JP3850077B2 - Endoscope device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an endoscope in which a solid-state imaging device is disposed at a distal end portion of an insertion portion of an endoscope, and particularly relates to an endoscope that is intended to reduce the diameter of the distal end portion of the insertion portion.
[0002]
[Prior art]
In recent years, medical endoscopes for observing the inside of a body cavity by inserting a long and thin insertion portion into a body cavity, an industrial endoscope used for observation and inspection in a tube of a machine or a chemical plant, or in a machine Is widely used.
[0003]
Among these endoscopes, there is an electronic endoscope in which an imaging device including a solid-state imaging device (hereinafter abbreviated as SID) is disposed at a distal end portion of an insertion portion. In this electronic endoscope, the distal end portion of an elongated insertion portion having a built-in SID must be inserted into a tube or a lumen having a small diameter and a winding, so that the outer diameter of the distal end portion can be reduced. It was desired. In addition, in an electronic endoscope that is inserted into a body cavity, it has been desired to reduce the patient's pain by reducing the diameter of the insertion portion and inserting the insertion portion of the endoscope as smoothly as possible.
[0004]
In general, a subject image is formed on an imaging surface of a SID through an objective lens that constitutes an imaging device disposed at a distal end portion of an endoscope. One or two circuit boards constituting a signal processing circuit are disposed in the opposite direction of the objective lens of the SID, and the circuit board and external leads extending from the SID are fixed by soldering or the like. ing. In addition, a signal line of a signal cable extending from a signal processing device (video processor) which is an external device is connected to the circuit board. As a result, the SID drive signal, the SID output signal, the SID drive power source, and the like, which are the SID input / output signals, are transmitted to the SID via the signal cable and the circuit board.
[0005]
On the circuit board, a peripheral circuit that performs driving and signal processing, a capacitor that rectifies the power supplied to SID, removes noise, an IC that processes SID output, and an electrical component such as a resistor Is installed. Wiring between the SID and the video processor is performed by a composite cable of a coaxial line and a simple line, and a jumper line is used as a part of the wiring. The jumper wire is particularly effective for connecting the front and back surfaces of a circuit board on which peripheral circuits are mounted.
[0006]
[Problems to be solved by the invention]
However, since the width dimension of the circuit board on which capacitors, ICs, resistors, and the like are mounted is generally the same as the width dimension of the SID package, the front side and the back side of the circuit board are formed by jumper wires. , The jumper wire protrudes outside the outer peripheral surface of the substrate, which causes the image pickup apparatus to become large.
[0007]
The present invention has been made in view of the above circumstances, and aims to provide an endoscope in which the distal end portion of the insertion portion of the endoscope has a small diameter in order to further reduce the size of the imaging device. Yes.
[0008]
[Means for Solving the Problems]
A first endoscope apparatus according to the present invention is disposed on a front surface side, an insertion portion that can be inserted into a subject, an imaging element that is provided on a distal end side of the insertion portion and captures an image of the subject. Further, a drive signal line GND connecting portion that can be electrically connected to an external conductor of an electric signal line for driving the image sensor, and a GND terminal that is disposed on the back surface side and extends from the image sensor A circuit board provided with an image sensor GND connection portion connectable to the circuit board, electrically connecting the drive signal GND connection portion of the circuit board and the image sensor GND connection portion, and one side surface of the circuit board And a cable having a wire diameter smaller than the notch depth of the notch portion provided along the notch portion formed on the outer periphery on the side .
A second endoscope apparatus according to the present invention includes an insertion portion that can be inserted into a subject, an imaging device that is provided on a distal end side of the insertion portion and that captures an image of the subject, and a signal from the imaging device A circuit board for performing processing, a drive signal line GND connecting portion disposed on the surface side of the circuit board and electrically connectable to an external conductor of an electric signal line for driving the imaging device; An image sensor GND connection portion, which is disposed on the back side of the circuit board and can be electrically connected to a GND terminal extending from the image sensor, and electrically connects the drive signal GND connection portion and the image sensor GND connection portion. And a cable having a wire diameter smaller than the notch depth of the notch portion provided along the notch portion formed on the outer periphery of the one side surface of the circuit board . It is characterized by that.
The third endoscope apparatus according to the present invention is characterized in that, in the first or second endoscope apparatus, the cable is a jumper wire without covering.
