JP2019195382A - Imaging unit and oblique-viewing type or side-viewing type endoscope - Google Patents

Abstract

To provide an imaging unit which prevents image deterioration, is easily assembled and adjusted and enables reduction in strength thereof to be suppressed, and an oblique-viewing type or side-viewing type endoscope.SOLUTION: An imaging unit 100 in the present invention is used in an oblique-viewing type or side-viewing type endoscope, and includes an objective lens 11, a lens frame 12, an imaging device 20a, a cover glass 21 protecting the imaging device 20a, an FPC board 22 on which the imaging device 20a is mounted, a holding substrate 30 holding the FPC board 22, and a holding frame 40 having a fitting part 41 fitting and holding the lens frame 12 and a storage part 42 for storing the imaging device 20a or the like. The storage part 42 has a plurality of abutment surfaces, and the holding substrate 30 and the cover glass 21 are abutted on the abutment surfaces.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an imaging unit and a perspective or side view endoscope used in a perspective or side view endoscope for observing the inside of a subject from an oblique direction or a side.

  2. Description of the Related Art Conventionally, endoscopes that can be used for various therapeutic treatments using a treatment instrument inserted into a subject and observing the examination site and inserted into a treatment instrument channel as necessary have been widely used. As the endoscope, a side view type and a perspective type in which the arrangement direction of the lens unit is changed are used in addition to the normal view type for observing the front according to the observation direction.

  As a perspective type endoscope, the lens unit is arranged so that the optical axis of the lens unit is inclined with respect to the endoscope axis, and the imaging element is arranged in parallel with the lens unit (the light receiving surface of the imaging element is the lens unit). An endoscope that is connected to the terminals of the image sensor by bending the end of a flexible printed circuit board that is mounted in parallel with the endoscope axis. A mirror has been proposed (see, for example, Patent Document 1).

  Further, a perspective view in which light from a lens unit arranged so that the optical axis is inclined with respect to the endoscope axis is incident on a solid-state imaging device having a light receiving surface orthogonal to the endoscope axis via a prism. A type endoscope has been proposed (see, for example, Patent Document 2).

JP 2009-39434 A Japanese Patent Laid-Open No. 2001-212074

  However, in the endoscope of Patent Document 1, the imaging unit is assembled to the distal end main body while holding the rear end of the imaging unit. The imaging element is fixed to the element frame via a plurality of cover glasses. Therefore, the twisting force is easily applied to the adhesive surface of the cover glass, and the adhesive surface may be peeled off. In addition, when the bending portion is bent when the endoscope is used, stress is applied to the adhesive surface with the cover glass, and the adhesive surface may be peeled off. In addition, the endoscope disclosed in Patent Document 2 has a problem in that the image quality deteriorates because the processing accuracy of the prism does not accompany the recent increase in the number of pixels of the image sensor and the reduction in the pixel pitch.

  The present invention has been made in view of the above, and provides an imaging unit and a perspective-type or side-view-type endoscope that prevent deterioration in image quality, can be easily adjusted, and can suppress a decrease in strength. The purpose is to do.

  In order to solve the above-described problems and achieve the object, an imaging unit according to the present invention includes a perspective type or a side-view type in which an observation axis intersects an endoscope axis that is a longitudinal direction of the distal end portion of the endoscope. In an imaging unit used for a endoscope, an optical system, a lens frame that holds the optical system, an imaging element that converts an optical image formed by the optical system into an image signal, and a cover glass that protects the imaging element An FPC board on which the imaging element is mounted; a holding board that has an inclined surface that is orthogonal to the observation axis; and that holds the FPC board; a fitting part that fits and holds the lens frame; and the cover glass; A holding frame having a part of the FPC board on which the imaging device is mounted and a holding part for receiving the holding board, and the storage part has a first contact on the front end side parallel to the observation axis. The contact surface and the first contact surface A second contact surface that is connected to the first contact surface and the second contact surface, and a third contact surface that is orthogonal to the observation axis, and A front end portion orthogonal to the inclined surface of the holding substrate and one side surface portion orthogonal to the front end portion are applied to the first contact surface and the second contact surface, respectively, and the cover glass is It is applied to the third contact surface.

