JPH1050969A - Solid-state image sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image sensor which can be provided with good flare stop function while reducing the size. SOLUTION: A light receiving face 25 is formed in the center on the surface of a solid-state image sensor and lands 26 are arranged on the opposite sides thereof. The land 26 is connected through a bump 27 with the inner lead 28c of a TAB tape 28 connected, on the other end thereof, with an outer lead 24 through a conductor 23 which is connected through a bump with a TAB tape outer lead 28d. The inner lead 28c is covered with a TAB tape base film 28a and an opening 28e of substantially same shape as the light receiving face 25 is made thus providing a field stop function for determining the field of view of the light receiving face and a flare stop function for preventing flare due to random reflection at the end part of the inner lead 28c. Since the flare stop can be formed of the TAB tape 28, the size can be reduced and the opening 28e can be aligned accurately through alignment of the TAB tape 28 and a good flare stop function is realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a solid-state imaging device having a function of preventing the incidence of flare light.

[0002]

2. Description of the Related Art For miniaturization of a solid-state imaging device (or a solid-state imaging device), for example, in a video camera, it is desired to reduce the size and weight of the camera for the purpose of reducing operator fatigue, good handling, good storage, and the like. . In addition, miniaturization of inspection devices, monitoring cameras, and the like for observing the inside of a narrow portion is desired.

In medical endoscopes and the like, the operability of the operator can be improved by reducing the size of the image pickup unit to reduce the size of the insertion section itself and the distal end portion of the endoscope. And significant efficiency in reducing patient fatigue.

In a conventional solid-state imaging device, a solid-state imaging device chip is die-bonded to a ceramic base having external leads for mounting the solid-state imaging device chip, and a pad provided on the ceramic base and electrically connected to the external leads is provided. In this case, the pads of the solid-state imaging device chip were connected by wire bonding and sealed with a resin cover. However, the ceramic base was large and the solid-state imaging device was large.

Therefore, in order to further reduce the size, it is necessary to reduce the size of the package of the solid-state imaging device. For this purpose, there is a solid-state imaging device 40 having a structure as shown in FIG.

In the solid-state imaging device 40, a back surface of a solid-state imaging device chip 42 is die-bonded on a ceramic base 41. External leads 44 electrically connected to the conductor 43 are attached to the rear surface of the ceramic base 41 so as to protrude.

A light receiving surface 42a is provided at the center of the surface of the solid-state image sensor chip 42, and a plurality of lands 42b are provided on both sides of the light receiving surface 42a.

Each land 42b is connected to Ta via bumps 47a.
pe Automated Bonding (abbreviated as TAB) tape 48 is connected. In other words, this TAB tape 48
Tape base film 48a and TAB tape conductor 48b
And a TA protruding from the TAB tape base film 48a in the TAB tape conductor 48b.
B tape inner lead 48c is solid-state image sensor chip 42
Are electrically connected to the lands 42b of the lands 42 via bumps 47a.

The TAB tape 48 is disposed along insulating tapes 49 provided on both sides of the solid-state image sensor chip 42 and the ceramic base 41, and the TAB tape inner leads 48c are bent in an L-shape toward the front side. ing. TAB tape conductor 4 electrically connected to each TAB tape inner lead 48c on the side surface of the ceramic base 41
8b is the TAB tape outer lead 48d having the conductor 43
Is electrically connected to one end by a bump 47b. The other end of the conductor 43 is connected to an external lead 44.

Thus, each land 42b is electrically connected to the external lead 44 via the TAB tape 48. The insulating tape 49 prevents the TAB tape conductor 48b from short-circuiting due to unintended contact with the solid-state imaging device chip 42.

A cover glass 50 is attached to face the light receiving surface 42a.
A flare stop 46 for preventing flare is provided between the tape inner lead 48c. Further, the bump connection portion and the like are sealed with a sealing resin 45.

Further, as disclosed in Japanese Patent Application Laid-Open No. 61-131690, a solid-state image sensor chip is connected to a chip carrier provided on a ceramic base by bump connection, a cover glass is provided on the incident side, and resin sealing is performed. Was.

[0013]

However, Japanese Patent Application Laid-Open No.
No. 131690, a chip carrier is used, and as shown in FIG.
In the case of connection using a bump near the same surface as the light receiving surface such as the one using 8c, the lead end surface approaches the light receiving surface, and flare occurs due to out-of-field light or irregular reflection of light reflected from the chip surface. I do.

For this reason, a flare mask is formed by tapering the ceramic base as described in the above publication, a flare stop 46 is separately provided as shown in FIG. Was.

