JP2009111334A - Optical device and method of manufacturing the same, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat radiation efficiency of a control circuit on an optical element and heat radiation efficiency of the whole optical element in an optical device. <P>SOLUTION: The optical device includes: a base 3 including a lead 1 which has a through-hole 7 in a center, is formed by an inner lead 1A extending from the center toward a peripheral edge and an outer lead 1B connected to the inner lead 1A and extending downward, and has an L-shaped cross-section, and a resin 2; and an optical element 4 which is provided under the base 3 so as to correspond to the through-hole 7. Electrode pads of the optical element 4 are connected to the leads 1 of the base 3 through bumps 6, respectively. The resin 2 is formed so as to cover respective inner ends Z<SB>1A</SB>of the leads 1 and respective front surfaces X<SB>1A</SB>of the inner leads 1A and to fill a gap between adjacent leads 1, and respective outer ends Z<SB>1B</SB>of the leads 1 and respective front surfaces X<SB>1B</SB>of the outer leads 1B are exposed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical device including an optical element that emits or receives light, a manufacturing method thereof, and a camera module including the optical device.

  In recent years, the amount of heat generated in a semiconductor device has increased due to the higher functionality of the semiconductor device, and improvement of the heat dissipation efficiency of the semiconductor device has become a major issue. In particular, in an optical device, it is necessary to secure an optical path above the optical element, and a heat dissipation member cannot be disposed above the optical element. Therefore, compared with other semiconductor devices, in terms of heat dissipation efficiency. I have to take a disadvantageous structure.

  For example, in an image sensor device, in many cases, a light receiving element is arranged at the center of a chip made of silicon, a control circuit is arranged at the periphery of the chip, and an electrode pad is arranged above or on the outside of the control circuit. Then, a chip is mounted on the surface side of the element forming surface on a base having a concave cross section made of ceramic or resin or the like, via a paste material or tape, and an electrode pad on the chip using an elongated gold wire or the like In many cases, a structure is used in which the electrode inside the base is connected and the concave portion of the base is closed using a transparent member such as glass. At this time, it is common to close the recess of the base so that the transparent member does not contact the chip surface.

  The main heat dissipation path in such an image sensor device is that heat generated in the control circuit is conducted through the chip to the back of the chip, and is conducted to the base via a paste material or tape, etc. Conducted outside the image sensor device. The heat conducted to the outside of the image sensor device is radiated mainly through a mounting portion of the image sensor device or a heat radiating plate provided in the image sensor device.

  However, in recent years, the amount of heat generated in the control circuit has increased, and the heat generation in the control circuit cannot be sufficiently dissipated with the above heat dissipation path alone, and the control circuit area becomes locally high in temperature. Concerns have been recognized that circuits will not operate properly or may be destroyed.

  One method for this countermeasure is as follows. Instead of using a long and thin gold wire, the electrode pad close to the control circuit is connected to the electrode inside the base using bumps, and a heat dissipation path is ensured via bumps and leads with high heat conduction efficiency. is there. An example of this type of optical device is shown in FIG. FIG. 12 is a cross-sectional view showing the structure of a conventional optical device.

In the optical device shown in FIG. 12, as a main component, a lead 201 having an external terminal 201t at the outer end (specifically, a lead is composed of an inner lead and an outer lead) is sealed in a resin 202. In addition, a base 203 having a through-hole 207 in the center and an optical element (image sensor chip) 204 having a light detection region 205 in the center are included. The electrode pads on the optical element 204 and the inner leads of the base 203 are connected via bumps 206. As shown in FIG. 12, the inner lead is formed so as to extend from the center toward the periphery, and is sealed in the resin 202 so that the contact area with the bump 206 on the back surface is exposed. On the other hand, as shown in FIG. 12, the outer lead is formed so as to be connected to the inner lead and protrude downward, and no resin is formed on the outer lead. A control circuit (not shown) and electrode pads are disposed outside the light detection region 205 of the optical element 204. A light shielding film 208 is formed on the periphery of the optical element 204. The light shielding film 208 prevents unnecessary light from entering from the back side of the optical element 204, and dust and the like enter the optical element 204. To adhere to the surface of the. As described above, an efficient heat dissipation path is secured for local heat generation in the control circuit on the optical element 204 from the electrode pad adjacent to the control circuit to the lead 201 via the bump 206 (for example, Patent Document 1).
Japanese Patent Application No. 9-507469

  However, the conventional optical device has the following problems.

  In the prior art optical device, as shown in FIG. 12, most of the back surface of the optical element 204 is in contact with air, and there is almost no area where the optical element 204 is in contact with other members. There is a problem in that a sufficient heat dissipation path for radiating heat generated by the entire optical element cannot be ensured using the contact area, resulting in deterioration of the heat dissipation efficiency of the entire optical element.

  A problem similar to the above problem also exists in a hollow type semiconductor device in which a semiconductor element having a structure similar to that of the above optical device is mounted. In other words, in the hollow type semiconductor device, most of the back surface of the semiconductor element is in contact with air, and there is almost no area where the semiconductor element contacts other members, and the semiconductor using the contact area with other members is used. There is a problem in that a sufficient heat dissipation path for dissipating the heat generated in the entire element cannot be secured, resulting in deterioration of the heat dissipation efficiency of the entire semiconductor element.

