WO2018079328A1 - Image capture unit and endoscope system - Google Patents

Image capture unit and endoscope system Download PDF

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Publication number
WO2018079328A1
WO2018079328A1 PCT/JP2017/037456 JP2017037456W WO2018079328A1 WO 2018079328 A1 WO2018079328 A1 WO 2018079328A1 JP 2017037456 W JP2017037456 W JP 2017037456W WO 2018079328 A1 WO2018079328 A1 WO 2018079328A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
back surface
semiconductor package
imaging unit
connection electrode
Prior art date
Application number
PCT/JP2017/037456
Other languages
French (fr)
Japanese (ja)
Inventor
小林　弘幸
寛幸 本原
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オリンパス株式会社
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Publication of WO2018079328A1 publication Critical patent/WO2018079328A1/en

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Definitions

  • the present invention relates to an imaging unit and an endoscope system that are provided at the distal end of an insertion portion of an endoscope that is inserted into a subject and images the inside of the subject.
  • An endoscope that are inserted into a subject to observe a region to be examined are known and widely used in the medical field and the like.
  • An endoscope is configured by incorporating an imaging unit in which an electronic component such as an imaging element is mounted at the distal end of a flexible elongated insertion portion.
  • the hard part in which the imaging unit of the endoscope is built should be reduced in diameter and shortened in order to reduce the burden on the subject.
  • various imaging units have been proposed in which a mounting density is improved by reducing the connection pitch in a planar electronic circuit board, reducing the mounting interval between adjacent electronic components, and the like, and circuit boards are stacked. (For example, refer to Patent Document 1).
  • Patent Document 1 discloses an imaging unit in which an imaging element and two substrates are stacked.
  • the connection between the image sensor and the circuit board and the connection between the circuit board and the irregular circuit board are connected by solder. These connections are generally made using solder balls.
  • the connection layer between the image pickup element and the circuit board and the connection layer between the circuit board and the irregular circuit board have different conditions, but usually solder balls having the same diameter are used in consideration of workability. Therefore, for example, a connection layer with a small number of solder balls has a problem that the mechanical strength is weak.
  • the present invention has been made in view of the above, and in a configuration in which a semiconductor package having an imaging element, a circuit board, and a deformed circuit board are stacked, a circuit between the semiconductor package and the circuit board and a circuit are provided. It is an object of the present invention to provide an imaging unit and an endoscope system that can be securely and electrically connected between a substrate and an irregular circuit substrate using solder balls.
  • an imaging unit includes a semiconductor package having an imaging element and a connection electrode formed on the back surface, and a connection electrode on the front surface and the back surface. Are formed, and the circuit board is laminated on the back surface side of the imaging element, and the odd-shaped circuit board is formed with the connection electrodes formed on the front surface and the back surface side and laminated on the back surface side of the circuit board.
  • a first solder that electrically and mechanically connects the electronic component mounted on the back surface of the circuit board, the connection electrode on the back surface of the semiconductor package, and the connection electrode on the surface of the circuit board.
  • the ball and the connection electrode on the back surface of the circuit board and the connection electrode on the surface of the irregular circuit board are electrically and mechanically connected, and the number is smaller than that of the first solder ball, and Comprising a second solder ball 1 solder ball and the diameter is different, the said circuit board and said profiled circuit board, is characterized in that seated in the semiconductor package of the optical axis direction of the projection plane.
  • the electronic component is housed in a recess formed on the back surface of the circuit board.
  • the imaging unit according to one aspect of the present invention is characterized in that the connection electrode is formed on a surface of the back surface of the circuit board excluding the concave portion.
  • the length of the semiconductor package in the short direction is 1.5 mm or more, and the diameter of the second solder ball is larger than the diameter of the first solder ball. It is characterized by.
  • the length of the semiconductor package in the short direction is less than 1.5 mm, and the length of the semiconductor package in the longitudinal direction is less than 1.9 mm.
  • the diameter of the second solder ball is smaller than the diameter of the first solder ball.
  • the imaging unit according to one aspect of the present invention is characterized in that the second solder balls are arranged in a staggered manner.
  • an endoscope system is characterized in that the imaging unit includes an insertion portion provided at a distal end.
  • a gap between the semiconductor package and the circuit board and between the circuit board and the deformed circuit board are provided.
  • an imaging unit and an endoscope system that can be reliably connected electrically and mechanically using solder balls.
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention.
  • FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG.
  • FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 4 is a cross-sectional view corresponding to the line BB in FIG.
  • FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment.
  • FIG. 6 is a side view of the imaging unit according to the second embodiment.
  • FIG. 7 is a cross-sectional view corresponding to the line CC in FIG.
  • FIG. 8 is a cross-sectional view corresponding to the line DD in FIG.
  • FIG. 9 is a side view of the imaging unit according to the third embodiment.
  • an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention.
  • an endoscope system 1 according to the first embodiment includes an endoscope 2 that is introduced into a subject, images the inside of the subject, and generates an image signal in the subject.
  • An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information And a display device 5 for displaying an image signal after image processing by the processing device 3.
  • the endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.
  • the insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like.
  • the insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b.
  • the distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.
  • the operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment tool insertion portion 7b in which a treatment tool such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3.
  • a plurality of switch units 7c for operating peripheral devices such as a light source device 4, an air supply device, a water supply device, and a gas supply device.
  • the treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.
  • the universal cord 8 is configured using illumination fibers, cables, and the like.
  • the universal cord 8 is branched at the base end, and one end of the branch is the connector 8a, and the other end is the connector 8b.
  • the connector 8a is detachable from the connector of the information processing apparatus 3.
  • the connector 8b is detachable from the light source device 4.
  • the universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber.
  • the universal code 8 transmits an image signal captured by an imaging unit described later to the information processing apparatus 3 via a cable and a connector 8a.
  • the information processing apparatus 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.
  • the light source device 4 includes a light source that emits light, a condensing lens, and the like.
  • the light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.
  • the display device 5 is configured using a display using liquid crystal or organic EL (Electro Luminescence).
  • the display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize the desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.
  • FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG.
  • the imaging unit 10 has the imaging element 21 on the surface f1 which is the front surface, and the semiconductor package 20 in which the connection electrode 23 is formed on the surface f2 which is the back surface, and is connected to the surface f3 which is the front surface and the surface f4 which is the back surface.
  • An electrode 32 and a connection electrode 33 are formed, and are connected to the circuit board 30 stacked on the back surface (surface f2) side of the image sensor 21, and the surface f5 that is the front surface, the surface f6 that is the back surface side, and the surface f7.
  • the electrode 41 and the cable connection electrode 42 are formed, respectively, and the odd-shaped circuit board 40 stacked on the back surface (surface f4) side of the circuit board 30 and the electronic mounted on the back surface (surface f4) of the circuit board 30.
  • the component 51a and the electronic component 51b are electrically and mechanically connected to the connection electrode 23 on the back surface (surface f2) side of the semiconductor package 20 and the connection electrode 32 on the surface (surface f3) side of the circuit board 30.
  • the first solder balls 60, the connection electrodes 33 on the back surface (surface f4) side of the circuit board 30 and the connection electrodes 41 on the front surface (surface f5) side of the irregular circuit board 40 are electrically and mechanically connected. Second solder balls 70.
  • the circuit board 30 and the odd-shaped circuit board 40 are sized to fit within the projection plane of the semiconductor package 20 in the optical axis direction (vertical direction along the paper surface of FIG. 2).
  • the semiconductor package 20 has a structure in which a glass 22 is attached to the image sensor 21.
  • the light condensed by the lens unit is incident on the light receiving surface of the image pickup device 21 including the light receiving portion via the surface f1 which is the surface of the glass 22.
  • a connection electrode 23 is formed on the surface f ⁇ b> 2 (back surface) of the imaging element 21.
  • the semiconductor package 20 is a CSP (Chip Size Package) in which the imaging element chip in the wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the imaging element chip becomes the size of the semiconductor package as it is. ) Is preferable.
  • the length of the semiconductor package 20 in the short direction along the light receiving surface of the image sensor 21 is 1.5 mm or more.
  • the circuit board 30 is formed in a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the surface f3 and the surface f4 are laminated).
  • a substrate to be laminated a ceramic substrate, a glass epoxy substrate, a flexible substrate, a glass substrate, a silicon substrate, or the like is used.
  • a plurality of vias are formed in the circuit board 30 for conducting the wiring on the stacked boards.
  • a connection electrode 32 is formed on the surface f3 of the circuit board 30.
