JP2001104247A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve an imaging device to be easily assembled capable of connecting solid imaging elements of different kinds to a common circuit board. SOLUTION: The size and pitch of flexible leads 44 are the same at the connecting position to a circuit board 42 for a solid imaging element 39 or multi-pixel solid imaging element, and the common circuit board 42 can be connected to the solid imaging element 39 or multi-pixel solid imaging element. Therefore, different kinds of solid imaging elements can be connected to the common circuit board 42 to realize an imaging device which can be assembled easily.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus used for an endoscope and the like, and more particularly, to an image pickup apparatus to which solid-state image pickup devices of different types can be connected.

[0002]

2. Description of the Related Art In recent years, an objective optical system and an image pickup device having a solid-state image pickup device such as a CCD and a circuit board have been arranged in the distal end portion of an endoscope insertion portion, and an endoscope observation image has been electrically connected. 2. Description of the Related Art Electronic endoscopes for obtaining various image signals are widely used. The electronic endoscope has a signal cable connected to an image processing apparatus in which an electric signal obtained by forming an observation image of an observation target site on an imaging surface of the solid-state imaging device by the objective optical system is provided outside the endoscope. The image is converted into an image signal, and the image of the observation target portion is displayed on a monitor for observation.

An image pickup apparatus mounted in a small space such as the distal end portion of the insertion section of the electronic endoscope has a high demand for miniaturization, and has an area as small as possible in the direction of the image pickup plane and a short length in the vertical direction. Things are desired. The distal end of the insertion portion of the electronic endoscope has a hard part due to the objective optical system and the image pickup device built therein, because of these. Therefore, as the length of the imaging device becomes shorter, the length of the distal end hard portion can be made shorter, thereby reducing the pain on the patient at the time of insertion.

Various techniques for reducing the size of such an imaging apparatus have been proposed, for example, in Japanese Patent Application Laid-Open No. H11-47084.
The image pickup device described in Japanese Patent Application Laid-Open Publication No. H10-15064 discloses a solid-state image sensor incorporated in an endoscope end portion and a signal cable connected to the solid-state image sensor, via a substrate arranged in parallel with the solid-state image sensor. What is connected is proposed. On the other hand, for example, PAL (Phase Alte
NTSC (Natinal Televisin) such as rnating Line
When displaying an endoscope image on a display monitor whose television system is different from that of the System Committee system, it is necessary to use different types of solid-state imaging devices such as the PAL system.

[0005] Such different types of solid-state imaging devices are:
The size, pitch, etc. of the plurality of extending terminals differ depending on the type. Therefore, when such different types of solid-state imaging devices are incorporated in an imaging device, a substrate corresponding to the type has been required. Further, in this case, it is necessary to perform an operation corresponding to each type of the solid-state imaging device, which is complicated.

[0006]

As described above, in the conventional imaging apparatus, when various solid-state imaging devices are incorporated according to the use of the endoscope, the size of a plurality of terminals extending from the solid-state imaging device is reduced. It is necessary to use a substrate that matches the pitch and the pitch. In addition, it is necessary to perform an operation corresponding to each type of the solid-state imaging device, which is complicated.

The present invention has been made in view of these circumstances, and an object of the present invention is to provide an image pickup apparatus which can connect different types of solid-state image pickup devices to a common circuit board and has good assemblability.

[0008]

In order to achieve the above object, an image pickup apparatus according to the present invention comprises: a solid-state image pickup device provided with an electric connection portion in a peripheral portion of an image area; a circuit board having electronic components; External terminals connected to the electrical connection part of the element and connecting the circuit board, and the size and pitch of the external terminals at positions connected to the circuit board are different for solid-state imaging devices of different types. And a common circuit board can be connected to the solid-state imaging devices of the different types. With this configuration, different types of solid-state imaging devices can be connected to a common circuit board, and an imaging device with good assemblability is realized.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1 to 11 show a first embodiment of the present invention.
FIG. 1 is an explanatory view showing an entire configuration of an endoscope apparatus provided with an imaging device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of a distal end side of an insertion portion in FIG. FIG. 3 is a cross-sectional view showing the entire configuration of an image pickup apparatus having the first embodiment of the present invention, FIG. 4 is a cross-sectional view taken along line AA of FIG. 3, and FIG. FIG. 6, FIG. 6 is a side view of FIG. 5, FIG. 7 is a cross-sectional view taken along the line BB of FIG. 3, FIG. 8 is a front view of a solid-state image sensor unit before assembly showing a modification of FIG. FIG. 10 is a cross-sectional view showing the overall configuration of an image pickup apparatus provided with a multi-pixel solid-state image sensor, and FIG. 11 is a front view of the multi-pixel solid-state image sensor before assembly in FIG.

