JPH0653460A - Solid state image sensor element package - Google Patents
Solid state image sensor element packageInfo
- Publication number
- JPH0653460A JPH0653460A JP4219810A JP21981092A JPH0653460A JP H0653460 A JPH0653460 A JP H0653460A JP 4219810 A JP4219810 A JP 4219810A JP 21981092 A JP21981092 A JP 21981092A JP H0653460 A JPH0653460 A JP H0653460A
- Authority
- JP
- Japan
- Prior art keywords
- package
- state image
- solid
- ccd
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
- Endoscopes (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は固体撮像素子パッケー
ジ、特に固体撮像素子をパッケージ内に密閉状態で収納
するタイプのパッケージ構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device package, and more particularly to a package structure of a type in which the solid-state image pickup device is housed in a sealed state.
【０００２】[0002]
【従来の技術】固体撮像素子は、体腔内等の被観察体内
を画像表示するための電子内視鏡、ムービーカメラ等に
用いられ、この固体撮像素子としてＣＣＤ（Charge Cou
pled Device)等がある。このＣＣＤは、例えば電子内視
鏡（電子スコープ）の先端部に取り付けられ、この電子
内視鏡を被観察体内に挿入することにより、ＣＣＤはモ
ニタ上に表示するための被観察体内の画像を捉えること
ができる。2. Description of the Related Art A solid-state image pickup device is used for an electronic endoscope, a movie camera, etc. for displaying an image of the inside of an object to be observed such as a body cavity, and a CCD (Charge Cou
pled Device) etc. This CCD is attached to, for example, the tip of an electronic endoscope (electronic scope), and by inserting this electronic endoscope into the body to be observed, the CCD displays an image inside the body to be displayed on a monitor. I can catch it.
【０００３】図４には、従来において電子内視鏡、ムー
ビーカメラに用いられている固体撮像素子の取付け構造
が示されており、図においてＣＣＤ１はパッケージ２の
段差を有する収納部３内に落とし込まれ、銀ペースト等
の導電性接着剤によってパッケージ２の底面に接着され
る。また、このＣＣＤ１はその端子がボンデイングワイ
ヤ４にてパッケージ２側の段差部の端子と接続されてお
り、このパッケージ２の底面側には信号線と接続するた
めのピン５が配設される。FIG. 4 shows a mounting structure of a solid-state image pickup device conventionally used in an electronic endoscope and a movie camera. In the drawing, a CCD 1 is dropped in a storage part 3 having a step of a package 2. Then, it is attached to the bottom surface of the package 2 with a conductive adhesive such as silver paste. The terminals of the CCD 1 are connected to the terminals of the stepped portion on the package 2 side by bonding wires 4, and pins 5 for connecting to the signal lines are arranged on the bottom surface side of the package 2.
【０００４】更に、上記パッケージ２の上面にはカバー
ガラス６が気密状態で取付けられ、内部に窒素（Ｎ2 ）
ガス等が封入される。即ち、この種のＣＣＤ１の上面に
は図示していないが色フィルタ、マイクロレンズ等が積
層して設けられており、この色フィルタ及びマイクロレ
ンズを保護（湿気からの隔離、酸化防止等）するために
窒素ガスが封入されると共に、図示のようにＣＣＤ１と
カバーガラス６との間のエアギャップによってマイクロ
レンズの集光作用等を確保するようになっている。Further, a cover glass 6 is attached to the upper surface of the package 2 in an airtight state, and nitrogen (N 2 ) is contained inside.
Gas etc. is enclosed. That is, although not shown, a color filter, a microlens, and the like are laminated on the upper surface of the CCD 1 of this type to protect the color filter and the microlens (separation from moisture, oxidation prevention, etc.). Nitrogen gas is filled in the chamber, and the air gap between the CCD 1 and the cover glass 6 ensures the condensing action of the microlenses as shown in the figure.
