JPH0946566A - Solid-state image pickup device for electron endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device for an electron endoscope made small and thin in size. SOLUTION: This solid-state image pickup device has a solid-state image pickup element 2, a semiconductor element 4, and a thin film capacitive element 5, and a semiconductor element board 9 on whose one side the semiconductor element 4 is formed, a thin film capacitive element board 11 on whose one side the thin film capacitor is formed and laminated on the surface opposite to the surface of the semiconductor element board 9 on which the semiconductor element 4 is formed, a solid-state image pickup element board 1 laminated on the surface on which the thin film capacitive element board 11 and the thin film capacitor 5 are formed, and an electric connection member 6 connecting electrically the solid-state image pickup element 2, the semiconductor element 4 and the thin film capacitive element 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device for an electronic endoscope, which is used by being incorporated in a distal end portion of the electronic endoscope, for example.

[0002]

2. Description of the Related Art In recent years, for example, CCD (Charge Coupled Decode
vice), SIT (Static Induction Transistor), CM
Various techniques regarding an electronic endoscope using a solid-state imaging device having a solid-state imaging device such as a D (Charge Modulation Device) in an imaging unit have been proposed.

In these solid-state image pickup devices, it is desirable that the insertion portion be as thin as possible in order to reduce the pain of the patient at the time of insertion. However, the outer diameter of this insertion portion, particularly the tip portion of the endoscope, is restricted by the size of the solid-state imaging device provided inside the tip portion. A technique for miniaturizing the tip of such a solid-state imaging device is desired.

Then, for example, JP-A-63-272180
The publication discloses a technique relating to an "imaging device" in which a solid-state imaging device is mounted on a package using a bonding wire, and a hybrid integrated circuit (IC) incorporating a peripheral circuit is soldered to the package. . That is, according to this technique, the external terminals of the solid-state image sensor are separately arranged into a first external terminal group that connects to the accessory circuit in the camera head and a second external terminal group that does not connect to the accessory circuit, thereby providing a substrate of the accessory circuit. Is designed to be compact, and the wiring inside the electrical components is simplified.

FIG. 17 shows an example of the configuration of a conventional solid-state image pickup device for an electronic endoscope, which will be described. still,
17A is a front view and FIG. 17B is a side view.
In the figure, reference numeral 101 is an insulating substrate made of ceramic or glass epoxy, and a semiconductor element 102 for a peripheral circuit is connected to one main surface of the insulating substrate 101 by a bonding wire 103, and a sealing resin 104 is used. It is mounted in a sealed state, and the passive chip component 105 is soldered. The lead terminal 108 of the package 107 having the solid-state image pickup device 106 mounted thereon is soldered to the front and back surfaces of one end of the insulating substrate 101 to integrally fix the insulating substrate 101 and the solid-state image pickup device 106. ing. An external lead wire 111 is connected to the front and back surfaces of the other end of the insulating substrate 101. In addition,
Reference numeral 109 indicates a color filter, and reference numeral 110 indicates a sealing resin.

[0006]

However, FIG.
In the prior art shown in (1), when miniaturizing the solid-state imaging device for an electronic endoscope, the size of the substrate combined with the solid-state imaging device is determined by the size of chip components such as a capacitor and the mounting space. There was a limit to miniaturization beyond a certain level. Further, since the chip components are mounted on the substrate, there is a limit to thinning. The present invention has been made in view of the above problems, and an object thereof is to further reduce the size and thickness of a solid-state imaging device for an electronic endoscope.

[0007]

In order to achieve the above object, a first aspect of the present invention is an electronic endoscope solid-state image pickup device having a solid-state image pickup element, a semiconductor element, and a thin film capacitor element. A first substrate formed on one surface and the thin film capacitor element formed on one surface,
The second substrate to be laminated on the surface of the first substrate on which the semiconductor element is not formed and the solid-state image sensor are formed on one surface, and the thin film capacitor element of the second substrate is formed. It is characterized by comprising a third substrate laminated on the non-exposed surface, and an electrical connection material for electrically connecting the solid-state imaging device to the semiconductor device and the thin film capacitor device.

A second aspect is an electronic endoscope solid-state image pickup device having a solid-state image pickup element, a semiconductor element, and a thin-film capacitor element, and a first substrate having the semiconductor element and the thin-film capacitor element formed on one surface thereof. A second substrate having the solid-state imaging device formed on one surface thereof and laminated on a surface of the first substrate on which the semiconductor device and the thin-film capacitor device are not formed; the solid-state imaging device, the semiconductor device, and And an electrical connection material for electrically connecting the thin film capacitor element.

Furthermore, a third aspect is an electronic endoscope solid-state image pickup device having a solid-state image pickup element, a semiconductor element, and a thin-film capacitor element, wherein the semiconductor element is formed on one surface and the surface is orthogonal to the surface. The first substrate on which the thin film capacitor element is formed and the solid-state imaging device are formed on one surface, and the second substrate is laminated on the surface of the first substrate on which the semiconductor element and the thin film capacitor element are not formed. Board,
It is characterized by comprising the above-mentioned solid-state image pickup device and an electrical connection material for electrically connecting the semiconductor device and the thin film capacitor device.

The operations of the first to third aspects are as follows. That is, in the first aspect of the present invention, the second substrate having the thin film capacitor element formed on one surface thereof is formed on the surface of the first substrate having the semiconductor element formed on one surface thereof on which the semiconductor element is not formed. A substrate is laminated, and a third substrate having the solid-state imaging device formed on one surface is laminated on the surface of the second substrate on which the thin film capacitor element is not formed, and the solid-state imaging is performed by an electrical connection material. The element is electrically connected to the semiconductor element and the thin film capacitor element.

In the second aspect, the first semiconductor element and the thin film capacitor element are formed on one surface.
A second substrate having the solid-state imaging device formed on one surface thereof is laminated on the other surface of the substrate, and the solid-state imaging device is electrically connected to the semiconductor element and the thin-film capacitor element by an electrical connecting material. It

Further, in the third aspect, the semiconductor element is formed on one surface, and the solid-state imaging element is formed on the other surface of the first substrate on which the thin film capacitor element is formed on the surface orthogonal to the surface. The second substrate formed on one surface is laminated,
The solid-state imaging device, the semiconductor device, and the thin film capacitor device are electrically connected by the electrical connecting material.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a configuration of a solid-state image pickup device for an electronic endoscope according to a first embodiment of the present invention. This embodiment corresponds to the invention described in claim 1.

As shown in FIG. 1, the semiconductor element substrate 9
A semiconductor element 4 including a driving IC and a signal IC in which MOS (Metal Oxide Semiconductor) transistors and the like are integrated is formed on one surface, and the surface opposite to the surface on which the semiconductor element 4 is formed is formed. The thin film capacitor element substrate 11 is laminated. A thin film capacitor element 5 is formed on the surface of the thin film capacitor element substrate 11 facing the surface in contact with the semiconductor element forming substrate 9, and the solid-state imaging element substrate 1 is formed on the surface on which the thin film capacitor element 5 is formed. It is stacked. A solid-state image sensor 2 such as a CCD, CMD, or SIT is formed on the surface of the solid-state image sensor substrate 1 facing the surface in contact with the thin film capacitor element substrate 11. The solid-state imaging device substrate 1, the semiconductor device substrate 9, and the thin film capacitor device substrate 11 are silicon (Si) single crystal substrates.

