JP2853939B2 - Solid-state image sensor package - Google Patents
Solid-state image sensor packageInfo
- Publication number
- JP2853939B2 JP2853939B2 JP4219810A JP21981092A JP2853939B2 JP 2853939 B2 JP2853939 B2 JP 2853939B2 JP 4219810 A JP4219810 A JP 4219810A JP 21981092 A JP21981092 A JP 21981092A JP 2853939 B2 JP2853939 B2 JP 2853939B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- solid
- extension
- state imaging
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は固体撮像素子パッケー
ジ、特に固体撮像素子をパッケージ内に密閉状態で収納
するタイプのパッケージ構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device package, and more particularly to a package structure of a type in which a solid-state imaging device is housed in a package in a sealed state.
【０００２】[0002]
【従来の技術】固体撮像素子は、体腔内等の被観察体内
を画像表示するための電子内視鏡、ムービーカメラ等に
用いられ、この固体撮像素子としてＣＣＤ（Charge Cou
pled Device)等がある。このＣＣＤは、例えば電子内視
鏡（電子スコープ）の先端部に取り付けられ、この電子
内視鏡を被観察体内に挿入することにより、ＣＣＤはモ
ニタ上に表示するための被観察体内の画像を捉えること
ができる。2. Description of the Related Art A solid-state imaging device is used for an electronic endoscope, a movie camera, and the like for displaying an image of a body to be observed such as a body cavity.
pled Device). The CCD is attached, for example, to the distal end of an electronic endoscope (electronic scope). By inserting the electronic endoscope into the object to be observed, the CCD converts an image in the object to be displayed on a monitor. Can be caught.
【０００３】図４には、従来において電子内視鏡、ムー
ビーカメラに用いられている固体撮像素子の取付け構造
が示されており、図においてＣＣＤ１はパッケージ２の
段差を有する収納部３内に落とし込まれ、銀ペースト等
の導電性接着剤によってパッケージ２の底面に接着され
る。また、このＣＣＤ１はその端子がボンデイングワイ
ヤ４にてパッケージ２側の段差部の端子と接続されてお
り、このパッケージ２の底面側には信号線と接続するた
めのピン５が配設される。FIG. 4 shows a mounting structure of a solid-state image pickup device conventionally used for an electronic endoscope and a movie camera. In the figure, a CCD 1 is dropped into a storage section 3 having a step of a package 2. And is adhered to the bottom surface of the package 2 by a conductive adhesive such as a silver paste. Further, the CCD 1 has its terminals connected to the terminals of the step portion on the package 2 side by bonding wires 4, and pins 5 for connecting to signal lines are provided on the bottom side of the package 2.
【０００４】更に、上記パッケージ２の上面にはカバー
ガラス６が気密状態で取付けられ、内部に窒素（Ｎ2 ）
ガス等が封入される。即ち、この種のＣＣＤ１の上面に
は図示していないが色フィルタ、マイクロレンズ等が積
層して設けられており、この色フィルタ及びマイクロレ
ンズを保護（湿気からの隔離、酸化防止等）するために
窒素ガスが封入されると共に、図示のようにＣＣＤ１と
カバーガラス６との間のエアギャップによってマイクロ
レンズの集光作用等を確保するようになっている。Further, a cover glass 6 is mounted on the upper surface of the package 2 in an airtight state, and nitrogen (N 2 ) is provided inside.
Gas and the like are enclosed. That is, although not shown, a color filter, a microlens, and the like are stacked on the upper surface of this type of CCD 1 to protect the color filter and the microlens (separation from moisture, oxidation prevention, etc.). Is filled with nitrogen gas, and a light condensing action of the microlens is secured by an air gap between the CCD 1 and the cover glass 6 as shown in the figure.
