JP2006141726A - Solid imaging element unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid imaging element unit improving the efficiency of productivity by suppressing erroneous assembling when assembling the solid imaging element unit and an imaging apparatus itself. <P>SOLUTION: This solid imaging element unit 10 is constituted of a cover glass 14, a solid imaging element 12, a circuit board 13 disposed with signal cable connecting parts 13a and 13b, and an electrically connecting member 16 comprising a flexible board or a wire rod connecting the solid-state image sensing device to the circuit board. This solid imaging element unit is so constituted that predetermined sites visible in the external appearance become asymmetric in the vertical direction or left/right direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solid-state image sensor unit, and more particularly to a solid-state image sensor unit of an image pickup apparatus applied to an endoscope.

  2. Description of the Related Art In recent years, an imaging apparatus to which a solid-state imaging device unit including a solid-state imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) is used in various electronic devices such as an electronic endoscope. Has been. With regard to the external size of the solid-state image pickup device unit in such an image pickup device, the solid-state image pickup device itself has been remarkably downsized in recent years due to a strong demand for downsizing of the device itself to which the solid-state image pickup device unit is applied.

  Further, the downsizing of the imaging device itself is not limited to the downsizing of the applied solid-state imaging device, but, for example, downsizing of electronic components such as a drive circuit for driving the solid-state imaging device, and flexible mounting of these electronic components This is realized by reducing the number of parts as much as possible in addition to miniaturization of an electric board such as a printed circuit board and miniaturization and thinning of a wiring material.

  As described above, the demand for downsizing of the imaging apparatus that has been conventionally generated is not an exception even in the field of the endoscope apparatus to which the imaging apparatus is applied, and the solid-state image sensor unit of the imaging apparatus applied to the endoscope apparatus. However, further downsizing is strongly desired.

  However, in general, the solid-state image sensor unit in the image pickup apparatus tends to become difficult to visually distinguish the vertical direction and the left-right direction of the unit itself as the size is reduced. Therefore, for example, in the manufacturing process, if the solid-state imaging device and the electric circuit board are assembled by mistakenly looking up and down, a problem such as an incorrect signal being input to the solid-state imaging device may occur.

  Specifically, in a normal solid-state imaging device, various wires extending from electrical components on an electric circuit board, such as a power supply line, a ground line (ground line; GND line), a drive clock signal line, and a video output Signals and the like are connected. Normally, the maximum rated voltage of each of these wires is different. Therefore, for example, if a signal having a maximum rated voltage of 25 V is input to a signal line having a maximum rated voltage of 16 volts (V), problems such as damage to the solid-state imaging device itself may occur. Absent.

  On the other hand, in the manufacturing process of the imaging device and the solid-state imaging device unit applied thereto, even if the connection process as described above is normally assembled without erroneous connection, each unit of the imaging device thus created is Let us consider a case where the imaging surface is mistakenly installed vertically or horizontally when incorporated into an actual endoscope.

  In this case, when the observation image is displayed by the imaging device after the manufacturing of the imaging device itself is completed, the image is inverted in the vertical direction from the normal direction. Therefore, in this case, in order to perform repair, the disassembly is performed again and the reassembly work is performed, which is inefficient.

  The present invention has been made in view of the above-described points, and an object of the present invention is to reduce productivity during assembly of the solid-state imaging device unit and the imaging device itself, thereby realizing an increase in productivity. An object of the present invention is to provide a solid-state imaging device unit.

  To achieve the above object, a solid-state image sensor unit according to the present invention connects a cover glass, a solid-state image sensor, a circuit board on which a signal cable connecting member is disposed, and the solid-state image sensor and the circuit board. In a solid-state imaging device unit configured by an electrical connection member made of a flexible substrate or a wire, a predetermined part that can be visually recognized is configured to be asymmetric in the vertical direction or the horizontal direction. It is characterized by.

  ADVANTAGE OF THE INVENTION According to this invention, the solid-state image sensor unit which can suppress the incorporation mistake at the time of the assembly of a solid-state image sensor unit or an imaging device itself, and can implement | achieve productivity efficiency can be provided.

The present invention will be described below with reference to the illustrated embodiments.
FIG. 1 is a cross-sectional view illustrating an outline of an internal configuration of an imaging apparatus to which the solid-state imaging element unit according to the first embodiment of the present invention is applied. FIG. 2 is a diagram showing the configuration of the solid-state image pickup device unit taken out of the image pickup apparatus of FIG. 1, and is a side view of the solid-state image pickup device unit. FIG. 3 is a view showing only the light shielding plate that constitutes a part of the solid-state imaging device unit of FIG. 2, and is a front view of the light shielding plate.