The thin film capacitor element 5 has a structure in which a dielectric thin film is sandwiched between upper and lower electrodes. The upper and lower electrodes are made of a platinum group metal or an oxide conductive material, and the dielectric material is a ferroelectric material such as Pb (Zr, Ti) O3,
(Ba, Sr) TiO3, BaTiO3, (Pb, L
a) (Zr, Ti) O3, (Pb, Sr) (Zr, T
i) O3, (Pb, Ba) (Zr, Ti) O3, Bi layered oxide and the like. One of the upper and lower electrodes is connected to a power supply line (not shown), and the other is connected to a ground line.

The solid-state image pickup device 2, the semiconductor device 4, and the thin film capacitor device 5 are electrically connected to each other by using an electrically connecting material 6 of a tape carrier made of polyimide or the like through a conductive adhesive material 16 such as solder. Has been done. The color filter 18 is fixed on the surface of the substrate 1 on which the solid-state image sensor 2 is mounted in this way using a sealing resin 19, and further, on the element formation surface of the substrate 9 via an insulating film (not shown) through Au (gold). The bump external electrode terminal 17 such as a material is formed to form a solid-state imaging device for an electronic endoscope.

In the first embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1, 9, 11. Therefore, the thickness of the device itself is about 1,
Since the thickness is three, that is, 9 and 11, it is possible to reduce the size and thickness of the solid-state imaging device for an electronic endoscope. In addition, the surface of the substrate 1, 9, 11 opposite to the surface on which the elements are formed,
It is possible to further reduce the size and thickness by mechanically or chemically polishing and etching as much as possible after the formation of the above element.

Hereinafter, the second to sixteenth embodiments will be described. The same contents as those of the first embodiment described above are designated by the same reference numerals and the description thereof will be omitted. The description will focus on the characteristic points of. In addition, in FIGS. 2 to 16 corresponding to the first to sixteenth embodiments, the substrate 1
The upper color filter and the sealing resin, and the external electrode terminals under the substrate 3 are omitted for simplification of the description.

FIG. 2 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the second embodiment of the present invention. This embodiment corresponds to the invention described in claim 2. FIG.
As shown in FIG. 1, one surface of the solid-state image sensor substrate 1 is provided with a solid-state image sensor 2 such as a CCD, CMD, or SIT.
Are formed. On one surface of the semiconductor and thin film capacitor element substrate 3, a semiconductor element 4 including a driving IC, a signal IC, etc., in which MOS transistors and the like are integrated, and a side of the semiconductor element 4 or on the semiconductor element 4. The thin film capacitor element 5 is formed via the insulating film. Elements formed on the same surface of the semiconductor and the thin film capacitor substrate 3 are electrically connected by electrodes through wirings (not shown) formed on the same surface. The solid-state imaging device substrate 1 is laminated on the surface of the semiconductor and thin film capacitor substrate 3 facing the surface on which the semiconductor element 4 and the thin film capacitor element 5 are formed. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is similar to the first embodiment.

In the second embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1 and 3 in thickness. Since the thickness of the substrates 1 and 3 is only two, the size and thickness of the solid-state image pickup device for an electronic endoscope can be reduced. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Furthermore, the surfaces opposite to the element formation surface of the substrate 1 and the substrate 3 can be further downsized and thinned by mechanically or chemically polishing and etching as much as possible after the element formation so that they can be mounted.

FIG. 3 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the third embodiment of the present invention. This embodiment corresponds to the invention described in claim 3. FIG.
As shown in FIG. 1, one surface of the solid-state image sensor substrate 1 is provided with a solid-state image sensor 2 such as a CCD, CMD, or SIT.
Are formed. A semiconductor element 4 including a driving IC, a signal IC, etc., in which MOS transistors and the like are integrated on one surface of the semiconductor element and the thin film capacitor element substrate 3.
Is formed, and the thin film capacitor element 5 is formed on the surface opposite to the surface. The thin film capacitor element 5 of the semiconductor element and the thin film capacitor substrate 3
The solid-state imaging device substrate 1 is laminated on the surface on which is formed. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the third embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1 and 3, so that the device Since the thickness of itself is only the thickness of two substrates 1 and 3, the solid-state imaging device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Further, the surface opposite to the element formation surface of the substrate 1 can be further mechanically or chemically polished and etched as much as possible after the element formation, so that further miniaturization and thinning can be achieved.

FIG. 4 is a sectional view showing the structure of a solid-state image pickup device for an electronic endoscope according to a fourth embodiment of the present invention. This embodiment corresponds to the invention described in claim 4. FIG.
As shown in FIG. 1, one surface of the solid-state image sensor substrate 1 is provided with a solid-state image sensor 2 such as a CCD, CMD, or SIT.
Are formed. The semiconductor element and the thin film capacitor element substrate 3 is provided with a semiconductor element 4 including a driving IC, a signal IC, etc., in which MOS transistors and the like are integrated, and a thin film capacitor is provided on the surface facing the surface. The element 5 is formed. Then, the solid-state imaging device substrate 1 is laminated on the surface of the semiconductor device and the thin film capacitor substrate 3 on which the thin film capacitor device 5 is formed. Further, through holes 7 are formed in the semiconductor element and the thin film capacitor substrate 3, and the semiconductor element 4 and the thin film capacitor element 5 are electrically connected. Specifically, a wiring material is formed in this through hole, and the wiring material and the substrate are insulated by an insulating film. In addition to the above, the structure of the thin film capacitor element 5 and the electrical connection of the solid-state imaging element 2 and the semiconductor element 4 using the electrical connection material 6 of the tape carrier made of polyimide or the like are the same as those in the first embodiment. Is the same as. However, the thin film capacitor element 5 is electrically connected to the solid-state imaging element 2 through the through hole 7, the semiconductor element 4, the conductive adhesive material 16, and the electrical adhesive material 6 in this order.

In the fourth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin in thickness as compared with the thicknesses of the substrates 1 and 3. Since the substrate has a thickness of only two substrates 1 and 3, the solid-state image pickup device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surface opposite to the element formation surface of the substrate 1 is mechanically or chemically polished and etched as much as possible after the element formation, so that further downsizing and thinning can be achieved.

FIG. 5 is a sectional view showing the structure of a solid-state image pickup device for an electronic endoscope according to a fifth embodiment of the present invention. This embodiment corresponds to the invention described in claim 5. FIG.
As shown in FIG. 3, the solid-state image sensor 2 such as CCD, CMD, SIT, etc. is formed on one surface of the solid-state image sensor and thin-film capacitor element substrate 8, and the thin-film capacitor element 5 is formed on the surface facing the surface. Has been done. The semiconductor element 4 such as a driving IC and a signal IC is formed on one surface of the semiconductor element substrate 9. Then, the semiconductor element substrate 9
The solid-state image sensor and the thin film capacitor element substrate 8 are laminated on the surface of the semiconductor element 4 opposite to the surface on which the semiconductor element 4 is formed. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is similar to the first embodiment.

