WO2018079328A1 - Unité de capture d'image et système d'endoscope - Google Patents

Unité de capture d'image et système d'endoscope Download PDF

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Publication number
WO2018079328A1
WO2018079328A1 PCT/JP2017/037456 JP2017037456W WO2018079328A1 WO 2018079328 A1 WO2018079328 A1 WO 2018079328A1 JP 2017037456 W JP2017037456 W JP 2017037456W WO 2018079328 A1 WO2018079328 A1 WO 2018079328A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
back surface
semiconductor package
imaging unit
connection electrode
Prior art date
Application number
PCT/JP2017/037456
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English (en)
Japanese (ja)
Inventor
小林　弘幸
寛幸 本原
Original Assignee
オリンパス株式会社
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Filing date
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Publication of WO2018079328A1 publication Critical patent/WO2018079328A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Definitions

  • the present invention relates to an imaging unit and an endoscope system that are provided at the distal end of an insertion portion of an endoscope that is inserted into a subject and images the inside of the subject.
  • An endoscope that are inserted into a subject to observe a region to be examined are known and widely used in the medical field and the like.
  • An endoscope is configured by incorporating an imaging unit in which an electronic component such as an imaging element is mounted at the distal end of a flexible elongated insertion portion.
  • the hard part in which the imaging unit of the endoscope is built should be reduced in diameter and shortened in order to reduce the burden on the subject.
  • various imaging units have been proposed in which a mounting density is improved by reducing the connection pitch in a planar electronic circuit board, reducing the mounting interval between adjacent electronic components, and the like, and circuit boards are stacked. (For example, refer to Patent Document 1).
  • Patent Document 1 discloses an imaging unit in which an imaging element and two substrates are stacked.
  • the connection between the image sensor and the circuit board and the connection between the circuit board and the irregular circuit board are connected by solder. These connections are generally made using solder balls.
  • the connection layer between the image pickup element and the circuit board and the connection layer between the circuit board and the irregular circuit board have different conditions, but usually solder balls having the same diameter are used in consideration of workability. Therefore, for example, a connection layer with a small number of solder balls has a problem that the mechanical strength is weak.
  • the present invention has been made in view of the above, and in a configuration in which a semiconductor package having an imaging element, a circuit board, and a deformed circuit board are stacked, a circuit between the semiconductor package and the circuit board and a circuit are provided. It is an object of the present invention to provide an imaging unit and an endoscope system that can be securely and electrically connected between a substrate and an irregular circuit substrate using solder balls.
  • an imaging unit includes a semiconductor package having an imaging element and a connection electrode formed on the back surface, and a connection electrode on the front surface and the back surface. Are formed, and the circuit board is laminated on the back surface side of the imaging element, and the odd-shaped circuit board is formed with the connection electrodes formed on the front surface and the back surface side and laminated on the back surface side of the circuit board.
  • a first solder that electrically and mechanically connects the electronic component mounted on the back surface of the circuit board, the connection electrode on the back surface of the semiconductor package, and the connection electrode on the surface of the circuit board.
  • the ball and the connection electrode on the back surface of the circuit board and the connection electrode on the surface of the irregular circuit board are electrically and mechanically connected, and the number is smaller than that of the first solder ball, and Comprising a second solder ball 1 solder ball and the diameter is different, the said circuit board and said profiled circuit board, is characterized in that seated in the semiconductor package of the optical axis direction of the projection plane.
  • the electronic component is housed in a recess formed on the back surface of the circuit board.
  • the imaging unit according to one aspect of the present invention is characterized in that the connection electrode is formed on a surface of the back surface of the circuit board excluding the concave portion.
  • the length of the semiconductor package in the short direction is 1.5 mm or more, and the diameter of the second solder ball is larger than the diameter of the first solder ball. It is characterized by.
  • the length of the semiconductor package in the short direction is less than 1.5 mm, and the length of the semiconductor package in the longitudinal direction is less than 1.9 mm.
  • the diameter of the second solder ball is smaller than the diameter of the first solder ball.
  • the imaging unit according to one aspect of the present invention is characterized in that the second solder balls are arranged in a staggered manner.
  • an endoscope system is characterized in that the imaging unit includes an insertion portion provided at a distal end.
  • a gap between the semiconductor package and the circuit board and between the circuit board and the deformed circuit board are provided.
  • an imaging unit and an endoscope system that can be reliably connected electrically and mechanically using solder balls.
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention.
  • FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG.
  • FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 4 is a cross-sectional view corresponding to the line BB in FIG.
  • FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment.
  • FIG. 6 is a side view of the imaging unit according to the second embodiment.
  • FIG. 7 is a cross-sectional view corresponding to the line CC in FIG.
  • FIG. 8 is a cross-sectional view corresponding to the line DD in FIG.
  • FIG. 9 is a side view of the imaging unit according to the third embodiment.
  • an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code
  • FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to Embodiment 1 of the present invention.
  • an endoscope system 1 according to the first embodiment includes an endoscope 2 that is introduced into a subject, images the inside of the subject, and generates an image signal in the subject.
  • An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information And a display device 5 for displaying an image signal after image processing by the processing device 3.
  • the endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.
  • the insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like.
  • the insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b.
  • the distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.
  • the operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment tool insertion portion 7b in which a treatment tool such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3.
  • a plurality of switch units 7c for operating peripheral devices such as a light source device 4, an air supply device, a water supply device, and a gas supply device.
  • the treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.
  • the universal cord 8 is configured using illumination fibers, cables, and the like.
  • the universal cord 8 is branched at the base end, and one end of the branch is the connector 8a, and the other end is the connector 8b.
  • the connector 8a is detachable from the connector of the information processing apparatus 3.
  • the connector 8b is detachable from the light source device 4.
  • the universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber.
  • the universal code 8 transmits an image signal captured by an imaging unit described later to the information processing apparatus 3 via a cable and a connector 8a.
  • the information processing apparatus 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.
  • the light source device 4 includes a light source that emits light, a condensing lens, and the like.
  • the light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.
  • the display device 5 is configured using a display using liquid crystal or organic EL (Electro Luminescence).
  • the display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize the desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.
  • FIG. 2 is a side view of the imaging unit disposed at the distal end portion of the endoscope shown in FIG.
  • the imaging unit 10 has the imaging element 21 on the surface f1 which is the front surface, and the semiconductor package 20 in which the connection electrode 23 is formed on the surface f2 which is the back surface, and is connected to the surface f3 which is the front surface and the surface f4 which is the back surface.
  • An electrode 32 and a connection electrode 33 are formed, and are connected to the circuit board 30 stacked on the back surface (surface f2) side of the image sensor 21, and the surface f5 that is the front surface, the surface f6 that is the back surface side, and the surface f7.
  • the electrode 41 and the cable connection electrode 42 are formed, respectively, and the odd-shaped circuit board 40 stacked on the back surface (surface f4) side of the circuit board 30 and the electronic mounted on the back surface (surface f4) of the circuit board 30.
  • the component 51a and the electronic component 51b are electrically and mechanically connected to the connection electrode 23 on the back surface (surface f2) side of the semiconductor package 20 and the connection electrode 32 on the surface (surface f3) side of the circuit board 30.
  • the first solder balls 60, the connection electrodes 33 on the back surface (surface f4) side of the circuit board 30 and the connection electrodes 41 on the front surface (surface f5) side of the irregular circuit board 40 are electrically and mechanically connected. Second solder balls 70.
  • the circuit board 30 and the odd-shaped circuit board 40 are sized to fit within the projection plane of the semiconductor package 20 in the optical axis direction (vertical direction along the paper surface of FIG. 2).
  • the semiconductor package 20 has a structure in which a glass 22 is attached to the image sensor 21.
  • the light condensed by the lens unit is incident on the light receiving surface of the image pickup device 21 including the light receiving portion via the surface f1 which is the surface of the glass 22.
  • a connection electrode 23 is formed on the surface f ⁇ b> 2 (back surface) of the imaging element 21.
  • the semiconductor package 20 is a CSP (Chip Size Package) in which the imaging element chip in the wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the imaging element chip becomes the size of the semiconductor package as it is. ) Is preferable.
  • the length of the semiconductor package 20 in the short direction along the light receiving surface of the image sensor 21 is 1.5 mm or more.
  • the circuit board 30 is formed in a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the surface f3 and the surface f4 are laminated).
  • a substrate to be laminated a ceramic substrate, a glass epoxy substrate, a flexible substrate, a glass substrate, a silicon substrate, or the like is used.
  • a plurality of vias are formed in the circuit board 30 for conducting the wiring on the stacked boards.
  • a connection electrode 32 is formed on the surface f3 of the circuit board 30.