  • a recess 31 is provided at the center of the surface f4 of the circuit board 30, and a mounting land 35a and a mounting land 35b for mounting the electronic component 51a and the electronic component 51b are formed in the recess 31.
  • the electronic component 51a and the electronic component 51b to be mounted include passive components such as capacitors and resistance coils, and active components such as driver ICs. Since the electronic component 51a and the electronic component 51b are accommodated in the recess 31 near the center of the circuit board 30, the distance between the imaging element 21, the electronic component 51a, and the electronic component 51b can be shortened, so that the impedance can be reduced. Since the image sensor 21 can be driven stably, a high-quality image can be obtained.
  • a hard part length (length of the hard part of the optical axis direction of the imaging unit 10) can be shortened.
  • a connection electrode 33 is formed on a surface of the surface f4 of the circuit board 30 excluding the recess 31.
  • the odd-shaped circuit board 40 is made of a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like, and a plurality of substrates on which wiring is formed are stacked, and the opposing side surfaces f6 and f7 are stepped. Yes.
  • a connection electrode 41 connected to the connection electrode 33 is formed on the surface (surface f5) of the odd-shaped circuit board 40.
  • the surface f6 and the surface f7 which are side surfaces of the odd-shaped circuit board 40 are stepped so as to be close to each other on the base end side in the optical axis direction of the semiconductor package 20, that is, the surface f6 and the surface f7 have a stepped portion S1 and a stepped portion. S2 and the step part S3 are formed.
  • a cable connection electrode 42 to which a cable (not shown) is electrically and mechanically connected is formed on the staircase portion S2 and the staircase portion S3 of the surface f6 and the surface f7.
  • the cable connection electrodes 42 of the stepped portion S2 and the stepped portion S3 are arranged so as not to overlap in the optical axis direction.
  • the first solder balls 60 may be metal core solder balls, resin core solder balls, Au bumps, etc. in addition to solder balls.
  • the connection portion between the connection electrode 23 on the surface f2 and the connection electrode 32 on the surface f3 is sealed with a sealing resin (not shown).
  • the second solder ball 70 may be a solder ball, a metal core solder ball, a resin core solder ball, an Au bump, or the like.
  • the connection part of the connection electrode 33 on the surface f4 and the connection electrode 41 on the surface f5 and the inside of the recess 31 are sealed with a sealing resin (not shown).
  • FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 4 is a cross-sectional view corresponding to the line BB in FIG.
  • the second solder balls 70 are smaller in number than the first solder balls 60 and larger in diameter than the first solder balls 60.
  • the imaging unit 10 by reducing the diameter of the first solder ball 60, the electrical and mechanical connection between the semiconductor package 20 and the circuit board 30 having a large number of connections can be performed by the solder ball. it can. Furthermore, in this imaging unit 10, the mechanical strength between the circuit board 30 and the odd-shaped circuit board 40 with a small number of connections can be sufficiently obtained by increasing the diameter of the second solder ball 70.
  • the board on which the electronic component 51 a, the electronic part 51 b, and the cable (not shown) are mounted is divided into the circuit board 30 and the odd-shaped circuit board 40, and the circuit board 30 adjacent to the image pickup device 21 is separated. Since the electronic component 51a and the electronic component 51b are mounted, the impedance between the image sensor 21 and the electronic component 51a and the electronic component 51b can be reduced. Further, by accommodating the electronic component 51a and the electronic component 51b in the recess 31 formed on the back surface (surface f4) of the circuit board 30, the length of the hard portion in the optical axis direction of the imaging unit 10 can be shortened. .
  • the imaging unit 10 can be reduced in diameter, and the circuit board 30 and the odd-shaped circuit board 40 can be reduced.
  • the circuit board 40 can be connected to the semiconductor package 20 on the plane parallel to the stacked substrate plane, the plane f3, the plane f4, and the plane f5, and can be formed with fine pitch wiring. Therefore, it is possible to obtain the imaging unit 10 that is small in size and highly reliable.
  • FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment.
  • the imaging unit 10 ⁇ / b> A includes a component built-in substrate 30 ⁇ / b> A that incorporates an electronic component 51 a and an electronic component 51 b instead of the circuit board 30.
  • the recess 31 is provided on the back surface (surface f4) of the circuit board 30, but the recess may be provided on the surface (surface f5) of the odd-shaped circuit board 40. Furthermore, depending on the size of the electronic component 51a, the electronic component 51b, the first solder ball 60, and the second solder ball 70, the concave portion 31 on the back surface (surface f4) of the circuit board 30 or the surface of the odd-shaped circuit board 40 ( It is not necessary to form a recess in the surface f5).
  • FIG. 6 is a side view of the imaging unit according to the second embodiment.
  • the imaging unit 110 has an imaging element 121 on the front surface, a semiconductor package 120 having a connection electrode 123 formed on the back surface, and a connection electrode 132 and a connection electrode 133 formed on the front surface and the back surface.
  • the electronic component 151a and the electronic component 151b mounted on the back surface of the circuit board 130 are electrically and mechanically connected to the connection electrode 123 on the back surface side of the semiconductor package 120 and the connection electrode 132 on the front surface side of the circuit board 130.
  • First solder balls 160, connection electrodes 133 on the back side of the circuit board 130, and the surface of the irregular circuit board 140 Provided between the connection electrode 141 electrically, and the second solder balls 170 which is mechanically connected to, the.
  • the semiconductor package 120 has a structure in which a glass 122 is attached to the image sensor 121.
  • the semiconductor package 120 has a short side length of less than 1.5 mm along the light receiving surface of the image sensor 121 and a long side length of less than 1.9 mm.
  • a recess 131 is provided in the center of the back surface of the circuit board 130, and a mounting land 135a and a mounting land 135b for mounting the electronic component 151a and the electronic component 151b are formed in the recess 131.
  • FIG. 7 is a cross-sectional view corresponding to the line CC in FIG.
  • FIG. 8 is a cross-sectional view corresponding to the line DD in FIG.
  • the second solder balls 170 are smaller in number than the first solder balls 160 and smaller in diameter than the first solder balls 160.
  • the area of the semiconductor package 120 is small, and the area on which a solder ball can be placed between the circuit board 130 and the odd-shaped circuit board 140 (the surface excluding the recess 131 on the back surface of the circuit board 130) is small. .
  • the second solder balls 170 are reduced in diameter and the second solder balls 170 are arranged in a staggered manner (see FIG. 8), so that the circuit board 130, the deformed circuit board 140,
  • the electrical and mechanical connection between the two can be made by solder balls.
  • the connection between the semiconductor package 120 and the circuit board 130 is preferably connected by a solder ball having a large diameter from the viewpoint of increasing the mechanical strength, and the diameter of the first solder ball 160 is the second solder ball. Greater than 170 diameter.
  • the solder balls electrically and mechanically connect the semiconductor package and the circuit board depending on the design conditions such as the area of the semiconductor package and the size of the electronic component. It is preferable to appropriately set the relationship between the diameter of the solder ball and the diameter of the solder ball that electrically and mechanically connects the circuit board and the odd-shaped circuit board.
  • FIG. 9 is a side view of the imaging unit according to the third embodiment.
  • the imaging unit 210 includes an imaging element 221 on the front surface, a semiconductor package 220 having a connection electrode 223 formed on the back surface, and a connection electrode 232A and a connection electrode 233A formed on the front surface and the back surface, respectively.
  • Circuit board 230A stacked on the back side of the circuit board, and connection electrodes 232B and connection electrodes 233B are formed on the front and back surfaces, respectively, and the circuit board 230B stacked on the back side of the circuit board 230A, and the front and back surfaces
  • the connection electrode 241 and the cable connection electrode 242 are respectively formed on the side, the odd-shaped circuit board 240 stacked on the back surface side of the circuit board 230B, and the electronic component 251a and the electronic component mounted on the back surface of the circuit board 230A 251b, the electronic component 251c mounted on the back surface of the circuit board 230B, and the electronic Product 251d, first solder ball 260 electrically and mechanically connecting connection electrode 223 on the back side of semiconductor package 220 and connection electrode 232A on the front side of circuit board 230A, and back side of circuit board 230A
  • the second solder balls 270 that electrically and mechanically connect the connection electrodes 233A and the connection electrodes 232B on the front surface side of
  • the semiconductor package 220 has a structure in which a glass 222 is attached to the image sensor 221.
  • a recess 231A is provided at the center of the back surface of the circuit board 230A, and a mounting land 235a and a mounting land 235b for mounting the electronic component 251a and the electronic component 251b are formed in the recess 231A.
  • a recess 231B is provided at the center of the back surface of the circuit board 230B, and a mounting land 235c and a mounting land 235d for mounting the electronic component 251c and the electronic component 251d are formed in the recess 231B.
