JP2007049369A - Holding structure of image sensor package, and lens unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easy-to-assemble holding structure of an image sensor package in which heat can be dissipated efficiently from a solid state image sensor, and to provide a lens unit employing that holding structure, and a digital camera for attaching that lens unit. <P>SOLUTION: In the lens unit 4, a holding member 23, a mounting substrate 24, an image sensor package 22, and a heat transfer member 25 are incorporated sequentially in the rear end of a lens barrel 20 holding a photography lens, and a lens side mount 8 is secured to the lens barrel 20 by means of screws. The image sensor package 22 is fitted in a recess 38 of the holding member 23, and a contact 34 of the image sensor package 22 is connected with a connection terminal 41. When the lens side mount 8 is secured to the lens barrel 20, a seating portion 52 presses the heat transfer member 25 forward and the abutment surface 25a of the heat transfer member 25 adheres substantially entirely to the back 22a of the image sensor package 22. Consequently, the image sensor package 22 is positioned in the recess 38 and the heat transfer member 25 conducts heat generated from the a solid state image sensor 33 to the lens side mount 8 where heat is dissipated efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a holding structure for an image pickup device package in which a solid-state image pickup device is enclosed, and a lens unit using the holding structure.

  In recent years, digital cameras that convert captured images captured using a solid-state imaging device such as a CCD into digital image data and record them in a recording medium such as a built-in memory or a memory card have become widespread. Among digital cameras, there are an integrated type in which a photographing lens is integrated with a camera body, and an interchangeable lens type in which various photographing lenses are detachably attached to the camera body.

  As a new configuration of an interchangeable lens digital camera, it has been studied to incorporate a solid-state imaging device on the interchangeable lens side. This eliminates the need to optically connect the interchangeable lens and the camera body, and it is only necessary to electrically connect them via the mount portions provided on the interchangeable lens side and the camera body side, so that the structure is relatively The advantage that it can be simplified can be obtained.

On the other hand, solid-state image sensors used in digital cameras have been increasing in the number of pixels and the density of pixels has been increasing, so a high heat generation temperature has become a problem, and the heat generated from this solid-state image sensor is becoming a problem. Since there is a problem that an image captured due to the influence is deteriorated or noise is generated, a structure for dissipating heat generated from the solid-state imaging device has been considered. For example, in Patent Document 1, a Peltier element is brought into close contact with the back surface of a solid-state image sensor, and heat is conducted by conducting heat from a heat transfer plate attached to the heat radiation surface of the Peltier element to a fixing bracket for fixing the solid-state image sensor. Is described. Further, Patent Document 2 describes a configuration in which a temperature sensor is provided in an imaging unit, and heat is released by driving a Peltier element directly attached to the back surface of the solid-state imaging element based on a temperature signal from the temperature sensor. . Moreover, in patent document 3, the heat-transfer member is each attached to the back surface of several solid-state image sensor, These heat-transfer members are being individually fixed to the fixing member provided in the mutually spaced position, and heat transfer A configuration is described in which heat from a solid-state imaging device is conducted to a fixed member through a member to dissipate heat.
JP 9-37161 A Japanese Patent Laid-Open No. 2005-20229 Japanese Patent Laid-Open No. 2001-119615

  However, in Patent Documents 1 and 2, the use of Peltier elements is expensive. Furthermore, since it is necessary to incorporate a drive circuit for driving the Peltier element into the lens barrel or the camera body, the apparatus becomes large and the assemblability deteriorates. Furthermore, in Patent Document 2, since a temperature sensor is provided in the imaging unit and the Peltier element is driven based on the detection result of the temperature sensor, complicated control is also required. Moreover, in patent document 3, the terminal protruded in the back direction is provided in the side surface of the solid-state image sensor. For this reason, the heat transfer member attached to the back surface of the solid-state imaging device must be made small so as not to come into contact with the terminals, so that it is difficult to sufficiently conduct heat to the fixing member.

