JP5754271B2 - Imaging element fixing structure - Google Patents

Description

  The present invention relates to an image sensor fixing structure for fixing an image sensor for acquiring a subject image, an image pickup apparatus using the same, an electronic apparatus, and an image sensor fixing method.

  An imaging device is known in which a subject image is received by a light receiving surface of an imaging element through a photographing optical system, and a digital image corresponding to the subject image is generated based on an image signal from the imaging element. Some image pickup apparatuses employ an image pickup element fixing structure in which an image pickup element is fixed to a holding member with high positioning accuracy, and the holding member is attached to a predetermined position with respect to a photographing optical system. In such an image sensor fixing structure, it is considered to use a holding member that has a flat plate shape that can contact the back surface opposite to the light receiving surface of the image sensor and has a fixing hole that penetrates the flat plate portion. (For example, refer to Patent Document 1).

  By the way, in an imaging device, it is known to use an imaging device package in which an imaging element is provided in a recessed space formed by a substrate and a window frame member, and the recessed space is hermetically sealed. In such an image sensor package, since there is a tolerance in the relative positional relationship between the light receiving surface (the center position) and the outer shape when viewed in a direction orthogonal to the light receiving surface of the image sensor, the outer shape is used as a reference. If the position with respect to the photographing optical system is set, the photographing optical system and the light receiving surface cannot be in a predetermined positional relationship.

  In contrast, in the conventional imaging element fixing structure described above, the holding member is assigned to the back surface of the imaging element package, and the fixing hole is filled with the adhesive from the back side of the holding member addressed to the imaging element package. Thus, the image pickup device package can be fixed at a position adjusted with respect to the holding member. For this reason, in this imaging apparatus using the imaging element fixing structure, the imaging element package is arranged at a predetermined position with high accuracy with respect to the imaging optical system by attaching a holding member to the imaging optical system at a predetermined position. be able to.

  However, in this imaging element fixing structure, since the holding member is arranged on the back surface of the imaging element package (imaging element), the size in the direction orthogonal to the light receiving surface of the imaging element package (imaging element fixing structure) Increase in thickness dimension). Such an increase in the thickness dimension is desirably suppressed because it causes an increase in a size dimension (in many cases, a thickness dimension) in an imaging apparatus using the imaging element fixing structure.

  The present invention has been made in view of the above circumstances, and provides an imaging element fixing structure capable of fixing an imaging element package at an appropriate position with respect to a holding member without causing an increase in thickness dimension. The purpose is to do.

  The imaging element fixing structure according to claim 1 includes an imaging element package that includes an imaging element that acquires a subject image on a light receiving surface, and has a rectangular shape when viewed in an optical axis direction orthogonal to the light receiving surface. A pair of first intermediate facing surfaces that are opposed to a pair of element outer surfaces on a first direction orthogonal to the optical axis direction at a first interval are defined, and orthogonal to the first direction while orthogonal to the optical axis direction An intermediate member that allows a relative first distance movement of the imaging element package in the second direction, a first adhesive layer that spans and joins the element outer surface and the first intermediate facing surface; The intermediate member defines a pair of holding inner side surfaces facing the pair of second intermediate facing surfaces present in the second direction at a second interval, and the intermediate member is positioned relative to the intermediate member in the first direction. A holding member that allows movement of two distances; A second adhesive layer that spans and joins the intermediate facing surface and the holding inner side surface, and the first interval is set to be smaller than a half value of the first distance, and the second interval is The second distance is set to be smaller than half of the second distance.

  With the imaging element fixing structure according to the present invention, the imaging element package can be fixed at an appropriate position with respect to the holding member without causing an increase in the thickness dimension.

It is explanatory drawing which shows the digital camera 10 as an example of the imaging device which concerns on this invention, (a) shows the front, (b) has shown the back. 2 is an explanatory diagram showing a control block in the digital camera 10. FIG. It is explanatory drawing which shows a mode that the lens barrel 13 is provided in the fixed frame 31 (the fixed cylinder part 13a) with a typical cross section. FIG. 3 is an explanatory diagram viewed from the positive side in the Z-axis direction in order to explain the configuration of the image sensor fixing structure 50 according to the first embodiment. 4 is a perspective view for explaining a configuration of an image sensor fixing structure 50. FIG. It is explanatory drawing seen from the Y-axis direction positive side, in order to demonstrate the structure of the image pick-up element fixing structure 50. FIG. It is explanatory drawing for demonstrating the structure of the notch part 58 for adhesion | attachment of the intermediate member 52. FIG. 4 is a flowchart illustrating a method for fixing an image sensor package 51 using the image sensor fixing structure 50. It is explanatory drawing which shows the image pick-up element fixing structure 1 for demonstrating the subject of the prior art. FIG. 5 is an explanatory view similar to FIG. 4 for describing the configuration of an image sensor fixing structure 50A according to Example 2. FIG. 6 is an explanatory view similar to FIG. 4 for describing the configuration of an image sensor fixing structure 50B according to Example 3.

  Embodiments of an image sensor fixing structure according to the present invention will be described below with reference to the drawings.

  An image sensor fixing structure 50 of Example 1 as an example of an image sensor fixing structure according to the present invention and a digital camera 10 as an example of an imaging device using the same will be described with reference to FIGS. 1 to 7. . The Z-axis direction shown in FIG. 1 is a direction parallel to the imaging optical axis direction of the lens barrel 13 (imaging optical system 12) provided in the housing 11. The photographic optical axis is an optical axis in the photographic optical system 12, that is, a rotationally symmetric axis of each optical member, and is a photographic optical axis of the digital camera 10. A plane perpendicular to the Z axis is taken as an XY plane. The positive side in the Z-axis direction is the front side (front side) of the digital camera 10, and the negative side in the Z-axis direction is the back side (rear side) of the camera. The X-axis direction is a direction perpendicular to the photographic optical axis direction of the lens barrel 13 (photographic optical system 12) provided in the housing 11. The positive side in the X-axis direction is the right side, and the negative side in the X-axis direction is the left side. Furthermore, the Y-axis direction is a direction perpendicular to the photographing optical axis direction of the lens barrel 13 (the photographing optical system 12) provided in the housing 11. The positive side in the Y-axis direction is the upper side, and the negative side in the Y-axis direction is the lower side. In FIG. 5, the first adhesive layer 67 and the second adhesive layer 68 are omitted for easy understanding.

  The digital camera 10 according to the first embodiment has a camera shake correction function that corrects camera shake by moving the imaging device in a plane perpendicular to the photographing optical axis direction. As shown in FIG. 1, the digital camera 10 has a housing 11 that has a rectangular parallelepiped shape as a whole, and is photographed on the front surface of the housing 11 (the front surface when FIG. 1A is viewed from the front). A lens barrel 13 to which the optical system 12 is attached is provided. Although not shown, the photographing optical system 12 includes a plurality of optical members such as a fixed lens, a zoom lens, a focus lens, a shutter unit, and a diaphragm unit. The lens barrel 13 has a predetermined retracted position (stored state (see FIG. 1 (a))) and a predetermined extended position (photographing standby state (see FIG. 3)) along the photographing optical axis of the photographing optical system 12. It is possible to move between.

  In the housing 11, a release button 14 a as an operation unit 14 is provided on the upper surface (the upper surface when FIG. 1 is viewed from the front). Further, the casing 11 is provided with a direction indicating switch 14b and various switches 14c as the operation unit 14 on the rear surface (the front surface when FIG. 1B is viewed from the front). In addition, the operation unit 14 includes a dial, an ADJ lever, and the like for setting menus and the like, although not shown. Further, a display unit 15 (its display surface) is provided on the back surface of the housing 11. The display unit 15 displays an image based on captured image data or image data recorded on a recording medium.

  As shown in FIG. 2, the digital camera 10 includes an image sensor 16, a lens barrel drive unit 17, a position detection element 18, a shake detection element 19, a control unit 21, and a camera shake correction mechanism 30. Have. The image sensor 16 is composed of a solid-state image sensor such as a CCD image sensor or a CMOS image sensor, and an object signal imaged on the light receiving surface 16a (see FIG. 4) through the photographing optical system 12 is converted into an electric signal (image data). ) And output. The output electrical signal (image data) is transmitted to the control unit 21. As will be described later, the image sensor 16 is provided in the image sensor package 51.

  The lens barrel drive unit 17 supports each optical member of the photographic optical system 12 so that the lens barrel 13 is shifted between the housed state (see FIG. 1A) and the photographing standby state (see FIG. 3). An optical member holding frame (not shown) is moved. The position detection element 18 detects the position of a mounting stage 33 (see FIG. 3) with respect to a base plate 32 to be described later. In the first embodiment, the position detecting element 18 is configured by a Hall element and is provided on the mounting stage 33. Yes. The shake detection element 19 is a shake detection mechanism that detects a shake that occurs in the digital camera 10 itself (its casing 11), that is, a movement in space. In the first embodiment, the shake detection element 19 includes a gyro sensor and is provided in the casing 11. It has been. The shake detection element 19 can also be configured using an acceleration sensor. The position detection element 18 and the shake detection element 19 output detection signals to the control unit 21. In the first embodiment, the detection direction of the position detection element 18 and the shake detection element 19 is set in accordance with the moving direction of the imaging element 16 (an imaging element package 51 described later) in the camera shake correction mechanism 30.

The control unit 21 performs a driving process based on an operation performed on the operation unit 14, a generation process of image data based on a signal from the image sensor 16, a display unit 15, a lens barrel driving unit 17 (see FIG. 1), and Control such as driving of a camera shake correction mechanism 30 to be described later is performed in an integrated manner. The control unit 21 acquires an image with the imaging element 16 via the photographing optical system 12 and appropriately displays the image on the display unit 15 provided on the rear surface side of the housing 11. Detection signals are input from the position detection element 18 and the shake detection element 19 to the control unit 21.
(Configuration of lens barrel 13)
As shown in FIG. 3, the digital camera 10 includes a fixed frame 31. The fixed frame 31 is integrally formed on the front side (subject side) of the base plate 32 provided with the camera shake correction mechanism 30 as will be described later, and has a cylindrical fixed cylinder portion 31a inside. On the inner peripheral surface of the fixed cylinder portion 31a, although not shown, a rectilinear groove or a cam groove along the axial direction is formed. A lens barrel 13 is provided inside the fixed cylinder portion 31a.