As shown in FIG. 1, an endoscope apparatus 1 according to the present embodiment includes, for example, an endoscope 2 for obtaining an observation image of a site to be inspected, and a light source apparatus for supplying illumination light to the endoscope 2. 3
A video processor 4 for controlling the endoscope 2 and performing signal processing on an image signal obtained by the endoscope 2, and a monitor 5 for receiving a video signal output from the video processor 4 and displaying an observation image It is mainly composed of

The endoscope 2 has a distal end portion 6 provided with an illumination optical system and an observation optical system, a bending portion 7 connected to the distal end portion 6 and capable of bending in, for example, up, down, left and right directions. It has an elongated insertion section 9 composed of a flexible section 8 connected to the bending section 7 and having flexibility. An operation section 10 is provided at the base end side of the insertion section 9. A universal cord 11 in which a light guide or the like is inserted is extended from a side portion 10. The endoscope 2 has a universal cord 11
And is detachably connected to the light source device 3 via a light guide connector 11a provided at an end of the signal cable 12 extending from a side of the light guide connector 11a. The video processor 4 is detachably connected to the video processor 4 via the electric connector 12a.

As shown in FIG. 2, the distal end of the light guide 13 inserted into the insertion portion 9 is provided with a base 15 in a through hole forming an illumination window of a rigid distal end body 14 constituting the distal end portion 6. An illumination lens 16 is hermetically fixed to an illumination window which is fixed by soldering or an adhesive via an intermediary surface and has an enlarged diameter so as to face the front end surface. The light guide 13 is constituted by a fiber bundle in which flexible fibers are bundled, and this fiber bundle is covered with a flexible tube 17.

The distal end main body 14 is provided with a through hole having an image pickup window adjacent to the illumination window, and an image pickup device 20 having a function of picking up an image is fixed by screws (not shown) or the like. An imaging cable (or signal cable) 21 for transmitting a captured image (as a transmission body of an electric image) extends from the rear end of the imaging device 20. This imaging cable 21 is covered with a flexible protective tube 22. The imaging cable 21 is inserted into the universal cord 11 from the operation section 10 through the insertion section 9 and is connected to the electric connector 12a.

A first bending piece 23 is fixed to the rear end of the tip body 14 by soldering or the like, and a second bending piece 23 such as a rivet is attached to the rear end of the first bending piece 23. A large number of bending pieces 23 are rotatably connected to each other so as to be connected via a rotatable connection member to form the bending portion 7. The outer circumference of the bending piece 23 is covered with a flexible outer skin 24 such as a rubber tube.
Is also hermetically fixed to the tip body 14.

Illumination light emitted from a lamp (not shown) provided in the light source device 3 passes through the light guide connector 11a, the universal cord 11, and the operation unit 10 and the insertion unit 9 of the endoscope 2. Light guide 1
The illumination light transmitted to the distal end portion 6 via the optical path 3 is transmitted through the illumination lens 16 from the distal end surface to further illuminate the subject side such as a diseased part in front. After the image of the inspection target site obtained by being illuminated by the illumination light is captured by the imaging device 20 provided at the distal end portion 6 and converted into an electric signal,
The electric signal is transmitted to the video processor 4, the video signal is generated by the video processor 4, and the video signal is transmitted to the monitor 5 to display an observation image on a monitor screen. .

The image pickup device 20 can incorporate different types of solid-state image pickup devices such as a solid-state image pickup device having a standard number of pixels and a multi-pixel solid-state image pickup device according to the use of the endoscope. In the present embodiment, a common circuit board is used between an imaging device using a solid-state imaging device having a standard number of pixels and an imaging device having a multi-pixel solid-state imaging device.