  The present invention is for solving the above-mentioned problem, efficiently dissipating heat generated from a solid-state image sensor, and an image sensor package holding structure that is easy to assemble, and a lens unit using the holding structure, and An object is to provide a digital camera to which this lens unit is attached.

  The image sensor package holding structure of the present invention is a holding structure for holding an image sensor package in which a solid-state image sensor is enclosed in a housing, and a contact provided on at least one of the front surface or the side surface of the image sensor package; A holding member that is incorporated in the body and has a recess into which the image pickup device package is fitted from the front side, and a connection terminal that is connected to the contact when the image pickup device package is fitted into the recess; And a pressing member for positioning the image pickup device package in the recess by pressing the front side in contact with the back surface of the image pickup device package. Further, it is preferable that the pressing member includes an elastic member having an abutting surface that comes into contact with the back surface of the imaging element package, and a heat radiating member that comes into contact with the back side of the elastic member.

  A lens unit according to the present invention includes a lens barrel that holds a photographic lens, and an image sensor package that is disposed behind the lens barrel and encloses a solid-state image sensor, and is detachably attached to a camera body. In the unit, a contact provided on at least one of the front surface or the side surface of the image sensor package, a recess that is incorporated in the lens barrel, and the image sensor package is fitted from the front side, and the image sensor package is in the recess. A holding member having a connection terminal that is connected to the contact when fitted, and heat transfer, and abuts against the back surface of the image sensor package and presses the image sensor package in the recess. And a pressing member for positioning. Further, the pressing member is in contact with the elastic body having an abutting surface that contacts the back surface of the imaging device package, and the back surface side of the elastic body, and at least a part of the heat radiation is exposed to the outside of the lens barrel. It is preferable to provide a member. Further, the connection terminal is connected to a wiring pattern constituting a circuit for driving the solid-state imaging device.

  In the holding structure for the image pickup device package according to the present invention, the contact provided on at least one of the front surface or the side surface of the image pickup device package, the recess incorporated in the housing, and the image pickup device package being fitted from the front side, and the image pickup device A holding member having a connection terminal that is connected to a contact when the package is fitted in the recess, and has heat conductivity, and abuts against the back surface of the image sensor package and presses the image sensor package in the recess. Therefore, there is no need to provide a contact point on the back surface of the image pickup device package. Therefore, the area where the heat transfer member is brought into close contact with the back surface of the image pickup device package can be increased, so that heat can be efficiently radiated. Furthermore, since the solid-state imaging device and the drive circuit are electrically connected by fitting the imaging device package into the recess, the assembly can be easily performed. The housing is a lens barrel or a camera body.

  Further, in the lens unit of the present invention, the contact provided on at least one of the front surface or the side surface of the image sensor package, a recess that is incorporated in the lens barrel, and the image sensor package is fitted from the front side, and the image sensor package is a recess. A holding member having a connection terminal connected to the contact when fitted into the contact, and heat conductivity, and abuts against the back surface of the imaging device package and presses it forward to position the imaging device package in the recess. Since the pressing member is provided, it is not necessary to provide a contact point on the back surface of the imaging element package. Therefore, the area where the heat transfer member is brought into close contact with the back surface of the image pickup device package can be increased, so that heat can be efficiently radiated. Furthermore, since the solid-state imaging device and the drive circuit are electrically connected by fitting the imaging device package into the recess, the assembly can be easily performed.

  In addition, since the pressing member includes an elastic body having an abutting surface that abuts against the back surface of the imaging element package and a heat radiating member that abuts against the back surface side of the elastic body, heat generated from the solid-state imaging element more efficiently. Can be dissipated.

  Since the connection terminal is connected to the wiring pattern of the drive circuit that drives the solid-state image sensor, the solid-state image sensor and the drive circuit are electrically connected by fitting the image sensor package into the recess. There is no need to reconnect the contacts and the wiring pattern. Therefore, the assemblability is also improved.

