JPH10248804A - Image pick-up device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pick-up device capable of connecting a flexible printed circuit board to a hard board surely without enlarging its size. SOLUTION: In the image pick-up device 1, the connection part of a flexible printed circuit board 10 and a hard board 11 via an outer lead 10f is located at a position away from CCD 2, and the connection part of an image pick-up cable 16 is located between the connection part and the CCD 2. By this, the connection area of the hard board 11 with the flexible printed circuit board 10 can be made larger for improving the reliability of connection, and furthermore, since the connection part of the image pick-up cable 16 is arranged in a row with the hard board 11, size enlargement of the image pick-up device 1 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus for connecting a solid-state image pickup device and a hard board with a flexible printed board.

[0002]

2. Description of the Related Art An imaging apparatus for obtaining an electric image by photoelectrically converting an optical image of an object to be imaged by, for example, a solid-state imaging device has been widely applied to various fields. As an example.

One example of such a device is disclosed in Japanese Unexamined Patent Publication No.
Japanese Patent Application Laid-Open No. 71809 describes an imaging device in which a solid-state imaging device and a hard substrate are electrically connected via a flexible printed circuit board.

[0004]

However, in the imaging apparatus described in the above-mentioned Japanese Patent Application Laid-Open No. 8-271809, the connection position between the flexible printed board and the hard substrate is on the hard substrate closer to the solid-state imaging device. , It is not possible to secure a sufficient connection area,
The connection strength was insufficient and the reliability was insufficient.

In response to this point, it is conceivable to increase the connection area in order to increase the connection strength without changing the connection position. However, in this case, there is a drawback that the image pickup apparatus becomes large. there were.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an imaging device capable of securely connecting a flexible printed board and a hard board without increasing the size.

[0007]

In order to achieve the above object, an image pickup apparatus according to the present invention has a solid-state image pickup device,
A flexible printed board connected to the solid-state imaging device, a hard board connected to the flexible printed board for mounting electronic components, and a connection portion provided on at least one of the flexible printed board and the hard board or A signal cable connected to at least one connection portion of the electronic component mounted on the hard board;
In each of the imaging devices arranged on the back side of the imaging surface of the solid-state imaging device, a connection portion between the flexible printed board and the hard substrate is provided on a hard substrate that is on the distal side with respect to the solid-state imaging device, A connection portion of the signal cable is provided between a connection portion and the solid-state imaging device.

Accordingly, an image pickup apparatus according to the present invention has a solid-state image sensor, connects a flexible printed circuit board to the solid-state image sensor, and connects a hard substrate for mounting electronic components to the flexible printed circuit board. A signal cable is connected to at least one of a connection portion provided on at least one of the flexible printed board and the hard board or a connection portion of an electronic component mounted on the hard board, and the flexible printed board, the hard board, and the signal cable are connected to each other. Are respectively disposed on the back side of the imaging surface of the solid-state imaging device, and a connection portion between the flexible printed board and the hard substrate is provided on a hard substrate that is on a distal side with respect to the solid-state imaging device, and the connection portion A connection portion for the signal cable is provided between the signal cable and the solid-state imaging device.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 show a first embodiment of the present invention. FIG. 1 is a longitudinal sectional view showing a configuration of an image pickup apparatus, FIG. 2 is a plan view showing a flexible printed board, and FIG. Bottom view showing the board,
4 is a plan view showing a pattern surface of the hard board, FIG. 5 is a bottom view showing an electronic component mounting surface of the hard board, FIG. 6 is a perspective view showing the electronic endoscope, and FIG. 7 is an insertion portion of the electronic endoscope. FIG. 8 is a sectional view taken along the line AA of FIG. 7 showing a curved portion of the insertion portion.

As shown in FIG. 1, the image pickup apparatus 1 has a CCD 2 as a solid-state image pickup device having an image area and a row of bonding pads on its surface, and is adhered to the surface of the CCD 2 so as to cover the image area. And a mask 4 attached to the front surface of the cover glass 3. These are fixed by fitting the cover glass 3 to the CCD fixing frame 9.

In front of the CCD fixed frame 9, a lens 5 composed of a plurality of lenses, a brightness stop 6 for controlling the amount of light flux passing through the lens 5, and a lens 5 and a brightness stop 6 are provided. There is provided an imaging optical system 8 which is configured to hold the lens frame 7 fitted to the CCD fixed frame 9.

A flexible printed board (hereinafter, referred to as FPC) 10 is electrically connected to the CCD 2, and a hard board 11 is further electrically connected to the FPC 10.