First, an imaging apparatus using a solid-state imaging device having a standard number of pixels will be described with reference to FIGS.
As shown in FIG. 3, an imaging device 30 using a solid-state imaging device having a standard number of pixels, which will be described later, includes an objective optical unit 31 as an objective lens system and an imaging unit 32. Are objective lenses 33a, 33b, 33c,
The lens 33 includes a lens frame 34 in which the lenses 33 are fixedly arranged at predetermined positions. A cover glass 35 constituting the imaging unit 32 is provided on the base end side of the outer peripheral surface of the lens frame 34.
Is mounted at the base end. The CCD holder 36 is provided with an optical diaphragm 37.

The image pickup section 32 has a solid-state image pickup element 39 having a rectangular shape and an image area (light receiving section) 38 provided substantially at the center of the distal end face on the objective optical section 21 side. It is mainly constituted by a circuit board 42 which is adhered and fixed to the end face side by an adhesive described later and is formed of a hard material such as ceramic on which the electronic components 41a and 41b are disposed. The electronic component 41a is a buffer amplifier, and is sealed with a sealing resin after flip-chip bonding to the circuit board 42. The electronic component 41a and the solid-state imaging device 39 are bonded and fixed with an electrically insulating adhesive. On the surface of the circuit board 42 opposite to the electronic components 41a, electronic components 4 such as chip capacitors and chip resistors are provided.
1b is connected and fixed with solder. Note that the objective lens 33c is bonded and fixed to the cover glass 25 with an ultraviolet curing optical adhesive so that the objective lens 33c is centered with the image area 38 of the solid-state imaging device 39.

The solid-state image pickup device 39 has a standard number of pixels.
8, about 410,000 pixels capable of outputting an NTSC video signal are provided in a matrix. still,
The solid-state imaging device 39 has the smallest outer shape among a plurality of types of solid-state imaging devices connected to the circuit board 42.

The image area 3 of the solid-state imaging device 39
A pad 43, which is an electrical connection portion of the solid-state imaging device 39, is provided in a peripheral portion of the solid-state imaging device 8, and a flexible lead 44 serving as an external terminal is thermo-compressed or ultrasonic-compressed via a bump 45 to be electrically connected. Have been. The cover glass 35 is adhesively fixed while being sandwiched by the solid-state imaging device 39 around the crimping portion. The space between the cover glass 35 and the solid-state imaging device 39 may be an air layer or an adhesive layer using an optical adhesive.

The flexible lead 44 is formed of a copper foil having a surface plated with gold, and is held by a tape 46 made of polyimide or the like formed so as to cover the flexible lead 44 from both sides.

In this embodiment, the size and pitch of the flexible leads 44 at the positions where they are connected to the circuit board 42 are the same for solid-state imaging devices of different types, so that a common circuit board can be used. The solid-state imaging devices of the different types can be connected to each other.

The CCD holder 36 has a shield case 47 as an outer member formed of a thin stainless steel material.
The shield case 47 allows the internal solid-state imaging device 39, the circuit board 42, and the electronic component 41 to be fitted.
a and 41b are mechanically protected and external electrical noise is shielded. The space inside the shield case 47 is filled with an adhesive so that an adhesive filling portion 4 is formed.
8 are formed. The adhesive filling section 48 is provided over the imaging cable (or signal cable) 21 to prevent disconnection. The adhesive filling portion 48 is formed with an epoxy-based thermosetting adhesive for the purpose of sealing the electrical components around the solid-state imaging device 39. In the present embodiment, the sealing portion is provided for improving the sealing property. Before the thermosetting step, the adhesive is left at room temperature for 3 hours to allow the adhesive to spread to the electrical components, and then thermoset in an atmosphere of 90 ° C.

As shown in FIG.
Is the largest diameter solid-state image sensor 39 among the objective lenses.
Are circumscribed at four points to the objective lens 33c to be joined. A notch 49 is formed in the CCD holder 36 near the position where the objective lens 33c and the shield case 47 are in contact, and the objective lens 33c is exposed and is in contact with the shield case 47. This objective lens 33c has a notch 4
9 are supported by the CCD holder 36 only at locations where no 9 exists. In the present embodiment, the objective lens 3
Although 3c and the shield case 47 are circumscribed at four places, the present invention is not limited thereto, and one place, two places, or three places may be used. Further, the outer shape of the objective lens 33c is not limited to a circular shape, and a non-circular portion may be provided in a part, and the shield case 47 may be in surface contact. Further, a black paint may be applied to each part where the objective lens 33c and the shield case 47 are in contact with each other for the purpose of preventing optical flare and the like.