  In view of the above, the first object of the present invention is to improve not only the heat dissipation efficiency of the control circuit on the optical element but also the heat dissipation efficiency of the entire optical element in the optical device. The second object is to improve the heat dissipation efficiency.

  In order to achieve the first object, an optical device according to the present invention includes a through hole provided in the center, an inner lead extending from the center toward the periphery, and an outer lead connected to the inner lead and extending downward. A cross section having an L-shaped lead; a base including a resin; and an optical element disposed below the base so as to correspond to the through hole; and an electrode pad of the optical element and a lead of the base; Are connected via bumps, and the resin is formed so as to cover the inner end of the lead and the surface of the inner lead, and to embed between adjacent leads, and the outer end of the lead and the surface of the outer lead It is preferable to further include a thin plate member that is exposed and is disposed on the back surface of the optical element.

  According to the optical device of the present invention, by disposing the thin plate on the back surface of the optical element, a heat dissipation path can be secured from the optical element to the thin plate, and the contact area with other members, that is, the thin plate can be utilized. Thus, the heat dissipation efficiency of the entire optical element can be improved.

  In addition, instead of exposing the entire outer lead without forming resin as in the prior art, resin is formed so as to embed between adjacent outer leads to expose the outer end, front surface and back surface of the outer lead. Accordingly, it is possible to realize an optical device compatible with a surface-mounting type optical device having a terminal only in an existing peripheral portion. Therefore, for example, the present optical device can be applied by being replaced with an optical device constituting an existing camera module.

  Further, an efficient heat dissipation path from the optical element to the external terminal through the metal having high heat conduction efficiency is formed. In particular, by providing a bump between the lead and the electrode pad, the heat conduction efficiency can be improved as compared with the case where a long and thin gold wire is provided as in the prior art. Also, by covering the surface of the inner lead with resin, even when a camera module is configured using this optical device, unnecessary reflection on the surface of the inner lead can be prevented, and only the necessary light beam is detected in the light detection area. Can be reached.

  In the optical device according to the present invention, the thin plate member is preferably made of a material having high heat conduction efficiency.

  In the optical device according to the present invention, it is preferable that a bonding member is interposed between the optical element and the thin plate member.

  The optical device according to the present invention preferably further comprises a transparent member disposed in the through hole of the base, and the optical element disposed on the base is sealed by the transparent member and the thin plate member.

  In this case, since the base is sealed by the transparent member arranged in the through hole of the base and the thin plate body arranged with the optical element sandwiched below the base, dust entering from the outside In addition, it is possible to prevent defects in the optical device due to adhesion of moisture and the like.

  In the optical device according to the present invention, an adhesive is preferably interposed between the transparent member and the base.

  In the optical device according to the present invention, it is preferable that the back surface of the thin plate body further includes an electrode disposed so as to correspond to the external terminal located at the outer end of the lead.

  In this way, when the optical device is introduced into the camera module, not only the electrical connection with the external terminal but also the electrical connection with the electrode can be secured. Devices can be introduced with high reliability.

  In the optical device according to the present invention, a step having a shape corresponding to the corner shape of the thin plate is provided in the outer end region of the base, and the thin plate is disposed in the step so that the base and the thin plate are fitted. It is preferable.

  If it does in this way, when attaching a thin plate body to an optical element, positioning of a thin plate body becomes easy, and it can aim at improvement of attachment accuracy and simplification of an attachment method.

  In the optical device according to the present invention, the portion of the resin formed on the inner end of the lead is preferably formed in a tapered shape so that the inner diameter of the through hole increases from the upper end toward the lower end. .

  If it does in this way, the incident light which entered into the through-hole of the base will not hit and reflect the inner surface of the through-hole. Therefore, it is possible to prevent incident light from being reflected by hitting the inner side surface of the through hole, and the reflected light reaching the light detection region of the optical element to generate noise light.

  In order to achieve the first object, an optical device manufacturing method according to the present invention includes an inner lead that is provided with a through hole in the center and extends from the center toward the periphery, and an outer that is connected to the inner lead and extends downward. A step (a) of preparing a base including an L-shaped lead having a cross-sectional shape made of a lead and a resin, and a bump on an electrode pad formed on the surface of an optical element having a light detection region in the center After the step (b) to be formed, the step (a) and the step (b), an optical element is arranged below the base so as to correspond to the through hole, and the base lead and the optical element are arranged via the bump. A step (c) of connecting the electrode pads of the element, a step (d) of disposing a thin plate member on the back surface of the optical element via a bonding member, and a transparent member being disposed in the through hole of the base via an adhesive. A step (e), and a step (a) Covers the upper surface of the lead of the inner end and the inner lead, characterized in that it is a step of preparing a base resin is formed to fill between leads adjacent to each other.

  According to the method for manufacturing an optical device according to the present invention, by disposing a thin plate on the back surface of the optical element, a heat dissipation path conducting from the optical element to the thin plate can be secured, and the heat dissipation efficiency of the entire optical element can be improved. it can.

  In addition, since the base is sealed by the transparent member disposed in the through hole of the base and the thin plate body disposed with the optical element sandwiched below the base, dust and moisture entering from the outside are sealed. It is possible to prevent the optical device from being defective due to such adhesion.

