JP3742514B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging apparatus suitable for a built-in tip of an endoscope.
[0002]
[Prior art]
Conventionally, various apparatuses have been developed that electronically capture a subject image using a solid-state image sensor. For example, an image pickup apparatus using a CCD (charge coupled device) is also used in an electronic endoscope apparatus or the like.
[0003]
As an example of applying the conventional imaging device to the endoscope device as described above, there is one disclosed in Japanese Patent Laid-Open No. 6-148530. According to this proposal, the optical axis of the objective optical system provided at the distal end portion of the endoscope is bent and guided to the light receiving portion of the solid-state imaging device provided horizontally. The solid-state imaging device is connected to a circuit board on which electrical components are mounted. A through hole is formed in the circuit board, and electrical connection is performed by inserting a lead and a signal cable extending from the solid-state imaging device using the through hole.
[0004]
The signal cable is connected to the video processor, and the observation image of the subject is displayed by transmitting the image signal captured by the imaging device to the video processor via the signal cable.
[0005]
[Problems to be solved by the invention]
However, in the conventional imaging device, each signal line of the signal cable is connected to a through-hole land provided on the circuit board by soldering or the like. This signal cable is configured by covering a plurality of signal wires, that is, a stranded wire formed by twisting coaxial wires or simple wires, with a laterally wound tape, a comprehensive shield, and a resin sheath. .
[0006]
The plurality of signal lines are arranged and connected to through-hole lands on the circuit board surface. When the conductor of the simple line or the inner conductor of the coaxial line is arranged adjacent to the outer conductor of the coaxial line, the signal line is connected obliquely to the land formed on the circuit board, or the signal line When the strip length is long, the outer conductor of the coaxial line and the conductor of the simple line or the inner conductor of the coaxial line come into contact with each other, resulting in a problem of image defects.
[0007]
Further, a bending portion for bending the distal end portion is provided at the distal end portion of the insertion portion of the electronic endoscope. When the conventional imaging device is arranged at the distal end of the insertion portion, the signal cable is pushed and pulled by the bending operation of the bending portion, the signal line connected to the circuit board moves, and the conductor of the simple line and / or There has also been a problem that the observation image may become defective due to contact between the inner conductor and the outer conductor of the coaxial line.
[0008]
In order to prevent these image defects, it is necessary to widen the interval between the signal lines. For this reason, a circuit board will become large and an apparatus will enlarge. Therefore, the distal end portion of the electronic endoscope becomes thicker and the distal end rigid length becomes longer.
[0009]
Furthermore, when the outer conductor of the coaxial line is frayed or the insulator covering the inner conductor of the simple line or the coaxial line is damaged, each signal line may come into contact with the outer conductor of the coaxial line, resulting in an image defect. There was also a problem.
[0010]
  The present invention has been made in view of such problems., PaintingWhile preventing the occurrence of image defects,EquipmentAn object of the present invention is to provide an imaging device that can be reduced in size and shortened.
[0011]
[Means for Solving the Problems]
  Of the present inventionFirstThe imaging apparatus processes an objective optical system, a solid-state imaging apparatus that converts an optical image formed by the objective optical system into an electrical signal, wiring for transmitting an electrical signal from the solid-state imaging apparatus, and the electrical signal A circuit board on which electrical circuit components are provided;A core wire composed of an inner conductor and an insulating layer covering the inner conductor, and an outer conductor disposed coaxially with the core wire and covering the outer surface of the core wire via the insulating layer, A coaxial cable connected to the circuit board, wherein the coaxial cable is formed such that the core wire and the outer conductor extend from the outside of one end face of the circuit board across the one end face of the circuit board. And the inner conductor of the core wire is connected to a first connection portion disposed on one surface of the circuit board, while the outer conductor is connected to the back surface side of the first connection portion on the other surface of the circuit board. It is connected to the arranged second connection part.
[0012]
  According to a second imaging device of the present invention, in the first imaging device, the solid-state imaging device includes a light receiving unit disposed substantially parallel to an optical axis of the objective optical system, and the objective optical An optical element is provided that bends the optical axis of the objective optical system substantially at a right angle in order to form an optical axis of the system on the light receiving portion.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 7 relate to a first embodiment of the present invention, and FIG. 1 is a sectional view of a distal end portion of an electronic endoscope provided with an imaging apparatus according to the first embodiment. 2 is a schematic diagram of an electronic endoscope system in which the imaging apparatus of FIG. 1 is incorporated, FIGS. 3 and 4 are perspective views showing signal lines in FIG. 1, and FIG. 5 is a cross-sectional view showing a signal cable in FIG. 6 is a cross-sectional view taken along line XX in FIG. 1, and FIG. 7 is a top view seen from the direction A in FIG.
[0014]
The present embodiment is an example in which an imaging apparatus is applied to an electronic endoscope.
[0015]
First, an outline of the endoscope system will be described with reference to FIG.
[0016]
In FIG. 2, the endoscope system includes an electronic endoscope 1, a light source device 2 that supplies illumination light to the electronic endoscope 1, a video processor 3 that processes an image signal from the electronic endoscope 1, A monitor 4 for monitoring and displaying a video signal from the video processor 3 is provided. Peripheral devices such as a VTR deck 5, a video printer 6 and a video disk 7 are also connected to the video processor 3.
[0017]
The electronic endoscope 1 is formed with a flexible insertion portion 8 that is elongated at the distal end side and can be inserted into a body cavity, and an operation portion 9 is formed on the proximal (base end) side. The insertion portion 8 includes an elongated and flexible flexible tube 10 that can be inserted into a body cavity, a bending portion 11 formed of a plurality of bending pieces formed on the distal end side of the flexible tube 10, and a rigid tube. It is comprised by the front-end | tip part 12. FIG. The bending portion 11 can be bent by operating up / down / left / right bending operation knobs (not shown) disposed in the operation portion 9.
[0018]
A universal cord 14 extends from the operation unit 9 and is connected to the video processor 3 via the connector device 13. The light source device 2 is provided with a connector receiver 15 to which a connector device 13 is connected. The universal cord 14 is connected to the light source device 2 through the connector device 13 and the connector receiver 15, and the electronic endoscope is passed through a light guide fiber (not shown) through which illumination light from the light source lamp 16 of the light source device 2 is inserted. 1 leading to the leading end portion 12.
[0019]
The universal code 14 supplies a power supply voltage, a drive signal, and the like from the video processor 3 to the electronic endoscope 1 and supplies a video signal from the electronic endoscope 1 to the video processor 3. .
[0020]
In FIG. 1, the distal end portion 12 includes a cylindrical member 21 attached to the bending portion 11, and a substantially columnar distal end constituent member 22 provided at the distal end of the cylindrical member 21. A tip cover 23 is fitted on the tip of the tip component member 22 and is fixed by an adhesive. On the rear end side of the tip cover 23, a rubber tube 24 that covers the tip constituent member 22 and the cylindrical member 21 is provided.
[0021]
A light guide fiber 25, a forceps channel 26, and a signal cable 27 are inserted into the insertion portion 8 from the hand side to the distal end portion 12.
[0022]
An illumination through-hole 28 is formed in the tip constituting member 22, and an illumination lens frame 29 inserted and fixed in the illumination through-hole 28 is irradiated with illumination light from the light source device 2 to an observation portion. A plurality of illumination lenses 30 are fixed. The tip of the light guide fiber 25 is in contact with the illumination lens 30.