【０００５】図５には、上記パッケージ２を電子内視鏡
に配設した状態が示されており、例えば電子内視鏡７先
端の対物レンズ８Ａ、プリズム８Ｂ等の光学系部材を介
して上述したパッケージ２が配置される。従って、被観
察体内の画像は対物レンズ８Ａ、プリズム８Ｂ、そして
カバーガラス６を介してＣＣＤ１の上面のイメージエリ
アに到達することになる。FIG. 5 shows a state in which the package 2 is arranged on an electronic endoscope. For example, the package 2 is provided via an optical system member such as an objective lens 8A and a prism 8B at the tip of the electronic endoscope 7. Package 2 is placed. Therefore, the image inside the object to be observed reaches the image area on the upper surface of the CCD 1 via the objective lens 8A, the prism 8B, and the cover glass 6.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の固体撮像素子パッケージ、特に上述のようにＣＣＤ
１をパッケージ２内へ収納するタイプでは、ＣＣＤ１を
収納し、またエアギャップを設けるため、パッケージ２
の縦幅が大きくなる。しかも、図４のようにパッケージ
２の下面からピン５を出し、このピン５に信号線を接続
する構成となるので、パッケージ２の縦方向の全体の幅
が大きくなる。従って、図５のように、パッケージ２を
電子内視鏡７の中心軸に平行に配置する場合には、電子
内視鏡７の細径化を図ることができないという問題があ
った。However, the above-mentioned conventional solid-state image pickup device package, especially the CCD as described above,
In the type in which the CCD 1 is stored in the package 2, the CCD 1 is stored and the air gap is provided.
The vertical width becomes larger. Moreover, as shown in FIG. 4, the pins 5 are taken out from the lower surface of the package 2 and a signal line is connected to the pins 5, so that the entire width of the package 2 in the vertical direction is increased. Therefore, as shown in FIG. 5, when the package 2 is arranged in parallel with the central axis of the electronic endoscope 7, there is a problem that the diameter of the electronic endoscope 7 cannot be reduced.
【０００７】本発明は上記問題点に鑑みてなされたもの
であり、その目的は、パッケージの厚さを可能な限り薄
くし、特に電子内視鏡の細径化を図ることができる固体
撮像素子パッケージを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to reduce the thickness of a package as much as possible, and particularly to reduce the diameter of an electronic endoscope. To provide a package.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、第１請求項記載の発明は、複数の基板を積層して固
体撮像素子の収納部を形成する固体撮像素子パッケージ
において、上記固体撮像素子を上面に載置し、かつ所定
方向に延びる延出部領域を設けた底面基板と、この底面
基板の上面に重ねられ、上記固体撮像素子の収納部を形
成する収納孔を有し、かつ所定方向に延びる延出部領域
を設けた延出部補強用基板と、を上記複数の基板の一部
として配置し、当該パッケージの厚み方向の寸法を小さ
くするために、上記底面基板の厚さを０．５ｍｍ未満に
設定すると共に、上記底面基板と延出部補強用基板の延
出部領域を重ねて当該パッケージの側面から一方向に延
びる延出部を形成し、この延出部に、上記固体撮像素子
が電気的に連結され、かつ出力信号線が接続される端子
部を設けたことを特徴とする。According to a first aspect of the present invention, there is provided a solid-state imaging device package in which a plurality of substrates are stacked to form a storage portion for a solid-state imaging device. A bottom substrate provided with an image pickup device mounted on the upper surface and provided with an extension region extending in a predetermined direction, and a storage hole formed on the upper surface of the bottom substrate to form a storage portion of the solid-state image sensor, And an extension portion reinforcing substrate provided with an extension portion region extending in a predetermined direction, and a part of the plurality of substrates, and the thickness of the bottom substrate is reduced in order to reduce the thickness dimension of the package. The length is set to less than 0.5 mm and the bottom substrate and the extension region of the extension portion reinforcing substrate are overlapped to form an extension extending in one direction from the side surface of the package. The solid-state imaging device is electrically connected. And wherein the output signal line is provided with a terminal portion to be connected.
【０００９】また、第２請求項記載の発明は、上記底面
基板に上記延出部補強用基板を重ねて形成した延出部の
厚さを、０．５ｍｍ以上に設定したことを特徴とする。According to a second aspect of the present invention, the thickness of the extension formed by laminating the extension portion reinforcing substrate on the bottom substrate is set to 0.5 mm or more. .