First, referring to FIG. 2 and FIG.
10 will be described in detail.

The FPC 10 is configured by arranging electrical patterns as shown on both surfaces of a base material 10a formed of a material such as polyimide.

That is, a plurality of fine line-shaped internal patterns 10b are formed on the surface of the base material 10a, and one end of the internal pattern 10b extends from one end of the base material 10a and is connected to the CCD 2. Inner lead 10e.

The other ends of some of the internal patterns 10b connected to the inner leads 10e have the F
A via hole 10c for connecting the internal pattern 10b on the front surface and the rear surface of the PC 10 is provided.
0b is a cable pad 10d.
Directly connected to

Some of the inner patterns 10b on the back surface connected via the via holes 10c are further connected to the cable pads 10d on the front surface again via the via holes 10c, and the other internal patterns 10b are In order to connect to the hard substrate 11, it is connected to an outer lead 10f extending from the other end of the back surface of the base material 10a.

That is, in the illustrated example, five of the nine inner leads 10e are connected to the cable pad 10d on the front surface, and four of them are the outer leads 10f on the rear surface.
It is connected to the.

Thus, the cable pad 1 is attached to the FPC 10.
By providing 0d, the number of the outer leads 10f is configured to be smaller than the number of the inner leads 10e, and the pitch of the outer leads 10f can be larger than the pitch of the inner leads 10e.

Next, the hard substrate 11 will be described in detail with reference to FIGS.

The hard substrate 11 is formed by arranging electrical patterns as shown on both sides of a base material 11a formed of a material such as ceramic, for example, and one surface is a pattern surface (FIG. 4). The other surface is an electronic component mounting surface (see FIG. 5) on which the IC chip 13 as the electronic component and the chip capacitor 12 as the electronic component as shown in FIG. 1 are mounted.

That is, a plurality of fine line-shaped internal patterns 11b are formed on the pattern surface of the base material 11a, and one end of the internal pattern 11b is cut into a semicircle for connecting the patterns on both surfaces. The missing through hole 11c has a FPC pad 11d as a connection site at the other end.
Is provided. The other FPC pad 11d has a through hole 11 cut out in an approximately 1/4 arc shape.
c is provided.

On the other hand, on the electronic component mounting surface, a chip pad 11 is provided at a portion where a chip capacitor 12 is mounted.
The chip pad 11e is connected to the internal pattern 11b on the pattern surface via the through hole 11c.

Further, an IC pad 11f and an IC dummy pad 11g corresponding to the electrode 13a of the IC chip 13 are provided in a portion where the IC chip 13 is mounted, and the former IC pad 11f is provided with an internal pattern 11b. However, the latter IC dummy pad 11g is provided in an electrically floating state.

The IC pads 11f and the IC dummy pads 11g are bonding points between the IC chip 13 and the hard substrate 11, and the IC chip 13 and the hard substrate 11 are connected via bumps.

The IC chip 13 thus mounted on the hard substrate 11 is sealed with a sealing resin 20 (see FIG. 1). This IC chip 13 is a versatile chip, has two pad rows on both sides including the part shown by the broken line in FIG. 5, and can select and use the electrode 13a. It has become.

Returning to FIG. 1, the connection between the CCD 2 and the FPC 10 and the connection between the FPC 10 and the hard substrate 11 will be described.

The FPC 10 is connected to the bonding pad of the CCD 2 via an inner lead 10e via a bump 2a, and the connection portion is fixed using a sealing resin 14.

After the FPC 10 is bent from the side surface of the CCD 2 along the back surface, the FPC 10 further extends along the pattern surface of the hard substrate 11 arranged so that its longitudinal direction is perpendicular to the back surface of the CCD 2. It is bent.

The back surface of the CCD 2 and the folded F
The PC 10 is fixed using an adhesive 15, and similarly, the FPC folded over the pattern surface of the hard substrate 11.
10 is also adhered and fixed.

The electrical connection between the FPC 10 and the hard board 11 is made by connecting the FPC pad 11d of the hard board 11 to the FPC.
This is performed by attaching the outer leads 10f of C10 with solder 17 together. At this time, the FPC pad 11d, which is a connection portion, is disposed so as to be located at a portion far from the CCD 2, that is, to be on the distal side with respect to the CCD 2.

An imaging cable 16 as a signal cable is connected to the cable pad 10 d of the FPC 10 and the chip capacitor 12 on the hard substrate 11 as described above.

