JPH0621310A - Surface mounted semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device of multipin while moreover being hard to cause a shortcircuit at the time of soldering in a surface mounting type semiconductor device. CONSTITUTION:In this surface mounted semiconductor device consisting of a semiconductor chip where a plurality of electrodes are formed on the surface, the internal leads to be connected by the electrodes and fine wires, the resin sealing these and the external leads connecting to the neighboring external leads 2, 3 inside one side are different in the bending shapes and the parts 7, 8 to be soldered are not piled up in a straight line on the sides.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type semiconductor device.

[0002]

2. Description of the Related Art In a conventional surface mount type semiconductor device, as shown in FIG.
The soldering parts 7 were formed so as to be aligned on the same straight line. Therefore, when the conventional surface mount semiconductor device is soldered, the soldering lands 5 are arranged in a straight line as shown in FIG.

[0003]

At present, the surface mounting method is very popular, and the number and kinds of surface mounting type semiconductor devices are increasing remarkably accordingly.

Electronic devices are becoming lighter, thinner, shorter, and smaller, and the circuit boards used therein are also becoming smaller and thinner. On the other hand, along with the sophistication of electronic devices, the semiconductor devices used for these have also become so sophisticated that many terminals for external output are required,
So-called multi-pins are becoming more common. In order to satisfy both of these requirements, it has become more and more popular to use a multi-pin surface mount semiconductor device.

However, the size of the semiconductor device cannot be increased due to the restriction of miniaturization, but a technique for satisfying the requirement of increasing the number of pins is required, and as a result, the pitch of the external terminals is reduced to increase the number of pins. Has become established. The EIAJ also establishes the pitch standard, and the normal surface mount semiconductor device has a minimum of 0.3 mm. At this time, the recommended value for the external lead width is 0.1 mm, and the gap between the leads is only 0.2 mm, which has a drawback that the risk of short-circuiting when soldering to the circuit board increases.

The present invention has been made to solve the above-mentioned drawbacks, and an object thereof is to obtain a surface mounting type semiconductor device which can reduce the risk of short-circuiting at the time of soldering and which has a large number of pins. is there.

[0007]

In the surface mount type semiconductor device of the present invention, the external lead bending shape adjacent to the reduced pitch is changed so that the soldered portion does not overlap the straight line of the side. Can be achieved by increasing the distance of the soldering pattern installed on the circuit board.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1A is a perspective view of the present invention.
(B) is sectional drawing of this invention. 1 (a) and 1
As shown in (b), this embodiment is such that the outer lead 2 which is outwardly bent to be connected to the outside from the package body 1 and which is bent in the gull wing shape is bent, and the outer lead 3 which is bent adjacent to the gull wing shape is also bent. It is a surface-mounted semiconductor device in which the shape can be changed and the soldering lands 5 installed on the circuit board 4 can be arranged so as not to overlap in a straight line. In this embodiment, the first of the external leads 2 and 3
The bent portion 6 is changed so that the soldering portion 7 of the external lead 2 and the soldering portion 8 of the external lead 3 are not at the same distance from the package body 1.

FIG. 2 is a layout diagram of soldering lands when the surface mount semiconductor device of the present invention is used. The soldering lands 5 installed on the circuit board 4 are arranged in a staggered pattern, and short-circuiting between adjacent soldering lands is performed. The risk of can be reduced.

FIG. 3 is a sectional view of another embodiment of the present invention. In this embodiment, the external leads 3 are bent in a J shape so that the soldering portions 8 and 7 are not at the same distance from the package body 1.

FIG. 4 is a sectional view of another embodiment of the present invention. In this embodiment, the outer lead 3 is bent into an I shape.

[0013]

As described above, according to the present invention, the risk of short circuit at the time of soldering is reduced by changing the bending shape of the adjacent external leads to substantially separate the distance between the soldered portions. This has the effect of reducing the number and further promoting the increase in the number of pins of the surface mount semiconductor.

[Brief description of drawings]

FIG. 1A is a perspective view of an embodiment of the present invention. (B) It is sectional drawing of one Example of this invention.

FIG. 2 is a layout diagram of soldering lands when soldering the present invention.

FIG. 3 is a sectional view of another embodiment of the present invention.

FIG. 4 is a sectional view of another embodiment of the present invention.

FIG. 5 is a perspective view of an example of a conventional surface mount semiconductor device.

FIG. 6 is a layout diagram of soldering lands when soldering a conventional surface mount semiconductor device.

[Explanation of symbols]

 1 Package Body 2, 3 External Leads 4 Circuit Board 5 Soldering Land 6 First Bending Section 7, 8 Soldering Section

Claims (3)

[Claims] 1. A surface mount comprising a semiconductor chip having a plurality of electrodes formed on its surface, internal leads connected to the electrodes by fine wires, a resin for sealing these, and external leads for connecting to the outside. In the semiconductor device, the surface mounting type semiconductor device is characterized in that the external leads adjacent to each other on one side have different bending shapes, and the soldered portions do not overlap the straight line of the side. 2. A surface-mounting type semiconductor device according to claim 1, wherein the bent shape of the adjacent external lead is a combination of a gull wing type and a J-shape. 3. A surface-mounting type semiconductor device according to claim 1, wherein adjacent external leads are bent in a combination of gull-wing type and I-type.