  Furthermore, an optical device compatible with an existing surface mount type optical device can be realized. Therefore, for example, the present optical device can be applied by being replaced with an optical device constituting an existing camera module.

  Furthermore, since an optical device can be manufactured using only versatile bump bonding and adhesion techniques, the optical device can be manufactured easily and inexpensively. That is, as in the prior art, an optical device can be manufactured without complicated formation such as formation of a light shielding film.

  In the optical device manufacturing method according to the present invention, the step (a) includes a step (a1) of preparing a predetermined number of lead frames corresponding to the number of leads included in the base, The lead frame is installed after the step (a2) and the step (a2) in which the portion corresponding to the connecting portion between the inner lead and the outer lead is bent and the portion corresponding to the outer end of the lead is bent. The lower mold and the upper mold are combined to form a cavity between the lower mold and the upper mold (a3), and after the step (a3), the cavity is filled with resin and cured. Then, after forming a molded body composed of a lead frame and a resin, after opening the lower mold and the upper mold and taking out the molded body (a4), and after the step (a4), Outside the lead of the molded body And a step (a5) for obtaining a singulated base by cutting at a portion corresponding to, and in the step (a4), on the surface serving as the inner end of the lead and the surface serving as the surface of the inner lead It is preferable to form a molded body in which resin is formed so as to cover the lead frames and to embed between adjacent lead frames.

  In this way, since the base can be manufactured using only versatile lead processing and resin molding techniques, the base can be manufactured easily and inexpensively.

  In order to achieve the second object, a semiconductor device according to the present invention has an L-shaped cross section comprising an inner lead extending from the center toward the periphery and an outer lead connected to the inner lead and extending downward. And a base including resin, and a semiconductor element in which an electrode pad is arranged below the base so as to correspond to the lead, and the electrode pad of the semiconductor element and the lead of the base are connected via a bump The inner end of the lead and the surface of the inner lead are covered, and resin is formed so as to embed between adjacent leads, and the outer end of the lead and the surface of the outer lead are exposed. It is preferable that it further includes a thin plate member disposed on the back surface of the semiconductor element.

  According to the semiconductor device of the present invention, by disposing the thin plate on the back surface of the semiconductor element, a heat dissipation path conducting from the semiconductor element to the thin plate can be secured, and the contact area with other members, that is, the thin plate is utilized. Thus, the heat dissipation efficiency of the entire semiconductor element can be improved.

  In addition, since the base is hermetically sealed by the thin plate body arranged with the semiconductor element sandwiched below the base, it is possible to prevent a semiconductor device from being defective due to adhesion of dust and moisture entering from the outside.

  In addition, an efficient heat dissipation path from the semiconductor element to the external terminal through the metal having high heat conduction efficiency is formed. In particular, by providing a bump between the lead and the electrode pad, the heat conduction efficiency can be improved as compared with the case where a long and thin gold wire is provided as in the prior art.

  According to the optical device and the manufacturing method thereof according to the present invention, by disposing the thin plate on the back surface of the optical element, a heat dissipation path conducting from the optical element to the thin plate can be secured, and contact with other members, that is, the thin plate The heat dissipation efficiency of the entire optical element can be improved using the region. In addition, an optical device compatible with an existing surface mount type optical device can be realized.

  According to the semiconductor device of the present invention, by disposing the thin plate on the back surface of the semiconductor element, a heat dissipation path conducting from the semiconductor element to the thin plate can be secured, and the contact area with other members, that is, the thin plate is utilized. Thus, the heat dissipation efficiency of the entire semiconductor element can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the thickness, length, and the like of each component shown in the figure are different from the actual shape from the creation of the drawing. Moreover, in each figure, the same code | symbol is attached | subjected about the same component and description may be abbreviate | omitted.

(First embodiment)
The optical device according to the first embodiment of the present invention will be described below with reference to FIGS. 1 (a) to 1 (c). FIGS. 1A to 1C are diagrams showing the structure of an optical device according to the first embodiment of the present invention. Specifically, FIG. 1 (a) is a plan view of the optical device viewed from the back side of the optical element, and FIG. 1 (b) is a cross-sectional view taken along line Ib-Ib shown in FIG. 1 (a). 1 (c) is a perspective view of the optical device viewed from the surface side of the optical element.

  As shown in FIG. 1 (b), the optical device according to the present embodiment includes, as main components, a base 3 including a lead 1 and a resin 2 provided with a through hole 7 in the center, and a base 3 below. The optical element 4 is disposed so as to correspond to the through hole 7 and has the light detection region 5 in the center. The lead 1 of the base 3 and the electrode pad of the optical element 4 are connected via bumps 6.

  As shown in FIG. 1 (b), the lead 1 is composed of an inner lead 1A extending from the center toward the peripheral edge and an outer lead 1B connected to the inner lead 1A and extending downward. It is a letter shape. Further, the lead 1 has an external terminal 1t (in particular, see FIG. 1 (a)) at its outer end.

  The base 3 includes a plurality of leads 1 included in one optical device and a resin 2 that integrates all of the plurality of leads 1. Further, as shown in FIG. 1B, the base 3 is provided with a through-hole 7 having a shape smaller than the shape of the optical element 4 at the center thereof.