The imaging cable 16 is formed by bundling a plurality of coaxial wires having a core wire 16a, an insulating coating 16b, and a shield wire 16c in this order from the center side. Each coaxial line is fixed by using.

In this manner, several core wires 16a of a plurality of coaxial wires are electrically connected to the cable pad 10d by using the solder 19, and the connection portion of the chip capacitor 12 is left. The core wire 16 a of the coaxial cable is electrically connected using solder 18.

The connection portions of the imaging cable 16 as described above are connected portions between the FPC 10 and the hard substrate 11, that is, the outer leads 10 f of the FPC 10 and the hard substrate 11.
This is disposed so as to be on the front side of the connection portion with the FPC pad 11d and on the rear side of the CCD 2, that is, between the connection portion and the CCD 2.

In the above description, the imaging cable 16 is connected to the chip capacitor 12 of the hard substrate 11, but the invention is not limited to this. For example, the imaging cable 16 is directly connected to the hard substrate 11. Is also good.

A metal frame 21 fitted and fixed to the rear end of the CCD fixing frame 9 is provided so as to cover the FPC 10 and the hard substrate 11, and inside the metal frame 21. The sealing resin 22 is filled.

The CCD fixed frame 9 and the metal frame 21
Is covered with an insulating tube 23, and the other end of the insulating tube 23 reaches the end of the imaging cable 16 so as to also cover the cable pressing thread 16d.

Next, referring to FIG. 6, an electronic endoscope 31 constituted by using the above-described image pickup apparatus 1 will be described.

The electronic endoscope 31 has a distal end portion 38, a curved portion 39, and a flexible tube portion 40 which are connected in order from the distal end side from the operating portion 32 provided with the bending knob 36 and the forceps insertion port 37. An elongated insertion portion 33 is extended, a universal cord portion 34 is extended from a side of the operation portion 32, and an electric connector 41 is attached to an end of the universal cord portion 34.
And a connector 35 having a light guide entrance end 42 and an air supply base 43.

The insertion section 33 of the electronic endoscope 31 will be described with reference to FIG.

The distal end portion 38 of the insertion portion 33 is configured by fitting a distal end cover 46 to the distal end side of a distal end fixing member 45, and an air / water nozzle 47 is attached to the distal end cover 46. I have.

An air supply / water supply pipe 48 communicating with the air supply / water supply nozzle 47 is provided on the proximal side of the tip fixing member 45.
Is attached, and a forceps insertion pipe 49 is attached so as to penetrate the tip fixing member 45 and the tip cover 46.

Further, the imaging device 1 as described above is inserted into and fixed to the distal end fixing member 45 and the distal end cover 46 from the near side.

A curved portion 39 on the hand side of the distal end portion 38
And the flexible tube section 40 are as follows.

First, the bending portion 39 includes a plurality of bending pieces 55.
And a curved portion blade 56 and a curved portion rubber 57 coated on the outer periphery thereof. Both ends of the curved portion rubber 57 are fixed by a curved portion rubber pressing thread 57a.

The flexible tube portion 40 includes a flexible tube portion blade 58 and a flexible tube portion resin 59 coated on the outer periphery thereof, and a flexible tube base for connecting to the curved portion 39 is provided at the distal end side. 61 are provided.

The air / water pipe 48 has
The air supply / water supply tube 51 is connected,
The outer periphery of the water supply tube 51 is an air supply / water supply protection tube 52.
Coated with

A forceps insertion tube 53 is connected to the forceps insertion pipe 49. The forceps insertion tube 53 has a small inner diameter and a small thickness as indicated by reference numeral 53a in the curved portion 39. On the other hand, as shown by reference numeral 53b, the inside diameter and the wall thickness of the flexible tube portion 40 are larger than those of the curved portion 39. Thus, the forceps insertion tube 53 is provided such that the outer diameter of the portion indicated by the reference numeral 53a in the curved portion 39 is smaller than the portion indicated by the reference numeral 53b in the flexible tube portion 40.

Further, the outer circumference of the imaging cable 16 extending from the imaging device 1 is covered with an imaging cable protection tube 54.

Further description will be made with reference to FIG. 8 which is a sectional view taken along the line AA of FIG.

The insertion portion 33 includes a pair of light guides 64 for transmitting illumination light incident from the light guide entrance end 42 of the connector portion 35 as built-in components other than those shown in FIG. A light guide protection tube 65 that covers each light guide 64, two pairs of bending wires 62 each having one end connected to the bending piece 55 for bending the bending portion 39, And a curved wire receiver 63 for passing through.