  • a recess 31 is provided at the center of the surface f4 of the circuit board 30, and a mounting land 35a and a mounting land 35b for mounting the electronic component 51a and the electronic component 51b are formed in the recess 31.
  • the electronic component 51a and the electronic component 51b to be mounted include passive components such as capacitors and resistance coils, and active components such as driver ICs. Since the electronic component 51a and the electronic component 51b are accommodated in the recess 31 near the center of the circuit board 30, the distance between the imaging element 21, the electronic component 51a, and the electronic component 51b can be shortened, so that the impedance can be reduced. Since the image sensor 21 can be driven stably, a high-quality image can be obtained.
  • a hard part length (length of the hard part of the optical axis direction of the imaging unit 10) can be shortened.
  • a connection electrode 33 is formed on a surface of the surface f4 of the circuit board 30 excluding the recess 31.
  • the odd-shaped circuit board 40 is made of a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like, and a plurality of substrates on which wiring is formed are stacked, and the opposing side surfaces f6 and f7 are stepped. Yes.
  • a connection electrode 41 connected to the connection electrode 33 is formed on the surface (surface f5) of the odd-shaped circuit board 40.
  • the surface f6 and the surface f7 which are side surfaces of the odd-shaped circuit board 40 are stepped so as to be close to each other on the base end side in the optical axis direction of the semiconductor package 20, that is, the surface f6 and the surface f7 have a stepped portion S1 and a stepped portion. S2 and the step part S3 are formed.
  • a cable connection electrode 42 to which a cable (not shown) is electrically and mechanically connected is formed on the staircase portion S2 and the staircase portion S3 of the surface f6 and the surface f7.
  • the cable connection electrodes 42 of the stepped portion S2 and the stepped portion S3 are arranged so as not to overlap in the optical axis direction.
  • the first solder balls 60 may be metal core solder balls, resin core solder balls, Au bumps, etc. in addition to solder balls.
  • the connection portion between the connection electrode 23 on the surface f2 and the connection electrode 32 on the surface f3 is sealed with a sealing resin (not shown).
  • the second solder ball 70 may be a solder ball, a metal core solder ball, a resin core solder ball, an Au bump, or the like.
  • the connection part of the connection electrode 33 on the surface f4 and the connection electrode 41 on the surface f5 and the inside of the recess 31 are sealed with a sealing resin (not shown).
  • FIG. 3 is a cross-sectional view corresponding to the line AA in FIG. 4 is a cross-sectional view corresponding to the line BB in FIG.
  • the second solder balls 70 are smaller in number than the first solder balls 60 and larger in diameter than the first solder balls 60.
  • the imaging unit 10 by reducing the diameter of the first solder ball 60, the electrical and mechanical connection between the semiconductor package 20 and the circuit board 30 having a large number of connections can be performed by the solder ball. it can. Furthermore, in this imaging unit 10, the mechanical strength between the circuit board 30 and the odd-shaped circuit board 40 with a small number of connections can be sufficiently obtained by increasing the diameter of the second solder ball 70.
  • the board on which the electronic component 51 a, the electronic part 51 b, and the cable (not shown) are mounted is divided into the circuit board 30 and the odd-shaped circuit board 40, and the circuit board 30 adjacent to the image pickup device 21 is separated. Since the electronic component 51a and the electronic component 51b are mounted, the impedance between the image sensor 21 and the electronic component 51a and the electronic component 51b can be reduced. Further, by accommodating the electronic component 51a and the electronic component 51b in the recess 31 formed on the back surface (surface f4) of the circuit board 30, the length of the hard portion in the optical axis direction of the imaging unit 10 can be shortened. .
  • the imaging unit 10 can be reduced in diameter, and the circuit board 30 and the odd-shaped circuit board 40 can be reduced.
  • the circuit board 40 can be connected to the semiconductor package 20 on the plane parallel to the stacked substrate plane, the plane f3, the plane f4, and the plane f5, and can be formed with fine pitch wiring. Therefore, it is possible to obtain the imaging unit 10 that is small in size and highly reliable.
  • FIG. 5 is a side view of an imaging unit according to a modification of the first embodiment.
  • the imaging unit 10 ⁇ / b> A includes a component built-in substrate 30 ⁇ / b> A that incorporates an electronic component 51 a and an electronic component 51 b instead of the circuit board 30.
  • the recess 31 is provided on the back surface (surface f4) of the circuit board 30, but the recess may be provided on the surface (surface f5) of the odd-shaped circuit board 40. Furthermore, depending on the size of the electronic component 51a, the electronic component 51b, the first solder ball 60, and the second solder ball 70, the concave portion 31 on the back surface (surface f4) of the circuit board 30 or the surface of the odd-shaped circuit board 40 ( It is not necessary to form a recess in the surface f5).
  • FIG. 6 is a side view of the imaging unit according to the second embodiment.
  • the imaging unit 110 has an imaging element 121 on the front surface, a semiconductor package 120 having a connection electrode 123 formed on the back surface, and a connection electrode 132 and a connection electrode 133 formed on the front surface and the back surface.