  As shown in FIG. 1B, the optical element 4 has a control circuit (not shown) and electrode pads arranged outside the light detection region 5. Here, the optical device of the present embodiment is an optical device in which only the light receiving element is mounted as the optical element 4, an optical device in which only the light emitting element is mounted, or an optical device in which both the light receiving element and the light emitting element are mounted. including. Specific examples of the light receiving element include an image sensor such as a CMOS sensor and a CCD sensor. Specific examples of the light emitting element include a laser or a light emitting diode. In the case of an optical device in which only the light receiving element is mounted as the optical element 4, the light detection area 5 indicates an imaging area.

  Next, the structure of the base 3 which comprises this optical device is demonstrated, referring FIG. 2 (a)-(c). FIGS. 2A to 2C are diagrams showing the configuration of the base constituting the optical device. Specifically, Fig. 2 (a) is a plan view of the base viewed from the back side of the base, Fig. 2 (b) is a side view of the base, and Fig. 2 (c) is from the back side of the base. It is the perspective view of the seen base.

The inner lead 1A constituting the lead 1 has a resin 2 on the inner end (see FIG. 1 (b): Z _1A ), on the surface (see FIG. 1 (b): X _1A ), and between adjacent inner leads. On the other hand, the back surface (FIG. 2 (c): Y _1A ) is exposed.

In the outer lead 1B, the resin 2 is formed between adjacent outer leads, while the front surface (see FIG. 1 (b): X _1B ), the back surface (see FIG. 2 (c): Y _1B ), and the outside The end (see FIG. 2 (c): Z _1B ) is exposed.

Thus, covering over the surface X _1A of the inner end Z _1A and the inner leads 1A of the lead 1, by the resin 2 is formed to fill between the lead 1 adjacent to each other, a plurality of leads 1 are resin 2 is integrated. Then, the lead 1 of the outer end Z _1B, the surface X _1B of the outer lead 1B, and the lead 1 of the rear surface (specifically, the rear surface Y _1B of the back Y _1A and outer leads 1B, the inner lead 1A) is exposed .

  The lead 1 is made of a material similar to that used for a normal lead frame, such as a Cu alloy or 42 alloy (superalloy containing 42% Ni in Fe), and has a thickness of 100 μm or more, for example. It is 500 micrometers or less, and it is preferable that it is about 250 micrometers. As the resin 2, an insulating material, for example, a plastic resin such as an epoxy resin is used.

  For example, solder or gold is used as the bump 6, but it is also possible to use, for example, an anisotropic conductor having high heat conduction efficiency.

According to the present embodiment, the resin 2 is formed so as to be embedded between the adjacent outer leads 1B, instead of exposing the entire outer lead without forming the resin as in the prior art, and the outer end Z of the outer lead 1B. _1B, by exposing the surface X _1B and back Y _1B, it is possible to realize an optical device having optical device compatible with surface mount type with the terminal only to the existing periphery. Therefore, for example, the present optical device can be applied by being replaced with an optical device constituting an existing camera module.

Further, an efficient heat dissipation path from the optical element 4 to the external terminal 1t is formed through a metal having high heat conduction efficiency. In particular, by providing the bump 6 between the lead 1 and the electrode pad, the heat conduction efficiency can be improved as compared with the case where a long and thin gold wire is provided as in the prior art. In addition, by covering the surface X _1A of the inner lead 1 with the resin 2, even when a camera module is configured using this optical device, unnecessary reflection on the surface X _1A of the inner lead 1 can be prevented and necessary. Only light rays can reach the light detection region 5.

(Second Embodiment)
An optical device according to the second embodiment of the present invention will be described below with reference to FIG. FIG. 3 is a cross-sectional view showing the structure of an optical device according to the second embodiment of the present invention.

  As shown in FIG. 3, in addition to the configuration of the first embodiment, the optical device of the present embodiment includes a thin plate body 8 disposed below the optical element 4 via a bonding member 9, and a base 3 And a transparent member 10 disposed in the through hole 7 with an adhesive 11 interposed therebetween.

  The thickness of the thin plate member 8 is, for example, 200 μm or more and 400 μm or less. As the material of the thin plate member 8, for example, ceramic is used, but other than that, for example, a metal plate or the like may be used. As the joining member 9, for example, an adhesive is used. However, for example, an adhesive sheet or the like may be used.

  The transparent member 10 is designed so that the front surface and the back surface thereof are parallel to each other, and forms an optical plane with flatness that satisfies the optical application to be used. The thickness of the transparent member 10 is, for example, not less than 300 μm and not more than 500 μm. As a material of the transparent member 10, for example, optical glass, quartz, quartz, optical transparent resin, or the like is used.

  According to this embodiment, the same effects as those of the first embodiment described above can be obtained.

  In addition, since the thin plate member 8 is bonded to the back surface of the optical element 4 via the bonding member 9, a heat dissipation path conducting from the optical element 4 to the thin plate member 8 can be secured, and the heat dissipation efficiency of the entire optical element 4 is improved. be able to.

  Further, since the base 3 is sealed by the transparent member 10 disposed in the through hole 7 of the base 3 and the thin plate member 8 disposed with the optical element 4 sandwiched below the base 3, the external base 3 is sealed. It is possible to prevent the optical device from being defective due to adhesion of dust, moisture and the like entering from the inside.