  The imaging unit according to the present invention is characterized in that, in the above invention, the holding substrate has a wall portion for positioning the imaging element on the inclined surface.

  In the imaging unit according to the present invention, in the above invention, the FPC board includes an imaging element mounting area for mounting the imaging element, an electronic component mounting area for mounting an electronic component, and a cable mounting area for mounting a cable. The holding substrate is formed of the inclined surface, has a first region for holding the image sensor mounting region of the FPC board, and a surface parallel to the endoscope axis. And a second area for holding an electronic component mounting area.

  In the imaging unit according to the present invention as set forth in the invention described above, the holding substrate has at least one bent portion in the second region.

  In the imaging unit according to the present invention, in the above invention, the FPC board includes an imaging element mounting area for mounting the imaging element, an electronic component mounting area for mounting an electronic component, and a cable mounting area for mounting a cable. The holding substrate is formed of the inclined surface, has a first region for holding the image sensor mounting region of the FPC board, and a surface parallel to the endoscope axis. And an electronic component mounting area and a second area for holding the cable mounting area.

  In the imaging unit according to the present invention, in the above invention, the FPC board includes an imaging element mounting area for mounting the imaging element and a cable mounting area for mounting a cable. A bent portion is provided between the cable mounting region and the cable mounting region.

  The imaging unit according to the present invention is characterized in that, in the above invention, the holding substrate has a circuit portion.

  In the imaging unit according to the present invention, the first contact surface, the second contact surface, and the third contact surface are the front end portion and the side surface portion of the holding substrate. And bonded to the cover glass.

  In addition, a perspective type or side view type endoscope according to the present invention includes an insertion unit in which the imaging unit according to any one of the above is disposed at a distal end.

  The present invention holds a semiconductor package by a holding substrate via an FPC substrate, positions the holding substrate and the cover glass in contact with the holding portion of the holding frame, and positions them by bonding, and also contacts the cover glass and the holding frame. Since the image pickup unit is held and fixed by the image pickup unit, the image pickup unit can be positioned with high accuracy and stress can be distributed over the entire bonding portion, and the peeling of the bonding portion can be reduced. You can get a mirror.

FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the imaging unit according to the first embodiment of the present invention. FIG. 3 is a perspective view of the imaging unit shown in FIG. 4 is a perspective view from another direction of the imaging unit shown in FIG. FIG. 5 is a cross-sectional view of the imaging unit of FIG. 3 (a cross section on a plane including an endoscope axis and an observation axis). FIG. 6 is a cross-sectional view of the imaging unit of FIG. 3 (a cross section taken along a plane that includes the observation axis and is orthogonal to the endoscope axis). FIG. 7 is a diagram for explaining the connection between the holding substrate and the FPC substrate in FIG. 3. FIG. 8 is a cross-sectional view of the imaging unit according to the first modification of the first embodiment of the present invention. FIG. 9 is a cross-sectional view of the imaging unit according to the second modification of the first embodiment of the present invention. FIG. 10 is a diagram illustrating an example of an FPC board having a bent portion. FIG. 11 is a diagram illustrating an example of an FPC board having a bent portion. FIG. 12 is a cross-sectional view of the imaging unit according to the second embodiment of the present invention. FIG. 13 is a cross-sectional view of the imaging unit according to the third embodiment of the present invention. 14A is a cross-sectional view of an imaging unit according to Modification 1 of Embodiment 3 of the present invention, and FIG. 14B is a bottom view thereof. FIG. 15 is a cross-sectional view of an imaging unit according to Modification 2 of Embodiment 3 of the present invention. FIG. 16 is a cross-sectional view of the imaging unit according to the fourth embodiment of the present invention. FIG. 17 is a cross-sectional view of an imaging unit according to the fifth embodiment of the present invention.

  In the following description, an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

(Embodiment 1)
FIG. 1 is a diagram schematically illustrating an overall configuration of an endoscope system 1 according to the first embodiment of the present invention. As shown in FIG. 1, an endoscope system 1 according to the first embodiment includes an endoscope 2 that is inserted into a subject, images the inside of the subject, and generates an image signal in the subject. An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information And a display device 5 for displaying an image signal after image processing by the processing device 3.