  Hereinafter, a digital camera to which the present invention is applied will be described with reference to the drawings. As shown in FIGS. 1 and 2, the digital camera 2 includes a camera body 3 and a lens unit 4. A lens unit 4 is detachably attached to the camera body 3, and the camera body 3 and the lens unit 4 are electrically connected when mounted. 1 shows a state in which the lens unit 4 is attached to the camera body 3, and FIG. 2 shows a state in which the lens unit 4 is removed.

  The lens unit 4 is provided with a lens side mount portion 8, and the lens side mount portion 8 is formed with three lens side bayonet claws 9 (see FIG. 3). The lens side bayonet claw 9 is provided with a contact 60 (see FIG. 3). A body-side mount portion 10 is provided on the front surface of the camera body 3. A bayonet groove 11 is provided in the body side mount portion 10. Further, a mount lid 12 urged forward by a coil spring (not shown) is provided inside the body-side mount portion 10 to prevent dust from entering the camera body 3 when the lens unit 4 is not attached. To do.

  When the lens unit 4 is attached to the camera body 3, the mount lid 12 is pushed in and rotated with the bayonet claws 9 aligned with the bayonet grooves 11. When the lens unit 4 is rotated by a predetermined angle, the lock pin 13 of the body side mount portion 10 engages with a pin hole (not shown) of the lens side mount portion 8 so that the lens unit 4 is positioned and attached to the body side mount portion 10. . Further, as the lens unit 4 is positioned, the contact 60 (see FIG. 3) of the lens side mount portion 8 is connected to the contact (not shown) of the body side mount portion 10 provided inside the mount lid 12.

  Further, a lock release button 14 is provided in the vicinity of the body side mount portion 10. The lock release button 14 is operated when the lens unit 4 is removed, and the lock pin 13 can be moved rearward by pressing to release the engagement with the pin hole.

  On the upper surface of the camera body 3, there are provided a release button 16 that is pressed during shooting and a mode operation unit 17 that is operated when switching between shooting and playback modes. Further, a strobe 18 is provided on the front surface of the camera body 3, and an LCD, a power switch, and the like on which a captured image and various setting conditions (not shown) are displayed are provided on the rear surface.

  As shown in FIGS. 2 and 3, the lens unit 4 includes a lens barrel 20, a photographing lens 21, an image sensor package 22, a holding member 23, a mounting substrate 24, a heat transfer member 25, and a lens side mount portion 8. ing. The lens barrel 20 has a photographing lens 21 held inside one end thereof. As shown in FIG. 3, the image sensor package 22, the holding member 23, the mounting substrate 24, the heat transfer member 25, and the lens side mount portion 8 that is a heat radiating member are integrally incorporated inside the other end side.

  As shown in FIGS. 4 and 5, the image pickup device package 22 includes a semiconductor substrate 28, a frame member 29 bonded to the semiconductor substrate 28 with an adhesive, and a frame bonded to the frame member 29. It is composed of a cover glass 30 or the like that encloses the inside of the member 29. The semiconductor substrate 28 is obtained by dicing a silicon wafer, and a solid-state image sensor 33 is formed at the center of the upper surface. The solid-state image sensor 33 is composed of a large number of photodiodes and a CCD, for example. RGB color filters, microlenses, and the like are stacked on each photodiode.

  The frame member 29 is made of an inorganic material, such as silicon or ceramic, and is formed in a square shape surrounding the solid-state image sensor 33. The frame member 33 joins its lower surface and the semiconductor substrate 28 with an adhesive. Moreover, the cover glass 30 is joined to the upper surface, and the upper surface and the cover glass 30 form the same plane. The cover glass 30 is made of a transparent α-ray shielding glass in order to prevent destruction of the CCD photodiode. And the space | gap between the solid-state image sensor 33 and the cover glass 30 is provided so that the condensing capability by a micro lens may not be reduced. A wiring layer connected to the solid-state image sensor 33 is formed inside the semiconductor substrate 28. The frame member 29 is provided with a conductive portion connected to the wiring layer, and a plurality of contacts 34 are exposed at the side edge of the frame member 29. Note that six contacts 34 are exposed as contacts on the upper surface of the frame member 29, but the present invention is not limited to this, and it is preferable to set the necessary number of terminals 31 appropriately. The same plane formed from the frame member 28 and the cover glass 30 is defined as the front surface of the image sensor package 22, and the surface of the semiconductor substrate 28 on which the solid-state image sensor 33 is not formed is defined as the back surface of the image sensor package 22.