  • the diameter of the first solder ball 260 is made the largest
  • the diameter of the second solder ball 270 is made larger than the first solder ball 260
  • the diameter of the third solder ball 280 is made the smallest.
  • the semiconductor package 220 and the circuit board 230A, the circuit board 230A and the circuit board 230B, and the circuit board 230B and the odd-shaped circuit board 240 are electrically and mechanically connected with the solder balls, respectively. be able to.
  • the diameter of the third solder ball 280 is maximized and the diameter of the second solder ball 270 is set to the third size depending on design conditions such as the area of the semiconductor package and the size of the electronic component. It may be preferable to enlarge the solder ball 280 next to make the diameter of the first solder ball 260 the smallest.
  • circuit board is not limited to the configuration in which the circuit boards are stacked in three stages as in the third embodiment, and each circuit can be designed by appropriately designing the diameter of the solder balls even when more circuit boards are stacked. It is possible to connect the substrates electrically and mechanically with solder balls.

Abstract

Provided is an image capture unit, comprising: a semiconductor package which comprises an image capture element and wherein a connector electrode is formed on the back surface of said semiconductor package; a circuit substrate wherein connector electrodes are respectively formed on the front surface and the back surface thereof, said circuit substrate being stacked on the back surface side of the image capture element; a variant circuit substrate wherein connector electrodes are respectively formed on the front surface and the back surface thereof, said variant circuit substrate being stacked on the back surface side of the circuit substrate; a digital component which is mounted on the back surface of the circuit substrate; first solder balls which connect the connection electrode on the back surface of the semiconductor package with the connection electrode on the front surface of the circuit substrate; and second solder balls which connect the connection electrode on the back surface of the circuit substrate with the connection electrode on the front surface of the variant circuit substrate, said second solder balls being fewer in number than the first solder balls and having different diameters from the first solder balls. The circuit substrate and the variant circuit substrate are contained within a projection plane of the semiconductor package in an optical axis direction. An image capture unit is thus provided whereby it is possible to make reliable connections among the semiconductor package, the circuit substrate, and the variant circuit substrate, using the solder balls.

Description

撮像ユニット、及び内視鏡システムImaging unit and endoscope system
　本発明は、被検体内に挿入される内視鏡の挿入部の先端に設けられており、被検体内を撮像する撮像ユニット、及び内視鏡システムに関する。 The present invention relates to an imaging unit and an endoscope system that are provided at the distal end of an insertion portion of an endoscope that is inserted into a subject and images the inside of the subject.
　従来、被検体内に挿入されて被検部位の観察等を行う内視鏡が知られており、医療分野等で広く利用されている。内視鏡は、可撓性を有する細長の挿入部の先端部に、撮像素子等の電子部品を実装した撮像ユニットが内蔵されて構成されている。 2. Description of the Related Art Conventionally, endoscopes that are inserted into a subject to observe a region to be examined are known and widely used in the medical field and the like. An endoscope is configured by incorporating an imaging unit in which an electronic component such as an imaging element is mounted at the distal end of a flexible elongated insertion portion.
　内視鏡の撮像ユニットが内蔵された硬質な部分は、被験者の負担を軽減するために、細径化、短小化が望まれている。そこで、平面的な電子回路基板において接続ピッチの微細化や隣接する電子部品の実装間隔の縮小等により実装密度の向上を図るとともに、回路基板を積層して構成した撮像ユニットが種々提案されている（例えば、特許文献１参照）。 It is desired that the hard part in which the imaging unit of the endoscope is built should be reduced in diameter and shortened in order to reduce the burden on the subject. In view of this, various imaging units have been proposed in which a mounting density is improved by reducing the connection pitch in a planar electronic circuit board, reducing the mounting interval between adjacent electronic components, and the like, and circuit boards are stacked. (For example, refer to Patent Document 1).
国際公開第２０１６／０９２９８６号International Publication No. 2016/092986
　特許文献１には、撮像素子と２つの基板が積層された撮像ユニットが開示されている。撮像素子と回路基板との接続及び回路基板と異形回路基板との接続は、半田により接続されている。これらの接続は、半田ボールを用いて接続されることが一般的である。撮像素子と回路基板との接続層及び回路基板と異形回路基板との接続層は、条件は異なるが、通常は作業性を考慮して同じ径の半田ボールが用いられていた。そのため、例えば半田ボールの数が少ない接続層では、機械的強度が弱いという課題があった。 Patent Document 1 discloses an imaging unit in which an imaging element and two substrates are stacked. The connection between the image sensor and the circuit board and the connection between the circuit board and the irregular circuit board are connected by solder. These connections are generally made using solder balls. The connection layer between the image pickup element and the circuit board and the connection layer between the circuit board and the irregular circuit board have different conditions, but usually solder balls having the same diameter are used in consideration of workability. Therefore, for example, a connection layer with a small number of solder balls has a problem that the mechanical strength is weak.
　本発明は、上記に鑑みてなされたものであって、撮像素子を有する半導体パッケージと、回路基板と、異形回路基板と、が積層されている構成において、半導体パッケージと回路基板との間及び回路基板と異形回路基板との間を、半田ボールを用いて電気的及び機械的に確実に接続することができる撮像ユニット、及び内視鏡システムを提供することを目的とする。 The present invention has been made in view of the above, and in a configuration in which a semiconductor package having an imaging element, a circuit board, and a deformed circuit board are stacked, a circuit between the semiconductor package and the circuit board and a circuit are provided. It is an object of the present invention to provide an imaging unit and an endoscope system that can be securely and electrically connected between a substrate and an irregular circuit substrate using solder balls.
　上述した課題を解決し、目的を達成するために、本発明の一態様に係る撮像ユニットは、撮像素子を有し、裏面に接続電極が形成されている半導体パッケージと、表面及び裏面に接続電極がそれぞれ形成されており、前記撮像素子の裏面側に積層されている回路基板と、表面及び裏面側に接続電極がそれぞれ形成されており、前記回路基板の裏面側に積層されている異形回路基板と、前記回路基板の裏面に実装されている電子部品と、前記半導体パッケージの裏面の前記接続電極と前記回路基板の表面の前記接続電極とを電気的及び機械的に接続している第１半田ボールと、前記回路基板の裏面の前記接続電極と前記異形回路基板の表面の前記接続電極とを電気的及び機械的に接続しており、前記第１半田ボールより数が少なく、かつ前記第１半田ボールと径が異なっている第２半田ボールと、を備え、前記回路基板、及び前記異形回路基板は、前記半導体パッケージの光軸方向の投影面内に収まっていることを特徴とする。 In order to solve the above-described problems and achieve the object, an imaging unit according to one embodiment of the present invention includes a semiconductor package having an imaging element and a connection electrode formed on the back surface, and a connection electrode on the front surface and the back surface. Are formed, and the circuit board is laminated on the back surface side of the imaging element, and the odd-shaped circuit board is formed with the connection electrodes formed on the front surface and the back surface side and laminated on the back surface side of the circuit board. A first solder that electrically and mechanically connects the electronic component mounted on the back surface of the circuit board, the connection electrode on the back surface of the semiconductor package, and the connection electrode on the surface of the circuit board. The ball and the connection electrode on the back surface of the circuit board and the connection electrode on the surface of the irregular circuit board are electrically and mechanically connected, and the number is smaller than that of the first solder ball, and Comprising a second solder ball 1 solder ball and the diameter is different, the said circuit board and said profiled circuit board, is characterized in that seated in the semiconductor package of the optical axis direction of the projection plane.
　また、本発明の一態様に係る撮像ユニットは、前記電子部品は、前記回路基板の裏面に形成された凹部内に収容されていることを特徴とする。 In the imaging unit according to one aspect of the present invention, the electronic component is housed in a recess formed on the back surface of the circuit board.
　また、本発明の一態様に係る撮像ユニットは、前記回路基板の裏面の前記凹部を除く面に前記接続電極が形成されていることを特徴とする。 The imaging unit according to one aspect of the present invention is characterized in that the connection electrode is formed on a surface of the back surface of the circuit board excluding the concave portion.
　また、本発明の一態様に係る撮像ユニットは、前記半導体パッケージの短手方向の長さが１．５ｍｍ以上であり、前記第２半田ボールの径が前記第１半田ボールの径よりも大きいことを特徴とする。 In the imaging unit according to one aspect of the present invention, the length of the semiconductor package in the short direction is 1.5 mm or more, and the diameter of the second solder ball is larger than the diameter of the first solder ball. It is characterized by.