In the case where the lead connected to the solid-state imaging device chip 42 by bump connection and the flare prevention member are formed separately as in the conventional example, the alignment accuracy between the solid-state imaging device chip 42 and the flare prevention member is poor. However, the size of the package was increased due to the adjustment margin.

Further, in the case of the above publication, since the flare preventing member is made of ceramic, there is a disadvantage that the thickness is large and the solid-state imaging device becomes large in the thickness direction. Further, in the case of a mask in which the back surface of the cover glass is black-treated, the size in the thickness direction can be reduced. However, as in the case of a separate flare prevention member, the alignment accuracy with the solid-state imaging device chip 42 is poor, and the flare prevention function is not provided. It was difficult to fully demonstrate it.

(Purpose of the Invention) The present invention has been made in view of the above points, and has as its object to provide a solid-state imaging device having good flare resistance and realizing miniaturization.

[0018]

[MEANS FOR SOLVING THE PROBLEMS] The inner lead is set to TAB.
Cover with the base film of the tape, and make the light-receiving side end of the base film protrude from the inner lead,
The base film prevents flare of the inner lead.

The base film of the TAB tape prevents flare due to light outside the field of view at the inner lead end or irregular reflection of unintended reflected light from the TAB tape, thereby realizing miniaturization and highly accurate positioning. A good flare prevention function can be secured, and the assemblability has also been improved.

[0020]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. (First Embodiment) FIG. 2 shows an endoscope apparatus 2 provided with an electronic endoscope 1 incorporating the first embodiment. The endoscope device 2 includes an electronic endoscope 1 having a built-in solid-state imaging device 3A according to the first embodiment, a control device 4 as a peripheral device to which the electronic endoscope 1 is connected, and a control device And a color monitor 5 for displaying a video signal output from the color monitor 4.

The electronic endoscope 1 has an elongated insertion section 6, an operation section 7 provided at the base end of the insertion section 6, and a universal cord 8 extended from the operation section 7. A connector 9 is provided at an end of the cord 8, and can be detachably connected to the control device 4.

The insertion portion 6 is formed of a hard tip portion 11, a bendable portion 12 formed adjacent to the rear end of the tip portion 11, and a front end of the operating portion 7 from the rear end of the bend portion 12. And a flexible portion 13 extending in the direction. A light guide (not shown) is inserted into the insertion portion 6, the operation portion 7, and the universal cord 8, and illumination light is supplied from a light source (not shown) inside the control device 4 by connecting the connector 9 to the control device 4. Transmitted by the guide, the tip component 1
The light is emitted from the distal end surface fixed to one illumination window, and illuminates a subject such as an affected part.

The illuminated subject is attached to an observation window formed adjacent to the illumination window, and forms an optical image on a solid-state imaging device 3A disposed at the image forming position by an objective lens 15 forming an imaging unit 14. .

This optical image is photoelectrically converted to an electric signal. The solid-state imaging device 3A is connected to a signal processing circuit unit (not shown) in the control device 4 by a signal cable 17, and an output signal of the solid-state imaging device 3A is signal-processed and converted into a standard video signal. A subject image captured by the solid-state imaging device 3A, that is, an endoscope image is displayed.

The imaging unit 14 includes an objective lens 15 and a solid-state imaging device 3A.
The lens frame 18 is fixed to the observation window of the distal end component 11 by 8 and is connected to a solid-state imaging device frame 19 to which the solid-state imaging device 3A is attached. Next, the configuration of the solid-state imaging device 3A according to the first embodiment will be described with reference to FIG. FIG.
1A shows a cross-sectional view of the solid-state imaging device 3A, and FIG.
1 shows a view as viewed from the direction indicated by the arrow A in FIG.

The solid-state imaging device 3A has a ceramic base 21
The back surface of the solid-state imaging device chip 22 is die-bonded. On the rear surface of the ceramic base 21, an external lead 24 electrically connected to a conductor 23 bent in an L-shape on the side surface is attached so as to project from the rear surface by brazing or the like.

As shown in FIG. 1B, the solid-state image pickup device chip 22 has a rectangular plate shape like the ceramic base 21 and has, for example, a square light receiving surface 25 at the center of the surface. A plurality of lands 26 are provided in parallel on the longitudinal side portions (left and right portions in FIG. 1) on both sides of the lands 26.