[0009]
According to this configuration, by using a jumper wire without a cover for wiring on a circuit board, the imaging apparatus can be reduced in size by a cover thickness compared to a jumper line with a cover.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 3 relate to an embodiment of the present invention, FIG. 1 is an explanatory view showing a schematic configuration of an endoscope apparatus, and FIG. 2 is a longitudinal direction of a distal end portion of the endoscope for explaining a schematic configuration of an imaging unit. FIG. 3 is a cross-sectional view, and FIG. 3 is an explanatory diagram showing a wiring state of a peripheral circuit board constituting the imaging unit.
[0011]
As shown in FIG. 1, the endoscope apparatus 10 can be inserted into a body cavity, for example, and is formed by disposing an objective lens or a solid-state imaging device (hereinafter abbreviated as SID) such as a CCD at the distal end portion 2b of the insertion portion 2a. And a light source device that supplies illumination light through a light guide fiber (not shown) provided in the endoscope 2, which is an external device of the endoscope 2. 3 or a video processor that is a signal processing device that performs supply of drive power to the SID of the imaging unit 1 disposed at the distal end portion 2b of the endoscope 2 and signal processing control of a subject image formed on the imaging surface of the SID. 4 and a monitor 6 that receives an image signal obtained by converting an electric signal transmitted to the video processor 4 and displays an endoscopic image on a screen.
[0012]
The endoscope 2 includes an insertion portion 2a that is inserted into a body cavity, an operation portion 2c that is located on the proximal side of the insertion portion 2a, a universal cord 9 that extends from a side portion of the operation portion 2c, and the like. The universal cord 9 is provided with a universal connector 9 a that is detachably connected to the peripheral device 5 at the proximal end of the universal cord 9.
[0013]
Supply of drive power for driving the SID built in the imaging unit 1 and transmission / reception of an electrical signal of a subject image formed on a SID imaging surface and subjected to photoelectric conversion are performed by the insertion unit 2a, the operation unit 2c, and This is performed by a signal cable 7 composed of a plurality of signal lines inserted through the universal cord 9.
[0014]
Note that an imaging device 8 is configured by the imaging unit 1, the video processor 4, and the signal cable 7 that connects the imaging unit 1 and the video processor 4.
[0015]
As illustrated in FIG. 2, the imaging unit 1 includes an objective lens group 20 and an imaging unit 30.
The imaging unit 30 mainly includes an SID chip 31, a ceramic base 33, a Kovar plate 33a, a cover glass 34, and a plurality of external leads 36, 36,..., And a cover disposed on the SID chip 31. A field lens 32 provided on the front surface of the glass 34 is integrally fixed to the SID holder 25.
[0016]
The objective lens group 20 includes a first lens frame 21, a second lens frame 22, a third lens frame 23, and an insulating frame 24, and the first lens frame 21 and the second lens. Necessary optical lenses are incorporated in the frame 22. Then, the positional relationship between the first lens frame 21 and the second lens frame 22 is adjusted so that the optical image captured by the objective lens group 20 forms an image on the imaging surface of the SID chip 31. Then, the objective lens group 20 is fixed to the SID holder 25 in a watertight manner.
[0017]
The external lead 36, which is an electrical component of the image pickup unit, is divided into a drive system external lead 36a and an image output system external lead 36b.
A core wire 71b of a coaxial line 71a of the signal cable 7 is electrically connected to the drive system external lead 36a through a U-shaped plate 46, and an IC chip 41, a capacitor 44 and the like are mounted on the image output system external lead 36b. Are electrically connected to the circuit pattern 47 of the circuit board 40 forming the peripheral circuit.
[0018]
The IC chip 41 is die-bonded to the circuit board 40, wired with bonding wires 42, and sealed with a sealing resin 43.
[0019]
In this embodiment, as shown in FIG. 2 and FIG. 3, a jumper wire 77 made of, for example, an annealed copper wire without a coating connecting the front surface side and the back surface side of the circuit board 40 is used for the GND wiring. The notch 48 is formed so as not to protrude from the outer peripheral surface of the circuit board 40. When the cutout portion 48 is formed, an uncovered jumper wire 77 is used for the jumper wire 77. Therefore, by forming the cutout portion 48 slightly larger than the wire diameter of the jumper wire 77, the amount of cut Thus, the circuit board 40 is miniaturized.
