JPH0556917A - Solid-state image pickup device and solid-state image pickup device for endoscope - Google Patents

Abstract

PURPOSE:To mount a scope tip part to a target part with high operability without heightening the height of a solid-state image pickup device being the dimensions in the diameter direction of the scope tip part. CONSTITUTION:The electrode 2 of a CCD 1 for converting light from the image pickup surface of an object to be photographed to an electric signal and the electrode 3 of an FPC 6 having flexibility for supporting the CCD 1 are opposed to each other and they area connected by interposing an electric conductor between them in a cavity provided on the FPC tip part. The connecting part of the electrode is protected from the outside by a resin 4 and cover glass 7. A height component in a direction perpendicular to a scope axis can be shortened remarkably, and the scope diameter can be reduced, therefore, the scope tip part can be mounted on a target part with high operability.

Description

Detailed Description of the Invention

 [Object of the Invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device (CCD) incorporated as an image pickup device in, for example, an endoscope device.

[0002]

2. Description of the Related Art FIGS. 4 and 5 show a conventional structure of an image pickup device incorporated in a distal end portion of an endoscope device. FIG. 6 shows a block diagram showing a general structure of the endoscope apparatus. The endoscope apparatus emits light toward a subject and obtains image data based on the reflected light, a scope 12, an arithmetic processing unit 15 that arithmetically processes the image data from the scope 12 to obtain a television image signal, The monitor 18 receives a television image signal from the arithmetic processing unit 15 and displays it as a photographed image of a subject.

The scope 12 is provided with a CCD 1 at the tip and is CC
A driving / receiving circuit 11 for transmitting / receiving a signal to / from D1 and a light guide 13 for guiding light for irradiating a subject with light.
It consists of and. The arithmetic processing unit 15 includes a light source 14 for sending light to the light guide, a camera processing circuit (CCU) 16 for signal processing, and a digital scan converter (DSC) 17 for converting the output signal into a television image signal.

Next, the peripheral structure of the CCD 1 will be described. It is constructed as shown in FIGS. 4 to 6 to meet the needs unique to the endoscope. That is, the CCD 1 is adhesively fixed in the package 19 made of a substrate such as ceramic. The electrodes of the package 19 and the electrodes of the CCD 1 are electrically connected by the bonding wires 20, which are connected by a plurality of wires 20 as shown in FIG. 5, which is a plan view of FIG.

Further, in order to partially transmit the electric signal propagated from the CCD 1 to the electrodes of the package 19 to the chip component 8 for amplifying, filtering, etc., a printed board comprising an insulating film on which the chip component 8 is mounted and a conductor wiring. The (hereinafter FPC) 6 is superposed on the package 19 and mechanically fixed. The FPC 6 is made of, for example, a film member, and can be bent and extended freely according to the bending of the distal end portion of the endoscope, and is extremely thin. The electrodes of the FPC 6 are soldered to the electrodes of the package 19. That is, in order to electrically connect the CCD 1 and the drive / reception circuit 11, the electrodes of the CCD 1 are passed through the electrodes of the package 19 and F
It is partially connected to a chip component 8 that performs amplification, filtering, etc. through the electrode of the PC 6.

Furthermore, the resin 4 is potted to the FPC 6 and the electrode connection portion of the package 19 for physical and chemical protection. That is, it plays an important role in protecting the electrode from corrosion due to water, acid, alkali, etc. that may enter the tip of the endoscope. The cover glass 7 is attached to protect the CCD image pickup surface, the bonding wire 20, and the like. That is, this bonding wire is a thin wire and is vulnerable to mechanical damage, and is housed in the protective cover glass 7 so as not to easily touch obstacles. The cover glass 7 is transparent so as not to block the reflected light from the subject of the CCD 1.