Each land 26 is connected to a TAB via a bump 27.
It is connected to a tape 28. That is, the TAB tape 28 has an insulating property, a flexible TAB tape base film 28a and a TA
And a TAB tape inner conductor 2b formed of the TAB tape conductor 28b.
8c is the land 26 and the bump 2 of the solid-state image sensor chip 22.
7 and are mechanically fixed.

The TAB tape 28 is bent in an L-shape along an insulating tape 29 provided on both side surfaces of the solid-state image pickup device chip 22 and the ceramic base 21, and each TAB tape inner lead is formed on the side surface of the ceramic base 21. TAB tape conductor 28 conducting to 28c
b, the TAB tape outer lead 28d is electrically connected to one end of the conductor 23 by a bump 31 and is mechanically fixed. The other end of the conductor 23 is connected to an external lead 24.

Thus, each land 26 is electrically connected to the external lead 24 via the TAB tape 28. The insulating tape 29 prevents short circuit due to unintended contact of the TAB tape conductor 28b with the solid-state imaging device chip 22.

The TAB tape base film 28a is made of TA
It is the base of the B tape 28. In the conventional example,
As shown in FIG. 16, TAB tape inner lead 48c is TAB
Although formed so as to be exposed from the tape base film 48a, this embodiment is characterized in that a TAB tape base film opening 28e is provided by the TAB tape base film 28a as shown in FIG. Has become.

This TAB tape base film opening 2
8e is a square opening slightly larger than the light receiving surface 25, and is provided so as to cover the periphery of the light receiving surface 25 so that the light incident through the cover glass 32 reaches the light receiving surface 25. I have. That is, it has the function of a field mask that determines the field of view of the light receiving surface.

The TAB tape inner lead 28c is not exposed to the TAB tape base film opening 28e. That is, the TAB tape base film opening 28e has a function of masking unnecessary light from entering the light receiving surface 25 and also covers the TAB tape inner lead 28c with the TAB tape base film 28c provided around the light receiving surface 25. Accordingly, the light receiving surface 25 has a function of preventing flare, which also has a function of preventing light or the like that is irregularly reflected when light strikes the end of the TAB tape inner lead 28c.

The TAB tape inner lead 28c is connected to the land 26 by bump connection, and then the TAB tape 28
Is bent and the TAB tape outer lead 28d is connected to the conductor 2
3 is bump-connected. After that, in order to protect the light receiving surface 25, the cover glass 32 faces the light receiving surface 25.
And solid-state imaging device 3A of the first embodiment is completed by integrally molding with sealing resin 33.

This embodiment has the following effects. TA
When the B tape inner lead 28c is bump-connected, it is positioned with the land 26. At this time, since the position of the TAB tape base film opening 28e can be determined at the same time, the positioning of the TAB tape inner lead 28c and the TAB tape The position of the base film opening 28e can be adjusted at one time, and the solid-state imaging device 3A having good assemblability, low cost, and excellent flare prevention function can be realized.

Further, the TAB tape inner lead 28c and the TAB tape opening 28e are
Since the tape 28 can be manufactured with high accuracy, the positioning of the TAB tape base film opening 28e can be performed with high accuracy for bump connection.

Further, since the mask for preventing flare is formed by the TAB tape 28, the mask can be formed more simply and thinly than in the conventional example using ceramics. Accordingly, it is possible to provide a small solid-state imaging device 3A having at least a small thickness direction, and to reduce the size of an imaging device such as the imaging unit 14 using the solid-state imaging device 3A.

Further, the package can be made smaller than the conventional example using a separate flare preventing member, and the package can be made smaller as well. Also, the thickness is about the same as that of the back side of the cover glass, and it can be easily manufactured (has good assemblability) and can be positioned with higher precision than that of the black side. Can be realized.

On the other hand, application to the endoscope apparatus 2 has the following effects. Since the solid-state imaging device 3A can be reduced in size, the imaging unit 14 can be reduced in size, and the insertion portion 6, especially the distal end portion 11, can be made thinner, and the length of the hard portion can be made shorter. Therefore, the pain of the patient can be reduced.

Because the size of the imaging unit 14 can be reduced, the insertion portion 6 and the distal end configuration portion 11 are of a practical thickness even though the forceps channel is not shown in the figure or is provided with a plurality of channels or a water supply function is provided. It can be realized in Therefore, the operator's operability and treatment ability are improved.

(Second Embodiment) FIG. 3 shows a video camera 36 having a second embodiment. The video camera 36 includes an objective lens system 38 and a solid-state imaging device 3B according to the second embodiment, which are arranged at an image forming position on a camera body 37.
And a signal processing circuit 3 connected to the solid-state imaging device 3B.
9 is provided.