  An imaging apparatus to which the solid-state imaging device unit of the present embodiment is applied is an example of an imaging apparatus mainly applied to an electronic endoscope.

  First, an outline of an internal configuration of an imaging apparatus to which the solid-state imaging device unit of the present embodiment is applied will be described with reference to FIG.

  As shown in FIG. 1, an imaging apparatus 1 to which a solid-state imaging device unit 10 of the present embodiment is applied includes a lens unit 11 that includes a plurality of optical lenses 11a and the like and forms an optical image of a subject, and the lens unit. 11, a solid-state image sensor unit 10 including a solid-state image sensor 12 such as a CCD or a CMOS that receives an optical image of a subject formed by the image sensor 11 and performs photoelectric conversion on an electrical image signal, and a lens unit 11 and a solid-state image sensor. An element frame 18 that fixes and holds the element unit 10, an electric board 21 that is connected to the solid-state image sensor unit 10 and on which various electric components 21 a are mounted, and an output signal from the solid-state image sensor unit 10 is transmitted. A plurality of signal cables 22a, and a bundle of signal cables 22a to form a single signal cable bundle 22; A reinforcement frame 19 provided on the outer edge side of the connecting portion of the solid-state imaging device unit 10, the electric substrate 21, and the signal cable 22 a to cover and protect them, the element frame 18, the reinforcement frame 19, and the vicinity of the distal end portion of the signal cable bundle 22. It is mainly composed of an insulating tube 20 provided on the outer edge side to cover and protect them.

  The lens unit 11 includes a plurality of optical lenses 11 a, a lens frame 11 b that arranges the plurality of optical lenses 11 a on the optical axis, and holds the optical lenses 11 a at predetermined positions. It is configured by a flare stop 11c to be regulated.

  As shown in FIG. 2, the solid-state image sensor unit 10 includes a solid-state image sensor 12, a circuit board 13 that receives a drive signal and a video output signal for operating the solid-state image sensor 12, and a light receiving surface 12 a of the solid-state image sensor 12. A cover glass 14 provided on the light-receiving side, a light-shielding plate 15 disposed between the cover glass 14 and the light-receiving surface 12a of the solid-state image sensor 12, and shielding unnecessary incident light on the light-receiving surface 12a, and a solid-state image sensor An electrical connection member 16 that secures an electrical connection between the circuit board 13 and a bonding pad (not shown) disposed on a portion other than the light receiving surface 12a. It is mainly configured by an insulating sealing resin 17 or the like provided on the outer surface side of the connecting member 16 so as to cover the outer peripheral edge portion of the solid-state imaging element unit 10.

  A centering lens 26 is disposed on the front side of the solid-state image sensor unit 10, that is, the front side of the cover glass 14, and a flare stop 25 is disposed on the front side of the centering lens 26.

  The centering lens 26 is bonded and fixed to the cover glass 14 at a position where the center of the lens substantially coincides with the center position of the light receiving surface 12a of the solid-state imaging device 12.

  As described above, the electrical connection member 16 is a member that electrically connects the solid-state imaging device 12 (bonding pad thereof) and the circuit board 13, and is formed of a flexible substrate or a wire. Specifically, the electrical connection member 16 is formed by, for example, an inner lead made of a copper material (Cu) of a TAB tape, a wire member made of a gold material (Au), or the like.

  For this reason, when a light beam is incident on the portion of the electrical connection member 16, an unnecessary light beam such as a flare may be generated. A portion other than the light receiving surface 12a of the solid-state imaging device 12 is covered with a light shielding plate 15 in order to block unnecessary light rays generated at this time. Therefore, the light shielding plate 15 is disposed on the back surface side of the cover glass 14 and on the light receiving surface 12 a side of the solid-state imaging device 12.

  The circuit board 13 is provided with at least two lead pins 13a and 13b (signal cable connecting members) having different lengths protruding rearward. The two lead pins 13a and 13b are electrically connected to a part of the wiring pattern of the electric board 21 and the plurality of signal cables 22a by means such as soldering. In the case of this embodiment, as shown in FIG. 1, the lead pin 13a is connected to the electric board 21, and the cable connecting portion 22aa of the signal cable 22a is connected to the lead pin 13b.

