JP2000083896A - Imaging device for endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize an imaging device by miniaturizing an electrical connection between a solid state imaging device and a substrate by a simple structure. SOLUTION: In the imaging 15 for an endoscope, a flexible lead 13 extended from at least one side of a solid state imaging device 12 is connected electrically with the connection land 21 of a circuit board 30, bent toward the outline center side of the solid imaging device 12 or a signal cable 20 whereby the solid state imaging device 12 and the circuit board 30 can be connected without using the other connecting member, and the connection between the solid state imaging device 12 and the circuit board 30 and the signal cable 20 can be miniaturized, and the whole imaging device can be miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board by bending a flexible lead extending from at least a part of a side surface of a solid-state image pickup device built in an endoscope toward a center of an outer shape of the fixed image pickup device. Or by connecting to a signal cable,
The present invention relates to an imaging device for an endoscope that can be downsized.

[0002]

2. Description of the Related Art In recent years, a solid-state image pickup device such as a CCD is built in the end of an elongated insertion portion of an endoscope, and an observation image of a portion to be observed is formed on an image pickup surface of the solid-state image pickup device by an objective lens. An electronic endoscope that transmits the obtained electric signal to an image processing device installed outside the endoscope via a signal cable, converts the signal into an image signal, displays an image of an observation target site on a monitor, and performs observation. Is widely used.

In such an electronic endoscope, an image pickup device including the above-described solid-state image pickup device is mounted as a main member of the endoscope at an insertion distal end portion thereof. In addition to obtaining an electric signal corresponding to the observed image by forming an image with an objective lens, the fixed image pickup device and the output of the solid-state image pickup device are used to supply the electric signal to an image processing device via a signal cable. There is also a role of electrically connecting a board or a signal cable on which electronic circuit components for performing processing such as signal amplification are provided.

In general, such an electronic endoscope is generally used by inserting it into a body cavity of a human body. In consideration of pain of a patient at the time of insertion, the length of the endoscope insertion tip portion is considered. Ideally, the size of the endoscope is short, that is, the entire endoscope is downsized. For this reason, in order to reduce the size of the endoscope as a whole, it is indispensable to reduce the size of the image pickup device mounted thereon, and many proposals have been made on how to reduce the size.

Among such proposals, for example, an endoscope described in Japanese Patent Publication No. 2572766 is described as a conventional example. In this proposal, an endoscope in which a solid-state imaging device built in an electronic endoscope and a substrate disposed in parallel with the solid-state imaging device are electrically connected at a side surface of the substrate is shown.

According to the proposed structure, the solid-state image pickup device and the substrate are arranged in parallel, and electrical connection between the solid-state image pickup device and the fixed image pickup device is made by using side surfaces of the substrate. When mounted, the circuit can be connected to a desired circuit configuration, and there is an advantage that the imaging portion, that is, the imaging device can be reduced in size.

[0007]

However, in the above-mentioned conventional endoscope, it is necessary to prepare a connection substrate separately from the solid-state imaging device and the substrate in order to connect the solid-state imaging device and the substrate. In addition to the increase in the number of components, the cost increases, and the connection work is complicated.

In order to use the endoscope effectively, further miniaturization is desired. However, in the above-mentioned conventional example, since the connecting substrate for connecting the solid-state image pickup device and the substrate is cylindrical, the solid-state imaging device is solid. It is necessary to make the imaging device and the substrate substantially the same diameter, and since the connection portion exists on the side of the solid-state imaging device and the substrate, the size of the connection portion between the solid-state imaging device and the substrate and the signal cable should be reduced. As a result, there is a problem that the size of the imaging device cannot be reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is possible to reduce the size of an electrical connection between a fixed imaging element and a substrate with a simple configuration, thereby achieving a reduction in the size of the entire imaging apparatus. An object of the present invention is to provide an imaging device for an endoscope.

[0010]

According to the present invention, there is provided an imaging apparatus for an endoscope, comprising: a solid-state imaging device; a flexible lead extending from at least one side of the solid-state imaging device; a circuit board; Wherein the flexible lead is connected to at least one of the circuit board and the signal cable in a state where the flexible lead is bent toward the center of the outer shape of the solid-state imaging device. It is.

In the imaging device for an endoscope of the present invention, with the above configuration, the connection between the solid-state imaging device and the circuit board is eliminated without using a connecting member separately from the solid-state imaging device and the circuit board.
In addition, since the flexible lead is connected to at least one of the circuit board and the signal cable in a state where the flexible lead is bent toward the center of the outer shape of the solid-state imaging device, the connection between the solid-state imaging device and the circuit board and the signal cable is smaller than in the past. It is possible to reduce the size of the part, which greatly contributes to downsizing of the entire imaging device.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment FIGS. 1 to 16 show a first embodiment of an endoscope imaging apparatus according to the present invention. FIG. 1 is a sectional view showing the configuration of the apparatus, and FIG. FIG. 3 is a perspective view of a configuration of a cable holder mounted on the device of FIG. 1, and FIG.
4 is a perspective view showing a configuration of a connection land provided on a conventional circuit board, FIG. 5 is a perspective view showing a configuration of a connection land mounted on the apparatus shown in FIG. 1, and FIG. 6 is a configuration of a conventional solid-state image pickup device before assembly. FIGS. 7 and 8 are configuration diagrams showing the configuration of a solid-state image sensor unit before assembly mounted on the apparatus of FIG. 1. FIG. 9 is a cross-sectional view showing the configuration of the solid-state image sensor unit after assembly. 10 is a configuration diagram showing a configuration of another solid-state imaging element unit before assembling, FIG. 11 is an explanatory diagram for explaining the operation of the solid-state imaging element unit shown in FIG. 10, and FIG. 12 is a solid-state imaging unit shown in FIG. FIG. 13 is a cross-sectional view showing the structure of the element unit after assembly. FIG. 13 is a cross-sectional view of the solid-state image sensor unit for explaining another connection method.
(C) is an explanatory view for explaining a method of manufacturing a connection land mounted on the apparatus of FIG. 1, FIG. 15 is a top view showing a configuration of the connection land, and FIG. 16 is a view for explaining a connection state of the connection land portion. FIG.