[0023]
A forceps through hole 31 is also formed in the distal end component member 22. A forceps pipe 32 is inserted and fixed in the forceps through-hole 31, and the forceps pipe 32 is inserted into the forceps channel 26 provided in the insertion portion 8 and inserted into the operation portion 9. 17 is communicated. The forceps inserted from the insertion port 17 are projected from the distal end portion 12 via the forceps channel 26 and the forceps pipe 32.
[0024]
Further, a nozzle (not shown) is also attached to the tip cover 23, and an air / water feed channel is connected to a communication hole formed in the tip constituent member 22 so as to communicate with the nozzle.
[0025]
An objective lens frame 36 is inserted and fixed in the tip component member 22 so as to be fitted, and an objective lens optical system 37 including a plurality of objective lenses is fixed in the objective lens frame 36.
[0026]
A light receiving unit 41 of the solid-state imaging device 40 is disposed in parallel to the optical axis of the objective lens optical system 37 below the rear end of the objective lens 38 on the base end side of the objective lens optical system 37. A prism 39 that bends an optical axis substantially parallel to the longitudinal axis of the insertion portion 8 at a substantially right angle is bonded and fixed to the objective lens 38, and a solid-state imaging device 40 disposed substantially parallel to the longitudinal axis of the insertion portion 8. An optical image is guided to the light receiving portion 41 of the light source.
[0027]
The solid-state imaging device 40 is connected and fixed to the distal end side of a circuit board 42 arranged substantially parallel to the solid-state imaging device 40, and signal lines for connecting a plurality of signal lines 43 to the proximal end side of the circuit board 42. A land portion is formed. The signal lines 43 include, for example, signal lines that transmit Vdd that is a driving power source of the solid-state imaging device, φP, φS, and φAB that are clock signals and Vout that is an output signal, GND lines, and the like. 43 is connected at the signal line land. The plurality of signal lines 43 are configured by twisting and bundling coaxial lines and / or simple lines, and are extended to the connector device 13 as signal cables 27.
[0028]
A plurality of electronic components 44 are provided on the circuit board 42, and a wiring pattern (not shown) for connecting signals input / output from the signal lines 43 and the solid-state imaging device 40 to the electronic components 44 is also provided.
[0029]
The object illuminated with the illumination light forms an image on the light receiving unit 41 of the solid-state imaging device 40 via the objective lens optical system 37 and is photoelectrically converted by the solid-state imaging device 40. The photoelectrically converted signal is supplied to the video processor 3 via a signal line 43 (signal cable 27) connected to the rear end side of the solid-state imaging device 40.
[0030]
3 and 4 show a plurality of signal lines 43. 3 shows the coaxial line 51, and FIG. 4 shows the simple line 57.
[0031]
The coaxial line 51 has a core wire 54 and an outer conductor 55 that covers the core wire 54. The core wire 54 includes an inner conductor 52 and an inner insulating coating 53 that covers the inner conductor 52. The outer conductor 55 is covered with an outer insulating coating 56. The simple line 57 includes a conductor 58 and an insulating coating 59 that covers the conductor 58.
[0032]
FIG. 5 shows the signal cable 27.
[0033]
A plurality of signal lines 43 are provided in the signal cable 27. FIG. 5 shows an example in which two coaxial lines 51-1 and 51-2 and two simple lines 57-1 and 57-2 are provided as the signal line 43. These signal lines 51-1, 51-2, 57-1, 57-2 are bundled together in the insulating tape 60, and the insulating tape 60 is covered with a general shield 61 and an outer skin 62. .
[0034]
In the present embodiment, as shown in FIG. 1, the signal line 43 is connected on both sides of the circuit board 42. FIG. 6 specifically shows a connection portion of the signal line 43 by cutting along the line XX of FIG.
[0035]
As shown in FIG. 6, the circuit board 42 is provided with a plurality of lands 65 for signal line connection on the upper and lower surfaces. Furthermore, a plurality of lands 66 for connecting external conductors are provided on the lower surface of the circuit board 42. The lands 65 and 66 are provided at substantially line symmetrical positions above and below the circuit board 42.
[0036]
For example, the conductor 58-1 (Vdd) of the simple line 57-1, the inner conductor 52-1 (φVout) and the inner conductor 52-2 (φP) of the core wires 54-1 and 54-2 of the coaxial line 51 are on the upper surface. Connected to the land 65 provided. A conductor 58-2 of a simple line 57-2 is connected as a GND line to the land 65 provided on the lower surface, and external conductors 55-1 (φAB) and 55-2 (φS) are fixedly connected to the land 66. It has come to be.
[0037]
After the electrical connection of each signal line 43 to the circuit board 42 is completed, the solid-state imaging device 40 and the connection part between the circuit board 42 and the signal cable 27 are covered with a shield frame 45 as shown in FIG. Thus, the inside of the shield frame 45 is sealed with an insulating filler 46. Further, the shield frame 45 is covered with an insulating cover 47. A cable protection member 48 that covers the outer sheath 62 of the signal cable 27 is held and fixed at the base end portion of the insulating cover 47 formed so as to extend to the base end side from the shield frame 45. The cable protection member 48 reduces damage to the signal cable 27 from other built-in objects disposed in the insertion portion 8 or damage to other built-in objects.
[0038]
The operation of the embodiment configured as described above will be described with reference to FIGS.
[0039]
Lands 65 and 66 are formed on both sides of the circuit board 42. Among the plurality of signal lines 43 (coaxial line 51 and simple line 57) constituting the signal cable 27, the inner conductors 52-1 and 52- of the core lines 54-1 and 54-2 of the coaxial lines 51-1 and 51-2. 2 and the external conductors 55-1 and 55-2 are connected to lands on different surfaces of the circuit board 42, respectively. Further, for example, the conductor 58-2 of the simple line 57-2 used as the GND line is also connected to the same surface as the connection surface of the external conductors 55-1 and 55-2, for example, another Vdd simple line 57-1. The conductor 58-1 is connected to the same surface as the inner conductors 52-1 and 52-2.
[0040]
Accordingly, in the vicinity of the signal line connecting portion of the circuit board 42, the inner conductors 52-1 and 52-2 of the plurality of coaxial lines 51-1 and 51-2 and the outer conductor of the plurality of coaxial lines 51-1 and 51-2. Contact with 55-1 and 55-2 can be prevented. Thereby, it is possible to prevent the occurrence of image defects.
[0041]
In addition, since the plurality of surfaces of the circuit board 42 are used as signal line connection portions, the circuit board 42 can be reduced in size. Thereby, the imaging device 49 can be reduced in size and the length can be shortened. Therefore, it is possible to reduce the diameter of the distal end portion 12 of the electronic endoscope 1 in which the imaging device is disposed. Of course, the distal end rigid length of the distal end portion 12 can also be shortened.
[0042]
Further, as shown in FIG. 6, a simple line 57-2 is arranged and connected between the core wires 54-1 and 54-2. As a result, the contact between the external conductors 55-1 and 55-2 can be prevented, and the occurrence of image defects can be prevented.