FIG. 4 shows a solid-state imaging device 3 according to the second embodiment.
3 shows a part of B. The solid-state imaging device 3B is the same as the solid-state imaging device 3A shown in FIG. 1, except that the end of the TAB tape base film 28a forming the TAB tape base film opening 28e is an oblique end 28f, and the TAB tape base film 28a is black, which has a high light-shielding function.

The other configuration is the same as that of the first embodiment. It has almost the same operation and effect as the first embodiment. Further, by applying the solid-state imaging device 3B to the video camera 36, the video camera 36 can be reduced in size, and the handling property is improved.

(Third Embodiment) FIG. 5 shows a main part of a solid-state imaging device 3C according to a third embodiment of the present invention. In this embodiment, for example, in FIG. 1, the TAB tape 28 is provided with a groove 28g at a position where it can be bent as shown in FIG.
Easy to bend.

Then, by bending at the position of the groove 28, T
By attaching the AB tape 28, the solid-state imaging device 3C according to the third embodiment can be assembled as shown in FIG.

This embodiment has the following effects. 1. Easy to bend and easy to assemble. 2. Since the bending position can be accurately formed as a groove by etching in advance, accurate positioning can be achieved. Therefore, accuracy is improved and quality is stabilized. The other effects are the same as those of the first embodiment.

(Fourth Embodiment) FIG. 7 shows a fourth embodiment of the present invention.
The solid-state imaging device 3D according to the embodiment is shown. FIG. 7A shows a front view of the solid-state imaging device 3D, and FIG.
The JJ line section of (A) is shown.

In the solid-state imaging device 3A of the first embodiment shown in FIG. 1, the TAB tape base film 28a of the TAB tape 28 is a TAB tape inner lead 28c.
Is formed so as to not only cover the light receiving surface 25, but also to form an opening 28e that covers the periphery of the light receiving surface 25. In the solid-state imaging device 3D of the present embodiment, a part of the TAB tape base film 28a is projected. A TAB tape base film end 28h that covers the TAB tape inner lead 28c is provided.

That is, the TAB tape inner leads 28c formed of the TAB tape conductors 28b are extended upward along the side surfaces on both sides of the solid-state image pickup device chip 22, are bent along the surface, and are landed on the surface. 26 are electrically connected to each other by bumps 27 and are mechanically fixed.

The TAB tape base film to which the TAB tape conductor 28b is adhered also has the TAB tape inner lead 28c at the end where the TAB tape inner lead 28c extends (the upper end in FIG. 7). A TAB tape base film end 28h is provided so as to extend to the upper side so as not to be exposed, and the TAB is extended along the surface.
It is bent together with the tape inner lead 28c.

Then, as shown in FIG.
Each of the tape inner leads 28c is covered with a TAB tape base film end 28h. Therefore, TAB
A situation in which light is reflected by the end of the tape inner lead 28c on the light receiving surface 25 side and incident on the light receiving surface 25 can be eliminated.

Since other structures are the same as those in FIG. 1, the same members are denoted by the same reference numerals and description thereof will be omitted. According to the present embodiment, it is possible to eliminate a situation in which light is reflected by at least the end of the TAB tape inner lead 28c on the light receiving surface 25 side and is incident on the light receiving surface 25.

In FIG. 7, the TAB tape inner leads 28c are each a TAB tape base film end 28.
h, the plurality of TAB tape inner leads 28c may be collectively covered with a smaller number of TAB tape base film ends 28h.

Next, an embodiment of an image pickup apparatus capable of making the length shorter than that of the conventional example shown in FIG. 17 will be described with reference to FIG. FIG. 8A shows a vertical cross section of the imaging device, and FIG.
Shows a cross section taken along line CC in FIG. The imaging device 51A shown in FIG. 8 is different from the imaging device 51B of the conventional example shown in FIG. 17 in that the mounting of the chip capacitor 58 is basically changed to shorten the length of the imaging device 51A.

That is, in the image pickup device 51A of the present embodiment, as shown in FIG. 17, the chip capacitor 58 has a long axis 58a not between the external leads 55d arranged in the direction of the long axis 55e of the solid-state image sensor 55. As shown in FIG. 8B, the substrate 57 is formed by connecting the chip capacitors 58 between the external leads 55d adjacent to each other in the short axis direction of the solid-state imaging device 55 so that the long axis 58a thereof is oriented.
Can be arranged closer to the solid-state imaging device 55 side, and the length of the imaging device 51A is shortened.