  In addition, cable connection portions 22aa of some signal cables 22a among the plurality of signal cables 22a are connected to the electric board 21 by means such as soldering. The plurality of signal cables 22 a are bundled by a covering member or a protective tube 23 to form a signal cable bundle 22. Although not shown, the signal cable bundle 22 passes through the insertion portion of the endoscope and reaches the image processing device (video processor) via the operation portion. Therefore, the signal cable bundle 22 transmits the image signal acquired by the imaging device 1 to which the solid-state imaging device unit 10 of the present embodiment is applied to the image processing device, or is connected to the image processing device and performs the internal viewing. It serves to transmit a control signal from the control device that controls the entire mirror to the imaging device 1.

  As described above, the light shielding plate 15 is an aluminum wiring portion other than the light receiving surface 12a of the solid-state image sensor 12 or an inner lead between the cover glass 14 and the light receiving surface 12a side of the solid-state image sensor 12. The bump material made of gold (Au) for connecting the bonding pad and the inner lead is disposed so as to cover it.

  As shown in FIG. 3, the light shielding plate 15 in the solid-state imaging device unit 10 of the present embodiment is formed by a plate-like member that is formed in a substantially rectangular shape when viewed from the front. The light shielding plate 15 is entirely black by painting or the like, or by the material itself.

  The light shielding plate 15 is provided with a substantially rectangular hole 15a at a substantially central portion thereof. The hole portion 15 a is formed to expose the light receiving surface 12 a in a state where the light shielding plate 15 is disposed at a predetermined portion between the cover glass 14 and the solid-state imaging device 12. In the present embodiment, the light shielding plate 15 is integrally formed by being deposited on the cover glass 14.

  Further, when the light shielding plate 15 is viewed from the front (see FIG. 3), a notch 15b is formed at one of the four corners of the substantially rectangular shape. The cutout portion 15b is an index provided for determining by visually recognizing the vertical direction or the horizontal direction of the solid-state imaging device unit 10 with the light shielding plate 15 attached thereto, and constitutes a determination unit. Therefore, the notch 15 b as an index may be arranged at any of the four corners of the light shielding plate 15. That is, the shape of the light shielding plate 15 is formed in an asymmetric shape in the vertical direction or the horizontal direction. In the present embodiment, as in the example shown in FIG. 3, for example, the notch 15b is formed in the lower right corner. In FIG. 3, an arrow X indicates the horizontal transfer direction of the solid-state image sensor 12 on which the light shielding plate 15 is disposed, and an arrow Y indicates the vertical transfer direction of the solid-state image sensor 12.

  In the imaging apparatus 1 to which the solid-state imaging element unit 10 of the present embodiment configured as described above is applied, when the solid-state imaging element unit 10 is assembled in the manufacturing process, the solid-state imaging element unit 10 Of the solid-state image sensor unit 10 can be determined by simply confirming the position of the cutout portion 15b of the light shielding plate 15 seen through the cover glass 14 when viewed from the front side, that is, the side facing the light receiving surface 12a. It is very easy to turn on.

  Further, when the outer shape of the centering lens 26 to be joined to the cover glass 14 is not circular but a lens having an asymmetric shape is assembled in a predetermined direction of the solid-state imaging device unit 10, the centering lens 26 is also passed through the centering lens 26. It can be assembled and fixed while confirming the notch 15b.

  Further, the two lead pins 13a and 13b projecting from the circuit board 13 of the solid-state imaging device unit 10 are configured to have different lengths. In other words, the two lead pins 13a and 13b are arranged so as to be asymmetric in the vertical direction or the horizontal direction in appearance, and constitute a discrimination means. Therefore, by confirming the positions of the two lead pins 13a and 13b, it is possible to easily determine the vertical direction or the horizontal direction of the assembled solid-state imaging device unit 10. At the same time, it is possible to prevent wiring mistakes when connecting the signal cables 22a and the like to the lead pins 13a and 13b.

  As described above, according to the first embodiment, only the appearance of the solid-state image sensor unit 10 assembled in the manufacturing process of the imaging device 1 is visually recognized, and the vertical direction or the horizontal direction is easily determined. It has a configuration that can. Therefore, in the case of connecting a signal line or the like to the solid-state image sensor unit 10 in the assembled state, in the next assembly process, it is possible to prevent mistakes in erroneous connection or assembly in the vertical direction or the horizontal direction. Assembling work can be performed, and the efficiency of the productivity of the imaging device 1 can be improved.

  In the first embodiment described above, the length of the lead pins 13a and 13b is varied to realize the asymmetric shape of the solid-state image sensor unit 10 in the vertical direction or the horizontal direction. However, the present invention is not limited to this. For example, the same operation and effect can be obtained by forming the lead pins 13a and 13b with different cross-sectional shapes, or by arranging the mounting positions of the lead pins 13a and 13b asymmetrically. Can do.

