JP4699741B2 - Endoscopic imaging device - Google Patents

Endoscopic imaging device Download PDF

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JP4699741B2
JP4699741B2 JP2004328252A JP2004328252A JP4699741B2 JP 4699741 B2 JP4699741 B2 JP 4699741B2 JP 2004328252 A JP2004328252 A JP 2004328252A JP 2004328252 A JP2004328252 A JP 2004328252A JP 4699741 B2 JP4699741 B2 JP 4699741B2
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circuit board
endoscope
electrode
electrodes
imaging device
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JP2006136488A (en
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逸司 南
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Fujifilm Corp
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Description

本発明は内視鏡用撮像装置、特に撮像装置が収納配置される内視鏡先端部を細径化及び短縮化することができる撮像素子と回路基板の接続構造に関する。   The present invention relates to an imaging device for an endoscope, and more particularly to a connection structure between an imaging element and a circuit board capable of reducing and shortening the distal end portion of an endoscope in which the imaging device is accommodated.

図７には、電子内視鏡先端部の細径化を図る従来の撮像装置の一構成例（特開２０００−１９４２７）が示されている。図７の撮像装置１では、対物光学系２の後側にプリズム３が設けられ、このプリズム３の下側に、カバーガラス４を介して固体撮像素子であるＣＣＤ５が配置される。このＣＣＤ５の撮像面（上面）の前端（先端側）及び後端には、電極ｋ１が設けられており、この電極ｋ１に接続され、かつカバーガラス４に挟まれる形でリード線６が取り付けられる。また、ＣＣＤ５の下側に、収納溝７ａを有する回路基板７が配置されており、この回路基板７には、上記リード線６を接続するための電極ｋ２と信号線接続のための電極ｋ３が設けられる。そして、上記ＣＣＤ５は、回路基板７の収納溝７ａに配置され、電極ｋ１とｋ２をリード線６で接続することにより、ＣＣＤ５が回路基板７に接続され、この回路基板７の電極ｋ３に信号線を接続することにより、ＣＣＤ５で得られた映像信号を取り出すことができる。 FIG. 7 shows a configuration example (Japanese Patent Laid-Open No. 2000-19427) of a conventional imaging device that reduces the diameter of the distal end portion of an electronic endoscope. In the imaging apparatus 1 of FIG. 7, a prism 3 is provided on the rear side of the objective optical system 2, and a CCD 5 that is a solid-state imaging device is disposed below the prism 3 through a cover glass 4. An electrode k 1 is provided at the front end (front end side) and rear end of the imaging surface (upper surface) of the CCD 5, and the lead wire 6 is connected to the electrode k 1 and sandwiched between the cover glasses 4. It is attached. Further, below the CCD 5, is arranged the circuit board 7 having a receiving groove 7a is, the electrode k for this the circuit board 7, the connecting electrodes k 2 and a signal line for connecting said lead wire 6 3 is provided. Then, the CCD 5 is disposed in the housing groove 7a of the circuit board 7, by connecting the electrodes k 1 and k 2 a lead wire 6, CCD 5 is connected to the circuit board 7, the electrode k 3 of the circuit board 7 By connecting the signal line to the video signal, the video signal obtained by the CCD 5 can be taken out.

図８には、図７の撮像装置１を配置した内視鏡先端部の構成が示されており、この先端部８には、上記撮像装置１の両側にライトガイド９ａ，９ｂが配置され、回路基板７の下側に処置具を被観察体内へ導入するための処置具挿通チャンネル１０が配置される。このような先端部８においては、図からも理解されるように、対物光学系２を含む撮像装置１の高さと処置具挿通チャンネル１０の直径を加えた長さで内視鏡の径（直径）Ｄ１が決まることになる。
特開２０００−１９４２７号公報 FIG. 8 shows the configuration of the endoscope tip portion in which the imaging device 1 of FIG. 7 is arranged, and light guides 9a and 9b are arranged on both sides of the imaging device 1 at the tip portion 8. A treatment instrument insertion channel 10 for introducing the treatment instrument into the body to be observed is disposed below the circuit board 7. As can be understood from the drawing, the distal end portion 8 has a length (diameter) of an endoscope having a length obtained by adding the height of the imaging device 1 including the objective optical system 2 and the diameter of the treatment instrument insertion channel 10. ) D 1 is determined.
JP 2000-19427 A