In the fifth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 8 and 9, Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and thickness of the solid-state imaging device for an electronic endoscope. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surface opposite to the element formation surface of the substrate 9 can be further mechanically or chemically polished and etched as much as possible after element formation so that further miniaturization and thinning can be achieved. Further, the same effect can be obtained by forming the semiconductor element 4 instead of the thin film capacitor element 5 formed on the substrate 8 and forming the thin film capacitor element 5 instead of the semiconductor element 4 formed on the substrate 9.

FIG. 6 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the sixth embodiment of the present invention. This embodiment corresponds to the invention described in claim 6. Figure 6
As shown in FIG. 3, the solid-state image sensor 2 such as CCD, CMD, SIT, etc. is formed on one surface of the solid-state image sensor and the thin-film capacitor element substrate 8, and the thin-film capacitor element 5 is formed on the surface facing the surface. Are formed. A semiconductor substrate 4 such as a driving IC and a signal IC is formed on one surface of the semiconductor element substrate 9. The solid-state image sensor and the thin film capacitor element substrate 8 are laminated on the surface of the semiconductor element substrate 9 facing the surface on which the semiconductor element 4 is formed.

Further, through holes 10 are formed in the solid-state image pickup device and the thin-film capacitor substrate 8, and the solid-state image pickup device 2 and the thin-film capacitor device 5 are electrically connected. Specifically, a wiring material is formed in the through hole 10, and the wiring material and the substrate are insulated by an insulating film. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, 1
This is the same as the embodiment.

In the sixth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 8 and 9, so that Since the substrate has a thickness of only two substrates 1 and 3, the solid-state image pickup device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surface opposite to the element formation surface of the substrate 9 can be further mechanically or chemically polished and etched as much as possible after element formation so that further miniaturization and thinning can be achieved. Further, the same effect can be obtained by forming the semiconductor element 4 instead of the thin film capacitor element 5 formed on the substrate 8 and forming the thin film capacitor element 5 instead of the semiconductor element 4 formed on the substrate 9.

FIG. 7 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the seventh embodiment of the present invention. This embodiment corresponds to the invention described in claim 7. Figure 7
As shown in FIG. 3, the solid-state image sensor 2 such as CCD, CMD, SIT is formed on one surface of the solid-state image sensor substrate 1. On one surface of the semiconductor element substrate 9, the semiconductor element 4 including a driving IC in which MOS transistors and the like are integrated, a signal IC, and the like are formed. The solid-state imaging device substrate 1 is laminated on the surface of the semiconductor device substrate 9 that faces the surface on which the semiconductor device 4 is formed.
Further, the thin film capacitor element 5 is formed on one surface of the thin film capacitor element substrate 11, and the surface on which the thin film capacitor element 5 is formed is connected to the electrical connection material 6 of the tape carrier made of polyimide or the like. In addition, the solid-state image sensor 2 using the structure of the thin film capacitor element 5 and the electrical connection material 6 of the tape carrier made of polyimide or the like,
The electrical connection of the semiconductor element 4 and the thin film capacitor element 5 is the same as in the first embodiment.

In the seventh embodiment having such a configuration, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin compared to the substrates 1 and 9, Since the thickness is only the thickness of the two substrates 1 and 9, the solid-state imaging device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, substrate 1,
The surface opposite to the element formation surface of 9 can be further downsized and thinned by polishing or etching mechanically or chemically as much as possible after mounting the element. Furthermore, the substrate 11
The same effect can be obtained by forming the semiconductor element 4 instead of the thin film capacitor element 5 formed on the substrate 9 and forming the thin film capacitor element 5 on the substrate 9 instead of the semiconductor element 4.

FIG. 8 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the eighth embodiment of the present invention. This embodiment corresponds to the invention described in claim 8. FIG.
As shown in FIG. 3, the solid-state image sensor 2 such as CCD, CMD, SIT is formed on one surface of the solid-state image sensor substrate 1. On one surface of the semiconductor element substrate 9, the semiconductor element 4 including a driving IC in which MOS transistors and the like are integrated, a signal IC, and the like are formed. The solid-state imaging device substrate 1 is laminated on the surface of the semiconductor device substrate 9 that faces the surface on which the semiconductor device 4 is formed. Further, the thin film capacitor element 5 is connected to an electrical connection member 6 of a tape carrier made of polyimide or the like. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the eighth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1, 9, Since the thickness is only the thickness of the two substrates 1 and 9, the solid-state imaging device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surfaces opposite to the element formation surfaces of the substrate 1 and the substrate 9 are mechanically or chemically polished and etched as much as possible after element formation so that further miniaturization and thinning can be achieved.

FIG. 9 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the ninth embodiment of the present invention. This embodiment corresponds to the invention described in claim 9. FIG.
As shown in FIG. 3, the solid-state image sensor 2 such as CCD, CMD, SIT is formed on one surface of the solid-state image sensor substrate 1. In addition, on one surface of the semiconductor element substrate 9, a MOS
Driver IC and signal IC with integrated transistors
A semiconductor element 4 made of, for example, is formed. Further, the thin film capacitor element substrate 11 is a Si single crystal substrate having the thin film capacitor element 5 formed on one surface thereof, and is arranged on the surface of the semiconductor element substrate 9 orthogonal to the surface on which the semiconductor element 4 is formed. ing. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the ninth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1, 9, Since the thickness is only the thickness of the two substrates 1 and 9, the solid-state imaging device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surface opposite to the element formation surface of the substrate 1 can be further downsized and thinned by mechanically or chemically polishing and etching as much as possible after mounting the element. Further, instead of the thin film capacitor element 5 formed on the substrate 11, the semiconductor element 4
And the thin film capacitor element 5 is formed instead of the semiconductor element 4 formed on the substrate 9, the same effect can be obtained.