　また、本発明の一態様に係る撮像ユニットは、前記半導体パッケージの短手方向の長さが１．５ｍｍ未満であり、かつ前記半導体パッケージの長手方向の長さが１．９ｍｍ未満であり、前記第２半田ボールの径が前記第１半田ボールの径よりも小さいことを特徴とする。 In the imaging unit according to one aspect of the present invention, the length of the semiconductor package in the short direction is less than 1.5 mm, and the length of the semiconductor package in the longitudinal direction is less than 1.9 mm. The diameter of the second solder ball is smaller than the diameter of the first solder ball.
　また、本発明の一態様に係る撮像ユニットは、前記第２半田ボールは、千鳥状に配設されていることを特徴とする。 The imaging unit according to one aspect of the present invention is characterized in that the second solder balls are arranged in a staggered manner.
　また、本発明の一態様に係る内視鏡システムは、上記の撮像ユニットが先端に設けられている挿入部を備えることを特徴とする。 In addition, an endoscope system according to an aspect of the present invention is characterized in that the imaging unit includes an insertion portion provided at a distal end.
　本発明によれば、撮像素子を有する半導体パッケージと、回路基板と、異形回路基板と、が積層されている構成において、半導体パッケージと回路基板との間及び回路基板と異形回路基板との間を、半田ボールを用いて電気的及び機械的に確実に接続することができる撮像ユニット、及び内視鏡システムを実現することができる。 According to the present invention, in a configuration in which a semiconductor package having an image sensor, a circuit board, and a deformed circuit board are stacked, a gap between the semiconductor package and the circuit board and between the circuit board and the deformed circuit board are provided. In addition, it is possible to realize an imaging unit and an endoscope system that can be reliably connected electrically and mechanically using solder balls.
図１は、本発明の実施の形態１に係る内視鏡システムの全体構成を模式的に示す図である。FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention. 図２は、図１に示す内視鏡先端部に配置されている撮像ユニットの側面図である。FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG. 図３は、図２のＡ－Ａ線に対応する断面図である。FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 図４は、図２のＢ－Ｂ線に対応する断面図である。4 is a cross-sectional view corresponding to the line BB in FIG. 図５は、実施の形態１の変形例に係る撮像ユニットの側面図である。FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment. 図６は、実施の形態２に係る撮像ユニットの側面図である。FIG. 6 is a side view of the imaging unit according to the second embodiment. 図７は、図６のＣ－Ｃ線に対応する断面図である。FIG. 7 is a cross-sectional view corresponding to the line CC in FIG. 図８は、図６のＤ－Ｄ線に対応する断面図である。FIG. 8 is a cross-sectional view corresponding to the line DD in FIG. 図９は、実施の形態３に係る撮像ユニットの側面図である。FIG. 9 is a side view of the imaging unit according to the third embodiment.
　以下の説明では、本発明を実施するための形態（以下、「実施の形態」という）として、撮像ユニットを備えた内視鏡システムについて説明する。また、この実施の形態により、この発明が限定されるものではない。さらに、図面の記載において、同一部分には同一の符号を付している。さらにまた、図面は、模式的なものであり、各部材の厚みと幅との関係、各部材の比率等は、現実と異なることに留意する必要がある。また、図面の相互間においても、互いの寸法や比率が異なる部分が含まれている。 In the following description, an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.
　また、図面の記載において、同一又は対応する要素には適宜同一の符号を付している。また、図面は模式的なものであり、各要素の寸法の関係、各要素の比率などは、現実と異なる場合があることに留意する必要がある。図面の相互間においても、互いの寸法の関係や比率が異なる部分が含まれている場合がある。 In the description of the drawings, the same or corresponding elements are appropriately denoted by the same reference numerals. It should be noted that the drawings are schematic, and the relationship between the dimensions of each element, the ratio of each element, and the like may differ from the actual situation. Even between the drawings, there are cases in which portions having different dimensional relationships and ratios are included.
（実施の形態１）
　図１は、本発明の実施の形態１に係る内視鏡システムの全体構成を模式的に示す図である。図１に示すように、本実施の形態１に係る内視鏡システム１は、被検体内に導入され、被検体の体内を撮像して被検体内の画像信号を生成する内視鏡２と、内視鏡２が撮像した画像信号に所定の画像処理を施すとともに内視鏡システム１の各部を制御する情報処理装置３と、内視鏡２の照明光を生成する光源装置４と、情報処理装置３による画像処理後の画像信号を画像表示する表示装置５と、を備える。 (Embodiment 1)
FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention. As shown in FIG. 1, an endoscope system 1 according to the first embodiment includes an endoscope 2 that is introduced into a subject, images the inside of the subject, and generates an image signal in the subject. An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information And a display device 5 for displaying an image signal after image processing by the processing device 3.
　内視鏡２は、被検体内に挿入される挿入部６と、挿入部６の基端部側であって術者が把持する操作部７と、操作部７より延伸する可撓性のユニバーサルコード８と、を備える。 The endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.
　挿入部６は、照明ファイバ（ライトガイドケーブル）、電気ケーブル及び光ファイバ等を用いて実現される。挿入部６は、後述する撮像ユニットを内蔵した先端部６ａと、複数の湾曲駒によって構成された湾曲自在な湾曲部６ｂと、湾曲部６ｂの基端部側に設けられた可撓性を有する可撓管部６ｃと、を有する。先端部６ａには、照明レンズを介して被検体内を照明する照明部、被検体内を撮像する観察部、処置具用チャンネルを連通する開口部及び送気・送水用ノズル（図示せず）が設けられている。 The insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like. The insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b. Flexible tube portion 6c. The distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.
　操作部７は、湾曲部６ｂを上下方向及び左右方向に湾曲させる湾曲ノブ７ａと、被検体の体腔内に生体鉗子、レーザメス等の処置具が挿入される処置具挿入部７ｂと、情報処理装置３、光源装置４、送気装置、送水装置及び送ガス装置等の周辺機器の操作を行う複数のスイッチ部７ｃと、を有する。処置具挿入部７ｂから挿入された処置具は、内部に設けられた処置具用チャンネルを経て挿入部６先端の開口部から表出する。 The operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment tool insertion portion 7b in which a treatment tool such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3. A plurality of switch units 7c for operating peripheral devices such as a light source device 4, an air supply device, a water supply device, and a gas supply device. The treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.
　ユニバーサルコード８は、照明ファイバ、ケーブル等を用いて構成される。ユニバーサルコード８は、基端で分岐しており、分岐した一方の端部がコネクタ８ａであり、他方の端部がコネクタ８ｂである。コネクタ８ａは、情報処理装置３のコネクタに対して着脱自在である。コネクタ８ｂは、光源装置４に対して着脱自在である。ユニバーサルコード８は、光源装置４から出射された照明光を、コネクタ８ｂ、及び照明ファイバを介して先端部６ａに伝播する。また、ユニバーサルコード８は、後述する撮像ユニットが撮像した画像信号を、ケーブル及びコネクタ８ａを介して情報処理装置３に伝送する。 The universal cord 8 is configured using illumination fibers, cables, and the like. The universal cord 8 is branched at the base end, and one end of the branch is the connector 8a, and the other end is the connector 8b. The connector 8a is detachable from the connector of the information processing apparatus 3. The connector 8b is detachable from the light source device 4. The universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber. The universal code 8 transmits an image signal captured by an imaging unit described later to the information processing apparatus 3 via a cable and a connector 8a.
　情報処理装置３は、コネクタ８ａから出力される画像信号に所定の画像処理を施すとともに、内視鏡システム１全体を制御する。 The information processing apparatus 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.
　光源装置４は、光を発する光源や、集光レンズ等を用いて構成される。光源装置４は、情報処理装置３の制御のもと、光源から光を発し、コネクタ８ｂ及びユニバーサルコード８の照明ファイバを介して接続された内視鏡２へ、被写体である被検体内に対する照明光として供給する。 The light source device 4 includes a light source that emits light, a condensing lens, and the like. The light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.
　表示装置５は、液晶又は有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）を用いた表示ディスプレイ等を用いて構成される。表示装置５は、映像ケーブル５ａを介して情報処理装置３によって所定の画像処理が施された画像を含む各種情報を表示する。これにより、術者は、表示装置５が表示する画像（体内画像）を見ながら内視鏡２を操作することにより、被検体内の所望の位置の観察及び性状を判定することができる。 The display device 5 is configured using a display using liquid crystal or organic EL (Electro Luminescence). The display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize the desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.
　次に、内視鏡システム１で使用する撮像ユニットについて詳細に説明する。図２は、図１に示す内視鏡先端部に配置されている撮像ユニットの側面図である。 Next, the imaging unit used in the endoscope system 1 will be described in detail. FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG.