  As shown in FIG. 3, the holding member 23 has a substantially disk shape, and its outer diameter is substantially the same as the inner diameter of the lens barrel 20. A concave portion 38 into which the image pickup device package 22 is fitted from the front surface side is provided at the center of the one surface 23 a of the holding member 23, and the concave portion 38 protrudes to the other surface side of the holding member 23. The recess 38 substantially matches the outer shape of the image sensor package 22. Further, the recess 38 is formed with an opening 39 through which subject light from the photographing lens 21 passes toward the solid-state image sensor 33. The subject light that has passed through the opening 39 is imaged by the solid-state image sensor 33. A connection terminal 41 is continuously provided from the peripheral edge 40 of the opening 39 to one surface 23 a of the holding member 23. One end of the connection terminal 41 disposed on the peripheral edge portion 40 is connected to each of the contacts 34 provided on the front surface of the image pickup device package 22 when the image pickup device package 22 is fitted into the recess 38. The other end of the connection terminal 41 arranged on one surface 23a is a wiring pattern 24a formed on the mounting board 24 when the mounting board 24 is attached so as to cover the holding member 23 from the rear (see FIG. 6). Connect with. In addition, a through hole 44 is formed in the holding member 23 in accordance with the position of a screwing boss 43 (see FIG. 7) provided in the lens barrel 20.

  The mounting substrate 24 is a thin plate having a substantially circular shape, and an opening 45 that is slightly larger than the image pickup device package 22 is formed at the center, and control for driving the image pickup device package 22 on one surface facing the holding member 23. Wiring patterns such as circuits and various electronic components are incorporated. The mounting board 24 exposes the back surface 22a of the image pickup device package 22 fitted in the recess 38 from the opening 45, and aligns the notch 46 with the position of the screwing boss 43 (see FIG. 7). It is arranged so as to cover. As a result, the connection terminal 41 comes into contact with the wiring pattern 24 a formed on the mounting substrate 24, and the solid-state imaging device 33 is electrically connected to the wiring pattern 24 a via the contact 34 and the connection terminal 41.

  As shown in FIG. 6, for example, an elastic member such as a silicon sheet having a high thermal conductivity is used for the heat transfer member 25. The heat transfer member 25 has a shape slightly smaller than the back surface of the image pickup device package 22. When the lens-side mount portion 8 to be described later is attached to the lens barrel 20, the heat transfer member 25 causes the contact surface 25a to be in close contact with the back surface of the image pickup device package 22, and heat generated from the solid-state image pickup device 33 is mounted on the lens side mount. Conduct to part 8. In addition, although the silicon sheet was used as the heat-transfer member 25, it is not restricted to this, You may use the elastic member which has electrothermal properties, such as a sheet | seat which consists of an acryl-type rubber and an ethylene propylene-type rubber.

  As shown in FIGS. 3 and 6, the lens side mount portion 8 that is a heat radiating member includes a mount base 50, a bayonet claw 9, a contact board 54, a pressing plate 55, and the like. A cylindrical portion 50a is integrally provided on one side of the mount base 50, and a bayonet claw 9 is formed on the cylindrical portion 50a so as to protrude from the outer periphery. For example, three bayonet claws 9 are formed at rotationally symmetric positions at equal angular intervals of 120 degrees, for example. A through hole 59 is formed in the mount base 50 at a position corresponding to a screw boss 43 provided in the lens barrel 20. A screw 58 is inserted into the through hole 59, and the screw boss 43 is inserted. The lens side mount portion 8 is attached to the lens barrel 20 by screwing the screw 58 into the lens barrel 20.