  The endoscope 2 is a perspective type endoscope that observes the inside of a subject from an oblique direction, and includes an insertion portion 6 that is inserted into the subject, and a proximal end side of the insertion portion 6 that is an operator. Is provided with an operation unit 7 that is gripped by the robot and a flexible universal cord 8 that extends from the operation unit 7.

  The insertion portion 6 is realized using an illumination fiber, an electric cable, an optical fiber, or the like. The insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b. Flexible tube portion 6c. The distal end portion 6a is provided with a light guide cable that illuminates the inside of the subject via an illumination lens, an observation portion that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle. Yes.

  The operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment instrument insertion portion 7b in which a treatment instrument such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3. A plurality of switch units 7c for operating peripheral devices such as the light source device 4, the air supply device, the water supply device, and the gas supply device. The treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.

  The universal cord 8 is configured using an illumination fiber, a cable, or the like. The universal cord 8 is branched at the base end, one end of the branch is the connector 8a, and the other base end is the connector 8b. The connector 8a is detachable from the connector of the information processing apparatus 3. The connector 8b is detachable from the light source device 4. The universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber. Further, the universal code 8 transmits an image signal picked up by an image pickup unit described later to the information processing apparatus 3 via a cable and a connector 8a.

  The information processing device 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.

  The light source device 4 is configured using a light source that emits light, a condensing lens, and the like. The light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.

  The display device 5 is configured using a display or the like using liquid crystal or organic EL (Electro Luminescence). The display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize a desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.

Next, the configuration of the distal end portion 6a of the endoscope 2 will be described in detail. FIG. 2 is a cross-sectional view of the imaging unit 100 according to the first embodiment of the present invention. FIG. 3 is a perspective view of the imaging unit shown in FIG. 4 is a perspective view from another direction of the imaging unit shown in FIG. FIG. 5 is a cross-sectional view of the imaging unit of FIG. 3 (a cross section in a plane including the endoscope axis O ₁ and the observation axis O ₂ ). FIG. 6 is a cross-sectional view of the imaging unit of FIG. 3 (a cross section in a plane including the observation axis O ₂ and orthogonal to the endoscope axis O ₁ ). FIG. 7 is a diagram for explaining the connection between the holding substrate and the FPC substrate in FIG. 3. 3 to 5, the lens unit 10 and the collective cable 50 are not shown.

The imaging unit 100 includes a plurality of objective lenses 11a, 11b, and 11c, lens frames 12a and 12b that hold the objective lenses 11a to 11c, and an image sensor that converts an optical image formed by the objective lenses 11a to 11c into an image signal. A rectangular semiconductor package 20 having terminals 20a having terminals arranged in a grid on the back surface, a cover glass 21 that protects the image sensor 20a, an FPC board 22 on which the semiconductor package 20 is mounted, and an observation axis An FPC board 22 having an inclined surface orthogonal to O ₂ and holding the FPC board 22, a fitting part 41 for fitting and holding the lens frame 12 b, the cover glass 21, and the semiconductor package 20. And a holding frame 40 having a storage portion 45 for storing a part of the holding substrate 30.

The lens unit 10 includes a plurality of objective lenses 11a, 11b, and 11c, and lens frames 12a and 12b that hold the objective lenses 11a to 11c, and the lens holder 12a is inserted and fixed inside the distal end portion main body. By this, it is being fixed to the front-end | tip part main body. The lens unit 10 is disposed so that the optical axis O ₂ intersects the endoscope axis O ₁ . FIG. 2 shows a rear perspective type endoscope, and an angle θ between the optical axis O ₂ of the lens unit 10 and the endoscope axis O ₁ is larger than 90 ° and smaller than 180 °. The endoscope may be a front perspective view in which the angle θ intersecting the mirror axis O ₁ is 0 ° or more and less than 90, or a 90 ° side view type endoscope. The endoscope 2 observes the inside of the subject from an oblique direction or a side. The optical axis _{O 2} is viewing axis.