(Structure) As shown in FIG. 1, an imaging device for an endoscope (hereinafter abbreviated as an imaging device) 15 of the present embodiment
Although not shown, it is provided at the distal end of the insertion portion of the endoscope.

In the image pickup device 15, the observation image is passed through the concave lens 7, the convex lens 8 and the infrared cut filter 9 supported by the lens frame 1, the convex lens 10 and the cover glass 11 held by the CCD holder 2, and the solid-state image. Element 1
An image is formed on the second imaging surface 26.

A flare stop 4 is provided between each lens.
6, aperture stop 5, spacing member 3 for keeping the distance between lenses
Are provided respectively. The observation image formed on the imaging surface 26 is photoelectrically converted by the solid-state imaging device 12, and is provided via a circuit board 30 and a signal cable 20 to a video processor (not shown) as an image processing device provided outside the endoscope. And a signal is displayed on a monitor (not shown).

The convex lens 10 is attached to the cover glass 11 with a thermosetting optical adhesive and the solid-state image sensor 1.
It is glued and fixed in a state where the center with the image area 2 is set out.

A flexible lead 13 is bump-bonded to a part of the solid-state imaging device 12 on the imaging surface 26 side, and the bonding portion is bonded and fixed while being sandwiched between the cover glass 11 and the solid-state imaging device 12.

A V-shaped groove 16 for screw-fixing the imaging device 15 to the distal end of the endoscope, and an O-ring for keeping the fitting portion between the distal end of the endoscope and the imaging device 15 watertight are provided on the outer peripheral side surface of the lens frame 1. Is provided with a U-shaped groove 17.

A shield case 22 is fitted into the CCD holder 2 and an internal space is filled with an adhesive to form adhesive filling portions 29a and 29b. Further, a heat-shrinkable tube 23 is covered from the outer periphery of the shield case 22 to the cable holder 25.

On the surface of the solid-state imaging device 12 opposite to the imaging surface 26, a circuit board 30 is adhered and fixed in parallel with the solid-state imaging device 12 via electronic components 18.

In the present embodiment, the electronic component 18 is, for example, a transistor, and is connected and fixed to the circuit board 30 by soldering. The electronic component 18 and the solid-state imaging device 12 are bonded and fixed with an electrically insulating adhesive 32. Although not shown, electronic components such as a chip capacitor and a chip resistor are connected and fixed to the surface of the circuit board 30 opposite to the electronic component 18 by solder.

A plurality of connection lands 21 are provided on the side of the circuit board 30, and the corresponding signal cables 20 are connected and fixed to the respective connection lands 21 by soldering. Here, the connection land shape adopted in the present embodiment will be described. The plurality of connection lands 21 are connection means for connecting a signal cable from a video processor (not shown) external to the endoscope to the circuit board 30. By this connection, the signal cable 20, the circuit The connection between the wiring on the substrate 30 and the connection line from the solid-state imaging device 12 (the video processor (not shown) via the flexible lead 13 in this example) and the solid-state imaging device 12 is conducted.

A connection method using such connection lands 21 has been conventionally employed. In the conventional example, as shown in FIG.
1 are provided, and the shape of the plurality of connection lands 21 is formed to be the cylindrical surface of the semicircular through hole 33. With this shape, the solderability of the signal cable 20 is not good, and There is an inconvenience that the connection work with the signal cable 20 is complicated.

In this embodiment, for example, FIG.
As shown in (a), a connection pattern 3 is formed on a part of the cylindrical surface of the semicircular through hole 33 formed in each connection land 21.
4 were provided. 5A, which is a top view of FIG.
As shown in (b), a notch 35 is formed in the connection pattern 34.
At the time of connection with the signal cable 20 provided with the cable, the signal cable 2 is inserted into the notch 35 as shown in FIG.
After the 0 core wire 36 is press-fitted and temporarily fixed, it is connected and fixed with solder.

Therefore, according to this configuration, the signal cable 20 is temporarily fixed by the cutout portion 35, so that the soldering operation can be easily performed and the electrical connection is also ensured. In addition, there is an advantage that connection can be made in a smaller space than in the past. Therefore, adopting such a connection land shape contributes to downsizing of a connection portion between the signal cable 20 and the circuit board.

In the present embodiment, the solid-state imaging device 1
The connection performance between the flexible lead 13 and the circuit board 30 is improved, and the connection portion is downsized. The improvement will be described with reference to FIGS.

FIG. 6 shows the structure of the conventional solid-state image pickup device 12 before assembly. A plurality of flexible leads 13 as conductive members are connected to the image pickup surface 2 of the solid-state image pickup device 12.
6 extend from two side surfaces of the solid-state imaging device 12 in parallel.

At the time of assembling, first, the polyimide tape 14 is gripped and the flexible lead 1 is moved in the direction of the arrow shown in FIG.
Fold 3 However, flexible leads 13
The width is sharply reduced on the solid-state imaging device 12 side of the polyimide tape 14 for bump bonding to the solid-state imaging device 12. Therefore, when the flexible lead 13 is bent, the narrow portion of the flexible lead 13 is easily broken or disconnected, or the shape thereof becomes large due to insufficient bending. There was also a risk of having an adverse effect.

Therefore, in the present embodiment, as shown in FIG.
Dummy lead 38 for reinforcement purpose having the same thickness as the above and having a width dimension B larger than the narrow width dimension A of the flexible lead 13.
Are provided on both sides of a flexible lead 13 extending from two side surfaces of the solid-state imaging device 12, respectively.

Thus, the plurality of flexible leads 13 can be reinforced by the dummy leads 38 during the bending operation of the flexible leads 13, so that the narrow portions of the flexible leads 13 are disconnected without breaking. Can also be prevented. In addition, the reinforcement by the dummy leads 38 can eliminate insufficient bending, so that the shape can be reduced, which can greatly contribute to downsizing of the imaging apparatus itself.