FIG. 9 shows the structure of the solid-state image sensor 55 in this case.
It is shown in (A). The solid-state imaging device base 55a includes three substrates 63a, 63b, and 63c. Each bonding pad 55f of the solid-state imaging device chip 55b is connected to a bonding pad 65a of the substrate 63a by a bonding wire 64.
The bonding pad 65a is connected to the substrate 63
a through the through hole 65b of the pad 63 of the substrate 63b.
5c, and the pad 65c is connected to the through hole 65c.
The pad 65e of the substrate 63c is connected to the external lead 55d on the back surface of the substrate 63c through a pattern 65f and the like.

FIG. 9B shows the arrangement of the bonding pads 55f of the solid-state image sensor chip 55a as viewed from the back side of the solid-state image sensor base 55a, and the connection with the external leads 55d by the pattern 65f and the like.

For comparison, in the case of the conventional example shown in FIG.
FIG. 9C shows the arrangement of 5f and the connection to the external lead 55d by the pattern 65f and the like. Other configurations of the imaging device 51A shown in FIG.
Has the same configuration as the conventional example shown in FIG.

According to the imaging device 51A of the present embodiment,
A chip capacitor 58 as an electronic component is provided with two external leads 55 whose longitudinal direction or long axis 58a is arranged in the short axis direction (perpendicular to the long axis 55e) of the solid-state imaging device 55.
Since the connection density is increased, the mounting density is increased so that the substrate 57 on which the electronic components are mounted can be arranged closer to the back surface of the solid-state imaging device 55, so that the optical axis is higher than that of the conventional imaging device 51B. This realizes an imaging device 51A that can reduce the length in the direction.

Therefore, the imaging device 51A of the present embodiment has the following effects. 1. The operability is improved because the length of the imaging device 51A can be shortened. 2. For example, when used in an endoscope, the pain of the patient can be reduced, and an accident that damages the body cavity wall can be prevented.

Next, an imaging device which can be made smaller than the conventional example shown in FIG. 18 will be described with reference to FIG. As shown in FIG. 10, in the imaging device 96A of the present embodiment, external leads 68a are previously attached to the substrate 68 with a solder having a higher melting point than solder, and are assembled into a set. The configuration is such that the solder 70 is attached to the conductor portion on the back surface of 66b.

According to this configuration, as shown in FIG. 10, the length D2 of the connection portion of the external lead 68a with the substrate 68 can be shortened, and the external lead 68a can be manufactured in-house (the assembly maker of the solid-state imaging device 66A). Therefore, the pitch of the external leads 68a can be reduced and the accuracy can be improved. The length D2 is the length D of the conventional example shown in FIG.
Since it is shorter than 1, the length of the imaging device 96A in the optical axis direction can be shortened.

The reason why the length D2 is shorter than the length D1 is as follows.
This is because the external lead 68a is attached to the substrate 68 in advance by a member, so that it is not necessary to take a large amount of attachment margin. Other configurations are the same as those in FIG.

FIG. 11 shows a state where the solid-state imaging device 66 is attached to the check jig 72 at the time of assembly. Since the solid-state image sensor base 66b is not provided with the external lead 68a in advance, it is electrically connected to the conductor on the back surface of the solid-state image sensor base 66a at the check terminal 72a by the socket 72, and is mechanically accurate by the holding member 72b. Well fixed. Therefore, the accuracy when the color filter array of the cover glass 66c and the pixels of the solid-state image sensor chip 66a are aligned (position or inclination) is improved.

The imaging device 96A of this embodiment has the following effects. 1. The accuracy of the external leads 68a is improved, and the pitch can be reduced. 2. The mounting of the external lead 68a can be performed by the assembly maker of the imaging device 96A, so that assembly and quality control are facilitated.

3. The positioning accuracy of the cover glass 66c and the solid-state image sensor chip 66b is improved, and high-quality assembly is facilitated.

As described with reference to FIG. 18, in the conventional imaging device 96B, the solid-state imaging device 66 and the substrate 68 are connected by an external lead such as an external lead 66d. The mounting margin to the element 66 and the substrate 68 is large, and the image pickup device 96B is large. For this reason, in the present embodiment, an imaging device 75 that can be downsized with a structure as shown in FIG.

In this imaging device 75, a solid-state image sensor 76 includes a solid-state image sensor base 76a, a solid-state image sensor chip 76b,
The solid-state imaging device base 76a is formed of a plurality of triangular grooves formed at appropriate intervals along the ridge, as shown in FIG. A notch is formed so that the electrode 77a is exposed in the notch.