　撮像ユニット１０は、表面である面ｆ１に撮像素子２１を有し、裏面である面ｆ２に接続電極２３が形成されている半導体パッケージ２０と、表面である面ｆ３及び裏面である面ｆ４に接続電極３２及び接続電極３３がそれぞれ形成されており、撮像素子２１の裏面（面ｆ２）側に積層されている回路基板３０と、表面である面ｆ５及び裏面側である面ｆ６並びに面ｆ７に接続電極４１及びケーブル接続電極４２がそれぞれ形成されており、回路基板３０の裏面（面ｆ４）側に積層されている異形回路基板４０と、回路基板３０の裏面（面ｆ４）に実装されている電子部品５１ａ及び電子部品５１ｂと、半導体パッケージ２０の裏面（面ｆ２）側の接続電極２３と回路基板３０の表面（面ｆ３）側の接続電極３２とを電気的及び機械的に接続している第１半田ボール６０と、回路基板３０の裏面（面ｆ４）側の接続電極３３と異形回路基板４０の表面（面ｆ５）側の接続電極４１とを電気的及び機械的に接続している第２半田ボール７０と、を備える。 The imaging unit 10 has the imaging element 21 on the surface f1 which is the front surface, and the semiconductor package 20 in which the connection electrode 23 is formed on the surface f2 which is the back surface, and is connected to the surface f3 which is the front surface and the surface f4 which is the back surface. An electrode 32 and a connection electrode 33 are formed, and are connected to the circuit board 30 stacked on the back surface (surface f2) side of the image sensor 21, and the surface f5 that is the front surface, the surface f6 that is the back surface side, and the surface f7. The electrode 41 and the cable connection electrode 42 are formed, respectively, and the odd-shaped circuit board 40 stacked on the back surface (surface f4) side of the circuit board 30 and the electronic mounted on the back surface (surface f4) of the circuit board 30. The component 51a and the electronic component 51b are electrically and mechanically connected to the connection electrode 23 on the back surface (surface f2) side of the semiconductor package 20 and the connection electrode 32 on the surface (surface f3) side of the circuit board 30. The first solder balls 60, the connection electrodes 33 on the back surface (surface f4) side of the circuit board 30 and the connection electrodes 41 on the front surface (surface f5) side of the irregular circuit board 40 are electrically and mechanically connected. Second solder balls 70.
　撮像ユニット１０において、回路基板３０、及び異形回路基板４０は、半導体パッケージ２０の光軸方向（図２の紙面に沿った上下方向）の投影面内に収まる大きさである。 In the imaging unit 10, the circuit board 30 and the odd-shaped circuit board 40 are sized to fit within the projection plane of the semiconductor package 20 in the optical axis direction (vertical direction along the paper surface of FIG. 2).
　半導体パッケージ２０は、ガラス２２が撮像素子２１に貼り付けられた構造となっている。レンズユニットが集光した光はガラス２２の表面である面ｆ１を介して、受光部を備える撮像素子２１の受光面に入射する。撮像素子２１の面ｆ２（裏面）には接続電極２３が形成されている。半導体パッケージ２０は、ウエハ状態の撮像素子チップに、配線、電極形成、樹脂封止、及びダイシングをして、最終的に撮像素子チップの大きさがそのまま半導体パッケージの大きさとなるＣＳＰ（Ｃｈｉｐ　Ｓｉｚｅ　Ｐａｃｋａｇｅ）であることが好ましい。半導体パッケージ２０は、撮像素子２１の受光面に沿った方向の短手方向の長さが１．５ｍｍ以上である。 The semiconductor package 20 has a structure in which a glass 22 is attached to the image sensor 21. The light condensed by the lens unit is incident on the light receiving surface of the image pickup device 21 including the light receiving portion via the surface f1 which is the surface of the glass 22. A connection electrode 23 is formed on the surface f <b> 2 (back surface) of the imaging element 21. The semiconductor package 20 is a CSP (Chip Size Package) in which the imaging element chip in the wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the imaging element chip becomes the size of the semiconductor package as it is. ) Is preferable. The length of the semiconductor package 20 in the short direction along the light receiving surface of the image sensor 21 is 1.5 mm or more.
　回路基板３０は、配線が形成された複数の基板が積層されて板状をなしている（面ｆ３及び面ｆ４に平行な基板が複数積層）。積層される基板は、セラミックス基板、ガラエポ基板、フレキシブル基板、ガラス基板、シリコン基板等が用いられる。回路基板３０の内部には、積層される基板上の配線を導通させる複数のビアが形成されている。回路基板３０の面ｆ３には接続電極３２が形成されている。また、回路基板３０の面ｆ４の中央部には、凹部３１が設けられ、凹部３１内に電子部品５１ａ及び電子部品５１ｂを実装する実装ランド３５ａ及び実装ランド３５ｂが形成されている。実装される電子部品５１ａ及び電子部品５１ｂは、コンデンサ、抵抗コイル等の受動部品、ドライバＩＣ等の能動部品が例示される。回路基板３０の中央付近の凹部３１内に電子部品５１ａ及び電子部品５１ｂが収容されていることにより、撮像素子２１と電子部品５１ａ及び電子部品５１ｂとの距離を短くできるため、インピーダンスを小さくでき、撮像素子２１の安定的な駆動が可能となることで高画質の画像を得ることができる。また、回路基板３０の面ｆ４に凹部３１を設け、電子部品５１ａ及び電子部品５１ｂを収容するので、硬質部長（撮像ユニット１０の光軸方向の硬質部分の長さ）を短くすることができる。回路基板３０の面ｆ４の凹部３１を除く面に接続電極３３が形成されている。 The circuit board 30 is formed in a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the surface f3 and the surface f4 are laminated). As a substrate to be laminated, a ceramic substrate, a glass epoxy substrate, a flexible substrate, a glass substrate, a silicon substrate, or the like is used. A plurality of vias are formed in the circuit board 30 for conducting the wiring on the stacked boards. A connection electrode 32 is formed on the surface f3 of the circuit board 30. In addition, a recess 31 is provided at the center of the surface f4 of the circuit board 30, and a mounting land 35a and a mounting land 35b for mounting the electronic component 51a and the electronic component 51b are formed in the recess 31. Examples of the electronic component 51a and the electronic component 51b to be mounted include passive components such as capacitors and resistance coils, and active components such as driver ICs. Since the electronic component 51a and the electronic component 51b are accommodated in the recess 31 near the center of the circuit board 30, the distance between the imaging element 21, the electronic component 51a, and the electronic component 51b can be shortened, so that the impedance can be reduced. Since the image sensor 21 can be driven stably, a high-quality image can be obtained. Moreover, since the recessed part 31 is provided in the surface f4 of the circuit board 30, and the electronic component 51a and the electronic component 51b are accommodated, a hard part length (length of the hard part of the optical axis direction of the imaging unit 10) can be shortened. A connection electrode 33 is formed on a surface of the surface f4 of the circuit board 30 excluding the recess 31.
　異形回路基板４０は、セラミックス基板、ガラエポ基板、ガラス基板、シリコン基板等からなり、配線が形成された複数の基板が積層されて、対向する側面である面ｆ６及び面ｆ７が階段状をなしている。 The odd-shaped circuit board 40 is made of a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like, and a plurality of substrates on which wiring is formed are stacked, and the opposing side surfaces f6 and f7 are stepped. Yes.
　異形回路基板４０の表面（面ｆ５）には、接続電極３３と接続される接続電極４１が形成されている。異形回路基板４０の側面である面ｆ６及び面ｆ７は、半導体パッケージ２０の光軸方向の基端側で近接するような階段状、すなわち、面ｆ６及び面ｆ７には、階段部Ｓ１、階段部Ｓ２及び階段部Ｓ３が形成されている。 A connection electrode 41 connected to the connection electrode 33 is formed on the surface (surface f5) of the odd-shaped circuit board 40. The surface f6 and the surface f7 which are side surfaces of the odd-shaped circuit board 40 are stepped so as to be close to each other on the base end side in the optical axis direction of the semiconductor package 20, that is, the surface f6 and the surface f7 have a stepped portion S1 and a stepped portion. S2 and the step part S3 are formed.
　面ｆ６及び面ｆ７の階段部Ｓ２、及び階段部Ｓ３には、ケーブル（不図示）が電気的及び機械的に接続されるケーブル接続電極４２が形成されている。階段部Ｓ２及び階段部Ｓ３のケーブル接続電極４２は、光軸方向で重ならないようにずらして配置されている。 A cable connection electrode 42 to which a cable (not shown) is electrically and mechanically connected is formed on the staircase portion S2 and the staircase portion S3 of the surface f6 and the surface f7. The cable connection electrodes 42 of the stepped portion S2 and the stepped portion S3 are arranged so as not to overlap in the optical axis direction.