(Modification) In the present embodiment, FIG.
As shown in (2), even if the dummy lead 38 is configured to extend to another two side surfaces on which the flexible lead 13 does not exist, the effect of reinforcement can be obtained as described above. At this time, since the dummy leads 38 can be connected and fixed to the side of the circuit board 30 where the flexible leads 13 are not connected by soldering as shown in FIG. 9, the connection strength with the circuit board 30 can be improved. . In this case, the dummy lead 38 may have the same width and thickness as the flexible lead 13, and may be configured to use a metal having a higher bending strength than the flexible lead 13. It is possible to obtain

Conversely, as shown in FIG. 10, the width dimension B of the dummy lead 38 that is not electrically connected may be configured to be smaller than the narrow width dimension A of the flexible lead 13. As a result, for example, as shown in FIG. 11, when a large bending stress is applied during the bending operation, the dummy lead 38 first breaks. Lead 13
Is broken, that is, the breakage of the flexible lead can be predicted using the breakage of the dummy lead 38 as a guide, and the limit of the bending operation can be easily recognized. In this case, the dummy lead 38 may be formed of a metal having the same width and thickness as the flexible lead 13 and a bending strength lower than that of the flexible lead 13. In this case, the same effect is obtained. It is possible.

In the present embodiment, the imaging device 1
Further improvements have been made to reduce the size of the fifth embodiment.

That is, as shown in FIG.
, A small-sized electronic circuit board 30 formed smaller than the outer shape of the solid-state imaging device 12 is used.

At the time of assembling, as shown in FIG. 3, the flexible lead 13 is bent from the polyimide tape 14 to the connection land 21 of the circuit board 30 which is smaller than the solid-state image pickup device 12. That is, the flexible lead 13 is bent in the shape of a crank toward the center of the outer shape of the solid-state imaging device 12. At this time, the plurality of bent flexible leads 13 are arranged at positions corresponding to the respective connection lands 21 provided on the circuit board 30 in the vertical direction in the drawing.

In the present embodiment, six flexible leads 13 on one side and a total of 12 flexible leads 13 on both sides are
And connected to the same number and pitch of connection lands 21 provided at opposing positions on the circuit board 30.

On the other hand, the signal lands 20 are connected to the connection lands 21 and the through holes 39 provided on the circuit board 30 in the left and right directions in the drawing by solder at corresponding positions. In this case, since the circuit board 30 has a small shape, the connection portion between the flexible lead 13 and the circuit board 30 and the connection portion between the signal cable 20 and the circuit board 30 are disposed inside the outer shape of the solid-state imaging device 12. Becomes The connection lands 21 and the through holes 39 provided in the horizontal direction in the figure are electrically connected to the connection lands 21 provided in the vertical direction in the figure via conductor patterns (not shown) or the electronic components 18 inside the circuit board. It is to be connected.

The cable holder connecting portion 43 provided to face the projecting portion 3 of the cable holder 25
1 is inserted and adhesively fixed.

Therefore, as described above, the signal cable 2
0 and flexible lead 13 from solid-state image sensor 12
Circuit board 3 provided with connection lands 21 for respectively connecting
0 is a small shape smaller than the size and shape of the solid-state imaging device 12, and the flexible lead 13 is connected to the solid-state imaging device 12 while being bent toward the center of the outer shape. Can be made smaller than the outer diameter of the solid-state imaging device 12, thereby greatly contributing to downsizing of the imaging device 15 itself.

Further, in the present embodiment, a cable fixing structure for more securely connecting the circuit board 30 to the signal cable 20 is adopted. Such a cable fixing structure will be described with reference to FIG.

In the present embodiment, after the connection of the flexible lead 13 from the solid-state imaging device 12 to the electronic circuit board 30 and the connection of the signal cable 20 to the circuit board 30 are completed, the connection state of the signal cable 20 is changed to a cable holder. 25
However, in this case, the inserted signal cable 20 is swaged at the base end side of the cable holder 20 serving as an insertion port of the signal cable 20, while the circuit board 30 side As described above, the connection state can be reliably reinforced by inserting the protrusion 31 of the cable holder 25 into the cable holder connection portion 43 (see FIG. 3) on the circuit board 30 and bonding and fixing the same. .

More specifically, the cable holder 25 used in the present embodiment is formed by providing a notch 27 in a part of a cylindrical member as shown in FIG. Notch 27
Are provided so as to be symmetrical in the cross-sectional direction of the cylinder.

When connection reinforcement is performed using the cable holder 25 having such a configuration, the signal cable bundle 24 is inserted into the cable holder 25 in advance, and the signal cable 2
After the connection of the cable holder 25 to the circuit board 30 and the connection of the protrusion 31 of the cable holder 25 to the cable holder connection part 43 are completed, for example, a cylinder not provided in the notch 27 as shown in FIG. The signal cable bundle 2 (not shown) is inserted by crushing the portion 28 with a predetermined device.
4 is caulked and fixed.

Further, at the end of the signal cable bundle 24 on the circuit board 30 side from the swaged portion of the cable holder 25, a thread winding portion 19 is provided as shown in FIG. 1, and the signal cable bundle 24 is pulled rightward in the drawing. When the applied force acts, the signal cable bundle 24 is prevented from coming off.

The inside of the cylinder of the cable holder 25 is filled with an adhesive and an adhesive filling portion 29c is formed to further secure the fixing strength of the signal cable bundle 24.

By adopting the caulking structure as described above,
The connection and fixation between the circuit board 30 and the signal cable 20 can be reliably reinforced.

(Modification) In the present embodiment, a description has been given of the case where a flat plate made of glass epoxy or ceramic is used as the circuit board 30. However, the present invention is not limited to this. For example, FIG. As described above, the substrate may have a T-shaped cross section, and a connection land 21 for connecting the signal cable 24 may be provided at a protruding portion to connect the signal cable 24.

When there is not enough space for the connection lands 21 on the circuit board 30, the flexible lead 13 and the signal cable 20 are connected to the same connection lands 21 as shown in FIG. Is also good.