【００１０】[0010]
【作用】上記の構成によれば、延出部に信号線の接続端
子が配置されるので、従来のピンの長さ及び信号線の取
付け幅に相当する幅が削減でき、また延出部を少なくと
も２枚の基板にて構成するので、最下段の底面板を焼結
が可能な厚さ以下にすることができ、これによっても薄
型化が図れることになる。即ち、セラミック板を用いて
パッケージを形成する場合には、焼結工程があり、この
焼結工程にて熱を加えると、約０．５ｍｍ以下のセラミ
ック板は端部で曲ってしまい、良好な延出部を形成する
ことができない。そこで、上記第２請求項のように、延
出部を２枚以上のセラミック板で構成し、所定の厚さを
保ちながら細径化を図るために、底面板を薄くするよう
にしたものである。According to the above construction, the connection terminal of the signal line is arranged in the extension, so that the width corresponding to the length of the conventional pin and the mounting width of the signal line can be reduced. Since it is composed of at least two substrates, the bottom plate at the lowermost stage can be made thinner than the thickness that allows sintering, and thereby the thickness can be reduced. That is, when a package is formed using a ceramic plate, there is a sintering process, and when heat is applied in this sintering process, the ceramic plate of about 0.5 mm or less bends at the end, and a good The extension cannot be formed. Therefore, as in the second aspect, the extension portion is formed of two or more ceramic plates, and the bottom plate is made thin in order to reduce the diameter while maintaining a predetermined thickness. is there.
【００１１】[0011]
【実施例】図１には、実施例に係るパッケージの構成が
切断された状態で示されており、図２には固体撮像素子
を実装した状態のパッケージの断面が示されている。図
１において、実施例のパッケージ１０は４枚のセラミッ
ク板１１Ａ，１１Ｂ，１１Ｃ，１１Ｄを積層した構成と
なっており、このセラミック板１１Ａ〜１１Ｃの四角形
の孔にて形成される収納部１２内にＣＣＤ１がダイボン
ディングされることになる（図２）。上記４枚のセラミ
ック板１１Ａ〜１１Ｄにおいて、図２に示されるよう
に、第１板１１ＡはＣＣＤ１とパッケージ１０の上面に
配置されるカバーガラス２１との間にエアギャップを設
ける役目をし、第２板１１Ｂには、ＣＣＤ１の端子（２
０）へボンデイングワイヤ１３で接続される端子１４
Ａ，１４Ｂが形成される。FIG. 1 is a cut-away view of a package according to an embodiment, and FIG. 2 is a cross-sectional view of the package with a solid-state imaging device mounted thereon. In FIG. 1, a package 10 of the embodiment has a configuration in which four ceramic plates 11A, 11B, 11C, and 11D are stacked, and the inside of a storage portion 12 formed by rectangular holes of the ceramic plates 11A to 11C. Then, the CCD 1 is die-bonded (FIG. 2). In the four ceramic plates 11A to 11D, as shown in FIG. 2, the first plate 11A serves to provide an air gap between the CCD 1 and the cover glass 21 arranged on the upper surface of the package 10, and The two plates 11B have terminals (2
0) Terminal 14 connected to bonding wire 13
A and 14B are formed.
【００１２】そして、第３板１１Ｃと第４板１１Ｄは延
出部１００を形成するように縦長形状とされ、この第３
板１１Ｃの延出部１００の上面には上記第２板１１Ｂの
端子１４Ａ，１４Ｂに連結し、かつビデオ信号を送出す
るための信号線１５を接続する端子１６Ａ，１６Ｂが形
成される。即ち、上記端子１６Ａは第２板１１Ｂのスル
ーホール１７Ａ及び第３板１１Ｃの上面のプリント線
（不図示）を介して端子１４Ａに接続され、他方の端子
１６Ｂは各板に渡って形成されたスルーホール１７Ｂ，
１７Ｃ及び第４板１１Ｄの下面のプリント線を介して端
子１４Ｂに接続される。これによれば、従来のように、
パッケージ１０の下側へ突出したピンがなくなると共
に、信号線１５が延出部１００の上部空間を利用して配
設されるので、パッケージ１０全体の厚さを薄くするこ
とができる。The third plate 11C and the fourth plate 11D are vertically elongated so as to form the extended portion 100.
