at an image forming position of the objective optical system 43. The signal line 32 connected to the solid-state imaging device 70 via the board 49 is inserted through the insertion section 2, the operation section 3, the universal cord 4, the connector 5, and the signal cord 22, and is connected to the connector 23.
The solid-state imaging device 70 is driven by a video processor 24 connected via the connector 23, and an output signal of the solid-state imaging device 70 is processed by the video processor 24 for a video signal. ing. The video signal from the video processor 24 is transmitted to the monitor 25, VTR deck 26, video printer 27, video disk
It is input to 28 mag.

An air / water supply tube (not shown) is connected to the air / water supply port. The air / water supply tube is inserted through the insertion section 2, the operation section 3, and the universal cord 4, and is connected to the connector 5. A forceps channel tube 39 is connected to the forceps channel opening via a channel connection pipe 67. The forceps channel tube 39 is inserted through the insertion section 2 and connected to a forceps insertion port (not shown) provided in the operation section 3.

The bending portion 8 has a bending tube formed by connecting a large number of substantially cylindrical joint pieces 11, 12,... Coated with 14. A flexible tube 9 is connected to the rear end of the rearmost joint piece.

For example, four angle wires 17 for bending operation are inserted into the insertion portion 2, and the distal end portion of the angle wire 17 has a leading-edge joint piece (hereinafter, referred to as a first joint) 11.
Are fixed by wire guides 15. A second joint piece from the tip side (hereinafter, referred to as a second joint) 12
At the inner periphery of the subsequent joint pieces,
The angle wire 17 is inserted into the wire receiver 18. The angle wire 17 is pushed and pulled by an angle operation knob (not shown) provided on the operation unit 3, whereby the bending unit 8 is bent in the up / down / left / right directions.

 Next, the imaging unit 30 will be described in detail.

A first lens frame 42 is fixed to an observation through-hole formed in the distal end component 10 and the distal end cover 41 by an imaging unit fixing screw 40. On the first lens frame 42, an objective front lens 44 constituting an objective optical system 43 is mounted. A second lens frame 45 is fixed inside the first lens frame 42, and another lens system of the objective optical system 43 is mounted on the second lens frame 45. The solid-state imaging device unit set 31 is connected to the rear end of the second lens frame 45. In the solid-state imaging device group 31, a device frame 47 is connected to a rear end of the second lens frame 45, and a CCD (charge-coupled device) is attached to the device frame 47.
And the like are fixed. The solid reimaging device
The board 49 on which the electronic component 50 is mounted is connected to the leads 71 of the 70. The signal line 32 is connected to the board 49 via a cable fixing member 51. This signal line 32
A coaxial cable, a cable core wire 52 is connected to the board 49, and a shield wire 54 is connected to the solid-state imaging device 70 and the board.
It is electrically connected to a shield member 56 covering 49 by a conductive adhesive. The cable core wire 52 and the shield wire 54 are covered with an insulating tube 53 and a covering tube 55, respectively.

The cable 32 has a holding tape 61, a total shield 62
And the entire coating tube 63 in order. The outer periphery of the shield member 56 and the connecting portion of the cable 32 are covered with an insulating heat-shrinkable tube 66.

As shown in FIG. 1, for example, the solid-state imaging device 70 connects the lead 71 made of, for example, gold-plated foil copper to a chip 72, which is, for example, a CCD by a projecting bump 72a formed on the lead 71. Further, the chip 72, the leads 71, and a cover glass 74 disposed on the front surface on the imaging surface side of the chip 72 are substantially transparent sealing resin 73 without covering one end surface of the cover glass 74. And sealed.

The lead 71 is formed on a base film 75 made of, for example, a polyimide film before being connected to the chip 72, and when connected to the chip 72, the inner lead 71a and the inner lead 71a which are sealed with the sealing resin 73 are provided. The base film 75 is removed from the external lead portion 71b extending from the sealing resin 73, and the base film 75 is left only at the inspection terminal portion 71c at the opposite end of the inner lead 71a.

The inner lead portion 71a is connected to the chip 72 by a bump portion 72a formed on the inner lead portion 71a,
Further, the chip 72 is bent substantially at right angles to the rear end side of the chip 72 on substantially the side surface thereof, and the sealing is performed so that the external lead portion 71b and the inspection terminal portion 71c extend from the sealing resin 73. It is designed to be sealed in a resin 73.

After sealing the chip 72 and the like with the sealing resin 73, a reinforcing member 76 is attached to the rear end surface of the sealing resin 73 by, for example, a double-sided tape 78a, and further, the base film 75 is attached to the reinforcing member 76, for example, on both sides. It is stuck by tape 78b. Further, the lead 71 of the chip 72
The reinforcing member 77 is attached to the side surface on which the base film 75 is not attached and the side surface on which the base film 75 is not attached, for example, by a double-sided tape 78c. The reinforcing members 76 and 77 are made of a substantially hard substance such as plastic or metal.

When the solid-state imaging device 70 configured as described above is to be inspected, for example, by itself, the solid-state imaging device 70 is supported by a reinforcing member 77 attached to the side surface, and the inspection terminal portion 71c is provided.
Is attached to the test socket such that the electrode contacts the electrode such as the test socket.

When the solid-state imaging device 70 is disposed on the endoscope 1 or the like, the external lead portion 71b is cut while leaving an appropriate length, and the reinforcing members 76, 77, The base film 75 and the inspection terminal portion 71c are removed, and at least one of the substrate 49 and the cable core wire 52 is connected to the external lead portion 71b having an appropriate length as described above, for example, by soldering. To

That is, the test terminal portion 71c is held by the reinforcing member 76, and can be easily mounted on a test socket or the like without bending the test terminal portion 71c. In addition, there is an effect that the handling can be facilitated, and the mounting volume can be reduced by removing the reinforcing members 76 and 77 at the time of mounting.

The reinforcing member 76 may be attached to the base film 75 by bonding.

Further, the solid-state imaging device in which the lead extends from the sealing resin to the rear portion has been described, but may extend from a side portion of the sealing resin.

Further, the connection between the lead and the chip is not limited to the bump method described above, and another method such as a pedestal method may be used.

[Effects of the Invention] As described above, according to the present invention, there is an effect that a solid-state imaging device which is easy to handle and has a small mounting volume can be provided.

[Brief description of the drawings]

FIGS. 1 to 3 relate to one embodiment of the present invention, and FIG.
FIG. 1A is a side view of the solid-state imaging device, and FIG.
FIG. 2A is a cross-sectional view taken along the line AA ′, FIG. 2 is an explanatory diagram showing the entire configuration of the endoscope system, and FIG. 3 is a cross-sectional view on the distal end side of the endoscope insertion portion. 71 Leads 72 Chips 76 Reinforcement members 77 Reinforcement members

Continuation of the front page (58) Fields investigated (Int.Cl. ⁷ , DB name) H04N 5/335 H04N 5/225 H04N 7/18 H04N 1/028 A61B 1/04 372 G02B 23/24 H01L 21/60 H01L 23/32 H01R 11/01

Claims (1)

(57) [Claims] A lead set comprising a base film and a plurality of foil-like leads formed on the base film; a solid-state imaging device chip having the lead set extending rearward from a side surface; A reinforcing member disposed behind the solid-state imaging element chip and having a side surface detachably attached to the lead assembly.