[0043]
Further, as shown in FIGS. 6 and 7, the inner conductor and the outer conductor of one coaxial line are connected to the land at a line symmetrical position with the circuit board 42 as the axis of symmetry. That is, one of the inner conductor and the outer conductor is arranged and connected to the front surface of the circuit board, and the other is arranged and symmetrical with respect to the rear surface.
[0044]
For example, with respect to the core wire 54-1, the inner conductor 52-1 is connected to the land 65 on the front surface of the circuit board 42, and the outer conductor 55-1 is disposed and connected to the land 66 at the line-symmetrical position on the back surface. Thereby, the intersection of the signal lines can be eliminated, and the contact between the external conductors 55-1 and 55-2 can be prevented. In addition, the friction due to the intersection of the signal lines is eliminated and disconnection can be prevented, and the occurrence of image defects can be prevented.
[0045]
Further, by transmitting different signals to the inner conductor 52 and the outer conductor 55, the number of signal lines can be reduced to half. Thereby, the signal cable 27 can be made thinner, and the insertion portion and the distal end portion can be further reduced in diameter.
[0046]
Further, by making all the signal lines 43 constituting the signal cable 27 coaxial, the number of signal lines can be reduced and the signal cable 27 can be reduced in diameter.
[0047]
Thus, in the present embodiment, since the electrical connection with each signal line is performed on both surfaces of the circuit board, the apparatus can be miniaturized. Further, since the inner conductor and the outer conductor are separately connected on the front surface and the back surface, it is easy to prevent these contacts. Furthermore, since the contact can be prevented without the signal lines crossing each other, the occurrence of disconnection can also be prevented.
[0048]
8 and 9 relate to a second embodiment of the present invention, FIG. 8 is a side view showing a circuit board 71 employed in the second embodiment, and FIG. 9 is a rear view of FIG.
[0049]
In the present embodiment, a circuit board 71 is employed instead of the circuit board 42. The circuit board 71 is different from the circuit board 42 in the positions where the lands 72 and 73 are provided. A plurality of lands 72 are formed on the surface side of the circuit board 71 on the base end side. On the other hand, on the back surface side of the circuit board 71, a plurality of lands 73 are formed on the base end portion side, and a plurality of lands 74 are also formed on the tip end portion side. The land 74 is for connecting the inner conductor 52 of a certain coaxial line 51 and the conductor 58 of the simple line 57.
[0050]
The front-side land 72 is connected to the other inner conductor 52 and the conductor 58 of the simple line 57, and the rear-side land 73 is connected to the external conductor 55.
[0051]
At this time, the inner conductor 52 and the conductor 58 connected to the land 74 on the front end side are covered with the inner insulating coating 53 and the insulating coating 59, respectively. Therefore, the coaxial line 51 and the simple line 57 connected to the land 74 may be wired so as to pass over the land 73 connecting the external conductor 55 and the like.
[0052]
In the embodiment configured as described above, the conductor 58 of the simple line 57 and / or the inner conductor 52 of the core wire 54 of the coaxial line 51 is connected to the land 74 of the circuit board 71 on the tip side of the outer conductor 55. ing.
[0053]
The external conductor connected to the land 73 provided on the base end side of the circuit board 71 by connecting the simple wire 57 and / or the core wire 54 covered with the insulator to the land 74 provided on the front end side of the circuit board 71. 55 does not contact the inner conductor 52 and the conductor 58 connected on the same plane.
[0054]
As a result, the land can be arranged not only at the base end side end portion of the circuit board 71 but also at an arbitrary position such as the front end side while preventing the occurrence of image defects, and the degree of design freedom is increased. In addition, the circuit board can be further reduced in size.
[0055]
FIG. 10 is a cross-sectional view showing the circuit board 42 cut along a land portion according to the third embodiment of the present invention.
[0056]
In the present embodiment, as shown in FIG. 10, the inner conductor 52 and the outer conductor 55 of the coaxial line 51 are alternately arranged in any of the lands 65 and 66 arranged on the front surface and the back surface of the circuit board 42. Connecting.
[0057]
In the embodiment configured as described above, the contact between the external conductors 55 can be prevented by alternately arranging the internal conductor 52 covered with the insulator and the external conductor 55 where the conductor is exposed. . Thereby, it is possible to prevent the occurrence of image defects.
[0058]
FIG. 11 is a cross-sectional view showing an imaging apparatus according to the fourth embodiment of the present invention. FIG. 11 shows from the objective lens optical system to the solid-state imaging device. A circuit board to which the solid-state imaging device is attached and various wirings can be appropriately designed.
[0059]
The present embodiment will be described by applying it to the distal end portion 12 of the electronic endoscope apparatus of FIG. In this case, the configuration other than the prism 75 and the optical diaphragm 76 may be the same as in FIG.
[0060]
The optical image from the objective lens optical system 37 is bent by the prism 75 and guided to the light receiving unit 41 of the solid-state imaging device 40. For this reason, it is necessary to align the light receiving unit 41 and the prism 75 of the solid-state imaging device 40 with high accuracy, and it is difficult to assemble, and image defects such as blurring of one side of the image occur.
[0061]
In general, a light-shielding mask as an optical stop is interposed in the objective lens frame, but this light-shielding mask is not located immediately before the light-receiving unit 41, but a plurality of objective lenses ahead. Arrangement on the top may cause image defects such as flare.
[0062]
This embodiment is for solving these problems. That is, one surface of the prism 75 is in contact with the objective lens 38 on the most proximal end side of the objective lens optical system 37, and a bottom surface perpendicular to this surface faces the light receiving unit 41 of the solid-state imaging device 40, and An optical axis substantially parallel to the longitudinal axis is bent at a substantially right angle and guided to the light receiving unit 41.
[0063]
In the present embodiment, a light shielding optical diaphragm 76 is provided between the bottom surface of the prism 75 and the light receiving unit 41. The optical diaphragm 76 is a plate-shaped member that shields light, and has stepped portions 77 and 78 at both ends.
[0064]
The stepped portions 77 are formed above and below the front end side of the optical diaphragm 76, and the rear end surfaces thereof are formed in a predetermined positional relationship, for example, flush. The stepped portion 78 is formed above the rear end side of the optical diaphragm 76 so that the distance from the stepped portion 77 corresponds to the length of the bottom surface of the prism 75 in the front-rear direction.
[0065]
The bottom surface side of the prism 75 is fitted into the concave portion formed by the step portions 77 and 78 of the optical diaphragm 76 so that the bottom surface of the prism 75 contacts the plate-like portion of the optical diaphragm 76. Further, the front surface of the solid-state imaging device 40 is brought into contact with the stepped portion 77 provided below the optical diaphragm 76 so that the light receiving unit 41 is brought into contact with the optical diaphragm 76.
[0066]
In the embodiment configured as described above, a light-shielding optical diaphragm 76 is interposed between the prism 75 and the solid-state imaging device 40. The front surface of the solid-state imaging device 40 is brought into contact with a stepped portion 77 provided on the optical diaphragm 76, and the prism 75 is fitted into a recess formed by the stepped portions 77 and 78.
[0067]
As a result, the prism 75 and / or the solid-state imaging device 40 are aligned with each other via the prism 75. Therefore, the alignment operation between the prism 75 and the solid-state imaging device 40 becomes extremely easy and accurate, and the occurrence of image defects such as one-sided blur can be prevented. Further, by interposing the optical diaphragm 76 between the prism 75 that is the objective lens immediately before the light receiving unit 41 of the solid-state imaging device 40, it is possible to prevent the occurrence of image defects such as flare.