Terminals 16A and 16B are formed on the upper surface of the extension 100 of the plate 11C to be connected to the terminals 14A and 14B of the second plate 11B and to connect a signal line 15 for transmitting a video signal. That is, the terminal 16A is connected to the terminal 14A via a through hole 17A of the second plate 11B and a printed wire (not shown) on the upper surface of the third plate 11C, and the other terminal 16B is formed over each plate. Through hole 17B,
17C and the lower surface of the fourth plate 11D are connected to the terminals 14B via printed lines. According to this, as before,
Since the pins protruding below the package 10 are eliminated, and the signal lines 15 are provided using the upper space of the extension 100, the thickness of the entire package 10 can be reduced.
【００１３】なお、実施例では上記第３板１１Ｃが銀ペ
ースト収容のための空間を形成する役目もしており、こ
の第３板１１Ｃの孔幅を第２板１１Ｂの孔幅よりも所定
長さだけ大きくすることにより、図示のギャップ１８が
形成される。即ち、ＣＣＤ１を取り付ける際に使用され
る銀ペースト（接着剤）がＣＣＤ１の下面側からはみ出
ることになるので、このはみ出た銀ペーストを上記ギャ
ップ１８に収容し、ＣＣＤ１の上面側に銀ペーストがは
み出ないようにしている。In the embodiment, the third plate 11C also serves to form a space for accommodating the silver paste. The width of the hole of the third plate 11C is longer than the width of the hole of the second plate 11B by a predetermined length. The gap 18 shown in FIG. That is, since the silver paste (adhesive) used when attaching the CCD 1 protrudes from the lower surface side of the CCD 1, the protruding silver paste is stored in the gap 18, and the silver paste protrudes from the upper surface side of the CCD 1. I try not to.
【００１４】また、実施例では、上記第１板１１Ａを約
０．４ｍｍ、第２板１１Ｂを約０．２ｍｍ、第３板１１
Ｃを約０．２ｍｍ、第４板１１Ｄを約０．３ｍｍとし、
この第３板１１Ｃと第４板１１Ｄの合計厚さが約０．５
ｍｍとなるようにしている。即ち、これらのセラミック
板（１１Ａ〜１１Ｄ）は、焼結工程を経ることによって
パッケージ１０とされるが、このセラミック板の厚さが
０．５ｍｍ程度以下では上記焼結工程での熱によって端
部が曲ってしまうことがある（ＣＣＤ１の底面部は両側
が押えられているので問題がない）。しかし、パッケー
ジ１０の厚さを薄くするために、底面板である第４板１
１Ｄは、できるだけ薄くする必要がある。そこで、本発
明では、底面板としての第４板１１Ｄを約０．３ｍｍ程
度まで薄くし、延出部１００については第３板１１Ｃと
第４板１１Ｄの２枚を合わせて約０．５ｍｍの厚さを確
保したものである。これによって、焼結工程での延出部
１００の端部の曲りを防止した上で、パッケージ１０の
薄型化を図ることが可能となる。In the embodiment, the first plate 11A is approximately 0.4 mm, the second plate 11B is approximately 0.2 mm, and the third plate 11A is approximately 0.2 mm.
C is about 0.2 mm, the fourth plate 11D is about 0.3 mm,
The total thickness of the third plate 11C and the fourth plate 11D is about 0.5
mm. That is, these ceramic plates (11A to 11D) are formed into a package 10 by undergoing a sintering process. May be bent (the bottom surface of the CCD 1 is pressed down on both sides, so there is no problem). However, in order to reduce the thickness of the package 10, the fourth plate 1 serving as a bottom plate is used.
1D needs to be as thin as possible. Therefore, in the present invention, the fourth plate 11D as the bottom plate is thinned to about 0.3 mm, and the extension 100 is about 0.5 mm in total of the third plate 11C and the fourth plate 11D. Thickness is secured. Accordingly, it is possible to reduce the thickness of the package 10 while preventing the bending of the end portion of the extension portion 100 in the sintering process.
【００１５】図３には、固体撮像素子パッケージ全体の
分解斜視図が示されており、ダイボンディングする際に
は、上述したパッケージ１０の収納部１２に、ＣＣＤ１
がイメージエリアを上側へ向けて配置され、銀ペースト
にて固着される。そして、収納部１２内へ収納されたＣ
ＣＤ１は、図３に示される端子２０とパッケージ１０の
端子１４との間がワイヤボンディングされることによ
り、パッケージ１０へ電気的に接続される。その後に、
カバーガラス２１がパッケージ１０の上面に接着される
が、この際に窒素（Ｎ2 ）ガスを封入（窒素ガスは封入
しなくてもよい）すれば、パッケージ１０の組立てが終
了する。FIG. 3 is an exploded perspective view of the entire solid-state image pickup device package. When die bonding is performed, the CCD 1 is stored in the storage portion 12 of the package 10 described above.