  In the first embodiment described above, the vertical or horizontal direction of the solid-state image sensor unit 10 in an assembled state is determined by forming the notch 15b at one of the four corners of the light shielding plate 15. It is composed. The method of arranging the indicators is not limited to this, and various modes are possible as shown below.

  FIG. 4 shows a modification of the shape of the light shielding plate in the solid-state image sensor unit of the first embodiment described above, as viewed from the side facing the light receiving surface 12a of the solid-state image sensor unit 10 in the assembled state. FIG.

  A light-shielding plate 15A according to a modification shown in FIG. 4 is replaced with the notch 15b of the light-shielding plate 15 in the first embodiment described above, and a substantially L-shaped notch 15Ab and three L-shaped L-shapes. Perforations 15Ac are formed.

  When the three perforations 15Ac are assembled in the order of the cover glass 14, the light shielding plate 15A, and the solid-state image sensor 12, the substantially L-shaped inner line substantially coincides with the outline of the solid-state image sensor 12. Is formed.

  Further, the cutout portion 15Ab is formed at a position where one side of the substantially square shape substantially coincides with the outline of the solid-state imaging device 12 when the cutout portion 15Ab is in the same state.

  Also in FIG. 4, the arrow X indicates the horizontal transfer direction of the solid-state imaging device (12) on which the light shielding plate 15A is disposed, and the arrow Y indicates the vertical transfer direction of the solid-state imaging device (12). Each is shown.

  By using the light shielding plate 15A formed in this way, the same effects as those of the first embodiment can be obtained. Further, the notch 15Ab and the L-shaped perforation 15Ac formed in the light shielding plate 15A can also be used as a positioning index of the solid-state imaging device 12 with respect to the light shielding plate 15A, and constitutes a determination unit.

  FIG. 5 is a front view showing another modified example of the shape of the light shielding plate in the solid-state imaging device unit of the first embodiment, and showing only the light shielding plate.

  A light shielding plate 15B of another modified example shown in FIG. 5 is formed by cutting two adjacent corners out of the four corners of the light shielding plate 15B in place of the notch 15b of the light shielding plate 15 in the first embodiment described above. The two chamfered portions 15Bb are formed to constitute a discrimination means.

  In FIG. 5, an arrow X indicates the horizontal transfer direction of the solid-state imaging device (12) on which the light shielding plate 15B is disposed, and an arrow Y indicates the vertical transfer direction of the solid-state imaging device 12. Yes.

  By using the light shielding plate 15B formed in this way, the same effects as those of the first embodiment can be obtained.

  The solid-state image sensor unit 10B may be configured by forming the outer shape of the cover glass 14B in the same shape in accordance with the outer shape of the light shielding plate 15B.

  In this case, as shown in FIG. 6, when the solid-state image pickup device unit 10B is disposed on the endoscope distal end portion 100, the shape of the chamfered portion 15Bb causes the inner periphery of the endoscope distal end portion 100 to be closer to the outer periphery. It becomes easy to arrange in a part. And it can contribute to diameter reduction of the front-end | tip part 100 compared with the case where the solid-state image sensor unit 10 in which chamfering part 15Bb is not formed is used.

  In FIG. 6, arrow UP indicates the up (UP) direction of the endoscope distal end portion 100, and arrow DN indicates the down (DOWN) direction of the endoscope.

  Further, the chamfered portion 15Bb is not limited to the portion formed near the outer periphery inside the endoscope distal end portion 100, and for example, the chamfered portion 15Bb is formed at a portion that interferes with other internal components. As a result, the arrangement of the internal components can be made closer to each other while avoiding interference with the internal components, which can contribute to further reducing the diameter of the endoscope distal end portion 100.

  By the way, on the surface of the solid-state imaging device 12, a light receiving surface 12a is disposed in a predetermined region near the center. In portions other than the light receiving surface 12a, for example, aluminum wiring is formed. Therefore, this portion is visually recognized, for example, in silver.

  FIG. 7 shows another modification of the light shielding plate focusing on this. That is, FIG. 7 is a front view showing another modified example of the shape of the light shielding plate in the solid-state imaging device unit of the first embodiment, and showing only the light shielding plate. In FIG. 7, an arrow X indicates the horizontal transfer direction of the solid-state image sensor (12) on which the light shielding plate 15C is disposed, and an arrow Y indicates the vertical transfer direction of the solid-state image sensor (12). Show.