The lens barrel 13 has a cylindrical shape that can be inserted inward of the fixed cylindrical portion 31a. In the lens barrel 13, although not shown, an optical member holding frame that holds each optical member of the photographing optical system 12 (see FIG. 1) inward, and the optical member holding frame are moved in the photographing optical axis direction. Rotating cylinders, liners, and the like are appropriately provided. The lens barrel 13 is rotated around the photographing optical axis in the fixed cylinder portion 31a by appropriately transmitting the driving force from the output shaft of the motor constituting the lens barrel driving unit 17 to the photographing optical axis direction. Is moved forward and backward appropriately to shift between a predetermined retracted position (stored state (see FIG. 1A)) and a predetermined extended position (shooting standby state (see FIG. 3)), and the shooting optical system 12 (see FIG. 1). ) Optical members (not shown) are appropriately moved to predetermined positions on the photographing optical axis.
(Configuration of the image stabilization mechanism 30)
The camera shake correction mechanism 30 moves the mounting stage 33 (image sensor 16 (image sensor package 51 described later)) in a plane (XY plane) perpendicular to the photographing optical axis direction (Z-axis direction). to correct. As shown in FIG. 3, the mounting stage 33 holds the image sensor 16 by holding an image sensor package 51 described later. Although not shown, the mounting stage 33 is held movably in the X-axis direction by a slide frame, and the slide frame is held movably in the Y-axis direction by a slide holding frame fixed to the base plate 32. Thus, the base plate 32 is held so as to be movable along the XY plane. Although not shown, the slide frame has a pair of guide rods extending in the X-axis direction along both sides of the placement stage 33 as seen in the Y-axis direction. The mounting stage 33 is held by being slidably inserted into both sides in the Y-axis direction. Although not shown, the slide holding frame has a pair of guide bars extending in the Y-axis direction along both sides of the mounting stage 33 as viewed in the X-axis direction. The slide frame is held by being slidably inserted into both sides in the X-axis direction. As a result, the mounting stage 33, that is, the image pickup device package 51 (the image pickup device 16) held on the mounting stage 33, the imaging optical system 12 (see FIG. 1) of the base plate 32, that is, the lens barrel 13, to which the slide holding frame is fixed (see FIG. 1). It is possible to move along the XY plane within a predetermined range with respect to the photographing optical axis).

  Although not shown in the drawings, the above-mentioned slide holding frame is integrally formed with the permanent magnet, adjacent to the Y-axis direction or the X-axis direction so as to surround the slide frame when viewed in the XY plane. Two yokes are provided. Two coils are provided on the back side of each yoke (the side opposite to the subject) so as to face each yoke in the Z-axis direction. In the mounting stage 33, each coil is fixed to an extending portion that extends to a position facing the yoke in the Z-axis direction on the back surface side (the side opposite to the subject) of the slide holding frame.

  In the camera shake correction mechanism 30, a magnetic force is appropriately generated in each coil, and an attractive repulsive force due to both magnetic forces is generated between each of the coils facing each other in the Z-axis direction (a permanent magnet formed integrally therewith). By appropriately acting, the mounting stage 33 can be moved in the X-axis direction, and the slide frame (not shown) can be moved in the Y-axis direction. As described above, the mounting stage 33 is provided with the position detection element 18 (see FIG. 2) for detecting the position of the mounting stage 33.

  In the camera shake correction mechanism 30, under the control of the control unit 21 (see FIG. 2), the current applied to each coil is controlled based on the shake detection information detected by the shake detection element 19 (see FIG. 2). . By this control, an attractive repulsion force by a magnetic force is appropriately applied between each coil and the yoke (permanent magnet formed integrally therewith). By this repulsive force, the mounting stage 33, that is, the image pickup device package 51 (image pickup device 16) is moved in the X-axis direction, and the slide frame (not shown) is moved in the Y-axis direction so as to cancel camera shakes. 16 (image sensor package 51) can be moved to a predetermined position on the XY plane with respect to the imaging optical axis. For this reason, in the digital camera 10, that is, the camera shake correction mechanism 30, the control unit 21 controls the current applied to each coil to move on the XY plane so as to cancel the camera shake, thereby moving the subject image due to camera shake. Then, the image pickup device 16 (the image pickup device package 51) is moved to follow the camera shake correction.

  Next, features of the digital camera 10 of the present invention will be described with reference to FIGS. In the digital camera 10, the image sensor fixing structure 50 according to the present invention is used. The imaging element fixing structure 50 includes an imaging element package 51, an intermediate member 52, and a holding member 53.

  The image pickup device package 51 has a flat plate shape as a whole, and is configured such that the image pickup device 16 is provided in a recessed space formed by a substrate and a window frame material, and the recessed space is hermetically sealed although not clearly illustrated. Has been. In the image pickup device package 51, the image pickup device 16 is arranged with the light receiving surface 16a desired on the front side as viewed in front of FIG. 4, and the direction orthogonal to the paper surface of FIG. ). In the first embodiment, the image sensor package 51 is provided with an optical filter 51a that controls light incident on the image sensor 16 (the light receiving surface 16a). The image pickup device package 51 has a rectangular shape when viewed in the photographing optical axis direction (Z-axis direction), and each side thereof extends along the X-axis direction and the Y-axis direction. In the first embodiment, in the image pickup device package 51, a pair of outer surfaces present at positions in the X-axis direction are defined as first element outer surfaces 54, and a pair of outer surfaces present at positions in the Y-axis direction are defined as second elements. The outer surface 55 is assumed. An intermediate member 52 is provided outside the image pickup device package 51.

  The intermediate member 52 is formed from a flat member. In the first embodiment, the intermediate member 52 has a thickness dimension in the Z-axis direction that is smaller than that of the imaging element package 51. The intermediate member 52 has a rectangular shape as a whole when viewed in the Z-axis direction, and is provided with an arrangement hole 52a penetrating in the Z-axis direction at the center. The arrangement hole 52 a has a rectangular shape that follows the outer shape of the image pickup device package 51 when viewed in the Z-axis direction, and has a larger size than the image pickup device package 51. Each side of the arrangement hole 52a extends along the X-axis direction and the Y-axis direction. For this reason, the intermediate member 52 has a frame shape that can surround the image pickup device package 51 when viewed in the XY plane.

  On the inner surface of the intermediate member 52, that is, the wall surface defining the arrangement hole 52 a, a surface that exists at a position in the X-axis direction and faces the pair of first element outer surfaces 54 in the X-axis direction is a first intermediate facing surface 56. A surface that exists at a position in the Y-axis direction and faces the pair of second element outer surfaces 55 in the Y-axis direction is referred to as a fourth intermediate facing surface 57.

  In the intermediate member 52, adhesive notches 58 are provided on both first intermediate facing surfaces 56. The adhesive notch 58 is a place where an adhesive is disposed to form a first adhesive layer 67 (see FIG. 4) described later. In the first embodiment, as shown in FIG. 7, the bonding notch portion 58 is formed by partially cutting the first intermediate facing surface 56, and the disposing hole is formed toward the negative side in the Z-axis direction. The adhesive receiving surface 58a is inclined to the YZ plane so as to approach the inner space of 52a, that is, the first element outer surface 54 of the image pickup device package 51. In the intermediate member 52, as shown in FIGS. 4 and 5, in the first embodiment, each of the first intermediate facing surfaces 56 is provided with two bonding notches 58, and the positions are opposed to each other in the X-axis direction. It is related.

  In the intermediate member 52, the size of the arrangement hole 52a is set as follows. In the arrangement hole 52a, each first intermediate facing surface 56 is opposed to each first element outer surface 54 of the imaging element package 51 facing each other with a first interval C1 when viewed in the X-axis direction. ing. That is, the arrangement hole 52a has a size that can receive the image pickup device package 51 with the first gap C1 being placed on both sides as viewed in the X-axis direction. The first interval C1 is arranged in order to form the size of each bonding notch 58 provided on each first intermediate facing surface 56 and a first bonding layer 67 (see FIG. 4) described later. It is set in consideration of the material and amount of the adhesive. In other words, when the adhesive for the first adhesive layer 67 is disposed in the adhesive notch 58, the first interval C1 is the adhesive receiving surface while the adhesive fills the adhesive notch 58. 58a and the first element outer surface 54 facing each other in the X-axis direction with a first interval C1 are spanned with a substantially uniform thickness dimension (height dimension viewed in the Z-axis direction) (see FIG. 3). Set it to a size that allows In the first embodiment, the first interval C1 is set to 0.3 mm.

  Further, in the arrangement hole 52a, each fourth intermediate facing surface 57 is opposed to each second element outer surface 55 of the imaging element package 51 facing each other with a third interval C3 when viewed in the Y-axis direction. It is said that. That is, the arrangement hole 52a is sized so as to receive the image pickup device package 51 while placing the third gap C3 on both sides viewed in the Y-axis direction. The third interval C3 is set from the viewpoint of allowing the image pickup device package 51 and the intermediate member 52 to move by the first distance relatively in the Y-axis direction, and is larger than the first interval C1. Set to value. This first distance is an allowable value (tolerance) of the deviation amount of the center position Rc (see FIG. 4) of the light receiving surface 16a of the image sensor 16 with respect to the center position of the outer shape viewed in the Y-axis direction at least in the image sensor package 51. Set to. For this reason, the 3rd space | interval C3 is set to the value which made the said tolerance (1st distance) the half at least. In the first embodiment, the third interval C3 is set to a value slightly larger than the value obtained by halving the tolerance, and is set to 0.8 mm.

  In the outer surface of the intermediate member 52, that is, the wall surface defining the outer shape, the surface existing at the position in the Y-axis direction is a pair of second intermediate facing surfaces 61, and the surface existing at the position in the X-axis direction is a pair of first 3 intermediate facing surface 62. The intermediate member 52 is provided with an intermediate reference position 59. The intermediate reference position 59 serves as a positioning reference for the imaging element package 51 (the center position Rc of the light receiving surface 16a of the imaging element 16 (see FIG. 4)) in the intermediate member 52. In the first embodiment, the intermediate reference position 59 is a sap part that is located at a position in the X-axis direction, that is, a sap part that defines the first intermediate facing surface 56 and the third intermediate facing surface 62, in the X-axis direction. Is provided on the positive side. A holding member 53 is provided outside the intermediate member 52.