  The contact substrate 54 is formed in a shape substantially similar to the side surface of the cylindrical portion 50a. A plurality of contacts 60 used for electrical connection with the camera body 3 side are mounted on the contact board 54, and are electrically connected to the mounting board 24 by a flexible board (not shown). Further, the holding plate 55 is formed to be slightly smaller than the contact board 54. The holding plate 55 fixes the contact substrate 54 to the cylindrical portion 50a. The lens side mount portion 8 is assembled by sandwiching the contact substrate 54 between the cylindrical portion 50a and the holding plate 55 and screwing the screws 62 into the screwing bosses 56 (see FIG. 7) provided on the mount base portion 50. . The number of contacts 60 mounted on the contact board 54 may be as many as necessary to have a sufficient communication speed between the camera body 3 side and the lens unit 4. It is preferable to provide it. In addition, although three bayonet claws 9 are provided on the outer periphery of the cylindrical portion 50a, the number of bayonet claws 9 is not limited to this, and may be two or four or more.

  As shown in FIG. 6, a pedestal 52 is provided at the center of the other side of the mount base 50. The pedestal portion 52 is formed in a substantially rectangular shape that matches the size of the heat transfer member 25, and is integrated with the mount base 50 by the connecting portion 53. When the through hole 59 formed in the mount base 50 is aligned with the screwing boss 43 and the lens side mount portion 8 is fixed to the lens barrel 20 with the screw 58, the front surface 52 a of the pedestal portion 52 is attached to the heat transfer member 25. The back surface 25b is pressed forward. At this time, the contact surface 25 a of the heat transfer member 25 is in close contact with the back surface 22 a of the image pickup device package 22, the heat transfer member 25 is crushed by the image pickup device package 22 and the pedestal portion 52, and the image pickup device package 22 is in the recess 38. Positioned with. Note that the pedestal 52 is preferably formed of a metal having high thermal conductivity such as aluminum or copper. In addition to aluminum, it may be made of ceramic or plastic having high thermal conductivity in addition to metal such as copper. The heat transfer member 25 and the lens side mount portion 8 constitute a pressing member.

  Next, the effect | action by the said structure is demonstrated. As described above, the holding member 23, the image pickup device package 22, the mounting substrate 24, and the heat transfer member 25 are sequentially assembled on the other end side of the lens barrel 20 that holds the photographing lens 21 on one end side, and the lens barrel 20. The lens unit 4 is fixed by fixing the lens side mount portion 8 to the lens unit 4. As shown in FIG. 7, when the lens side mount portion 8 is fixed to the lens barrel 20, the back surface 25 b of the heat transfer member 25 is pressed forward by the front surface 52 a of the pedestal portion 52. As a result, the heat transfer member 25 is crushed, and the contact surface 25a is brought into close contact with almost the entire back surface 22a of the imaging element package 22. Further, since the image pickup device package 22 is pressed forward by the heat transfer member 25 and the lens side mount portion 8, the image pickup device package 22 is positioned in the recess 38. Thereby, the connection terminal 41 provided on the peripheral edge portion 40 of the opening 39 and the contact 44 provided on the front surface of the imaging element package 22 are reliably connected. In addition, the mounting substrate 24, the heat transfer member 25, and the lens side mount portion 8 are sequentially arranged behind the image pickup device package 22 fitted in the recess 38, and the lens side mount portion 8 is fixed to the lens barrel 20. As a result, since the solid-state imaging device 33 and the control circuit are electrically connected, the lens unit 4 can be easily assembled.

  When the lens unit 4 is attached to the camera body 3 and the photographing mode is selected and photographing is performed, the solid-state imaging device 33 is continuously driven. As a result, the solid-state image sensor 33 gradually generates heat. Since the heat transfer member 25 is in close contact with the back surface 22a of the image pickup device package 22 incorporated in the lens unit 4, the heat conducted through the pedestal portion 52 is radiated from the lens side mount portion 8 to the outside. Is done. Thereby, the lens unit 4 can obtain a sufficient heat dissipation effect.

