JP4459701B2 - The tip of the electronic endoscope - Google Patents

Description

  The present invention relates to a distal end portion of an electronic endoscope.

In an electronic endoscope that incorporates a solid-state image sensor at the tip of the insertion portion, a circuit board on which electronic components constituting a drive circuit of the solid-state image sensor are attached is arranged adjacent to the rear side of the solid-state image sensor, A plurality of signal lines drawn from the tip of the signal cable inserted and arranged in the insertion portion are connected to a plurality of connection terminal portions provided in a wiring portion of the circuit board (for example, Patent Document 1).
JP 2000-199863 A

  In the conventional electronic endoscope as described above, a plurality of connection terminal portions are formed in a flat shape on the rear end portion of the circuit board formed in a flat plate shape, and a plurality of lead wires are drawn out from the front end of the signal cable. These signal lines are individually connected and fixed to the respective connection terminal portions by soldering or the like.

  Therefore, when soldering the signal line to the connection terminal part, if the molten solder etc. is inadvertently flowing toward the adjacent connection terminal part, it will conduct between the connection terminal parts. Work requires advanced skills and skill.

  If the circuit board is miniaturized as the solid-state imaging device is miniaturized due to technological advancement, the leakage of the signal line to the connection terminal part of the circuit board in the operation of soldering the signal line to the adjacent connection terminal part It was more difficult to avoid.

  Therefore, according to the present invention, when the signal line of the signal cable is connected to the connection terminal portion of the circuit board by soldering or the like, the melted solder or the like hardly adheres to the adjacent connection terminal portion, and the signal line connection work is easy. It is an object of the present invention to provide a distal end portion of an electronic endoscope that can be performed.

  In order to achieve the above object, the distal end portion of the electronic endoscope of the present invention is drawn out from the distal end of a signal cable that has a solid-state imaging device and a circuit board built into the distal end of the insertion portion and is inserted and disposed in the insertion portion. The plurality of signal lines are erected with respect to each connection terminal portion of the circuit board at the distal end portion of the electronic endoscope connected to the plurality of connection terminal portions provided in the wiring portion of the circuit board. A three-dimensional relay member made of a conductive material having a terminal mounting portion connected and fixed in a state and a signal line mounting portion to which a signal line is connected and fixed is provided.

  If multiple types of relay members with different heights from the terminal mounting portion to the signal line mounting portion are used, the molten excess solder or the like is connected to the adjacent relay when connecting the signal lines. Not only is it difficult to adhere to the member, but the signal lines can be arranged so as not to interfere with each other, so that the signal line can be easily connected.

The relay member may be a columnar or conical member.
Further, the signal line mounting portion may be the top surface of the relay member, a groove formed in the top portion of the relay member, or a hole formed through the trunk portion of the relay member. There may be.

  According to the present invention, from a conductive material having a terminal mounting portion that is connected and fixed in a standing condition with respect to each connection terminal portion of the circuit board, and a signal line mounting portion that is connected and fixed to a signal line. By providing a three-dimensional relay member, when connecting the signal line of the signal cable to the connection terminal portion of the circuit board by soldering or the like, it is difficult for molten solder or the like to adhere to the adjacent connection terminal portion, The signal line can be easily connected.

  A solid-state imaging device and a circuit board are built in the distal end of the insertion portion, and a plurality of signal lines led out from the distal end of the signal cable inserted and arranged in the insertion portion are provided in a wiring portion of the circuit board. At the distal end portion of the electronic endoscope connected to the connection terminal portion, a terminal mounting portion that is connected and fixed in a standing state with respect to each connection terminal portion of the circuit board, and a signal line to which the signal line is connected and fixed A three-dimensional relay member made of a conductive material having an attachment portion is provided, and a plurality of types of relay members having different heights from the terminal attachment portion to the signal line attachment portion are used.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 2 shows the distal end portion of the insertion portion of the electronic endoscope incorporating the solid-state imaging device 5, and the bending portion 1 formed at the distal end portion of the insertion portion flexible tube (not shown) can be inserted. It bends at an arbitrary angle in an arbitrary direction by a remote operation from an operation unit provided on the proximal end side of the flexible tube.

  An observation window 3 or the like is disposed on the distal end surface of the distal end main body 2 connected to the distal end of the bending portion 1. For example, a CCD is placed at the projection position of the subject by the objective optical system 4 built in the back of the observation window 3. An imaging surface 6 of a solid-state imaging device 5 made of (charge coupled device) is disposed.

  In the imaging unit frame 7 that holds the objective optical system 4 and the solid-state imaging device 5, a circuit board 8 to which an electronic component 9 such as a capacitor or an IC chip constituting a driving circuit of the solid-state imaging device 5 is attached, The solid-state image pickup device 5 is fixedly disposed with respect to the solid-state image pickup device 5 adjacent to the rear side of the solid-state image pickup device 5. The circuit board 8 is formed of a block body made of ceramics, for example.

  Reference numeral 11 denotes a signal cable inserted and arranged over the entire length in the insertion portion, and a plurality of signal lines 12 drawn from the distal end thereof are connected to a plurality of connection terminal portions 10 arranged in a plane on the wiring portion of the circuit board 8. These are connected and fixed by soldering or the like via columnar relay members 20 and 21 made of conductive members. Reference numeral 13 denotes a lead connected to the circuit board 8 from the solid-state imaging device 5 side.

  As shown also in FIG. 1 illustrating a state in which such a circuit board 8 portion is viewed obliquely from the rear, each relay member 20 and 21 formed in a columnar shape has a bottom surface (terminal mounting portion) having a circuit. The connection is fixed by soldering or the like in a state of being erected with respect to the connection terminal portion 10 of the substrate 8, and the signal line 12 is connected and fixed to the top surface (signal line attachment portion 22) by soldering or the like. However, the relay members 20 and 21 are not limited to a cylindrical shape, and may have any three-dimensional shape such as a prismatic shape, a conical shape, or a pyramid shape.

  Such relay members 20 and 21 are arranged in such a manner that three short relay members 20 are arranged in a horizontal line at the rear end portion of the circuit board 8 so as to be aligned with the position of the connection terminal portion 10. Two tall relay members 21 are arranged side by side and spaced apart from each other at a forward position. FIG. 1 shows a state in which the signal line 12 is connected and fixed to only one of the five relay members 20 and 21.

  In this way, the signal lines 12 can be attached to the plurality of connection terminal portions 10 located on the same plane in a three-dimensional positional relationship with a space between them, and the relay members 20 and 21 are connected to each other. In the operation of connecting the signal line 12 to each connection terminal portion 10, it is difficult for the molten excess solder to come into contact with the adjacent relay members 20 and 21, and the connection operation of the signal line 12 can be easily performed. it can.

  Further, since a plurality of relay members 20 and 21 having different heights from the terminal mounting portion on the bottom surface to the signal line mounting portion 22 on the top surface are used, the molten excess solder or the like is relayed next to the relay member 20 or 21. In addition to being difficult to adhere to the members 20 and 21, the signal lines 12 attached to the relay members 20 and 21 can be arranged so as not to interfere with each other.

  The signal line attachment portion 22 may be a groove formed at the top of the relay members 20 and 21 as in the second embodiment shown in FIG. 3, or the third embodiment shown in FIG. The through-hole etc. which were formed in the state which crosses the trunk | drum of the relay members 20 and 21 like an Example may be sufficient.

  The connection fixing of the relay members 20 and 21 to the connection terminal portion 10 and the connection fixing of the signal line 12 to the relay members 20 and 21 are not limited to soldering, and may be performed by laser welding, caulking, or the like. The work procedure for connecting and fixing the relay members 20 and 21 to the portion 10 and connecting and fixing the signal line 12 to the relay members 20 and 21 may be performed first.

It is the perspective view of the state which looked at the circuit board part of 1st Example of this invention from diagonally backward. It is side surface sectional drawing of the insertion part front-end | tip of the electronic endoscope of 1st Example of this invention. It is the perspective view of the state which looked at the circuit board part of the 2nd Example of this invention from diagonally backward. It is the perspective view of the state which looked at the circuit board part of the 3rd Example of this invention from diagonally backward.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Tip part main body 4 Objective optical system 5 Solid-state image sensor 8 Circuit board 9 Electronic component 10 Connection terminal part 11 Signal cable 12 Signal line 20, 21 Relay member 22 Signal line attachment part

Claims (5)

And the solid-state image sensor and the circuit board are incorporated in the distal end of the insertion portion, a plurality of signal lines from the tip of the insertion arrangement signal cable into the insertion portion is drawn out, a plurality for connecting said plurality of signal lines In the distal end portion of the electronic endoscope in which the connection terminal portion is provided on the same plane on the wiring portion of the circuit board,
A relay member made of a single three-dimensional conductive member having a bottom surface fixed to the surface of the connection terminal portion is individually erected from the surface of each connection terminal portion,
Each of the relay members is formed with a signal line attachment portion to which the signal line is connected and fixed in a direction parallel to the surface of the connection terminal portion.
Of the relay members, the relay member arranged at a position far from the tip of the signal cable is formed taller than the relay member located near the tip of the signal cable ,
The tip of the electronic endoscope characterized in that the height from the surface of the connection terminal portion to the signal line mounting portion of each relay member differs corresponding to the height of the back of each relay member Department. Tip of the electronic endoscope of the relay member is a columnar or conical member according to claim 1 Symbol placement. The distal end portion of the electronic endoscope according to claim 1 or 2 , wherein the signal line attachment portion is a top surface of the relay member. The distal end portion of the electronic endoscope according to claim 1 or 2 , wherein the signal line attachment portion is a groove formed in a top portion of the relay member. The distal end portion of the electronic endoscope according to claim 1 or 2 , wherein the signal line attachment portion is a hole formed through the trunk portion of the relay member.

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