[0068]
As described above, in the present embodiment, it is possible to facilitate the assembly work and to perform accurate alignment, to prevent the occurrence of image defects such as one-sided blur, and to cause image defects such as flare. Can also be prevented.
[0069]
Further, the step portions 77 and 78 formed on the optical diaphragm 76 may be formed in a shape in which the bottom surface portion of the prism 75 is fitted. For example, if the shape of the bottom surface of the prism 75 is a quadrangle, a quadrangular step may be formed. Thereby, the alignment of the prism 75 and the light receiving unit 41 is performed.
[0070]
FIG. 12 is a cross-sectional view from the objective lens optical system to the solid-state imaging device according to the fifth embodiment of the present invention. In FIG. 12, the same components as those of FIG.
[0071]
In the present embodiment, only the prism 81 and the optical diaphragm 82 are different from the prism 75 and the optical diaphragm 76 of FIG.
[0072]
The prism 81 has a front surface in contact with the objective lens 38 and a bottom surface facing the light receiving unit 41 through the optical diaphragm 82. The optical diaphragm 82 has an outer shape that is substantially the same as the outer shape of the solid-state imaging device 40, and a step portion 83 is formed above the rear end.
[0073]
In the present embodiment, the optical aperture 82 is configured such that the front end face and the rear end face are flush with the front end face and the rear end face of the solid-state imaging device 40. The front end surface of the step portion 83 has a predetermined positional relationship with the solid-state imaging device 40, and the bottom surface of the prism 81 is placed on the optical aperture 82 in a state where the rear end portion of the prism 81 is in contact with the step portion 83. By attaching to the prism, the prism 81 and the solid-state imaging device 40 can be aligned.
[0074]
In the embodiment configured as described above, the optical diaphragm 82 and the solid-state imaging device 40 are aligned by aligning their outer shapes. The optical diaphragm 82 and the prism 81 are aligned by the step portion 83.
[0075]
Accordingly, the prism 81 and the solid-state imaging device 40 are aligned through the optical diaphragm 82, so that the alignment operation is accurate and easy, and image defects such as one-sided blur can be prevented.
[0076]
As described above, in the present embodiment, the same effect as that of the fourth embodiment can be obtained, and the step portion 83 serving as the alignment means may be provided only on either the front or rear side. Parts processing becomes easy.
[0077]
It is obvious that the outer shape of the optical aperture 82 may be made to coincide with the prism 81 and the stepped portion 83 may be formed on the solid-state imaging device 40 side.
[0078]
13 and 14 relate to a sixth embodiment of the present invention, FIG. 13 is a sectional view showing an imaging device according to the sixth embodiment, and FIG. 14 is a sectional view showing a bonded solid-state imaging device. FIG.
[0079]
This embodiment is applied to an apparatus having a solid-state imaging device having a light receiving portion on a surface perpendicular to the optical axis of the objective lens optical system.
[0080]
The imaging apparatus according to the present embodiment includes an objective lens optical system and an imaging unit disposed on the optical axis of the objective lens optical system. The objective lens optical system includes a plurality of objective lenses and an objective lens frame for fixing and arranging these objective lenses at predetermined positions.
[0081]
FIG. 13 shows a solid-state imaging unit 85 disposed on the optical axis of the objective lens optical system. A light receiving portion 87 of the solid-state imaging device 86 is provided perpendicular to the optical axis direction (up and down direction on the paper surface). A protective glass 91 is integrally bonded and fixed to the front surface of the light receiving portion 87 with a transparent resin 100.
[0082]
At both ends of the solid-state imaging device 86, connection portions having terminals serving as a plurality of signal input / output portions are provided in rows, and a plurality of protruding electrodes 88 for connecting leads are provided at these connection portions. Is provided.
[0083]
A plurality of leads 89 and 90 are connected to the protruding electrodes 88 provided at both ends of the solid-state imaging device 86, respectively. Bonding of the leads 89 and 90 to the solid-state imaging device 86 is performed by, for example, a TAB (TAPE AUTOMATED BONDING) method.
[0084]
After bonding the leads 89 and 90 of the TAB tape 93 to the solid-state image pickup device 86, the TAB tape 93 is cut at a predetermined position, whereby the state shown in FIG. 14 is obtained. The holding member 92 of the TAB tape 93 is formed of an insulating member, for example, a polyimide tape, and collectively holds the leads 90. A predetermined land and a wiring pattern are formed on the surface of the holding member 92 opposite to the surface on which the leads 90 are held. The holding member 92 is also formed with a through hole connected to the land.
[0085]
As shown in FIG. 13, the leads 89 and 90 are bent at a substantially right angle so as to follow the end of the solid-state imaging device 86. A circuit board 95 provided with a signal processing IC 96, which is an electronic component, is provided behind the solid-state imaging device 86.
[0086]
The circuit board 95 is formed of a hard material such as ceramic, and has a connection portion for making an electrical connection on a side surface. The leads 89 and 90 bent rearward are electrically connected to the connection portion on the side surface of the circuit board 95 and further extended rearward, and then bent in directions facing each other, with the holding member 92 interposed therebetween. Make them face each other.
[0087]
That is, in the present embodiment, the leads 89 and 90 are bent in the rear projection plane of the circuit board 95 so that the other lead 89 is laminated on the holding member 92 that holds the leads 90 in an integrated manner. It is arranged.
[0088]
As shown in FIG. 13, a plurality of signal lines 98 are connected to lands formed on the lead 89 and the holding member 92. The plurality of signal lines 98 are bundled as a signal cable 97 and connected to a video processor or the like (not shown).
[0089]
13 is attached so that the protective glass 91 is fitted and fixed in a solid imaging device frame (not shown). The entire electrical component is covered from the solid-state imaging device frame with a sealant, a shield frame, and an insulating cover. As described above, an image pickup apparatus is completed by combining such an image pickup unit and an objective lens optical system.
[0090]
In the embodiment configured as described above, the leads 89 and 90 are bent in the rear projection plane of the solid-state imaging device 86, and the circuit board 95 is disposed in a portion surrounded by the leads 89 and 90. . In addition, a portion where the lead 90, the holding member 92, and the lead 89 are stacked is also within the rear projection plane of the solid-state imaging device 86, and further, electrical connection with the signal line 98 is performed in this stacked portion.
[0091]
Accordingly, in the direction perpendicular to the optical axis of the objective lens optical system (not shown), the solid-state imaging unit 85 can be formed to have substantially the same outer shape or less as the rear projection surface of the solid-state imaging device 86. Thereby, the apparatus can be miniaturized.
[0092]
In addition, the length of the imaging device can be shortened by arranging and connecting the signal line 98 to the lead bent in the rear projection plane of the circuit board. In addition, since the holding member 92 that is an insulating member is disposed between the bent leads 89 and 90, a short circuit between the leads can be prevented, and the occurrence of an image defect can be prevented. .
[0093]
15 to 17 relate to a seventh embodiment of the present invention, FIG. 15 is a sectional view showing an imaging device according to the seventh embodiment, and FIG. 16 is a sectional view showing a bonded solid-state imaging device. FIG. 17 is a cross-sectional view showing a state after signal lines are connected. 15 to FIG. 17, the same components as those in FIG. 13 and FIG.