  • the electronic component 151a and the electronic component 151b mounted on the back surface of the circuit board 130 are electrically and mechanically connected to the connection electrode 123 on the back surface side of the semiconductor package 120 and the connection electrode 132 on the front surface side of the circuit board 130.
  • First solder balls 160, connection electrodes 133 on the back side of the circuit board 130, and the surface of the irregular circuit board 140 Provided between the connection electrode 141 electrically, and the second solder balls 170 which is mechanically connected to, the.
  • the semiconductor package 120 has a structure in which a glass 122 is attached to the image sensor 121.
  • the semiconductor package 120 has a short side length of less than 1.5 mm along the light receiving surface of the image sensor 121 and a long side length of less than 1.9 mm.
  • a recess 131 is provided in the center of the back surface of the circuit board 130, and a mounting land 135a and a mounting land 135b for mounting the electronic component 151a and the electronic component 151b are formed in the recess 131.
  • FIG. 7 is a cross-sectional view corresponding to the line CC in FIG.
  • FIG. 8 is a cross-sectional view corresponding to the line DD in FIG.
  • the second solder balls 170 are smaller in number than the first solder balls 160 and smaller in diameter than the first solder balls 160.
  • the area of the semiconductor package 120 is small, and the area on which a solder ball can be placed between the circuit board 130 and the odd-shaped circuit board 140 (the surface excluding the recess 131 on the back surface of the circuit board 130) is small. .
  • the second solder balls 170 are reduced in diameter and the second solder balls 170 are arranged in a staggered manner (see FIG. 8), so that the circuit board 130, the deformed circuit board 140,
  • the electrical and mechanical connection between the two can be made by solder balls.
  • the connection between the semiconductor package 120 and the circuit board 130 is preferably connected by a solder ball having a large diameter from the viewpoint of increasing the mechanical strength, and the diameter of the first solder ball 160 is the second solder ball. Greater than 170 diameter.
  • the solder balls electrically and mechanically connect the semiconductor package and the circuit board depending on the design conditions such as the area of the semiconductor package and the size of the electronic component. It is preferable to appropriately set the relationship between the diameter of the solder ball and the diameter of the solder ball that electrically and mechanically connects the circuit board and the odd-shaped circuit board.
  • FIG. 9 is a side view of the imaging unit according to the third embodiment.
  • the imaging unit 210 includes an imaging element 221 on the front surface, a semiconductor package 220 having a connection electrode 223 formed on the back surface, and a connection electrode 232A and a connection electrode 233A formed on the front surface and the back surface, respectively.
  • Circuit board 230A stacked on the back side of the circuit board, and connection electrodes 232B and connection electrodes 233B are formed on the front and back surfaces, respectively, and the circuit board 230B stacked on the back side of the circuit board 230A, and the front and back surfaces
  • the connection electrode 241 and the cable connection electrode 242 are respectively formed on the side, the odd-shaped circuit board 240 stacked on the back surface side of the circuit board 230B, and the electronic component 251a and the electronic component mounted on the back surface of the circuit board 230A 251b, the electronic component 251c mounted on the back surface of the circuit board 230B, and the electronic Product 251d, first solder ball 260 electrically and mechanically connecting connection electrode 223 on the back side of semiconductor package 220 and connection electrode 232A on the front side of circuit board 230A, and back side of circuit board 230A
  • the second solder balls 270 that electrically and mechanically connect the connection electrodes 233A and the connection electrodes 232B on the front surface side of
  • the semiconductor package 220 has a structure in which a glass 222 is attached to the image sensor 221.
  • a recess 231A is provided at the center of the back surface of the circuit board 230A, and a mounting land 235a and a mounting land 235b for mounting the electronic component 251a and the electronic component 251b are formed in the recess 231A.
  • a recess 231B is provided at the center of the back surface of the circuit board 230B, and a mounting land 235c and a mounting land 235d for mounting the electronic component 251c and the electronic component 251d are formed in the recess 231B.
  • the diameter of the first solder ball 260 is made the largest
  • the diameter of the second solder ball 270 is made larger than the first solder ball 260
  • the diameter of the third solder ball 280 is made the smallest.
  • the semiconductor package 220 and the circuit board 230A, the circuit board 230A and the circuit board 230B, and the circuit board 230B and the odd-shaped circuit board 240 are electrically and mechanically connected with the solder balls, respectively. be able to.
  • the diameter of the third solder ball 280 is maximized and the diameter of the second solder ball 270 is set to the third size depending on design conditions such as the area of the semiconductor package and the size of the electronic component. It may be preferable to enlarge the solder ball 280 next to make the diameter of the first solder ball 260 the smallest.
  • circuit board is not limited to the configuration in which the circuit boards are stacked in three stages as in the third embodiment, and each circuit can be designed by appropriately designing the diameter of the solder balls even when more circuit boards are stacked. It is possible to connect the substrates electrically and mechanically with solder balls.