The capacitor 78a, the sealing resin 78b
A plurality of triangular grooves are formed in the ridge formed by the end face and the upper face of the solid-state imaging device base 76a on the substrate 78 on which the electronic component sealed by the electrodes 78c is formed. Is provided so as to be exposed.

Then, the two cutouts are aligned and 1
The four-sided pyramid-shaped concave portion has a structure in which electrodes 77a and 78c adjacent in the concave portion are connected by a bump 79 that can be accommodated in the concave portion. Further, the core wire 80b of the signal line 80a of the signal cable 80 can also be connected to the electrode 77a of the solid-state imaging device base 76a by the solder 81.

According to the imaging device 75 of the present embodiment, the mounting margin can be significantly reduced because the imaging device 75 is connected to the substrate 78 by the bump 79. Also, the bump 79 does not protrude. Wiring between the solid-state imaging device 76 and the substrate 78 can be performed in one step.

Further, since the core wire 80b of the signal line 80a can be directly connected to the core wire 80b with the solder 81 without using the external lead projecting from the back surface of the solid-state image pickup device base 76a, the space of the portion where the external lead projects can be reduced. Since it can be used for mounting components, the size can be further reduced.

The imaging device 75 of the present embodiment has the following effects. 1. Since the mounting margin is small and the bump 79 does not protrude, the imaging device 75 can be reduced in size and the operability is improved. For example, when the imaging device 75 is built in the distal end component of the endoscope, the pain of the patient is reduced. It can reduce and prevent accidents that may hurt the body wall.

2. Because wiring can be performed in one process (conventionally,
(2 steps of solid-state imaging device and external lead, substrate and external lead) can be simplified, and cost down, accuracy and quality can be improved.

Next, an image pickup apparatus having external leads which are hardly bent in the horizontal direction and are easily bent in the vertical direction will be described.
In the imaging device 85 of the present embodiment illustrated in FIG.
The solid-state image sensor 86 includes a solid-state image sensor base 86a, a solid-state image sensor chip 86b, and a cover glass 86c. An external lead 87 projects in an L shape on the back surface of the solid-state image sensor base 86a. Of the external lead 87 and the land 88 of the substrate 88
b (see FIG. 14B) by solder 90.

An electronic component sealed with a sealing resin 88a is mounted on the substrate 88. In the present embodiment, the external lead 87 is a cross section taken along the line DD of FIG.
The cross section is semicircular as shown in FIG.

On the other hand, in the conventional example, the cross section of the external lead is
It was rectangular or circular. If it is rectangular, it is difficult to form a fillet at the time of soldering, and if it is circular, there is no directionality in bending strength when bending the lead.

On the other hand, as described above, the external leads 87
Is formed in a semicircular shape, so that the land 8 of the substrate 88 can be formed.
8b or fillet 9 for conductor 89b of signal cable 89
In addition, it is possible to provide the external lead 87 that can be sufficiently secured in the horizontal direction H and is easy to bend in the vertical direction G as shown in FIG. That is, in order to align with the land 88b of the substrate 88 in the horizontal direction,
It is better to bend less in this direction, and it is more convenient to bend in the up and down direction so that it can be easily connected to the substrate 88 or the core wire 89b of the signal line 89a.

The imaging device 85 of the present embodiment has the following effects. 1. Since the fillet 90a is reliable, the reliability of soldering is improved. 2. By making the external lead 87 easy to bend in the desired direction and difficult to bend in the direction not desired, the molding is easy and the accuracy is improved.

The embodiments formed by partially combining the above-described embodiments and the like also belong to the present invention.

[Supplementary Notes] A solid-state imaging device chip having a land portion provided on the same side as the light receiving surface; a TAB tape having inner leads electrically connected to the land portion; and a cover arranged to face the light receiving surface In a solid-state imaging device having glass, the TAB tape is provided with an opening to allow light rays incident on the light receiving surface to pass therethrough, in order to prevent flare light from entering the light receiving surface,
A solid-state imaging device disposed on a base film of the TAB tape.

2. A solid-state imaging device chip having a land portion provided on the same surface side as the light receiving surface, a TAB tape having inner leads electrically connected to the land portion,
A cover glass disposed so as to face the light receiving surface, wherein the base film of the TAB tape is projected to the light receiving surface side so as to cover the inner leads, thereby preventing flare. An imaging device, comprising: 3. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is disposed at a distal end of an elongated insertion portion of an endoscope. 4. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is built in a video camera. 5. A solid-state imaging device having a plurality of external leads for inputting / outputting a signal of the solid-state imaging device chip to / from an external peripheral circuit; a substrate electrically connected to the external leads and mounting a plurality of electronic components; An imaging device having an imaging element or a cable for inputting and outputting signals to and from the peripheral circuit, wherein, among the plurality of electronic components, an electronic component connected to two of the plurality of external leads is adjacent to the electronic component. An imaging device, wherein the imaging device is connected to two external leads.