　第１半田ボール６０は、半田ボールのほか、金属コアはんだボール、樹脂コアはんだボール、Ａｕバンプ、等でもよい。面ｆ２の接続電極２３と面ｆ３の接続電極３２との接続部は、図示しない封止樹脂により封止されている。 The first solder balls 60 may be metal core solder balls, resin core solder balls, Au bumps, etc. in addition to solder balls. The connection portion between the connection electrode 23 on the surface f2 and the connection electrode 32 on the surface f3 is sealed with a sealing resin (not shown).
　第２半田ボール７０は、半田ボールのほか、金属コアはんだボール、樹脂コアはんだボール、Ａｕバンプ、等でもよい。面ｆ４の接続電極３３と面ｆ５の接続電極４１の接続部及び凹部３１内は、図示しない封止樹脂により封止されている。 The second solder ball 70 may be a solder ball, a metal core solder ball, a resin core solder ball, an Au bump, or the like. The connection part of the connection electrode 33 on the surface f4 and the connection electrode 41 on the surface f5 and the inside of the recess 31 are sealed with a sealing resin (not shown).
　次に、第１半田ボール６０及び第２半田ボール７０の配置について詳細に説明する。図３は、図２のＡ－Ａ線に対応する断面図である。図４は、図２のＢ－Ｂ線に対応する断面図である。図３、図４に示すように、第２半田ボール７０は、第１半田ボール６０より数が少なく、かつ第１半田ボール６０より径が大きい。この撮像ユニット１０では、第１半田ボール６０の径を小さくしていることにより、接続数が多い半導体パッケージ２０と回路基板３０との間の電気的及び機械的な接続を半田ボールにより行うことができる。さらに、この撮像ユニット１０では、第２半田ボール７０の径を大きくすることにより、接続数が少ない回路基板３０と異形回路基板４０との間の機械的強度を十分に得ることができる。 Next, the arrangement of the first solder balls 60 and the second solder balls 70 will be described in detail. FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 4 is a cross-sectional view corresponding to the line BB in FIG. As shown in FIGS. 3 and 4, the second solder balls 70 are smaller in number than the first solder balls 60 and larger in diameter than the first solder balls 60. In the imaging unit 10, by reducing the diameter of the first solder ball 60, the electrical and mechanical connection between the semiconductor package 20 and the circuit board 30 having a large number of connections can be performed by the solder ball. it can. Furthermore, in this imaging unit 10, the mechanical strength between the circuit board 30 and the odd-shaped circuit board 40 with a small number of connections can be sufficiently obtained by increasing the diameter of the second solder ball 70.
　また、本実施の形態１では、電子部品５１ａ、電子部品５１ｂ、ケーブル（不図示）を実装する基板を、回路基板３０及び異形回路基板４０に分割し、撮像素子２１に近接する回路基板３０に電子部品５１ａ及び電子部品５１ｂを実装するので、撮像素子２１と電子部品５１ａ及び電子部品５１ｂとの間のインピーダンスを低下することができる。また、電子部品５１ａ及び電子部品５１ｂを、回路基板３０の裏面（面ｆ４）に形成した凹部３１に収容することで、撮像ユニット１０の光軸方向の硬質部分の長さを短くすることができる。 In the first embodiment, the board on which the electronic component 51 a, the electronic part 51 b, and the cable (not shown) are mounted is divided into the circuit board 30 and the odd-shaped circuit board 40, and the circuit board 30 adjacent to the image pickup device 21 is separated. Since the electronic component 51a and the electronic component 51b are mounted, the impedance between the image sensor 21 and the electronic component 51a and the electronic component 51b can be reduced. Further, by accommodating the electronic component 51a and the electronic component 51b in the recess 31 formed on the back surface (surface f4) of the circuit board 30, the length of the hard portion in the optical axis direction of the imaging unit 10 can be shortened. .
　さらに、回路基板３０、及び異形回路基板４０を、半導体パッケージ２０の光軸方向の投影面内に収まる大きさとしているので、撮像ユニット１０の細径化が可能であるとともに、回路基板３０、異形回路基板４０は、ファインピッチな配線形成が可能な、積層する基板面と平行な面、面ｆ３、面ｆ４、面ｆ５で、半導体パッケージ２０との接続や、回路基板３０と異形回路基板４０との接続を行うため、小型化、かつ信頼性の高い撮像ユニット１０を得ることができる。 Furthermore, since the circuit board 30 and the odd-shaped circuit board 40 are sized to fit within the projection plane of the semiconductor package 20 in the optical axis direction, the imaging unit 10 can be reduced in diameter, and the circuit board 30 and the odd-shaped circuit board 40 can be reduced. The circuit board 40 can be connected to the semiconductor package 20 on the plane parallel to the stacked substrate plane, the plane f3, the plane f4, and the plane f5, and can be formed with fine pitch wiring. Therefore, it is possible to obtain the imaging unit 10 that is small in size and highly reliable.
　なお、上記の実施の形態１では、凹部３１が形成されている回路基板３０を用いているが、部品内蔵基板を用いてもよい。図５は、実施の形態１の変形例に係る撮像ユニットの側面図である。図５に示すように、撮像ユニット１０Ａは、回路基板３０に代えて電子部品５１ａ及び電子部品５１ｂを内蔵する部品内蔵基板３０Ａを備える。 In the first embodiment, the circuit board 30 in which the recess 31 is formed is used, but a component-embedded board may be used. FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment. As shown in FIG. 5, the imaging unit 10 </ b> A includes a component built-in substrate 30 </ b> A that incorporates an electronic component 51 a and an electronic component 51 b instead of the circuit board 30.
　また、上記の実施の形態１では、凹部３１を回路基板３０の裏面（面ｆ４）に設けているが、凹部は異形回路基板４０の表面（面ｆ５）に設けてもよい。さらに、電子部品５１ａ及び電子部品５１ｂや第１半田ボール６０、第２半田ボール７０の大きさによっては、必ずしも、回路基板３０の裏面（面ｆ４）の凹部３１、又は異形回路基板４０の表面（面ｆ５）の凹部を形成する必要はない。 In the first embodiment, the recess 31 is provided on the back surface (surface f4) of the circuit board 30, but the recess may be provided on the surface (surface f5) of the odd-shaped circuit board 40. Furthermore, depending on the size of the electronic component 51a, the electronic component 51b, the first solder ball 60, and the second solder ball 70, the concave portion 31 on the back surface (surface f4) of the circuit board 30 or the surface of the odd-shaped circuit board 40 ( It is not necessary to form a recess in the surface f5).
（実施の形態２）
　図６は、実施の形態２に係る撮像ユニットの側面図である。撮像ユニット１１０は、表面に撮像素子１２１を有し、裏面に接続電極１２３が形成されている半導体パッケージ１２０と、表面及び裏面に接続電極１３２及び接続電極１３３がそれぞれ形成されており、撮像素子１２１の裏面側に積層されている回路基板１３０と、表面及び裏面側に接続電極１４１及びケーブル接続電極１４２がそれぞれ形成されており、回路基板１３０の裏面側に積層されている異形回路基板１４０と、回路基板１３０の裏面に実装されている電子部品１５１ａ及び電子部品１５１ｂと、半導体パッケージ１２０の裏面側の接続電極１２３と回路基板１３０の表面側の接続電極１３２とを電気的及び機械的に接続している第１半田ボール１６０と、回路基板１３０の裏面側の接続電極１３３と異形回路基板１４０の表面側の接続電極１４１とを電気的及び機械的に接続している第２半田ボール１７０と、を備える。 (Embodiment 2)
FIG. 6 is a side view of the imaging unit according to the second embodiment. The imaging unit 110 has an imaging element 121 on the front surface, a semiconductor package 120 having a connection electrode 123 formed on the back surface, and a connection electrode 132 and a connection electrode 133 formed on the front surface and the back surface. A circuit board 130 laminated on the back surface side, a connection circuit 141 and a cable connection electrode 142 formed on the front surface and the back surface side, respectively, and a modified circuit board 140 laminated on the back surface side of the circuit board 130; The electronic component 151a and the electronic component 151b mounted on the back surface of the circuit board 130 are electrically and mechanically connected to the connection electrode 123 on the back surface side of the semiconductor package 120 and the connection electrode 132 on the front surface side of the circuit board 130. First solder balls 160, connection electrodes 133 on the back side of the circuit board 130, and the surface of the irregular circuit board 140 Provided between the connection electrode 141 electrically, and the second solder balls 170 which is mechanically connected to, the.