In the conventional image pickup apparatus, the outer periphery of the objective lens 33c is fitted and supported over the entire periphery with the CCD holder 36, and the shield case 47 is provided further outside the CCD holder 36.
Was fitted to the CCD holder 36, so that the objective lens 3
There is no direct contact between 3c and the shield case 47,
Therefore, although the image pickup apparatus has been increased in size, the objective lens 33 having the largest outer diameter among the objective lenses has the above-described configuration.
Since the shield case 47, which is an outer surrounding member, is provided so as to be in contact with c, the maximum outer shape of the imaging device is formed by the shield case 47, so that the size of the imaging device can be reduced.

The flexible lead 44 is bent to the rear of the image area 38 (see FIG. 9) and is connected to the circuit board. For example, as shown in FIGS. Are connected to pads 43 provided on two sides facing each other, six on each side, a total of 12 pads. These flexible leads 44 extend from the solid-state imaging device 39 in parallel with the image area 38 before assembly. The pad 43 is connected to the solid-state imaging device 39.
Are provided in a row on the two sides, but may be provided on all four sides or on only one side. Also facing two
Instead of the sides, they may be provided on two adjacent sides.

When the flexible lead 44 is bent toward the rear of the image area 38, the width of the flexible lead 44 gradually increases as the distance from the solid-state imaging device 39 increases. The portion of the flexible lead 44 having a larger width outside the tape 46 is provided at an equal width and an equal pitch so as to be connected to the circuit board 42 in a later step.

On the other hand, although not shown, the front view shape of the circuit board 42 is substantially the same as the outer shape of the solid-state image pickup device 39, and a plurality of connection lands are formed on the side portions at the same pitch and the same size as the flexible leads 44. It is provided in.

As a result, the flexible lead 44
Are fixed to the connection lands of the circuit board 42 by soldering, respectively, so that different types of solid-state imaging devices can be connected to a common circuit board.

Here, the pads 43 in the conventional image pickup device shown in FIG. 16 are widely scattered on the peripheral side of the image area 38, so that the flexible leads 44 connected to the pads 43 are also provided. As a result, the width W of the tape 46 holding the flexible lead 44 becomes larger than the width of the solid-state imaging device 39. When the flexible lead 44 held by the tape 46 is bent to the rear of the image area 38 and connected to the circuit board, as shown in FIG.
Of the four corners becomes large. For this reason, by providing the pad 43 on the center side of the periphery of the image area 38 of the solid-state imaging device 39, the flexible lead 44 connected to the pad 43 is also provided in a narrow range. Can be made smaller than the width dimension of the solid-state imaging device 39.

When the flexible lead 44 held on the tape 46 smaller than the width dimension of the solid-state imaging device 39 is bent to the rear of the image area 38 and connected to the circuit board, as shown in FIG. The chamfered portion 50 can be formed at the bottom. Accordingly, when the imaging device 30 is disposed at the endoscope distal end portion 6, for example, other internal components of the endoscope 2 can be disposed at the chamfered portion 50, and the small diameter of the endoscope distal end portion can be achieved. Is possible.

If it is difficult to provide the pad 43 on the center side of the periphery of the image area 38 of the solid-state imaging device 39 for reasons such as the circuit pattern design of the solid-state imaging device 39, FIG. As shown, by cranking the flexible lead 44 in a narrow portion inside the tape 46, the flexible lead 44 outside the tape 46 and the tape 46 connected to the outside is made smaller than the width dimension of the solid-state imaging device 39. Can be. According to this configuration, the flexible lead 44 held by the tape 46 smaller than the width of the solid-state image sensor 39 is also used for the image area 3.
8, when it is bent rearward and connected to the circuit board 42, chamfers 50 can be provided at the four corners of the shield case 47 as described with reference to FIG. Therefore, when this imaging device is arranged at the distal end portion of the endoscope, for example, other internal components of the endoscope can be arranged at the chamfered portion 50,
Similar effects can be obtained.