-Manufacturing method of base-
Next, the manufacturing method of the base 3 which comprises this optical device is demonstrated, referring FIG. 4 (a)-(e). 4 (a) to 4 (e) are cross-sectional views of essential steps showing a manufacturing method of a base constituting the optical device in the order of steps. In the following description, a case where two bases 3 are manufactured will be described as a specific example.

First, as shown in FIG. 4A, a predetermined number of lead frames 1f corresponding to the number of leads included in one optical device are prepared. Here, the length of the lead frame 1f is determined according to the number of bases to be manufactured. For example, when two bases are planned to be manufactured, the lengths l ₁ , l ₂ , and l ₃ (see FIG. 4 (d)) corresponding to the areas to be punched out to be separated into pieces are configured. A lead frame 1f having a length obtained by adding up the lengths L ₁ and L ₂ (see FIG. 4 (e)) required for the preparation is prepared. Here, the lead frame 1f is provided with openings corresponding to the number of bases to be manufactured, and the opening positions thereof correspond to the through-hole positions of the bases.

Then, out of the lead frame 1f, with folded around the portion P _1A corresponding to the connection portion between the inner lead and the outer lead which constitute lead, after folding around the portion P _1B corresponding to the outer end of the lead, The lead frame 1 f is set on the lower mold 12.

  Next, as shown in FIG. 4 (b), the lower mold 12 on which the lead frame 1 f is installed and the upper mold 13 are combined, and the cavity 14 is interposed between the upper mold 13 and the lower mold 12. Form.

Next, as shown in FIG. 4C, after the resin 2 is filled in the cavity 14 and cured, the lower mold 12 and the upper mold 13 are opened, and the molded body 15 is taken out. The molded body 15 includes a number of lead frames 1f corresponding to the number of leads included in one optical device, and a resin 2 that integrates the lead frames 1f. A through hole 7 is provided in the center of the region corresponding to the base in the molded body 15. In this way, the inner ends of the leads (Fig. 4 (e): see Z _1A) to become plane Z _1f, and the inner lead surface (FIG. 4 (e): see X _1A) and covers the upper surface X _1f comprising At the same time, the resin 2 is formed so as to embed between the adjacent lead frames 1f.

  Next, as shown in FIG. 4D, the receiving mold 16 and the pressing mold 17 are opposed to each other with the molded body 15 interposed therebetween. The molded body 15 sandwiched and fixed between the receiving mold 16 and the presser mold 17 is punched by the pressing mold 18, and the portion punched by the pressing mold 18 in the molded body 15 is punched out. Here, the presser mold 17 is provided with a space 17 a for punching out a portion punched by the push mold 18.

Finally, as shown in FIG. 4 (e), by opening the receiving mold 16 and the pressing mold 17, the two bases 3 separated into pieces are obtained. In this way, the molded body 15 is cut at the portion P _1B corresponding to the outer end of the lead to obtain the separated base 3. Each base 3 is composed of a plurality of leads 1 included in one optical device and a resin 2 that integrates the plurality of leads 1, and a through hole 7 is provided in the center thereof. Yes. The lead 1 is composed of an inner lead 1A extending from the center toward the periphery and an outer lead 1B connected to the inner lead 1A and extending downward, and the cross-sectional shape thereof is L-shaped. A resin 2 is formed so as to cover the inner end Z _1A of the lead ₁ and the surface X _{1A of the} inner lead, and to embed between the adjacent leads 1.

  In this way, the base constituting the optical device can be manufactured.

  In the manufacturing method of the base that constitutes the optical device, the base can be manufactured using only versatile lead processing and resin molding techniques, so that the base can be manufactured easily and inexpensively. Can do.

  In the above description, the case where two bases are manufactured has been described as a specific example, but the present invention is not limited to this.

-Optical device manufacturing method-
Next, an optical device manufacturing method according to the second embodiment of the present invention will be described with reference to FIGS. 5 (a) to 5 (e). 5 (a) to 5 (e) are cross-sectional views of main steps showing the optical device manufacturing method according to the second embodiment of the present invention in the order of steps.

  First, as shown in FIG. 5 (a), an electrode having bumps 6 formed on an electrode pad of an optical element 4 having a light detection region 5 at the center of the surface is prepared.

  Next, as shown in FIG. 5 (b), the base 3 manufactured by the above manufacturing method is disposed above the optical element 4 so that the through hole 7 of the base 3 and the optical element 4 correspond to each other. Then, the lead 1 of the base 3 and the electrode pad of the optical element 4 are connected via the bumps 6.

  Next, as shown in FIG. 5 (c), a thin plate 8 having a joining member 9 formed thereon is prepared.

  Next, as shown in FIG. 5 (d), the thin plate member 8 is connected to the back surface of the optical element 4 via the bonding member 9.

  Next, as shown in FIG. 5 (e), the transparent member 10 is disposed in the through hole 7 of the base 3, and the transparent member 10 is connected to the base 3 through the adhesive 11.

  As described above, the optical device of this embodiment can be manufactured.

  In this embodiment, versatile lead processing and resin molding (see FIGS. 4 (a) to (e)), and versatile bump bonding and bonding (see FIGS. 5 (a) to (e)). Since the optical device can be manufactured using only the optical device, the optical device can be manufactured easily and inexpensively. That is, as in the prior art, an optical device can be manufactured without complicated formation such as formation of a light-shielding film (see FIG. 12: 208).