Are arranged with the image area facing upward, and are fixed with silver paste. Then, C stored in the storage section 12
The CD 1 is electrically connected to the package 10 by wire bonding between the terminal 20 shown in FIG. 3 and the terminal 14 of the package 10. Then,
The cover glass 21 is adhered to the upper surface of the package 10. At this time, if the nitrogen (N 2 ) gas is sealed (the nitrogen gas need not be sealed), the assembly of the package 10 is completed.
【００１６】上記実施例では、延出部１００には信号線
１５のみを配置するようにしたが、この延出部１００に
回路部品を実装することができる。また、この延出部１
００は、パッケージ１０の他の側面に設けてもよく、信
号線１５或いは回路部品を接続する以外の目的、例えば
パッケージ１０の取付け又は保持のために設けることが
可能であり、この場合にも、底面板を薄くした複数のセ
ラミック板を貼り合わせれば、延出部１００のみを所定
の厚さに設定することができる。In the above embodiment, only the signal line 15 is arranged in the extension 100. However, circuit components can be mounted on the extension 100. Also, this extension 1
00 may be provided on another side surface of the package 10 and may be provided for a purpose other than connecting the signal line 15 or the circuit component, for example, for mounting or holding the package 10. By bonding a plurality of ceramic plates having thinner bottom plates, only the extension 100 can be set to a predetermined thickness.
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば、
固体撮像素子を上面に載置する底面基板と上記固体撮像
素子の収納部を形成する収納孔が設けられた基板とを積
層する構成で、上記の底面基板を０．５ｍｍよりも薄く
し、上記収納孔を有する基板として、上記底面基板に重
ねて信号線接続用の延出部を補強するための延出部補強
用基板を配置したので、固体撮像素子をパッケージの収
納部に密閉状態で取り付けるタイプにおいて、従来のよ
うに、接続ピンをパッケージ下部に突出させる必要がな
く、信号線もパッケージの厚さを利用して良好に配置さ
れる。As described above, according to the present invention,
In a configuration in which a bottom substrate on which a solid-state imaging device is mounted on the top surface and a substrate provided with a storage hole forming a storage portion of the solid-state imaging device are stacked, the bottom substrate is thinner than 0.5 mm, As a substrate having a storage hole, an extension portion reinforcing substrate for reinforcing the extension portion for signal line connection is arranged so as to be superimposed on the bottom substrate, so that the solid-state imaging device is attached to the package storage portion in a sealed state. In the type, unlike the related art, there is no need to protrude the connection pins to the lower part of the package, and the signal lines are also arranged well by using the thickness of the package.
【００１８】しかも、底面板を０．５ｍｍよりも薄くす
ることにより、パッケージの薄型化を促進でき、電子内
視鏡にあっては細径化を図ることが可能となる。また、
信号線を接続する延出部では、その厚さを０．５ｍｍ以
上とすることにより焼結工程での曲りが防止されるとい
う利点がある。Further, by making the bottom plate thinner than 0.5 mm, the package can be made thinner, and the diameter of the electronic endoscope can be reduced. Also,
The extension portion for connecting the signal line has an advantage that bending in the sintering step is prevented by setting the thickness to 0.5 mm or more.
【図１】本発明の実施例に係る固体撮像素子パッケージ
の構成を示す切断斜視図である。FIG. 1 is a cutaway perspective view showing a configuration of a solid-state imaging device package according to an embodiment of the present invention.
【図２】実施例のパッケージに固体撮像素子を取付けた
状態の断面図である。FIG. 2 is a cross-sectional view illustrating a state where a solid-state imaging device is mounted on the package according to the embodiment.
【図３】実施例のパッケージの組立て前の全体構成を示
す分解斜視図である。FIG. 3 is an exploded perspective view showing the entire configuration of the package according to the embodiment before assembly.