【０００５】図５には、上記パッケージ２を電子内視鏡
に配設した状態が示されており、例えば電子内視鏡７先
端の対物レンズ８Ａ、プリズム８Ｂ等の光学系部材を介
して上述したパッケージ２が配置される。従って、被観
察体内の画像は対物レンズ８Ａ、プリズム８Ｂ、そして
カバーガラス６を介してＣＣＤ１の上面のイメージエリ
アに到達することになる。FIG. 5 shows a state in which the package 2 is arranged in an electronic endoscope. For example, the above-mentioned package is provided via an optical system member such as an objective lens 8A at the tip of the electronic endoscope 7 and a prism 8B. The package 2 is placed. Therefore, the image inside the observed body reaches the image area on the upper surface of the CCD 1 through the objective lens 8A, the prism 8B, and the cover glass 6.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の固体撮像素子パッケージ、特に上述のようにＣＣＤ
１をパッケージ２内へ収納するタイプでは、ＣＣＤ１を
収納し、またエアギャップを設けるため、パッケージ２
の縦幅が大きくなる。しかも、図４のようにパッケージ
２の下面からピン５を出し、このピン５に信号線を接続
する構成となるので、パッケージ２の縦方向の全体の幅
が大きくなる。従って、図５のように、パッケージ２を
電子内視鏡７の中心軸に平行に配置する場合には、電子
内視鏡７の細径化を図ることができないという問題があ
った。However, the above-mentioned conventional solid-state image pickup device package, especially the CCD as described above.
In the type in which the CCD 1 is housed in the package 2, the CCD 1 is housed and an air gap is provided.
The vertical width of becomes larger. Moreover, as shown in FIG. 4, since the pin 5 is extended from the lower surface of the package 2 and the signal line is connected to the pin 5, the overall width of the package 2 in the vertical direction is increased. Therefore, as shown in FIG. 5, when the package 2 is arranged parallel to the central axis of the electronic endoscope 7, there is a problem that the diameter of the electronic endoscope 7 cannot be reduced.
【０００７】本発明は上記問題点に鑑みてなされたもの
であり、その目的は、パッケージの厚さを可能な限り薄
くし、特に電子内視鏡の細径化を図ることができる固体
撮像素子パッケージを提供することにある。The present invention has been made in view of the above problems, and an object thereof is to make the thickness of a package as thin as possible, and in particular, to reduce the diameter of an electronic endoscope. To provide the package.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、第１請求項記載の発明は、固体撮像素子を収納部内
に配置する固体撮像素子パッケージにおいて、複数の基
板を積層して上記収納部が形成されたパッケージを構成
すると共に、この基板の一部によってパッケージ側面一
方向に延出部を形成し、この延出部には固体撮像素子に
電気的に連結され、かつ出力のための信号線を接続する
端子部を設けたことを特徴とする。In order to achieve the above object, the invention according to the first aspect of the present invention is a solid-state image pickup device package in which a solid-state image pickup device is arranged in a storage portion, and a plurality of substrates are laminated to store the same. And a part of this substrate forms an extension in one direction on the side of the package, and the extension is electrically connected to the solid-state image sensor and is for output. A terminal portion for connecting the signal line is provided.
【０００９】また、第２請求項記載の発明は、固体撮像
素子を収納部内に配置する固体撮像素子パッケージにお
いて、複数の基板を積層して上記収納部が形成されたパ
ッケージを構成すると共に、この基板のうち少なくとも
２枚の基板によってパッケージ側面から延びる延出部を
形成し、この延出部を形成する最下段の基板を上記収納
部の底面板としたことを特徴とする。According to a second aspect of the present invention, in a solid-state image pickup device package in which a solid-state image pickup device is arranged in a storage portion, a package in which the storage portion is formed is formed by laminating a plurality of substrates. At least two substrates among the substrates form an extending portion extending from the side surface of the package, and the lowermost substrate forming the extending portion is the bottom plate of the accommodating portion.