As a specific connection method, first, FIG.
As shown in (a), the core wire 36 of the signal cable 20 is connected and fixed to the connection land 21 using high melting point solder, and then the high melting point solder portion 41 and the core wire 36 are connected as shown in FIG. A part is shaved and adjusted to the outer diameter of the substrate 30. Thereafter, as shown in FIG.
Are connected to the same connection land 21 using a low melting point solder through a low melting point solder portion 42. Connection land 21 at this time
FIG. 16 shows an enlarged cross-sectional view of the periphery.

That is, as shown in FIG. 16, by implementing the above connection method, the flexible lead 13 is connected only to the low melting point which melts at a lower melting point than the high melting point solder used when connecting the signal cable 20. Since it is solder, the flexible lead 13 can be bonded and fixed without melting the high-melting-point solder portion 41 which is the connection portion of the signal cable 20 that has already been connected. Thereby, the workability of the solder connection on the same connection land 21 can be improved.

In FIG. 14A, the connection lands 21
Although a core wire 36 having a large diameter is used for the dimensions of the above, for example, as shown in FIG. 15, if a core wire 36 having a small diameter is used, the work of shaving according to the outer shape of the substrate becomes unnecessary, and the processing step is reduced. It becomes possible to reduce.

In the present embodiment, first, the signal cable 20 is connected to the circuit board 30 and then the flexible lead 13 is connected. However, the flexible lead 13 is connected to the circuit board 30 first, and then the signal cable is connected. 20 may be connected.

(Effects) As described above, according to the present embodiment, the signal cable 20 is connected using the circuit board 30 smaller than the solid-state imaging device 12, and the side surface of the solid-state imaging device 12 is Is bent toward the connection land 21 of the circuit board 30 toward the center of the outer shape of the solid-state imaging device 12, and the connection portion, that is, the connection land 21 is located inside the outer shape of the solid-state imaging device 12. Since it is provided, the electrical connection around the circuit board 30 is reduced in size, and the overall size of the imaging device can be reduced.

Second Embodiment Next, a second embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. FIG. 17 is a sectional view of a main part showing the configuration of the second embodiment of the imaging apparatus of the present invention. In the apparatus shown in FIG. 17, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Configuration) In the imaging device 15 of the present embodiment, as shown in FIG.
The circuit board 30 is provided on the surface opposite to the surface 6 through the electronic component 18.
Are adhered and fixed in parallel with the solid-state imaging device 12.

The electronic component 18 on the left side of the figure with respect to the circuit board 30 is, for example, a transistor. The electronic component 18 and the solid-state imaging device 12 are bonded and fixed with an electrically insulating adhesive 32. The electronic component 18 on the right side in the figure with respect to the circuit board 30 is a buffer IC, which is connected to the circuit board 30 by wire bonding and then sealed with a sealing resin.

The flexible lead 13 extending from the solid-state imaging device 12 is bent in a direction opposite to the imaging surface 26 of the solid-state imaging device 12, and further bent toward the side of the small circuit board 30. That is, the flexible lead 13 is bent toward the center of the outer shape of the solid-state imaging device 12.

A connection land 21 is provided on a side of the circuit board 30 in the vertical direction in the figure, and the flexible lead 13 is connected and fixed to the connection land 21 by soldering.

In the present embodiment, the flexible lead 13 further extends from the connected and fixed circuit board 30 to the right side in the figure (to the side of the signal cable), and the signal cable 20 is soldered to the extending portion. 37b. In this case, each connection part is a solid-state imaging device 12.
Is located inside of the outer shape of.

(Effects) Therefore, according to the present embodiment, the flexible lead 1 extended from the circuit board 30
Since the signal cable 20 is directly connected by soldering to the circuit board 3, the number of connection lands 21 can be reduced, and the size of the circuit board 30 can be reduced. As a result, the overall size of the imaging device can be reduced. Other effects are the same as those of the first embodiment.

Third Embodiment Next, a third embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. FIG. 18 is a sectional view of a main part showing the configuration of the third embodiment of the imaging apparatus of the present invention. In the apparatus shown in FIG. 18, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) As shown in FIG. 18, a circuit board 30 is adhered and fixed in parallel with the solid-state imaging device 12 via an electronic component 18 on a surface opposite to the imaging surface 26 of the solid-state imaging device 12. I have. In this case, in this embodiment, the circuit board 3
The outer shape of 0 is substantially the same size as the outer shape of the solid-state imaging device 12.

The electronic component 18 on the left side of the circuit board 30 in the figure is, for example, a transistor. The electronic component 18 and the solid-state imaging device 12 are bonded and fixed with an electrically insulating adhesive 32. The electronic component 1 on the right side in the figure with respect to the circuit board 30
Reference numeral 8 denotes a chip capacitor and a chip resistor, for example.

The flexible lead 13 extending from the solid-state imaging device 12 is bent in a direction opposite to the imaging surface 26 of the solid-state imaging device 12.

A connection land 21 is provided on a side portion of the circuit board 30 in the vertical direction in the figure, and the flexible lead 13 is soldered to the connection land 21 in a state where the flexible lead 13 is bent perpendicularly to the solid-state imaging device 12. The connection is fixed.

In the present embodiment, the flexible lead 13 protrudes further from the circuit board 30 to which the flexible lead 13 is connected and fixed in the same manner as in the embodiment shown in FIG. Signal cable 2 in part
0 is connected via the solder portion 37b. At this time, the protruding portion of the flexible lead 13 is formed so as to be bent inward with the joint surface with the circuit board 30 as a fulcrum. That is, the protruding portion of the flexible lead 13 is bent toward the center of the outer shape of the solid-state imaging device 12.
Similarly, the connection portion between the flexible lead 13 and the signal cable 20, that is, the solder portion 37b, is also used for the solid-state imaging device 12
Will be provided inside the outer shape of.