As described above, the flexible lead 44 connected to the pad 43 of the solid-state imaging device 39 and extending from the side surface of the solid-state imaging device 39 at the same width and the same pitch as shown in FIG. It is bent to the rear of the image sensor 39, that is, to the rear of the image area 38.

Next, as described with reference to FIG.
9 on the side opposite to the image area 38.
The circuit board 42 is adhered and fixed in parallel with the solid-state imaging device 39 via. The plurality of connection lands provided on the circuit board 42 as described above
Since the pitch is the same and the dimensions are the same, the flexible leads 44 can be connected and fixed to the connection lands of the circuit board 42 by soldering.

Next, the configuration of an image pickup apparatus using a multi-pixel solid-state image pickup device will be described with reference to FIGS. FIG.
The imaging device 60 using the multi-pixel solid-state imaging device 61 has substantially the same configuration as the imaging device described with reference to FIG. 3, but the multi-pixel solid-state imaging device 61 has the solid-state imaging device described with reference to FIG. The number of pixels is larger than 39, and the element size is also larger. Although not shown, the multi-pixel solid-state imaging device 61 is provided with about 2.11 million pixels capable of outputting a UXGA-size digital video signal to the image area 38 in a matrix.

As shown in FIG. 11, the pad 43 provided around the image area 38 of the multi-pixel solid-state image sensor 61 is provided at the same gap as the solid-state image sensor 9 shown in FIG. . Therefore, the same flexible lead 44 as that used in FIG. 3 can be used as the flexible lead 44 held on the tape 46. That is, the flexible lead 44 in a portion having a larger width outside the tape 46 to be connected to the circuit board 42 in a later step has the same size and the same size as those connected to the solid-state imaging device 39 described in FIG. It has the same pitch and can be connected to the same circuit board 42 as in the embodiment shown in FIG.

The circuit board 42 is the smallest solid-state image sensor 3 described with reference to FIG.
9, the outer shape is smaller than that of the multi-pixel solid-state imaging device 61 of the present embodiment. Therefore, when connected to the multi-pixel solid-state imaging device 61, the flexible lead 44 is bent in the vertical direction and connected to the side surface of the circuit board 42 (see FIG. 10).

At this time, if the circuit board 42 is formed to have the same shape according to the solid-state image sensor having the smallest element size among a plurality of types of solid-state image sensors, the miniaturization of the image pickup apparatus can be always maintained. it can. In the present embodiment, among the plurality of types of solid-state imaging devices, the smallest solid-state imaging device 39
And the circuit board 42 have the same outer shape.

Accordingly, a circuit board which can be connected to a plurality of types of solid-state image pickup devices without reducing the size of the image pickup device itself and without having to prepare a high-cost circuit board for each type of solid-state image pickup device. Can be provided, and the cost of the imaging device can be reduced. Further, the assembly work relating to the circuit board connection is unified, and the workability of the assembly is improved.

(Second Embodiment) FIG. 12 is a front view of a solid-state imaging device unit before assembly according to a second embodiment of the present invention. In the first embodiment, the imaging device 30 using the solid-state imaging device 39 having the standard number of pixels described in FIG. 3 and the imaging device 60 including the multi-pixel solid-state imaging device 61 described in FIG. Although the image pickup apparatus is configured using the common circuit board 42 between the first and second embodiments, in the second embodiment, the flexible lead 44 is provided in the same manner as described with reference to FIG. It has a cranked configuration.

That is, as shown in FIG. 12, by cranking the flexible lead 44 in a narrow portion inside the tape 46, the flexible lead 44 outside the tape 46 connected to the outside is explained with reference to FIG. The same size and pitch as those of the flexible lead 44 at the same location as in the flexible lead 44 provided. Therefore, the same circuit board 42 can be connected.

The circuit board 42 is the smallest solid-state image sensor 3 described with reference to FIG.
9, the outer shape is smaller than that of the multi-pixel solid-state imaging device 61 of the present embodiment. Therefore, when connected to the multi-pixel solid-state imaging device 61, FIG.
The flexible lead 44 is bent in the vertical direction and connected to the side surface of the circuit board 42 as shown in FIG.