  In the first embodiment, the objective lenses 11a and 11b are held by the lens frame 12a, and the objective lens 11c is held by the lens frame 12b. By decentering or rotating the lens frames 12a and 12b with each other, it is possible to effectively correct the eccentricity deviation. When the objective lenses 11a to 11c are dispersed and held by the two lens frames 12a and 12b, the objective lens 11a and 11b having negative power and the objective lens 11c having positive power are divided into the lens frame 12a, It is preferable to hold at 12b. Thereby, adjustment margins such as eccentricity deviation and one-sided blur can be reduced, and an increase in the outer diameter size of the imaging unit 100 can be prevented. Adjustment of eccentricity deviation etc. may be performed by rotating and / or decentering the lens frame 12a fitted to the lens frame 12b. Although the adjustment allowance increases, the objective lenses 11a to 11c may be held by one lens frame.

The semiconductor package 20 is disposed so that the light receiving surface is orthogonal to the optical axis O ₂ of the lens unit 10. A sensor electrode (not shown) is formed on the back surface of the semiconductor package 20. The semiconductor package 20 performs wiring, electrode formation, resin sealing, and dicing on the imaging element chip in a wafer state, and finally the CSP (Chip Size) in which the size of the imaging element chip becomes the size of the semiconductor package 20 as it is. Package).

On the surface side of the semiconductor package 20, a cover glass 21 that protects the image sensor 20a is bonded with an optical adhesive. The cover glass 21 preferably has a larger projected area in the direction orthogonal to the optical axis O ₂ than the semiconductor package 20. By making the cover glass 21 larger than the semiconductor package 20, it is possible to reduce the influence on the semiconductor package 20 when the cover glass 21 is applied to a holding frame 43 described later and aligned.

The FPC board 22 includes a semiconductor package mounting region 23 for mounting the semiconductor package 20, an electronic component mounting region 24 having a connection electrode 26 for mounting an electronic component 60, and a cable mounting region having a cable connection electrode 27 for mounting a cable 51. 25. A core wire 52 of a cable 51 routed from the collective cable 50 is connected to the cable connection electrode 27. The FPC board 22 is bent between the semiconductor package mounting area 23 and the electronic component mounting area 24. The FPC board 22 is bent so that the semiconductor package mounting area 23 is orthogonal to the optical axis O _2, and the electronic component mounting area 24 and the cable mounting area 25 are parallel to the endoscope axis O ₁ . The sensor electrode of the semiconductor package 20 is mounted on an electrode (not shown) of the FPC board 22 with a bonding member 28 such as a solder ball, a metal core solder ball, a resin core solder ball, or an Au bump.

The holding substrate 30 is made of a hard material and holds the FPC substrate 22. The holding substrate 30 has an inclined surface, and includes a first region 31 for holding the semiconductor package mounting region 23 of the FPC board 22 and a surface parallel to the endoscope axis O _1, and the electronic component mounting region of the FPC board 22. And a second region 32 holding 24.

  As shown in FIG. 7, the holding substrate 30 has a side wall portion 33 and a front end wall portion 34 in a first region 31 that is an inclined surface. The length r1 between the side walls 33 is substantially the same as the length r2 in the width direction of the cover glass 21 (see FIG. 6), and the length r3 of the first region 31 is the length r4 of the cover glass. Is substantially the same as or slightly longer (see FIG. 5). The height h1 of the side wall portion 33 and the front end wall portion 34 is smaller than the total height h2 of the cover glass 21, the semiconductor package 20, the bonding member 28, and the FPC board 22. By fitting the cover glass 21 into the first region 31 surrounded by the side wall portion 33 and the front end wall portion 2434, the semiconductor package 20 can be accurately aligned. In the present specification, the distal end side of the endoscope 2 will be described as the front end side, and the operation unit side will be described as the proximal end side.

  From the viewpoint of improving the alignment of the semiconductor package 20, it is preferable to provide the side wall portion 33 and the front end wall portion 34. However, if the alignment accuracy can be improved, the alignment may be performed using an alignment mark or the like. It is not always necessary to provide a wall. Further, only the side wall portion 33 or only the front end wall portion 34 may be formed.