[0007]

In the conventional apparatus, first of all, the height of the solid-state image pickup device, which is the radial dimension of the distal end of the scope determined by the stacking of the package, bonding wire, cover glass, resin, FPC, etc. Since H becomes high as shown in FIG. 4, the diameter of the distal end portion of the endoscope cannot be made thin, which is an obstacle to improvement. Second, to electrically connect the CCD 1 and the outside, the CCD 1
Since the connection process is required at least twice such as between the package 19 and the package 19 or between the package 19 and the FPC 6, there are problems that the reliability of the connection is low and the number of assembling steps is increased. An object of the present invention is to provide a solid-state imaging device that can be mounted on a target site without increasing the height H of the solid-state imaging device that is the radial dimension of the scope. [Constitution of Invention]

[0008]

The present invention has taken the following means in order to solve the above problems and achieve the object. That is, a CCD for converting light from a subject into an electric signal, a printed board including an insulating film for transmitting the electric signal to an external electric circuit and connecting with the CCD, and a conductor wiring; A resin for protecting the connection portion, an electrode provided on the CCD, an electrode provided on the printed circuit board so as to oppose the electrode, a conductor interposed between the electrode of the CCD and the electrode of the printed circuit board, and It is characterized by comprising an electrode and a light-transmissive member for protecting the conductor from the outside.

[0009]

With this structure, the electrodes provided on the CCD are electrically connected to the electrodes provided on the FPC via the conductors to obtain the electric signal applied to the CCD to the external electric circuit and the CCD. An electric signal is transmitted. Therefore,
Since the bonding wire and the package are not required, the scope diameter can be reduced. Further, since the connecting portion of the electrodes of the CCD and the FPC is protected from the outside by the resin and the light transmitting member, the connecting portion of the electrode can be protected from various obstacles. Also, since the number of connections is reduced, reliability and assemblability are improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the first embodiment of the present invention is shown in FIGS.
Will be described. FIG. 1 is a sectional view of the same embodiment,
It shows a state in which the solid-state imaging device for an endoscope is located at the tip portion of the endoscope. That is, in FIG. 1, the CCD of the device
1 is connected to an FPC 6 located along the central axis of the scope, which is located at the tip of the scope (not shown). In particular, a rectangular cavity 21 is formed at the tip of the FPC 6, and a plurality of FPC electrodes 3 are arranged facing each other in this cavity.

On the other hand, an electrode 2 is provided on the CCD 1 so as to face the FPC electrode 3, and a conductor 5 is interposed between the electrodes 2 and 3, that is, the conductor 5 is stacked in the radial direction of the distal end of the scope. .. In order to seal the cavity 21 from the outside, the light-transmissive cover glass 7 is made of FP.
It is adhesively fixed to C6 at the periphery of the cavity 21. A space between the cover glass 7 and the CCD 1 may be filled with a light-transmissive resin or gas so that the reflected light from the subject can be guided to the CCD 1, and may be a vacuum. With respect to both electrodes 2 and 3, resin 4 is provided so as to protect both electrodes 2 and 3 and conductor 5 from the opposite side of the cover glass.
Seals the CCD 1 and the FPC 6 with, for example, potting means. Next, the electric signal applied to the CCD 1 and the electric signal obtained from the CCD 1 are conducted to an external electric circuit via, for example, the chip component 8 having an amplifying function.

Next, the operation of the embodiment configured as described above will be described. Now, it is assumed that the endoscope scope insertion portion is inserted into, for example, the stomach of the subject. The light reflected from the stomach wall is made incident on the CCD 1 through the cover glass 7 arranged at the distal end of the scope and converted into an electric signal there. This signal is guided from the electrode 2 of the CCD 1 to the electrode 3 of the FPC 6 through the conductor 5 and transmitted to the external circuit via the chip component 8 on the FPC 6. in this case,
The conductor 5 has a low connection resistance, and is made of, for example, gold, and C
It is connected to the CD electrode 2 and the FPC electrode 3. The connection method of the conductor 5 will be described in more detail. The CCD side electrode 2
A solder bump is formed on the AU bump and the FPC side electrode 3, and the connection between the two electrodes 2 and 3 via the conductor 5 is made by thermocompression bonding.

Further, when the CCD 1 is a rectangular parallelepiped, it is arranged inside the scope tip so that its short side is in the height direction perpendicular to the scope axis. In addition, CCD1
The FPC 6 connected to is located parallel to the scope axis. Further, since the FPC electrode 3 projects in parallel with the axis of the scope, it is housed in the cavity portion 21 of the FPC 6. As a result, the arrangement described above minimizes the height H from the lower surface of the cover glass 7 to the upper surface of the CCD 1 perpendicular to the scope axis direction.