As described above, the forceps insertion tube 53
Is configured such that the outer diameter of the portion indicated by the reference numeral 53a in the curved portion 39 is smaller than the portion indicated by the reference numeral 53b in the flexible tube portion 40, so that the outer diameter of the curved portion 39 is increased. Instead, the two pairs of curved wire receivers 63 can be arranged in vertical and horizontal positions in a plane perpendicular to the central axis of the curved portion 39, that is, along the vertical axis Y and the horizontal axis X in FIG.

The air / water protection tube 5 as described above
2. The imaging cable protection tube 54, the forceps insertion tube 53, and the light guide protection tube 65 are all formed of the same material, for example, a Teflon tube or a silicon tube.

According to the first embodiment, the FP
Since the connection portion between the C and the hard substrate is provided on the rear end side of the hard substrate, that is, on the side far from the CCD, the contact area between the FPC and the hard substrate can be made sufficiently large, and both of them can be reliably formed. Can be connected.

Further, since the imaging cable is connected to the FPC and the hard board on the side close to the CCD, the hard length can be shortened, that is, the imaging device can be shortened.

Further, since the cable pads are provided on the surface of the FPC, the number of outer leads can be made smaller than the number of inner leads, and the pitch of the outer leads can be made larger. For that, FP
C and the hard substrate can be easily connected.

Further, in the FPC, since the cable pad is provided on the front surface and the outer lead is provided on the rear surface so that the surfaces are different from each other, no heat is transmitted to the outer lead when the imaging cable is connected to the cable pad. Reliability is improved.

In addition, the provision of the IC dummy pad on the hard substrate allows the rigid substrate and the IC chip to be securely connected even when the IC pad is shifted in a certain direction when a versatile IC chip is used. Can be connected and fixed, thereby improving the reliability and reducing the cost.

Further, since the air / water protection tube, the imaging cable protection tube, the forceps insertion tube, and the light guide protection tube are formed of the same material, and the unified sliding properties of the built-in portions of the bending portion are smoothed. Can be performed.

Further, since the forceps insertion tube has a smaller outer diameter at a portion located in the curved portion than a portion located in the flexible tube portion, two pairs of curved wires can be used without increasing the outer diameter of the curved portion. The receivers can be arranged up, down, left and right, that is, along the vertical and horizontal axes. Thereby, the bending portion can bend accurately in any of up, down, left, and right directions, and can accurately follow the operation in the direction desired by the operator.

FIG. 9 shows a second embodiment of the present invention, and is a longitudinal sectional view showing a main part of an image pickup apparatus. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different points will be mainly described.

The hard substrate 11 of the present embodiment is obtained by mounting a chip resistor 71 as an electronic component and a transistor chip 72 as an electronic component, in addition to the chip capacitor 12, and furthermore, the electronic component mounting surface is the first substrate described above. It is provided upside down from the embodiment.

The connecting portion of the chip resistor 71 is connected to a part of the core wire 16 of the plurality of coaxial wires constituting the imaging cable 16.
a is electrically connected using solder 19, and
The transistor chip 72 is covered with a sealing resin 73.

According to the second embodiment, substantially the same effects as those of the first embodiment can be obtained.

FIG. 10 shows a third embodiment of the present invention, and is a longitudinal sectional view showing a main part of an image pickup apparatus. In the third embodiment, the same parts as those in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted. Only different points will be mainly described.

The hard substrate 11 of this embodiment has a chip capacitor 12 and an IC chip 13 mounted thereon in the same manner as in the first embodiment, but the electronic component mounting surface is vertically different from that of the first embodiment. The opposite is provided.

Further, the CCD 2 of this embodiment has one upper and lower bonding pad row for the image area. The first FPC 10 as described above is electrically connected to these upper and lower bonding pads via the bumps 2a by the inner leads 10e, and the second FPC 75 is also connected to the inner leads 75.
a is electrically connected via the bump 2b.

The second FPC 75 has an inner lead 75a and a cable pad 1 similar to the FPC 10.
0d (see FIG. 2), but does not include outer leads 10f for connecting to the hard substrate 11.

The second FPC 75 is bent from the side surface of the CCD 2 along the back surface in the same manner as the above-described FPC 10, and then the hard substrate 11 is perpendicular to the back surface of the CCD 2. Is bent along the pattern surface, and its end is bonded and fixed on a sealing resin 20 for sealing the IC chip 13 on the hard substrate 11. This second FPC 75 is also an FPC
Similarly to 10, it is fixed to the CCD 2 and the hard substrate 11 using an adhesive 15.