(Effects) Therefore, according to the present embodiment, even when a large number of electronic components 18 must be mounted and a circuit board 30 having an outer shape almost the same as the outer shape of the solid-state imaging device 12 is used. The flexible lead 13 where the signal cable 20 is soldered is connected to the solid-state imaging device 1.
2 is bent toward the center of the outer shape, so that the size of the imaging device can be reduced. This allows
The same effects as in the above embodiment can be obtained.

Fourth Embodiment Next, a fourth embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. FIG. 19 is a sectional view of a main part showing the configuration of the fourth embodiment of the imaging apparatus of the present invention. In the apparatus shown in FIG. 19, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) As shown in FIG. 19, two circuit boards 3 are provided on the surface of the solid-state imaging device 12 on the side opposite to the imaging surface 26.
0 A is arranged and provided so that the distance between the substrates gradually decreases as the distance from the solid-state imaging device 12 increases. Electronic components 18 are mounted on the inner surface of each circuit board 30A. The flexible lead 13 extending from the solid-state imaging device 12 is connected to the imaging surface 2 of the solid-state imaging device 12.
6 is bent in the opposite direction.

Connection lands 21 are provided at the left ends of the circuit boards 30A in the figure, and the flexible leads 13 are connected and fixed to these connection lands 21 by soldering. Therefore, the flexible lead 13 is bent toward the center of the outer shape of the solid-state imaging device 12.

The connection lands 21 are also provided on the right end of the circuit board 30A in the drawing, on the surfaces facing the respective circuit boards 30A.
1 is connected to the signal cable 20 via a solder portion 37b.

(Modification) In the present embodiment, as the two circuit boards 30A are separated from the solid-state image pickup device 12, a certain predetermined distance from the solid-state image pickup device 12 is reduced so that the distance between the substrates is gradually reduced. Although it is configured to be arranged at an angle, if there is room in the space, for example, FIG.
As shown in FIG. 0, the solid-state imaging device 12 may be arranged so as to be vertically opposed to the imaging surface 26. in this case,
Each of the circuit boards 30A is configured to maintain the distance between the boards by the cable torses 44 within a range not exceeding the outer dimensions of the solid-state imaging device 12. Further, the right end (signal cable side) of the cable torsion 44 in the drawing is formed in a tapered shape, so that the signal cable 20 which has been separated in the vertical direction in the drawing by the circuit board 30A can be tapered. The signal cable bundle 2 is narrowed gradually toward the signal cable side, and the connection portion with the signal cable 20 is restricted to the diameter limit.
It can be made as thin as 4 in diameter.

(Effect) Therefore, according to the present embodiment, since a large number of electronic components 18 must be mounted,
Even when a plurality of circuit boards 30 </ b> A arranged perpendicularly or at an angle to the imaging surface 26 of the solid-state imaging device 12 are provided, the flexible leads 13
Since it is bent toward the center of the outer shape, the size of the imaging device can be reduced. Further, as shown in FIG. 19, the two circuit boards 30A are arranged so that the distance between the boards gradually decreases as the distance from the solid-state imaging device 12 increases, so that the connection portion up to the signal cable bundle 24 is formed. The diameter can be gradually reduced, which greatly contributes to downsizing of the imaging device.

Fifth Embodiment Next, a fifth embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. FIG. 21 is a sectional view of a main part showing the configuration of the fifth embodiment of the imaging apparatus of the present invention. In the apparatus shown in FIG. 21, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) As shown in FIG. 21, two circuit boards 3 are provided on the surface of the solid-state image pickup device 12 opposite to the image pickup surface 26.
0B is arranged in parallel with the solid-state imaging device 12 so as to face the same.
Among these circuit boards 30B, an electronic component 18 is mounted on a circuit board (the circuit board 30B on the left side in the figure) arranged on the solid-state imaging device 12 side. The outer shape of the circuit board 30 is substantially the same as the outer shape of the solid-state imaging device 12, as in the third embodiment shown in FIG.

Also in this embodiment, the solid-state imaging device 1
The flexible lead 13 extending from 2 is bent in the direction opposite to the imaging surface 26 of the solid-state imaging device 12, and is connected to the vertical end of the circuit board 30B on the left side in the figure. A land 21 is provided, and the flexible lead 13 is connected and fixed to the connection land 21 by soldering.

In this embodiment, the flexible lead 1
Reference numeral 3 is formed so as to extend further than the joint portion with the circuit board 30B, and the extended portion is bent inward through the joint portion with the circuit board 30B. The connection lands 21 provided on both side surfaces of the circuit board 30B on the middle right side are connected and fixed by soldering. Further, the circuit board 30B on the right side in the figure is a board for connecting a signal cable, and the signal cable 20 is connected to a through hole 39 provided on the other side surface having no connection land 21. I have. That is, since the substrate is used for connection, it is possible to reduce the size of the substrate.

Therefore, according to the above configuration, the flexible lead 13 is bent toward the center of the outer shape of the solid-state imaging device 12 from the circuit board 30B on the left side of the figure through the signal cable connection portion. First,
The connection portion can be configured with a configuration substantially similar to that of the third embodiment.

(Effects) Therefore, according to the present embodiment, it is possible to obtain the same effects as those of the third and third embodiments, that is, it is possible to reduce the size of the imaging device 15. Become.

Sixth Embodiment: Next, a sixth embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. FIG. 22 is a sectional view of a main part showing the configuration of the sixth embodiment of the imaging apparatus of the present invention. In the apparatus shown in FIG. 22, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Construction) In the present embodiment, the circuit board 30 used in the above-described embodiment is deleted, and the electronic components 18 are mounted on the respective inner surfaces of the extending flexible leads 13 so as to be electrically connected. This embodiment is different from the above-described embodiment in that connection is made and the flexible leads 13 are formed so as to be gradually bent toward the center of the solid-state imaging device 12, thereby enabling downsizing. It is.

More specifically, as shown in FIG. 22, the flexible lead 13 extending from the solid-state imaging device 12 is bent in a direction opposite to the imaging surface 26 of the solid-state imaging device 12. An electronic component 18 is mounted on a part of the inner surface of each flexible lead 13, and a polyimide tape 14 for electrical insulation is coated on an outer surface other than the mounting part and the connection land 21. It has become so.