[0094]
The solid-state imaging unit 101 shown in FIG. 15 is formed by bending the leads 89 and 90 of FIG. 16 in the rear projection plane of the solid-state imaging device 86. In the present embodiment, as shown in FIG. 16, holding members 94 and 99 for collectively holding the leads 89 and 90 are provided. The holding members 94 and 99 are insulating members as in the sixth embodiment.
[0095]
As shown in FIG. 15, the leads 89 and 90 extending rearward from the circuit board 95 are bent and arranged in the rear projection plane of the circuit board 95. Then, the holding members 94 and 99 are removed as indicated by broken lines in FIG. As shown in FIG. 17, a plurality of signal lines 98 are connected to the leads 89 and 90 exposed from the removed portion.
[0096]
Also in the embodiment configured as described above, the leads 89 and 90 are bent in the rear projection plane of the solid-state imaging device 86. In the present embodiment, the leads 89 and 90 are collectively held by holding members 94 and 99, respectively. Therefore, the leads 89 and 90 are not separated, and the circuit board 95 can be easily bent and arranged in the rear projection plane, and the assembling work of the imaging apparatus is simplified.
[0097]
In addition, the holding members 94 and 99 can be removed by disposing the leads 89 and 90 behind the circuit board 95 without contacting them, and the length of the optical axis direction can be shortened to reduce the size of the apparatus. be able to.
[0098]
As described above, the present embodiment has the advantages that the same effects as those of the sixth embodiment can be obtained and the apparatus can be further miniaturized.
[0099]
The lead may be a solid-state imaging device arranged only on one side of the light receiving unit 87.
[0100]
18 to 20 relate to an eighth embodiment of the present invention, FIG. 18 is an explanatory view showing an imaging apparatus according to the eighth embodiment, and FIG. 19 is a side view showing the imaging apparatus. 20 is a cross-sectional view taken along line AA in FIG.
[0101]
In this embodiment, the apparatus is miniaturized by utilizing the space behind the prism.
[0102]
18, the configuration of the objective lens optical system 104 is the same as that of the objective lens optical system 37 in FIG. 1, and a plurality of objective lenses are provided in the objective lens frame 105. At the rear end of the objective lens 106 on the most proximal end side, a prism 107 that guides an optical image to the solid-state imaging device 108 that is arranged substantially horizontally by bending the optical axis of the objective lens optical system 104 downward at a substantially right angle is attached. ing.
[0103]
In the present embodiment, a flexible circuit board 109 on which wiring for extracting an electrical signal from the solid-state imaging device 108 and an electrical circuit component for processing the electrical signal is mounted is employed. The flexible circuit board 109 extends to the side of the solid-state imaging device 108.
[0104]
After the signal line 110 and the electronic component 111 are connected and arranged, the flexible circuit board 109 is bent along the prism 107 so that the signal line 110 and the electronic component 111 are arranged behind the prism 107. ing.
[0105]
FIG. 19 shows this state. As shown in FIG. 19, by bending the flexible circuit board 109 in a direction perpendicular to the major axis direction of the objective lens optical system 104, the electronic component 111 and the signal line 110 are free above the solid-state imaging device 108 and the prism 107. Arranged in space.
[0106]
Thereby, the space on the base end side of the prism 107 can be effectively used, and the imaging apparatus can be reduced in size and shortened.
[0107]
FIG. 20 shows a cross section taken along line AA in FIG. As shown in FIG. 20, the prism 107 is covered with a flexible circuit board 109. The low reflection portion 112 is formed by the vicinity of the prism 107 of the flexible circuit board 109. Thereby, the light reflection at the side surface of the prism 107 is reduced, and the occurrence of flare is prevented.
[0108]
Thus, in the present embodiment, the electronic components and the signal lines can be arranged in the empty space near the prism, so that the apparatus can be further downsized. In addition, the flexible circuit board can reduce the light reflection of the prism and prevent the occurrence of flare.
[0109]
In FIG. 18, the flexible circuit board 109 is extended only to one side of the solid-state imaging device 108, but may be extended to both sides of the solid-state imaging device 108. FIG. 21 is an explanatory view showing this example.
[0110]
As shown in FIG. 21, flexible circuit boards 113 are formed on both sides of the solid-state imaging device 108. On the flexible circuit board 113, the electronic component 111 is mounted and the signal line 110 is connected. Even in this case, it is obvious that the electronic component 111 and the signal line 110 can be arranged in the empty space of the prism by bending the flexible circuit board 113 so as to cover the solid-state imaging device 108 and the prism (not shown).
[0111]
By the way, various arrangement methods of the solid-state imaging device and the circuit board are conceivable. For example, as shown in FIG. 22, an example in which circuit boards 122 are provided on both sides of the solid-state imaging device 121 can be considered.
[0112]
23 and 24 are explanatory diagrams for explaining an assembly method using a TAB tape in the image pickup apparatus in the example of FIG.
[0113]
A light receiving unit 123 is provided on the upper surface of the solid-state imaging device 121. A plurality of protruding electrodes (not shown) are formed in rows on both sides of the light receiving portion 123. An inner lead 124 protruding from the TAB tape is connected to the protruding electrode.
[0114]
In this state, the inner lead 124 is cut to separate the solid-state imaging device 121 from the TAB tape, and the circuit board 122 is connected and fixed to the inner lead 124 with solder or the like. Next, as shown in FIG. 24, the circuit board 122 is gripped and bent so that both are parallel to the base end side of the solid-state imaging device 121.
[0115]
This working method is easier than soldering the circuit board 122 to the bent inner lead 124, and the assembling work can be simplified.
[0116]
Next, the imaging device is assembled by connecting a signal cable or the like on the circuit board 122.
[0117]
Instead of making the circuit boards 122 parallel to each other, the circuit boards 122 may be bent into a V shape as shown in FIG. In this case, the length of the apparatus can be shortened compared to the example of FIG.
[0118]
FIG. 26 to FIG. 28 are examples in which a circuit board is arranged on the back side of the solid-state imaging device. 26 is a side view showing the imaging device, FIG. 27 is a cross-sectional view of the circuit board portion of FIG. 26 as viewed from above, and FIG. 28 is a side view of the circuit board portion of FIG.
[0119]
A light receiving portion 132 is formed on the front surface of the solid-state imaging device 131, and protruding electrodes 133 are formed in rows on both sides of the light receiving portion 132. An inner lead 134 protruding from the TAB tape is connected to the protruding electrode 133. Between the inner lead 134 and the solid-state imaging device 131, a polyimide tape 136 that is a constituent member of a TAB tape is disposed. The polyimide tape 136 is an insulating member, and insulation between the inner lead 134 and the solid-state imaging device 131 is maintained. A circuit board 135 is disposed on the base end side of the solid-state imaging device 131.
[0120]
The circuit board 135 has a first connection terminal 137 formed on the side surface in the vertical direction, an inclined surface 145 formed on the side surface in the left-right direction, and the second connection terminal 140 provided on the inclined surface 145.
[0121]
The inner lead 134 from the solid-state imaging device 131 is connected to the first connection terminal 137 on the side surface of the circuit board 135. On the other hand, the inner conductor 139 of the coaxial line among the signal lines of the signal cable 138 is connected to the second connection terminal 140 provided on the inclined surface 145 of the circuit board 135.