FIG. 10 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the tenth embodiment of the present invention. This embodiment corresponds to the invention described in claim 10. As shown in FIG. 10, one surface of the solid-state imaging device substrate 1 is a solid-state imaging device 2 such as CCD, CMD, or SIT.
Are formed. Further, the semiconductor element substrate 9 has a driving I in which MOS transistors and the like are integrated on one surface thereof.
C is a Si single crystal substrate on which a semiconductor element 4 including a signal IC and the like is formed, and a thin film capacitor element 5 is formed on a side surface orthogonal to the surface on which the semiconductor element 4 is formed. Further, the solid-state imaging element substrate 1 is laminated on the surface of the semiconductor element substrate 9 facing the surface on which the semiconductor element 4 is formed. The elements formed on the substrate 12 are electrically connected via a conductive adhesive material 16,
It is electrically connected via electrodes by wiring (not shown). In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the tenth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin in thickness as compared with the thicknesses of the substrates 1 and 9. Since the substrate has a thickness of only two substrates 1 and 9, the solid-state image pickup device for an electronic endoscope can be made compact and thin. Further, the work of connecting the two substrates with the electrical connecting material 6 is easier than the work of connecting the three substrates, so that the yield is improved. Here, the surface opposite to the element formation surface of the substrate 1 can be further downsized and thinned by mechanically or chemically polishing and etching as much as possible after mounting the element. Further, even if the thin film capacitor element 5 is formed instead of the semiconductor element 4 formed on one surface of the substrate 9 and the semiconductor element 4 is formed instead of the thin film capacitor element 5 on the side surface, the same effect can be obtained. To be

FIG. 11 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the 11th embodiment of the present invention. This embodiment corresponds to the invention described in claim 11. As shown in FIG. 11, the solid-state imaging device, the semiconductor device, and the thin film capacitor device substrate 12 are Si single crystal substrates,
A solid-state image sensor 2 such as a CCD, CMD, or SIT is formed on one surface thereof, and a semiconductor element 4 including a driving IC, a signal IC, etc. in which MOS transistors are integrated is formed on the surface facing the surface. The thin film capacitor element 5 is provided beside or above the semiconductor element 4 with an insulating film interposed therebetween.
Are formed. The elements formed on the substrate 12 are electrically connected via electrodes by wiring (not shown). In addition, the structure of the thin film capacitor element 5 and the electrical connection material 6 of the tape carrier made of polyimide or the like.
The electrical connection of the solid-state image sensor 2, the semiconductor element 4, the thin film capacitor element 5 and the like using the same are the same as those in the first embodiment.

In the eleventh embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrate 12, so that the thickness is Since only the thickness of the substrate 12 is used, the solid-state image pickup device for an electronic endoscope can be made small and thin. Further, the work of connecting the upper and lower surfaces of one substrate with the electrical connecting material 6 is easier than connecting two or more substrates, so the yield is improved.

FIG. 12 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the twelfth embodiment of the present invention. This embodiment corresponds to the invention described in claim 12. As shown in FIG. 12, the solid-state image sensor, the semiconductor element, and the thin film capacitor element substrate 12 are Si single crystal substrates, and the solid-state image sensor 2 such as CCD, CMD, SIT, etc. is formed on one surface of the substrate. MOS on the surface facing the surface
Driver IC and signal IC with integrated transistors
And the like, and a thin film capacitor element 5 is formed beside or above the semiconductor element 4 with an insulating film interposed therebetween. The elements formed on the substrate 12 are electrically connected by electrodes by wiring (not shown). Further, the solid-state imaging device 2, the semiconductor device 4, and the thin film capacitor device 5 are electrically connected via the through hole 13. A wiring material is formed in the through hole 10, and the wiring material is insulated from the substrate by an insulating film. In addition, the structure of the thin film capacitor element 5 and the electrical connection material 6 of the tape carrier made of polyimide or the like.
The electrical connection of the solid-state imaging device 2, the semiconductor device 4, the thin-film capacitor device 5 and the like using the same are the same as those in the first embodiment.

In the twelfth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrate 12, so that the thickness is Since only the thickness of the substrate 12 is used, the size and thickness of the solid-state image pickup device for an electronic endoscope can be reduced. Furthermore, since each element is electrically connected through the through hole, an electrical connecting material is not required, so that the mounting process is simplified and the yield is improved.

FIG. 13 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the thirteenth embodiment of the present invention. This embodiment corresponds to the invention described in claim 13. As shown in FIG. 13, the solid-state imaging device substrate 1 is S
i Single crystal substrate with CCD, CMD, S on one surface
A solid-state image sensor 2 such as an IT is formed. Further, the semiconductor element and the thin film capacitor substrate 3 are Si single crystal substrates, and the semiconductor element 4 including, on one surface thereof, a driving IC in which MOS transistors and the like are integrated, a signal IC, and the like.
Then, the thin film capacitor element 5 is formed near or on the semiconductor element 4 with an insulating film interposed therebetween. The elements formed on the substrate 3 are electrically connected by electrodes by wiring (not shown). On the other surface of the substrate 1 is A
A wiring electrode 14 made of u, Pt, Al, Ti, Ni, Cr, Ag, or the like is formed, and is electrically connected to the solid-state imaging device 2 via the through hole 10.

A wiring material is formed in the through hole 10 and the substrate is insulated from the substrate by an insulating film. Similarly, on the other surface of the substrate 3, Au, Pt, A
A wiring electrode 15 made of l, Ti, Ni, Cr, Ag, or the like is formed, and is electrically connected to the semiconductor element 4 and the thin film capacitor element 5 via the through hole 7. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the thirteenth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1 and 3, Since the thickness is only the thickness of the two substrates 1 and 3, the solid-state imaging device for an electronic endoscope can be made compact and thin. Furthermore, since each element is electrically connected through the through hole, an electrical connecting material is not required, so that the mounting process is simplified and the yield is improved. In addition, in all the embodiments in which the electrical connection material 6 is used for the electrical connection, the same applies to the structure in which the respective elements are electrically connected using the through holes without using the electrical connection material 6. Can be obtained.

FIG. 14 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the fourteenth embodiment of the present invention. This embodiment corresponds to the invention described in claim 14. As shown in FIG. 14, the solid-state imaging device substrate 1 is
Si single crystal substrate with CCD, CMD, S on one surface
A solid-state image sensor 2 such as an IT is formed. Further, the semiconductor element and the thin film capacitor substrate 3 are Si single crystal substrates, and the semiconductor element 4 including, on one surface thereof, a driving IC in which MOS transistors and the like are integrated, a signal IC, and the like.
Then, the thin film capacitor element 5 is formed near or on the semiconductor element 4 with an insulating film interposed therebetween. Further, the electrical connection material 22 of the tape carrier made of polyimide or the like is electrically connected to one side of the substrate 2 by the conductive connection material 16 such as solder, and the external lead wire is provided on the other surface of the electrical connection material 22. After electrically connecting with a conductive adhesive material 21 such as solder, the electrical connection material 22 is aligned with one side of the substrate 3.
Was bent to the substrate 3 side, and the electrical connection material 22 was pressed against the substrate 3. In addition to the above, regarding the structure of the thin film capacitor element 5 and the electrical connection of the solid-state image sensor 2, the semiconductor element 4 and the thin film capacitor element 5 using the electrical connection material 6 of the tape carrier made of polyimide or the like, This is the same as the embodiment.

In the fourteenth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1 and 3, Since the thickness is only the thickness of the two substrates 1 and 3, the solid-state imaging device for an electronic endoscope can be made compact and thin. Further, since the work of electrically connecting the two substrates with the single electrical connecting member 6 is easy, the yield is improved. In all the embodiments in which the electrical connection member 6 is used for the electrical connection, the same effect as that of the fourteenth embodiment is obtained by using the electrical connection member 6 only on one side of the substrate. Is obtained.

FIG. 15 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the 15th embodiment of the present invention. This embodiment corresponds to the invention of claim 15. As shown in FIG. 15, the solid-state imaging device substrate 1 is S
i Single crystal substrate with CCD, CMD, SI on one side
A solid-state image sensor 2 such as T is formed. Further, the semiconductor element and the thin film capacitor substrate 3 are Si single crystal substrates, and a semiconductor element 4 including a driving IC, a signal IC, etc., on one surface of which a MOS transistor or the like is integrated,
A thin film capacitor element 5 is formed beside or on the semiconductor element 4 with an insulating film interposed therebetween. This substrate 3
The elements formed on the same upper surface are electrically connected by electrodes by wiring (not shown).

Further, the electrical connection material 6 of the tape carrier made of polyimide or the like is attached to one side of the substrate 1 and one side of the substrate 3 by a conductive adhesive material 16 such as solder, so that the solid-state image pickup element 2, the semiconductor element 4, the thin film. The capacitor element 5 is electrically connected. Further, the electrical connection material 22 of the tape carrier made of polyimide or the like is electrically connected to one side of the substrate 3 by the conductive adhesive material 16 such as solder, and the external lead wire 20 is soldered to the other side of the electrical connection material 22. Conductive adhesive material 21
To make an electrical connection. Besides, the structure and the like of the thin film capacitor element 5 are the same as those in the first embodiment.

In the fifteenth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin-film capacitor device 5 are very thin as compared with the substrates 1 and 3, Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and thickness of the solid-state imaging device for an electronic endoscope. Further, it is easy to electrically connect the two substrates with the single electrical connection member 6, and the connection with the external lead wire 20 is performed using the electrical connection member 22. The yield is improved because the process of providing the electrode terminals on the substrate 3 can be simplified. In all the embodiments, the same effect can be obtained by using the external lead wire connection structure of the fifteenth embodiment.

FIG. 16 is a sectional view showing the arrangement of a solid-state image pickup device for an electronic endoscope according to the 16th embodiment of the present invention. This embodiment corresponds to the invention of claim 15. As shown in FIG. 16, the solid-state imaging device substrate 1 is S
i Single crystal substrate with CCD, CMD, SI on one side
A solid-state image sensor 2 such as T is formed. Further, the semiconductor element and the thin film capacitor substrate 3 are Si single crystal substrates smaller than the above-mentioned substrate 1, and on one surface thereof, a semiconductor element 4 including a driving IC in which MOS transistors and the like are integrated, a signal IC, and the like. A thin film capacitor element 5 is formed beside or on the semiconductor element 4 with an insulating film interposed therebetween. The elements formed on the same surface of the substrate 3 are electrically connected by electrodes by wiring (not shown).

The electrical connection material 6 of the tape carrier made of polyimide or the like is attached to one side of the substrate 1 and one side of the substrate 3 by a conductive adhesive material 16 such as solder, so that the solid-state image sensor 2, the semiconductor element 4, the thin film. The capacitor element 5 is electrically connected. Further, the electrical connection material 22 of the tape carrier made of polyimide or the like is electrically connected to one side of the substrate 3 by the conductive adhesive material 16 such as solder, and the electrical connection material 22 is connected to the substrate 1 side at the edge of the substrate 3. Bend it to the substrate 1
The external lead wire 20 is electrically connected to the portion brought into contact with the conductive adhesive 21 such as solder.

In the sixteenth embodiment having such a structure, the solid-state image pickup device 2, the semiconductor device 4, and the thin film capacitor device 5 are very thin as compared with the substrates 1 and 3, The thickness is only the thickness of the two substrates 1 and 3. Further, since the connecting portion between the external lead wire 20 and the electrical connecting material 22 is on the surface of the substrate 1, the area of the external lead wire 20 can be shortened, and the size and thickness can be reduced. Further, it is easy to electrically connect the two substrates with the single electrical connecting member 6, and the external lead wires 20 are connected by using the electrical connecting member 22, so that the external electrode The yield is improved because the step of providing the terminals on the substrate 3 can be simplified. In addition, in all the embodiments,
The same effect can be obtained by using the external lead wire connection structure of the 16th embodiment.

The first to sixteenth embodiments have been described above, but the present invention is not limited to this, and it goes without saying that various improvements and modifications can be made without departing from the spirit of the invention. is there. For example, in each of the above embodiments, an insulating film may be formed on the surface of each substrate on which the element is not formed. Furthermore, in the structure in which the surfaces of the substrates on which the elements are not formed are aligned, the surfaces on which the elements are not formed are vapor-deposited or coated with a conductive material such as Au by sputtering or printing to maintain the same potential between the substrates. You may do it. In addition, a conductive material such as Au may be vapor-deposited or coated by sputtering or printing after etching the surface on which the element is not formed. In addition, in each of the embodiments, the substrates may be bonded together by a bonding technique such as pressure bonding using an adhesive material.

Here, the summary of the solid-state image pickup device for an electronic endoscope of the present invention is summarized as follows. 1. An electronic endoscope solid-state imaging device having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), a first substrate (9) having the semiconductor device (4) formed on one surface thereof. And a second substrate (1) on which the thin film capacitor element (5) is formed on one surface and laminated on the surface of the first substrate (9) on which the semiconductor element (4) is not formed.
1) and the solid-state image sensor (2) are formed on one surface,
A third substrate (1) laminated on the surface of the second substrate (11) on which the thin film capacitor element (5) is formed, the solid-state imaging element (2), the semiconductor element (4), and the thin film capacitor element ( The solid-state imaging device for electronic endoscopes, comprising: an electrical connecting material (6) for electrically connecting the above (5).

The present invention corresponds to the first embodiment.
That is, the solid-state imaging device 2 is formed on one surface of the substrate 1, and one surface of the substrate 11 having the thin film capacitor element 5 formed on the other surface thereof is aligned with the other surface of the substrate 11. Substrate 9 with semiconductor element 4 formed on one surface
The solid-state imaging device 2, the semiconductor device 4, and the thin-film capacitor device 5 are electrically connected to each other by electrically connecting the other surface of the solid-state imaging device 2, the conductive adhesive 16, and the solid-state imaging device for an electronic endoscope. It is a thing.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are very thin as compared with the substrates 1, 9, 11. Since the thickness is only the thickness of the three substrates 1, 9 and 11, it is possible to reduce the size and the thickness. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope, which can reduce the size and thickness of the tip of the endoscope.

2. In an electronic endoscope solid-state imaging device having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), the semiconductor device (4) and the thin-film capacitor device (5) are formed on one surface. Done first
Substrate (3) and the solid-state imaging device (2) are formed on one surface, and the semiconductor device (4) of the first substrate (3) is formed.
And a second substrate (1) laminated on the surface on which the thin film capacitor element (5) is not formed, the solid-state imaging element (2), the semiconductor element (4) and the thin film capacitor element (5) electrically. A solid-state imaging device for an electronic endoscope, comprising: an electrical connection material (6) for connection.