The holding frame 40 includes a fitting portion 41 that fits and holds the lens frame 12b, a cover glass 21, a semiconductor package mounting region 23 of the FPC board 22 on which the semiconductor package 20 is mounted, and a first region 31 of the holding substrate 30. And a storage portion 42 for storing. The storage portion 42 includes a first contact surface 43 on the front end side parallel to the optical axis O ₂ , a second contact surface 44 that is connected perpendicularly to the first contact surface 43, and a fitting portion 41. And a third contact surface 45 orthogonal to the optical axis O ₂ . In the imaging unit 100 according to the first embodiment, the outer peripheral surface of the front end wall portion 34 that is orthogonal to the inclined surface of the holding substrate 30 and the outer peripheral surface of one side wall portion 33 that is connected orthogonally to the front end wall portion 34 are the first. By applying to the first contact surface 43 and the second contact surface 44 respectively, and applying the upper surface 21a of the cover glass 21 disposed in the first region 31 to the third contact surface 45, the semiconductor The package 20 and the lens unit 10 are aligned. The first contact surface 43, the second contact surface 44, and the third contact surface 45 are bonded and fixed to the outer peripheral portions of the front end wall portion 34 and the side wall portion 33 and the surface of the cover glass 21. Yes.

  The proximal end sides of the holding substrate 30 and the holding frame 40 are covered with a heat shrinkable tube 71, and the inside of the heat shrinkable tube 71 and the storage portion 42 is filled with a sealing resin 70.

  In the first embodiment, the outer peripheral surface of the front end wall portion 34, the outer peripheral surface of the one side wall portion 33, and the upper surface 21 a of the cover glass 21 are connected to the first abutting surface 43 and the second inner surface of the storage portion 42. By making contact with the contact surface 44 and the third contact surface 45, the semiconductor package 20 and the lens unit can be easily aligned. Further, the image pickup unit 100 is not fitted with a cover glass as in Patent Document 1, but is simply fitted and fixed by fitting the holding substrate 30 and the holding frame 40. Thereby, the twisting force applied to the rear end side of the imaging unit 100 is not easily transmitted to the adhesive surface of the cover glass, and peeling of the adhesive surface can be prevented. Furthermore, since the imaging unit 100 is bonded and fixed to the holding frame 40 via the cover glass 21 and the holding substrate 30, even when stress is applied to the imaging unit 100, the area where the stress is applied can be dispersed, Generation | occurrence | production of peeling can be prevented.

  In the first embodiment, the second area of the holding board 30 holds the electronic component mounting area 24 of the FPC board 22, but holds the electronic component mounting area 24 and the cable mounting area 25. It may be. FIG. 8 is a cross-sectional view of an imaging unit 100A according to the first modification of the first embodiment of the present invention. In FIG. 8, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

Holding substrate 30A is made of the inclined surface, a first region 31 for holding a semiconductor package mounting region 23 of the FPC board 22, consists of a plane parallel to the endoscope axis _{O 1,} the electronic component mounting region of the FPC board 22 24 and a second area 32A for holding the cable mounting area 25.

  The imaging unit 100A is excellent in rigidity because the second region 32A holds the electronic component mounting region 24 and the cable mounting region 25 in addition to the effects exhibited by the imaging unit 100 of Embodiment 1, and the rear end portion of the imaging unit 100A Occurrence of peeling of the bonded portion when holding and assembling to the main body of the tip portion can be further reduced.

  Further, when the electronic component 60 is not mounted on the FPC board, the holding board may be formed only from the first region formed of the inclined surface. FIG. 9 is a cross-sectional view of the imaging unit 100B according to the second modification of the first embodiment of the present invention. In FIG. 9, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

The FPC board 22 </ b> B has a semiconductor package mounting area 23 for mounting the semiconductor package 20 and a cable mounting area 25 for mounting the cable 51. The holding substrate 30B has an inclined surface orthogonal to the observation axis O ₂ and includes a first region 31 that holds the semiconductor package mounting region 23 of the FPC substrate 22B.

  The imaging unit 100B can adjust the extension angle of the cable mounting region 24 of the FPC board 22B in addition to the effects exhibited by the imaging unit 100 of the first embodiment. The accommodation efficiency of things can be increased.

  In the imaging unit 100B, it is preferable to provide a bent portion on the FPC board so that the extension angle of the cable mounting region 25 of the FPC board 22B is a predetermined angle. FIG. 10 is a diagram illustrating an example of the FPC board 22 </ b> B having the bent portion 29.

