JPH07204162A - Mounting circuit member for solid-state image pickup element - Google Patents

Abstract

PURPOSE:To make small the lateral width of the circuit members, such as a package, leaving the size of a solid-state image pickup element as it is. CONSTITUTION:An electrode part 12 is provided in the placing area of a plane where a CCD that is the solid-state image pickup element is placed, and an electrode part provided at the back plane of the CCD is connected to the electrode part 12, and also, a through hole 13 connected to the electrode part 12 and a wiring pattern 15 formed at the back side are formed in the placing area. By employing such constitution, since no electrode part and through hole, etc., are required to arrange at the outer wall part 10A of the package 10, the lateral width of the package can be reduced, therefore. the making of an electronic endoscope into a small diameter can be performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting circuit member for a solid-state image pickup device, and more particularly to a package or a mounting circuit board for a solid-state image pickup device used in an electronic endoscope having a small diameter.

[0002]

2. Description of the Related Art A package of a solid-state image pickup device is a CCD (Charge Coupl) which is a solid-state image pickup device in an electronic endoscope or the like.
ed Device), and is provided to electrically connect this CCD. In the electronic endoscope apparatus, an image of the inside of the body to be observed is captured by a CCD, this image signal is transmitted from the CCD to an image signal processing circuit, and a predetermined process is executed by this image signal processing circuit, whereby a monitor is displayed. An image of the inside of the observed body is displayed. Therefore, the CCD package serves not only to hold the CCD but also to supply the image signal to the signal line. The solid-state image sensor may be directly attached to the circuit board.

FIG. 4 shows the structure of a conventional solid-state image pickup device package. FIG. 4A is a cross-sectional view thereof, and FIG. 4B is a top view of the package before the CCD is arranged. It is a figure. In the figure, the CCD 1 is housed in a housing portion 3 of a package 2, and an electrode portion (electrode pad) 4 is formed on the bottom of the housing portion 3, and the electrode portion 4 has a C
The electrode portion 5 on the back surface of the CD 1 is connected. The electrode portion 4 is formed even inside the outer wall portion 2A of the package 2, and is connected to the wiring pattern 7 formed on the back surface through the through hole 6. The wiring pattern 7 is formed up to the terminal portion 8. By connecting a signal cable to the terminal portion 8, the CCD 1 is electrically connected to the signal processing circuit and the like. The above CC
A cover glass 9 is arranged on the upper surface of D1.

[0004]

By the way, since the electronic endoscope is inserted into a narrow body cavity as a scope, there is a demand to make the diameter as small as possible, and therefore the CCD package 2 is also thin. Figure 4 for diameter reduction
The lateral width D1 shown in (A) must be made as small as possible. However, in the package of the conventional solid-state image pickup device, as shown in FIG. 4, the electrode portion 4 is arranged up to the outer wall portion 2A of the package 2, and the through hole 6 and the wiring pattern 7 are provided inside the outer wall portion 2A. Because of the structure in which the width is formed, the lateral width D1 cannot be reduced unless the CCD 1 itself is reduced. Further, the above is the same when the CCD 1 is directly attached to the circuit board.

The present invention has been made in view of the above problems, and an object of the present invention is to change the conventional concept of the arrangement of the electrode section so that the size of the solid-state image pickup device is unchanged and the width of the package or the like is changed. An object of the present invention is to provide a mounting circuit member for a solid-state imaging device that can be made small.

[0006]

In order to achieve the above-mentioned object, the invention according to the first aspect of the present invention is a circuit member for mounting and electrically connecting a solid-state image sensor, wherein a surface on which the solid-state image sensor is placed. Is characterized in that an electrode portion is formed in the mounting area, and the electrode portion provided on the back surface of the solid-state imaging device is connected to this electrode portion. According to a second aspect of the present invention, a through hole for connecting the wiring on the upper surface side of the circuit member including the electrode portion and the wiring on the rear surface side of the circuit member is formed in the mounting area of the solid-state imaging device. To do.

[0007]

According to the above structure, since the electrode portion and the through hole are formed in the mounting area of the solid-state image pickup device, for example, the electrode portion and the through hole are eliminated from the outer wall portion of the package, and the outer wall portion is minimized. The thickness can be limited. Therefore, the lateral width of the package is reduced, and the diameter of the electronic endoscope is reduced.

[0008]

FIG. 1 shows the structure of a mounting circuit member (in the case of a package) of a solid-state image pickup device according to the first embodiment.
FIG. 2 shows a sectional view of a package containing a CCD. As shown in the top view of FIG. 1A, a package 10 made of ceramic or the like is provided with a storage section 11 for storing a CCD, and at the bottom of the storage section 11, that is, C
A required number of electrode portions (electrode pads) 12 are arranged in the CD mounting area. Then, the electrode portion 12 is connected to a through hole 13 which is a part of the conductive wire, and the through hole 13 is, as shown in FIG.
It is formed by penetrating to the back surface of 0. On this rear surface, a wiring pattern 15 including a terminal portion 14 is connected to the through hole 13, and a signal cable connected to a signal processing circuit or the like is connected to the terminal portion 14.