  The holding member 53 is formed of a flat plate member. In the first embodiment, the holding member 53 has a thickness dimension in the Z-axis direction that is smaller than that of the imaging element package 51. The holding member 53 has a rectangular shape as a whole when viewed in the Z-axis direction, and is provided with an arrangement hole 53a penetrating in the Z-axis direction at the center. The arrangement hole 53 a has a rectangular shape that follows the outer shape of the intermediate member 52 when viewed in the Z-axis direction, and has a larger size than the intermediate member 52. Each side of the arrangement hole 53a extends along the X-axis direction and the Y-axis direction. Therefore, the holding member 53 has a frame shape that can surround the intermediate member 52 when viewed in the XY plane.

  On the inner surface of the holding member 53, that is, the wall surface defining the arrangement hole 53 a, a surface that exists at a position in the Y-axis direction and faces the pair of second intermediate facing surfaces 61 in the Y-axis direction is defined as a first holding inner side surface 63. A surface that exists at a position in the X-axis direction and faces the pair of third intermediate facing surfaces 62 in the Y-axis direction is a second holding inner side surface 64.

  In the holding member 53, adhesive notch portions 65 are provided on both first holding inner side surfaces 63. The adhesive notch 65 is a place where an adhesive is disposed to form a second adhesive layer 68 (see FIG. 4) described later. In the first embodiment, the adhesive notch 65 is formed by partially notching the first holding inner side surface 63 in the same manner as the adhesive notch 58 of the intermediate member 52, and is directed to the negative side in the Z-axis direction. The adhesive receiving surface 65a is inclined with respect to the XZ plane so as to approach the inner space of the arrangement hole 53a, that is, the second intermediate facing surface 61 of the intermediate member 52 as it goes. In the holding member 53, in the first embodiment, two adhesive notch portions 65 are provided on each first holding inner side surface 63, and are in a positional relationship facing each other in the Y-axis direction.

  In the holding member 53, the size of the arrangement hole 53a is set as follows. In the arrangement hole 53a, each first holding inner side surface 63 is opposed to each second intermediate facing surface 61 of the intermediate member 52 facing each other at a second interval C2 when viewed in the Y-axis direction. Yes. In other words, the arrangement hole 53a has a size that can receive the intermediate member 52 while placing the second gap C2 on both sides viewed in the Y-axis direction. The second interval C2 is arranged to form the size of each bonding notch 65 provided on each first holding inner surface 63 and a second bonding layer 68 (see FIG. 4) described later. It is set in consideration of the material and amount of the adhesive. In other words, when the adhesive for the second adhesive layer 68 is disposed in the adhesive notch 65, the second interval C2 is the adhesive receiving surface while the adhesive fills the adhesive notch 65. It spans between the 65a and the 1st holding | maintenance inner surface 63 which opposes in the Y-axis direction at the 2nd space | interval C2, with a substantially uniform thickness dimension (height dimension seen in the Z-axis direction) (see FIG. 3). Set it to a size that allows In the first embodiment, the second interval C2 is set to 0.3 mm.

  Further, in the arrangement hole 53a, each second holding inner side surface 64 faces each third intermediate facing surface 62 of the intermediate member 52 facing each other with a fourth interval C4 when viewed in the X-axis direction. Has been. That is, the arrangement hole 53a is sized so as to receive the intermediate member 52 while placing the fourth gap C4 on both sides viewed in the X-axis direction. The fourth interval C4 is set from the viewpoint of allowing the intermediate member 52 and the holding member 53 to move by the second distance relatively in the X-axis direction, and is larger than the second interval C2. Set to. This second distance is an allowable value (tolerance) of a deviation amount of the center position Rc (see FIG. 4) of the light receiving surface 16a of the image sensor 16 with respect to the center position of the outer shape viewed in the X-axis direction in at least the image sensor package 51. Set to. For this reason, the 4th space | interval C4 is set to the value which made the said tolerance (2nd distance) the half at least. In the first embodiment, the fourth interval C4 is set to a value slightly larger than the value obtained by halving the tolerance, and is set to 0.8 mm.

  In the holding member 53, a holding reference position 66 is provided. The holding reference position 66 serves as a positioning reference for the image pickup device package 51 (the center position Rc of the light receiving surface 16a of the image pickup device 16 (see FIG. 4)) in the holding member 53. In the first embodiment, the holding reference position 66 is the one that is located on the positive side in the X-axis direction among the sap material part that exists at the position in the X-axis direction, that is, the slab part that defines the second holding inner side surface 64. Is provided.

  The first adhesive layer 67 spans between the first intermediate facing surface 56 and the first element outer surface 54 in the X-axis direction (connects both surfaces in the X-axis direction), so The member 52 is joined. In the first embodiment, the adhesive member is formed in each adhesive notch 58 provided on each first intermediate facing surface 56 of the intermediate member 52. In the first embodiment, the adhesive is an ultraviolet curable adhesive. The adhesive has a substantially uniform thickness between the adhesive notch 58 (the adhesive receiving surface 58a) and the first intermediate facing surface 56 by setting the adhesive notch 58 and the first interval C1. It spans by the dimension (height dimension seen in the Z-axis direction). The adhesive is cured while maintaining the stretched state by being irradiated with ultraviolet rays in the stretched state, and the adhesive notch 58 (the adhesive receiving surface 58a), that is, the first intermediate facing surface. A first adhesive layer 67 is formed to span 56 and the first element outer surface 54.

  In the first embodiment, the adhesive for the first adhesive layer 67 is omitted in the drawing, but using a syringe-type dispenser that can apply (emit) a predetermined amount by using air pressure. It arrange | positions to each notch part 58 for adhesion | attachment. For this reason, the setting of the adhesive notch 58 and the first interval C1 is set on the basis of a single application amount of the adhesive material in the dispenser (not shown). By using such a dispenser, the forming operation of the first adhesive layer 67, that is, the bonding operation of the imaging element package 51 and the intermediate member 52 can be performed efficiently.

  The second adhesive layer 68 spans between the first holding inner side surface 63 and the second intermediate facing surface 61 in the Y-axis direction (connects both surfaces in the Y-axis direction), so that the intermediate member 52 and the holding member 53 is joined. In the first embodiment, the adhesive is provided in each adhesive notch 65 provided on each first holding inner side surface 63 of the holding member 53 using the above-described dispenser. In the first embodiment, the adhesive is an ultraviolet curable adhesive as in the first adhesive layer 67. The adhesive has a substantially uniform thickness between the adhesive notch 65 (the adhesive receiving surface 65a) and the second intermediate facing surface 61 by setting the adhesive notch 65 and the second interval C2. It spans by the dimension (height dimension seen in the Z-axis direction). When the adhesive is irradiated with ultraviolet rays in this stretched state, the adhesive is cured while maintaining the stretched state, and the adhesive notch 65 (the adhesive receiving surface 65a), that is, the first holding inner surface. A second adhesive layer 68 is formed to span 63 and the second intermediate facing surface 61. For this reason, the setting of the adhesive notch 65 and the second interval C2 is set with reference to the amount of adhesive applied once in the dispenser (not shown). By using such a dispenser, the operation of forming the second adhesive layer 68, that is, the operation of joining the intermediate member 52 and the holding member 53 can be performed efficiently.

  Next, a method of fixing the image sensor package 51 in the image sensor fixing structure 50 will be described with reference to FIG. FIG. 8 is a flowchart illustrating a method for fixing the image sensor package 51 using the image sensor fixing structure 50 according to the first embodiment. Hereinafter, each step of the flowchart of FIG. 8 will be described.

  In step S1, the image sensor package 51 is disposed in the arrangement hole 52a of the intermediate member 52, and the process proceeds to step S2. In step S1, the pair of first element outer surfaces 54 of the image sensor package 51 are opposed to the first intermediate facing surfaces 56 of the intermediate member 52 inside the arrangement hole 52a, and the pair of image sensor packages 51 The 2nd element outer surface 55 is made to oppose each 4th intermediate | middle opposing surface 57 of the intermediate member 52 (refer FIG. 4).

  In step S2, following the arrangement of the image sensor package 51 in the arrangement hole 52a in step S1, the position of the image sensor package 51 in the X-axis direction with respect to the intermediate member 52 (arrangement hole 52a) is adjusted. Proceed to S3. In this step S2, the intermediate member 52 and the image pickup device package 51 are arranged so that the outer shape (each first element outer surface 54) of the image pickup device package 51 has a predetermined positional relationship with respect to the intermediate reference position 59 of the intermediate member 52. Are moved relative to each other in the X-axis direction, and each of the first element outer surfaces 54 of the image pickup device package 51 has an X relative to the first intermediate facing surface 56 of the corresponding intermediate member 52 (arrangement hole 52a). It is assumed that the first interval C1 is set when viewed in the axial direction. In other words, in step S2, the image pickup device package 51 is arranged in the arrangement hole 52a with the first gap C1 (at a substantially central position) on both sides viewed in the X-axis direction. In the first embodiment, in step S2, the intermediate member 52 is fixed, and the image pickup device package 51 is picked and moved by a jig (not shown), thereby moving the image pickup device package 51 in the X-axis direction with respect to the intermediate member 52. Adjust the position of.

  In step S3, following the adjustment of the position of the image sensor package 51 in the X-axis direction with respect to the intermediate member 52 in step S2, the position of the image sensor package 51 in the Y-axis direction with respect to the intermediate member 52 (arrangement hole 52a) is adjusted. The process proceeds to step S4. In this step S3, the intermediate member 52 and the image sensor package 51 are relatively moved in the Y-axis direction, and the intermediate reference position 59 of the intermediate member 52 and the center position of the light receiving surface 16a of the image sensor 16 of the image sensor package 51 are obtained. Rc (see FIG. 4) has a predetermined positional relationship when viewed in the Y-axis direction. In other words, in step S3, the position of the image pickup device package 51 viewed in the Y-axis direction in the arrangement hole 52a is adjusted with reference to the center position Rc of the light receiving surface 16a. In step S3, as in step S2, the intermediate member 52 is fixed and the image pickup device package 51 is picked and moved by a jig (not shown). Although adjustment of the position in the Y-axis direction in step S3 is omitted, the center position Rc of the light receiving surface 16a is measured by using an image recognition technique or a laser displacement meter, and the center position Rc and the intermediate reference position 59 are measured. Are performed in a predetermined positional relationship in the Y-axis direction. In step S2 and step S3, the imaging element package 51 (its outer shape) is placed at the first interval C1 in the arrangement hole 52a when viewed in the X-axis direction (first direction to be described later), and in the Y-axis direction (described later). This is the first step in which adjustment is performed with reference to the center position Rc of the light receiving surface 16a of the image sensor 16 as viewed in the second direction. For this reason, in Example 1, the X-axis direction is the first direction, and the Y-axis direction is the second direction.