  The light shielding plate 15C shown in FIG. 7 forms an opening 15Cb made of an elongated hole at a predetermined portion of the portion other than the portion corresponding to the light receiving surface 12a, and constitutes a discriminating means.

  When the light shielding plate 15C formed in this way is used, when the light shielding plate 15C is visually confirmed through the cover glass (14) in the assembled solid-state imaging device unit 10, the portion of the opening 15Cb is, for example, Visible in silver. Therefore, the opening 15Cb functions as an index, and the solid-state image sensor unit (10) can be easily determined in the vertical direction or the horizontal direction.

  In this case, the size of the opening 15Cb needs to be formed to be sufficiently small so as not to impair the light shielding function of the unnecessary light flux by the light shielding plate 15. However, even if the opening 15Cb is sufficiently small, the silver portion exposed by the opening 15Cb is a reflecting member that reflects light when the entire black light shielding plate 15C is visually recognized. It is very easy. For example, if the size of the light shielding plate 15C is 2 mm × 2 mm, it is sufficient that the width of the opening 15Cb is 0.1 mm.

  Therefore, even in the case of such a configuration, it is possible to easily determine the vertical direction or the horizontal direction of the solid-state imaging element unit (10).

  On the other hand, a conductive member made of chromium (Cr), for example, may be used as a material for forming the light shielding plate (15).

  Here, FIG. 8 is a front view showing the light-receiving surface side of the solid-state image sensor applied to the solid-state image sensor unit of the first embodiment, and the light-receiving surface side of the solid-state image sensor other than the light-receiving surface is shown. The arrangement | positioning of the bonding pad provided in a part is shown schematically. In FIG. 8, the arrow X indicates the horizontal transfer direction of the solid-state image sensor 12, and the arrow Y indicates the vertical transfer direction of the solid-state image sensor 12.

  As described above, on the light receiving surface 12a side of the solid-state imaging device 12, the bonding pad 12b is disposed in a portion other than the light receiving surface 12a (see FIG. 8), and the electrical connection member 16 is disposed so as to cover the bonding pad 12b. (See FIG. 1). Therefore, in the solid-state imaging device unit (10) configured such that the electrical connection member 16 and the light shielding plate (15) are in contact with each other, a leakage occurs between the electrical connection member 16 and the light shielding plate (15). Can be considered.

  Therefore, still another modified example of the light shielding plate focusing on this is shown in the drawing. That is, FIG. 9 is a front view showing still another modification example of the shape of the light shielding plate in the solid-state imaging device unit of the first embodiment, and showing only the light shielding plate.

  The light-shielding plate 15D shown in FIG. 9 has a portion of the solid-state imaging device 12 that is not attached to the light-receiving surface 12a when the light-shielding plate 15D is attached to the light-receiving surface 12a of the solid-state imaging device 12. A plurality of slits 15Db that divide the respective parts corresponding to the bonding pad 12b so as to be independent from each other are formed to constitute a discrimination means.

  In FIG. 9, an arrow X indicates the horizontal transfer direction of the solid-state image sensor 12 on which the light shielding plate 15 </ b> D is disposed, and an arrow Y indicates the vertical transfer direction of the solid-state image sensor 12.

  When the light shielding plate 15D formed in this way is used, even if the light shielding plate 15D is a conductive member such as chromium (Cr), each bonding is performed via the light shielding plate 15D and the electrical connection member (16). The conduction between the pads 12b can be prevented.

  On the other hand, in the assembly process of the imaging device 1, the solid-state imaging element unit 10 is fixed to the element frame 18. Therefore, in order to determine the vertical direction or the left-right direction in the solid-state image sensor unit 10 after being fixed to the element frame 18, a portion exposed to the outside from the outer surface side of the solid-state image sensor unit 10 or the element frame 18 is visually recognized. Will be determined.

  Therefore, in the imaging apparatus 1 to which the solid-state imaging device unit 10 of the first embodiment described above is applied, as described above, the imaging device 1 protrudes behind the circuit board 13 of the solid-state imaging device unit 10 and has two different lengths. By confirming the positions of the lead pins 13a and 13b, the vertical or horizontal direction of the solid-state image sensor unit 10 (imaging device 1) can be determined.

  Here, a connection structure between the circuit board 13 and the electrical connection member 16 and the solid-state imaging device 12 will be described below with reference to FIGS. 13 and 14.