[0020]
One end of the jumper wire 77 is electrically and mechanically connected and fixed to the U-shaped plate 46 by bundling the external conductor of the signal line 71 and GND, and the other end of the image output system external lead 36b. It is electrically connected to the GND terminal.
[0021]
Further, the image pickup unit 30 is provided with a reinforcing adhesive layer 81, an insulating adhesive layer 82, a filling adhesive layer 83, and the like. A shield frame 26 is provided, and the shield frame 26 is covered with a heat-shrinkable tube 27 to form an insulating structure.
[0022]
Furthermore, by using a silver-plated high-strength copper alloy instead of an annealed copper wire as the material of the fine gold wire such as the jumper wire 77, the resistance to bending is improved and problems such as disconnection can be eliminated.
[0023]
In this way, by using uncovered jumper wires for the wiring that connects the front and back sides of the peripheral circuit board via the cutouts, the jumper lines do not protrude from the peripheral surface of the peripheral circuit board. The peripheral circuit board can be miniaturized by minimizing the cut amount of the notch to be formed. As a result, it is possible to reduce the diameter of the imaging unit, and in turn reduce the diameter of the distal end portion of the endoscope.
[0024]
In addition, by using uncovered jumper wires for peripheral circuit board wiring, it is not necessary to determine the length of the jumper wires in advance and to remove the coating by a predetermined length for each jumper wire length. Since the hardness of the jumper wire is constant over the entire length, the three-dimensional forming work at the time of wiring can be improved, and the workability of the imaging unit assembly can be greatly improved.
[0025]
As shown in FIG. 2, the signal cable 7 has a signal line 71 composed of a plurality of coaxial lines and a plurality of simple lines, and a general shield (not shown) is wound around the outer periphery of the signal cable 71. In order to protect the signal line 71, for example, a cable protection tube 72 made of synthetic resin is provided. At the end of the cable protection tube 72, a bobbin 73 for integrally connecting and fixing the signal line 71 and the cable protection tube 72 is provided.
[0026]
In this way, when the insertion portion of the endoscope is curved by providing a bobbin portion that integrally connects and fixes the signal wire and the cable protection tube at the end of the cable protection tube, the signal wire and the cable protection tube As a result, the cable protection tube can only be pulled to protect the signal line and prevent the signal line from being exposed and disconnected, thereby improving the signal line resistance. Can do.
[0027]
Further, as shown in FIG. 2, a concave portion 22a serving as an adhesive reservoir capable of pouring and storing an adhesive on the SID side outer peripheral surface of the second lens frame 22 constituting the SID side of the objective lens group 20 is provided. Is provided. By storing an adhesive in the recess 22a, the second lens frame 22 is securely bonded and fixed to the SID holder 25. For the objective lens group 20 having almost the same appearance and different optical characteristics such as brightness and squeezing, the SID of the second lens frame 22 can be distinguished so that the type of lens can be determined by looking at the appearance. The concave portion 22a provided on the side outer peripheral surface is used as a discrimination means. That is, by changing the number of recesses 22a provided on the outer peripheral surface of the second lens frame 22 on the SID side, the brightness and aperture of the objective lens group 20 can be determined. In this figure, the second lens frame 22 is provided with two concave portions 22a.
[0028]
As described above, by providing the adhesive reservoir and the concave portion which is a means for discriminating the optical characteristics of the objective lens group on the SID side outer peripheral surface of the SID side lens frame constituting the objective lens group, the adhesion between the lens frame and the SID holder is achieved. The reliability can be greatly improved, and the optical characteristics of the objective lens group having substantially the same appearance can be easily identified by the number of concave portions. This improves the assembly efficiency of the imaging unit.
[0029]
Further, it is desirable that the shield frame 26 and the SID holder 25 are electrically connected in order to prevent radiation noise and adverse effects due to external noise. Since the SID holder 25 is generally a part of the objective optical system, a black member is provided on the inner peripheral surface of the SID holder 25 by black dyeing such as painting, vapor deposition, or corrosion treatment. It was. However, when blackening treatment is performed on the inner peripheral surface of the SID holder 25, it is ideal to selectively perform treatment only on the inner peripheral surface, but in most cases, blackening treatment is also applied to the outer peripheral surface. End up. For this reason, in order to achieve electrical continuity between the shield frame 26 and the SID holder 25, it is necessary to intentionally remove the blackened portion, which is troublesome. Therefore, in this embodiment, as shown in FIG. 2, the outer peripheral surface of the SID holder 25 and the inner peripheral surface of the shield frame 26 are not overlapped to achieve electrical conduction, but as shown in FIG. The end face is abutted against the end face of the shield frame 26 to achieve conduction.
