JPH08172177A - Solid state image sensing module and endoscope equipment - Google Patents

Abstract

PURPOSE: To provide a solid state image sensing module and an endoscope equipment wherein the improvement of picture quality, the functional high reliabilty and the compact size are realized. CONSTITUTION: A solid state image sensing module is provided with a glass substrate 9 wherein a wiring circuit 9a containing desired I/O terminals is formed on one main surface, a solid state image sensing element 10 wherein light receiving surfaces are mounted and arranged on the one main surface of the glass substrate 9 so as to face each other, a connection part 11 which electrically connects the part between a terminal 10a of the solid state image sensing element 10 and one side connection terminal 9a of the surface of the glass substrate 9, an active type circuit element 12a interposed in a wiring circuit 9a of the surface of the glass substrate 9, and a flexible wiring board 15 which is electrically connected with the other side connection terminal of the surface of the glass substrate 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a CCD (Carge Copuled).
The present invention relates to a solid-state image pickup module having a solid-state image pickup device called a device as a main body and suitable for an endoscope, and an endoscope apparatus including the solid-state image pickup module.

[0002]

2. Description of the Related Art For example, a monitoring device or an endoscopic device for examining the inside of the stomach generally has an image pickup head portion formed by sealing at least a solid-state image pickup module in a liquid-tight manner, and an input / output signal of the image pickup head portion. It employs a configuration including a signal introducing / extracting section for introducing / extracting and an input / output signal control section for controlling an input / output signal in the signal introducing / extracting section. In addition, in this type of endoscope apparatus and the like, generally, a solid-state imaging module configured to have a cross-sectional view of a main part structure is used in FIG. In FIG. 4, 1 is a chip carrier, 2
Is a solid-state image sensor (CCD chip) mounted and mounted on the chip carrier 1 and fixed by adhesion with, for example, an epoxy resin (not shown), 3 is a terminal 2a of the solid-state image sensor 2 and a terminal on the surface of the chip carrier 1 Bonding wires 4 for electrically connecting with 1a are resin layers for protecting / sealing the connecting portion including the bonding wire 3. Reference numeral 5 denotes an optical filter arranged on the light-receiving surface (active area surface) of the solid-state image sensor 2 via an adhesive layer (for example, a silicone resin layer) 6 having a filter function.
Reference numeral 7 is a flexible wiring board electrically connected to the back terminals of the chip carrier 1 by soldering load, and 8 is a circuit such as an active element and a passive element inserted in the signal wiring portion of the flexible wiring board 7 surface. It is a part. Note that the solid-state imaging device 2 usually has a configuration in which a microlens (not shown) is provided for each active region forming a light-receiving surface in order to improve light-receiving ability.

[0003]

However, the following disadvantages are recognized in the solid-state image pickup module having the above-described configuration and the endoscope apparatus configured by using the solid-state image pickup module. That is, the solid-state imaging device 2 is mounted and mounted on the chip carrier 1 and electrically connected by the bonding wire 3. By the way, in the solid-state image pickup module, there is a demand for making the pixel fine structure for the purpose of improving the obtained image quality, or making the image pickup head unit compact. To meet these demands, the miniaturization of wiring and the increase in the number of wirings are inevitably accompanied, and the number of circuit components 8 such as semiconductor elements to be mounted and arranged also increases. Therefore, the solid-state imaging module inevitably becomes large in size, and as a result, the compactness of the solid-state imaging module is hindered. Moreover, assembling (manufacturing) operations such as wire bonding and adhesion of the optical filter 5 become complicated, and there are problems in terms of productivity, yield, and product reliability. That is,
On the other hand, there is a problem that the solid-state imaging module and the endoscope device (imaging head unit) are inevitably increased in size, while on the one hand, the development of a practically effective solution is required. The current situation is waiting.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a solid-state image pickup module and an endoscope apparatus which are compact in size while improving image quality and functional reliability. And

[0005]