As shown in FIG. 2, the CCD 17 is attached to the housing portion 11 of the package 10. The electrode portion 18 of the CCD 17 also corresponds to the position of the electrode portion 12 of the package 10. , Which is placed inwardly of the conventional one. Then, the electrode portion 18 and the electrode portion 12 of the package 10 are adhered by the dropped solder or the like. In this way, after connecting and storing the CCD 17,
A cover glass 20 is attached to the upper part of the package 10, and an optical system member connected to the eyepiece through the cover glass 20 is arranged.

According to the first embodiment, the electrode portion 12 of the package 10 and the electrode portion 18 of the CCD 17 are C
It is connected in the mounting area (also the storage area) of the CD 17. Further, since the through hole 13 and the wiring pattern 15 are similarly formed in the mounting area of the CCD, the outer wall portion 10A on the side surface of the package 10 is
The minimum width that can maintain the strength of the package 10 at the minimum is sufficient. Therefore, the overall width D2 of the package 10 shown in FIG. 2 can be made smaller than the conventional width D1 (FIG. 4), and it becomes possible to contribute to the downsizing of the electronic endoscope.

FIG. 3 shows the configuration of the second embodiment in which the electrode portions are arranged differently from the first embodiment. Figure 3
As shown in (A), the package 22 is provided with the electrode portion 12 connected to the electrode portion 18 of the CCD 17 as in the first embodiment, but the through hole 23 is provided immediately below the electrode portion 12. It is formed. Then, as shown in FIG. 3B, an electrode portion 24 is formed on the back surface of the package 22 so as to be connected to the through hole 23.
4 is connected to each line of the signal cable 25. Therefore, according to the second embodiment, the CCD 17 and the signal cable 25 are provided by the package 22 having no terminals.
Are connected.

As described above, according to the present invention, the electrodes 12 and the through holes 13 and 2 in the packages 10 and 22 are used.
By changing the conventional concept of arranging 3 and the like on the outside (outer wall) side of the packages 10 and 22, and arranging these in the mounting area (or storage area) of the CCD 17,
This is to reduce the width of the packages 10 and 22.

In the above embodiment, the case where the CCD 17 is housed in the packages 10 and 22 has been described, but the present invention can be similarly applied to the case where the CCD is directly attached and connected to the circuit board.

[0014]

As described above, according to the first aspect of the invention, the electrode portion is formed in the mounting area of the surface on which the solid-state image sensor is placed, and the electrode portion is provided on the back surface of the solid-state image sensor. Since the formed electrode portions are connected, it is not necessary to dispose the electrode portions on the outer wall portion of the package, and the lateral width of the package can be reduced. Further, when the solid-state image sensor is mounted on the circuit board, the circuit board can be adjusted to the width of the solid-state image sensor. Therefore, it is possible to further reduce the diameter of the electronic endoscope.

According to the second aspect of the present invention, the through hole for connecting the wiring on the upper surface side of the circuit member such as the package including the electrode portion and the wiring on the rear surface side of the circuit member is also within the placement area. By forming it in the above manner, it is possible to contribute to the reduction of the width of the circuit member.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a mounting circuit member of a solid-state image pickup device according to a first embodiment of the present invention, FIG. 1A is a top view, and FIG. 1B is a back view.

FIG. 2 is a sectional view showing a state in which a CCD is connected to the package of the first embodiment.

FIG. 3 is a diagram showing a configuration of a second embodiment, in which FIG.
Sectional drawing of the package which connected D, FIG. (B) are back views.

FIG. 4 is a diagram showing a configuration of a conventional package, and FIG.
Is a cross-sectional view with a CCD connected, and FIG. 6B is a top view of the package.

[Explanation of symbols]

 1, 17 ... CCD, 2, 10, 22 ... Package, 3, 11 ... Storage section, 4, 5, 12, 18, 24 ... Electrode section, 6, 13, 23 ... Through hole, 7, 15 ... Wiring pattern.

Claims (2)

[Claims] 1. In a circuit member for mounting and electrically connecting a solid-state image sensor, an electrode portion is formed in a mounting area of a surface on which the solid-state image sensor is placed, and the back surface of the solid-state image sensor is formed on the electrode portion. A mounting circuit member for a solid-state image pickup device, characterized in that an electrode portion provided on the substrate is connected. 2. A through hole for connecting the wiring on the upper surface side of the circuit member including the electrode portion and the wiring on the rear surface side of the circuit member,
The mounting circuit member for a solid-state image pickup device according to claim 1, wherein the mounting circuit member is formed in a mounting region of the solid-state image pickup device.