　半導体パッケージ１２０は、ガラス１２２が撮像素子１２１に貼り付けられた構造となっている。半導体パッケージ１２０は、撮像素子１２１の受光面に沿った短手方向の長さが１．５ｍｍ未満であり、かつ長手方向の長さが１．９ｍｍ未満である。 The semiconductor package 120 has a structure in which a glass 122 is attached to the image sensor 121. The semiconductor package 120 has a short side length of less than 1.5 mm along the light receiving surface of the image sensor 121 and a long side length of less than 1.9 mm.
　回路基板１３０の裏面の中央部には、凹部１３１が設けられ、凹部１３１内に電子部品１５１ａ及び電子部品１５１ｂを実装する実装ランド１３５ａ及び実装ランド１３５ｂが形成されている。 A recess 131 is provided in the center of the back surface of the circuit board 130, and a mounting land 135a and a mounting land 135b for mounting the electronic component 151a and the electronic component 151b are formed in the recess 131.
　次に、第１半田ボール１６０及び第２半田ボール１７０の配置について詳細に説明する。図７は、図６のＣ－Ｃ線に対応する断面図である。図８は、図６のＤ－Ｄ線に対応する断面図である。図７、図８に示すように、第２半田ボール１７０は、第１半田ボール１６０より数が少なく、かつ第１半田ボール１６０より径が小さい。この撮像ユニット１１０では、半導体パッケージ１２０の面積が小さく、回路基板１３０と異形回路基板１４０との間で半田ボールを配置可能な面（回路基板１３０の裏面の凹部１３１を除く面）の面積が小さい。そのため、撮像ユニット１１０では、第２半田ボール１７０の径を小さくし、かつ第２半田ボール１７０を千鳥状に配設している（図８参照）ことにより、回路基板１３０と異形回路基板１４０との間の電気的及び機械的な接続を半田ボールにより行うことができる。一方、半導体パッケージ１２０と回路基板１３０との間の接続は、機械的強度を強くする観点から、径が大きい半田ボールによって接続されることが好ましく、第１半田ボール１６０の径は第２半田ボール１７０の径より大きい。 Next, the arrangement of the first solder balls 160 and the second solder balls 170 will be described in detail. FIG. 7 is a cross-sectional view corresponding to the line CC in FIG. FIG. 8 is a cross-sectional view corresponding to the line DD in FIG. As shown in FIGS. 7 and 8, the second solder balls 170 are smaller in number than the first solder balls 160 and smaller in diameter than the first solder balls 160. In this imaging unit 110, the area of the semiconductor package 120 is small, and the area on which a solder ball can be placed between the circuit board 130 and the odd-shaped circuit board 140 (the surface excluding the recess 131 on the back surface of the circuit board 130) is small. . Therefore, in the imaging unit 110, the second solder balls 170 are reduced in diameter and the second solder balls 170 are arranged in a staggered manner (see FIG. 8), so that the circuit board 130, the deformed circuit board 140, The electrical and mechanical connection between the two can be made by solder balls. On the other hand, the connection between the semiconductor package 120 and the circuit board 130 is preferably connected by a solder ball having a large diameter from the viewpoint of increasing the mechanical strength, and the diameter of the first solder ball 160 is the second solder ball. Greater than 170 diameter.
　実施の形態１及び実施の形態２において説明したように、半導体パッケージの面積や電子部品の大きさ等の設計条件によって、半導体パッケージと回路基板との間を電気的及び機械的に接続する半田ボールの径と、回路基板と異形回路基板との間を電気的及び機械的に接続する半田ボールの径との関係を適正に設定することが好ましい。 As described in the first and second embodiments, the solder balls electrically and mechanically connect the semiconductor package and the circuit board depending on the design conditions such as the area of the semiconductor package and the size of the electronic component. It is preferable to appropriately set the relationship between the diameter of the solder ball and the diameter of the solder ball that electrically and mechanically connects the circuit board and the odd-shaped circuit board.
（実施の形態３）
　図９は、実施の形態３に係る撮像ユニットの側面図である。撮像ユニット２１０は、表面に撮像素子２２１を有し、裏面に接続電極２２３が形成されている半導体パッケージ２２０と、表面及び裏面に接続電極２３２Ａ及び接続電極２３３Ａがそれぞれ形成されており、撮像素子２２１の裏面側に積層されている回路基板２３０Ａと、表面及び裏面に接続電極２３２Ｂ及び接続電極２３３Ｂがそれぞれ形成されており、回路基板２３０Ａの裏面側に積層されている回路基板２３０Ｂと、表面及び裏面側に接続電極２４１及びケーブル接続電極２４２がそれぞれ形成されており、回路基板２３０Ｂの裏面側に積層されている異形回路基板２４０と、回路基板２３０Ａの裏面に実装されている電子部品２５１ａ及び電子部品２５１ｂと、回路基板２３０Ｂの裏面に実装されている電子部品２５１ｃ及び電子部品２５１ｄと、半導体パッケージ２２０の裏面側の接続電極２２３と回路基板２３０Ａの表面側の接続電極２３２Ａとを電気的及び機械的に接続している第１半田ボール２６０と、回路基板２３０Ａの裏面側の接続電極２３３Ａと回路基板２３０Ｂの表面側の接続電極２３２Ｂとを電気的及び機械的に接続している第２半田ボール２７０と、回路基板２３０Ｂの裏面側の接続電極２３３Ｂと異形回路基板２４０の表面側の接続電極２４１とを電気的及び機械的に接続している第３半田ボール２８０と、を備える。 (Embodiment 3)
FIG. 9 is a side view of the imaging unit according to the third embodiment. The imaging unit 210 includes an imaging element 221 on the front surface, a semiconductor package 220 having a connection electrode 223 formed on the back surface, and a connection electrode 232A and a connection electrode 233A formed on the front surface and the back surface, respectively. Circuit board 230A stacked on the back side of the circuit board, and connection electrodes 232B and connection electrodes 233B are formed on the front and back surfaces, respectively, and the circuit board 230B stacked on the back side of the circuit board 230A, and the front and back surfaces The connection electrode 241 and the cable connection electrode 242 are respectively formed on the side, the odd-shaped circuit board 240 stacked on the back surface side of the circuit board 230B, and the electronic component 251a and the electronic component mounted on the back surface of the circuit board 230A 251b, the electronic component 251c mounted on the back surface of the circuit board 230B, and the electronic Product 251d, first solder ball 260 electrically and mechanically connecting connection electrode 223 on the back side of semiconductor package 220 and connection electrode 232A on the front side of circuit board 230A, and back side of circuit board 230A The second solder balls 270 that electrically and mechanically connect the connection electrodes 233A and the connection electrodes 232B on the front surface side of the circuit board 230B, and the connection electrodes 233B on the back surface side of the circuit board 230B and the deformed circuit board 240 A third solder ball 280 electrically and mechanically connected to the connection electrode 241 on the surface side.
　半導体パッケージ２２０は、ガラス２２２が撮像素子２２１に貼り付けられた構造となっている。 The semiconductor package 220 has a structure in which a glass 222 is attached to the image sensor 221.
　回路基板２３０Ａの裏面の中央部には、凹部２３１Ａが設けられ、凹部２３１Ａ内に電子部品２５１ａ及び電子部品２５１ｂを実装する実装ランド２３５ａ及び実装ランド２３５ｂが形成されている。 A recess 231A is provided at the center of the back surface of the circuit board 230A, and a mounting land 235a and a mounting land 235b for mounting the electronic component 251a and the electronic component 251b are formed in the recess 231A.
　回路基板２３０Ｂの裏面の中央部には、凹部２３１Ｂが設けられ、凹部２３１Ｂ内に電子部品２５１ｃ及び電子部品２５１ｄを実装する実装ランド２３５ｃ及び実装ランド２３５ｄが形成されている。 A recess 231B is provided at the center of the back surface of the circuit board 230B, and a mounting land 235c and a mounting land 235d for mounting the electronic component 251c and the electronic component 251d are formed in the recess 231B.