Further, each of the flexible leads 13
Are arranged such that the distance between the leads gradually decreases within a range not exceeding the outer dimensions of the solid-state imaging device 12 and approach each other.

Therefore, the flexible lead 13 can be bent toward the center of the outer shape of the solid-state image pickup device 12.

Further, each flexible lead 13
Connection lands 21 are provided at the respective base ends shown on the right side of FIG.
Are connected via a solder portion 37b.

(Effects) Therefore, according to the embodiment having the above structure, since the flexible lead 13 on which the electronic component 18 is mounted is bent toward the center of the outer shape of the solid-state imaging device 12, the size of the imaging device can be reduced. Can be achieved. In addition, since all the parts to be bent are members of flexible leads, it is easy to perform bending work, and it is possible to make any bent shape, which makes it possible to improve connection workability and bending workability. Regarding the shape of the part, it is also possible to expand the application range.

By the way, in the image pickup apparatus of the present invention, in addition to the miniaturization of the electrical connection portion between the flexible lead from the solid-state image pickup device 12 and the circuit board or the signal cable, other peripheral members are improved. In addition, the size of the imaging device itself can be reduced. Such an embodiment will be described with reference to FIGS.

In a conventional image pickup apparatus, although not shown, the solid-state image pickup device or the cover glass provided on the front surface of the solid-state image pickup device has the same diameter as the outer shape of the lens adhered to the cover glass, or partially has a smaller diameter. Was also large. For this reason, since the solid-state image sensor or the cover lens is partially larger than the lens, the shape of the holding frame for holding the solid-state image sensor to which the lens is adhered and the shape of the shield case for protecting the circuit board connected to the solid-state image sensor are complicated. As a result, the processing and assembly of the members become complicated, and the image pickup apparatus becomes large.

An embodiment in consideration of such a problem will be described below.

Seventh Embodiment FIG. 23 shows a seventh embodiment of the image pickup apparatus according to the present invention, in which a solid-state image pickup device portion including a lens during the assembly of the image pickup apparatus is viewed from the rear. It is a perspective view. In the apparatus shown in FIG. 23, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Configuration) In the present embodiment, the imaging device 15
As the convex lens 10 mounted on the solid-state image pickup device 12, a cover glass 11 provided on the front surface of the solid-state image pickup device 12 or a lens having an outer shape larger than that of the solid-state image pickup device 12 is used.

Therefore, at the time of assembly,
When the cover glass 11, the convex lens, and the circuit board 30 are connected to each other, as shown in FIG. The large convex lens 10 will be partially exposed. In addition, when viewed from the front, for example, as shown in FIG. 24, the cover glass 11 and the solid-state imaging device 12 can be accommodated within the size and shape of the convex lens 10.

The circuit board 30 is provided with a predetermined number of through holes 39 through which the signal cables 20 are inserted and fixed by soldering in the subsequent connection process. In addition, it is used at the time of connection with the signal cable 20.

(Effects) Therefore, according to the embodiment having the above structure, for example, as shown in FIG.
Can be formed integrally with the CCD holder 2, so that processing and assembling are easy, and a shield case, which is conventionally required, is unnecessary, and the number of parts is low. It is also possible to reduce costs.

Since the outer shape of the convex lens 10 is larger than the outer shape of the cover glass 11 or the solid-state image pickup device 12, if the inner diameter of the cylindrical support portion 40 is the same as the outer shape of the convex lens 10, the internal space of the support portion 40 will be reduced. The cover glass 11 and the solid-state imaging device 12 can be inserted into the device. That is, it is possible to electrically or mechanically shield the cover glass 11, the solid-state imaging device 12, and the electrical connection portion bonded to the convex lens 10 by the support portion 40.

(Modification) In the present embodiment, the cross-sectional shape of the convex lens 10 is circular. However, for example, as shown in FIG. It may be formed and configured so as to obtain a size relationship. In this case, the same effect can be obtained.

By the way, in consideration of the size (width) and arrangement of the flexible leads used for making electrical connection between the fixed image pickup device and the circuit board in the general image pickup device 15, the size of the image pickup device can be reduced. In order to achieve this, it is desired that the connection be made in a width and arrangement suitable for that. In other words, since the size (size) of the circuit board is determined by the width and arrangement of the flexible leads used, the width and arrangement of the flexible leads suitable for miniaturization of the circuit board must be considered.

However, the solid-state imaging device 1 of the conventional imaging device
Since the width and the interval of the flexible leads extending from 2 are constant, for example, as shown in FIG. 28, the size of the circuit board for connecting the solid-state imaging device and the signal cable depends on the width and the interval of the flexible leads as described above. Has been determined, and there has been an inconvenience that the image pickup apparatus becomes large.

An embodiment for solving such disadvantages will be described below.

Eighth Embodiment FIG. 29 shows an imaging apparatus according to an eighth embodiment of the present invention.
FIG. 3 is a configuration diagram for explaining a shape of a flexible lead that connects between circuit boards. In the apparatus shown in FIG. 29, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) As shown in FIG. 29, a flexible lead 1 is provided on a part of the solid-state imaging device 12 on the imaging surface 26 side.
3 is bump-bonded, and the bonding portion is adhesively fixed while being sandwiched between the cover glass 11 and the solid-state imaging device 12. The other end of the flexible lead 13 is connected and fixed to the circuit board 30 by soldering or the like.

In the present embodiment, the distance a between the flexible leads 13 and the width b of the flexible leads 13 near the joint between the solid-state image pickup device 12 and the flexible leads 13 are different from those of the circuit board 30 and the flexible leads 13. The relationship between the spacing dimension a ′ and the width dimension b ′ of each of the flexible leads 13 in the vicinity of the portion is a> a ′, b
= B '(see FIG. 29).