  13 is an arrow view seen from the direction of arrow XIII in FIG. Moreover, FIG. 14 is an arrow view similarly seen from the arrow XIV direction of FIG. In FIGS. 13 and 14, only the circuit board 13, the electrical connection member 16, and the solid-state imaging device 12 are taken out and illustrated in order to avoid complication of the drawings. Moreover, the arrow XIII direction and the arrow XIV direction in FIG. 2 indicate directions orthogonal to the incident optical axis O (see FIG. 2) to the solid-state imaging device 12.

  As described above, electrical connection is ensured between the solid-state imaging device 12 (bonding pad) and the circuit board 13 by the electrical connection member 16 interposed therebetween. As shown in FIGS. 13 and 14, the electrical connection member 16 disposed on the side surface of the solid-state imaging device unit 10 viewed from the arrow XIII direction and the electrical connection member 16 disposed on the side surface viewed from the arrow XIV direction are as follows. The discriminating means is configured so that the number is different. Therefore, by confirming the number of the electrical connection members 16, it is possible to easily determine whether the solid-state image sensor unit 10 is vertically or horizontally from the appearance.

  In this case, in order to set the electrical connection members 16 to have different numbers, for example, dummy wires 16 that are not electrically connected to the solid-state imaging device 12 may be additionally provided.

  In addition to the determination based on the number of the electrical connecting members 16, for example, forms such as the modifications shown in FIGS. 15 and 16 are also conceivable. 15 and 16 show a modified example of the connection structure between the circuit board 13 and the electrical connection member 16 and the solid-state imaging device 12, and FIG. 15 shows an arrow XIII in FIG. It is an arrow view seen from the direction. FIG. 16 is a view seen from the direction of the arrow XIV in FIG.

  In this modification, the same number of electrical connection members 16 are arranged on both side surfaces of FIGS. 15 and 16, but on the side surface shown in FIG. On the other hand, on the side surface shown in FIG. 16, the discrimination means is configured by arranging the tips of the wirings at both ends of the electrical connection member 16 in an inward shape. Thus, by confirming the external shape of the electrical connection member 16 on each surface of the solid-state image sensor unit 10, the solid-state image sensor unit 10 can be easily discriminated in the vertical or horizontal direction from the external appearance.

  In the element frame 18, a reinforcing portion 18 a that protects the solid-state imaging element unit 10 is formed to protrude rearward. By forming the protruding portion, the stress transmitted from the outside to the reinforcing frame 19 can be relieved from the stress transmitted to the solid-state imaging device unit 10.

  The protruding length of the reinforcing portion 18a is set to a position and a dimension that allow the solid-state imaging device unit 10 to be distinguished from the appearance in the vertical or horizontal direction. Thereby, even in a state of being fixed to the element frame 18, the top and bottom of the solid-state imaging element unit 10 can be easily visually identified.

  In the element frame 18 in FIG. 1, the position, direction, and length are set so that the connecting portion between the inner lead 16 and the circuit board 13 can be confirmed. Of course, in this case, the lead pins 13a and 13b can also be easily confirmed.

  The reinforcing portion 18a is not limited to being integrally formed with the element frame 18, and may be formed separately. Moreover, the reinforcement part 18a is not limited to two sides, For example, you may form in any one side, three sides, or four sides.

  In addition to this, as shown below, for example, by devising the arrangement of a plurality of electrical components mounted on the circuit board 13 of the solid-state image sensor unit 10, the vertical direction of the solid-state image sensor unit 10 (imaging device 1) Or the structure which enables it to distinguish the left-right direction can be considered.

  For example, as shown in FIG. 1, in the imaging apparatus 1 to which the solid-state imaging device unit 10 of the first embodiment described above is applied, two pieces projecting backward from the circuit board 13 of the solid-state imaging device unit 10. The electrical substrate 21 is connected to the long lead pin 13a of the lead pins 13a and 13b. On the other hand, a part of the plurality of signal cables 22a is connected to the short lead pin 13b.

  Only by visually recognizing the difference in appearance of the imaging device 1 in the assembled state, the vertical or horizontal direction of the imaging device 1 can be easily determined.

  In addition to this example, for example, a solid-state imaging device unit 10A using a circuit board 13A as shown in FIG. 10 is also conceivable. In this case, the difference between the electric components 21a arranged on the mounting surfaces 13Aa and 13Ab of the circuit board 13A, that is, the arrangement of the electric components 21a on the mounting surface 13Aa and the arrangement of the electric components 21a on the mounting surface 13Ab. By adopting an asymmetric form, it is possible to easily determine the vertical direction or the horizontal direction of the solid-state imaging element unit 10A. Therefore, also in the imaging apparatus (1) configured using the solid-state imaging element unit 10A, in the assembled state, the vertical direction or the horizontal direction can be easily determined only by visual observation. In this case, the protruding length of the reinforcing portion 18a is set to a dimension that can confirm the difference in the arrangement of the electrical components.