  In step S4, following the adjustment of the position of the image pickup device package 51 in the Y-axis direction with respect to the intermediate member 52 in step S3, the first adhesive layer 67 is formed, and the process proceeds to step S5. In this step S4, while maintaining the state adjusted in steps S2 and S3, an adhesive is arranged on each adhesive notch 58 using the above-described dispenser (not shown), and ultraviolet rays are applied to the adhesive. By irradiating, a first adhesive layer 67 is formed that spans between the adhesive notch 58 (the adhesive receiving surface 58a) and the first intermediate facing surface 56 with a substantially uniform thickness. By this step S4, the image pickup device package 51 is attached to the arrangement hole 52a of the intermediate member 52 in a state where the position in the Y-axis direction is adjusted by the appropriately formed first adhesive layers 67. This step S4 is a second step in which the first adhesive layer 67 is formed and the imaging element package 51 is attached to the arrangement hole 52a of the intermediate member 52.

  In step S5, following the formation of the first adhesive layer 67 in step S4, the intermediate member 52 to which the image sensor package 51 is attached is disposed in the arrangement hole 53a of the holding member 53, and the process proceeds to step S6. In step S5, the pair of second intermediate facing surfaces 61 of the intermediate member 52 are opposed to the first holding inner side surfaces 63 of the holding member 53, and the pair of third third surfaces of the intermediate member 52 are located inside the arrangement hole 53a. The intermediate facing surface 62 is opposed to each second holding inner side surface 64 of the holding member 53 (see FIG. 4).

  In step S6, following the arrangement of the intermediate member 52 in the arrangement hole 53a in step S5, the position of the intermediate member 52 in the Y-axis direction with respect to the holding member 53 (arrangement hole 53a) is adjusted, and the process proceeds to step S7. move on. In this step S6, the holding member 53 and the intermediate member 52 are placed so that the outer shape (each second intermediate facing surface 61) of the intermediate member 52 has a predetermined positional relationship with respect to the holding reference position 66 of the holding member 53. The second intermediate facing surface 61 of the intermediate member 52 moves relative to the Y-axis direction so that the second intermediate facing surface 61 of the intermediate member 52 corresponds to the first holding inner surface 63 of the corresponding holding member 53 (arrangement hole 53a). And the second interval C2 is set. In other words, in step S6, the image pickup device package 51 is arranged in the arrangement hole 53a with the second interval C2 (at substantially the center position) on both sides viewed in the Y-axis direction. In the first embodiment, in step S6, the holding member 53 is fixed, and the intermediate member 52 is held by a jig (not shown) and moved to move the intermediate member 52 relative to the holding member 53 in the Y-axis direction. Make adjustments.

  In step S7, following the adjustment of the position of the intermediate member 52 in the Y-axis direction with respect to the holding member 53 in step S6, the position of the intermediate member 52 in the X-axis direction with respect to the holding member 53 (arrangement hole 53a) is adjusted. Proceed to S8. In step S7, the holding member 53 and the intermediate member 52 are relatively moved in the X-axis direction, and the holding reference position 66 of the holding member 53 and the image pickup device package 51 fixed (held) to the intermediate member 52 are detected. The center position Rc (see FIG. 4) of the light receiving surface 16a of the image pickup device 16 has a predetermined positional relationship when viewed in the X-axis direction. In other words, in step S7, the position of the intermediate member 52 (imaging element package 51) viewed in the X-axis direction in the arrangement hole 53a is adjusted with reference to the center position Rc of the light receiving surface 16a. In step S7, as in step S6, the holding member 53 is fixed and the intermediate member 52 is picked and moved by a jig (not shown). Although adjustment of the position in the X-axis direction in step S7 is omitted, the center position Rc of the light receiving surface 16a is measured by using an image recognition technique or a laser displacement meter, and the center position Rc and the holding reference position 66 are measured. Are performed in a predetermined positional relationship in the X-axis direction. In step S6 and step S7, in the arrangement hole 53a, the intermediate member 52 (its outer shape) and the second interval C2 are placed in the Y-axis direction (second direction described later), and the X-axis direction (described later). This is a third step in which adjustment is performed with reference to the center position Rc of the light receiving surface 16a of the image sensor 16 as viewed in the first direction.

  In step S8, following the adjustment of the position of the intermediate member 52 in the X-axis direction with respect to the holding member 53 in step S7, the second adhesive layer 68 is formed, and the fixing operation of the imaging element (imaging element package 51) is completed. . In this step S8, while maintaining the state adjusted in step S6 and step S7, an adhesive is disposed on each adhesive notch 65 using the above-described dispenser (not shown), and ultraviolet rays are applied to the adhesive. By irradiating, a second adhesive layer 68 is formed that spans between the adhesive notch 65 (its adhesive receiving surface 65a) and the second intermediate facing surface 61 with a substantially uniform thickness. By this step S8, the intermediate member 52 (imaging device package 51) is placed in the arrangement hole 53a of the holding member 53 in a state where the position in the X-axis direction is adjusted by the appropriately formed second adhesive layers 68. It is attached. This step S8 is a fourth step in which the second adhesive layer 68 is formed and the intermediate member 52, that is, the imaging element package 51 is attached to the arrangement hole 53a of the holding member 53.

  Next, a technical problem when the configuration in which the mounting position of the image sensor is adjustable is described. In the imaging device (16) configured as the imaging device package (51), for example, when used in the above-described digital camera 10, the imaging optical axis and the light receiving surface in a direction orthogonal to the imaging optical axis of the imaging optical system 12 are used. It is desirable that the positional relationship with (16a) is a predetermined one with high accuracy. In the image pickup device package (51), since a plurality of terminals (not shown) are provided in the outer frame portion that defines the outer shape, the photographing optical system 12 takes a picture based on the outer shape (outer frame portion). The position with respect to the optical axis is set. However, in the image pickup device package (51), there is a tolerance in the relative positional relationship between the light receiving surface (16a (the center position (Rc))) of the image pickup device (16) and the outer shape (outer frame portion). If the position of the photographing optical system 12 with respect to the photographing optical axis is set with reference to the outer shape (outer frame portion), the photographing optical axis and the light receiving surface (its central position) cannot be in a predetermined positional relationship. .

  For this reason, an imaging element is formed using a holding member having a flat plate shape that can be in contact with the back surface opposite to the light receiving surface of the imaging element (imaging element package) and having a fixing hole that penetrates the flat plate portion. An image sensor fixing structure for fixing the sensor has been considered. In this image sensor fixing structure, the holding member is assigned to the back surface of the image sensor, and the fixing element is filled with an adhesive from the back surface side of the support plate addressed to the image sensor so that the image sensor is attached to the holding member. Therefore, the fixing position of the image sensor can be adjusted with respect to the support plate. However, in this imaging element fixing structure, since the holding member is assigned to the back surface of the imaging element, the size dimension in the direction orthogonal to the light receiving surface of the imaging element (the thickness dimension in the imaging element fixing structure). ) Will increase.

  For this reason, as shown in FIG. 9, the holding member 2 is provided with an arrangement hole 2 a penetrating in a direction orthogonal to the flat plate surface, and the arrangement hole 2 a is allowed to move in a direction along the flat plate surface of the image pickup device package 3. It is conceivable that the imaging device fixing structure 1 has a size and size (see FIG. 9). In this imaging element fixing structure 1, by adjusting the position of the imaging element package 3 within the arrangement hole 2a and fixing it with the adhesive layer 4, the light receiving surface of the imaging element package 3 with respect to the outer shape of the holding member 2 It is possible to prevent an increase in the thickness dimension of the imaging element fixing structure while maintaining a predetermined positional relationship with respect to the center position.

  However, when the position of the image pickup device package 3 in the arrangement hole 2a is biased as a result of the adjustment, the distance between the holding member 2 (the arrangement hole 2a) and the image pickup device package 3 may be reduced or increased. Therefore, the adhesive layer 4 may not be formed uniformly and with appropriate strength, and the holding member 2 (arrangement hole 2a) and the image pickup device package 3 may not be appropriately bonded. In particular, when the adhesive layer 4 is formed using a syringe-type dispenser (not shown) capable of applying (emitting) a predetermined amount of adhesive as described above, the adhesive disposed at a small interval overflows. (See reference numeral 4A), the thickness dimension (size dimension in the Z-axis direction) of the adhesive disposed at a large interval may be uneven and small (see reference numeral 4B). The uneven thickness of the adhesive at this large interval is due to the surface tension of the adhesive. Here, in order to make the adhesive layer 4 have an appropriate strength, it is conceivable to adjust the amount of the adhesive to be arranged according to the interval. However, a mechanism for measuring the interval is required, and according to the interval. A mechanism for adjusting the amount of adhesive is required. For this reason, in comparison with the use of the above-described dispenser, the efficiency of the operation of forming the adhesive layer 4, that is, the operation of joining the holding member 2 (arrangement hole 2a) and the image pickup device package 3 is deteriorated, and the image pickup device. The cost in the fixed structure 1 will increase. In addition, it cannot be solved that the two adhesive layers 4 provided on both sides of the image pickup device package 3 are uneven.

  On the other hand, in the imaging element fixing structure 50, the arrangement hole 52a of the intermediate member 52 can receive the imaging element package 51 while placing the first gap C1 on both sides viewed in the X axis direction, and also the Y axis. The image sensor package 51 can be received with the third gap C3 on both sides viewed in the direction, that is, the image sensor package 51 is allowed to move by a first distance in the Y-axis direction. Further, the arrangement hole 53a of the holding member 53 can receive the intermediate member 52 while placing the second gap C2 on both sides viewed in the Y-axis direction, and the fourth gap C4 on both sides viewed in the X-axis direction. It is possible to receive the intermediate member 52 while placing the intermediate member 52, that is, the intermediate member 52 is allowed to move by a second distance relative to the X-axis direction.