[0030]
In this way, the inner periphery of the shield frame can be connected to the inner peripheral surface of the shield frame and the outer peripheral surface of the SID holder by abutting the end faces of both the shield frame and the SID holder to achieve conduction. The work of removing the black dyed portion of the surface can be eliminated, and the shielding effect can be reliably obtained.
[0031]
By the way, on the circuit board 40 constituting the imaging unit 30, for example, an electrical component such as a chip capacitor is used as a capacitor for rectifying the power supplied to the SID chip 31 or removing noise. However, since this chip capacitor is small, it is difficult to place the chip capacitor on the circuit board 40 at a regular position, which is one of the factors that reduce the mounting density. For this reason, improvement in mounting accuracy of mounting components has been desired.
[0032]
As shown in FIG. 4, in mounting the chip capacitor 51 and the chip capacitor 52 in the present embodiment, the width dimension a of the chip capacitor 51 and the width dimension b of the circuit pattern 51a on the circuit board 40 are substantially the same. After the setting and soldering, the positional displacement of the chip capacitor 51 is prevented. The same applies to the chip capacitor 52, and the width dimension d of the circuit pattern 52a with respect to the width dimension c of the capacitor 52 is set to be approximately the same.
[0033]
That is, by making the chip capacitor and the circuit pattern (land) width to which the chip capacitor is connected substantially the same size, when the solder is melted, the chip capacitor is positioned from a predetermined mounting position by the surface tension of the molten solder. It is arranged without shifting.
[0034]
In this way, by setting the width dimension of the circuit pattern relative to the width dimension of the electrical component mounted on the circuit board to be approximately the same size, the position of the mounting component is held by the surface tension of the molten solder when the solder melts. Thus, it is possible to mount the mounting component at a predetermined position while preventing the displacement of the mounting component. As a result, the mounting accuracy of the mounting components is improved, the mounting density is increased, and the size can be reduced. The insertion portion of the endoscope can be downsized to reduce the patient's pain and improve the operability of the operator.
[0035]
By the way, when only one type of SID package is prepared when configuring an endoscope, it is difficult to configure a different type of endoscope having a different internal layout, and the degree of freedom in design is impaired. was there. Therefore, in the present embodiment, as shown in FIG. 5, the same type of SID chip 61 is replaced with an SID package 62 in which a notch 62a is formed in the lower left end as shown in the figure, and a notch 63a in the lower right end. It is mounted on the formed SID package 63.
[0036]
In this way, the same SID chip is mounted on an SID package having a notch at the lower left end and an SID package having a notch at the lower right end to form two types of SID packages, thereby providing a layout. SID packages suitable for the above can be selectively used. As a result, different types of endoscopes having different internal layouts can be configured, and the degree of design freedom is increased.
[0037]
By the way, in the electronic endoscope, the SID chip and the peripheral circuit board are covered with a metal shield frame in order to ensure the shielding property, and configured as an imaging unit. An external force is applied, and this external force has a direct influence on the peripheral circuit board to cause an electrical failure such as a conduction failure. Therefore, as shown in FIG. 6, in the present embodiment, the external force applied to the imaging unit 80 directly acts on the circuit board 81 to prevent problems such as disconnection of the signal line 7, so that the circuit board 81 is shielded. It arrange | positions so that it may fit in the frame 82. FIG. In other words, when the positional relationship between the rear end portion of the circuit board 81 and the rear end portion of the shield frame 82 is compared, the rear end portion of the circuit board 81 is disposed inside the rear end portion of the shield frame 82 by a dimension e. It has come to be.
[0038]
Thus, by arranging the position of the rear end portion of the circuit board inside by a predetermined dimension from the position of the rear end portion of the shield frame, the external stress is applied to the circuit board even when the external stress is applied to the imaging unit. This can be prevented and the tolerance of the imaging unit can be improved.
[0039]
Here, as shown in FIG. 7, an example of a wiring procedure when the connection between the external lead 36 a and the land of the circuit board 101 is performed through the cutout portion 103 of the wiring cable 102 will be described.