  The FPC board 22B is made of an insulating base material 22a and a metal or an alloy, and the first wiring layer 22b, the second wiring layer 22c, the first wiring layer 22b, and the second wiring formed on both surfaces of the base material 22a. A first resist layer 22d and a second resist layer 22e covering the layer 22c are provided.

  The FPC board 22 </ b> B has a bent portion 29 between the semiconductor package mounting area 23 and the cable mounting area 25. In the bent portion 29, the first resist layer 22d and the second resist layer 22e are removed to make it easier to bend the FPC board 22B and to easily adjust the extension angle of the cable mounting region 25 to a predetermined angle.

  Further, the bent portion may be one having a reduced width as well as a reduced thickness as in the FPC board 22B. FIG. 11 is a diagram illustrating an example of an FPC board 22D having a bent portion 29D.

The FPC board 22 </ b> D has a bent portion 29 </ b> D between the semiconductor package mounting area 23 and the cable mounting area 25. The bending portion 29D, the wiring to the cable connection electrode 27 is arranged closer to the central axis parallel direction to the endoscope axis O ₁ of the FPC board 22D, both sides of the substrate are taken hollowed. The length r6 in the width direction of the bent portion 29D is shorter than the length r5 in the width direction in the semiconductor package mounting region 23 and the cable mounting region 25 of the FPC board 22D. In the bending portion 29D, the FPC board 22D is easily bent by scraping the base material, and the extension angle of the cable mounting region 25 is easily adjusted to a predetermined angle.

(Embodiment 2)
In the imaging unit according to Embodiment 2, cable mounting areas are provided on both sides of the FPC board. FIG. 12 is a cross-sectional view of the imaging unit 100E according to the second embodiment of the present invention. In FIG. 12, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

  The FPC board 22E has cable mounting areas 25 on both sides, and the cable 51 is mounted on both sides of the FPC board 22E. The imaging unit 100E does not have the electronic component mounting area 24, the second area 32 of the holding substrate 30 holds only the vicinity of the bent portion 29, and does not hold the cable mounting area 25. Since the rigidity of the cable mounting area 25 is smaller than when held by the holding substrate 30, it is added to the rear end side of the imaging unit when the imaging unit is assembled to the scope distal end main body, during repair, or when the endoscope is actually used. By applying a load, stress can be reduced at the cover glass joint. As a result, breakage of the cover glass joint can be prevented.

(Embodiment 3)
The imaging unit according to Embodiment 3 has at least one bent portion in the second region 32. FIG. 13 is a cross-sectional view of the imaging unit 100F according to the third embodiment of the present invention. In FIG. 13, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

  The holding substrate 30F has an inclined surface, and a first region 31 that holds the semiconductor package mounting region 23 of the FPC board 22F, an electronic component mounting region 24 of the FPC board 22F, and a part of the cable mounting region. 2nd area | region 32F, and the 1st bending part 36a and the 2nd bending part 36b are formed in the 2nd area | region 32F. In addition, the holding substrate 30F has a circuit unit and enables the electronic component 60 to be mounted.

Second region 32F of the holding substrate 30F is extended in parallel with the endoscope axis _{O 1} from the first region 31, bent in the direction of the central axis of the imaging unit 100F in the first bend portion 36a, the second parallel to bend the endoscope shaft O ₁ at the bent portion 36b. The FPC board 22F is also bent along the first bent part 36a and the second bent part 36b of the holding board 30F. It is on the surface side of the FPC board 22F, between the first bent part 36a and the second bent part 36b, and on the base end side from the second bent part 36b of the second region 32F of the holding board 30F. Thus, the electronic component 60 is mounted on the side surface opposite to the surface in contact with the FPC board 22F.

  The cable 51 is mounted on the cable mounting area 25 provided on both surfaces of the FPC board 22F. The cable mounting area 25 on the front surface side of the FPC board 22F is held in the second area 32F of the holding board 30F, but the cable mounting area 25 on the front surface side of the FPC board 22F is the second area of the holding board 30F. You may provide in the part which is not hold | maintained at 32F.

  The imaging unit 100F according to the third embodiment provides the first bent portion 36a and the second bent portion 36b in the second region 32F of the holding substrate 30F, so that the central axis of the aggregate cable 50 is the center of the imaging unit 100F. It is close to the axis. Thereby, in addition to the effect which the imaging unit 100 of Embodiment 1 has, the diameter of the endoscope can be reduced, and the mounting density of the electronic components 60 and the cables 51 can be improved.