[0122]
A through hole 141 connected to the GND of the solid-state imaging device 131 is formed in the circuit board 135 substantially at the center, and the coaxial outer conductor 142 of the signal lines is connected to the through hole 141. The through hole 141 is also connected to the GND of the electronic component when an electronic component such as an IC chip is mounted on the circuit board 135.
[0123]
In this way, the signal lines are connected at the inclined surface 145 provided on the circuit board 135, and the external conductors are connected using the through hole 141 provided substantially at the center, thereby reducing the size of the signal line connection portion. can do.
[0124]
It is obvious that the second connection terminal 140 may be provided on the side surface of the plate circuit board instead of the inclined surface 145.
[0125]
By the way, it is necessary to perform a focus adjustment operation according to the positions of the objective lens optical system and the solid-state imaging device that constitute the imaging device. When the example of FIG. 29 is adopted, this focus adjustment work can be omitted.
[0126]
In FIG. 29, a plurality of objective lenses 154 constituting an objective lens optical system are provided on the distal end side of the objective lens frame 151. The light receiving unit 153 of the solid-state imaging device 152 is arranged at the image forming position of the objective lens 154 on the base end side. In the example of FIG. 29, the solid-state imaging device 152 is disposed so as to fit inside the objective lens frame 151.
[0127]
That is, in the example of FIG. 29, the positional relationship between the solid-state imaging device 152 and the objective lens optical system is determined by one objective lens frame 151. Therefore, it is possible to omit focus adjustment work when assembling the imaging apparatus, reduce the number of assembling steps, and configure the apparatus at low cost.
[0128]
By the way, various examples of the arrangement method of the solid-state imaging device and the signal cable in the electronic endoscope can be considered. 30 to 32 show an example of this arrangement method, FIG. 30 is a side view showing a solid-state imaging device to which a signal cable is connected, and FIG. 31 is a cross-sectional view showing a cross section of the electronic endoscope. 32 is an explanatory diagram showing an internal configuration of the electronic endoscope.
[0129]
30, the configuration of the objective lens optical system 37 is the same as that in FIG. A prism 39 that also serves as a filter for removing a specific wavelength, such as an infrared cut filter, is attached to the objective lens 38 on the base end side. The bottom surface of the prism 39 is fixed to the light receiving unit of the solid-state imaging device 40.
[0130]
The solid-state imaging device 40 is connected to the circuit board 161 by an external lead 162. The external lead 162 has a length that allows a space for wiring the signal line 165 between the solid-state imaging device 40 and the circuit board 161.
[0131]
The outer end 166 of the signal cable 163 in which the signal line 165 is twisted and bundled is disposed around the prism 39, that is, on the back surface of the circuit board 161 in FIG. That is, since the outer skin end portion 166 is disposed not on the rear end side of the circuit board 161 but on the periphery of the prism 39 on the front end side, the length of the apparatus can be shortened.
[0132]
Further, as shown in FIG. 32, a bending operation wire 167 for bending the bending portion is connected to a connection site 168 attached to the tubular member. In the example of FIG. 32, the connection portion 168 is disposed on the proximal end side of the prism 39.
[0133]
As described above, the space behind the prism 39 is effectively used to reduce the diameter of the tip. Further, the outer end 166 of the signal cable 163 is arranged around the prism 39 to shorten the length of the imaging device. Furthermore, by arranging the signal line 165 in the space between the solid-state imaging device 40 and the circuit board 161, the bend R of the signal line 165 folded back at the tip of the circuit board 161 can be increased, and the signal line 165 is disconnected. Can be prevented.
[0134]
Obviously, the location where the signal cable 163 is arranged may be the position indicated by the broken line in FIG.
[0135]
By the way, it is possible to reduce the size of the apparatus by deforming the outer shape of the imaging apparatus provided at the distal end portion of the endoscope. FIG. 33 is an explanatory diagram showing this example.
[0136]
As shown in FIG. 33, the outer shape of the imaging device 172 is formed asymmetrically along the inner periphery 171 of the distal end portion of the endoscope. For example, the distal end portion can be reduced in diameter by forming the shield frame in a different shape so that one part of the left and right of the outer shape of the imaging device 172 is inclined to the other.
[0137]
By the way, it is possible to reduce the diameter of the imaging device by considering the coupling position between the objective lens frame and the solid-state imaging device frame. FIG. 34 is a sectional view showing this example.
[0138]
In FIG. 34, the objective lens optical system 183 includes a plurality of objective lenses. Among the plurality of objective lenses, the plurality of objective lenses arranged on the tip side with the objective lens 184 having the smallest outer diameter as a boundary is held in the objective lens frame 181. The light receiving unit 186 of the solid-state imaging device 187 is attached to the objective lens 185 on the most proximal side. A plurality of objective lenses disposed closer to the base end side than the objective lens 184 to the solid-state imaging device 187 are fixed in the solid-state imaging device frame 182. A solid-state imaging device frame 182 is fitted in the objective lens frame 181, and focus adjustment is performed by adjusting both of them to move back and forth.
[0139]
As described above, focus adjustment is performed by inserting and inserting the objective lens frame 181 and the solid-state imaging device frame 182 between the frames in which the objective lens optical system is held at the portion where the smallest objective lens 184 is disposed. Thus, the imaging device can be reduced in size. Even if multiple objective lens frames that hold the objective lens optical system are required, the image pickup device can be similarly miniaturized by adjusting the focus at the objective lens frame portion that holds the objective lens with the smallest outer diameter. can do.
[0140]
FIG. 35 is a side view showing a lead and cable connection example in the imaging apparatus.
[0141]
A circuit board 192 is disposed substantially parallel to the solid-state imaging device 191. On the side surface of the circuit board 192, a lead connection land 194 that is a connection portion with the external lead 193 from the solid-state imaging device 191 and a cable connection land 197 that is a connection portion with the signal cable 195 are formed. After the external lead 193 of the solid-state imaging device 191 is connected and fixed to the lead connection land 194, the signal line 198 of the signal cable 195 is connected to the cable connection land 197 and the external lead 199 extending from the circuit board 192 to the proximal end side. Is done.
[0142]
Thus, by directly connecting the signal line 198 to the external lead 199, the number of cable connection lands 197 provided on the circuit board 192 can be reduced, and the circuit board can be reduced in cost and size. An inexpensive and downsized imaging apparatus can be provided. Further, by arranging the solid-state imaging device 191 and the circuit board 192 substantially in parallel, the imaging device can be shortened.
[0143]
36 to 38 are rear views for explaining a lead arrangement method of the solid-state imaging device.
[0144]
An external lead 202 is provided on the back surface of the solid-state imaging device 201. As shown in FIG. 36, three external leads 202 are provided on the upper back side of the solid-state imaging device 201 and four are provided on the lower side.
[0145]
In the example of FIG. 37, the external leads 203 and 204 provided on the back surface of the solid-state imaging device 201 have different sizes. That is, the size of the external lead 203 on the upper back side of the solid-state imaging device 201 is X, and the size of the external lead 204 on the lower back side is Y (X> Y).
[0146]
In the example of FIG. 38, the external leads 205 and 206 provided on the back surface of the solid-state imaging device 201 have different pitches. That is, the pitch of the external leads 205 on the upper back side of the solid-state imaging device 201 is P1, and the pitch of the external leads 206 on the lower back side is P2 (P1> P2).