A first solid-state image pickup module according to the present invention comprises a glass substrate having a wiring circuit including required input / output connection terminals on one main surface thereof, and a main substrate of the glass substrate. A solid-state imaging device mounted and arranged with the light-receiving surface facing each other on the surface, and a connecting portion for electrically connecting the terminals of the solid-state imaging device and one of the connection terminals on the glass substrate surface,
It is characterized by comprising an active type circuit element inserted in the wiring circuit on the glass substrate surface and a flexible wiring board electrically connected to the other connection terminal on the glass substrate surface. In a second solid-state imaging module according to the present invention, a glass substrate provided with a wiring circuit including required input / output connection terminals on one main surface and a light-receiving surface on one main surface of the glass substrate are opposed to each other. A solid-state image sensor mounted and arranged,
A connection part for electrically connecting between a terminal of the solid-state imaging device and one of the connection terminals on the glass substrate surface, an active circuit element inserted in a wiring circuit on the glass substrate surface, and the solid-state imaging device It shall be configured to have a pair of flexible wiring boards that are electrically connected to the other connection terminals on the glass substrate surface on opposite sides, and one of which is folded back 180 ° and led out in the same direction. Is characterized by. Further, the endoscope apparatus according to the present invention includes an image pickup head section which is formed by sealing at least a solid-state image pickup module in a liquid-tight manner, a signal introduction section which introduces and outputs an input / output signal of the image pickup head section, and the signal. In the endoscope apparatus including an input / output signal control unit that controls an input / output signal at the introduction / extraction unit, the solid-state imaging module has a wiring circuit including required input / output connection terminals on one main surface. An electrical connection is provided between the provided glass substrate, the solid-state imaging device mounted and arranged on the one main surface of the glass substrate with the light-receiving surface facing each other, the terminal of the solid-state imaging device, and one connection terminal of the glass substrate surface. And a flexible wiring board electrically connected to the other connection terminal on the glass substrate surface, and an active type circuit element inserted in the wiring circuit on the glass substrate surface. That you are doing And butterflies. That is, according to the present invention, a solid-state image sensor (CCD chip) and a part of an active type circuit component are mounted in a so-called flip-chip form on a glass substrate surface that also functions as a filter for protecting the active surface of the image pickup. In addition, if necessary, a pair of flexible wiring boards are set so that one side is folded back 180 ° and led out in the same direction, while maintaining compactness, the layout surface of signal wiring and circuit parts and solid-state imaging. The main idea is to achieve a compact module.

Further, in the configuration of the solid-state image pickup module, a so-called microlens may be arranged on the light-receiving surface of the solid-state image pickup element to improve the light-receiving performance.
Further, it is possible to protect and improve the environmental resistance by sealing a resin layer between the surfaces of the glass substrate facing the light receiving surface of the solid-state image sensor.

[0007]

In the first solid-state image pickup module according to the present invention, the glass substrate surface is used as the connection wiring portion, the image pickup function (active or light-receiving surface) surfaces of the solid-state image pickup element are opposed to each other, and the active type circuit component is further provided. Part of this is also mounted and arranged on the glass substrate surface. Since the glass substrate not only protects the image pickup function surface of the solid-state image pickup element but also participates in the image pickup function by the filter action, it is not necessary to separately provide an optical filter, which is a factor in eliminating the need for the bonding wire. Therefore, a significant reduction in size will be achieved.

Further, in the first solid-state image pickup module, in addition to the above-mentioned action, with respect to the connection wiring on the glass substrate surface,
Signal wiring is connected separately by two (pair) flexible wiring boards, and one flexible wiring board is 180
Since it is bent and drawn (extended) in the same direction as the other flexible wiring board through the back surface side of the solid-state imaging device, another configuration is adopted, so that a more compact form can be easily obtained.
In other words, while adopting a configuration in which the signal wiring is installed separately,
Since the area for mounting and arranging the circuit components is also increased, the layout of the signal wiring and the circuit components can be easily performed, and high performance and high reliability are ensured, and at the same time, a compact configuration is achieved.

Further, in the endoscope apparatus according to the present invention, since the solid-state image pickup module is mounted / incorporated in the image pickup head portion, the image pickup function and the image pickup function can be maintained while maintaining the compactness of the image pickup head portion. It becomes possible to function as an endoscopic device having improved reliability.

[0010]

Embodiments of the present invention will be described below with reference to FIGS. 1, 2 and 3.

FIG. 1 is a cross-sectional view showing a main part of a configuration example of a solid-state image pickup module. Reference numeral 9 indicates a required terminal (including a wiring conductor) 9a provided on one main surface and a thickness of about 0.5 mm. ， Width about 6
mm, a length of about 9 mm, a glass substrate, 10 is a solid-state imaging device mounted and arranged on one main surface of the glass substrate 9, for example, a CCD chip having 100,000 pixels. Reference numeral 11 denotes a bump (connecting portion) made of, for example, Au which electrically connects the terminal 10a of the solid-state image pickup device 10 and the terminal 9a of the glass substrate 9, and is connected by a micro socket method by using In solder together. ing. Here, in order to improve the light receiving ability of the solid-state image pickup device 10, a microlens is provided for each active area forming a light receiving surface (imaging active surface), and the microlens forming surface is formed on the glass substrate 9 surface. It is also possible to mount and arrange them facing each other.

Further, 12a is an active type circuit component inserted in the wiring conductor portion of the terminal 9a including the wiring conductor on the surface of the glass substrate 9, and 13 is the solid-state image pickup device 9 and the active type circuit component 12a. A sealing resin layer (for example, a photo-curing resin such as an epoxy resin) that seals between the light-receiving surface of the solid-state imaging device 9 and the surface of the glass substrate 8 in the mounting and placement area, and 14 is the terminal 9a of the glass substrate 9 and the imaging. An anisotropic conductor layer for electrically connecting a flexible wiring board (15) connected to the device body (not shown) side. Here, the flexible wiring board 15 is
Corresponding signal wirings are provided, and circuit components such as an active circuit component 12b such as a semiconductor device and a passive circuit component 12c such as a resistance device are mounted and arranged.

FIG. 2 is a cross-sectional view showing the main part of another configuration example of the solid-state image pickup module. Reference numeral 9 indicates a required terminal (including a wiring conductor) 9a provided on one main surface and having a thickness of about 0.5. mm, width approx.
A glass substrate 10 having a length of 6 mm and a length of approximately 9 mm is a solid-state image pickup device mounted and arranged on one main surface of the glass substrate 9, for example, a CCD chip having 100,000 pixels. Reference numeral 11 denotes a bump (connecting portion) made of, for example, Au which electrically connects the terminal 10a of the solid-state image pickup device 10 and the terminal 9a of the glass substrate 9, and is connected by a micro socket method by using In solder together. ing. Here, in order to improve the light receiving ability of the solid-state image pickup device 10, a microlens is provided for each active area forming a light receiving surface (imaging active surface), and the microlens forming surface is formed on the glass substrate 9 surface. It is also possible to mount and arrange them facing each other.

Further, 12a is an active type circuit component inserted in the wiring conductor portion of the terminal 9a including the wiring conductor on the surface of the glass substrate 9, and 13 is the solid-state image pickup device 9 and the active type circuit component 12a. A sealing resin layer (for example, a photo-curing resin such as an epoxy resin) that seals between the light-receiving surface of the solid-state imaging device 9 and the surface of the glass substrate 8 in the mounting and placement area, and 14 is the terminal 9a of the glass substrate 9 and the imaging. This is an anisotropic conductor layer that electrically connects the flexible wiring boards 15a and 15b connected to the equipment body (not shown) side. Here, the flexible wiring boards 15a and 15b are provided with corresponding signal wirings, and the flexible wiring boards 15a and 15b are electrically connected to the terminals 9a side of the glass substrate 9 by facing opposite sides of the solid-state imaging device 10. Flexible wiring boards 15a and 15b are separately provided on one side, and one flexible wiring board 15b is bent by 180 ° and extended in the same direction as the other flexible wiring board 15a. Also these flexible wiring boards
15a and 15b include active circuit components 12b such as semiconductor devices and passive circuit components 1 such as resistance devices.
Circuit parts such as 2c are mounted and arranged.

Next, an example of the structure of an endoscope apparatus using the solid-state image pickup module having the above structure will be described. That is, as shown in FIG. 3 as a block diagram showing a schematic configuration of a main part, at least an imaging head unit 16 formed by liquid-tightly sealing a solid-state imaging module and an input / output signal of the imaging head unit 16 are introduced. The signal introduction / output unit 17 and the signal introduction / output unit
An endoscope apparatus including an input / output signal controller 18 for controlling the input / output signal at 17 was prepared. Here, the imaging head unit 16 has a structure in which an insulating tube and a side wall of the insulating tube are sealed so that the back surface of the glass substrate 9 of the solid-state imaging module and the light source are optically exposed. . The signal lead-in / out section 17 is composed of an insulating cable in which a required wiring circuit connected to the flexible wiring board 15 or 15a, 15b on the other end side of the insulating tube is installed. Further, the input / output signal control unit (endoscope device main body) 18 is connected to the signal introduction / output unit 17, and the imaging head unit is connected.
It incorporates a means for introducing and outputting 16 input / output signals, and if necessary, adopts a configuration provided with means for imaging the output signal. Here, the connection of the signal introduction / output unit 17 to the input / output signal control unit 18 may be a fixed type or a detachable type.

When the solid-state image pickup module having the structure shown in FIG. 1 or FIG. 2 is mounted as the solid-state image pickup module of the image pickup head unit 16 included in this endoscope apparatus, the image pickup head unit 16 is reduced in size. In addition to achieving 50%, high performance and reliability were secured. That is, as described above, when the endoscopic device having the configuration in which the solid-state imaging module according to the present invention is mounted was tested, it was confirmed that an image with good image quality was always obtained as the initial purpose. It was also confirmed that the excellent performance (function) is maintained for a long time.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. For example, it is possible to adopt a configuration in which a microlens is formed on the light-receiving surface of the solid-state image sensor, or to omit filling the resin layer between the light-receiving surface of the solid-state image sensor and the glass substrate surface.

[0018]

As described above, the solid-state image pickup module according to the present invention is capable of obtaining a high-quality picked-up image without significantly changing the specifications such as the basic structure and is compact. Hold and exert. In other words, the number of components is reduced by supporting and electrically connecting the solid-state image sensor with a glass substrate that also functions as an optical filter and mounting and arranging a part of the active circuit components on the glass substrate. The performance and compactness of the solid-state image pickup module can be achieved while simplifying the structure and the structure. In particular, in the case where the flexible wiring board is drawn out from two opposite directions and one of the flexible wiring boards is bent and extended in one direction, the signal wiring is distributed as a result. While maintaining compactness, the area for arranging the signal wiring and the circuit components is also increased, so that the number of pixels of the solid-state imaging device is increased, and the layout of the signal wiring and the circuit components, which is increased along with the increase, is facilitated. Higher performance and compactness of the imaging module are achieved.

Further, since the endoscope apparatus according to the present invention has a structure in which the solid-state image pickup module is mounted on the image pickup head section thereof, the image pickup head section of the endoscope apparatus can be easily made compact. Not only can it contribute to the reduction of the patient's pain in inserting a fart, but it also becomes possible to obtain a highly reliable examination image.

[Brief description of drawings]

FIG. 1 is a sectional view showing a main part of a configuration example of a solid-state imaging module according to the present invention.

FIG. 2 is a cross-sectional view showing the main parts of another configuration example of the solid-state imaging module according to the present invention.

FIG. 3 is a block diagram showing a configuration example of a main part of an endoscope apparatus according to the present invention.

FIG. 4 is a sectional view showing a main part of a configuration example of a conventional solid-state imaging module.

[Explanation of symbols]

1 ... Chip carrier 2,10 ... Solid-state image sensor (CCD chip) 3 ... Bonding wire 4,13 ... Filling resin layer 5 ... Optical filter 6 ... Adhesive layer having filter function 7,15, 15a, 15b …… Flexible wiring board 7,14 …… Circuit parts 8,12
...... Circuit parts 9 ...... Glass substrate 9a ...... Glass substrate side terminals (including wiring conductors) 10a ...... Solid-state image sensor terminals 11 ...... Connection bumps (connection parts) 14 ...... Conductor layer 16 ...... Imaging head Section 17 …… Signal introduction section 18 …… I / O signal control section

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H05K 1/18 S 8718-4E

Claims (3)

[Claims] 1. A solid-state image pickup device, comprising: a glass substrate having a wiring circuit including required input / output connection terminals provided on one main surface thereof; and a light receiving surface of the glass substrate facing and mounted on the main surface of the glass substrate. An element, a connecting portion for electrically connecting a terminal of the solid-state imaging device and one of the connecting terminals on the glass substrate surface, an active circuit element inserted in a wiring circuit on the glass substrate surface, and the glass A solid-state imaging module comprising a flexible wiring board electrically connected to the other connection terminal on the substrate surface. 2. A solid-state imaging device comprising a glass substrate on which a wiring circuit including required input / output connection terminals is provided on one main surface, and a light receiving surface facing and mounted on one main surface of the glass substrate. An element, a connecting portion for electrically connecting a terminal of the solid-state image pickup device and one of the connecting terminals on the glass substrate surface, an active circuit element inserted in a wiring circuit on the glass substrate surface, and the solid state The opposite side of the image sensor is electrically connected to the other connection terminal on the glass substrate surface, and
A solid-state image pickup module comprising a pair of flexible wiring boards that are folded back and led out in the same direction. 3. An image pickup head section which is formed by sealing at least a solid-state image pickup module in a liquid-tight manner, a signal introducing section which introduces and outputs an input / output signal of the image pickup head section, and an input / output at the signal introducing section. In an endoscope apparatus comprising an input / output signal control unit for controlling signals, the solid-state imaging module has a glass substrate on which a wiring circuit including required input / output connection terminals is provided on one main surface, A solid-state imaging device mounted and arranged on one main surface of the glass substrate with a light-receiving surface facing each other; and a connecting portion for electrically connecting a terminal of the solid-state imaging device and one connection terminal of the glass substrate surface. An active type circuit element inserted in a wiring circuit on the glass substrate surface, and a flexible wiring board electrically connected to the other connection terminal on the glass substrate surface. Characteristic endoscopic device