JP2003324635A - Image pickup device unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image pickup device unit which can be attached highly precisely to a component such as a lens barrel. <P>SOLUTION: The image pickup device unit 10 comprises a covering glass 11, a spacer 12, a CCD chip 13 and a base member 14 stacked in layers. Holes 15 to 18 are formed on projecting parts 12a and 12b of the spacer 12. The front faces of the projecting parts 12a and 12b are tightly pressed to an internal surface of a flange portion 23a of a lens barrel 23 in such a way that bosses 24 and 25 formed on the flange portion 23a are inserted in the holes 15 and 16, respectively. With this, an optical axis L of a taking lens 22 is positioned precisely perpendicular to a light receiving surface 13a of the CCD chip 13 giving a predetermined space to the taking lens 22. Then, screws 28 and 29 are inserted through the holes 17 and 18 and screwed in screw holes 26 and 27 of the flange portion 23a, the image pickup device unit 10 is thereby fixed to the flange portion 23a. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device unit that can be attached to a member to be attached such as a lens barrel with high accuracy.

[0002]

2. Description of the Related Art In recent years, in the bodies of digital cameras and video cameras which have been rapidly popularized, CCD images for photoelectrically converting an image optically formed on a light receiving surface to output a time-series image signal. An image pickup device such as a sensor (hereinafter abbreviated as CCD) is incorporated.

Since such an image pickup device cannot be directly incorporated into a camera as a bare chip (bare chip), as described in, for example, Japanese Patent Application Laid-Open No. 11-330442, a bare chip (hereinafter referred to as CCD) of a CCD. A chip) is bonded to the inner bottom surface of the recess of the package to form an image pickup device unit, which is incorporated in the flange portion of the lens barrel or the like.

However, the size of the image pickup device unit is large, which is disadvantageous in reducing the size of the camera. Therefore, an opening is formed in a circuit board on which peripheral circuits such as a video signal scanning system and a processing system are mounted, and an image pickup device unit is inserted into the opening to minimize the thickness of the circuit board including the image pickup device unit. It is known that the circuit board is fixed at a certain position and this circuit board is incorporated into the camera body (Japanese Patent Laid-Open No. 5-176208).

The image pickup device unit described in this publication includes a photographing lens, a lens barrel, a transparent member such as an optical filter, and a CC.
Film carrier for propagating input / output signals of D chip, C
The CD chips are sequentially attached. When fixing this to the circuit board, insert the image sensor unit into the opening of the circuit board so that its optical axis is perpendicular to the circuit board, and then attach the leads of the film carrier to the circuit board. After that, the edge portion of the opening of the circuit board and the side surface of the lens barrel or the transparent member are fixed with an adhesive.

[0006]

In order for a subject image to be accurately formed on the light receiving surface of the image pickup device, the image pickup device unit must be accurately fixed with its optical axis perpendicular to the circuit board. There is. However, when soldering the leads of the film carrier to the circuit board, and subsequently when fixing with the adhesive, how to maintain the verticality of the optical axis of the image pickup element with respect to the circuit board with high accuracy, The specific means is not disclosed in the above-mentioned Japanese Patent Laid-Open No. 5-176208, and is unknown.

It is an object of the present invention to provide an image pickup device unit which can be mounted on a mounted member such as a lens barrel with high accuracy.

[0008]

In order to achieve the above object, an image pickup device unit of the present invention includes a cover glass for protecting the light receiving surface of the image pickup device from dust and the like, and a space between the light receiving surface and the cover glass. In an image pickup device unit including a plate-shaped spacer member that forms a predetermined interval, the spacer member has a protrusion that protrudes from at least two locations on the outer contour of the image pickup device, and the attached member is attached to the protrusion. It is provided with a positioning means used for positioning with.
Further, the image pickup device has a light receiving surface and an opening portion that is joined to the light receiving surface side of the image pickup device and exposes the light receiving surface.
A plate-shaped spacer member having a protruding portion protruding from the location, a positioning means provided on the protruding portion and used for positioning with a member to be attached, and an opening portion of the spacer member, and a protruding portion of the spacer member The cover glass is fixed to the spacer member so as to protrude from the outer shell. Further, the positioning means is a hole into which the protrusion provided on the mounted member is inserted. Further, in addition to the positioning means, a hole used for screwing the spacer member to the attached member is formed in the protruding portion.

[0009]

1 shows an embodiment of the present invention, an image pickup device unit 10 is a plate-shaped cover glass 1
1, a ceramic plate-like spacer 12, a CCD chip 13 as an image pickup element, and a glass base member 14 are sequentially laminated in layers. Image sensor unit 10
Are manufactured by a well-known wafer process.