The present invention corresponds to the second embodiment.
That is, the solid-state imaging device 2 is formed on one surface of the substrate 1, and the semiconductor device 4 and the thin film capacitor device 5 are formed on the substrate 3.
Is formed on one surface. The solid-state imaging device 2, the semiconductor device 4, and the thin film capacitor device 5 are electrically connected to each other by electrically connecting the surfaces of the substrate 1 and the substrate 3 on which the elements are not formed, with the electrical connecting material 6 and the conductive adhesive material 16. It constitutes a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are very thin as compared with the substrates 1 and 3. Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and the thickness. In addition, since the work of assembling the two of the substrate 1 and the substrate 3 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

3. At the tip of an electronic endoscope having a solid-state imaging device (2), a semiconductor device (4) and a thin film capacitor device (5), the semiconductor device (4) is formed on one surface and the thin film capacitor is formed on the other surface. One of the surfaces of the substrate (3) on which (5) is formed, and the substrate (1) on which the solid-state imaging device (2) is formed on one surface.
A solid-state imaging device for an electronic endoscope, characterized in that the respective elements are connected by an electrical connecting material (6) together with the other surface of the.

The present invention corresponds to the third embodiment.
That is, the solid-state image sensor 2 is formed on one surface of the substrate 1, the semiconductor element 4 is formed on one surface of the substrate 3, and the thin film capacitor element 5 is formed on the other surface of the substrate 3. The surface of the substrate 1 on which no element is formed and one of the surfaces of the substrate 3 are aligned, and the solid-state imaging device 2, the semiconductor device 4, and the thin film capacitor device 5 are electrically connected by the electrical connecting material 6 and the conductive adhesive material 16. And are connected to each other to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and the thickness. In addition, since the work of assembling the two of the substrate 1 and the substrate 3 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

4. 4. The solid-state image pickup device for an electronic endoscope according to the above 3, wherein the semiconductor element (4) and the thin film capacitor element (5) are electrically connected via a through hole (7).

The present invention corresponds to the fourth embodiment.
That is, the solid-state image sensor 2 is formed on one surface of the substrate 1, the semiconductor element 4 is formed on one surface of the substrate 3, and the thin film capacitor element 5 is formed on the other surface of the substrate 3. The semiconductor element 4 and the thin film capacitor element 5 are electrically connected to each other through the through hole 7. Further, the solid-state imaging device 2, the semiconductor device 4, and the thin film capacitor device 5 are made by matching the surface of the substrate 1 on which no element is formed and one surface of the substrate 3 with the electrical connecting material 6 and the conductive adhesive material 16. Are electrically connected to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and the thickness. Further, since the work of assembling the two substrates 1 and 3 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

5. At the tip of an electronic endoscope having a solid-state image sensor (2), a semiconductor element (4), and a thin-film capacitor element (5), the solid-state image sensor (2) is provided on one surface.
And the surface of the substrate (8) on which the thin film capacitor (5) is formed and the thin film capacitor element (5) is formed, and the semiconductor element (4) on one surface.
A solid-state image pickup device for an electronic endoscope, characterized in that the respective elements are connected by an electrical connecting material (6) in combination with the other surface of the substrate (9) on which is formed.

The present invention corresponds to the fifth embodiment.
That is, the solid-state image sensor 2 is formed on one surface of the substrate 8,
The thin film capacitor element 5 is formed on the other surface of the substrate 8, and the semiconductor element 4 is formed on one surface of the substrate 9. In addition, the surface of the substrate 9 on which the elements are not formed and the substrate 8
Align the surfaces on which the thin film capacitor element of is formed,
The solid-state imaging device 2, the semiconductor device 4, and the thin-film capacitor device 5 are electrically connected by the electrical connecting material 6 and the conductive adhesive material 16 to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thickness of the substrates 8 and 9. Since the thickness is only the thickness of the two substrates 8 and 9, it is possible to reduce the size and the thickness. In addition, since the work of assembling the two of the substrate 8 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

6. 6. The solid-state imaging device for electronic endoscope according to the above 5, wherein the solid-state imaging device (2) and the thin-film capacitor device (5) are electrically connected through a through hole (10).

The present invention corresponds to the sixth embodiment.
That is, the solid-state image sensor 2 is formed on one surface of the substrate 8,
The thin film capacitor element 5 is formed on the other surface of the substrate 8, and the semiconductor element 4 is formed on one surface of the substrate 9. The solid-state image sensor 2 and the thin film capacitor element 5 are electrically connected via a through hole 10. Also the substrate 9
Of the substrate 8 and the surface of the substrate 8 on which the thin film capacitor element is formed, and the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are connected by the electrical connecting material 6 and the conductive adhesive material 16. Are electrically connected to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thickness of the substrates 8 and 9. Since the thickness is only the thickness of the two substrates 8 and 9, it is possible to reduce the size and the thickness. In addition, since the work of assembling the two of the substrate 8 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

7. At the tip of an electronic endoscope having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), the solid-state imaging device (2) is provided on one surface.
The thin film capacitor element (5) was formed by aligning the other surface of the substrate (1) on which the substrate was formed with the other surface of the substrate (9) on which the semiconductor element (2) was formed on one surface. A solid-state imaging device for an electronic endoscope, characterized in that each element is connected by an electrical connection material (6) on which a substrate (11) is mounted.

The present invention corresponds to the seventh embodiment.
That is, the solid-state imaging device 2 is formed on one surface of the substrate 1,
The semiconductor element 4 is formed on one surface of the substrate 9. Further, the substrate 11 having the thin film capacitor element 5 formed thereon is mounted on the electrical connecting material 6, and the surface side of the substrate 1 and the substrate 9 on which the element is not formed is put together to form the electrical connecting material 6 and the conductive material. The solid-state imaging device 2, the semiconductor device 4, and the thin-film capacitor device 5 are electrically connected by the adhesive 16 to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the thickness of the solid-state image pickup element 2 and the semiconductor element 4 is very small compared with the thickness of the substrates 1 and 9, and therefore the thickness of the substrate 1 is 1. Since the thickness of the substrate 9 is only two, the size and thickness of the substrate 9 can be reduced. Further, since the work of assembling the two of the substrate 1 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

8. 8. The solid-state imaging device for an electronic endoscope according to the above 7, wherein the thin film capacitor element (5) is formed on an electrical connecting material (6). This invention corresponds to the eighth embodiment. That is, the solid-state image sensor 2 is formed on one surface of the substrate 1, and the semiconductor element 4 is formed on one surface of the substrate 9. Further, the thin film capacitor element 5 is formed on the electrical connection material 6, the surfaces of the substrates 1 and 9 on which the elements are not formed are aligned, and the electrical connection material 6 and the conductive adhesive material 16 are used to form the solid-state imaging device. 2, the semiconductor element 4 and the thin film capacitor element 5 are electrically connected to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the thickness of the solid-state image pickup element 2 and the semiconductor element 4 is much smaller than the thickness of the substrates 1 and 9, so that the thickness of the substrate 1 is 1. Since the thickness of the substrate 9 is only two, the size and thickness of the substrate 9 can be reduced. Further, since the work of assembling the two of the substrate 1 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

9. In an electronic endoscope solid-state imaging device having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), the semiconductor device (4) is formed on one surface and a surface orthogonal to the surface. The first substrate (9) on which the thin film capacitor element (5) is formed and the solid-state image sensor (2) are formed on one surface, and the semiconductor element (4) of the first substrate (9) is formed. And a second substrate (1) to be laminated on the surface on which the thin film capacitor element (5) is not formed
And an electrical connecting material (6) for electrically connecting the solid-state imaging device (2) to the semiconductor device (4) and the thin-film capacitor device (5). Imaging device.

The present invention corresponds to the ninth embodiment.
That is, the solid-state imaging device 2 is formed on one surface of the substrate 1,
The semiconductor element 4 is formed on one surface of the substrate 9. Further, the substrate 11 on which the thin film capacitor element 5 is formed is arranged on the side of the substrate 9, and the surface sides of the substrate 1 and the substrate 9 on which the element is not formed are aligned, and the electrical connection material 6 and the conductive adhesive material 16 are used. The solid-state imaging device 2, the semiconductor device 4, and the thin-film capacitor device 5 are electrically connected to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the thickness of the solid-state image pickup device 2 and the semiconductor device 4 is very thin compared to the thickness of the substrates 1 and 9, and therefore the thickness of the substrate 1 is 1. Since the thickness of the substrate 9 is only two, the size and thickness of the substrate 9 can be reduced. Further, since the work of assembling the two of the substrate 1 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

10. 10. The solid-state image pickup device for an electronic endoscope according to the above 9, wherein the thin film capacitor element (5) is formed on a side portion of the substrate (9). This invention corresponds to the tenth embodiment. That is, the solid-state image sensor 2 is formed on one surface of the substrate 1, and the semiconductor element 4 is formed on one surface of the substrate 9. Further, the substrate 1 on which the thin film capacitor element 5 is formed on the side of the substrate 9 and the surface side of the substrate 9 on which the element is not formed are put together, and the solid-state image pickup element 2 and the semiconductor element are formed by the electrical connection material 6 and the conductive adhesive 16. 4. The thin film capacitor element 5 is electrically connected to form a solid-state image pickup device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the thickness of the solid-state image pickup element 2 and the semiconductor element 4 is very small compared to the thickness of the substrates 1 and 9, and hence the thickness of the substrate 1 is 1. Since the thickness of the substrate 9 is only two, the size and thickness of the substrate 9 can be reduced. Further, since the work of assembling the two of the substrate 1 and the substrate 9 while electrically connecting them using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

11. At the tip of an electronic endoscope having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), the solid-state imaging device (2), the semiconductor device (4), and the thin-film capacitor device (5). ) Is formed on the same substrate (12), a solid-state image pickup device for an electronic endoscope.

The present invention corresponds to the eleventh embodiment. That is, the solid-state image sensor 2 is formed on one surface of the substrate 12, and the semiconductor element 4 and the thin film capacitor element 5 are formed on the other surface. Further, the solid-state imaging device 2, the semiconductor device 4, and the thin-film capacitor device 5 are electrically connected by the electrical connection material 6 and the conductive adhesive material 16 to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thickness of the substrate 12. Since the thickness is only the thickness of the substrate 12, it is possible to reduce the size and the thickness. Further, since the work of assembling while electrically connecting using the electrical connecting material 6 can be easily performed, the yield is improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

12. At the tip of an electronic endoscope having a solid-state imaging device (2), a semiconductor device (4), and a thin-film capacitor device (5), the solid-state imaging device (2), the semiconductor device (4), and the thin-film capacitor device (5). ) Are formed on the same substrate (12), the solid-state imaging device (2) is provided on one surface of the substrate (12), and the semiconductor device (4) and the thin film capacitor device (5) are provided on the other surface. A solid-state imaging device for an electronic endoscope, which is formed and electrically connected to the front and back of a substrate (12) through a through hole (13).

The present invention corresponds to the twelfth embodiment. That is, the solid-state image sensor 2 is formed on one surface of the substrate 12, and the semiconductor element 4 and the thin film capacitor element 5 are formed on the other surface. In addition, the solid-state imaging device 2, the semiconductor device 4, the thin-film capacitor device 5 through the through hole 13.
Are electrically connected to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope constructed as described above, the thickness of the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 is very small compared with the thickness of the substrate 12, so that Since the thickness is only the thickness of the substrate 12, it is possible to reduce the size and the thickness. Also, by performing electrical wiring between each element through through holes in the board,
Since electrical connection materials are not required and further downsizing and thinning are possible, and assembling work becomes easier,
The yield will be improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

13. The solid-state imaging device (2), the semiconductor device (4), and the thin film capacitor device (5) are electrically connected using the through holes (7) and (8) and the wiring electrodes (14) and (15) formed on the back surface. 1 characterized in that
The solid-state imaging device for electronic endoscopes according to 6, 9, and 10.

The present invention corresponds to the thirteenth embodiment. That is, the solid-state imaging device 2 is formed on one surface of the substrate 1 and the wiring electrode 14 is formed on the other surface thereof, and the solid-state imaging device 2 and the wiring electrode 14 are electrically connected to each other through the through hole 10. Has been done. The semiconductor element 4 and the thin-film capacitor element 5 are formed on one surface of the substrate 3, and the wiring electrode 15 is formed on the other surface of the substrate 3.
The wiring electrode 15, the semiconductor element 4 and the thin film capacitor element 5 are electrically connected via the. Further wiring electrode 1
4 and 15 are electrically connected using a conductive adhesive material 16,
It constitutes a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. Since the thickness is only the thickness of the two substrates 1 and 3, it is possible to reduce the size and the thickness. Further, by performing the electrical wiring between each element through the through hole in the substrate, it is possible to further reduce the size and thickness of the electrical connection material is not required, and the assembly work is easy, The yield will be improved. Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be downsized and thinned, can be easily assembled, and has improved yield.

14. 14. The solid-state image pickup device for an electronic endoscope according to claim 1, wherein the thin film capacitor element (5) is formed by using a ferroelectric thin film. This invention corresponds to the first to thirteenth embodiments. This embodiment relates to a solid-state imaging device for an electronic endoscope in which a thin film capacitor element is formed by using a ferroelectric thin film.

12. The solid-state image pickup device for an electronic endoscope according to claim 1, wherein one side of a substrate consisting of 15.4 sides is electrically connected by the electrical connecting material (6). 14. The solid-state image pickup device for an electronic endoscope according to any one of 1 to 13 above, wherein the capacitor element (5) is formed by using a ferroelectric thin film.

The present invention corresponds to the fourteenth embodiment. That is, one of each of the substrate 1 and the substrate 3 having four sides
The sides are electrically connected by the electrical connecting material 6 and the conductive adhesive material 16 to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. Since the thicknesses are only the two thicknesses of the substrates 1 and 3, it is possible to reduce the size and the thickness. In addition, since the work of assembling while electrically connecting only one side of the substrate using the electrical connecting material 6 can be facilitated, the yield is improved.