【図４】従来のパッケージの構成を示す断面図である。FIG. 4 is a cross-sectional view showing a configuration of a conventional package.
【図５】図４のパッケージを電子内視鏡に取り付けた場
合の配置例を示す図である。FIG. 5 is a diagram showing an example of arrangement when the package of FIG. 4 is attached to an electronic endoscope.
１ … ＣＣＤ、 ２，１０ … パッケージ、 ３，１２ … 収納部、 １１Ａ，１１Ｂ，１１Ｃ，１１Ｄ … セラミック板、 １４Ａ，１４Ｂ，１６Ａ，１６Ｂ … 端子、 ９，１５ … 信号線、 １７Ａ〜１７Ｃ … スルーホール。 DESCRIPTION OF SYMBOLS 1 ... CCD, 2,10 ... Package, 3,12 ... Storage part, 11A, 11B, 11C, 11D ... Ceramic plate, 14A, 14B, 16A, 16B ... Terminal, 9, 15 ... Signal line, 17A-17C ... Through hole.
Claims (2)
納部を形成する固体撮像素子パッケージにおいて、上記固体撮像素子を上面に載置し、かつ所定方向に延び
る延出部領域を設けた底面基板と、 この底面基板の上面に重ねられ、上記固体撮像素子の収
納部を形成する収納孔を有し、かつ所定方向に延びる延
出部領域を設けた延出部補強用基板と、を上記複数の基
板の一部として配置し、 当該パッケージの厚み方向の寸法を小さくするために、
上記底面基板の厚さを０．５ｍｍ未満に設定すると共
に、上記底面基板と延出部補強用基板の延出部領域を重
ねて当該パッケージの側面から一方向に延びる延出部を
形成し、この延出部に、上記固体撮像素子が電気的に連
結され、かつ出力信号線が接続される端子部を設けた こ
とを特徴とする固体撮像素子パッケージ。(1)Stacking multiple substrates to collect solid-state imaging devices
Form the storageIn solid-state imaging device packages,The solid-state imaging device is placed on the upper surface and extends in a predetermined direction.
A bottom substrate provided with an extension portion region, The solid-state image sensor is superimposed on the upper surface of the bottom substrate.
An extension having a storage hole forming a storage portion and extending in a predetermined direction.
An extension portion reinforcing substrate provided with an extension portion region;
Placed as part of the board, In order to reduce the thickness dimension of the package,
When the thickness of the bottom substrate is set to less than 0.5 mm,
In addition, the extension area of the bottom substrate and the extension portion reinforcing substrate is overlapped.
The extension extending in one direction from the side of the package
The solid-state imaging device is electrically connected to the extension.
And a terminal portion to which the output signal line is connected is provided. This
And a solid-state imaging device package.
重ねて形成した延出部の厚さを、０．５ｍｍ以上に設定
したことを特徴とする上記請求項１記載の固体撮像素子
パッケージ。2. The extension portion reinforcing substrate is provided on the bottom substrate.
Set the thickness of the overlaid extension to 0.5 mm or more
2. The solid-state imaging device package according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4219810A JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4219810A JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0653460A JPH0653460A (en) | 1994-02-25 |
| JP2853939B2 true JP2853939B2 (en) | 1999-02-03 |
Family
ID=16741393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4219810A Expired - Lifetime JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2853939B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8179428B2 (en) | 2004-11-24 | 2012-05-15 | Fujinon Corporation | Imaging apparatus for electronic endoscope and electronic endoscope |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5754271B2 (en) * | 2011-07-08 | 2015-07-29 | 株式会社リコー | Imaging element fixing structure |
| US8988564B2 (en) | 2011-09-09 | 2015-03-24 | Apple Inc. | Digital camera with light splitter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58140145A (en) * | 1982-02-15 | 1983-08-19 | Seiko Epson Corp | Integrated circuit device |
| JPS6365840A (en) * | 1986-04-04 | 1988-03-24 | オリンパス光学工業株式会社 | Endoscope |
-
1992
- 1992-07-27 JP JP4219810A patent/JP2853939B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8179428B2 (en) | 2004-11-24 | 2012-05-15 | Fujinon Corporation | Imaging apparatus for electronic endoscope and electronic endoscope |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0653460A (en) | 1994-02-25 |
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