[0147]
In this way, by making the number, size, or pitch of the external leads asymmetric in the vertical direction, the positional relationship of the solid-state imaging device, for example, the vertical relationship, is not mistaken when assembling the imaging device and inspecting the solid-state imaging device. Since it can be assembled and inspected, damage to the solid-state imaging device can be prevented.
[0148]
Further, the thickness of the external lead may be provided asymmetrically. FIG. 39 is a side view showing an example of this case.
[0149]
When the thickness of the external leads of the solid-state imaging device is provided asymmetrically, as shown in FIG. 39, a thick external lead 213 is provided on the base end side to connect to the circuit board 212. When the bending operation of the bending portion of the electronic endoscope is performed, the signal cable is also pushed and pulled. As a result, stress is applied to the circuit board 212 to which the signal line 214 is connected, and consequently stress is applied to the external leads of the solid-state imaging device 211. However, increasing the thickness of the external lead 213 on the proximal end side makes it more resistant to stress and prevents damage to the solid-state imaging device. In this case, instead of making the external lead thick, an external lead that is firmly connected by the solid-state imaging device may be arranged on the base end side. When the signal line is directly connected to the external lead, the external lead may be thicker than other external leads and firmly fixed.
[0150]
FIG. 40 is a side view showing an example in which the extension direction of the lead is taken into account for miniaturization.
[0151]
As shown in FIG. 40, the external lead 223 of the solid-state imaging device 222 is extended to the proximal end side of the prism 221 and the signal line 224 of the signal cable 225 is connected at the extended portion. As a result, the space on the base end side of the prism 221 can be effectively utilized, so that the imaging apparatus can be downsized and shortened.
[0152]
FIG. 41 is a cross-sectional view showing an example in which signal line disconnection is prevented.
[0153]
In FIG. 41, in the imaging apparatus, the electrical component is covered with an insulating sealant 231 and is further covered with a heat shrinkable tube 232 which is an insulating member for insulation. The heat-shrinkable tube 232 is covered from the solid-state imaging device frame 233 to the protective tube 234 having substantially the same outer shape as the solid-state imaging device frame 233. The proximal end side of the protective tube 234 extends to the proximal end side at least from the curved portion proximal end portion.
[0154]
By providing the signal tube 235 with the protective tube 234 having substantially the same outer shape as the solid-state imaging device frame 233, the heat shrinkable tube 232 is contracted and cured in a state where both ends of the heat-shrinkable tube 232 are in close contact with the solid-state imaging device frame 233 and the protective tube 234. Can do. For this reason, the disconnection of the protection tube 234 and the signal cable 235 in the protection tube 234 can be reliably prevented.
[0155]
Instead of the protective tube 234, a member having substantially the same outer shape as the solid-state imaging device frame 233 may be provided. Moreover, the sealing agent 231 can be reliably filled in the heat shrinkable tube 232 by reliably shrinking the both ends of the heat shrinkable tube 232. Therefore, the sealant 231 is prevented from being closed at the end of the heat shrinkable tube 232 and the movement of the signal cable 235 is suppressed, so that the signal line can be prevented from being disconnected.
[0156]
[Appendix]
(1) an objective optical system;
A solid-state imaging device that converts an optical image formed by the objective optical system into an electrical signal;
A circuit board provided with wiring for transmitting electrical signals from the solid-state imaging device and electrical circuit components for processing the electrical signals;
It is constituted by a coaxial line composed of an inner conductor and an outer conductor, and a signal cable connected to the circuit board,
An image pickup apparatus, wherein an inner conductor and an outer conductor of at least one coaxial line of the signal cable are arranged and connected to different surfaces of a circuit board.
[0157]
(2) One or more of the inner conductor and the outer conductor of the at least one coaxial line are arranged and connected to the surface of the circuit board, and the other is arranged and connected to the back surface of the circuit board. The imaging apparatus according to 1.
[0158]
(3) The solid-state imaging device has a light receiving unit arranged substantially parallel to the optical axis of the objective optical system,
One of the additional items 1 and 2, further comprising an optical element that bends the optical axis of the objective optical system substantially at a right angle in order to image the optical axis of the objective optical system on the light receiving unit. The imaging device described in 1.
[0159]
(4) an objective optical system;
A solid-state imaging device disposed at the imaging position of the objective optical system;
An optical diaphragm disposed in front of the solid-state imaging device;
A circuit board provided with wiring for transmitting electrical signals from the solid-state imaging device and electrical circuit components for processing the electrical signals;
In the imaging device comprising the solid-state imaging device and a signal line connected to the circuit board,
An image pickup apparatus, wherein the optical aperture is provided with an alignment means for an objective optical system and / or a solid-state image pickup apparatus.
[0160]
(5) The objective optical system is provided with an optical element that guides an optical image so as to form an image on a solid-state imaging device in which the optical axis is bent at a substantially right angle and parallel to the longitudinal axis of the insertion portion. Item 5. The imaging apparatus according to Item 4, wherein:
[0161]
(6) The imaging device according to any one of the additional items 4 and 5, wherein both the objective optical system and the solid-state imaging device are aligned by the step provided in the optical diaphragm.
[0162]
(7) The imaging device according to any one of appendices 5 and 6, wherein an outer shape of the optical aperture is substantially the same as the outer shape of the optical element and / or the solid-state imaging device.
[0163]
(Background to Supplementary Items 4-7)
(Conventional technology)
Conventionally, as shown in Japanese Patent Laid-Open No. 5-130972, a technique has been shown in which a light-shielding mask is interposed in an objective lens frame.
[0164]
(Issue to solve)
Conventionally, a light-shielding mask, which is an optical diaphragm, is arranged so as to be sandwiched between objective lenses or a distance tube that keeps the distance between objective lenses at a predetermined distance within the objective lens frame. Then, in order to guide an optical image to a solid-state imaging device disposed substantially parallel to the optical axis of the objective optical system, a prism that is an optical element is disposed on the base end side lens of the objective optical system. At this time, it was very difficult to align the objective optical system with the prism. Also, the alignment operation between the light receiving unit of the solid-state imaging device and the prism is very difficult, it is difficult to assemble correctly, and an image defect such as blurring of one side of the image occurs.
[0165]
In addition, since the optical diaphragm for light shielding has a plurality of objective lenses arranged between the solid-state imaging device, the imaging device is likely to cause image defects such as flare.
[0166]
(the purpose)
An object of the present invention is to provide an image pickup apparatus that has good assemblability and prevents image defects such as one-sided blur and flare by providing an alignment means for an objective optical system and a solid-state image pickup device in an optical stop for light shielding.
[0167]
(Means and actions for solving the problems)
In order to bend the optical axis of the objective optical system at a substantially right angle and guide the optical image to the light-receiving unit of the solid-state imaging device arranged substantially parallel to the optical axis of the objective optical system, the proximal-side objective lens of the objective optical system A light-blocking optical diaphragm is interposed between the prism, which is an optical element disposed in the lens, and the solid-state imaging device, and a step serving as a means for aligning the prism and / or the solid-state imaging device is provided in the optical diaphragm. Then, the prism and / or the solid-state imaging device are brought into contact with the step portion of the optical diaphragm to align both. This facilitates assembly and prevents image defects such as single blurring. In addition, the occurrence of image defects such as flare can be prevented by interposing an optical diaphragm between the prism that is the objective lens immediately before the light receiving unit of the solid-state imaging device.