In the wafer process, first, the base member 14
A glass plate serving as a substrate, a CCD chip wafer having a large number of CCD chips 13 arranged in a matrix, a ceramics plate serving as a spacer 12, and a glass plate serving as a cover glass 11 are sequentially layered. After this, cutting is performed so that both ends of the spacer 12 protrude from two portions of the outer shape of the rectangular cover glass 11, the CCD chip 13, and the base member 14 which face each other to form protrusions 12a and 12b. Be seen.

After that, the projections 12a and 12b have holes 15 and 16 as positioning means and a hole 1 for screwing.
7 and 18 are formed respectively. In addition, an opening 12c exposing the light receiving surface 13a of the CCD chip 13 is formed in advance in the central portion of the spacer 12 (at the stage of the ceramic plate before being stacked in layers). The holes 15 and 16 are symmetrical with respect to the opening 12c.

A large number of microlenses 19 are mounted on the light receiving surface 13a of the CCD chip 13 (see FIG. 2).
reference). The microlens 19 is arranged above each light receiving element of the CCD chip 13 in order to improve the light collection rate.

The spacer 12 is provided so that the cover glass 11 and the CCD chip 13 are separated from each other so that the cover glass 11 does not press the microlens 19, and the submicron dust adhering to the cover glass 11 is CCD. The image of the chip 13 should not be reflected. Therefore, it is preferable that the spacer 12 is thick. Moreover, in order to reduce the overall thickness of the image pickup element unit 10, it is preferable that the cover glass 11 be thin.

Further, the light receiving surface 13a and the front surface (the side to which the cover glass 11 is adhered) and the rear surface (CCD) of the spacer 12 are provided.
The spacer 12 is formed to have a uniform thickness so as to be completely parallel to the chip 13 and the bonding side). Further, a plurality of solder ball terminals 20 are provided on the lower surface of the base member 14, and the CCD is connected via wires 21.
It is electrically connected to the chip 13. An arrangement in which a large number of terminals 20 are arranged in a grid is known as a ball grid array.

Image sensor unit 1 having such a configuration
0 is fixed to the flange portion 23a of the lens barrel 23 incorporating the taking lens 22. As shown in FIG. 2, the flange portion 23a formed at the rear end portion of the lens barrel 23 to which the image pickup device unit 10 is attached has a protrusion 12a,
Bosses 24 and 25 corresponding to the holes 15 and 16 of 12b and screw holes 26 and 27 corresponding to the holes 17 and 18 are formed. In FIG. 2, the cross section of the hole 15 in the protrusion 12a and the cross section of the hole 18 in the protrusion 12b are drawn by solid lines.

The bosses 24 and 25 are inserted into the holes 15 and 16, respectively, so that the protrusions 12a and 1 of the spacer 12 are formed.
When the front surface of 2b is pressed against the inner wall surface of the flange portion 23a, the photographing optical axis L of the photographing lens 22 is accurately perpendicular to the light receiving surface 13a of the CCD chip 13, and the photographing lens 2
The distance from 2 becomes a predetermined distance. After this, screws 28, 29
The screw holes 2 of the flange portion 23a by inserting the screw holes 2 into the holes 17 and 18.
When screwed in 6, 27, the image pickup device unit 10 is fixed to the flange portion 23a.

After this, the image pickup device unit 10 is pressed from the base member 14 side to the lens barrel 23 side by the leaf spring 32 with the flexible substrate 31 interposed therebetween. As a result, the terminals 20 come into contact with the printed contacts of the flexible board 31, and the CCD chip 13 is connected to the flexible board 31.
Electrically connected to. Although not shown, the flexible substrate 31 is provided with peripheral circuits for driving the CCD chip 13.

When the image pickup device unit 10 is fixed to the flange portion 23a of the lens barrel 23, no load is applied to the cover glass 11 and the CCD chip 13, so that the cover glass 11 and the CCD chip 13 may be damaged. There is no.

In the embodiment described above, the terminals of the CCD chip 13 are provided on the back surface of the chip opposite to the light receiving surface 13a, and the terminals and the terminals 20 are electrically connected by the wires 21. The present invention is not limited to this, and as shown in FIG.
The chip 34 has a terminal 36 on the chip surface 34 a on the light receiving surface 35 side, and the terminal 36 and the terminal 20 of the base member 14 are provided.
And are electrically connected via a wire 37. In addition,
Like the spacer 12, the projections 38a and 38b of the spacer 38 are provided with holes 39 and 40 as positioning means. Similarly to the spacer 12, the protrusions 38a and 38b may be screwed to the flange portion of the lens barrel, but may be fixed by being sandwiched between the flange portion and another member.

Next, referring to FIG. 4 showing another image pickup device unit, in the image pickup device unit 41, the size of the CCD chip 42 is relatively smaller than that of the base member 43, and the CCD chip 42 is formed in the opening 44a of the spacer 44. The whole is stored. The opening 44a is covered with a cover glass 45. In addition, the wire 4 is provided along the edge of the base member 43.
6 is provided.