The second FPC 75 is a part of the plurality of coaxial lines constituting the imaging cable 16.
6a is electrically connected using solder 18.

The connection between the FPC 10 and the hard substrate 11 is the same as in the second embodiment.

According to the third embodiment, almost the same effects as those of the first and second embodiments can be obtained, and the bonding pad rows of the CCD are provided in two rows. Can be increased, and the reliability can be further improved.

Further, since it is not necessary to connect the imaging cable to the hard board, no extra heat is applied to the components mounted on the hard board when connecting the imaging cable, and the reliability can be improved. it can.

FIG. 11 shows a fourth embodiment of the present invention, and is a longitudinal sectional view showing a main part of an image pickup apparatus. In the fourth embodiment, the same components as those in the above-described first to third embodiments are denoted by the same reference numerals, and description thereof will be omitted. Only different points will be mainly described.

The hard substrate 11 of this embodiment has a chip resistor 71 and a transistor chip 72 mounted thereon in addition to the chip capacitor 12, as in the second embodiment described above. It is provided upside down from the second embodiment.

Further, the CCD 2 of this embodiment has one upper and lower bonding pad row with respect to the image area, similarly to the third embodiment described above. , The first FPC 10 and the second FPC 75 are electrically connected.

The connection between the FPC 10 and the hard substrate 11 is the same as in the first embodiment.

On the other hand, the second FPC 75 is
Is formed by bending in the same manner as in the embodiment of FIG.
2 and the rigid substrate 11 using an adhesive 15.

The imaging cable 16 is electrically connected to each connection portion between the chip capacitor 12 and the chip resistor 71 on the hard substrate 11 by using solder 19, and the cable pad 10 d (on the second FPC 75). 2) (see FIG. 2).

According to the fourth embodiment, substantially the same effects as those of the first to third embodiments can be obtained.

FIG. 12 shows a fifth embodiment of the present invention and is a longitudinal sectional view showing a main part of an image pickup apparatus. In the fifth embodiment, the same components as those in the above-described first to fourth embodiments are denoted by the same reference numerals, and description thereof will be omitted. Only different points will be mainly described.

The CCD 2 of this embodiment is the same as the third CCD described above.
In the same manner as in the embodiment, the upper and lower bonding pads are provided for the image area, and the first FPC 1 is provided for the upper and lower bonding pads.
0 and the second FPC 75 are electrically connected to each other.

The hard substrate 81 of the present embodiment has the chip capacitor 12 and the IC chip 13 sealed with the sealing resin 20 mounted thereon. The hard substrate 8
1 is that only the electronic component mounting surface is pattern-formed,
This is a so-called single-sided substrate.

[0086] Such a rigid substrate 81 is used for the IC chip 1.
The chip capacitor 12 is arranged at a position farther from the CCD 2 than the chip capacitor 3.

The FPC 10 of this embodiment extends rearward as it is along the side surface of the CCD 2, and is not particularly bent except for the inner lead 10e. The FPC 10 is electrically connected to a connection portion of the chip capacitor 12 mounted on the hard board 81 by using solder 82. Thus, in the present embodiment, the FPC 10 is only connected to the hard substrate 81 via the chip capacitor 12, and is not directly connected to the hard substrate 81.

On the other hand, the second FPC 75 is
And is arranged along the surface of the hard substrate 81 on the side opposite to the electronic component mounting surface, and the adhesive 15 is attached to the CCD 2 and the hard substrate 81.
It is fixed using.

The imaging cable 16 is connected to the second FPC
The hard substrate 81 is electrically connected to only the cable pad 10d (see FIG.
And the electronic components mounted on the hard substrate 81 are not connected.

According to the fifth embodiment, substantially the same effects as those of the above-described first to fourth embodiments can be obtained, and since the hard substrate is a single-sided substrate, it is necessary to form through holes and the like. Therefore, the rigid substrate can be easily reduced in size, and can be formed at low cost.

The present invention is not limited to the above-described embodiments, and it is needless to say that various modifications and applications can be made without departing from the gist of the invention.

[Appendix] According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.

(1) A flexible printed circuit board having a solid-state image sensor and connected to the solid-state image sensor, a hard board connected to the flexible printed circuit board for mounting electronic components, and the flexible printed circuit board And a signal cable connected to at least one portion of a connection portion provided on at least one of the hard substrates or a connection portion of an electronic component mounted on the hard substrate, respectively, on a back side of an imaging surface of the solid-state imaging device. In the imaging device to be provided, a connection portion between the flexible printed board and the hard substrate is provided on a hard substrate on a distal side with respect to the solid-state imaging device, and the signal is provided between the connection portion and the solid-state imaging device. An imaging device, comprising a cable connection portion.

(2) A solid-state image sensor, a flexible printed circuit board connected to the solid-state image sensor, a hard board having a connection portion with the flexible printed circuit board and mounting an electronic component, and an imaging cable are provided. In the imaging device, a connection portion with the flexible printed circuit board is provided on the hard substrate on a distal side with respect to the solid-state imaging device.

(3) A solid-state image pickup device, a flexible printed circuit board connected to the solid-state image pickup device, and a connection portion with the flexible printed circuit board, electronic parts are mounted, and a light-receiving surface of the solid-state image pickup device is mounted. In an imaging device having a rigid substrate disposed so that the longitudinal direction is perpendicular to the substrate and an imaging cable, the rigid substrate having a connection portion with the flexible printed circuit board located on a distal side with respect to the solid-state imaging device. An imaging device provided above.

(4) The imaging according to (2) or (3), wherein the hard board and the flexible printed board are connected via an electronic component mounted on the hard board. apparatus.

(5) A connection portion between the imaging cable and the flexible printed board and / or the hard board is provided between the connection portion between the hard board and the flexible printed board and the solid-state imaging device. (2), (3), or (4).

(6) The imaging device according to (5), wherein the connection portion between the imaging cable and the hard board is provided on an electronic component mounted on the hard board.

According to the invention described in Supplementary Note (1), Supplementary Note (2), Supplementary Note (3), Supplementary Note (4), Supplementary Note (5), or Supplementary Note (6), the size of the imaging device can be increased. Not
The flexible printed board and the hard board can be reliably connected.

[0099]

As described above, according to the imaging apparatus of the present invention, the flexible printed board and the hard board can be reliably connected without increasing the size.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view illustrating a configuration of an imaging device according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the flexible printed circuit board according to the first embodiment.

FIG. 3 is a bottom view showing the flexible printed circuit board according to the first embodiment.

FIG. 4 is a plan view showing a pattern surface of the hard substrate according to the first embodiment.

FIG. 5 is a bottom view showing the electronic component mounting surface of the hard substrate according to the first embodiment.

FIG. 6 is an exemplary perspective view showing the electronic endoscope according to the first embodiment;

FIG. 7 is a longitudinal sectional view showing an insertion portion of the electronic endoscope according to the first embodiment.

FIG. 8 is a cross-sectional view taken along the line AA of FIG. 7, showing a curved portion of the insertion portion of the first embodiment.

FIG. 9 is a longitudinal sectional view illustrating a main part of an imaging device according to a second embodiment of the present invention.

FIG. 10 is a longitudinal sectional view showing a main part of an imaging device according to a third embodiment of the present invention.

FIG. 11 is a longitudinal sectional view showing a main part of an imaging device according to a fourth embodiment of the present invention.

FIG. 12 is a longitudinal sectional view illustrating a main part of an imaging device according to a fifth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Image pick-up device 2 ... CCD (solid-state image sensor) 10 ... Flexible printed circuit board (FPC) 10d ... Cable pad 10f ... Outer lead 11 ... Hard board 11d ... FPC pad (connection part) 11g ... IC dummy pad 12 ... Chip capacitor (electronic component) 13 IC chip (electronic component) 16 imaging cable (signal cable) 71 chip resistor (electronic component) 72 transistor transistor (electronic component) 75 second flexible printed circuit board (second FP
C)

Claims (1)

[Claims] 1. A flexible printed circuit board having a solid-state image sensor, connected to the solid-state image sensor, a hard board connected to the flexible printed circuit board for mounting electronic components, and the flexible printed circuit board. A signal cable connected to at least one of a connection portion provided on at least one of the rigid substrates or a connection portion of an electronic component mounted on the rigid substrate, respectively, on a rear side of an imaging surface of the solid-state imaging device. In the imaging device to be provided, a connection portion between the flexible printed board and the hard substrate is provided on a hard substrate on a distal side with respect to the solid-state imaging device, and the signal cable is provided between the connection portion and the solid-state imaging device An image pickup apparatus, comprising: a connecting portion of (1).