(Effects) Therefore, with the above configuration, the plurality of flexible leads 13 extending from the solid-state imaging device 12 can be arranged with the arrangement interval gradually narrowed toward the circuit board side. The size of the circuit board to be connected can be reduced, and as a result, the size of the imaging device can be reduced.

Ninth Embodiment: FIG. 30 shows a ninth embodiment of the imaging apparatus according to the present invention.
FIG. 3 is a configuration diagram for explaining a shape of a flexible lead that connects between circuit boards. In the apparatus shown in FIG. 30, the same components as those in the eighth embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) This embodiment is a modification of the eighth embodiment (see FIG. 29), and is the same as the eighth embodiment except for the shape and structure of the flexible lead.

The difference is that, as shown in FIG. 30, the distance a between the flexible leads 13 and the width b between the flexible leads 13 near the joint between the solid-state image pickup device 12 and the flexible leads 13 are different from those of the circuit board 30 and the flexible board 13. The point is that the size relationship between the spacing dimension a ′ and the width dimension b ′ of each flexible lead 13 near the joint with the lead 13 is such that a = a ′ and b> b ′.

(Effects) Therefore, with the above configuration, the same effects as in the eighth embodiment can be obtained.

Tenth Embodiment: FIG. 31 shows a tenth embodiment of the imaging apparatus according to the present invention, and is a configuration for explaining the shape of a flexible lead connecting between a solid-state imaging device and a circuit board. FIG. In the apparatus shown in FIG. 31, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(Structure) This embodiment is a modification of the eighth embodiment (see FIG. 29), and is the same as the eighth embodiment except for the shape and structure of the flexible lead.

The difference is that, as shown in FIG. 31, the distance a between the flexible leads 13 near the joint between the solid-state image pickup device 12 and the flexible leads 13 and the width b of the flexible board 13 are different from those of the circuit board 30 and the flexible board 13. The point is that the size relationship between the spacing dimension a ′ and the width dimension b ′ of each flexible lead 13 near the joint with the lead 13 is such that a> a ′ and b> b ′.

(Effects) Therefore, the above configuration makes it possible to further reduce the size of the circuit board 30 as compared with the eighth and ninth embodiments, greatly contributing to the miniaturization of the imaging device. [Supplementary Note] (Supplementary Note 1) In the endoscope imaging device including a solid-state imaging device, a flexible lead extending from at least one side surface of the solid-state imaging device, a circuit board, and a signal cable, An imaging apparatus for an endoscope, wherein a lead is connected to at least one of the circuit board and the signal cable in a state where the lead is bent toward a center of an outer shape of the solid-state imaging device.

(Supplementary note 2) The connecting part between the flexible lead and at least one of the circuit board and the signal cable is provided inside the outer shape of the solid-state imaging device. Endoscope imaging device.

(Additional Item 3) The imaging device for an endoscope according to Additional Item 1 or 2, wherein the circuit board is provided substantially in parallel with the solid-state imaging device.

(Additional Item 4) The endoscope imaging apparatus according to Additional Item 3, wherein the circuit board is formed with an outer shape smaller than an outer shape of the solid-state image sensor.

(Supplementary Note 5) The flexible lead is connected to a part of the side surface of the circuit board and is connected to the signal cable via the connection part, or is connected to a part of the side surface of the circuit board. The imaging device for an endoscope according to claim 4, wherein the signal cable is connected to an extension portion extending together with the endoscope.

(Additional Item 6) The imaging device for an endoscope according to Additional Item 3, wherein the circuit board is formed to have substantially the same outer shape as the outer shape of the solid-state imaging device.

(Supplementary Note 7) The flexible lead is connected to a part of the side surface of the circuit board and bends an extended portion toward the center of the outer shape of the solid-state imaging device. 7. The endoscope imaging apparatus according to claim 6, wherein the signal cable is connected.

(Additional Item 8) Endoscope imaging having a solid-state imaging device, flexible leads extending from at least one side surface of the solid-state imaging device, first and second circuit boards, and a signal cable. In the device, the flexible lead is connected to the first circuit board in a state where the flexible lead is bent toward the center of the outer shape of the solid-state imaging device, and an extended portion of the flexible lead further extended is attached to the first circuit board. An imaging device for an endoscope, wherein the imaging device is connected to a second circuit board having an outer shape smaller than an outer shape of the circuit board.

(Supplementary Note 9) The first and second circuit boards are disposed substantially parallel to and opposed to the solid-state imaging device, and the signal cable is provided near the center of the outer shape of the solid-state imaging device. 9. The imaging device for an endoscope according to claim 8, wherein the imaging device is connected to a surface of the second circuit board.

(Additional Item 10) Endoscope imaging having a solid-state imaging device, flexible leads extending from at least one side surface of the solid-state imaging device, first and second circuit boards, and a signal cable. In the apparatus, the flexible lead is connected to the first and second circuit boards in a state where the flexible lead is bent toward a center of an outer shape of the solid-state imaging device;
An imaging apparatus for an endoscope, wherein the first and second circuit boards are gradually inclined toward the center of the outer shape of the solid-state imaging device as the distance from the solid-state imaging device increases.

(Additional Item 11) The additional feature of the additional item 10, wherein the signal cable is connected to the inner surface of the first and second circuit boards near the center of the outer shape of the solid-state imaging device. Endoscope imaging device.

(Supplementary Note 12) The first and second circuit boards are provided so as to be substantially parallel to and opposed to the solid-state image sensor at a position from the center of the outer shape of the solid-state image sensor. The imaging device for an endoscope according to additional item 10 or 11, wherein:

(Supplementary Note 13) A solid-state image pickup device, a circuit board, a signal cable, and a signal cable fixing member are provided, and the signal cable and the circuit board are connected and fixed by the signal cable fixing member. In the imaging device for an endoscope, the imaging device for an endoscope is characterized in that the signal cable fixing member is fixed by caulking and fixing the signal cable.

(Additional Item 14) The signal cable fixing member is formed with a projecting portion integrally extending at a base end opposite to the side to which the signal cable is fixed, and the projecting portion is connected to the circuit board. The imaging device for an endoscope according to claim 13, wherein the image pickup device for an endoscope is connected and fixed to the circuit board by being inserted and fixed in a connection hole provided on the surface.