【００１０】[0010]
【作用】上記の構成によれば、延出部に信号線の接続端
子が配置されるので、従来のピンの長さ及び信号線の取
付け幅に相当する幅が削減でき、また延出部を少なくと
も２枚の基板にて構成するので、最下段の底面板を焼結
が可能な厚さ以下にすることができ、これによっても薄
型化が図れることになる。即ち、セラミック板を用いて
パッケージを形成する場合には、焼結工程があり、この
焼結工程にて熱を加えると、約０．５ｍｍ以下のセラミ
ック板は端部で曲ってしまい、良好な延出部を形成する
ことができない。そこで、上記第２請求項のように、延
出部を２枚以上のセラミック板で構成し、所定の厚さを
保ちながら細径化を図るために、底面板を薄くするよう
にしたものである。According to the above construction, since the connecting terminals of the signal line are arranged in the extending portion, the width corresponding to the conventional pin length and the mounting width of the signal line can be reduced, and the extending portion can be reduced. Since it is composed of at least two substrates, the bottom plate at the lowermost stage can be made to have a thickness less than that at which it can be sintered, which also makes it possible to reduce the thickness. That is, when a package is formed using a ceramic plate, there is a sintering process, and when heat is applied in this sintering process, the ceramic plate of about 0.5 mm or less is bent at the end portion, which is favorable. The extension cannot be formed. Therefore, as in the second claim, the extending portion is composed of two or more ceramic plates, and the bottom plate is made thin in order to reduce the diameter while maintaining a predetermined thickness. is there.
【００１１】[0011]
【実施例】図１には、実施例に係るパッケージの構成が
切断された状態で示されており、図２には固体撮像素子
を実装した状態のパッケージの断面が示されている。図
１において、実施例のパッケージ１０は４枚のセラミッ
ク板１１Ａ，１１Ｂ，１１Ｃ，１１Ｄを積層した構成と
なっており、このセラミック板１１Ａ〜１１Ｃの四角形
の孔にて形成される収納部１２内にＣＣＤ１がダイボン
ディングされることになる（図２）。上記４枚のセラミ
ック板１１Ａ〜１１Ｄにおいて、図２に示されるよう
に、第１板１１ＡはＣＣＤ１とパッケージ１０の上面に
配置されるカバーガラス２１との間にエアギャップを設
ける役目をし、第２板１１Ｂには、ＣＣＤ１の端子（２
０）へボンデイングワイヤ１３で接続される端子１４
Ａ，１４Ｂが形成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the package according to the embodiment in a cut state, and FIG. 2 shows a cross section of the package in which a solid-state image pickup device is mounted. In FIG. 1, a package 10 of the embodiment has a structure in which four ceramic plates 11A, 11B, 11C, and 11D are laminated, and the inside of a storage portion 12 formed by square holes of the ceramic plates 11A to 11C. The CCD 1 is die-bonded to the substrate (FIG. 2). In the four ceramic plates 11A to 11D, as shown in FIG. 2, the first plate 11A serves to provide an air gap between the CCD 1 and the cover glass 21 arranged on the upper surface of the package 10. The terminals of the CCD 1 (2
0) terminal 14 connected to bonding wire 13
A and 14B are formed.
【００１２】そして、第３板１１Ｃと第４板１１Ｄは延
出部１００を形成するように縦長形状とされ、この第３
板１１Ｃの延出部１００の上面には上記第２板１１Ｂの
端子１４Ａ，１４Ｂに連結し、かつビデオ信号を送出す
るための信号線１５を接続する端子１６Ａ，１６Ｂが形
成される。即ち、上記端子１６Ａは第２板１１Ｂのスル
ーホール１７Ａ及び第３板１１Ｃの上面のプリント線
（不図示）を介して端子１４Ａに接続され、他方の端子
１６Ｂは各板に渡って形成されたスルーホール１７Ｂ，
１７Ｃ及び第４板１１Ｄの下面のプリント線を介して端
子１４Ｂに接続される。これによれば、従来のように、
パッケージ１０の下側へ突出したピンがなくなると共
に、信号線１５が延出部１００の上部空間を利用して配
設されるので、パッケージ１０全体の厚さを薄くするこ
とができる。The third plate 11C and the fourth plate 11D are vertically elongated so as to form the extending portion 100.
On the upper surface of the extension portion 100 of the plate 11C, terminals 16A and 16B are formed that are connected to the terminals 14A and 14B of the second plate 11B and that connect the signal line 15 for transmitting the video signal. That is, the terminal 16A is connected to the terminal 14A through the through hole 17A of the second plate 11B and the printed line (not shown) on the upper surface of the third plate 11C, and the other terminal 16B is formed across each plate. Through hole 17B,
17C and the printed wire on the lower surface of the fourth plate 11D are connected to the terminal 14B. According to this, as in the past,
Since the pins protruding to the lower side of the package 10 are eliminated and the signal line 15 is arranged in the upper space of the extension portion 100, the thickness of the entire package 10 can be reduced.
【００１３】なお、実施例では上記第３板１１Ｃが銀ペ
ースト収容のための空間を形成する役目もしており、こ
の第３板１１Ｃの孔幅を第２板１１Ｂの孔幅よりも所定
長さだけ大きくすることにより、図示のギャップ１８が
形成される。即ち、ＣＣＤ１を取り付ける際に使用され
る銀ペースト（接着剤）がＣＣＤ１の下面側からはみ出
ることになるので、このはみ出た銀ペーストを上記ギャ
ップ１８に収容し、ＣＣＤ１の上面側に銀ペーストがは
み出ないようにしている。In the embodiment, the third plate 11C also has a role of forming a space for accommodating the silver paste, and the hole width of the third plate 11C is a predetermined length longer than the hole width of the second plate 11B. The gap 18 shown in FIG. That is, since the silver paste (adhesive) used when attaching the CCD 1 is projected from the lower surface side of the CCD 1, the protruding silver paste is accommodated in the gap 18 and the silver paste is projected to the upper surface side of the CCD 1. I try not to.
【００１４】また、実施例では、上記第１板１１Ａを約
０．４ｍｍ、第２板１１Ｂを約０．２ｍｍ、第３板１１
Ｃを約０．２ｍｍ、第４板１１Ｄを約０．３ｍｍとし、
この第３板１１Ｃと第４板１１Ｄの合計厚さが約０．５
ｍｍとなるようにしている。即ち、これらのセラミック
板（１１Ａ〜１１Ｄ）は、焼結工程を経ることによって
パッケージ１０とされるが、このセラミック板の厚さが
０．５ｍｍ程度以下では上記焼結工程での熱によって端
部が曲ってしまうことがある（ＣＣＤ１の底面部は両側
が押えられているので問題がない）。しかし、パッケー
ジ１０の厚さを薄くするために、底面板である第４板１
１Ｄは、できるだけ薄くする必要がある。そこで、本発
明では、底面板としての第４板１１Ｄを約０．３ｍｍ程
度まで薄くし、延出部１００については第３板１１Ｃと
第４板１１Ｄの２枚を合わせて約０．５ｍｍの厚さを確
保したものである。これによって、焼結工程での延出部
１００の端部の曲りを防止した上で、パッケージ１０の
薄型化を図ることが可能となる。In the embodiment, the first plate 11A is about 0.4 mm, the second plate 11B is about 0.2 mm, and the third plate 11 is about 0.2 mm.
C is about 0.2 mm, the fourth plate 11D is about 0.3 mm,
The total thickness of the third plate 11C and the fourth plate 11D is about 0.5.
It is set to be mm. That is, these ceramic plates (11A to 11D) are made into the package 10 by undergoing a sintering process. However, when the thickness of the ceramic plate is about 0.5 mm or less, the end portions are heated by the heat in the sintering process. May be bent (there is no problem because the bottom surface of the CCD 1 is pressed on both sides). However, in order to reduce the thickness of the package 10, the fourth plate 1 that is the bottom plate is used.
1D needs to be as thin as possible. Therefore, in the present invention, the fourth plate 11D as the bottom plate is thinned to about 0.3 mm, and the extension portion 100 has a combined thickness of about 0.5 mm of the third plate 11C and the fourth plate 11D. The thickness is secured. As a result, it is possible to prevent the bending of the end portion of the extension portion 100 in the sintering process and to reduce the thickness of the package 10.
【００１５】図３には、固体撮像素子パッケージ全体の
分解斜視図が示されており、ダイボンディングする際に
は、上述したパッケージ１０の収納部１２に、ＣＣＤ１
がイメージエリアを上側へ向けて配置され、銀ペースト
にて固着される。そして、収納部１２内へ収納されたＣ
ＣＤ１は、図３に示される端子２０とパッケージ１０の
端子１４との間がワイヤボンディングされることによ
り、パッケージ１０へ電気的に接続される。その後に、
カバーガラス２１がパッケージ１０の上面に接着される
が、この際に窒素（Ｎ2 ）ガスを封入（窒素ガスは封入
しなくてもよい）すれば、パッケージ１０の組立てが終
了する。FIG. 3 is an exploded perspective view of the entire solid-state image pickup device package. When die bonding is performed, the CCD 1 is stored in the housing portion 12 of the package 10 described above.