  In the third embodiment, the circuit unit is formed on the holding substrate 30F and the electronic component 60 is mounted on the holding substrate 30F. However, the concave portion is formed on the holding substrate to accommodate the electronic component mounted on the FPC substrate. May be. FIG. 14A is a cross-sectional view of the imaging unit 100J according to the first modification of the third embodiment of the present invention, and FIG. 14B is a bottom view of the imaging unit 100J. In FIG. 14, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

  In the holding substrate 30J, a recess 35J penetrating in the thickness direction is formed on the base end side from the second bent portion 36b. The electronic component 60 mounted on the base end side from the second bent portion 36b on the back surface side of the FPC board 22J is accommodated in the recess 35J. In the imaging unit 100J, in addition to the effects exhibited by the imaging unit 100 of the first embodiment, the endoscope can be reduced in diameter and the mounting density of the electronic components 60 and the cables 51 can be improved.

  In addition, the bending part provided in the 2nd area | region of a holding substrate should just be able to make the center axis | shaft of the assembly cable 50 close to the center axis | shaft of the imaging unit 100F, and one bending part may be sufficient as it. FIG. 15 is a cross-sectional view of an imaging unit 100G according to the second modification of the third embodiment of the present invention. In FIG. 15, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

Second region 25G of the holding substrate 30G is extended in parallel with the endoscope axis _{O 1} from the first region 31 is bent toward the central axis of the imaging unit 100G in the first bent portion 26a. The FPC board 22G is also bent along the first bent portion 26a of the holding board 30G. An electronic component 60 is mounted on the surface side of the FPC board 22G with the first bent part 26a interposed therebetween.

  The cable 51 is mounted on a cable mounting area 25G provided on the back side of the FPC board 22G.

  Also in the imaging unit 100G, by providing the first bent portion 26a in the second region 25G of the holding substrate 30G, the central axis of the collective cable 50 can be brought close to the central axis of the imaging unit 100G. The diameter can be increased, and the mounting density of the electronic component 60 and the cable 51 can be improved.

  In the third embodiment and the modification, the holding substrate is bent in the central axis direction of the imaging unit from the viewpoint of reducing the diameter, but depending on the built-in object at the tip, it is not always necessary to bend in the central axis direction. It is possible to optimize the accommodation efficiency of the built-in object at the tip by bending it vertically or horizontally.

(Embodiment 4)
In the imaging unit according to Embodiment 4, the electronic component mounting area of the FPC board is provided on the back surface of the semiconductor package mounting area. FIG. 16 is a cross-sectional view of the imaging unit 100H according to the fourth embodiment of the present invention. In FIG. 16, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

The FPC board 22H has a semiconductor package mounting area 23, an electronic component mounting area 24, and a cable mounting area 25, and the electronic component mounting area 24 is disposed on the back side of the semiconductor package mounting area. The FPC board 22 is bent between the semiconductor package mounting area 23 and the cable mounting area 25. The FPC board 22 is bent so that the semiconductor package mounting area 23 and the electronic component mounting area 24 are orthogonal to the optical axis O ₂ and the cable mounting area 25 is parallel to the endoscope axis O ₁ .

Holding substrate 30H is made from a slant, the second region comprising a first region 31H and, a plane parallel to the endoscope axis O ₁ for holding a semiconductor package mounting region 23 and the electronic component mounting area 24 of the FPC board 22H 32. In the first area, a recess 35 for accommodating the electronic component 60 mounted in the electronic component mounting area 24 is formed.

  Electronic components such as a bypass capacitor are preferably mounted in the vicinity of the semiconductor package 20 from the viewpoint of noise reduction. In the imaging unit 100H, in addition to the effects exhibited by the imaging unit 100 of the first embodiment, the electronic component mounting area 24 is provided on the back surface of the semiconductor package mounting area 23, so that an image with less noise can be obtained.

(Embodiment 5)
In imaging unit 100K according to Embodiment 5, electronic component 60 is mounted on a board unit different from the FPC board. FIG. 17 is a cross-sectional view of the imaging unit 100K according to the fifth embodiment of the present invention. In FIG. 17, illustration of the lens unit 10, the storage unit 40, and the like is omitted.