  In the above-described embodiment, the contact 34 is exposed on the front surface of the image sensor package 22, and the connection terminal 41 and the contact 34 provided on the peripheral edge 40 of the opening 39 when the image sensor package 22 is fitted into the recess 38. However, instead of this, a contact is provided extending from the front surface to the side surface of the image pickup device package 22, and provided on the side surface of the image pickup device package 22 when the image pickup device package 22 is fitted into the recess 38. The contact point provided may be connected to a connection terminal provided in the recess 38. The configuration of the image pickup device package in this case is shown in FIGS. In addition, the same code | symbol is attached | subjected to the member of the same structure as the said embodiment, and the description is abbreviate | omitted.

  FIG. 8 is an external perspective view of the image sensor package 65, and FIG. 9 is a cross-sectional view of the image sensor package 65. The image pickup device package 65 includes a semiconductor substrate 28 on which the solid-state image pickup device 33 is formed at the center of the upper surface, a frame member 29, a cover glass 30, and an L-shaped terminal 66 having an L shape. The frame member 29 surrounds the solid-state imaging device 33 with an adhesive and is bonded to the semiconductor substrate 28. The cover glass 30 is bonded to the frame member 29, and the solid-state imaging device 33 is enclosed by the cover glass 30 and the frame member 29. Further, the upper surface of the frame member 29 and the cover glass 30 form the same plane. The frame member 29 is provided with a conductive portion 67 connected to a wiring layer formed on the semiconductor substrate 28, and is connected to an L-shaped terminal 66 serving as a contact point on the front surface of the frame member 29. The L-shaped terminal 66 is disposed along the side surface from the upper surface of the frame member 29, one surface is connected to the conductive portion 67, and the surface orthogonal to the one surface is brought into contact with the side surface of the frame member 29. ing.

  As shown in FIG. 10, the holding member 23 incorporated in the lens barrel 20 is provided with an L-shaped connection terminal 68 provided continuously from one surface 23 a of the holding member 23 to the inner surface of the recess 38. ing. When the image pickup device package 65 is fitted into the recess 38, the L-shaped terminal 66 disposed on the upper surface of the frame member 29 and the peripheral edge portion 40 of the opening 39 come into contact with each other, and the L-shaped terminal 66 disposed on the side surface of the frame member 29 The connection terminal 68 is connected to the side surface of the recess 38. When the mounting board 24 is assembled after the holding member 23, the connection terminals 68 arranged on the one surface 23 a side of the holding member 23 are connected to the wiring pattern 24 a constituting the control circuit formed on the mounting board 24. Connected. Thereby, the solid-state imaging device 33 and the control circuit are electrically connected via the L-shaped terminal 66 and the connection terminal 68. After that, when the heat transfer member 25 is arranged on the back surface 65a side of the image pickup device package 65 and the lens side mount portion 8 is screwed to the lens barrel 20, the back surface 25b of the heat transfer member 25 is moved by the front surface 52a of the pedestal portion 52. Pressed. As a result, the contact surface 25a of the heat transfer member 25 is in close contact with almost the entire back surface 65a of the image sensor package 65, and the image sensor package 65 is reliably positioned in the recess 38. Therefore, the heat conducted from the heat transfer member 25 to the lens side mount portion 8 is radiated to the outside.

  Further, if the mounting position and accuracy of the image pickup device package 65 are poor and the light receiving surface of the solid-state image pickup device 33 is inclined with respect to the optical axis of the shooting lens 21, so-called tilting occurs, the shooting image quality is deteriorated. Therefore, in the present embodiment, when the imaging device package 65 is fitted in the recess 38, the peripheral portion of the opening 39 so that the imaging surface of the solid-state imaging device 33 is substantially perpendicular to the optical axis of the imaging lens 21. 40 and an L-shaped terminal 66 provided on the upper surface of the image pickup device package 65 are formed. Thereby, when the lens side mount portion 8 is fixed to the lens barrel 20, the image pickup device package 65 is pressed and positioned in the recess 38. At this time, since the L-shaped terminal 66 reliably contacts the peripheral edge portion 40, the occurrence of tilt can be prevented. Therefore, better image quality can be obtained.