Furthermore, since the CCD 1 and the FPC 6 are connected to each other by interposing a conductor between the electrodes, the bonding wire 20 which is conventionally required is no longer required. Also, the cover glass 7 and the resin 4 are CC
Since the main part of the D1 and the FPC 6 is covered and can be protected from various physical and chemical obstacles, the large package 19 unlike the conventional case is not required. As a result of the combination of the various configurations described above, the radial dimension of the endoscope scope insertion portion can be significantly reduced as a result.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view of the same embodiment, in which the film constituting the FPC is partially or entirely transparent so that the reflected light from the subject wall surface is incident on the imaging surface of the CCD 1 in the endoscope solid-state imaging device. Alternatively, a transparent film may be attached separately to the FPC having a through hole.

The FPC electrodes 3 exposed on the upper surface of the light non-transmissive areas 10 on both sides of the light transmissive area 9 are exposed to the CCD.
The CCD 1 is arranged such that the electrode 2 is parallel to the FPC 6 by sandwiching the conductor 5 with the FPC electrode 3 so that the electrodes 2 face each other. In addition, CC by resin 4
The configuration for molding the D1 and the FPC 6 is the same as that of the first embodiment described above, so the description thereof is omitted here.

Next, the operation of the second embodiment constructed as described above will be described. In this embodiment, the reflected light from the subject wall surface passes through the transparent member 9 of the FPC 6 and CC
Since the light is incident on D1, and the electrodes 2 and 3 are protected from the outside by the FPC 6, the cover glass used in the first embodiment is not required. The height component in the direction perpendicular to the scope axis in this embodiment can be greatly shortened as in the first embodiment.

[0018]

According to the present invention, the electrode provided on the CCD is connected to face the electrode provided on the FPC by interposing a conductor therebetween, and the electrical connection portion is made of resin and a light-transmissive member. Since it is configured to be sealed from the outside by,
At least the tip of the scope can be made thin. Further, the number of connection points is reduced, so that the number of processes is reduced and the reliability due to connection is increased. Since the number of members is reduced, the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of a first embodiment of the present invention.

FIG. 2 is a plan view of the embodiment shown in FIG.

FIG. 3 is a sectional view showing a configuration of a second exemplary embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of a conventional example.

5 is a plan view of the conventional example shown in FIG.

FIG. 6 is a block diagram showing a structure of a conventional endoscope apparatus.

[Explanation of symbols]

 1 CCD 2 CCD electrode 3 FPC electrode 4 Resin 5 Conductor 6 FPC 7 Cover glass 21 Cavity

Claims (4)

[Claims] 1. C for converting light from a subject into an electric signal
The CD and the CC for transmitting the electric signal to an external electric circuit.
A printed circuit board including an insulating film connected to D and a conductor wiring, a resin that protects a connecting portion between the CCD and an electrode of the printed circuit board, an electrode provided on the CCD, and a printed circuit board provided facing the electrode. Electrodes and the CCD
A solid-state imaging device comprising a conductor interposed between the electrode of the printed circuit board and the electrode of the printed circuit board, and a light transmissive member that protects both electrodes and the conductor from the outside. 2. The solid-state imaging device according to claim 1, wherein the printed circuit board as a light-transmitting member has a cavity through which light from a subject passes, and the cavity is protected by a cover glass. .. 3. The solid-state imaging device according to claim 1, wherein the printed circuit board as a light transmissive member has a light transmissive area that allows light from a subject to pass therethrough and protects the connection part of the CCD and the electrode of the printed circuit board from the outside. A solid-state imaging device having. 4. A solid-state imaging device for an endoscope, which generates endoscopic image data based on reflected light obtained by illuminating a wall of an object, wherein the reflected light is electrically positioned at the tip of the endoscope. A CCD for converting into a signal, a printed circuit board comprising an insulating film for transmitting the electric signal to an external electric circuit and connecting to the CCD, and a conductor wiring;
A resin that protects the connection between the electrode D of the printed circuit board and the electrode of the printed circuit board; an electrode provided on the CCD; an electrode provided on the printed circuit board so as to oppose this electrode; A solid-state imaging device for an endoscope, comprising a conductor interposed between the electrodes and a light-transmissive member that protects the electrodes and the conductor from the outside.