Is arranged with the image area facing upward, and is fixed with silver paste. The C stored in the storage unit 12
The CD 1 is electrically connected to the package 10 by wire bonding between the terminal 20 shown in FIG. 3 and the terminal 14 of the package 10. After that,
The cover glass 21 is adhered to the upper surface of the package 10. At this time, if nitrogen (N 2 ) gas is filled (the nitrogen gas may not be filled), the assembly of the package 10 is completed.
【００１６】上記実施例では、延出部１００には信号線
１５のみを配置するようにしたが、この延出部１００に
回路部品を実装することができる。また、この延出部１
００は、パッケージ１０の他の側面に設けてもよく、信
号線１５或いは回路部品を接続する以外の目的、例えば
パッケージ１０の取付け又は保持のために設けることが
可能であり、この場合にも、底面板を薄くした複数のセ
ラミック板を貼り合わせれば、延出部１００のみを所定
の厚さに設定することができる。In the above embodiment, only the signal line 15 is arranged in the extension portion 100, but circuit components can be mounted in the extension portion 100. Also, this extension 1
00 may be provided on the other side surface of the package 10, and may be provided for the purpose other than connecting the signal line 15 or the circuit component, for example, for mounting or holding the package 10. In this case as well, If a plurality of thin ceramic plates are attached to the bottom plate, only the extension 100 can be set to a predetermined thickness.
【００１７】[0017]
【発明の効果】以上説明したように、第１請求項記載の
発明によれば、収納部を有するパッケージを複数の基板
を積層して形成し、この基板の一部によってパッケージ
側面一方向に延出部を形成し、この延出部に固体撮像素
子と信号線を接続する端子部を設けたので、固体撮像素
子をパッケージの収納部に密閉状態で取り付けるタイプ
において、従来のように、接続ピンをパッケージ下部に
突出させる必要がなく、信号線もパッケージの厚さを利
用して良好に配置されるので、パッケージを薄型化させ
ることができる。従って、電子内視鏡にあっては細径化
を図ることが可能となる。As described above, according to the first aspect of the present invention, a package having a housing portion is formed by laminating a plurality of substrates, and a part of the substrates extends in one direction on the side surface of the package. Since the extension part is formed and the terminal part that connects the solid-state image sensor and the signal line is provided in this extension part, the connection pin is the same as the conventional type in the type in which the solid-state image sensor is hermetically mounted in the package storage part. Does not need to be protruded to the lower part of the package, and the signal line is well arranged by utilizing the thickness of the package, so that the package can be made thin. Therefore, it is possible to reduce the diameter of the electronic endoscope.
【００１８】また、第２請求項記載の発明は、積層され
る複数の基板のうち少なくとも２枚の基板によってパッ
ケージ側面から延びる延出部を形成し、この延出部を形
成する最下段の基板を上記収納部の底面板としたので、
延出部を焼結により曲りが生じない所定の厚さに設定し
ながら、底面板を薄くすることができ、これによってパ
ッケージの薄型化を更に促進させることができる。According to the second aspect of the present invention, at least two of the plurality of substrates to be stacked form an extending portion extending from the side surface of the package, and the lowermost substrate forming the extending portion. Since it was the bottom plate of the storage part,
It is possible to make the bottom plate thin while setting the extension portion to a predetermined thickness that does not cause bending due to sintering, thereby further promoting the thinning of the package.
【図１】本発明の実施例に係る固体撮像素子パッケージ
の構成を示す切断斜視図である。FIG. 1 is a cut perspective view showing a configuration of a solid-state imaging device package according to an embodiment of the present invention.
【図２】実施例のパッケージに固体撮像素子を取付けた
状態の断面図である。FIG. 2 is a cross-sectional view showing a state in which a solid-state image sensor is attached to the package of the example.
【図３】実施例のパッケージの組立て前の全体構成を示
す分解斜視図である。FIG. 3 is an exploded perspective view showing the entire configuration of the package of the embodiment before assembling.
【図４】従来のパッケージの構成を示す断面図である。FIG. 4 is a sectional view showing a configuration of a conventional package.
【図５】図４のパッケージを電子内視鏡に取り付けた場
合の配置例を示す図である。5 is a diagram showing an arrangement example when the package of FIG. 4 is attached to an electronic endoscope.