  For this reason, in the imaging element fixing structure 50, the imaging element package 51 is moved to the first distance in the Y-axis direction with respect to the intermediate member 52 (arrangement hole 52a) without affecting the setting of the first interval C1 in the X-axis direction. The intermediate member 52 is moved by the second distance in the X-axis direction with respect to the holding member 53 (arrangement hole 53a) without affecting the setting of the second interval C2 in the Y-axis direction. be able to. In other words, the first adhesive layers 67 can be formed at the predetermined first interval C1 regardless of the position adjustment in the Y-axis direction of the image pickup device package 51 with respect to the intermediate member 52 (arrangement hole 52a), and the holding member Regardless of the position adjustment of the intermediate member 52 in the X-axis direction with respect to 53 (arrangement hole 53a), each second adhesive layer 68 can be formed at a predetermined second interval C2.

  From this, in the image sensor fixing structure 50 according to the present invention, the image sensor package 51 and the intermediate are formed by spanning in the X-axis direction (first direction) by the first adhesive layers 67 formed at a predetermined first interval C1. The member 52 can be joined, and the intermediate member 52 and the holding member 53 are connected to each other in the Y-axis direction (second direction) by the second adhesive layers 68 formed at a predetermined second interval C2. Since it can join, the image pick-up element package 51 can be attached to the holding member 53 with appropriate intensity | strength.

  In the imaging element fixing structure 50, the Y axis direction of the imaging element package 51 (imaging element 16) with respect to the intermediate member 52 (arrangement hole 52a) without affecting the setting of the first interval C1 in the X axis direction. The position in the (second direction) can be adjusted, and the X axis of the intermediate member 52 with respect to the holding member 53 (arrangement hole 53a) without affecting the setting of the second interval C2 in the Y axis direction. Since the position in the direction (first direction) can be adjusted, the image sensor is mainly adjusted by adjusting the position in the Y-axis direction (second direction) between the image sensor package 51 and the intermediate member 52. 16 (imaging element package 51) can determine the positioning accuracy in the Y-axis direction, and mainly adjust the position in the X-axis direction (first direction) between the intermediate member 52 and the holding member 53. , Image sensor 16 (image sensor It is possible to determine the X-axis direction positioning accuracy of Kkeji 51). Therefore, the position in the direction along the XY plane of the imaging element 16 (its center position Rc) can be adjusted and attached to the holding member 53 with high accuracy.

  Further, in the imaging element fixing structure 50, the imaging element package 51 and the intermediate member 52 are joined by being spanned in the X-axis direction (first direction) by the first adhesive layers 67, and at the second adhesive layers 68. Since the intermediate member 52 and the holding member 53 are joined by spanning in the Y-axis direction (second direction), compared to a conventional configuration in which the holding member is applied to the back surface of the image sensor. Thus, an increase in thickness dimension (size dimension in the Z-axis direction) can be prevented.

  In the image sensor fixing structure 50, the arrangement hole 52a of the intermediate member 52 is sized so that the image sensor package 51 can be received while the first gap C1 is placed on both sides viewed in the X-axis direction. The pair of first element outer surfaces 54 and the pair of first intermediate facing surfaces 56 may be set to the first interval C1 only by arranging the image pickup device package 51 at an intermediate position in the arrangement hole 52a when viewed in the axial direction. it can. Therefore, it is possible to form the first adhesive layer 67 that extends in the X-axis direction in an appropriate state while facilitating the position adjustment of the image-capturing element package 51 and the intermediate member 52 in the X-axis direction. The package 51, that is, the imaging element 16 and the intermediate member 52 can be easily and appropriately joined.

  In the image sensor fixing structure 50, the arrangement hole 52a of the intermediate member 52 is sized so that the image sensor package 51 can be received while the first gap C1 is placed on both sides viewed in the X-axis direction. The distance C1 is determined so that the adhesive material has a substantially uniform thickness dimension between the first element outer surface 54 and the first intermediate facing surface 56 with reference to a single application amount of the adhesive material in a dispenser (not shown). The first adhesive layer 67 is appropriately formed by the number of times of application of the adhesive material, since the size is set so as to be able to be crossed by the height dimension as viewed in the Z-axis direction). Can do. For this reason, the frequency | count of application | coating of the adhesive material in the joining operation | work of the image pick-up element package 51 and the intermediate member 52 can be minimized, and the said joining operation | work can be performed efficiently.

  In the imaging element fixing structure 50, the third interval C3 is set from the viewpoint of allowing the imaging element package 51 and the intermediate member 52 to move by the first distance relatively in the Y-axis direction. Since the distance is set to at least an allowable value (tolerance) of the shift amount of the center position Rc of the light receiving surface 16a of the image sensor 16 with respect to the center position of the outer shape of the image sensor package 51 viewed in the Y-axis direction. A sufficient adjustment allowance in the Y-axis direction can be ensured in the 52a and the tolerance in the image pickup device package 51 can be reliably absorbed. Therefore, the image pickup device package in the Y-axis direction with respect to the intermediate member 52, that is, the holding member 53 The position 51 can be set more appropriately.

  In the imaging element fixing structure 50, the arrangement hole 53a of the holding member 53 is sized so that the intermediate member 52 can be received while placing the second gap C2 on both sides viewed in the Y-axis direction. The pair of second intermediate facing surfaces 61 and the pair of first holding inner side surfaces 63 can be set to the second interval C2 only by arranging the intermediate member 52 at an intermediate position in the arrangement hole 53a when viewed in the direction. Therefore, it is possible to form the second adhesive layer 68 that extends in the Y-axis direction in an appropriate state while facilitating the position adjustment of the intermediate member 52 and the holding member 53 in the Y-axis direction. The image sensor package 51 attached to the image sensor, that is, the image sensor 16 and the holding member 53 can be easily and appropriately joined.

  In the imaging element fixing structure 50, the arrangement holes 53a of the holding member 53 are sized so that the intermediate member 52 can be received while placing the second gap C2 on both sides viewed in the Y-axis direction. C2 is a substantially uniform thickness dimension (Z) between the second intermediate facing surface 61 and the first holding inner side surface 63 with reference to the amount of adhesive applied once in a dispenser (not shown). (The height dimension viewed in the axial direction) is set to a size that allows the two adhesive layers 68 to be appropriately formed by applying the adhesive once. it can. For this reason, the frequency | count of application | coating of the adhesive material in the joining operation | work of the intermediate member 52 and the holding member 53 can be minimized, and the said joining operation | work can be performed efficiently.

  In the imaging element fixing structure 50, the fourth distance C4 is set from the viewpoint of allowing the intermediate member 52 and the holding member 53 to move by the second distance relatively in the X-axis direction. Is set to an allowable value (tolerance) of the shift amount of the center position Rc of the light receiving surface 16a of the image sensor 16 with respect to the center position of the outer shape of the image sensor package 51 viewed in the X-axis direction. A sufficient adjustment allowance in the X-axis direction can be ensured by the displacement of the intermediate member 52 in the interior, and the tolerance in the image sensor package 51 can be reliably absorbed, so the image sensor in the X-axis direction with respect to the holding member 53 The position of the package 51 can be set more appropriately.

  In the imaging element fixing structure 50, the intermediate member 52 is an adhesive that is inclined with respect to the YZ plane so as to approach the first element outer surface 54 of the imaging element package 51 toward the negative side in the Z-axis direction. Since the adhesive notch 58 having the receiving surface 58a is provided, the adhesive is simply disposed on the adhesive notch 58 from the positive side in the Z-axis direction. Since the one element outer surface 54 can be spanned, the first adhesive layer 67 can be easily formed.

  In the imaging element fixing structure 50, the holding member 53 receives an adhesive that is inclined with respect to the XZ plane so as to approach the second intermediate facing surface 61 of the intermediate member 52 toward the negative side in the Z-axis direction. Since the adhesive notch 65 having the surface 65a is provided, the adhesive is simply disposed on the adhesive notch 65 from the positive side in the Z-axis direction. Since the intermediate facing surface 61 can be spanned, the second adhesive layer 68 can be easily formed.

  In the imaging element fixing structure 50, the intermediate member 52 is configured to surround the imaging element package 51 around the Z axis, and the holding member 53 is configured to surround the intermediate member 52 around the Z axis. As compared with the configuration in which the holding member is attached to the back surface of the substrate, an increase in thickness dimension (size dimension in the Z-axis direction) can be prevented. In particular, in the first embodiment, since the thickness dimension in the Z-axis direction of the intermediate member 52 and the holding member 53 is smaller than that of the imaging element package 51, the thickness dimension (Z Size in the axial direction).

  In the image sensor fixing structure 50, since an ultraviolet curable adhesive is used as an adhesive for forming the first adhesive layer 67 and the second adhesive layer 68, the adhesive is disposed before irradiation with ultraviolet rays. Since the position can be adjusted even after the adjustment, the position of the light receiving surface 16a (the center position Rc) of the image sensor 16 of the image sensor package 51 in the direction along the XY plane with respect to the holding member 53 is determined. It can be set more appropriately.

  In the digital camera 10 using the image sensor fixing structure 50, the holding member 53 to which the image sensor package 51 is attached in an appropriate positional relationship is held by the mounting stage 33. Since the image sensor 16 can be in an appropriate position with respect to the axis, a more appropriate image can be acquired.

  In the digital camera 10 using the imaging element fixing structure 50, the mounting stage 33 that holds the holding member 53 to which the imaging element package 51 is attached in an appropriate positional relationship is placed perpendicular to the imaging optical axis direction (Z-axis direction). Since the camera shake is corrected by moving in the plane (XY plane), more accurate camera shake correction can be performed.

  In the digital camera 10 using the imaging element fixing structure 50, the thickness dimension (the dimension dimension in the Z-axis direction) of the imaging element fixing structure 50 is compared with the conventional configuration in which the holding member is attached to the back surface of the imaging element. ) Can be prevented, so that an increase in the thickness dimension (size dimension in the Z-axis direction) of its own external shape can be prevented, and a more compact configuration can be achieved.

  Therefore, in the imaging element fixing structure 50 according to the present invention, the imaging element package can be fixed at an appropriate position with respect to the holding member without causing an increase in the thickness dimension.