(Additional Item 15) In the endoscope imaging apparatus having a solid-state imaging device, a cover glass provided on the front surface of the solid-state imaging device, and a lens provided on the front surface of the glass lid, the solid-state imaging device An endoscope imaging device, wherein at least one of the outer shape of the lens and the cover glass is smaller than the outer shape of the lens.

(Additional Item 16) A solid-state image pickup device, a flexible lead extending from at least one side surface of the solid-state image pickup device, a circuit board, and a signal cable are provided, and the circuit is provided via the flexible lead. In the imaging device for an endoscope connected to a substrate, at least one of the width and the interval of the flexible lead extending from the solid-state imaging device is reduced as the distance from the connecting portion between the flexible lead and the solid-state imaging device decreases. An imaging device for an endoscope, comprising:

[0128]

As described above, according to the present invention, the connection between the solid-state imaging device and the circuit board is not required by using a connecting member separately from the solid-state imaging device and the circuit board, and the flexible lead is provided. Is connected to at least one of the circuit board and the signal cable in a state where it is bent toward the center of the outer shape of the solid-state image sensor. Therefore, the size of the entire imaging device can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a first embodiment of an endoscope imaging apparatus according to the present invention.

FIG. 2 is a configuration perspective view of a cable holder mounted on the device of FIG. 1;

FIG. 3 is a rear perspective view of a fixed imaging element mounted on the apparatus of FIG. 1;

FIG. 4 is a configuration perspective view of a connection land provided on a conventional circuit board.

FIG. 5 is a configuration perspective view of a connection land provided on the circuit board according to the present embodiment.

FIG. 6 is a configuration diagram showing a configuration of a conventional solid-state imaging device unit before assembly.

FIG. 7 is a configuration diagram showing a configuration of a solid-state imaging device unit before assembly mounted on the apparatus of FIG. 1;

FIG. 8 is a configuration diagram showing a configuration of a solid-state imaging device unit before assembly mounted on the apparatus of FIG. 1;

FIG. 9 is a cross-sectional view showing the configuration of a solid-state image sensor unit after being mounted on the apparatus shown in FIG. 1;

FIG. 10 is a configuration diagram showing a configuration before assembling another solid-state imaging element unit.

FIG. 11 is an explanatory diagram for explaining the operation of the solid-state imaging device shown in FIG. 10;

FIG. 12 is a cross-sectional view illustrating a configuration of the solid-state imaging device unit illustrated in FIG. 10 after assembly.

FIG. 13 is a cross-sectional view of a solid-state imaging device for explaining another connection method.

FIG. 14 is an explanatory diagram for explaining a method of manufacturing a connection land mounted on the apparatus of FIG. 1;

FIG. 15 is a top view showing a configuration of a connection land.

FIG. 16 is an explanatory diagram for explaining a connection state of a connection land portion.

FIG. 17 is a cross-sectional view of an apparatus for explaining the configuration of the second embodiment.

FIG. 18 is a cross-sectional view of an apparatus for explaining the configuration of the third embodiment.

FIG. 19 is a cross-sectional view of an apparatus for explaining a configuration of a fourth embodiment.

FIG. 20 is a cross-sectional view of the device for explaining a modification of the device shown in FIG. 19;

FIG. 21 is a sectional view of an apparatus for describing a configuration of a fifth embodiment.

FIG. 22 is a cross-sectional view of an apparatus for describing a configuration of a sixth embodiment.

FIG. 23 is a rear perspective view of the solid-state imaging device unit in the middle of assembly for explaining the configuration of the seventh embodiment;

FIG. 24 is an explanatory diagram for explaining a size relationship between a convex lens and a cover glass.

FIG. 25 is a configuration diagram of an imaging device for describing effects.

FIG. 26 is a rear perspective view of the solid-state imaging element unit in the process of assembling for describing a modification;

FIG. 27 is an explanatory diagram for explaining a size relationship between a convex lens and a cover glass.

FIG. 28 is a configuration diagram showing a configuration of a connection section using a conventional flexible lead.

FIG. 29 is a configuration diagram of a connection portion for describing the configuration of the eighth embodiment.

FIG. 30 is a configuration diagram of a connection portion for describing a configuration of a ninth embodiment.

FIG. 31 is a configuration diagram of a connection portion for describing the configuration of the tenth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Lens frame, 2 ... CCD holder, 3 ... Space holding member, 4 ... Flare stop, 5 ... Brightness stop, 6 ... Flare stop, 7 ... Concave lens, 8 ... Convex lens, 9 ... Infrared cut filter, 10 ... Convex lens Reference Signs List 11 11 cover glass 12 solid-state imaging device 13 flexible lead 14 polyimide tape 15 imaging device 16 V-shaped groove 17 U-shaped groove 18 electronic component 19 thread winding part 20 ... Signal cable, 21 ... Connection land, 22 ... Shield case, 23 ... Heat shrinkable tube, 24 ... Signal cable bundle, 25 ... Cable holder, 26 ... Imaging surface, 27 ... Notch, 28 ... Cylinder part, 29 ... Adhesive Filling portion, 30: Circuit board, 31: Projecting portion, 32: Electrical insulating adhesive, 33: Semicircular through hole, 34: Connection pattern, 35: Notch portion, 36: Core , 37 ... solder portion, 38 ... dummy leads, 39 ... through hole, 40 ... support portion, 41 ... high melting point solder portion, 42 ... low melting point solder portion, 43 ... cable holder connecting part, 44 ... cable and fit.

Claims (1)

[Claims] 1. An endoscope imaging apparatus comprising: a solid-state imaging device; a flexible lead extending from at least one side surface of the solid-state imaging device; a circuit board; and a signal cable. An imaging device for an endoscope, wherein the imaging device for an endoscope is connected to at least one of the circuit board and the signal cable in a state where the solid-state imaging device is bent toward the center of the outer shape.