　図９に示すように、例えば、第１半田ボール２６０の径を最も大きくし、第２半田ボール２７０の径を第１半田ボール２６０の次に大きくし、第３半田ボール２８０の径を最も小さくすることにより、半導体パッケージ２２０と回路基板２３０Ａとの間、回路基板２３０Ａと回路基板２３０Ｂとの間、回路基板２３０Ｂと異形回路基板２４０との間をそれぞれ半田ボールで電気的及び機械的に接続することができる。ただし、実施の形態２で説明したように、半導体パッケージの面積や電子部品の大きさ等の設計条件によって、第３半田ボール２８０の径を最も大きくし、第２半田ボール２７０の径を第３半田ボール２８０の次に大きくし、第１半田ボール２６０の径を最も小さくすることが好ましい場合がある。 As shown in FIG. 9, for example, the diameter of the first solder ball 260 is made the largest, the diameter of the second solder ball 270 is made larger than the first solder ball 260, and the diameter of the third solder ball 280 is made the smallest. As a result, the semiconductor package 220 and the circuit board 230A, the circuit board 230A and the circuit board 230B, and the circuit board 230B and the odd-shaped circuit board 240 are electrically and mechanically connected with the solder balls, respectively. be able to. However, as described in the second embodiment, the diameter of the third solder ball 280 is maximized and the diameter of the second solder ball 270 is set to the third size depending on design conditions such as the area of the semiconductor package and the size of the electronic component. It may be preferable to enlarge the solder ball 280 next to make the diameter of the first solder ball 260 the smallest.
　また、実施の形態３のような回路基板が３段積層されている構成に限られず、より多段の回路基板が積層されている場合にも、半田ボールの径を適宜設計することにより、各回路基板間を半田ボールで電気的及び機械的に接続することが可能となる。 Further, the circuit board is not limited to the configuration in which the circuit boards are stacked in three stages as in the third embodiment, and each circuit can be designed by appropriately designing the diameter of the solder balls even when more circuit boards are stacked. It is possible to connect the substrates electrically and mechanically with solder balls.
　さらなる効果や変形例は、当業者によって容易に導き出すことができる。よって、本発明のより広範な態様は、以上のように表わしかつ記述した特定の詳細及び代表的な実施の形態に限定されるものではない。従って、添付のクレーム及びその均等物によって定義される総括的な発明の概念の精神又は範囲から逸脱することなく、様々な変更が可能である。 Further effects and modifications can be easily derived by those skilled in the art. Accordingly, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
　１　内視鏡システム
　２　内視鏡
　３　情報処理装置
　４　光源装置
　５　表示装置
　５ａ　映像ケーブル
　６　挿入部
　６ａ　先端部
　６ｂ　湾曲部
　６ｃ　可撓管部
　７　操作部
　７ａ　湾曲ノブ
　７ｂ　処置具挿入部
　７ｃ　スイッチ部
　８　ユニバーサルコード
　８ａ、８ｂ　コネクタ
　１０、１０Ａ、１１０、２１０　撮像ユニット
　２０、１２０、２２０　半導体パッケージ
　２１、１２１、２２１　撮像素子
　２２、１２２、２２２　ガラス
　２３、３２、３３、４１、１２３、１３２、１３３、１４１、２２３、２３２Ａ、２３３Ａ、２３２Ｂ、２３３Ｂ、２４１　接続電極
　３０、１３０、２３０Ａ、２３０Ｂ　回路基板
　３０Ａ　部品内蔵基板
　３１、１３１、２３１Ａ、２３１Ｂ　凹部
　３５ａ、３５ｂ、１３５ａ、１３５ｂ、２３５ａ、２３５ｂ、２３５ｃ、２３５ｄ　実装ランド
　４０、１４０、２４０　異形回路基板
　４２、１４２、２４２　ケーブル接続電極
　５１ａ、５１ｂ、１５１ａ、１５１ｂ、２５１ａ、２５１ｂ、２５１ｃ、２５１ｄ　電子部品
　６０、１６０、２６０　第１半田ボール
　７０、１７０、２７０　第２半田ボール
　２８０　第３半田ボール
　Ｓ１、Ｓ２、Ｓ３　階段部 DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope 3 Information processing apparatus 4 Light source apparatus 5 Display apparatus 5a Image | video cable 6 Insertion part 6a Tip part 6b Bending part 6c Flexible tube part 7 Operation part 7a Bending knob 7b Treatment tool insertion part 7c Switch part 8 Universal code 8a, 8b Connector 10, 10A, 110, 210 Imaging unit 20, 120, 220 Semiconductor package 21, 121, 221 Imaging element 22, 122, 222 Glass 23, 32, 33, 41, 123, 132, 133, 141, 223, 232A, 233A, 232B, 233B, 241 Connection electrode 30, 130, 230A, 230B Circuit board 30A Component built-in board 31, 131, 231A, 231B Recess 35a, 35b, 135a, 135b, 235a, 235b, 235c, 235d mounting land 40 140, 240 Variant circuit board 42, 142, 242 Cable connection electrode 51a, 51b, 151a, 151b, 251a, 251b, 251c, 251d Electronic component 60, 160, 260 First solder ball 70, 170, 270 Second solder ball 280 Third solder ball S1, S2, S3 Staircase

Claims (7)

  1. 　撮像素子を有し、裏面に接続電極が形成されている半導体パッケージと、
    　表面及び裏面に接続電極がそれぞれ形成されており、前記撮像素子の裏面側に積層されている回路基板と、
    　表面及び裏面側に接続電極がそれぞれ形成されており、前記回路基板の裏面側に積層されている異形回路基板と、
    　前記回路基板の裏面に実装されている電子部品と、
    　前記半導体パッケージの裏面の前記接続電極と前記回路基板の表面の前記接続電極とを電気的及び機械的に接続している第１半田ボールと、
    　前記回路基板の裏面の前記接続電極と前記異形回路基板の表面の前記接続電極とを電気的及び機械的に接続しており、前記第１半田ボールより数が少なく、かつ前記第１半田ボールと径が異なっている第２半田ボールと、
    　を備え、
    　前記回路基板、及び前記異形回路基板は、前記半導体パッケージの光軸方向の投影面内に収まっていることを特徴とする撮像ユニット。     A semiconductor package having an image sensor and having a connection electrode formed on the back surface;
    Connection electrodes are formed on the front surface and the back surface, respectively, and a circuit board laminated on the back surface side of the imaging device,
    Connection electrodes are formed on the front surface and the back surface, respectively, and a deformed circuit board laminated on the back surface side of the circuit board;
    Electronic components mounted on the back surface of the circuit board;
    A first solder ball electrically and mechanically connecting the connection electrode on the back surface of the semiconductor package and the connection electrode on the surface of the circuit board;
    The connection electrode on the back surface of the circuit board and the connection electrode on the surface of the odd circuit board are electrically and mechanically connected, and the number of the first solder balls is smaller than that of the first solder balls. A second solder ball having a different diameter;
    With
    The imaging unit, wherein the circuit board and the irregular circuit board are within a projection plane in the optical axis direction of the semiconductor package.
  2. 　前記電子部品は、前記回路基板の裏面に形成された凹部内に収容されていることを特徴とする請求項１に記載の撮像ユニット。 2. The imaging unit according to claim 1, wherein the electronic component is housed in a recess formed on a back surface of the circuit board.
  3. 　前記回路基板の裏面の前記凹部を除く面に前記接続電極が形成されていることを特徴とする請求項２に記載の撮像ユニット。 The imaging unit according to claim 2, wherein the connection electrode is formed on a surface of the back surface of the circuit board excluding the concave portion.
  4. 　前記半導体パッケージの短手方向の長さが１．５ｍｍ以上であり、前記第２半田ボールの径が前記第１半田ボールの径よりも大きいことを特徴とする請求項１～３のいずれか１つに記載の撮像ユニット。 4. The semiconductor package according to claim 1, wherein a length of the semiconductor package in a short direction is 1.5 mm or more, and a diameter of the second solder ball is larger than a diameter of the first solder ball. The imaging unit described in one.
  5. 　前記半導体パッケージの短手方向の長さが１．５ｍｍ未満であり、かつ前記半導体パッケージの長手方向の長さが１．９ｍｍ未満であり、前記第２半田ボールの径が前記第１半田ボールの径よりも小さいことを特徴とする請求項１～３のいずれか１つに記載の撮像ユニット。 The length of the semiconductor package in the short direction is less than 1.5 mm, the length of the semiconductor package in the length direction is less than 1.9 mm, and the diameter of the second solder ball is that of the first solder ball. The imaging unit according to any one of claims 1 to 3, wherein the imaging unit is smaller than the diameter.
  6. 　前記第２半田ボールは、千鳥状に配設されていることを特徴とする請求項５に記載の撮像ユニット。 6. The imaging unit according to claim 5, wherein the second solder balls are arranged in a staggered manner.
  7. 　請求項１～６のいずれか１つに記載の撮像ユニットが先端に設けられている挿入部を備えることを特徴とする内視鏡システム。 An endoscope system comprising an insertion unit in which the imaging unit according to any one of claims 1 to 6 is provided at a distal end.
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