JP2007073572A - Solid-state imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device wherein the identification mark of a solid-state imaging element can be confirmed while the solid-state imaging device is being mounted to a mounting substrate. <P>SOLUTION: The solid-state imaging device 2 is comprised of a solid-state imaging element chip 3 wherein a light receiver and a plurality of input/output pads are formed on the upper surface of a semiconductor substrate made of silicon or the like, a nearly box-like package body 12 made of ceramic, and a lid 13. The recessed housing 13 is formed on the upper surface 12b of the package body 12 to house the solid-state imaging element chip 3, the solid-state imaging element chip 3 is die-bonded in the housing 13, and the opening 13a of the housing 13 is sealed by the lid 15. An identification mark 20 is printed on the side surface 12a of the package body 12 to identify the solid-state imaging element chip 3. Thus, even when the solid-state imaging device 2 is mounted to a mounting substrate 21, the identification mark 20 can be easily confirmed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device in which a solid-state imaging element chip is sealed inside a package.

  In recent years, digital cameras and digital videos using solid-state image sensor chips have become widespread. The solid-state imaging device chip is obtained by forming a light receiving portion and an external connection terminal on a semiconductor substrate made of silicon. In general, a solid-state imaging device chip is mounted on a mounting substrate such as a digital camera in a state of a solid-state imaging device housed in a substantially box-shaped package made of ceramic or plastic.

  The solid-state imaging device stores a solid-state imaging device chip in a concave storage portion formed on the upper surface of the package, and connects the leads formed in the package and external connection terminals with bonding wires, and is formed of transparent glass. The storage part is sealed by the lid. The solid-state imaging device is provided with an identification mark for identifying the solid-state imaging element chip. This identification mark is a lot of information such as a manufacturer's logo, model, product type, assembly lot number, chip number and the like. In the solid-state imaging device, a concave portion is formed on the upper surface of the package, and since there is not enough space, an identification mark is provided on the rear surface of the package.

Further, identification information for identifying the component is provided in the semiconductor component mounted on the mounting substrate. For example, in Patent Document 1, a relief bar code or a matrix code (identification mark) is formed integrally with a package on an upper surface of a package (exterior) constituting a semiconductor component such as a transistor or an integrated circuit.
Japanese Patent Laid-Open No. 06-13475

  However, when the solid-state imaging device as described above is mounted on the mounting substrate, it is impossible to confirm the identification mark provided on the back surface of the package. Therefore, in order to confirm the identification mark after mounting, the solid-state imaging device must be removed from the mounting substrate, which not only takes extra effort, but also when the removed solid-state imaging device is mounted on the mounting substrate again, There have been problems in that the quality and reliability of the imaging device are deteriorated and the solid-state imaging device is damaged. Moreover, in patent document 1, it is not assumed that the recessed part which accommodates a solid-state image sensor chip | tip in the upper surface of a package is provided. For this reason, it is difficult to form a barcode integrally on the upper surface of the package or to form a barcode in a narrow space portion such as the side surface of the package.

  The present invention relates to a solid-state imaging device capable of confirming an identification mark for identifying a solid-state imaging device chip when the solid-state imaging device is mounted on a mounting substrate.

  The solid-state imaging device of the present invention is used as a solid-state imaging device chip, a top surface on which the solid-state imaging device chip is sealed, and a light receiving window for allowing light to enter the solid-state imaging device chip, and a mounting surface. In the solid-state imaging device including a package having a lower surface, an identification mark for identifying the solid-state imaging element chip is provided on the surface of the package other than the mounting surface and the light receiving window. The identification mark is preferably at least one of a character, a code, and a color code. Moreover, it is preferable that the said identification mark is formed in uneven | corrugated shape integrally with the said package.

  The solid-state imaging device of the present invention includes an upper solid-state imaging device chip, an upper surface on which the solid-state imaging device chip is housed and a light receiving window for allowing light to enter the solid-state imaging device chip, and a lower surface used as a mounting surface In the solid-state imaging device including the package having the identification mark, the identification mark for identifying the solid-state imaging element chip is provided on the surface of the package other than the mounting surface and the light receiving window. Can be easily confirmed. In addition, the identification mark can be provided in a small space by using at least one of a character, a code, and a color code. Further, by forming the identification mark integrally with the package in a concavo-convex shape, it can be prevented that the identification mark cannot be confirmed due to peeling or abrasion.