6. A solid-state imaging device having a long axis, a drive signal of the solid-state imaging device, or an electronic component having at least a long axis for controlling an output input signal, and a signal cable for inputting and outputting current to the solid-state imaging device and the electronic component, The electronic device according to claim 1, wherein a major axis direction of the electronic component is disposed substantially perpendicular to a major axis direction of the imaging device.

As shown in FIG. 17, in a conventional imaging device 51B, a solid-state imaging device holder 53 is connected to an objective lens frame 52 on which an objective lens is mounted. The solid-state imaging element chip 55b and the solid-state imaging element base 55a joined to the cover glass 55c are attached to the element holder 53.

The solid-state image sensor 55 includes a solid-state image sensor base 55a, a solid-state image sensor chip 55b attached to the base 55a, and a cover glass 55c.
External leads 55d protruding from the back surface of the solid-state imaging element base 55a are connected to the core wire 56b of the signal line 56a of the signal cable 56 and also to the chip capacitor 58 mounted on the substrate 57.

That is, as shown in FIG. 17B which shows a cross section taken along the line EE in FIG. 17A, the solid-state imaging device 55 has a rectangular plate shape and is parallel to the longitudinal direction (or the long axis 55e). A plurality of external leads 55d protrude left and right along two rows, and a substrate 57 is disposed therebetween. This substrate 5
In FIG. 7, a chip capacitor chip 58 is mounted in addition to an electronic component sealed with a sealing resin 59 shown in FIG. The chip capacitor 58 has a rectangular parallelepiped shape having a major axis 58a.

The chip capacitor chip 58 cuts the central external lead 55d among the three external leads 55d arranged on one side to shorten the length of the external lead 55d, and slightly extends the external leads 55d at both ends so as to widen the interval. The electrodes are bent, and the electrodes at both ends of the long axis 58a are connected by solder. The shortened external lead 55d is connected to the jumper wire 60.
Is connected to the land 57a of the substrate 57.

The core wire 56b of each signal line 56a of the signal cable 56 is connected to the land 57a of the substrate 57 and the external lead on the other side of the external leads 55d arranged in two rows (FIG. 1).
7 (B) is connected to the right external lead 55d. The imaging device 51B is covered with an insulating cover 61.

(Problems of Conventional Techniques in Supplementary Notes 5 and 6) As described above, in the conventional example, the chip capacitor 58 as the first electronic unit having the major axis 58a is the same as the solid-state imaging device 55 having the major axis 55e. It was provided in the longitudinal direction. However, since the sealing resin 59 that seals the second electronic component is provided along the optical axis direction (long axis direction) of the imaging device 51B, the imaging device 51B is long. Note that the chip capacitor 58 is also a second electronic component (sealing resin 59).
Also controls the drive signal and / or output signal of the solid-state image sensor 55.

If the image pickup device 51B is long, for example, in an endoscope, the distal end portion containing the image pickup device 51B becomes long, which deteriorates the handleability of an operator (operator) and inserts the endoscope into a bent body cavity. In such a case, it is difficult to insert the body and the body wall is pressed, so that the pain given to the patient increases. For this reason, the length of the image pickup device is reduced by adopting the configuration as described in Supplementary Notes 5 and 6.

7. A solid-state imaging device having an external lead for inputting / outputting a signal of the solid-state imaging device chip to / from the outside; a substrate electrically connected to the external lead and mounting a peripheral circuit; and the solid-state imaging device or the peripheral circuit And a cable for inputting and outputting a signal to and from the solid-state imaging device, wherein the external lead is separable from the solid-state imaging device.

8. An imaging device comprising: a solid-state imaging device; a substrate having peripheral circuits; a signal cable for inputting and outputting signals to and from the solid-state imaging device or the substrate; and external leads electrically and mechanically connected to the solid-state imaging device and the substrate. 3. The imaging device according to claim 1, wherein the external leads are connected to the substrate in advance.