In the present embodiment, the electronic component 43c mounted on the circuit board 42 communicates with a larger number of pixels than the multi-pixel solid-state image sensor 61. This is a high-frequency-compatible electronic component 43c dedicated to the pixel solid-state imaging device 61. That is, it is possible to cope with a difference in driving conditions between different types of solid-state imaging devices.

As a result, although the circuit board 42 is common,
Since the electronic components to be mounted can be selected according to the solid-state imaging device to be connected, the versatility of the circuit board 42 is expanded.

(Third Embodiment) FIGS. 13 to 15
FIG. 13 relates to a third embodiment of the present invention, FIG. 13 is a cross-sectional view showing an overall configuration of an imaging apparatus having the third embodiment of the present invention, FIG. FIG. 15 is a front view of the PAL solid-state imaging device unit before assembly. The third embodiment uses a common circuit board 42 between the imaging device using the solid-state imaging device 39 having the standard number of pixels described in FIG. 3 and the imaging device having the PAL solid-state imaging device. It is configured as follows.

As shown in FIG. 13, the PAL solid-state image sensor 7
The imaging device 70 using the PAL 1 has substantially the same configuration as the imaging device described with reference to FIG.
The device size (so-called package size) is the same as that of the solid-state imaging device 39 described with reference to FIG. 3, and although not shown, about 440,000 pixels capable of outputting a PAL video signal to the image area 38 are arranged in a matrix. It is provided in the shape. Reference numeral 41d denotes an electronic component that processes a PAL video signal.

As shown in FIG. 14, the objective lens 33c joined to the PAL solid-state imaging device 71 has a non-circular portion 81 whose outer shape is partially non-circular. This non-circular part 8
1 is a heat-shrinkable tube 82 exposed from the CCD holder 36.
Is in contact with In this embodiment, the surrounding member is a heat-shrinkable tube 82.
Are in close contact with the non-circular portion 81 of the objective lens 33c at four positions of the objective lens 33c, especially at the top and bottom in the figure. Therefore, the outer shape can be further reduced in size as compared with the imaging device 30 of the first embodiment.

The PAL solid-state image sensor 71 has a large number of pads 43 as shown in FIG. 15 due to a difference in image system from the solid-state image sensor 39 described with reference to FIG. 8 on one side and 16 on both sides. Similarly, the driving conditions of the PAL solid-state imaging device 71 are different from those of the solid-state imaging device 39 due to the difference in image method.

However, since the flexible leads 44 are unified within the tape 46, the flexible leads 44 outside the tape 46 connected to the outside are present.
Have the same dimensions, the same pitch, and the same number as those of the flexible leads 44 in the same portion described in FIG.

Therefore, the same circuit board 42 can be connected. The circuit board 42 has a solid-state image sensor 3 having the same element size as the PAL solid-state image sensor 71.
Since the outer shape of the image pickup device is the same as that of the image pickup device 9, the entire image pickup device is not enlarged.

It should be noted that the imaging apparatus of the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

[Supplementary Note] (Supplementary Note 1) A solid-state image pickup device provided with an electric connection portion in a peripheral portion of an image area, a circuit board having electronic components,
External terminals connected to the electric connection portion of the solid-state imaging device and connecting the circuit board, and the size and pitch of the external terminals at positions connected to the circuit board for solid-state imaging devices of different types Wherein the same circuit board is connectable to the solid-state imaging devices of the different types.

(Additional Item 2) A solid-state image pickup device having an electric connection portion in the periphery of the image area, a circuit board having electronic components, and one end connected to the electric connection portion of the solid-state image pickup device, and the other end A flexible lead connected to the circuit board by bending the solid-state imaging device to the rear of the image area, and a tape holding the flexible lead, wherein the solid-state imaging device extends the tape with the flexible lead. An imaging apparatus characterized in that the width is smaller than the width dimension of (1).

(Additional Item 3) The imaging apparatus according to additional item 1, wherein the external terminal is a flexible lead bent behind the image area of the solid-state image sensor.

(Additional Item 4) The imaging device according to Additional Item 1, wherein the number of pixels is different from that of the solid-state imaging device of the different type.

