JPH01161979A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To improve the mount density and to decrease the length of the circuit board by applying stereoscopic mount to the surround circuit of a solid-state image pickup element by two circuit boards and chip components. CONSTITUTION:The 2nd flexible printed board(FPC) 40 is prepared, and a chip component 50 of the peripheral circuit is mounted. That is, the chip component 50 is mounted on the 2nd FPC 40 and the connection terminal of the chip component 50 and the connection pad 41 of the FPC 40 are soldered. Then the 2nd FPC 40 is arranged to the image pickup face of the solid-state image pickup element 10 and the 1st FPC 30 in the orthogonal direction and the FPCs 30, 40 are connected electrically. The 1st FPC 30 and the 2nd FPC 40 are connected easily by soldering the connection pad 31 of the 1st FPC 30 and the connection terminal of the chip component 50 and stereoscopic mount is applied. Thus, the device constitution is made small in size.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to solid-state imaging devices used in electronic endoscopes, micro cameras, etc., and particularly relates to implementation of peripheral circuits of solid-state imaging probes. This invention relates to a solid-state imaging device with improved technology.

(Prior Art) In recent years, electronic endoscopes, micro cameras, and the like have been developed as applied technologies using solid-state imaging devices.

The selling points of an electronic endoscope are that the distal end that is inserted into the body is thin, and that the camera head of a micro camera is small, and it is desirable that the solid-state imaging device incorporated therein be small. Such a solid-state imaging device is
It consists of a solid-state image sensor, peripheral circuits such as a noise reduction circuit, and an extension cable.

The outer diameter of the tip of an electronic endoscope is directly related to the size of the solid-state imaging device, and efforts have been made to make the solid-state imaging device as small as possible. For example, connect a solid-state image sensor to a chip carrier made as small as possible, pull out a flexible printed circuit board (FPC) from the chip carrier, mount peripheral circuits on the FPC using chip components, and connect cables to terminals provided on the FPC. do. Further, a configuration is adopted in which a solid-state image sensor is flip-chip connected to a glass substrate, and an FPC is pulled out from the glass substrate to mount peripheral circuits.

On the other hand, solid-state imaging devices such as CCDs are being rapidly miniaturized, and as a result, the volume occupied by peripheral circuits in solid-state imaging devices has become relatively large. moreover,
As solid-state image sensors become smaller, the width of the FPC drawn out from the solid-state image sensor also becomes narrower. For this reason, the FPC has to be made longer in order to mount peripheral circuits, which is a factor that hinders the miniaturization of solid-state imaging devices.

(Problem to be solved by the invention) Conventionally, as the solid-state image sensor becomes smaller, the width of the FPC drawn out from it also becomes narrower, and if the width of the FPC is maintained and peripheral circuits are mounted, the length of the FPC becomes smaller. becomes longer. In other words, compared to the miniaturization of solid-state image sensors, it is no longer possible to miniaturize the device.

The present invention has been made in consideration of the above circumstances, and its purpose is to mount peripheral circuits without increasing the length of the circuit board pulled out from the solid-state image sensor even if the solid-state image sensor becomes smaller. The object of the present invention is to provide a solid-state imaging device that can be used to reduce the size of the device configuration.

[Structure of the Invention] (Means for Solving Problems) The gist of the present invention is to three-dimensionally mount peripheral circuits of a solid-state image sensor by three-dimensionally providing a plurality of circuit boards.

That is, the present invention provides a solid-state imaging device for use in electronic endoscopes, micro cameras, etc. The device includes a first circuit board, and a second circuit board mounted with chip components, arranged in a direction perpendicular to the first circuit board, and electrically connected to the first circuit board. , a peripheral circuit of the solid-state image sensor is configured from the chip component and the first and second circuit boards.

(Function) According to the present invention, by three-dimensionally mounting the peripheral circuit of the solid-state image sensor using two circuit boards and chip components, it is possible to improve the mounting density and shorten the length of the circuit board.

Moreover, since the second circuit board is also located behind the imaging surface of the solid-state imaging device, there is no problem such as an increase in the overall outer diameter. Therefore, it is possible to prevent the relative volume of peripheral circuits from increasing due to the miniaturization of solid-state image sensors.
It becomes possible to downsize the device configuration.

Additionally, by connecting the two circuit boards through the connection terminals of the chip components, there is no need for an electrical or mechanical connection mechanism to connect the two circuit boards, which simplifies the configuration. It is also possible to measure

(Example) Hereinafter, details of the present invention will be explained with reference to illustrated embodiments.

FIG. 1 is a perspective view showing a schematic configuration of a solid-state imaging device according to an embodiment of the present invention. A solid-state imaging device 10 made of a CCD or the like is mounted on a chip carrier 20, and a first FPC 30 is attached to the side surface of the chip carrier 20. The FPC 30 is drawn out behind the imaging surface of the solid-state image sensor 10, and the connection terminals gathered on the side surface of the chip carrier 30 and the wiring pattern of the FPC 30 are connected.

Here, the solid-state imaging device required for electronic endoscopes, micro cameras, etc. has a form in which an extension cable 60 is connected from the solid-state imaging device 10 via a peripheral circuit, and the extension cable 60 is connected so as not to exceed the area of the solid-state imaging device 10. It is desirable to mount a small peripheral circuit behind the solid-state image sensor 10. If such a configuration is implemented only in the first FPC 30, the width of the FPC 30 is limited by the width of the solid-state image sensor 10, so the FPC
Even if peripheral circuits are mounted on both sides of the solid-state imaging device 30, the solid-state imaging device will be long.

Therefore, in this embodiment, as shown in FIG.
A C40 is prepared, and a peripheral circuit chip component 50 is mounted thereon. In other words, the chip component 50 is transferred to the second FPC 40
The connection terminals of the chip component 50 and the connection pads 41 of the FPC 40 are soldered. Then, the second FPC 40 is arranged in a direction perpendicular to the imaging surface of the solid-state image sensor 10 and the first FPC 30, and the FPC 30° 40
electrically connect them to each other. The first FPC 30 and the second FPC 40 can be easily electrically connected by soldering the connection pads 31 of the first FPC 30 and the connection terminals of the chip component 50, and can be mounted three-dimensionally.

When there are many chip components 50, the chip components 40 are mounted on both sides of the second FPC 40, or the third FPC 40 is mounted on both sides of the second FPC 40.
The solid-state imaging device can be miniaturized by higher-density packaging, such as by providing the FPC in parallel with the second FPC 40. In addition, FPC3
0, 40 are provided with cable connection pads 32.42, and extension cables 6 are connected to these connection pads 32.42.
0 is soldered.

Thus, according to this embodiment, by arranging the second FPC 40 in addition to the first FPC 30 in a direction perpendicular to both the imaging surface of the solid-state image sensor 10 and the first FPC 30, the packaging density of peripheral circuits can be increased. Can be used, FPC30
Peripheral circuits can be mounted without increasing the length.

Therefore, the solid-state imaging device including the solid-state imaging device 10 and its peripheral circuits can be downsized, and it becomes possible to realize a small-diameter electronic endoscope, a small-sized micro camera, and the like.

In addition, the connection terminals of the chip component 50 are connected to the first and second FPs.
Since it is connected to both C30 and C40, the first and second
There is no need to directly connect the FPCs 30 and 40, and manufacturing can be simplified. Furthermore, chip parts 5
0 and the connection pad 41 of the FPC 40, as well as the connection terminal of the chip component 50 and the FPC 30.
Since the connecting portion with the connecting pad 31 also has a surface contact, the first
Another advantage is that the mechanical connection strength of the second FPCs 30 and 40 can be sufficiently increased.

FIG. 2 is a perspective view for explaining another embodiment of the present invention. The same parts as in Fig. 1 are given the same reference numerals.
A detailed explanation thereof will be omitted.

This embodiment differs from the previously described embodiment in that a glass substrate 70 is used instead of the chip carrier 20, and the other parts are completely the same as the previous embodiment. Even with such a configuration, the same effects as in the previous embodiment can be obtained.

Note that the present invention is not limited to the embodiments described above. For example, the second circuit board does not necessarily need to be disposed perpendicular to the imaging surface of the solid-state image sensor;
It is sufficient if it is arranged orthogonally to the circuit board. Further, as a method of connecting the first and second circuit boards, pads provided on the respective circuit boards may be connected without using connection terminals of chip components. In addition, various modifications can be made without departing from the gist of the present invention.

[Effects of the Invention] As described in detail above, according to the present invention, the peripheral circuit of the solid-state image sensor is three-dimensionally mounted using two circuit boards and chip components. The board can be shortened. Therefore, it is possible to prevent the relative volume of peripheral circuits from increasing due to the downsizing of the solid-state imaging device, and it is possible to downsize the device configuration.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a schematic configuration of a solid-state camera (mounting device) according to an embodiment of the present invention, and FIG. 2 is a perspective view for explaining another embodiment of the present invention. 10... Solid-state image sensor, 20... chip carrier,
30... First circuit board, 40... Second circuit board, 31.32, 41.42... Connection pad, 50...
・Chip parts, 60... Extension cable, 70... Glass substrate. Agent Patent Attorney Nori Chika 1G

Claims (4)

[Claims] (1) A solid-state image sensor and a first lens drawn out behind the image sensor and electrically connected to the image sensor.
and a second circuit board mounted with chip components, arranged in a direction perpendicular to the first circuit board, and electrically connected to the first circuit board. A solid-state imaging device characterized by: (2) The second circuit board is arranged in a direction perpendicular to both the imaging surface of the image sensor and the first circuit board. solid-state imaging device. (3) The solid-state imaging device according to claim 1, wherein a plurality of the second circuit boards are provided. (4) The solid-state imaging device according to claim 1, wherein the first and second circuit boards are electrically and mechanically connected via the chip component.