  FIG. 1 is a cross-sectional view showing a configuration of a solid-state imaging device using the present invention. The solid-state imaging device 2 includes a solid-state imaging device chip 3 and a package 5 that houses the solid-state imaging device chip 3, and is an LCC (Leadless chip carrier) type.

  The solid-state imaging device chip 3 is made of, for example, a CCD, a CMOS, or the like, and a light receiving portion 8 and a plurality of input / output pads 9 are formed on the upper surface of a semiconductor substrate 7 made of silicon or the like. For example, photodiodes (PD) are arranged in a matrix in the light receiving unit 8, and a color filter and a microlens (not shown) are provided thereabove. The input / output pad 9 is an electrode pad formed of a conductive metal and is electrically connected to the light receiving unit 8.

  The package 5 includes a substantially box-shaped package body 12 made of, for example, ceramic, a concave storage portion 13 provided on the upper surface of the package body 12, and a plurality of metal pieces insert-molded in the package body 12. The connection terminal 14 of the book and a lid 15 that is bonded to the upper surface of the package main body 12 and seals the storage portion 13 are configured.

  The connection terminal 14 used for electrical connection with the solid-state imaging device chip 3 has a substantially U-shape. The connection terminal 14 includes an inner portion 14 a exposed in the storage portion 13, and the package body 12. The outer pad portion 14b is exposed from the side surface 12a. The lid 15 is formed of a transparent glass plate or plastic plate so that light can enter the solid-state image sensor chip 3.

  In the storage part 13, one step part 17 is formed on the entire circumference so that the cross section is substantially stepped. The external shape of the solid-state image sensor chip 3 is smaller than the stepped portion 17, and when this solid-state image sensor chip 3 is stored in the package 4, it is die-bonded to the bottom surface 13 b of the storage unit 13. The input / output pad 9 of the solid-state imaging device chip 3 and the inner portion 14 a of the lead 14 are connected by the bonding wire 18, and the opening 13 a of the storage portion 13 is sealed with the lid 15. Note that it is also possible to connect the solid-state imaging device chip 3 and the connection terminal 14 using bumps without using the bonding wires 18.

  In the solid-state imaging device 2, a light receiving window 19 is configured from the opening 13 a and the lid 15 of the storage unit 13. The light receiving window 19 makes light incident on the light receiving portion 8 of the solid-state imaging device chip 3 die-bonded to the housing portion 13.

  As shown in FIG. 2, the solid-state imaging device 2 is mounted on the mounting substrate 21 by connecting a mounting pattern 21 a formed on the mounting substrate 21 and the outer pad portion 14 b. Thereby, the lower surface of the package body 12 is used as the mounting surface 12c (see FIG. 1).

  In addition, the solid-state imaging device 2 is provided with an identification mark 20 for identifying the solid-state imaging device chip 3 die-bonded to the storage portion 13 on the side surface 12a of the package body 12 where the outer pad portion 14b is not exposed. Yes. As this identification mark 20, information for identifying the solid-state imaging device chip 3 such as a manufacturer, a manufacturing model, a product type, an assembly lot, and a chip number is appropriately used. Thereby, even after the solid-state imaging device 2 is mounted on the mounting substrate 21, the identification mark 20 of the solid-state imaging device chip 3 can be easily confirmed.

  In the above embodiment, the identification mark 20 is printed on the side surface 12 a of the package body 12. However, the identification mark 20 may be printed on the peripheral edge 12 b of the storage portion 13 as shown in FIG. 3. In this case, since the identification mark 20 is printed on the upper surface of the package body 12 in which the storage unit 13 is formed, the identification mark 20 can be easily confirmed even when the solid-state imaging device 2 is mounted on the mounting substrate 21. . The identification mark 20 may be printed on both the side surface 12a of the package body 12 and the peripheral edge 12b of the storage unit 13. Thereby, since the space for displaying the identification mark 20 increases, more information can be displayed.