  In the first embodiment, the first direction is the X-axis direction and the second direction is the Y-axis direction. However, the first direction is perpendicular to the optical axis direction, and the second direction is the light direction. What is necessary is just to be orthogonal to the 1st direction while being orthogonal to an axial direction, and it is not limited to above-mentioned Example 1. FIG.

  Further, in the first embodiment described above, in the first step of the fixing method of the image pickup device package 51 in the image pickup device fixing structure 50, step S3 is performed after step S2, but this is performed in the reverse order. Alternatively, both adjustments may be interwoven and not limited to the first embodiment described above.

  Further, in the first embodiment described above, the adhesive is arranged in each adhesive notch 58 while maintaining the state adjusted in steps S2 and S3. However, the adhesive is first applied to each adhesive notch 58. The adjustment by step S2 and step S3 may be performed after the arrangement, and is not limited to the first embodiment described above.

  In the first embodiment described above, step S7 is performed after step S6 in the third step of the method of fixing the image pickup device package 51 in the image pickup device fixing structure 50. However, the steps may be performed in the reverse order. These adjustments may be interwoven and are not limited to the first embodiment described above.

  In the first embodiment described above, the adhesive is disposed in each adhesive notch 65 while maintaining the state adjusted in steps S6 and S7. However, the adhesive is first disposed in each adhesive notch 65. Then, the adjustment in step S6 and step S7 may be performed, and is not limited to the first embodiment described above.

  In the first embodiment described above, each of the adhesive notches 58 for forming the first adhesive layer 67 is provided in the intermediate member 52. However, the first element outer surface 54 and the first intermediate portion having the first interval C1 are provided. If the imaging element package 51 and the intermediate member 52 can be joined by spanning the opposing surface 56 with the first adhesive layer 67 in the X-axis direction, the bonding notch (58) is attached to the imaging element package 51. The adhesive notches 58 may not be provided, and are not limited to the first embodiment described above.

  In the first embodiment described above, each adhesive notch 65 for forming the second adhesive layer 68 is provided on the holding member 53. However, the second intermediate facing surface 61 and the first holding surface having the second interval C2 are provided. If the intermediate member 52 and the holding member 53 can be joined by spanning the inner surface 63 with the second adhesive layer 68 in the Y-axis direction, this adhesive notch (65) is provided in the intermediate member 52. Alternatively, the adhesive notch portions 65 may not be provided, and are not limited to the first embodiment described above.

  Next, an image sensor fixing structure 50A according to Example 2 of the present invention and a digital camera 10 using the same will be described with reference to FIG. The second embodiment is an example in which the configuration of the image sensor fixing structure 50A is different from the first embodiment. Since the basic configuration of the image sensor fixing structure 50A according to the second embodiment is the same as that of the image sensor fixing structure 50 according to the first embodiment, the same reference numerals are given to portions having the same configuration, and the details thereof are described. Description is omitted. Further, since the digital camera 10 of the second embodiment is the same as the digital camera 10 of the first embodiment except that the image sensor fixing structure 50A is used, the description thereof is omitted. FIG. 10 is an explanatory diagram similar to FIG. 4 for describing the configuration of the image sensor fixing structure 50A according to the second embodiment.

  The image sensor fixing structure 50A according to the second embodiment includes an image sensor package 51, an intermediate member 52A, and a holding member 53A as shown in FIG. The image sensor package 51 has the same configuration as that of the first embodiment.

  The intermediate member 52A has two intermediate piece portions 69 formed from a flat plate-like member. In the second embodiment, both intermediate piece portions 69 have a thickness dimension in the Z-axis direction that is smaller than that of the image sensor package 51. Since both the intermediate piece portions 69 have a line-symmetric configuration with respect to the Y axis, they are basically the same configuration. Therefore, the intermediate piece portion 69 arranged on the X axis direction positive side will be described below. The other intermediate piece 69 is omitted.

  The intermediate piece portion 69 has a main body portion 69a that has a long plate shape extending in the Y-axis direction, and a mounting arm portion 69b that protrudes from the intermediate position in the longitudinal direction to the positive side in the X-axis direction. The main body portion 69a has a rectangular shape as a whole when viewed in the Z-axis direction. The main body portion 69a forms a first intermediate facing surface 56A along the YZ plane on the outer surface that defines the outer shape on the X axis direction negative side. The attachment arm portion 69b has a rectangular shape as a whole when viewed in the Z-axis direction. The mounting arm portion 69b forms a second intermediate facing surface 61A along the XZ plane with a pair of outer surfaces defining the outer shape in the Y-axis direction, and defines the outer shape on the positive side in the X-axis direction. A third intermediate facing surface 62A along the YZ plane is formed on the outer surface. In the intermediate member 52A, an intermediate reference position 59A is provided at the end on the Y axis direction positive side of the main body portion 69a in both intermediate piece portions 69.

  Both intermediate piece portions 69 as the intermediate member 52A are arranged on both sides of the image pickup device package 51 as viewed in the X-axis direction, with the first intermediate facing surface 56A facing the first element outer surface 54. For this reason, in the intermediate member 52A, nothing is present at a position facing the second element outer surface 55 of the imaging element package 51 in the Y-axis direction. In other words, there is nothing in the intermediate member 52A that constitutes a surface corresponding to the fourth intermediate facing surface 57 of the first embodiment. For this reason, in the intermediate member 52A, the size as viewed in the Y-axis direction is set smaller than that of the intermediate member 52 of the first embodiment.

  The holding member 53A is formed of a flat plate member. In the second embodiment, the holding member 53 </ b> A has a thickness dimension in the Z-axis direction that is smaller than that of the imaging element package 51. The holding member 53A has a rectangular shape as a whole when viewed in the Z-axis direction, and is provided with an arrangement hole 53Aa penetrating in the Z-axis direction at the center. The holding member 53A and the arrangement hole 53Aa provided therein are smaller in size in the Y-axis direction than the intermediate member 52A in the intermediate member 52A in the first embodiment. Compared with the arrangement hole 53a), the size as viewed in the Y-axis direction is set smaller. The arrangement hole 53Aa has a rectangular shape that follows the outer shape of the intermediate member 52A with the image pickup device package 51 interposed as viewed in the Z-axis direction, and has a larger size than the intermediate member 52A. Each side of the arrangement hole 53Aa extends along the X-axis direction and the Y-axis direction, and a pair of receiving cutouts 53b are provided at an intermediate position along the Y-axis direction.

  The both receiving cutouts 53b have a rectangular shape as viewed in the Z-axis direction, and each side thereof extends along the X-axis direction and the Y-axis direction. The both receiving cutouts 53b are sized so that both mounting arm portions 69b of the intermediate member 52A can be received at intervals. For this reason, the holding member 53A has a frame shape that can surround the intermediate member 52A with the image pickup device package 51 interposed, as viewed in the XY plane.

  On the wall surface defining both receiving notches 53b, the first holding of each pair of the second intermediate facing surfaces 61A that are located at the position in the Y-axis direction and that are defined by the mounting arm portion 69b is opposed to each other in the Y-axis direction. The inner side surface 63A. Further, on the wall surface that defines both receiving notches 53b, the surface that is present at the position in the X-axis direction and that faces the third intermediate facing surface 62A defined by the attachment arm portion 69b in the X-axis direction is the second holding inner surface 64A. And

  In the holding member 53A, the size dimensions of the arrangement hole 53Aa and the both receiving cutouts 53b are set as follows. In the arrangement hole 53Aa, as viewed in the X-axis direction, a first interval C1A is set between each first intermediate facing surface 56A and each first element outer surface 54 in the intermediate member 52A with the image pickup device package 51 interposed therebetween. The size is such that it can be performed. The first interval C1A is set in consideration of the material and amount of the adhesive disposed between each first intermediate facing surface 56A and each first element outer surface 54 to form the first adhesive layer 67A. . Unlike the first adhesive layer 67 of the first embodiment, the first adhesive layer 67A is formed between each first intermediate facing surface 56A and each first element outer surface 54. Therefore, the first interval C1A is defined between each first intermediate facing surface 56A and each first element outer surface 54 with reference to the amount of adhesive applied once in the dispenser (not shown) of the first embodiment. When the adhesive for the first adhesive layer 67A is disposed on the first adhesive layer 67A, the adhesive has a substantially uniform thickness dimension (Z-axis direction) between each first intermediate facing surface 56A and each first element outer surface 54. The height is set to a size that can be passed over. In the second embodiment, the first interval C1A is set to 0.3 mm.

  Further, in both receiving notches 53b, each first holding inner side surface 63A has a second interval C2A when viewed in the Y-axis direction from each second intermediate facing surface 61A of the mounting arm portion 69b of the intermediate member 52A facing each other. It is supposed to be placed opposite. That is, both receiving notches 53b are sized so as to receive the mounting arm portion 69b of the intermediate member 52A while placing the second gap C2A on both sides as viewed in the Y-axis direction. The second distance C2A is set in consideration of the material and amount of the adhesive disposed between the first holding inner side surface 63A and the second intermediate facing surface 61A so as to form the second adhesive layer 68A. Unlike the second adhesive layer 68 of the first embodiment, the second adhesive layer 68A is formed between the first holding inner side surface 63A and the second intermediate facing surface 61A. For this reason, the second interval C2A is defined between the first holding inner side surface 63A and the second intermediate facing surface 61A on the basis of the amount of adhesive applied once in the dispenser (not shown) of the first embodiment. 2 When the adhesive for the adhesive layer 68A is disposed, the adhesive has a substantially uniform thickness dimension (high in the Z-axis direction) between the first holding inner side surface 63A and the second intermediate facing surface 61A. The size is set such that it can be crossed over. In the second embodiment, the second distance C2A is set to 0.3 mm.

  Further, in both receiving notches 53b, the second holding inner side surface 64A is spaced from the third intermediate facing surface 62A of the mounting arm portion 69b of the intermediate member 52A facing each other with a fourth interval C4 when viewed in the X-axis direction. It is supposed to be opposite. That is, both receiving cutouts 53b have a size that can receive the intermediate member 52A (intermediate piece portion 69) with the image pickup device package 51 interposed while placing the fourth gap C4 on both sides viewed in the X-axis direction. Has been. The fourth interval C4 is the same as that in the first embodiment, and is set to 0.8 mm.