【符号の説明】 １ … ＣＣＤ、 ２，１０ … パッケージ、 ３，１２ … 収納部、 １１Ａ，１１Ｂ，１１Ｃ，１１Ｄ … セラミック板、 １４Ａ，１４Ｂ，１６Ａ，１６Ｂ … 端子、 ９，１５ … 信号線、 １７Ａ〜１７Ｃ … スルーホール。[Explanation of reference symbols] 1 ... CCD, 2, 10 ... Package, 3, 12 ... Storage section, 11A, 11B, 11C, 11D ... Ceramic plate, 14A, 14B, 16A, 16B ... Terminal, 9, 15 ... Signal line, 17A to 17C ... Through hole.
Claims (2)
撮像素子パッケージにおいて、複数の基板を積層して上
記収納部が形成されたパッケージを構成すると共に、こ
の基板の一部によってパッケージ側面一方向に延出部を
形成し、この延出部には固体撮像素子に電気的に連結さ
れ、かつ出力のための信号線を接続する端子部を設けた
ことを特徴とする固体撮像素子パッケージ。1. A solid-state image pickup device package in which a solid-state image pickup device is arranged in an accommodating part, wherein a plurality of substrates are stacked to form a package in which the accommodating part is formed. A solid-state image pickup device package, comprising: an extension part formed in the extension part; and a terminal part electrically connected to the solid-state image pickup device and connecting a signal line for output to the extension part.
撮像素子パッケージにおいて、複数の基板を積層して上
記収納部が形成されたパッケージを構成すると共に、こ
の基板のうち少なくとも２枚の基板によってパッケージ
側面から延びる延出部を形成し、この延出部を形成する
最下段の基板を上記収納部の底面板としたことを特徴と
する固体撮像素子パッケージ。2. A solid-state image pickup device package in which a solid-state image pickup device is arranged in a storage portion, and a package in which the storage portion is formed is formed by stacking a plurality of substrates, and at least two of the substrates are used. A solid-state image pickup device package, wherein an extension portion extending from a side surface of the package is formed, and a lowermost substrate forming the extension portion is a bottom plate of the storage portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4219810A JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4219810A JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0653460A true JPH0653460A (en) | 1994-02-25 |
| JP2853939B2 JP2853939B2 (en) | 1999-02-03 |
Family
ID=16741393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4219810A Expired - Lifetime JP2853939B2 (en) | 1992-07-27 | 1992-07-27 | Solid-state image sensor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2853939B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102868848A (en) * | 2011-07-08 | 2013-01-09 | 株式会社理光 | Image pickup component fixing structure and fixing method, image pickup and electric apparatus |
| JP2014526825A (en) * | 2011-09-09 | 2014-10-06 | アップル インコーポレイテッド | Digital camera with optical splitter |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8179428B2 (en) | 2004-11-24 | 2012-05-15 | Fujinon Corporation | Imaging apparatus for electronic endoscope and electronic endoscope |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58140145A (en) * | 1982-02-15 | 1983-08-19 | Seiko Epson Corp | Integrated circuit device |
| JPS6365840A (en) * | 1986-04-04 | 1988-03-24 | オリンパス光学工業株式会社 | Endoscope |
-
1992
- 1992-07-27 JP JP4219810A patent/JP2853939B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58140145A (en) * | 1982-02-15 | 1983-08-19 | Seiko Epson Corp | Integrated circuit device |
| JPS6365840A (en) * | 1986-04-04 | 1988-03-24 | オリンパス光学工業株式会社 | Endoscope |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102868848A (en) * | 2011-07-08 | 2013-01-09 | 株式会社理光 | Image pickup component fixing structure and fixing method, image pickup and electric apparatus |
| CN102868848B (en) * | 2011-07-08 | 2015-03-25 | 株式会社理光 | Image pickup component fixing structure and fixing method, image pickup and electric apparatus |
| JP2014526825A (en) * | 2011-09-09 | 2014-10-06 | アップル インコーポレイテッド | Digital camera with optical splitter |
| US9465221B2 (en) | 2011-09-09 | 2016-10-11 | Apple Inc. | Digital camera with light splitter |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2853939B2 (en) | 1999-02-03 |
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