[0040]
First, the signal cable 7 is preformed. Next, the signal line 71 of the signal cable 7 and the U-shaped plate 46 are soldered. Next, the circuit board 101 and the external leads 36b are soldered. Then, the signal cable 71 and the external lead 36a are soldered. Finally, the wiring cable 102 is soldered to the external lead 36a and the land.
By performing in the assembly order shown above, the assembly property can be improved.
[0041]
As shown in FIG. 8, when the signal line 71 is routed from the back surface side of the circuit board 101 to the front surface side through the notch portion 103, the notch size of the notch portion 103 has a limited dimension value. Therefore, when passing a plurality of signal lines 71 through the notch 103, it is desirable to pass the plurality of signal lines 71 side by side. When wiring to the circuit board 101, the signal lines 71 are passed through in advance. By twisting and bundling, the signal lines 71 are not separated, and flexibility is increased and workability is improved.
[0042]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.
[0043]
[Appendix]
According to the embodiment of the present invention as described above in detail, the following configuration can be obtained.
[0044]
(1) An endoscope provided with a circuit board provided with a solid-state imaging device built in the distal end portion of the insertion portion and a peripheral circuit for driving the solid-state imaging device or processing an output signal, and a peripheral circuit of the circuit board In an endoscope apparatus having a signal processing device which is an external device for processing the signal of
An endoscope apparatus using uncovered jumper wires for wiring constituting peripheral circuits on the circuit board.
[0045]
(2) An endoscope provided with a circuit board provided with a solid-state imaging device built in the distal end portion of the insertion portion and a peripheral circuit for driving the solid-state imaging device or processing an output signal, and a peripheral circuit of the circuit board In an endoscope apparatus having a signal processing device which is an external device for processing the signal of
An endoscope apparatus in which the width dimension of a circuit pattern provided on a circuit board is set to the same dimension as the width dimension of an electrical component connected to the circuit pattern.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an endoscope in which the distal end portion of the insertion portion of the endoscope is reduced in diameter by further downsizing the imaging apparatus.
[Brief description of the drawings]
FIGS. 1 to 3 relate to an embodiment of the present invention, and FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus. FIG. 2 is a front end of an endoscope that illustrates a schematic configuration of an imaging unit. FIG. 3 is an explanatory view showing a wiring state of a peripheral circuit board constituting the imaging unit. FIG. 4 is a relation between the width dimension of an electrical component mounted on the circuit board and the width dimension of a circuit pattern. FIG. 5 is an explanatory diagram showing the external shape of the SID package. FIG. 6 is a diagram explaining the positional relationship between the circuit board and the shield frame. FIG. 7 is a diagram explaining an example of the wiring procedure of the imaging unit. FIG. 8 is an explanatory diagram showing a state of a signal cable when wiring from the back surface side of the circuit board to the front surface side through a notch;
31 ... SID chip 40 ... Circuit board 77 ... Jumper wire

Claims (3)

An insertion section that can be inserted into a subject;
An image sensor provided on the distal end side of the insertion portion for capturing an image of the subject;
A drive signal line GND connecting portion arranged on the front surface side and electrically connectable with an external conductor of an electric signal line for driving the image pickup device, and extended from the image pickup device arranged on the back surface side A circuit board provided with an image sensor GND connection portion electrically connectable to a GND terminal ;
Thereby electrically connecting the drive signal GND connection portion of the circuit board the imaging element GND connecting portion, is provided along a cutout portion formed on an outer periphery of one side of the circuit board, the A cable having a wire diameter smaller than the notch depth of the notch , and
An endoscope apparatus characterized by comprising: An insertion section that can be inserted into a subject;
An image sensor provided on the distal end side of the insertion portion for capturing an image of the subject;
A circuit board for performing signal processing of the image sensor;
A drive signal line GND connecting portion disposed on the surface side of the circuit board and electrically connectable to an external conductor of an electric signal line for driving the imaging device;
An image sensor GND connecting portion disposed on the back side of the circuit board and electrically connectable to a GND terminal extending from the image sensor;
Thereby electrically connecting the drive signal GND connection unit the imaging element GND connecting portion, is provided along a cutout portion formed on an outer periphery of one side of said circuit board, of the notch A cable having a wire diameter smaller than the notch depth ;
An endoscope apparatus characterized by comprising:   The endoscope apparatus according to claim 1, wherein the cable is a jumper wire without covering.

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