ところで、内視鏡先端部８の内視鏡軸方向の短縮化のために、上記ＣＣＤ５及び回路基板７の前後方向に配置されている電極ｋ１，ｋ２の存在に着目し、図６（Ａ）〜（Ｃ）のような構成の撮像装置１１が提案されている。即ち、図６の撮像装置１１のＣＣＤ１２では、前端側の電極部をなくして後端側へ全ての電極ｋ１を配置し、回路基板１３でも前方の電極部をなくして後方の電極部に上記電極ｋ１に対応した数の電極Ｋ２を設ける。これら電極ｋ１及びｋ２は、精密機械等でワイヤボンディンク接続（或いはテープオートメイテッド）されるので、信号線を接続する電極Ｋ３と比較すると、小さな面積の電極にすることができる。 By the way, in order to shorten the endoscope tip portion 8 in the endoscope axis direction, attention is paid to the presence of the electrodes k 1 and k 2 arranged in the front-rear direction of the CCD 5 and the circuit board 7, and FIG. An imaging apparatus 11 having a configuration as shown in A) to (C) has been proposed. That is, the rearward of the electrode portions by eliminating the front of the electrode portion in CCD 12, to place all of the electrodes k 1 by eliminating the electrode portion of the front side to the rear side, even the circuit board 13 of the imaging device 11 of FIG. 6 the number of electrodes K 2 corresponding to the electrode k 1 provided. Since these electrodes k 1 and k 2 are wire-bonded (or tape automated) with a precision machine or the like, the electrodes can have a smaller area than the electrode K 3 to which the signal line is connected.

そして、上記のＣＣＤ１２を回路基板１３の段差部に配置してボンディングワイヤ１５によって電極ｋ１とｋ２の接続を行い、カバーガラス１４を接着すれば、図６（Ｃ）のように組み立てられる。これによれば、図７で説明した撮像装置１と比較すると、前方の電極ｋ１，ｋ２を配置した電極部がなくなるので、この分の長さの短縮化を図ることが可能となる。 Then, place the CCD12 of the step portion of the circuit board 13 performs connection of the electrodes k 1 and k 2 by a bonding wire 15, if bonding the cover glass 14 are assembled as shown in FIG. 6 (C). According to this, as compared with the imaging device 1 described with reference to FIG. 7, there is no electrode part in which the front electrodes k 1 and k 2 are arranged, so that the length can be shortened.

しかし、図６の構成において、ＣＣＤ１２の一側面（後端面）及びこれに対応する回路基板１３の電極部に必要な数の電極（ｋ１，ｋ２）を配置できる場合はよいが、細径化するためのＣＣＤ１２及び回路基板１３の横幅との関係で必要な数の電極を配置することができない場合もある。 However, in the configuration of FIG. 6, it is good if the necessary number of electrodes (k 1 , k 2 ) can be arranged on one side surface (rear end surface) of the CCD 12 and the corresponding electrode portion of the circuit board 13. In some cases, a necessary number of electrodes cannot be arranged due to the relationship between the CCD 12 and the horizontal width of the circuit board 13.

また、内視鏡先端部の細径化を図るための要素として、上記回路基板７，１３の厚みに着目することができ、この回路基板７，１３の厚みをなくすことができれば、更なる細径化が可能である。   Further, as an element for reducing the diameter of the distal end portion of the endoscope, attention can be paid to the thickness of the circuit boards 7 and 13, and if the thickness of the circuit boards 7 and 13 can be eliminated, further thinning can be performed. Diameter can be reduced.

本発明は上記問題点に鑑みてなされたものであり、その目的は、内視鏡先端部の短縮化を促進することができ、また撮像素子用回路基板の厚みに着目した先端部の細径化が可能となる内視鏡用撮像装置を提供することにある。   The present invention has been made in view of the above-described problems, and the object thereof is to promote shortening of the endoscope distal end portion and to reduce the diameter of the distal end portion focusing on the thickness of the circuit board for the image sensor. An object of the present invention is to provide an imaging apparatus for an endoscope that can be made.

上記目的を達成するために、請求項１に係る発明は、上面が撮像面となり、被観察体を撮像する撮像素子体と、この撮像素子体が接続され、信号の入出力を行うための方形板の回路基板とを有し、内視鏡先端部内へ配置される内視鏡用撮像装置において、上記回路基板の内視鏡前方に位置する方形板側面の横幅及び厚みを上記撮像素子体の内視鏡後方に位置する側面と略同一にし、かつこれら撮像素子体及び回路基板のそれぞれの側面に電極を設け、上記回路基板の内視鏡前方の側面と上記撮像素子体の内視鏡後方の側面を合わせながら両方の電極を電気的に接続し、これら撮像素子体の側面と回路基板の側面は、接着剤を流し込むことにより固定することを特徴とする。 In order to achieve the above object, the invention according to claim 1 is characterized in that an upper surface is an imaging surface, and an imaging element body that images an object to be observed, and a square that is connected to the imaging element body and inputs and outputs signals. In an endoscope imaging device that is disposed in the distal end portion of an endoscope , the lateral width and thickness of the side surface of the rectangular plate located in front of the endoscope of the circuit board is determined. The side surfaces of the imaging device body and the circuit board are substantially the same as the side surfaces located behind the endoscope, and electrodes are provided on the side surfaces of the imaging device body and the circuit board. aspect electrically connecting both electrodes keying, side surfaces and circuitry substrate of the imaging device body, characterized by fixing by pouring the adhesive.

また、請求項２の発明に係る上記回路基板は、上面に信号線を接続する電極が設けられていることを特徴とする。
請求項３の発明は、上記撮像素子体の側面電極と上記回路基板の側面電極のいずれか一方を突起として形成したことを特徴とする。 The circuit board according to a second aspect of the invention is characterized in that an electrode for connecting a signal line is provided on the upper surface.
The invention of claim 3 is characterized in that either one of the side electrode of the image pickup element body and the side electrode of the circuit board is formed as a protrusion .

上記の構成によれば、側面に電極を設けることにより、撮像素子体と回路基板の上面の電極を減らすことができ、また例えば全ての電極を撮像素子後方の１側面に配置する場合は前方の電極部が不要となるので、撮像素子体及び回路基板の縦方向（内視鏡軸方向）の長さを短くすることができる。また、前方の電極部が必要なければ、撮像素子収納部をなくして回路基板の厚みを撮像素子に合わせることができ、回路基板の薄型化により内視鏡先端部の細径化を促進することが可能となる。   According to the above configuration, by providing the electrodes on the side surfaces, it is possible to reduce the number of electrodes on the upper surface of the image sensor body and the circuit board. For example, when all the electrodes are arranged on one side surface behind the image sensor, Since an electrode part becomes unnecessary, the length of the vertical direction (endoscope axial direction) of an image pick-up element body and a circuit board can be shortened. Moreover, if the front electrode part is not necessary, the thickness of the circuit board can be adjusted to the imaging element by eliminating the imaging element housing part, and the thinning of the circuit board promotes the reduction of the diameter of the endoscope tip part. Is possible.

本発明の内視鏡用撮像装置によれば、電極配置に着目した先端部の短縮化と、回路基板の厚みに着目した先端部の細径化が可能となる。   According to the endoscope imaging apparatus of the present invention, it is possible to shorten the tip portion paying attention to the electrode arrangement and to reduce the diameter of the tip portion paying attention to the thickness of the circuit board.

図１〜図３には、第１実施例に係る内視鏡用撮像装置の構成が示されており、図１（Ａ）は、撮像素子の前後の向きを図１（Ｂ）とは反対にしたものである。図１（Ａ）に示されるように、撮像装置２０の撮像素子体としてのＣＣＤ２１は上面が撮像面（斜線部）２１Ｓとなるが、このＣＣＤ２１の後方側面２１Ｒに、ＣＣＤ２１側の全ての側面電極（端子）Ｋ１が設けられる。そして、このＣＣＤ２１の撮像面２１Ｓを覆うようにカバーガラス２２が接着配置される（このカバーガラス２２は透視表示している）。 FIGS. 1 to 3 show the configuration of an endoscope imaging apparatus according to the first embodiment. FIG. 1A shows the front-back direction of the imaging device opposite to that shown in FIG. It is a thing. As shown in FIG. 1A, the upper surface of the CCD 21 as the imaging element body of the imaging device 20 is an imaging surface (shaded portion) 21S, and all the side electrodes on the CCD 21 side are formed on the rear side surface 21R of the CCD 21. (terminal) K 1 is provided. A cover glass 22 is adhered and disposed so as to cover the imaging surface 21S of the CCD 21 (the cover glass 22 is displayed in a transparent manner).

一方、図１（Ｂ）及び図２（Ｂ），（Ｃ）に示されるように、回路基板２４はＣＣＤ２１と横幅及び厚みが略同一となる方形の板であり、この前方（先端側）側面２４Ｆに、上記側面電極Ｋ１に接続するための側面電極Ｋ２（端子）が設けられる。この側面電極Ｋ２は、上記ＣＣＤ２１の側面２１Ｒを略同一形状の回路基板２４の側面２４Ｆに当接したとき、上記側面電極Ｋ１と対面する位置に配置される。また、この回路基板２４の上面に、信号線を接続するための電極Ｋ３が設けられ、この回路基板２４の下面には回路素子２５（図３）を配置することができる。 On the other hand, as shown in FIGS. 1 (B), 2 (B), and 2 (C), the circuit board 24 is a rectangular plate having substantially the same width and thickness as the CCD 21, and the front (tip side) side surface thereof. A side electrode K 2 (terminal) for connecting to the side electrode K 1 is provided on 24F. The side electrodes K 2, when in contact with the side surface 24F of the circuit board 24 having substantially the same shape side 21R of the CCD 21, is disposed at the position facing the said side electrodes K 1. Further, the upper surface of the circuit board 24 is provided with a electrode K 3 for connecting the signal line, the lower surface of the circuit board 24 can be arranged circuit elements 25 (Figure 3).

そして、図２（Ａ），（Ｂ）にも示されるように、上記ＣＣＤ２１と回路基板２４は、その左右側面及び上下面の位置を合わせて後方側面２１Ｒと前方側面２４Ｆを当接し、電極Ｋ１と電極Ｋ２を接続することにより、図１（Ｃ），図２（Ｃ）のように、一体の撮像装置２０として組み立てられる。この場合のＣＣＤ２１と回路基板２４との固定は、後方側面２１Ｒと前方側面２４Ｆの接着面の外周部に接着剤を流し込むことによって行うことができ、電極Ｋ１と電極Ｋ２の一方の各々を突起（凸部）として形成すると共に、他方の各々を凹部に形成し、突起と凹部を嵌合させた状態で後方側面２１Ｒと前方側面２４Ｆを接着剤で接着するようにしてもよい。また、バンプ方式を用いて熱、超音波、高周波等によって電極同士の接続を行うこともできる。 2A and 2B, the CCD 21 and the circuit board 24 are in contact with the rear side surface 21R and the front side surface 24F by aligning the left and right side surfaces and the upper and lower surfaces thereof, and the electrode K by connecting one electrode K 2, FIG. 1 (C), the as shown in FIG. 2 (C), the assembled as an imaging device 20 integrally. Fixing of the CCD21 and the circuit board 24 of this case can take place by pouring the adhesive in the outer peripheral part of the adhesive surface of the rear side 21R and the front side 24F, one each of the electrodes K 1 and the electrode K 2 While forming as a protrusion (convex part), each of the other may be formed in a recess, and the rear side surface 21R and the front side surface 24F may be bonded with an adhesive in a state where the protrusion and the recess are fitted. In addition, the electrodes can be connected to each other by heat, ultrasonic waves, high frequency or the like using a bump method.

図３には、上記の撮像装置２０を挿入配置した内視鏡先端部の構成が示されており、この先端部２６には、従来と同様に、上記撮像装置２０の両側にライトガイド９ａ，９ｂが配置され、ＣＣＤ２１及び回路基板２４の下側に処置具を被観察体内へ導入するための処置具挿通チャンネル１０が配置される。   FIG. 3 shows a configuration of an endoscope distal end portion in which the imaging device 20 is inserted and arranged. The distal end portion 26 has light guides 9a, 9b is disposed, and the treatment instrument insertion channel 10 for introducing the treatment instrument into the body to be observed is disposed below the CCD 21 and the circuit board 24.

このような第１実施例の構成によれば、従来と比較して撮像装置２０の前後方向（内視鏡軸方向に対応する）の長さの短縮化と、薄型化が図られる。即ち、図２（Ｂ）と図６及び図７との比較から分かるように、実施例では、ＣＣＤ２１上面の前方及び後方の電極（ｋ１）と、回路基板２４上面のＣＣＤ接続側電極（ｋ２）がないので、ＣＣＤ２１と回路基板２４の前後（縦）方向の長さが短くなり、この結果、撮像装置２０の全体の長さＬ３を、図７のＬ１，図６のＬ２よりも短くすることができる。 According to the configuration of the first embodiment as described above, the length of the imaging device 20 in the front-rear direction (corresponding to the endoscope axis direction) can be shortened and thinned as compared with the conventional example. That is, as can be seen from a comparison between FIG. 2B and FIGS. 6 and 7, in this embodiment, the front and rear electrodes (k 1 ) on the upper surface of the CCD 21 and the CCD connection side electrodes (k 1 ) on the upper surface of the circuit board 24 are used. since there is no 2), the shorter the longitudinal (vertical) length of the CCD21 and the circuit board 24, as a result, the overall length L 3 of the imaging device 20, L 1 in FIG. 7, L 2 in FIG. 6 Can be shorter.

また、図３と図８との比較から分かるように、図８ではＣＣＤ４の下側に回路基板７の一部が存在するのに対して、図３ではＣＣＤ２１の下側に回路基板２４が配置されないので、その分、先端部２６の径（直径）Ｄ２は先端部８の径Ｄ１よりも小さくなる。 As can be seen from a comparison between FIG. 3 and FIG. 8, in FIG. 8, a part of the circuit board 7 exists below the CCD 4, whereas in FIG. 3, the circuit board 24 is arranged below the CCD 21. because it is not, correspondingly, the diameter (diameter) D 2 of the front end portion 26 is smaller than the diameter D 1 of the tip 8.

図４及び図５には、上面電極と側面電極を用いた第２実施例の撮像装置の構成が示されている。図４に示されるように、撮像装置２８のＣＣＤ２９には、その後端上面に電極ｋ１を設けると共に後方側面２９Ｒに１つの電極Ｋ１（複数の電極でもよい）を設け、回路基板３０にも、その前端上面に電極ｋ２を設けると共に前方側面３０Ｆに１つの電極Ｋ２を設ける。その他の構成は、第１実施例と同様となる。 4 and 5 show the configuration of the image pickup apparatus according to the second embodiment using the upper surface electrode and the side surface electrode. As shown in FIG. 4, the CCD 29 of the imaging device 28 is provided with an electrode k 1 on the upper surface of the rear end thereof and one electrode K 1 (may be a plurality of electrodes) on the rear side surface 29 R. , it provided one electrode K 2 on the front side face 30F provided with the electrodes k 2 at its front end upper surface. Other configurations are the same as those of the first embodiment.

このような第２実施例では、図５に示されるように、両方の側面２９Ｒと３０Ｆを合わせ電極Ｋ１とＫ２を接触させた状態として、上面の電極ｋ１とｋ２をリード線３１で接続する。上記の電極Ｋ１とＫ２は、例えばφ−ＶＳＵＢ信号線の接続電極として用いることができる。 In such a second embodiment, as shown in FIG. 5, the electrodes K 1 and k 2 on the upper surface are connected to the lead wire 31 with the side surfaces 29R and 30F being brought into contact with each other and the electrodes K 1 and K 2 being in contact with each other. Connect with. Electrodes K 1 and K 2 described above can be used as a connection electrode for example phi-VSUB signal line.

この第２実施例の構成は、ＣＣＤ２９及び回路基板３０の横幅に必要な数の電極を配置できない場合に有効であり、上面電極ｋ１，ｋ２に加えて側面電極Ｋ１，Ｋ２を設けることで、必要な数の電極を配置し、従来（図７）の前方に設けられていた回路基板（７）の電極部（ｋ２）をなくすことができる。これによっても、先端部の短縮化、細径化を達成することができる。 The configuration of the second embodiment is effective when the necessary number of electrodes cannot be arranged in the lateral width of the CCD 29 and the circuit board 30, and side electrodes K 1 and K 2 are provided in addition to the upper surface electrodes k 1 and k 2. Thus, the necessary number of electrodes can be arranged, and the electrode portion (k 2 ) of the circuit board (7) provided in front of the conventional device (FIG. 7) can be eliminated. This also makes it possible to shorten the tip and reduce the diameter.

本発明の第１実施例に係る内視鏡用撮像装置の構成を示す斜視図で、図（Ａ）は撮像素子及びカバーガラスの図（他の図とは前後の向きが逆となる）、図（Ｂ）は撮像素子と回路基板の接続前の図、図（Ｃ）は撮像素子と回路基板の接続後の図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the structure of the imaging device for endoscopes which concerns on 1st Example of this invention, A figure (A) is a figure of an image pick-up element and a cover glass (the direction of front and back becomes reverse with other figures), FIG. 2B is a diagram before the connection between the image sensor and the circuit board, and FIG. 2C is a diagram after the connection between the image sensor and the circuit board. 第１実施例に係る内視鏡用撮像装置の構成を示し、図（Ａ）は撮像素子と回路基板の接続前の上面図、図（Ｂ）は撮像素子と回路基板の接続後の上面図、図（Ｃ）は接続後の側面図である。1 shows a configuration of an endoscope imaging apparatus according to a first embodiment, in which FIG. (A) is a top view before connection of an image sensor and a circuit board, and FIG. (B) is a top view after connection of the image sensor and a circuit board. (C) is a side view after connection. 第１実施例の撮像装置を内視鏡先端部内へ配置したときの正面断面図である。It is front sectional drawing when the imaging device of 1st Example is arrange | positioned in an endoscope front-end | tip part. 第２実施例の撮像装置の構成を示す斜視図である。It is a perspective view which shows the structure of the imaging device of 2nd Example. 第２実施例の接続部の構成を示す断面図である。It is sectional drawing which shows the structure of the connection part of 2nd Example. 提案の撮像装置の構成を示し、図（Ａ）は撮像素子と回路基板の接続前の上面図、図（Ｂ）は撮像素子と回路基板の接続後の上面図、図（Ｃ）は接続後の側面図である。The configuration of the proposed imaging apparatus is shown, in which FIG. (A) is a top view before the image sensor and the circuit board are connected, FIG. (B) is a top view after the image sensor and the circuit board are connected, and FIG. FIG. 従来の撮像装置の構成を示す斜視図で、図（Ａ）は対物光学系及びプリズムの図、図（Ｂ）は撮像素子及び回路基板の図、図（Ｃ）は回路基板の図である。1A and 1B are perspective views illustrating a configuration of a conventional imaging device, in which FIG. 1A is a diagram of an objective optical system and a prism, FIG. 1B is a diagram of an imaging device and a circuit board, and FIG. 図７の撮像装置を内視鏡先端部内へ配置したときの正面断面図である。It is front sectional drawing when the imaging device of FIG. 7 is arrange | positioned in an endoscope front-end | tip part.

符号の説明Explanation of symbols

１，１１，２０，２８…撮像装置、
４，１４，２２…カバーガラス、
５，１２，２１，２９…ＣＣＤ、
７，１３，２４，３０…回路基板、 ８，２６…先端部、
ｋ１，ｋ２，ｋ３，Ｋ３…電極、 Ｋ１，Ｋ２…側面電極。 1, 11, 20, 28 ... imaging device,
4, 14, 22 ... cover glass,
5, 12, 21, 29 ... CCD,
7, 13, 24, 30 ... circuit board, 8, 26 ... tip,
k 1 , k 2 , k 3 , K 3 ... electrode, K 1 , K 2 .

Claims (3)

上面が撮像面となり、被観察体を撮像する撮像素子体と、この撮像素子体が接続され、信号の入出力を行うための方形板の回路基板とを有し、内視鏡先端部内へ配置される内視鏡用撮像装置において、
上記回路基板の内視鏡前方に位置する方形板側面の横幅及び厚みを上記撮像素子体の内視鏡後方に位置する側面と略同一にし、かつこれら撮像素子体及び回路基板のそれぞれの側面に電極を設け、
上記回路基板の内視鏡前方の側面と上記撮像素子体の内視鏡後方の側面を合わせながら両方の電極を電気的に接続し、これら撮像素子体の側面と回路基板の側面は、接着剤を流し込むことにより固定することを特徴とする内視鏡用撮像装置。 The upper surface is an imaging surface, and has an imaging element body that images the object to be observed, and a circuit board that is connected to the imaging element body and has a rectangular plate for inputting and outputting signals. In the endoscope imaging device,
The lateral width and thickness of the side surface of the rectangular plate located in front of the endoscope of the circuit board are made substantially the same as the side face of the imaging element body located behind the endoscope, and on the respective side surfaces of the imaging element body and the circuit board. Provide electrodes,
The circuit board to both electrodes keying endoscopic posterior aspect of endoscope front side and the image pickup device body is electrically connected to, side surfaces and circuitry substrate of the imaging device body, An endoscope imaging apparatus, which is fixed by pouring an adhesive. 上記回路基板は、上面に信号線を接続する電極が設けられていることを特徴とする請求項１記載の内視鏡用撮像装置。   2. The endoscope imaging apparatus according to claim 1, wherein the circuit board is provided with an electrode for connecting a signal line on an upper surface thereof. 上記撮像素子体の側面電極と上記回路基板の側面電極のいずれか一方を突起として形成したことを特徴とする請求項１又は２記載の内視鏡用撮像装置。   3. The endoscope imaging apparatus according to claim 1, wherein one of the side electrode of the imaging element body and the side electrode of the circuit board is formed as a protrusion.
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