JP4554962B2 - Substrate fixing structure for imaging device of electronic endoscope - Google Patents

Description

  The present invention relates to a substrate fixing structure for an imaging element of an electronic endoscope.

In an electronic endoscope having a solid-state image sensor built in the distal end of the insertion section, generally, an electronic component such as an IC chip or a capacitor is mounted on a wiring board attached to the rear side of the solid-state image sensor (for example, a patent Reference 1).
JP-A-10-192235

  FIG. 4 shows a substrate fixing structure for an image pickup device of a conventional electronic endoscope. Reference numeral 11 denotes a light receiving surface of the solid-state image pickup device 10, and a lead 12 extending rearward along the side surface of the solid-state image pickup device 10. A wiring board 13 is attached to the protruding end portion.

  However, since the mechanical fixing state of the wiring board 13 is very unstable by itself, the electrical insulating block 14 attached to the back surface of the solid-state imaging device 10 is the most of the electronic components 15 mounted on the wiring board 13. The wiring board 13 is fixed to the solid-state imaging device 10 by being attached to the end face of the tall electronic component 15A.

  However, since the height of the electronic component 15A bonded to the electrical insulating block 14 from the wiring board 13 and the inclination of the end face are inevitably varied, the wiring board 13 is inclined with respect to the solid-state imaging device 10. In other words, the lead 12 may be deformed or damaged.

  Therefore, the present invention is capable of firmly fixing a wiring board on which electronic components are mounted in an accurate positional relationship with respect to a solid-state image pickup device, and for an image pickup device of an electronic endoscope that does not cause lead deformation or breakage. An object is to provide a substrate fixing structure.

  In order to achieve the above object, the substrate fixing structure for the image pickup device of the electronic endoscope according to the present invention includes one or a plurality of substrate fixing devices on the rear side of the solid-state image pickup device disposed in the distal end of the insertion portion of the electronic endoscope. In a board fixing structure for an image pickup device of an electronic endoscope to which a wiring board on which electronic components are mounted is attached, a pair of feet protrudes from both ends of the flat plate portion substantially at right angles to the flat plate portion. A substrate fixing pedestal made of an electrical insulating material having a U-shaped cross-section is provided, and the surface of the flat portion of the substrate fixing pedestal is attached to the back surface of the solid-state imaging device, and a pair of feet A wiring board is attached to the back end surface portion.

  The pair of legs of the board fixing base may be formed to have the same length, and the wiring board may be fixed in parallel to the solid-state imaging device. At least one of the electronic components mounted on the wiring board may be used. The portion may be disposed in a space portion surrounded by the pair of feet, the flat plate-like portion, and the wiring board of the board fixing base.

  Moreover, the lead extended from a solid-state image sensor may be arrange | positioned along the outer wall surface of a pair of leg part, and may be connected to the wiring board in the rear end.

  According to the present invention, the surface of the flat plate-like portion of the board fixing base having a cross-section of “U” is pasted on the back surface of the solid-state imaging device, and the wiring board on which the electronic component is mounted is attached to the pair of legs. By being affixed to the sole end surface portion of the portion, the wiring board can be firmly fixed in an accurate positional relationship with respect to the solid-state imaging device, and the lead is not deformed or damaged.

  In the substrate fixing structure for the imaging device of the electronic endoscope in which a wiring board mounted with one or a plurality of electronic components is attached to the rear side of the solid-state imaging device arranged in the distal end of the insertion portion of the electronic endoscope. A board fixing base made of an electrical insulating material having a U-shaped cross section in which a pair of legs protrudes from both ends of the flat plate portion substantially at right angles to the flat plate portion, and is solid. The surface of the flat plate-like portion of the substrate fixing base is affixed to the back surface of the image sensor, and the wiring substrate is affixed to the sole end surface portions of the pair of feet.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 3 schematically shows the distal end portion of the insertion portion 1 of the electronic endoscope incorporating the solid-state imaging device 10, and the solid-state imaging is performed at the projection position of the subject by the objective optical system 3 disposed in the back of the observation window 2. A light receiving surface 11 of the element 10 is disposed.

  FIGS. 1 and 2 are a side sectional view and a perspective view of the solid-state image sensor 10 portion. The objective optical system is formed on the light-receiving surface 11 formed on the front surface side of the solid-state image sensor 10 composed of, for example, a CCD (electrically coupled element). 3 projects the subject image.