[0168]
(8) a solid-state image sensor chip;
Multiple external I / O leads,
A protruding electrode that connects the solid-state imaging device chip and the external input / output lead;
A circuit board provided behind the solid-state image sensor chip and provided substantially parallel to the solid-state image sensor chip on which electronic components are mounted;
In an imaging apparatus having the external input / output lead and / or a signal line connected to a circuit board
An image pickup apparatus comprising: an insulating holding means for collectively integrating and holding a plurality of external input / output leads on a surface different from the protruding electrodes connected to the external input / output leads;
[0169]
(9) The imaging apparatus according to appendix 8, wherein a plurality of external input / output leads are connected to a signal line at a bent portion in a rear projection plane of the circuit board.
[0170]
(10) The imaging device according to any one of appendixes 8 and 9, wherein the holding means is a polyimide tape.
[0171]
(Background to Supplementary Items 8-10)
(Conventional technology)
Conventionally, as shown in Japanese Patent Laid-Open No. 5-115435, there is shown a technique in which signal lines are connected to a base end portion of a substrate disposed so as to extend substantially parallel to the optical axis behind a solid-state imaging device by soldering or the like. It was.
[0172]
(Issue to solve)
Conventionally, since the signal line is connected to the base end portion of the substrate extending rearward of the solid-state imaging device by solder or the like, the imaging device is long and large. Further, when the circuit board is arranged in a laminated structure behind the solid-state imaging device, it is necessary to secure a space and a land for connecting the signal lines, so that the circuit board becomes large and the imaging device is enlarged.
[0173]
(the purpose)
It is an object of the present invention to provide an image pickup apparatus that is miniaturized by connecting a signal line to an external input / output lead that is bent in a rear projection plane of a circuit board.
[0174]
(Means and actions for solving the problems)
The external input / output leads collectively held by the holding means are connected to the side surface of the circuit board placed behind the solid-state image sensor, and the signal line is connected to the part bent in the rear projection plane of the circuit board Thus, the size of the image pickup apparatus can be formed to be substantially the same as or smaller than the projection surface of the solid-state image pickup device, so that the size can be reduced. In addition, the length of the imaging device can be shortened by arranging and connecting the signal lines to the external input / output leads bent in the rear projection plane of the circuit board.
[0175]
【The invention's effect】
  As described above, according to the present invention,PictureWhile preventing the occurrence of image defects,EquipmentThere is an effect that it is possible to achieve miniaturization and shortening.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a distal end portion of an electronic endoscope provided with an imaging apparatus according to a first embodiment.
2 is a schematic diagram of an electronic endoscope system in which the imaging apparatus of FIG. 1 is incorporated.
FIG. 3 is a perspective view showing a signal line in FIG. 1;
4 is a perspective view showing a signal line in FIG. 1. FIG.
FIG. 5 is a cross-sectional view showing the signal cable in FIG. 1;
6 is a cross-sectional view taken along line XX of FIG.
7 is a top view as seen from the direction A in FIG. 6;
FIG. 8 is a side view showing a circuit board 71 employed in the second embodiment.
9 is a rear view of FIG. 8. FIG.
FIG. 10 is a cross-sectional view showing a third embodiment of the present invention.
FIG. 11 is a cross-sectional view showing an imaging apparatus according to a fourth embodiment of the present invention.
FIG. 12 is a cross-sectional view showing a fifth embodiment of the present invention.
FIG. 13 is a cross-sectional view illustrating an imaging apparatus according to a sixth embodiment.
FIG. 14 is a cross-sectional view showing a bonded solid-state imaging device.
FIG. 15 is a cross-sectional view showing an imaging apparatus according to a seventh embodiment.
FIG. 16 is a cross-sectional view showing a bonded solid-state imaging device.
FIG. 17 is a cross-sectional view showing a state after signal lines are connected.
FIG. 18 is an explanatory diagram illustrating an imaging apparatus according to an eighth embodiment.
FIG. 19 is a side view illustrating an imaging device.
20 is a cross-sectional view taken along line AA in FIG.
FIG. 21 is an explanatory diagram showing a modification of the third embodiment.
FIG. 22 is an explanatory diagram for explaining a method of arranging the solid-state imaging device and the circuit board.
23 is an explanatory diagram for explaining an assembling method using a TAB tape in the image pickup apparatus in the example of FIG. 22;
24 is an explanatory diagram for explaining an assembling method using a TAB tape in the image pickup apparatus in the example of FIG. 22;
25 is an explanatory diagram showing another example of FIG. 24. FIG.
FIG. 26 is a side view illustrating an imaging device.
27 is a cross-sectional view of the circuit board portion of FIG. 26 as viewed from above.
28 is a side view of the circuit board portion of FIG. 26 viewed from the rear.
FIG. 29 is a sectional view showing an example in which the focus adjustment work is omitted.
FIG. 30 is a side view showing a solid-state imaging device to which a signal cable is connected.
FIG. 31 is a cross-sectional view showing a cross section of an electronic endoscope.
FIG. 32 is an explanatory diagram showing an internal configuration of the electronic endoscope.
FIG. 33 is an explanatory diagram showing an example of downsizing the apparatus.
FIG. 34 is a cross-sectional view showing an example in which the imaging apparatus can be reduced in diameter.
FIG. 35 is a side view showing an example of connecting leads and cables in the imaging apparatus.
36 is a rear view for explaining a lead arrangement method of the solid-state imaging device; FIG.
FIG. 37 is a rear view for explaining a lead arrangement method of the solid-state imaging device;
FIG. 38 is a rear view for explaining a lead arrangement method of the solid-state imaging device;
FIG. 39 is a rear view for explaining a lead arrangement method of the solid-state imaging device;
FIG. 40 is a side view showing an example in which the extension direction of a lead is taken into account for miniaturization.
FIG. 41 is a cross-sectional view showing an example in which disconnection of a signal line is prevented.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 12 ... Tip part, 27 ... Signal cable, 36 ... Objective lens frame, 37 ... Objective lens optical system, 39 ... Prism, 40 ... Solid-state imaging device, 42 ... Circuit board, 43 ... Signal line.

Claims (2)

An objective optical system;
A solid-state imaging device that converts an optical image formed by the objective optical system into an electrical signal;
A circuit board provided with wiring for transmitting electrical signals from the solid-state imaging device and electrical circuit components for processing the electrical signals;
A coaxial cable having an inner conductor and an insulating layer that covers the inner conductor, and an outer conductor that covers the outer surface of the core wire through the insulating layer, and is connected to the circuit board When,
With
In the coaxial cable, the core wire and the outer conductor extend from the outside of one end face of the circuit board across the one end face of the circuit board, and the inner conductor in the core wire is connected to the circuit board. Connected to a first connection portion disposed on one surface, while the outer conductor is connected to a second connection portion disposed on the back surface side of the first connection portion on the other surface of the circuit board. An imaging device that is characterized. The solid-state imaging device has a light receiving unit disposed substantially parallel to the optical axis of the objective optical system,
The imaging apparatus according to claim 1, further comprising an optical element that bends the optical axis of the objective optical system at a substantially right angle in order to form an image of the optical axis of the objective optical system on the light receiving unit.

Images