  In FIG. 10, an arrow X indicates the horizontal transfer direction of the solid-state image sensor 12, and an arrow Y indicates the vertical transfer direction of the solid-state image sensor 12.

  On the other hand, it is also conceivable to apply a connector member when connecting the solid-state imaging device unit 10 of the first embodiment and the signal cable bundle 22.

  FIG. 11 is an enlarged cross-sectional view showing a solid-state image sensor unit and a connector member connected thereto according to the second embodiment of the present invention.

  The basic configuration of this embodiment is substantially the same as that of the first embodiment described above, except that a connector member is applied to the connection between the solid-state imaging device unit and the signal cable bundle as described above. Only. Therefore, illustration and description of the same configuration as that of the above-described first embodiment are omitted, the same reference numerals are used, and only different portions will be described below.

  The solid-state image sensor unit 10 of the present embodiment has the same configuration as that of the first embodiment described above. A connector member 30 is connected and arranged behind the circuit board 13 of the solid-state image sensor unit 10.

  The connector member 30 includes a main body 30a made of, for example, resin, and two contact pins 30b and 30c disposed inside the main body 30a and in contact with the two lead pins 13a and 13b of the circuit board 13, respectively. The conductive members connected to the contact pins 30b and 30c inside the main body 30a and exposed to the outside of the main body 30a are connected to the signal cable bundle 22 (not shown in FIG. 11). It is comprised by the connection parts 30f and 30g which consist of.

  Lead pin receiving holes 30d and 30e into which the two lead pins 13a and 13b of the circuit board 13 of the unit 10 are inserted are formed on the front surface side of the main body 30a and facing the solid-state imaging device unit 10. Yes. The lead pin receiving holes 30d and 30e are formed with different dimensions in the depth direction corresponding to the two lead pins 13a and 13b having different lengths. Specifically, the lead pin 13a is inserted into the lead pin receiving hole 30d, and the lead pin 13b is inserted into the lead pin receiving hole 30e.

  For example, even if the long lead pin 13a is mistakenly inserted into the lead pin receiving hole 30e, the lead pin receiving hole 30e has only a hole depth corresponding to the short lead pin 13b. For this reason, the solid-state imaging device unit 10 (the two lead pins 13a and 13b of the circuit board 13) cannot be reliably connected to the connector member 30.

  Two contact pins 30b and 30c are provided in the lead pin receiving holes 30d and 30e, respectively. When the lead pin 13a is inserted into the lead pin receiving hole 30d, the lead pin 13a and the contact pin 30b come into contact with each other and can be held. For this purpose, the contact pin 30b is formed with elasticity, and can move in a direction perpendicular to the insertion direction of the lead pin 13a (the arrow X1 direction in FIG. 11). Thus, the lead pin 13a inserted into the lead pin receiving hole 30d is held by being pressed against the wall surface of the lead pin receiving hole 30d by the elastic force of the contact pin 30b.

  Moreover, the structure of the lead pin receiving hole 30e and the contact pin 30c is the same, and the effect | action of the lead pin 13b with respect to this is also the same.

  In FIG. 11, an arrow Y indicates the vertical transfer direction of the solid-state image sensor 12. Further, the horizontal transfer direction of the solid-state image pickup device 12 is indicated by the symbol X as being the same as that in the first embodiment (see FIG. 3).

  According to the second embodiment configured as described above, the solid-state image sensor unit 10 and the signal cable bundle 22 are connected via the connector member 30, and the solid-state image sensor unit 10 The connection with the connector member 30 is configured such that the connection can be made only in a specified direction. Thereby, the incorrect wiring at the time of connecting the solid-state image sensor unit 10 and the signal cable bundle 22 can be prevented.

  Further, by lengthening the lead pin having a high maximum rated voltage, it is possible to prevent the solid-state imaging device 12 from being destroyed even if it is accidentally connected to the connector member and, for example, the operator is energized without noticing misassembly. be able to.

  FIG. 12 is a diagram showing a modification of the connector member in the solid-state image sensor unit of the second embodiment described above, in which the solid-state image sensor unit and the connector member in a state where the signal cable bundle is connected and fixed are connected. It is an expanded sectional view showing the state.