  A wiring board 13 on which an electronic component 15 such as an IC chip or a capacitor is mounted is disposed behind the solid-state image sensor 10, and a plurality of leads 12 extending rearward from the side surface portion of the solid-state image sensor 10. Is connected to the wiring board 13.

  The back surface of the solid-state imaging device 10 (that is, the back surface of the light receiving surface 11) is formed in a plane parallel to the light receiving surface 11, and adjacent to the flat plate portion 16a from both ends of the flat plate portion 16a. A board fixing base 16 made of an electrical insulating material having a U-shaped cross section in which a pair of leg portions 16b are formed to protrude in a parallel direction at substantially right angles is disposed.

  The flat plate-like portion 16 a of the substrate fixing base 16 is formed to have a size substantially the same as or slightly smaller than the back surface of the solid-state image sensor 10. The surface of is attached with an adhesive. Therefore, the solid-state imaging device 10 and the substrate fixing base 16 can be firmly fixed.

  The pair of legs 16b of the board fixing base 16 are arranged to have a uniform length. And the foot end surface of each leg part 16b is formed in the plane parallel to the flat part 16a, and the wiring board 13 is fixedly affixed there with the adhesive agent there.

  Therefore, the board fixing base 16 and the wiring board 13 can be firmly fixed, and at the same time, the wiring board 13 is fixed to the solid-state image sensor 10 in a highly accurate positional relationship, and here, The wiring board 13 is always fixed in a parallel direction with respect to the solid-state imaging device 10.

  The plurality of leads 12 extending from the side surface of the solid-state imaging device 10 are arranged along the outer wall surface of each foot portion 16b of the board fixing base 16, and the rear end portions that are the projecting ends of the respective leads 12 are bent inward. And connected and fixed to the wiring board 13.

  Since such a lead 12 has an accurate positional relationship with respect to the solid-state imaging device 10, an unreasonable force does not act on the lead 12 due to connection and fixation with the wiring substrate 13, No damage will occur. Reference numeral 17 denotes an electrical insulating plate attached to the outer surface portion of the lead 12.

  In addition, the electronic component 15 mounted on the front side surface of the wiring board 13 (the surface facing the solid-state imaging device 10) includes a pair of legs 16b and a flat plate portion 16a of the board fixing base 16 and wiring. The space surrounded by the substrate 13 is disposed without touching the substrate fixing base 16, and the space can be used effectively without waste.

It is side surface sectional drawing of the board | substrate fixed structure with respect to the image pick-up element of the electronic endoscope of the Example of this invention. It is a perspective view of the board | substrate fixed structure with respect to the image pick-up element of the electronic endoscope of the Example of this invention. It is the schematic of the insertion part front-end | tip of the electronic endoscope of the Example of this invention. It is side surface sectional drawing of the board | substrate fixed structure with respect to the image pick-up element of the conventional electronic endoscope.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Solid-state image sensor 11 Light-receiving surface 12 Lead | read | reed 13 Wiring board 15 Electronic component 16 Base for board fixation 16a Flat part 16b Foot part

Claims (3)

In the substrate fixing structure for the imaging device of the electronic endoscope in which a wiring board mounted with one or a plurality of electronic components is attached to the rear side of the solid-state imaging device arranged in the distal end of the insertion portion of the electronic endoscope.
Substrate fixed to the cross-sectional shape in which a pair of leg portions at a right angle, each substantially are protruded rearward with respect to both ends of the flat portion of the back of the flat portion is made of shaped electrically insulating material "U" pedestal is provided, Rutotomoni surface of the flat portion of the substrate fixing pedestal is attached to the back of the solid-state imaging device, and the wiring board is attached to the foot end face portion of the pair of leg portions,
At least a part of the electronic component mounted on the wiring board is disposed in a space surrounded by the back surface of the board fixing base, the pair of feet, and the wiring board, and the board fixing base A substrate fixing structure for an image pickup device of an electronic endoscope, characterized in that no electronic component is directly attached to the back surface portion .   The substrate for an image pickup device of an electronic endoscope according to claim 1, wherein the pair of legs of the base for fixing the substrate is formed to have the same length, and the wiring board is fixed in parallel to the solid-state image pickup device. Fixed structure. The imaging element of an electronic endoscope according to claim 1 or 2 , wherein a lead extending from the solid-state imaging element is disposed along an outer wall surface of the pair of legs and connected to the wiring board at a rear end. Board fixing structure against.

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