  In the above-described embodiment, the heat transfer member 25 and the lens side mount portion 8 are individually provided to constitute the pressing member. However, the present invention is not limited to this, and the heat transfer member 25 is formed integrally with the lens side mount portion 8. Thus, the pressing member may be configured.

  In the above embodiment, the lens unit 4 and the camera body 3 are mounted by a bayonet-type mount coupling that meshes with each other's bayonet claws 9, and the contacts 60 are brought into contact with each other for electrical connection during the mounting. Although the configuration is taken as an example, the present invention is not limited to this, and the lens unit 4 and the camera body 3 are provided with a coupling portion in which one is a female connector and the other is a male connector. 4 may be connected to each other by a connector to connect the internal contacts.

  In addition, the image pickup device package holding structure of the present invention is used for the lens unit. However, the present invention is not limited to this, and the image pickup device package holding structure is used for an integrated digital camera in which the photographing lens is integrated with the camera body. Also good.

It is an external perspective view of a digital camera with a lens unit attached. It is an external perspective view of the digital camera with the lens unit removed. It is a disassembled perspective view which shows the structure of the holding member of a lens unit. It is an external appearance perspective view of an image pick-up element package. It is side surface sectional drawing which shows the structure of the image pick-up element package provided with the contact on the front. It is a disassembled perspective view which shows the structure of a lens side mount part. It is principal part sectional drawing of the lens side mount part incorporating the image pick-up element package. It is an external appearance perspective view of the image pick-up element package using an L-shaped terminal. It is side surface sectional drawing which shows the structure of the image pick-up element package using an L-shaped terminal. It is principal part sectional drawing of the lens side mount part incorporating the image pick-up element package using an L-shaped terminal.

Explanation of symbols

2 Digital camera 3 Camera body 4 Lens unit 8 Lens side mount unit 20 Lens barrel 21 Shooting lens 22 Image sensor package 23 Holding member 25 Heat transfer member 25a Contact surface 33 Solid-state image sensor 34 Contact point 38 Recess 41 Connection terminal

Claims (5)

In a holding structure for holding an image sensor package enclosing a solid-state image sensor in a housing,
A contact point provided on at least one of the front surface and the side surface of the imaging device package;
A holding member that is incorporated in the housing and has a recess into which the image pickup device package is fitted from the front side, and a connection terminal that is connected to the contact when the image pickup device package is fitted into the recess;
A holding member for an imaging device package, comprising: a pressing member that has heat conductivity and positions the imaging device package in the concave portion by pressing forward against the back surface of the imaging device package Construction.   The image pickup device according to claim 1, wherein the pressing member includes an elastic member having a contact surface that contacts the back surface of the image pickup device package, and a heat dissipation member that contacts the back surface side of the elastic member. Package holding structure. A lens barrel that holds the taking lens;
In a lens unit that is disposed behind the lens barrel and includes an image sensor package that encloses a solid-state image sensor, and is detachably attached to the camera body.
A contact point provided on at least one of the front surface and the side surface of the imaging device package;
A holding member incorporated in the lens barrel and having a recess into which the imaging device package is fitted from the front side, and a connection terminal connected to the contact when the imaging device package is fitted into the depression;
A lens unit comprising a pressing member that has heat conductivity and positions the image pickup device package in the recess by abutting against a back surface of the image pickup device package and pressing it forward.   The pressing member includes an elastic body having a contact surface that contacts the back surface of the imaging element package, and a heat dissipation member that contacts the back surface side of the elastic body and at least a part of which is exposed to the outside from the lens barrel. The lens unit according to claim 3, wherein the lens unit is provided. 5. The lens unit according to claim 3, wherein the connection terminal is connected to a wiring pattern constituting a circuit for driving the solid-state imaging device.

Images