  In addition, in the arrangement hole 53Aa, the imaging element package 51 is interposed regardless of the position of the imaging element package 51 that can be moved by the first distance with respect to the intermediate member 52A (intermediate piece portion 69) when viewed in the Y-axis direction. The size of the intermediate member 52A (intermediate piece 69) is set to a size that can be received. In this holding member 53A, a holding reference position 66A is provided at a position where it does not interfere with the arrangement hole 53Aa including both receiving notches 53b.

  In this imaging element fixing structure 50A, as an operation corresponding to step S1 of the fixing method of Embodiment 1 (see FIG. 8), both intermediate pieces 69 are arranged in the X-axis direction with the imaging element package 51 interposed. Further, as an operation corresponding to step S2, the intermediate reference position 59A of both intermediate piece portions 69 and the outer shape (each first element outer surface 54) of the imaging element package 51 are set in a predetermined positional relationship. Further, as an operation corresponding to step S3, the intermediate reference position 59A of both the intermediate piece portions 69 and the center position Rc of the light receiving surface 16a of the image pickup device 16 of the image pickup device package 51 are predetermined in the Y-axis direction. Positional relationship. Next, as an operation corresponding to step S4, an adhesive is disposed between each first intermediate facing surface 56A and each first element outer surface 54 that are set to the first interval C1, and these are hung in the X-axis direction. A first adhesive layer 67A to be passed is formed. As an operation corresponding to step S8, an adhesive is disposed between each first holding inner side surface 63A and each second intermediate facing surface 61A, which is set to the second interval C2A, and is passed over in the Y-axis direction. Two adhesive layers 68A are formed. Except for these, in the imaging element fixing structure 50A, the imaging element (imaging element package 51) can be fixed as in the imaging element fixing structure 50 of the first embodiment.

  The image sensor fixing structure 50A (digital camera 10) of the second embodiment is basically the same as the image sensor fixing structure 50 (digital camera 10) of the first embodiment, and is basically the same as that of the first embodiment. The effect of can be obtained.

  In addition, in the image sensor fixing structure 50A (digital camera 10) of the second embodiment, nothing exists in the intermediate member 52A at a position facing the pair of second element outer surfaces 55 of the image sensor package 51 in the Y-axis direction. Since there is nothing to do, compared with the intermediate member 52 of Example 1, the size dimension seen in the Y-axis direction can be made small. Thereby, in the image sensor fixing structure 50A, compared with the image sensor fixing structure 50 of the first embodiment, the size as viewed in the Y-axis direction as the second direction can be reduced, and the configuration is more compact. can do.

  Therefore, in the imaging element fixing structure 50A according to the present invention, the imaging element package can be fixed at an appropriate position with respect to the holding member without causing an increase in the thickness dimension.

  Next, an image sensor fixing structure 50B according to Example 3 of the present invention and a digital camera 10 using the same will be described with reference to FIG. The third embodiment is an example in which the configuration of the image sensor fixing structure 50B is different from the first and second embodiments. The basic configuration of the image sensor fixing structure 50B of the third embodiment is the same as that of the image sensor fixing structure 50 of the first embodiment, and the first direction and the second direction in the image sensor fixing structure 50A of the second embodiment. Therefore, the same reference numerals are given to parts having the same configuration, and detailed description thereof is omitted. Further, since the digital camera 10 of the third embodiment is the same as the digital camera 10 of the first embodiment except that the imaging element fixing structure 50B is used, the description thereof is omitted. FIG. 11 is an explanatory diagram similar to FIG. 4 for describing the configuration of the image sensor fixing structure 50B according to the third embodiment.

  As shown in FIG. 11, the image sensor fixing structure 50B according to the third embodiment includes an image sensor package 51, an intermediate member 52B, and a holding member 53B. The image sensor package 51 has the same configuration as that of the first embodiment.

  The intermediate member 52B has the same configuration as the intermediate member 52A of the second embodiment, and includes two intermediate piece portions 69B. Both the intermediate piece portions 69B are configured to be line symmetric with respect to the X axis. Therefore, in the intermediate member 52B, the first intermediate facing surface 56B along the XZ plane is formed on the outer surface that defines the outer shape of the main body portion 69a in the Y-axis direction. Further, in the intermediate member 52B, a pair of second intermediate facing surfaces 61B along the YZ plane is formed on the pair of outer surfaces that define the outer shape in the X-axis direction of the attachment arm portion 69b, and the Y-axis direction A third intermediate facing surface 62B along the XZ plane is formed on the outer surface that defines the outer shape. Further, in the intermediate member 52B, an intermediate reference position 59B is provided at the end on the X axis direction positive side of the main body portion 69a in both intermediate piece portions 69B.

  Both intermediate piece portions 69B as the intermediate member 52B are disposed on both sides of the image pickup device package 51 as viewed in the Y-axis direction, with the first intermediate facing surfaces 56B facing each other. For this reason, in the image sensor fixing structure 50B, in the image sensor package 51, the pair of outer surfaces present at the positions in the Y-axis direction become the first element outer surfaces 54B, and the pair of outer surfaces present at the positions in the X-axis direction. The side surface becomes the second element outer surface 55B. Further, in the intermediate member 52B of the image sensor fixing structure 50B, nothing is present at a position facing the second element outer surface 55B of the image sensor package 51 in the X-axis direction. In other words, there is nothing in the intermediate member 52B that constitutes a surface corresponding to the fourth intermediate facing surface 57 of the first embodiment. For this reason, in the intermediate member 52B, the size as viewed in the X-axis direction is set smaller than that of the intermediate member 52 of the first embodiment.

  The holding member 53B has the same configuration as that of the holding member 53A of the second embodiment. The holding member 53B has a rectangular shape as viewed in the Z-axis direction, and is provided with an arrangement hole 53Ba penetrating in the Z-axis direction at the center. The arrangement hole 53Ba has a rectangular shape that follows the outer shape of the intermediate member 52B with the image pickup device package 51 interposed as viewed in the Z-axis direction, and has a larger size than the intermediate member 52B. Each side of the arrangement hole 53Ba extends along the X-axis direction and the Y-axis direction, and a pair of receiving cutouts 53Bb is provided at an intermediate position along the X-axis direction.

  Both receiving cutouts 53Bb have a rectangular shape as a whole when viewed in the Z-axis direction, and each side thereof extends along the X-axis direction and the Y-axis direction. Both receiving cutouts 53Bb are sized so that both mounting arm portions 69b of the intermediate member 52B can be received at intervals. For this reason, the holding member 53B has a frame shape that can surround the intermediate member 52B with the image pickup device package 51 interposed, as viewed in the XY plane.

  On the wall surface that defines both receiving cutouts 53Bb, the first holding surfaces of the pair of second intermediate facing surfaces 61B that are located in the X-axis direction and that are defined by the mounting arm portion 69b are opposed to each other in the Y-axis direction. It is set as the inner side surface 63B. Further, on the wall surface that defines both receiving notches 53Bb, the surface that exists at a position in the Y-axis direction and that opposes the third intermediate facing surface 62B defined by the mounting arm portion 69b in the Y-axis direction is the second holding inner surface 64B. And

  In the holding member 53B, the size of the arrangement hole 53Ba and the receiving notches 53Bb thereof are set as follows. In the arrangement hole 53Ba, the first gap C1B is set between each first intermediate facing surface 56B and each first element outer surface 54B in the intermediate member 52B with the image pickup device package 51 interposed as viewed in the Y-axis direction. The size is such that it can be performed. The first interval C1B is set in consideration of the material and amount of the adhesive disposed between each first intermediate facing surface 56B and each first element outer surface 54B so as to form the first adhesive layer 67B. . This first adhesive layer 67B is formed between each first intermediate facing surface 56B and each first element outer surface 54B, similarly to the first adhesive layer 67A of the second embodiment. For this reason, the first interval C1B is defined between the first intermediate facing surface 56B and the first element outer surface 54B with reference to the amount of adhesive applied once in the dispenser (not shown) according to the first embodiment. When an adhesive for the first adhesive layer 67B is disposed therebetween, the adhesive has a substantially uniform thickness dimension (Z-axis) between each first intermediate facing surface 56B and each first element outer surface 54B. It is set to a size that allows it to be crossed by the height dimension seen in the direction). In the third embodiment, the first interval C1B is set to 0.3 mm.

  Further, in both receiving notches 53Bb, each first holding inner side surface 63B has a second interval C2B when viewed in the X-axis direction from each second intermediate facing surface 61B of the mounting arm portion 69b of the intermediate member 52B facing each other. It is supposed to be placed opposite. That is, both receiving notches 53Bb are sized so as to be able to receive the mounting arm portions 69b of the intermediate member 52B while placing the second gap C2B on both sides viewed in the Y-axis direction. The second distance C2B is set in consideration of the material and amount of the adhesive disposed between the first holding inner side surface 63B and the second intermediate facing surface 61B so as to form the second adhesive layer 68B. Similar to the second adhesive layer 68A of the second embodiment, the second adhesive layer 68B is formed between the first holding inner side surfaces 63B and the second intermediate facing surfaces 61B. For this reason, the second interval C2B is defined between the first holding inner side surface 63B and the second intermediate facing surface 61B with reference to the amount of adhesive applied once in the dispenser (not shown) of the first embodiment. When the adhesive for the two adhesive layers 68B is disposed, the adhesive has a substantially uniform thickness dimension (high as viewed in the Z-axis direction) between the first holding inner side surface 63B and the second intermediate facing surface 61B. The size is set such that it can be crossed over. In the third embodiment, the second interval C2B is set to 0.3 mm.

  Further, in both receiving notches 53Bb, the second holding inner side surfaces 64B are spaced from the third intermediate facing surface 62B of the mounting arm portion 69b of the intermediate member 52B facing each other with a fourth interval C4 when viewed in the Y-axis direction. Are supposed to face each other. That is, both receiving notches 53Bb are sized so as to receive the intermediate piece portion 69B of the intermediate member 52B with the image pickup device package 51 interposed, with the fourth gap C4 being placed on both sides as viewed in the Y-axis direction. ing. The fourth interval C4 is the same as that in the first embodiment, and is set to 0.8 mm.