Therefore, it is possible to obtain a solid-state image pickup device for an electronic endoscope which can be miniaturized and thinned, which can be easily assembled and which has an improved yield. 16. The solid-state image pickup device for an electronic endoscope according to any one of 1 to 11 above, wherein the electrical connection material (22) and the external lead wire (20) are electrically connected.

The present invention corresponds to the fifteenth embodiment. That is, the solid-state image sensor 2 is formed on one surface of the substrate 1, and the semiconductor element 4 and the thin film capacitor element 5 are formed on one surface of the substrate 3. The surface of the substrate 1 on which the elements are not formed is matched with each other, and the electrical connection member 6 is formed.
And the solid-state image sensor 2, the semiconductor element 4, and the thin film capacitor element 5 are electrically connected by the conductive adhesive material 16, and the substrate 3 and the external lead wire 20 are electrically connected by the electrical connection material 22 and the conductive adhesive materials 16, 21. The solid-state imaging device for an electronic endoscope is configured by being electrically connected.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin-film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. Since the thicknesses are only the two thicknesses of the substrates 1 and 3, it is possible to reduce the size and the thickness. Further, by electrically connecting the electrical connecting member 22 and the external lead wire 20, it is not necessary to provide the external electrode terminal on the substrate 3, so that the process is simplified and the yield is improved. Therefore, it is possible to obtain a solid-state imaging device for an electronic endoscope, which can be downsized and thinned, the process is simplified, and the yield is improved.

17. The solid-state image pickup device for an electronic endoscope according to any one of the above 1 to 11, wherein the substrate on the external lead wire (21) connection side is smaller than the substrate on which the solid-state image pickup element (2) is formed.

The present invention corresponds to the 16th embodiment. That is, the solid-state imaging element 2 is formed on one surface of the substrate 1, and the semiconductor element 4 and the thin film capacitor element 5 are formed on one surface of the substrate 3 smaller than the substrate 1. The solid-state imaging device 2, the semiconductor device 4, and the thin film capacitor device 5 are electrically connected to each other by electrically connecting the surfaces of the substrate 1 and the substrate 3 on which the elements are not formed, with the electrical connecting material 6 and the conductive adhesive material 16. In addition, the electrical connection material 22 and the external lead wire are electrically connected on the surface of the substrate 1 by the conductive adhesive material 21 to form a solid-state imaging device for an electronic endoscope.

In the solid-state image pickup device for an electronic endoscope thus configured, the solid-state image pickup element 2, the semiconductor element 4, and the thin film capacitor element 5 are very thin as compared with the thicknesses of the substrates 1 and 3. , And the thickness is only the thickness of the two substrates 1 and 3. Further, since the connecting portion between the external lead 20 and the electrical connecting material 22 is on the surface of the substrate 1, the area of the external lead wire 20 can be shortened, and the size and thickness can be reduced. Further, by electrically connecting the electrical connecting material 22 and the external lead wire 20, it is not necessary to provide an external electrode terminal on the substrate 3, so that the process is simplified and the yield is improved. Therefore, it is possible to obtain a solid-state imaging device for an electronic endoscope, which can be downsized and thinned, the process is simplified, and the yield is improved.

[0101]

As described in detail above, according to the present invention,
It is possible to provide a compact and thin solid-state imaging device for an electronic endoscope.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a first embodiment of the present invention.

FIG. 2 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a second embodiment of the present invention.

FIG. 3 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a third embodiment of the present invention.

FIG. 4 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to an eighth embodiment of the present invention.

FIG. 9 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a ninth embodiment of the present invention.

FIG. 10 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a tenth embodiment of the present invention.

FIG. 11 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to an eleventh embodiment of the present invention.

FIG. 12 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a twelfth embodiment of the present invention.

FIG. 13 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a thirteenth embodiment of the present invention.

FIG. 14 is a sectional view schematically showing the configuration of a solid-state imaging device for an electronic endoscope according to a fourteenth embodiment of the present invention.

FIG. 15 is a sectional view schematically showing a configuration of a solid-state imaging device for an electronic endoscope according to a fifteenth embodiment of the present invention.

FIG. 16 is a sectional view schematically showing the configuration of a solid-state imaging device for an electronic endoscope according to a sixteenth embodiment of the present invention.

17A and 17B are a plan view and a side view showing a configuration of a conventional solid-state imaging device for an electronic endoscope.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor substrate, 2 ... Solid-state image sensor, 3 ... Semiconductor element and thin film capacitor substrate, 4 ... Semiconductor element, 5 ... Thin film capacitor element, 6 ... Electrical connection material, 7 ... Through hole, 8 ... Solid image sensor And thin film capacitor element substrate, 9
... Semiconductor element substrate, 10 ... Through hole, 11 ... Thin film capacitor element substrate, 12 ... Solid-state image sensor, semiconductor element,
Thin film capacitor element substrate, 13 ... Through hole, 14,
15 ... Wiring, 16 ... Conductive connecting material, 17 ... External electrode terminal, 18 ... Color filter, 19 ... Sealing resin, 20 ... External lead wire, 21 ... Conductive adhesive material, 22 ... Electrical connecting material.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Hiroyuki Yumori 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Co., Ltd. (72) Inventor Takashi Mihara 2-43-2 Hatagaya, Shibuya-ku, Tokyo No. Olympus Optical Co., Ltd. (72) Inventor Takehiro Takahashi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd.

Claims (3)

[Claims] 1. An electronic endoscope solid-state imaging device having a solid-state imaging device, a semiconductor device, and a thin-film capacitor device, wherein a first substrate having the semiconductor device formed on one surface thereof and the thin-film capacitor device on one surface thereof. Formed on the first
A second substrate to be laminated on the surface of the substrate on which the semiconductor element is not formed, and the solid-state image sensor on one surface, and on the surface of the second substrate on which the thin film capacitor element is not formed. A solid-state imaging device for an electronic endoscope, comprising: a third substrate to be laminated; and an electrical connection material for electrically connecting the solid-state imaging device to the semiconductor element and the thin film capacitor element. 2. An electronic endoscope solid-state imaging device having a solid-state imaging device, a semiconductor device, and a thin-film capacitor device, comprising: a first substrate having the semiconductor device and the thin-film capacitor device formed on one surface; and the solid-state imaging device. A second substrate having an element formed on one surface thereof and laminated on a surface of the first substrate on which the semiconductor element and the thin film capacitor element are not formed; the solid-state imaging element, the semiconductor element, and the thin film capacitor element. A solid-state imaging device for an electronic endoscope, comprising: an electrical connection material that is electrically connected. 3. An electronic endoscope solid-state imaging device having a solid-state image sensor, a semiconductor element, and a thin-film capacitor element, wherein the semiconductor element is formed on one surface and the thin-film capacitor element is formed on a surface orthogonal to the surface. And a second substrate on which the solid-state imaging device is formed on one surface, and the second substrate is laminated on a surface of the first substrate on which the semiconductor device and the thin-film capacitor device are not formed, and the solid-state imaging device. A solid-state imaging device for an electronic endoscope, comprising: an element, a semiconductor element, and an electrical connection material that electrically connects the thin-film capacitor element.