  In the above-described embodiment, the identification mark 20 using characters and numbers is printed. Alternatively, information for identifying the solid-state imaging device chip 3 may be associated with a barcode. In this case, as shown in FIGS. 4 and 5, the barcode 22 is printed on the side surface 12a (see FIG. 4) of the package body 12 or the peripheral edge 12b (see FIG. 5) of the storage unit 13 as an identification mark.

  As a result, even when the solid-state imaging device 2 is mounted on the mounting substrate 21, the barcode 22 printed on the side surface 12 a of the package body 12 or the peripheral edge 12 b of the storage unit 13 is easily read by the barcode reader. Information for identifying the element chip 3 can be confirmed.

  In the above-described embodiment, the example in which the identification mark 20 or the barcode 22 is printed on one side surface 12a of the package main body 12 where the outer pad portion 14b is not provided or the peripheral edge 12b of the storage unit 13 has been described. However, the present invention is not limited to this, and the identification mark 20 or the barcode 22 may be provided on two side surfaces of the package body 12 where the outer pad portion 14b is not provided or on the peripheral edge 12b of the storage portion 13, and these may be combined. Also good.

  In addition, although characters, numbers, or barcodes 22 are provided as identification marks on the side surface 12a of the package body 12 or the peripheral edge 12b of the storage unit 13, a color code may be used instead. In this case, a combination of identification information and color is set in advance, and a color code is printed on the side surface 12 a of the package body 12 or the peripheral edge 12 b of the storage unit 13. Thereby, much information can be obtained from the identification mark printed in a small space.

  Further, the LCC type solid-state imaging device 2 in which the outer pad portion 14b is provided on the two side surfaces 12a of the package body 12 has been described. However, the present invention is not limited to this, and a lead pin may be used instead of the outer pad portion 14b. . For example, in a type such as DIP, SOP, and SOJ in which the lead pins protrude from the two side surfaces of the package body, it is preferable to provide the identification mark 20 on the two side surfaces of the package body where the lead pins do not protrude, or on the periphery of the storage portion. In addition, since it is difficult to place the identification mark 20 on the side surface of the package body for types such as QFP and QFJ in which lead pins protrude from the four side surfaces of the package body, it is preferable to provide the identification mark 20 on the periphery of the storage portion.

  In the present embodiment, the ceramic package body 12 has been described. However, a plastic package may be used. In this case, in addition to printing the identification mark 20 on the package body 12, it is preferable to form the identification mark 20 in an uneven shape integrally with the package body 12 by injection molding, press molding, or the like. Thereby, it can prevent that the identification label | marker 20 becomes impossible to confirm by peeling or abrasion. Further, the identification mark 20 printed on the package body 12 may be printed by combining characters, codes, bar codes, color codes, and the like.

It is sectional drawing which shows the structure of the solid-state imaging device of this invention. It is an external appearance perspective view of the solid-state imaging device which provided the identification display on the side surface of the package main body. It is an external appearance perspective view of the solid-state imaging device which provided the identification mark in the periphery of the accommodating part. It is an external appearance perspective view of the solid-state imaging device which provided the barcode on the side surface of the package main body. It is an external appearance perspective view of the solid-state imaging device which provided the barcode in the peripheral part of the accommodating part.

Explanation of symbols

2 Solid-state imaging device 3 Solid-state imaging device chip 5 Package 12 Package body 13 Storage unit 20 Identification mark 21 Mounting substrate 22 Bar code

Claims (3)

A solid-state image sensor chip;
In the solid-state imaging device comprising a package having an upper surface formed with a light receiving window for sealing the solid-state imaging element chip and allowing light to enter the solid-state imaging element chip, and a lower surface used as a mounting surface.
A solid-state imaging device, wherein an identification mark for identifying the solid-state imaging element chip is provided on the surface of the package other than the mounting surface and the light receiving window.   The solid-state imaging device according to claim 1, wherein the identification mark is at least one of a character, a code, and a color code. The solid-state imaging device according to claim 1, wherein the identification mark is formed in an uneven shape integrally with the package.

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