  In addition, in the arrangement hole 53Ba, the imaging element package 51 is interposed regardless of the position of the imaging element package 51 that can be moved by the first distance with respect to the intermediate member 52B (intermediate piece portion 69B) when viewed in the X-axis direction. The intermediate member 52B (intermediate piece portion 69B) is made to have a size that can be received. In the holding member 53B, a holding reference position 66B is provided at a position where the holding member 53B does not interfere with the arrangement hole 53Ba including both the receiving notches 53Bb.

  In the imaging element fixing structure 50B, as an operation corresponding to step S1 of the fixing method of the first embodiment (see FIG. 8), both intermediate piece portions 69B are arranged with the imaging element package 51 interposed in the Y-axis direction. Further, as an operation corresponding to step S2, the intermediate reference position 59B of both intermediate piece portions 69B and the outer shape (each first element outer surface 54B) of the imaging element package 51 are set in a predetermined positional relationship. Further, as an operation corresponding to step S3, the intermediate reference position 59B of both the intermediate piece portions 69B and the center position Rc of the light receiving surface 16a of the image sensor 16 of the image sensor package 51 are predetermined in the X-axis direction. Positional relationship. Next, as an operation corresponding to step S4, an adhesive is disposed between each first intermediate facing surface 56B and each first element outer surface 54B having the first interval C1B, and these are hung in the Y-axis direction. A first adhesive layer 67B to be passed is formed. Next, as an operation corresponding to step S8, an adhesive is disposed between each first holding inner side surface 63B and each second intermediate facing surface 61B set to the second interval C2B, and these are hung in the X-axis direction. A second adhesive layer 68B to be passed is formed. Except for these, in the imaging element fixing structure 50B, the imaging element (imaging element package 51) can be fixed as in the imaging element fixing structure 50 of the first embodiment.

  The imaging element fixing structure 50B (digital camera 10) of the third embodiment is basically the same as the imaging element fixing structure 50 (digital camera 10) of the first embodiment, and is basically the same as that of the first embodiment. The effect of can be obtained.

  In addition, in the image sensor fixing structure 50B (digital camera 10) of the third embodiment, there is nothing in the intermediate member 52B at a position facing the second element outer surface 55B of the image sensor package 51 in the X-axis direction. Therefore, the size as viewed in the X-axis direction can be reduced as compared with the intermediate member 52 of the first embodiment. Thereby, in the image sensor fixing structure 50B, compared with the image sensor fixing structure 50 of the first embodiment, the size as viewed in the X-axis direction as the second direction can be reduced, and a more compact configuration can be achieved. can do.

  Therefore, in the imaging element fixing structure 50B according to the present invention, the imaging element package can be fixed at an appropriate position with respect to the holding member without causing an increase in the thickness dimension.

  In each of the above-described embodiments, the image sensor fixing structures 50, 50A, and 50B as examples of the image sensor fixing structure according to the present invention have been described. However, the light receiving surface includes an image sensor that acquires a subject image on the light receiving surface. An image pickup device package that has a rectangular shape when viewed in the optical axis direction orthogonal to the pair, and a pair of element outer faces that exist on a first direction orthogonal to the optical axis direction in the image pickup device package and that face each other at a first interval. An intermediate member that defines a first intermediate facing surface and that allows a relative first distance movement of the imaging device package in a second direction orthogonal to the first direction while orthogonal to the optical axis direction; A first adhesive layer that spans and joins the outer surface of the element and the first intermediate facing surface, and a pair of the intermediate member that faces the pair of second intermediate facing surfaces that exist in the second direction at a second interval. Holding inside surface And a second adhesive that spans and joins the holding member that allows the relative movement of the intermediate member in the first direction by the second distance, and the second intermediate facing surface and the holding inner surface. An imaging device fixed, wherein the first interval is set to be smaller than a half value of the first distance, and the second interval is set to be smaller than a half value of the second distance. Any structure can be used, and the present invention is not limited to the above embodiments.

  In each of the above-described embodiments, the imaging element fixing structures 50, 50A, and 50B as examples of the imaging element fixing structure according to the present invention have been described. However, between the imaging element package 51 and the intermediate member 52, the imaging element is fixed. 16 (imaging device package 51) can be adjusted by the first adhesive layer 67 at a predetermined first interval C1 in the first direction while the position in the second direction can be adjusted, and can be held by the intermediate member 52. The second adhesive layer 68 can be joined to the member 53 at a predetermined second interval C2 in the second direction while adjusting the position of the image sensor 16 (image sensor package 51) in the first direction. It should just be said, and it is not limited to each above-mentioned example.

  Further, in each of the above-described embodiments, the ultraviolet curable adhesive is used as the adhesive for forming the first adhesive layer 67 and the second adhesive layer 68. However, the imaging element package 51 and the intermediate member (52, etc.) Or the intermediate member (52 and the like) and the holding member (53 and the like) are not limited to the above-described embodiments.

  In each of the above-described embodiments, the digital camera 10 has been described. However, if the image sensor fixing structure (50, 50A, 50B) according to the present invention is used, a so-called PDA (personal data assistant), a mobile phone, or the like It may be an electronic device as a portable information terminal device or an electronic device as an image input device, and is not limited to the above-described embodiments. This is because the above-mentioned electronic devices incorporating camera functions have recently appeared, and such electronic devices have substantially the same functions and configurations as the digital camera 10 although their appearances are slightly different. It is because there are a lot of things.

  As described above, the image sensor fixing structure of the present invention has been described based on each embodiment. However, the specific configuration is not limited to each embodiment, and design changes and additions are possible without departing from the gist of the present invention. Etc. are allowed.

10 Digital camera (as an example of an imaging apparatus) 50, 50A, 50B Imaging element fixing structure 51 Imaging element package 52, 52A, 52B Intermediate member 53, 53A, 53B Holding member 54, 54B First element outer surface 55, 55B First Two element outer surfaces 56, 56A, 56B First intermediate facing surface 57 Fourth intermediate facing surface 59, 59A, 59B Intermediate reference position 61, 61A, 61B Second intermediate facing surface 62, 62A, 62B Third intermediate facing surface 63, 63A, 63B First holding inner surface 64, 64A, 64B Second holding inner surface 66, 66A, 66B Holding reference position 67, 67A, 67B First adhesive layer 68, 68A, 68B Second adhesive layer C1, C1A, C1B First 1 interval C2, C2A, C2B 2nd interval C3 3rd interval (for 1st distance) C4 4th interval Rc Center position

JP 2006-094444 A

Claims (8)

An image pickup device package including an image pickup device for acquiring a subject image on a light receiving surface and exhibiting a rectangular shape when viewed in an optical axis direction orthogonal to the light receiving surface;
The imaging device package defines a pair of first intermediate facing surfaces opposed to a pair of element outer surfaces existing in a first direction orthogonal to the optical axis direction at a first interval, and is orthogonal to the optical axis direction while An intermediate member that allows a relative first distance movement of the imaging device package in a second direction orthogonal to the first direction;
A first adhesive layer that spans and joins the element outer surface and the first intermediate facing surface;
The intermediate member defines a pair of holding inner side surfaces facing the pair of second intermediate facing surfaces present in the second direction at a second interval, and the intermediate member is positioned relative to the intermediate member in the first direction. A holding member that allows movement of two distances;
A second adhesive layer that spans and joins the second intermediate facing surface and the holding inner surface;
The first interval is set to be smaller than a half value of the first distance,
2. The imaging element fixing structure according to claim 1, wherein the second interval is set to be smaller than a half value of the second distance. The holding member has a pair of second holding inner side surfaces that exist in the first direction with the holding inner side surface as a first holding inner side surface,
2. The imaging element fixing structure according to claim 1, wherein the intermediate member has a pair of third intermediate facing surfaces facing the second holding inner side surfaces in the first direction. In the imaging element package, the element outer surface is a first element outer surface, and a pair of second element outer surfaces existing in the second direction are as follows:
3. The image sensor fixing structure according to claim 1, wherein the intermediate member has a pair of fourth intermediate facing surfaces facing the second element outer surface in the second direction. 4. The first distance is the second direction between the image pickup device package and the intermediate member so that the center position of the image pickup device and the intermediate reference position in the intermediate member have a predetermined positional relationship when viewed in the second direction. Allow relative movement to
The second distance is determined in the first direction between the intermediate member and the holding member so that the center position of the image sensor and the holding reference position of the holding member are in a predetermined positional relationship when viewed in the first direction. The image sensor fixing structure according to any one of claims 1 to 3, wherein the relative movement of the imaging element is allowed. The first adhesive layer has the first interval between the first intermediate facing surfaces facing the element outer surfaces as viewed in the first direction, and the first adhesive layer as viewed in the second direction. As a predetermined positional relationship between the center position of the image sensor and the intermediate reference position in the intermediate member, the image sensor package and the intermediate member are joined,
The second adhesive layer has the second interval between the second intermediate facing surfaces and the holding inner surfaces facing the second intermediate facing surfaces when viewed in the second direction, and the second adhesive layer is viewed in the first direction. The intermediate member and the holding member are joined together with a center position of the imaging element and a holding reference position of the holding member as a predetermined positional relationship. The image sensor fixing structure according to the item.   An image pickup apparatus comprising the image pickup device fixing structure according to claim 1.   6. An electronic device, wherein the imaging element fixing structure according to claim 1 is mounted. An imaging element fixing method using the imaging element fixing structure according to any one of claims 1 to 5,
The image sensor package and the intermediate member are moved relative to each other in the first direction, and each first intermediate facing surface facing each element outer surface is set as the first interval, and A first step of relatively moving the image pickup device package and the intermediate member in the second direction so that a center position of the image pickup device and an intermediate reference position in the intermediate member are in a predetermined positional relationship;
A second step of forming the first adhesive layer by disposing an adhesive between the outer surface of the element and the first intermediate facing surface while maintaining the positional relationship of the first step;
The intermediate member and the holding member to which the image pickup device package is fixed are relatively moved in the second direction so that the second intermediate facing surfaces and the holding inner side surfaces facing the second intermediate facing surfaces are respectively In addition to the second interval, the intermediate member and the holding member are relatively moved in the first direction so that the center position of the image sensor and the holding reference position of the holding member are in a predetermined positional relationship. 3 steps,
And a fourth step of forming the second adhesive layer by disposing an adhesive between the second intermediate facing surface and the holding inner side surface while maintaining the positional relationship in the third step. An image sensor fixing method.