The wire 46 has one end arranged near the CCD chip 42 in the opening 43a and the other end connected to the solder ball terminal 20 provided on the lower surface of the base member 43. The CCD chip 42 is the well-known gold wire 4.
7 is electrically connected to one end of the wire 46 by wire bonding. In addition, the protruding portion 4 of the spacer 44
Like the spacer 38, holes 4 and 49 are formed in 4b and 44c as positioning means.

Next, referring to FIG. 5 showing another image pickup device unit, the image pickup device unit 50 uses a CCD chip 51 which is relatively smaller than the base member 43, and uses the base member 4 as a base member.
A circuit board 52 for driving the CCD chip 51 is provided between the CCD 3 and the CCD chip 51. The CCD chip 51 is mounted on the surface of a circuit board 52, and the circuit board 52 has wires 53.
It is connected to the terminal 20 via.

Next, referring to FIG. 6 showing another image pickup element unit, the image pickup element unit 55 uses a CCD chip 56 which is relatively smaller than the base member 43 and uses the base member 4.
A circuit board 57 for driving the CCD chip 56 is provided between the CCD 3 and the CCD chip 56. The CCD chip 56 is wire-bonded to a printed terminal 58 formed on the surface of the circuit board 57, and the circuit board 57 and the terminal 20 are connected via a wire 59.

In the embodiment described above, the protruding portions of the spacers are projected from the two opposite sides of the CCD chip, but the present invention is not limited to this. For example, the spacer projections may be projected from the entire circumference of the CCD chip in a brim shape. You may Also,
As the positioning means, the holes are formed in the protrusions, but the present invention is not limited to this, and for example, protrusions may be formed. In this case, a concave portion corresponding to the convex portion is provided on the flange portion of the lens barrel.

In the above embodiment, the spacer is made of ceramics, but the present invention is not limited to this and may be made of aluminum, hard plastic or the like. Although the base member is made of glass, it may be made of, for example, hard plastic as long as the material has rigidity and insulating properties. Further, in the above embodiment, the CCD chip was used as the image pickup element, but the present invention is not limited to this.
For example, a CMOS chip may be used.

[0026]

As described above, according to the image pickup device unit of the present invention, the image pickup device, the spacer member, and the cover glass are provided in layers, and the protrusions of the spacer member are provided at least at two opposite positions of the outer contour of the image pickup device. Since the protruding portion of the protruding spacer member is provided with the positioning means, the lens barrel or the like can be attached to the attached member with high accuracy. If the positioning means is a hole into which the protrusion provided on the member to be attached is inserted, the lens barrel or the like can be attached to the member to be attached with high precision with a very simple structure. Further, if a hole for screwing is formed in the projecting portion, it can be fixed to the mounted member with an extremely simple structure.

[Brief description of drawings]

FIG. 1 is a perspective view showing an external appearance of an image pickup device unit embodying the present invention.

FIG. 2 is a cross-sectional view showing a state in which an image pickup device unit is attached to a flange portion of a lens barrel.

FIG. 3 is an end view showing another imaging element unit.

FIG. 4 is an end view showing another imaging element unit using a CCD chip relatively smaller than the base member.

FIG. 5 is an end view showing an image pickup device unit in which a circuit board is provided between a CCD chip and a base member.

FIG. 6 is an end view showing another image pickup device unit in which a circuit board is provided between a CCD chip and a base member.

[Explanation of symbols]

10, 33, 41, 50, 55 Image sensor unit 11, 45 Cover glass 12, 38, 44 Spacer 12a, 12b, 38a, 38b, 44b, 44c Projection part 13, 34, 42, 51, 56 CCD chip 13a, 35 Light-receiving surface 14,43 Base members 15-18, 39, 40, 48, 49 Holes 20, 36 Terminal 23 Lens barrel 23a Flange portion

Claims (4)

[Claims] 1. An image pickup device unit comprising: a cover glass for protecting a light receiving surface of the image pickup device from dust and the like; and a plate-shaped spacer member for forming a predetermined space between the light receiving surface and the cover glass. The image pickup device unit, wherein the spacer member has a projecting portion that projects from at least two locations on the outer contour of the image pickup device, and the projecting portion is provided with positioning means used for positioning with the member to be attached. 2. An image pickup device having a light-receiving surface, and an opening portion which is joined to the light-receiving surface side of the image pickup device and exposes the light-receiving surface, and which protrudes from at least two opposite positions of the outer contour of the image pickup device. A plate-like spacer member having a portion, a positioning means provided on the protruding portion and used for positioning with the member to be attached, and an opening portion of the spacer member is closed so that the protruding portion of the spacer member protrudes from the outer shell. An image pickup device unit comprising: a plate-shaped cover glass fixed to the spacer member. 3. The image pickup device unit according to claim 1, wherein the positioning means is a hole into which a protrusion provided on the attached member is inserted. 4. The projection, in addition to the positioning means, is formed with a hole used for screwing a spacer member to a mounted member. Or the image pickup device unit described above.