  The electronic component 60 is mounted in the recess 62 of the substrate 61 having the recess 62 and constitutes a substrate unit 63. The board 61 has a circuit part and connection terminals (not shown), and is connected to the FPC board 22K through the connection terminals.

  Since the board unit 63 can efficiently mount electronic components, the mounting efficiency of the electronic components can be improved.

DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope 3 Information processing apparatus 4 Light source apparatus 5 Display apparatus 6 Insertion part 6a Tip part 6b Bending part 6c Flexible tube part 7 Operation part 7a Bending knob 7b Treatment tool insertion part 7c Switch part 8 Universal code 8a, 8b Connector 10 Lens unit 11a, 11b, 11c Objective lens 12a, 12b Lens holder 20 Semiconductor package 21 Cover glass 22 FPC board 23 Semiconductor package mounting area 24 Electronic component mounting area 25 Cable mounting area
26 connecting electrode 27 cable connecting electrode 28 joining member 29 bent portion 30 holding substrate
31 1st area | region 32 2nd area | region 33 Side wall part 34 Front end wall part 40 Holding frame 41 Fitting part 42 Storage part 43 1st contact surface
44 Second contact surface
45 Third contact surface
50 assembly cable 51 cable 52 core wire 60 electronic component 70 sealing resin 71 heat shrinkable tube

Claims (9)

In an imaging unit used in a perspective-type or side-view type endoscope in which an observation axis intersects with an endoscope axis that is a longitudinal direction of the distal end portion of the endoscope,
Optical system,
A lens frame for holding the optical system;
An image sensor that converts an optical image formed by the optical system into an image signal;
A cover glass for protecting the image sensor;
An FPC board on which the image sensor is mounted;
A holding substrate having an inclined surface orthogonal to the observation axis and holding the FPC substrate;
A holding frame having a fitting portion that fits and holds the lens frame, a cover portion that houses the cover glass, a part of the FPC board on which the imaging element is mounted, and the holding substrate;
With
The storage portion includes a first contact surface on the front end side parallel to the observation axis, a second contact surface connected perpendicularly to the first contact surface, and the first contact surface. And a third contact surface connected to the second contact surface and orthogonal to the observation axis,
A front end portion orthogonal to the inclined surface of the holding substrate and one side surface portion orthogonal to the front end portion are applied to the first contact surface and the second contact surface, respectively, and the cover glass Is applied to the third contact surface.   The imaging unit according to claim 1, wherein the holding substrate has a wall portion for positioning the imaging element on the inclined surface. The FPC board is
An image sensor mounting area for mounting the image sensor, an electronic component mounting area for mounting an electronic component, and a cable mounting area for mounting a cable;
The holding substrate is
A second region that includes the inclined surface, has a first region that holds the imaging element mounting region of the FPC board, and a surface that is parallel to the endoscope axis, and holds the electronic component mounting region of the FPC board. The imaging unit according to claim 1, further comprising: an area.   The imaging unit according to claim 3, wherein the holding substrate has at least one bent portion in the second region. The FPC board is
An image sensor mounting area for mounting the image sensor, an electronic component mounting area for mounting an electronic component, and a cable mounting area for mounting a cable;
The holding substrate is
The FPC board has a first area that holds the imaging element mounting area of the FPC board, a plane parallel to the endoscope axis, and the electronic component mounting area and the cable mounting area of the FPC board. The imaging unit according to claim 1, further comprising: a second region to be held. The FPC board is
It has an image sensor mounting region for mounting the image sensor and a cable mounting region for mounting a cable, and has a bent portion between the image sensor mounting region and the cable mounting region. The imaging unit according to claim 1 or 2.   The imaging unit according to claim 1, wherein the holding substrate has a circuit unit.   The first contact surface, the second contact surface, and the third contact surface are bonded to the front end portion and the side surface portion of the holding substrate and the cover glass. The imaging unit according to any one of claims 1 to 7.   A perspective-type or side-view-type endoscope, characterized in that the imaging unit according to any one of claims 1 to 8 includes an insertion portion arranged at a tip.

Images