(Modification of the first embodiment)
Hereinafter, an optical device according to a modification of the first embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the structure of an optical device according to a modification of the first embodiment of the present invention.

  The structural differences between this modification and the first embodiment are as follows.

In the first embodiment, the portion of the resin formed on the inner end Z _1A of the lead 1 is formed so that the inner diameter of the through hole 7 has a constant inner diameter from the upper end to the lower end. On the other hand, in this embodiment, as shown in FIG. 6, it is a point formed in the taper shape so that the internal diameter of the through-hole 7 may become large toward the lower end from an upper end. Here, as shown in FIG. 6, the resin 19 is formed so that the taper angle α is larger than the incident angle β of the incident light.

  According to this modification, incident light that has entered the through hole 7 of the base 3 does not hit the inner surface of the through hole 7 and is not reflected. Therefore, it is possible to prevent the incident light from being reflected by hitting the inner side surface of the through hole 7 and reaching the light detection region 5 of the optical element 4 to generate noise light.

(Modification 1 of 2nd Embodiment)
Hereinafter, an optical device according to Modification 1 of the second embodiment of the present invention will be described with reference to FIG. FIG. 7: is sectional drawing shown about the structure of the optical device which concerns on the modification 1 of the 2nd Embodiment of this invention.

  The structural differences between this modification and the second embodiment are as follows.

  As shown in FIG. 7, in addition to the configuration of the optical device of the second embodiment, the optical device of this embodiment further includes an electrode 20 disposed on the back surface of the thin plate member 8 so as to correspond to the external terminal 1t. It is a point that has.

  According to this modification, when the present optical device is introduced into the camera module, not only the electrical connection with the external terminal 1t but also the electrical connection with the electrode 20 can be ensured. The optical device can be introduced with high reliability (see the third embodiment described later).

(Modification 2 of the second embodiment)
Hereinafter, an optical device according to Modification 2 of the second embodiment of the present invention will be described with reference to FIG. FIG. 8: is sectional drawing shown about the structure of the optical device which concerns on the modification 2 of the 2nd Embodiment of this invention.

  The structural differences between this modification and the second embodiment are as follows.

  As shown in FIG. 8, in the optical device of the present embodiment, a step 21 having a shape corresponding to the corner shape of the thin plate 8 is provided in the outer end region of the base 3, and the thin plate 8 is provided in the step 21. It arrange | positions and the base 3 and the thin-plate body 8 are fitting.

  According to this modification, when the thin plate member 8 is attached to the optical element 4, the positioning of the thin plate member 8 is facilitated, and the attachment accuracy is improved and the attachment method is simplified as compared with the second embodiment. You can plan.

(Third embodiment)
Hereinafter, a camera module including the optical device according to the first modification of the second embodiment will be described as a specific example of the camera module according to the third embodiment of the present invention (that is, the camera module including the present optical device). Will be described. FIG. 9 is a cross-sectional view showing a structure of a camera module according to the third embodiment of the present invention.

  Here, the “camera module” refers to, for example, a digital still camera, a mobile phone camera, a mobile phone movie, an in-vehicle camera, a surveillance camera, a video camera, a medical camera, a broadcast camera, a Web camera, and a video phone camera. It refers to various devices represented by a game machine camera, an optical mouse, a DVD drive, a CD drive, and the like. In addition, when this optical device is used for a camera module, the optical element which comprises this optical device is light receiving elements, such as an image sensor.

  As shown in FIG. 9, the camera module of this embodiment includes a wiring board 101, an optical device 100 mounted on the wiring board 101, a positioning spacer 102 arranged around the optical device 100, and a wiring board 101. And a cylindrical barrel base 103 having a hollow above the light detection region (specifically, light receiving region) 5 of the optical element 4 and a light receiving region 5. The glass plate 104 fixed to the bottom of the lens barrel base 103, the lens storage portion 105 provided in the hollow of the lens barrel base 103, the lens holder 107 fixed in the lens storage portion 105, and the lens holder 107 And a lens 106 disposed above the light receiving region 5.

  The external terminal 1t of this optical device is connected to a wiring (not shown) provided on the wiring board 101 via a solder 108 formed on the wiring board 101.

  According to the present embodiment, since the heat dissipation efficiency of the entire optical element can be improved while maintaining good heat dissipation efficiency of a control circuit (not shown) on the optical element 4, a camera module including the optical device is provided. The heat radiation efficiency can be improved.

  In addition, the present optical device 100 can be introduced into an existing camera module in place of the optical device constituting the existing camera module. That is, the present optical device 100 can be applied to the existing camera module without any design change.

  Further, when the optical device 100 is mounted on the wiring board 101 and the optical device is introduced into an existing camera module, the bonding area of the solder 108 is not only the bonding area with the external terminal 1t but also the electrode 20. Therefore, the present optical device can be introduced with high reliability into an existing camera module.

  In addition, since the optical device can be easily and inexpensively manufactured (see the second embodiment described above), a camera module including the optical device can be easily and inexpensively provided.

(Fourth embodiment)
A semiconductor device according to the fourth embodiment of the present invention will be described below with reference to FIGS. 10 (a) to 10 (c). 10A to 10C are views showing the structure of a semiconductor device according to the fourth embodiment of the present invention. Specifically, FIG. 10A is a plan view of a semiconductor device viewed from the back side of the semiconductor element, and FIG. 10B is a cross-sectional view taken along the line Xb-Xb shown in FIG. 10 (c) is a perspective view of the semiconductor device viewed from the surface side of the semiconductor element. In the present embodiment, the same reference numerals as those shown in FIGS. 1A to 1C are assigned to the same components as those in the first embodiment.

  As shown in FIG. 10B, the semiconductor device of the present embodiment includes a base 23 including the lead 1 and the resin 22 as main constituent elements, and an electrode so as to correspond to the lead 1 below the base 23. And a semiconductor element 24 on which pads are arranged. The lead 1 of the base 23 and the electrode pad of the semiconductor element 24 are connected via the bump 6.

As shown in FIG. 10B, the inner lead 1A has a resin 22 formed on its inner end Z _1A, on the front surface X _1A , and between adjacent inner leads, while the back surface Y _1A is exposed. ing. On the other hand, as shown in FIG. 10B, the outer lead 1B has a resin 22 formed between adjacent outer leads, while its front surface X _1B , rear surface Y _1B , and outer end Z _1B are exposed. ing.

As described above, the resin 22 is formed so as to cover the inner end Z _1A of the lead 1 and the surface X _1A of the inner lead _1A and to embed between the adjacent leads 1, so that the plurality of leads 1 are made of the resin 22. It is integrated with. Then, the lead 1 of the outer end Z _1B, the surface X _1B of the outer lead 1B, and the lead 1 of the back (for more information, the back surface Y _1B of the back Y _1A and outer leads 1B, the inner leads 1A is exposed.

  As described above, the structural differences between the present embodiment and the first embodiment are as follows.

  In the present embodiment, a semiconductor element 24 is provided as shown in FIGS. 10A to 10B instead of the optical element in the first embodiment (see FIGS. 1A to 1C: 4). It is a point. In addition, a through hole (see FIGS. 1 (b) to (c): 7) is provided at the center of the base (see FIGS. 1 (b) to (c): 3) in the first embodiment. On the other hand, the base 23 in this embodiment is not provided with a through hole.

  According to the present embodiment, an efficient heat dissipation path from the semiconductor element 24 to the external terminal 1t is formed through the metal having high heat conduction efficiency. In particular, by providing the bump 6 between the lead 1 and the electrode pad, the heat conduction efficiency can be improved as compared with the case where a long and thin gold wire is provided as in the prior art.

(Fifth embodiment)
A semiconductor device according to the fifth embodiment of the present invention will be described below with reference to FIG. FIG. 11 is a cross-sectional view showing the structure of a semiconductor device according to the fifth embodiment of the present invention. In the present embodiment, the same components as those in the fourth embodiment are denoted by the same reference numerals as those shown in FIG.

  As shown in FIG. 11, the semiconductor device of the present embodiment further includes a thin plate member 25 disposed below the semiconductor element 24 via a bonding member 26 in addition to the configuration of the fourth embodiment.

  In addition, as the thin plate body 25 in this embodiment, the structure similar to the thin plate body 8 in 2nd Embodiment is mentioned. Moreover, as the joining member 26 in this embodiment, the structure similar to the joining member 9 in 2nd Embodiment is mentioned.

  According to the present embodiment, the same effect as that of the fourth embodiment described above can be obtained.

  In addition, by bonding the thin plate member 25 to the back surface of the semiconductor element 24 via the bonding member 26, a heat dissipation path conducting from the semiconductor element 24 to the thin plate member 25 can be secured, and the heat dissipation efficiency of the entire semiconductor element 24 is improved. be able to.

  Furthermore, since the base 23 is hermetically sealed by the thin plate member 25 disposed below the base 23 with the semiconductor element 24 interposed therebetween, it is possible to prevent a semiconductor device from being defective due to adhesion of dust and moisture entering from the outside. it can.

  Since the present invention can improve the heat dissipation efficiency of the entire optical element while maintaining good heat dissipation efficiency of the control circuit on the optical element in the optical device, for example, a digital still camera, a mobile phone camera, a surveillance camera It is useful for video cameras and the like. Furthermore, since the present invention can improve the heat dissipation efficiency of the entire semiconductor element in a semiconductor device, it is useful for, for example, a discrete device (power MOSFET (Metal-Oxide-Semiconductor Field-Effect-Transistor), SAW device). is there.

(a)-(c) is a figure shown about the structure of the optical device which concerns on the 1st Embodiment of this invention. (a)-(c) is a figure shown about the structure of the base which comprises this optical device. It is sectional drawing shown about the structure of the optical device which concerns on the 2nd Embodiment of this invention. (a)-(e) is principal part process sectional drawing which shows the manufacturing method of the base which comprises this optical device in order of a process. (a)-(e) is principal part process sectional drawing which shows the manufacturing method of the optical device which concerns on the 2nd Embodiment of this invention in process order. It is sectional drawing shown about the structure of the optical device which concerns on the modification of the 1st Embodiment of this invention. It is sectional drawing shown about the structure of the optical device which concerns on the modification 1 of the 2nd Embodiment of this invention. It is sectional drawing shown about the structure of the optical device which concerns on the modification 2 of the 2nd Embodiment of this invention. It is sectional drawing shown about the structure of the camera module which concerns on the 3rd Embodiment of this invention. (a)-(c) is a figure shown about the structure of the semiconductor device which concerns on the 4th Embodiment of this invention. It is sectional drawing shown about the structure of the semiconductor device which concerns on the 5th Embodiment of this invention. It is sectional drawing shown about the structure of the optical device of a prior art.

Explanation of symbols

1 Lead 1A Inner Lead 1B Outer Lead 1t External Terminal 1f Lead Frame 2 Resin 3 Base 4 Optical Element 5 Light Detection Area
6 bumps 7 a through hole X _1A inner lead surface Y _1A inner leads back surface Z _1A lead inner ends X _1B outer lead surface Y _1B outer leads on the back surface Z _1B outer end X _1f inner leads of the surface of the lead surface Z _1f Lead inner surface 8 Thin plate member 9 Joining member 10 Transparent member 11 Adhesive 12 Lower die 13 Upper die 14 Cavity 15 Molded body 16 Receiving die 17 Holding die 17a Space 18 Pushing die 19 Resin α Taper angle β Incident angle 20 Electrode 21 Step 22 Resin 23 Base 24 Semiconductor element 25 Thin plate body 26 Joining member 100 Optical device 101 Wiring substrate 102 Spacer 103 Lens barrel base 104 Glass plate 105 Lens housing portion 106 Lens 107 Lens holder 108 Solder

Claims (13)

A base having a through-hole in the center, an L-shaped lead having an inner lead extending from the center toward the periphery and an outer lead connected to the inner lead and extending downward, and a resin,
An optical element disposed below the base so as to correspond to the through hole,
The electrode pad of the optical element and the lead of the base are connected via a bump,
The resin is formed so as to cover the inner end of the lead and the surface of the inner lead, and to fill the space between adjacent leads, and the outer end of the lead and the surface of the outer lead are exposed. An optical device characterized by. The optical device according to claim 1.
An optical device further comprising a thin plate disposed on a back surface of the optical element. The optical device according to claim 2.
The thin plate is made of a material having high heat conduction efficiency. The optical device according to claim 2.
An optical device, wherein a joining member is interposed between the optical element and the thin plate member. The optical device according to claim 2.
A transparent member disposed in the through hole of the base;
The optical device, wherein the optical element disposed on the base is sealed by the transparent member and the thin plate member. The optical device according to claim 5.
An optical device, wherein an adhesive is interposed between the transparent member and the base. The optical device according to claim 2.
An optical device further comprising an electrode arranged on the back surface of the thin plate so as to correspond to an external terminal located at an outer end of the lead. The optical device according to claim 2.
A step having a shape corresponding to the shape of the corner of the thin plate is provided in the outer end region of the base,
An optical device, wherein the thin plate member is disposed in the step and the base and the thin plate member are fitted to each other. The optical device according to claim 1.
The optical device is characterized in that a portion of the resin formed on the inner end of the lead is formed in a tapered shape so that the inner diameter of the through hole increases from the upper end toward the lower end. A base including a through hole provided in the center, an inner lead extending from the center toward the periphery and an outer lead connected to the inner lead and extending downward, and a resin base is prepared. Step (a);
A step (b) of forming a bump on the electrode pad formed on the surface of the optical element having a light detection region in the center;
After the step (a) and the step (b), the optical element is disposed below the base so as to correspond to the through hole, and the lead of the base and the lead are interposed via the bumps. Connecting the electrode pads of the optical element (c);
A step (d) of disposing a thin plate member via a bonding member on the back surface of the optical element;
A step (e) of disposing a transparent member in the through hole of the base via an adhesive;
The step (a) is a step of preparing the base on which the resin is formed so as to cover the inner end of the lead and the surface of the inner lead and to embed between adjacent leads. A method for manufacturing an optical device. In the manufacturing method of the optical device according to claim 10,
The step (a)
Preparing a predetermined number of lead frames corresponding to the number of leads included in the base (a1);
A step of bending the lead frame around a portion corresponding to the connection portion between the inner lead and the outer lead, and bending the portion corresponding to the outer end of the lead (a2);
After the step (a2), a step (a3) of forming a cavity between the lower die and the upper die by combining the lower die provided with the lead frame and the upper die. ,
After the step (a3), the resin is filled in the cavity and cured to form a molded body composed of the lead frame and the resin, and then the lower mold and the upper mold are opened, A step (a4) of taking out the molded body;
After the step (a4), the molded body is cut at a portion corresponding to the outer end of the lead in the molded body to obtain the singulated base (a5). ,
In the step (a4), the molded body on which the resin is formed so as to cover the surface serving as the inner end of the lead and the surface serving as the surface of the inner lead and burying between the adjacent lead frames. A method for manufacturing an optical device, comprising: forming an optical device. A base including an L-shaped lead having an inner lead extending from the center toward the periphery and an outer lead connected to the inner lead and extending downward, and a resin;
A semiconductor element in which an electrode pad is disposed below the base so as to correspond to the lead;
The electrode pad of the semiconductor element and the lead of the base are connected via a bump,
The resin is formed so as to cover the inner end of the lead and the surface of the inner lead, and to fill the space between adjacent leads, and the outer end of the lead and the surface of the outer lead are exposed. A semiconductor device characterized by the above. The semiconductor device according to claim 12, wherein
A semiconductor device further comprising a thin plate disposed on a back surface of the semiconductor element.

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