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Abstract

La présente invention concerne une unité de capture d'image, comprenant : un boîtier de semi-conducteur qui comprend un élément de capture d'image et une électrode de connecteur étant formée sur la surface arrière dudit boîtier de semi-conducteur ; un substrat de circuit, des électrodes de connecteur étant formées respectivement sur la surface avant et la surface arrière de celui-ci, ledit substrat de circuit étant empilé sur le côté de la surface arrière de l'élément de capture d'image ; une variante de substrat de circuit, les électrodes de connecteur étant formées respectivement sur la surface avant et la surface arrière de celle-ci, ladite variante de substrat de circuit étant empilée sur le côté de la surface arrière du substrat de circuit ; un composant numérique qui est monté sur la surface arrière du substrat de circuit ; de premières billes de soudure qui connectent l'électrode de connexion sur la surface arrière du boîtier de semi-conducteur avec l'électrode de connexion sur la surface avant du substrat de circuit ; et des secondes billes de soudure qui connectent l'électrode de connexion sur la surface arrière du substrat de circuit avec l'électrode de connexion sur la surface avant de la variante de substrat de circuit, lesdites secondes billes de soudure étant moins nombreuses que les premières billes de soudure et ayant des diamètres différents de ceux des premières billes de soudure. Le substrat de circuit et la variante de substrat de circuit sont contenus dans un plan de projection du boîtier de semi-conducteur dans une direction d'axe optique. L'invention concerne ainsi une unité de capture d'image permettant d'obtenir des connexions fiables entre le boîtier de semi-conducteur, le substrat de circuit et la variante de substrat de circuit, à l'aide des billes de soudure.
PCT/JP2017/037456 2016-10-31 2017-10-17 Unité de capture d'image et système d'endoscope WO2018079328A1 (fr)

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JP2016-213082 2016-10-31

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2019021705A1 (fr) * 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 Dispositif de capture d'image monolithique
WO2024067664A1 (fr) * 2022-09-28 2024-04-04 常州联影智融医疗科技有限公司 Unité de circuit électronique, unité de caméra et endoscope

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JP2003046255A (ja) * 2001-07-31 2003-02-14 Ngk Spark Plug Co Ltd 配線基板
JP2004207461A (ja) * 2002-12-25 2004-07-22 Olympus Corp 固体撮像装置及びその製造方法
JP2007258430A (ja) * 2006-03-23 2007-10-04 Fujitsu Ltd 半導体装置

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Publication number Priority date Publication date Assignee Title
JP2003046255A (ja) * 2001-07-31 2003-02-14 Ngk Spark Plug Co Ltd 配線基板
JP2004207461A (ja) * 2002-12-25 2004-07-22 Olympus Corp 固体撮像装置及びその製造方法
JP2007258430A (ja) * 2006-03-23 2007-10-04 Fujitsu Ltd 半導体装置

Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2019021705A1 (fr) * 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 Dispositif de capture d'image monolithique
US11405569B2 (en) 2017-07-25 2022-08-02 Sony Semiconductor Solutions Corporation Solid-state imaging device
US11671726B2 (en) 2017-07-25 2023-06-06 Sony Semiconductor Solutions Corporation Solid-state imaging device
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