(Additional Item 5) The imaging device according to Additional Item 1, wherein the element size is different from the solid-state imaging device of the different type.

(Additional Item 6) The imaging apparatus according to Additional Item 1, in which driving conditions are different from those of the solid-state imaging device of the different type.

(Additional Item 7) The imaging device according to additional item 1, wherein the electronic components mounted on the circuit board are different for each type of the solid-state imaging device to be connected.

(Additional Item 8) The solid-state imaging device may be a TA.
3. The imaging apparatus according to claim 1 or 2, wherein the imaging apparatus is mounted by a B (Tape Automated Bonding) method.

(Supplementary Item 9) An objective lens group composed of a plurality of lenses, a solid-state imaging device for capturing an endoscope observation image, and a circuit board having electronic components for driving the solid-state imaging device are provided. An imaging device, comprising: an outer peripheral member provided so as to contact an exposed portion of a lens having a maximum diameter in the objective lens group, wherein the outer peripheral member forms a maximum outer diameter.

(Additional Item 10) The image pickup apparatus according to additional item 9, wherein the lens having the maximum diameter is a lens that is joined to the solid-state image sensor.

(Additional Item 11) The imaging device according to additional item 9 or 10, wherein the outer surrounding member is formed by bending a thin plate material.

(Additional Item 12) The imaging device according to additional item 9 or 10, wherein the outer surrounding member is formed of a heat-shrinkable tube.

[0064]

As described above, according to the present invention, different types of solid-state imaging devices can be connected to a common circuit board.
An imaging device with good assemblability can be realized.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an overall configuration of an endoscope apparatus including an imaging device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the distal end side of the insertion portion in FIG. 1;

FIG. 3 is a cross-sectional view illustrating the overall configuration of an imaging device including the first embodiment of the present invention.

FIG. 4 is a sectional view taken along line AA of FIG. 3;

FIG. 5 is a front view of the solid-state imaging device before assembly.

FIG. 6 is a side view of FIG.

FIG. 7 is a sectional view taken along line BB of FIG. 3;

FIG. 8 is a front view of the solid-state imaging device before assembling showing a modification of FIG. 5;

FIG. 9 is a rear perspective view of the solid-state imaging device unit.

FIG. 10 is a cross-sectional view illustrating an overall configuration of an imaging device provided with a multi-pixel solid-state imaging device.

FIG. 11 is a front view of the multi-pixel solid-state imaging device unit before the assembly in FIG. 10;

FIG. 12 is a front view of a solid-state imaging device unit before assembly according to a second embodiment of the present invention.

FIG. 13 is a cross-sectional view illustrating an overall configuration of an imaging device having a third embodiment of the present invention.

14 is a sectional view taken along the line CC of FIG.

FIG. 15 is a front view of a PAL solid-state imaging device unit before assembly.

FIG. 16 is a front view of a conventional solid-state imaging device unit before assembly.

FIG. 17 is a cross-sectional view of a conventional imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus 2 ... Endoscope 3 ... Light source apparatus 4 ... Video processor 5 ... Monitor 20, 30, 60 ... Imaging apparatus 33a, 33b, 33c ... Objective lens 35 ... Cover glass 38 ... Image area 39 ... Solid-state imaging Element 42 Circuit board 43 Pad (electrical connection part) 44 Flexible lead (external terminal) 45 Bump 46 Tape 47 Shield case 61 Multi-pixel solid-state imaging device

Continued on the front page F term (reference) 4C061 AA00 BB02 CC06 DD03 JJ06 LL02 NN01 PP08 SS01 4M118 AA10 AB01 BA03 GD03 HA19 5C022 AA09 AB15 AC01 AC42 AC70 5C024 AA01 BA03 CA31 CA33 EA02 EA04 EA09 FA01 FA05 FA01 GA01CCA1

Claims (1)

[Claims] 1. A solid-state imaging device having an electric connection portion provided in a peripheral portion of an image area, a circuit board having electronic components, and an external terminal connected to the electric connection portion of the solid-state imaging device and connecting the circuit board. Having the same size and pitch of external terminals at positions connected to the circuit board for different types of solid-state imaging devices, and connecting a common circuit board to the different types of solid-state imaging devices. An imaging device, comprising: