JPH1028672A - Image pick-up device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pick-up device having a small diameter and manufactured at a low cost. SOLUTION: An image pick-up device is composed of an image pick-up part 15 incorporated in the front end component part 6 and including an object lens system 16, a solid image pick-up element 17 located at the image forming position of the lens system 16, a flexible board 30 arranged on the rear side of the pick-up element 17 and mounted thereon with electronic parts constituting a signal processing circuit 18, and a connector connected thereto with the flexible board 30 and board side terminals 48 for connecting a cable 21 and cable side terminals 49. The board side terminals 48 arranged in a rectangular pattern are positionally aligned with a land part 46 of the flexible board 30 so as to simply connect the board side terminals 48 with the land part 46. Thus, the front end component part 6 can have a small diameter, and the cable 21 and the cable side terminal 49 can be easily connected through short wirings 37.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging apparatus used for an electronic endoscope or the like and suitable for miniaturization.

[0002]

2. Description of the Related Art In recent years, image pickup apparatuses (or image pickup units) have been
R, widely used for endoscopes and the like. A conventional imaging unit (or imaging device) 110 is as shown in FIG. Each electric wire 112 of the cable 111 is wired by direct soldering to each land portion provided on the outer surface of two opposing substrate surfaces on the flexible substrate 113 bent in a U-shape or a U-shape. . The flexible substrate 113 has an electronic component 114 mounted thereon, and the solid-state image sensor 11
5 is also connected. An imaging unit having a structure similar to this structure is disclosed in, for example, Japanese Patent Application Laid-Open No. 4-218136.

[0003] With the demand for higher image quality, the number of wirings has increased (the number of electric wires has increased), and a wiring space for the imaging section has been required more than before. On the other hand, with the reduction in the diameter of the distal end portion of the endoscope, miniaturization of the imaging section has been promoted.

For this reason, the flexible substrate 113 or T
In order to secure the wiring space and minimize the overall length of the imaging unit 110 using the AB tape, the land portion, that is, the wiring portion 116 of the electric wire is provided on the outer surface of the imaging unit 110 or on the outer peripheral direction. Furthermore, in order to wire each electric wire 112 to the outer surface of the imaging unit 110, a space L2 for extending each electric wire is required in the direction of the insertion unit (left and right in FIG. 11).

[0005]

Each electric wire is directly wired to each land on the board by soldering or the like. However, with the recent improvement in image quality of images, the number of electric wires has increased, and the area of land portions on a substrate has become insufficient.

Since each electric wire is not rigid, when the electric wire is connected to the land portion by soldering or the like, it tends to be shifted from the position of the land portion to which the electric wire is originally connected.

Therefore, in general, the area of each land portion is
It is set to be somewhat larger than the connection area with the electric wire. For this reason, when the electric wires are connected, even if they move slightly, the electric wires do not protrude from the lands. That is, since the position of each electric wire is not fixed, an area of the land portion larger than the contact area is required, and the area of the land portion with respect to the substrate is increased.

As a method of avoiding this, a method of shifting the positions of the lands and effectively arranging them on the substrate can be considered. However, according to this method, the lengths of the electric wires connected to the lands cannot be made uniform. That is, the length of each electric wire bundled in the same cable must be changed. Therefore, such a method is difficult to process and increases the manufacturing cost.

In order to reduce the area of the land with respect to the substrate, even if the area of each land is minimized, it is necessary to position each of the electric wires. Will be expensive.

In the case of the wiring structure as shown in FIG. 11, in order to reduce the hard length L2, it is only necessary to remove the insulating coating tubes that cover the outer periphery of each electric wire. However, it is conceivable that the electric wires may conduct with each other, which is not an appropriate method.

As a method for avoiding this, an insulating member for preventing other parts from coming into contact with the part from which each coated tube has been removed may be incorporated. However, since the member is considered to be larger than the coated tube, L2 is reduced. It cannot be made smaller.

The problems of the prior art described so far are summarized as follows. 1. Since each electric wire is not a rigid body, the area of the land portion is set to be large, and the board becomes large accordingly. 2. If the positions of the lands are shifted to reduce the size of the substrate, the lengths of the wires corresponding to the lands are different from each other, which is disadvantageous in processing and increases the manufacturing cost.

[0013] 3. If the land portion has a minimum necessary size with respect to the wire diameter, the electric wire is likely to be shifted from the land portion.
For this reason, time must be taken for positioning. Therefore, the manufacturing cost increases.

4. The apparatus can be made smaller by removing each coating tube of each electric wire, but each electric wire is conducted. If an insulating member is incorporated to avoid 5 and 4, the device becomes large.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide an imaging apparatus which can be reduced in diameter and which can be manufactured easily and at low cost.

[0016]

According to the present invention, there is provided an objective optical system, a solid-state imaging device disposed at an image forming position thereof, a substrate on which electronic components are mounted and connected to the solid-state imaging device, and a solid-state imaging device. And a cable for transmitting a signal from the solid-state imaging device, and the cable is not directly wired to the substrate, but has a terminal connected to a land of the substrate at one end and a cable at the other end. Has a structure in which a cable is wired via a connecting member having a terminal to be connected.

Accordingly, the wiring space of the wiring portion on the cable side of the substrate can be reduced, and the diameter of the end portion of the endoscope can be reduced.

For the hard lengths L1 (FIG. 1) and L2 (FIG. 11) behind the substrate, L1 ≒ L2. The reason is that in the case of the conventional example,
Since each wire is routed outside the imaging unit, each wire must be expanded, and a hard length is required. There is not much difference from the case of the present invention where wiring is performed via a connector.

[0019]

Embodiments of the present invention will be specifically described below with reference to the drawings. (First Embodiment) FIGS. 1 to 4 relate to a first embodiment of the present invention, FIG. 1 shows an image pickup apparatus according to the first embodiment, and FIG. 2 shows the first embodiment. Is shown in FIG. 3, FIG. 3 shows an electrical connection state of an external metal of the video scope, and FIG. 4 shows a part of an imaging device in a modified example.

As shown in FIG. 2, a video scope 1 has an elongated (long) insertion section 2 having flexibility and
, A flexible universal cord 4 extending from the operating section 3, and a scope connector 5 provided at an end of the universal cord 4. ing.

The insertion portion 2 includes a hard distal end portion 6 and a bendable bending portion 7 provided at the rear end of the distal end portion 6.
And a flexible tube portion 8 having flexibility extending from the rear end of the curved portion 7 to the front end of the operation portion 3. The operation unit 3 is provided with an angle knob 9. By operating the angle knob 9, the bending unit 7 can be bent.

A light guide for transmitting illumination light is inserted into the insertion section 2, and the rear end of the light guide is
, And is fixed to the light guide incident end 11 of the scope connector 5.

By connecting the light guide entrance end 11 to a light source device (FIG. 3 shows a part of the housing 12 of the light source device), the illumination light supplied from the lamp inside the light source device is transmitted and inserted. The signal is transmitted to the end face on the distal end side of the unit 2. An illumination window to which an illumination lens system 13 is attached is provided in front of the end face, and illumination light is emitted from the illumination window.

A subject, such as a diseased part, illuminated by the emitted illumination light is attached to an observation window adjacent to the illumination window (the imaging unit 15 of the first embodiment).
An optical image is formed at the image forming position by the objective lens system 16 constituting the above. The solid-state imaging device 17 (FIG. 1)
(See (A)) and performs photoelectric conversion.

This solid-state imaging device 17 is a signal processing circuit 1
8. Connected to the distal end of the signal cable 21 via the connector 19, this signal cable 21 is inserted through the insertion section 2, the operation section 3, and the universal cord section 4 like the light guide, and the electrical contacts of the scope connector section 5 Connected to the unit 22.

As shown in FIG. 3, the electric contact section 22 is further connected to a video processor (not shown) via an external cable 23, and converts the signal photoelectrically converted by the solid-state image pickup device 17 into a standard video signal. Output to a monitor not shown.

That is, as shown in FIG. 2, the scope connector portion 5 has a light guide incident end portion 11, an electric contact portion 22, and the like provided on a connector main body 24 thereof. In addition, a treatment instrument insertion port 200 is provided near the front end of the operation unit 3,
The channel 25 (FIG. 3) is inserted inside the treatment instrument insertion port 200.
See).

An image pickup unit 15 shown in FIG. Hereinafter, a specific configuration of the imaging unit 15 will be described with reference to FIG. FIG. 1A shows the imaging unit 15 in a longitudinal section in the longitudinal direction of the distal end component 6, and FIG. 1B shows a view of the vicinity of the upper surface of the connector from the P direction in FIG. 1A. FIG. 1C is a cross-sectional view taken along line QQ of FIG.
The imaging unit 15 includes an objective lens system 16, a solid-state imaging device 17, a signal processing circuit unit 18, a connector 19, and a cable 21.

The objective lens system 16 is divided into a front lens group 31 and a rear lens group 32. The front group lens 31 is attached to a front group lens frame 33, and the rear group lens 32 is attached to a rear group lens frame 34. These front lens frames 33
The rear lens frame 34 is formed of a metal body. These two lens frames 33 and 34 are connected via an insulating member 35.

The inner surface of the insulating member 35 is located on both lens groups 3
In order to reduce the deviation of the optical axes 1 and 32, the optical axis is formed without steps by processing from one direction over the entire length. The fixing of the objective lens system 16 to the distal end component 6 is performed via a fixing frame member 36. Like the inner surface of the insulating member 35, the inner surface of the fixing frame member 36 is formed without any steps by processing from one direction over the entire length.

The fixing frame member 36 includes the front lens frame 3
3 and the insulating member 35 are fitted and mounted. The front lens frame 33 and the rear lens frame 34 are fitted to the insulating member 35.

A cover glass 38 is positioned and adhered on the light receiving surface 37 of the solid-state imaging device 17.
On the light receiving surface side of the cover glass 38, a notch 39 for preventing the exudation of the adhesive is provided all around or partially.

At least one side surface of the cover glass 38 has a cover glass side reference surface 40 for positioning the center of the light receiving surface of the optical axis of the objective lens system 16. At the rear end of the rear lens group frame 34, at least one lens frame-side reference surface 41 (see FIG. 1C) for aligning the cover glass-side reference surface 40 is provided.

The space between the side surface (including the reference surface) of the cover glass and the rear lens group frame 34 is hermetically fixed, for example, with an epoxy or silicone adhesive 42. One end of a bendable flexible substrate 30 is wired to the electrode portion 43 of the solid-state imaging device 17 by a bump or the like. Electronic components such as an IC chip 44 and a capacitor 45 are mounted on the flexible substrate 30, and a circuit is formed by a pattern of copper foil or the like.

The flexible substrate 30 has a band shape and has circuit patterns on both sides. Further, in order to reduce the mounting space, the flexible substrate 30 is bent in a U-shape at both ends in the longitudinal direction with the side on which the electronic components are disposed inside. In other words, at a distance of about 1/3 from both ends in the longitudinal direction, a central portion (referred to as a central portion) is bent by 90 °, and the bent 2
The U-shape is formed so that the two bent portions face each other.
The length of the central portion of the U-shaped flexible substrate 30 substantially matches the size of the solid-state imaging device 17 in the height direction.

As shown in FIGS. 1A and 1B, the land portion 46 for cable wiring provided on the flexible substrate 30 is formed on the outer surface of the U-shape, that is, on the outer surface of the two opposing bent portions. In the specific example of FIG. 1A, the land portions 46 are provided on the upper surface of the upper bent portion and on the lower surface of the lower bent portion, respectively. A board-side terminal 48 connected to the land 46 of the flexible board 30 is provided at one end, and the cable 2 is provided at the other end.
A connector 19 having a cable-side terminal 49 to which each of the electric wires 37 is connected is provided on the rear side adjacent to the flexible board 30. That is, each electric wire 37 of the cable 21
Has a structure to be connected to the flexible substrate 30 via a connector 19 as a connection member.

The connector 19 has a substantially square plate shape with a small thickness. On one surface, a plurality of board-side terminals 48 are substantially L at positions closer to the upper portion and lower portion, respectively.
When viewed from the side, the cable side terminal 49 extends along the line at the left and right positions on the other surface.

That is, the board-side terminal 4 of the connector 19
The shape of 8 conforms to the U-shape of the flexible substrate 30, and the connector 19 also functions as a jig when bending the flexible substrate 30 into the U-shape.

The board-side terminals 48 of the connector 19 and the lands 46 of the flexible board 30 are connected by, for example, laser soldering. The space between the connector 19 and the flexible substrate 30 is filled with an epoxy-based or silicon-based adhesive 42 or the like, and the bent flexible substrate 3
0 is fixed.

The connector 19 may have a shape other than a substantially square shape as shown in FIG. 1, or a two-body first connector 5 as shown in a modification shown in FIG.
A connector 53 composed of the first and second connectors 52 may be used. FIG. 4A shows a flexible substrate 30 viewed from the side.
4B shows the vicinity of the connector 53, and FIG.
Flexible board 30 and connector 5 viewed from R direction
3 is shown.

As can be seen from FIG.
The method of folding 0 is different from that of FIG. In FIG. 1, the flexible substrate 30 is bent in a U-shape in a longitudinal section, but in FIG. 4, the flexible substrate 30 is bent in a U-shape in a section perpendicular to the longitudinal direction.

In this modified example, a land portion is provided at the rear end of the flexible board 30, and the first connector 51 and the board-side terminals 48 of the second connector 52 are connected to each other with the solder 54, respectively. And the engaging portion formed of the concave portion and the convex portion of the second connector 52 are engaged to be integrated. The connector 53 also functions as a jig for bending the flexible substrate 30 similarly to the connector 19.

As shown in FIG. 1, each electric wire 3 of the cable 21
Numerals 7 are connected by soldering to cable-side terminals 49 located on the opposite side of the substrate-side terminals 48, respectively. Flexible board 3
0 and then connect the cable 21 to the connector 19
May be wired, and vice versa.
After wiring 9 and cable 21, connector 19 may be fixed to flexible substrate 30.

The electrical components from the solid-state image pickup device 17 to the cable wiring portion are entirely covered by a shield frame 55. The shield frame 55 is fixed to the rear lens frame 34 of the metal body. The shield frame 55 and the rear lens group frame 34 are electrically connected. The outside of the shield frame 55 is covered with a second insulating member 56.

Since the cable 21 is wired to the flexible board 30 via the connector 19, the wiring space d1 in the thickness direction of the flexible board wiring portion 57 is slightly larger than the board-side terminal 48, which is the same as the conventional example shown in FIG. It can be smaller than the wiring space d2 (about the outer skin of the electric wire 112). That is, d1 <d2.

Next, the outer metal of the video scope 1 will be described with reference to FIG. FIG. 3 shows an electrical connection state of the chassis or exterior metal of the videoscope 1 in a state where the high-frequency treatment tool 61 is used.

The high-frequency treatment instrument 61 connected to the high-frequency power supply 59 is inserted through the treatment instrument insertion port 200 into the treatment instrument channel 25, and a loop of a cutting wire is hooked on a polyp or the like in the body cavity of the patient 62. The patient plate 63 is in contact with the body of the patient 62 over a wide area.

The length of the cable 21 from the image pickup device is generally much longer than the entire length of the video scope 1 in consideration of repairability. The extra portion is wound and stored in the scope connector section 5.

When a current flows through the cable 21, noise is generated from the cable 21. In particular, a strong magnetic field is generated in a portion where the cable 21 is wound.
Is the strongest in the entire video scope 1. That is, the scope connector section 5 is most likely to generate noise.

On the other hand, the exterior metal (chassis) of the video scope 1 is roughly divided into four parts. That is, there are four parts: the insertion part exterior metal 65, the operation part exterior metal 66, the universal cord part exterior metal 67, and the scope connector part exterior metal 68. The surface of each exterior metal is generally covered with an insulating resin. However, a part of the exterior metal may be partially exposed on the outer surface of the scope.

FIG. 3 is a picture in which it has been drawn quite extreme. The insertion portion exterior metal 65 is covered with an insulating resin member 69, but the other exterior metals of the other portions are exposed. The electrical connection state of each exterior metal is as follows.

Insertion part exterior metal 65 and operation part exterior metal 66
And the universal cord part exterior metal 67 are electrically conductive, and the GN of an electric circuit (not shown) of the imaging device is provided.
Floating from D70 (not connected is indicated by x). Further, it is electrically floating from the housing 12 of the light source device and the housing of the video processor (not shown).

The outer metal 68 of the scope connector portion is electrically floating from the outer metal of the insertion portion outer metal 65, the operating portion outer metal 66, and the universal cord outer metal 67, and the electric circuit of the image pickup device is used. GND of patient circuit
It conducts with 70. Furthermore, it is electrically floating from the housing 12 of the light source device and the housing of the video processor.

Next, the operation will be described. The object image is captured by the imaging unit 15
Is formed on the solid-state imaging device 17 arranged at the image forming position by the objective lens system 16 which forms the image, and is converted into an electric signal. Then, the signal is amplified by the signal processing circuit 18 in the imaging unit 15 and sent to the video processor via the cable 21.
The signal is processed, converted into a standard video signal, and displayed on a monitor (not shown).

After the electronic components such as the IC chip 44 are mounted on the strip-shaped flexible substrate 30 and then bent into a U-shape by the connector 19, each of the substrate-side terminals 48 The positioning can be easily performed so as to coincide with the land portion 46. Therefore, in this state, the substrate-side terminals 48 can be easily connected to the land portions 46 by fixing with the adhesive 42 and then soldering with laser light.

In this case, the connector 19 is located at a predetermined interval (the vertical direction in FIG. 1B, the x direction in FIG. 1C).
Thus, since the board-side terminal 48 is formed and the size of the terminal 48 is also reduced, soldering can be sufficiently performed even if the width of the land portion 46 is reduced. Also, the board side terminal 4
8 (the y direction in FIG. 1C) can be reduced, and when soldered, the portion protruding from the flexible substrate 30 can be reduced. That is, the wiring space d1 in FIG.
Can be reduced.

Further, the inner lead at one end of the flexible substrate 30 can be easily connected to the electrode portion 43 of the solid-state imaging device 17 by bump connection. This bump connection may be performed before the connection between the flexible substrate 30 and the connector 19. The area near the bump connection is sealed with an insulating resin.

The cable-side terminal 49 of the connector 19
Since the cable protrudes toward the cable 21, it is possible to easily connect the cables without the need to wire the wires 37 of the cable 21 too much. That is, the imaging unit 15
Can be sufficiently connected in a short state.

Next, the operation will be described with reference to FIG. The place where radiation noise is most likely to occur in the scope is the scope connector section 5. Since the electrical connection state of the connector portion exterior metal 68 is as described in the configuration section, the generated noise flows to the electric circuit GND 70 through the connector portion exterior metal 68. That is, emission of noise can be prevented.

As shown in FIG. 3, the treatment instrument insertion port 20 of the scope
When the high-frequency treatment is performed from 0 through the high-frequency treatment tool 61,
The high-frequency current 60 leaks from the high-frequency treatment tool 61 into the insertion portion exterior metal 65.

However, the insertion part outer metal 65, the operation part outer metal 66, and the universal cord part outer metal 67 are electrically conductive but float electrically from the other parts, so that the surgeon's hand is, for example, in the operating part. Although the exterior metal 66 is conductive, it floats electrically from other parts, so if the part other than the surgeon's hand does not touch any other metal body, the surgeon will not be electrocuted. There is no electrical safety.

If the outer metal of the insertion part outer metal 65, the operation part outer metal 66, and the universal cord part outer metal 67 falls on the GND 70 of the electric circuit similarly to the scope connector part outer metal 68, the above case in the case of,
The surgeon may get an electric shock.

In FIG. 3, the outer metal 68 of the scope connector portion is shown.
Only the example in which it floats electrically from other exterior metal is shown, but its structure is not limited to the scope connector part exterior metal 68 separately. Universal cord exterior metal 6
7 and the outer metal 68 of the scope connector.

That is, a portion of the exterior metal part (excluding the insertion part and the operation part), which is likely to radiate noise in the outer metal part after the universal cord part, is conducted to the GND of the patient circuit to reduce the radiation of noise. Exterior metal part is GND
The safety is ensured by floating from above.

By adjusting the cover glass side reference surface 40 of the solid-state image sensor 17 to the lens side reference surface 41 provided at the rear end of the rear lens group frame 34, the adjustment of the optical axis and the center of the light receiving surface can be performed only in the x-axis direction. Positioning can be performed easily.

In the picture of this embodiment (FIG. 1 (C)), the number of reference planes is one, but as shown in the sentence in the structure,
Two sides are fine. In that case, the optical axis and the center of the light receiving surface are uniquely positioned.

Since the cover glass 38 of the solid-state imaging device 17 is directly adhered and fixed to the rear group lens frame 34, the imaging unit 1
5 can be shortened. In addition, since it is no longer necessary to attach a separate glass member on the cover glass 38 by providing a reference surface on the cover glass 38, the number of adhesive layers is small and dust can hardly enter.

Notch 3 on the light receiving surface side of cover glass 38
9, the cover glass 38 is provided on the light receiving surface.
When positioning and bonding, the oozing of the adhesive does not flow out to the side surface of the cover glass.
It is possible to prevent the adhesive from adhering to the cover glass side reference surface 40.

The hard length L1 behind the substrate in the first embodiment
Is not different from the hard length L2 of the conventional example (FIG. 11). In the case of the conventional example, since each wire 112 is wired outside the imaging unit, a space for expanding each wire 112 is necessary, but in the case of the first embodiment, it is unnecessary. Since the space for the connector 19 is required correspondingly, L1 ≒ L2.

As described above, according to the present embodiment, the adoption of the connector 19 makes it possible to make the structure of the imaging unit 15 easy to manufacture, and the rigid length (in the optical axis direction) of the imaging unit 15 is substantially the same as that of the conventional example. , The size of the imaging unit 15 in the height or width direction (in the direction orthogonal to the optical axis) can be reduced. Therefore, the imaging unit 15 can be provided at low cost, and the diameter of the distal end configuration unit 6 that houses the imaging unit 15 can be reduced.

(Second Embodiment) FIG. 5 shows a connector 71 according to a second embodiment. The connector 71 has a terminal 73 penetrating therethrough so as to be embedded in the upper, lower, left and right side surfaces of the connector main body 72 or through the inside. That is, the connector 71 has a structure in which the board side and the cable side terminals are directly connected without being connected via the pattern.

The lengths of the terminals 73 protruding from the connector main body 72 toward the cable side or the board side, for example, s1 and s2, may be the same or different.
Further, the intervals between the terminals 73, for example, T1 and T2 may be the same interval or may be different intervals.

The cross-sectional shape of the connector body 72 need not be rectangular, but may be irregular, circular or polygonal. Further, the thickness of each terminal 73 may be changed at each terminal 73 according to the magnitude of the current flowing through the terminal 73. The material of the connector main body 72 may be an insulator, for example, a ceramic or an electrically insulating resin.

Each terminal 7 is connected to the connector body 72.
3 may be made detachable. In this case, the terminal 7
When the wire 3 is broken, the terminal 73 can be repaired by replacing only the terminal 73.

Further, the terminal may be bent like a terminal indicated by reference numeral 74 in FIG. By doing so, the flexible substrate 3
Compatible with complicated wiring patterns on 0. Further, it can also be used to connect to an electrode portion or a conductor portion of an electronic component mounted on the flexible substrate 30.

The other structure is the same as that of the first embodiment. The operation and effect of this embodiment are the same as those of the first embodiment.

(Third Embodiment) FIG. 6 shows a cable connecting portion according to a third embodiment. The connector 19 according to the first embodiment includes a board-side terminal 48 and a cable-side terminal 49.
Is a metal terminal, whereas the connector 75 in this embodiment has the board-side terminal 48 as in the first embodiment, but the cable-side terminal is not a metal terminal and has only the circuit pattern 76 (circuit The cable side terminals are formed in a pattern).

The cable 21 is fixed by a cable base 77, each electric wire (the coaxial cable 37 in this embodiment) is electrically connected to the solder projection 81, and is wired to the circuit pattern 76 via the anisotropic conductive sheet 78. You. As shown in FIG. 7, the cable 21 is cut perpendicularly to the longitudinal direction, and about 1 mm from the cut surface.
1b is stripped.

Next, as shown in FIG. 8, a metal cable base 77 having a diameter of about 2 mm and an inner diameter capable of fixing the coaxial cable 37 tightly, that is, not moving together, is attached to the strip portion of the cable 21. 7 to cover each coaxial cable 37, for example, by pushing in from the direction shown by the arrow in FIG.

In this way, as shown in FIG. 8, the cable base 77 is press-contacted and electrically connected to the cable base 77 at the portion where the general shield 21a is inserted between the overall covering 21b and the coaxial cable 37. It is installed to do.

The distal end surface of the cable base 77 is disposed so as to be approximately 0.5 mm above the cut surface of the coaxial cable 37. Pour the transparent insulating resin 79 into this step,
Let it cure. Thereafter, the conductive hole 80 is formed by irradiating the coaxial core wire 37a with laser light. A solder layer is formed in the conductive hole 80, and a solder protrusion 81 is formed so as to protrude above the end face of the cable base 77.

That is, as shown in FIG. 8, the solder projections 81 electrically connected to the coaxial core wire 37a are arranged in the respective conductive holes 80 on the front end surface covered with the transparent insulating resin 79. The cable base 77 is electrically connected to the overall shield 21a.

Returning to FIG. 6, the circuit pattern 76 of the connector 75 is connected to the cable 21 formed on the end face via an anisotropic conductive film 78 having conductivity only in the thickness direction.
Connect to

The anisotropic conductive film 78 can be conducted and adhered between the solder projection 81 and the corresponding circuit pattern 76 by increasing the temperature to about 180 ° C. and applying pressure and / or ultrasonic vibration. it can. Other configurations are almost the same as those of the first embodiment. The operation is almost the same as that of the first embodiment.

According to the present embodiment, in addition to the effects of the first embodiment, the size (hard length) of the imaging section in the optical axis direction can be further reduced. Further, since the pipe-shaped cable base 77 is used for the cable end surface, the position of each core wire is accurately determined, and the cable connection work is stabilized. The position of the anisotropic conductive sheet 78 need not be limited to the cable side. It may be used on the substrate side or on both the substrate side and the cable side.

FIG. 9 shows each electric wire of the endoscope device 85 as a whole. The endoscope device 85 includes, for example, a video scope (electronic endoscope) 1 according to the third embodiment, a light source device 86 to which the video scope 1 is connected, and an electric contact portion 22 of the video scope 1 connected by a signal. And a video processor 88 connected via a cable 87.

The image pickup section 15 having the solid-state image pickup element 17 and the like is connected to an electric contact section 22 via a cable 21. A switch 89 provided on the operation unit 3 is also connected to the electric contact unit 22 via the remote control cable 90, provided on the front end side of the scope connector unit 5, and connected to a first electric circuit 91 in the light source device 86. The electrical contact 91 is also connected to the electrical contact section 22 via a control signal cable 92. The electric contact section 22 connected to these cables is connected to a signal connection cable 87 via an electric connector 93.
Is connected to the second electric circuit 94.

FIG. 10 is a detailed view of a portion C in FIG. Each electric wire disposed in the video scope 1 is connected to the contact pin (male) 95 by solder 102. The cable 21 is composed of a plurality of drive signal cables 96 (FIG. 10 shows one cable).
And a plurality of output signal cables 97 (FIG.
Book).

An electromagnetic absorber 98 made of ferrite for absorbing electromagnetic waves is provided on at least the drive signal cable 96 and the control signal cable 92. The control signal cable 92 is a signal line for controlling the amount of light from the light source device 86 supplied to the video scope 1, for example.

The electromagnetic absorber 98 is fixed to each cable with an insulating adhesive 99 such as a silicon-based material. The insulating adhesive 99 filled on the back side of the substrate 100 ensures watertightness between the contact pin (male) 95 and the substrate 100.

The wiring portion of the electric connector 22 is made of the metal body 1
01 and shielded. The contact pins (male) 95 are connected to the contact pins (female) 103, respectively. The contact pin (female) 103 is fixed to the substrate 104 of the electrical connector 93.

With the above-described configuration, unnecessary radiation noise generated from the video processor 88 is reduced by the electromagnetic absorber 98.
Therefore, propagation can be blocked beforehand, reliable shielding can be performed, and unnecessary radiation noise of the entire apparatus can be reduced.

In the first embodiment and the like, the flexible substrate 30 has been described as a substrate for forming an imaging device. However, the present invention is not limited to the flexible substrate 30 and may be a rigid substrate.

[Supplementary Notes] An objective optical system, a solid-state imaging device arranged at an image forming position of the objective optical system, a substrate connected to the solid-state imaging device, on which electronic components are mounted, and a cable for transmitting a signal from the solid-state imaging device And a connecting member having a terminal connected to the land of the substrate and a terminal connected to the cable.

2. 2. The imaging device according to claim 1, wherein the substrate is a flexible substrate.

3. An image pickup apparatus comprising: an objective optical system, a holding member that holds the objective optical system, and a solid-state imaging device with a cover glass disposed at an image forming position of the objective optical system, wherein the objective optical system and the solid An imaging apparatus, wherein a reference surface for performing optical adjustment with an imaging element is provided on the holding member and the cover glass.

4. A long insertion section having an imaging means at a distal end thereof, an operation section connected to a base end of the insertion section, a flexible cord section extending from the operation section, and a distal end of the insertion section. A light source device for supplying the emitted illumination light; and a video signal processor for performing signal processing on the image pickup means, and a connector unit for connecting the code to the video processor. An endoscope having an exterior metal that is not electrically connected to an endoscope, wherein an exterior metal other than the insertion section and the operation section is insulated from the insertion section and the operation section and is electrically connected to the ground of an electric circuit. mirror.

5. The exterior metal of the connector part is the GN
4. The electronic endoscope according to claim 4, wherein the endoscope is electrically connected to D.

[0099]

As described above, according to the present invention, an objective optical system, a solid-state imaging device arranged at an image forming position of the objective optical system, and an electronic component mounted on the solid-state imaging device are mounted. Substrate, a cable for transmitting a signal from the solid-state imaging device, a terminal connected to a land of the substrate, and a connection member having a terminal to which the cable is connected, The board-side terminals set to match the board lands can be easily connected to the lands, and the size of the imaging device can be reduced. And it can be cheap.

[Brief description of the drawings]

FIG. 1 is a diagram showing an imaging apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a video scope incorporating the first embodiment.

FIG. 3 is a schematic diagram showing an electrical connection state of an outer metal of the video scope.

FIG. 4 is a diagram illustrating a part of an imaging device according to a modification.

FIG. 5 is a perspective view showing a connector according to a second embodiment of the present invention.

FIG. 6 is a view showing the vicinity of a connection portion between a connector and a cable according to a third embodiment of the present invention.

FIG. 7 is an explanatory view of attaching a cable base to an end of a cable on a connector connection side.

FIG. 8 is a perspective view showing the structure of the cable on the connector connection side.

FIG. 9 is an overall configuration diagram of an endoscope apparatus.

FIG. 10 is a sectional view showing a structure of a connection portion between an electric contact portion and a signal connection cable.

FIG. 11 is a diagram showing a schematic structure of a conventional imaging apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Video scope 2 ... Insertion part 6 ... Tip construction part 15 ... Imaging part 16 ... Objective lens system 17 ... Solid-state imaging device 18 ... Signal processing circuit 19 ... Connector 21 ... Signal cable 31 ... Front group lens 32 ... Rear group lens 38 ... Cover glass 32 ... Adhesive 37 ... Wire 44 ... IC chip 45 ... Capacitor 46 ... Land part 48 ... Board side terminal 49 ... Cable side terminal 55 ... Shield frame 57 ... Flexible board wiring part

Claims (1)

[Claims] 1. An objective optical system, a solid-state imaging device arranged at an image forming position of the objective optical system, a substrate connected to the solid-state imaging device, on which an electronic component is mounted, and An imaging apparatus comprising: a cable for transmitting a signal; a connection member having a terminal connected to the land of the substrate; and a terminal connected to the cable.