(Conventional Techniques of Supplementary Notes 7 and 8) As shown in FIG. 18, in a conventional imaging device 96B, a solid-state imaging device 66 includes a solid-state imaging device chip 66a and a solid-state imaging device base 66.
b, and a cover glass 66c attached so as to cover the light receiving surface of the solid-state image sensor chip 66a.
d is mounted so as to protrude in advance. Since this is later soldered to the rear end side of the external lead 66d, it is attached by, for example, brazing or high-temperature solder which does not melt at the melting point of the solder.

Then, a signal line 69a of a signal cable 69 is connected to the external lead 66d by solder 70 with a substrate 68 in which the mounted electronic component is sealed with a sealing resin 67. A cable fixing member 71 is provided on the rear end side of the substrate 68.
Is used to guide and fix the signal line 69a by the cable fixing member 71.

(Problems of Conventional Techniques of Supplementary Notes 7 and 8) In the case of such a structure, the substrate 6
In order to solder 8, the length D1 of the solder 70
It is necessary to lengthen the external lead 66d in terms of accuracy.
Pitch cannot be narrowed.

The external lead 66d is connected to the solid-state image sensor 66.
Since it is attached by the manufacturer, it is difficult to control the mounting accuracy and post-manufacturing, and the accuracy cannot be improved. Also, the length D
There is a disadvantage that the image pickup device 96B becomes large because the length of the image pickup device 96 is large. For this reason, the length of the imaging device can be shortened by using a configuration as described in Supplementary Notes 7 and 8.

[0097]

As described above, according to the present invention, a solid-state imaging device chip having a land portion provided on the same surface side as a light receiving surface and an inner lead electrically connected to the land portion are provided. In a solid-state imaging device having a TAB tape and a cover glass disposed so as to face the light receiving surface, a base film of the TAB tape covers the inner lead, and controls incidence of flare light on the light receiving surface. Since the opening to prevent is provided, the flare due to irregular reflection of light outside the field of view at the inner lead end or unintended reflected light from the other is prevented by the base film of the TAB tape, thereby realizing miniaturization, The positioning of the opening can be performed with high precision by positioning the inner lead, and a good flare prevention function can be secured.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure of a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing an entire endoscope apparatus including an electronic endoscope incorporating the first embodiment;

FIG. 3 is a diagram showing a video camera incorporating the second embodiment.

FIG. 4 is a cross-sectional view illustrating a structure of a solid-state imaging device according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a partial structure of a solid-state imaging device according to a third embodiment of the present invention.

FIG. 6 is a diagram showing a structure of a TAB tape used in the solid-state imaging device of FIG. 5;

FIG. 7 is a diagram illustrating a structure of a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating a structure of an imaging device of the present invention.

FIG. 9 is a diagram illustrating a structure of a solid-state imaging device and the like in the imaging device of FIG. 8;

FIG. 10 is a cross-sectional view illustrating a structure of an imaging device of the present invention.

FIG. 11 is a diagram illustrating a state of attachment to a check jig when the solid-state imaging device is assembled.

FIG. 12 is a diagram illustrating a structure of the imaging device according to the present invention with a part cut away.

FIG. 13 is a perspective view showing a structure of a connection portion between a solid-state imaging device base and a substrate.

FIG. 14 is a diagram showing a structure and the like of an imaging device of the present invention.

FIG. 15 is a perspective view showing the vicinity of a connection portion between an external lead and a substrate in FIG. 14;

FIG. 16 is a cross-sectional view showing the structure of a conventional solid-state imaging device.

FIG. 17 is a cross-sectional view illustrating the structure of a conventional imaging device.

FIG. 18 is a diagram showing a structure of a conventional imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic endoscope 2 ... Endoscope apparatus 3A ... Solid-state imaging device 4 ... Control device 5 ... Color monitor 6 ... Insertion part 7 ... Operation part 11 ... Tip constituent part 14 ... Imaging unit 15 ... Objective lens 17 ... Signal cable DESCRIPTION OF SYMBOLS 21 ... Ceramic base 22 ... Solid-state image sensor chip 23 ... Conductor 24 ... External lead 25 ... Light receiving surface 26 ... Land 27, 31 ... Bump 28 ... TAB tape 28a ... TAB tape base film 28b ... TAB tape conductor 28c ... TAB tape inner lead 28d: TAB tape outer lead 32: cover glass 33: sealing resin

Claims (1)

[Claims] 1. A solid-state imaging device chip having a land provided on the same side as a light receiving surface, a TAB tape having inner leads electrically connected to the land, and facing the light receiving surface. And a cover glass disposed in the solid-state imaging device, wherein the base film of the TAB tape covers the inner lead so as to prevent flare light from entering the light-receiving surface. apparatus.