  In FIG. 12, an arrow Y indicates the vertical transfer direction of the solid-state image sensor 12. Further, the horizontal transfer direction of the solid-state imaging device 12 is indicated by the symbol X as being the same as in the first and second embodiments described above (see FIGS. 3 and 11).

  The connector member 30A of the modified example shown in FIG. 12 has substantially the same configuration as the connector member (30) in the above-described second embodiment, but the lead pin receiving holes 30Ad, 30Ae provided in the main body 30Aa. The difference is that the contact pins 30Ab, 30Ac disposed inside are formed in a substantially spherical shape. About another structure, it is the same as that of the above-mentioned 2nd Embodiment.

  Also in the connector member 30A of the present modification configured as described above, the same effects as those of the second embodiment described above can be obtained.

  In the above-described second embodiment and its modification, the connection between the solid-state imaging device unit 10 and the connector member (30, 30A) is defined by making the lead pins 13a, 13b different in asymmetric shape. It is configured to be realized only in the direction of. However, the present invention is not limited to this, and similar actions and effects can be obtained by, for example, changing the shape of the lead pin or asymmetrically arranging the pin attachment positions.

1 is a cross-sectional view illustrating an outline of an internal configuration of an imaging apparatus to which a solid-state imaging element unit according to a first embodiment of the present invention is applied. The side view which takes out a solid-state image sensor unit from the imaging device of FIG. 1, and shows the structure. The front view which takes out and shows only the light-shielding plate which comprises a part of solid-state image sensor unit of FIG. The front view at the time of seeing from the side which faces the light-receiving surface of the solid-state image sensor unit of the assembled state which shows the modification about the shape of the light-shielding plate in the imaging device of FIG. The front view which shows the other modification about the shape of the light-shielding plate in the imaging device of FIG. 1, and takes out and shows only a light-shielding plate. The member arrangement | positioning figure which shows the cross section of the front-end | tip part at the time of arrange | positioning the solid-state image sensor unit which has the light-shielding plate of FIG. 5 in the endoscope front-end | tip part. The front view which shows another modification about the shape of the light-shielding plate in the imaging device of FIG. 1, and takes out and shows only a light-shielding plate. The front view which shows the light-receiving surface side of the solid-state image sensor applied to the solid-state image sensor unit of the imaging device of FIG. The front view which shows another modification about the shape of the light-shielding plate in the solid-state image sensor unit of the imaging device of FIG. 1, and takes out and shows only a light-shielding plate. The side view which shows the modification from which a circuit board differs in the solid-state image sensor applied to the solid-state image sensor unit of the imaging device of FIG. The expanded sectional view which takes out and shows the solid-state image sensor unit of the 2nd Embodiment of this invention, and the connector member connected to this. The expanded sectional view which shows the modification of the connector member in the solid-state image sensor unit of FIG. 1, and shows the state in which the solid-state image sensor unit and the connector member in the state where the signal cable bundle is connected and fixed are connected. FIG. 3 is an arrow view showing a connection structure between a circuit board, an electrical connection member 16 and a solid-state image sensor in the solid-state image sensor unit of the image pickup apparatus of FIG. 1 and viewed from the direction of arrow XIII in FIG. The arrow view seen from the arrow XIV direction of FIG. 2 which shows the connection structure of the circuit board in the solid-state image sensor unit of the imaging device of FIG. 1, the electrical connection member 16, and a solid-state image sensor. The arrow view seen from the arrow XIII direction of FIG. 2 which shows the modification of the connection structure of the circuit board in the solid-state image sensor unit of the imaging device of FIG. 1, the electrical connection member 16, and a solid-state image sensor. The arrow view seen from the arrow XIV direction of FIG. 2 which shows the modification of the connection structure of the circuit board in the solid-state image sensor unit of the imaging device of FIG. 1, the electrical connection member 16, and a solid-state image sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Imaging device 10, 10A ... Solid-state image sensor unit 11 ... Lens unit 11a ... Optical lens 11b ... Lens frame 11c ... Flare stop 12 ... Solid-state image sensor 12a ... Light-receiving surface 12b ... Bonding pad 13, 13A ... Circuit board 13a ... Lead pins 14, 14B ... Cover glass 15, 15A, 15B, 15C, 15D ... Shading plate 15b, 15Ab ... Notch 15Ac ... L-shaped perforation 15Bb ... Chamfer 15Cb ...... Opening 15Db ... Slit 16 ... Electrical connecting member 17 ... Insulating sealing resin 18 ... Element frame 19 ... Reinforcing frame 20 ... Insulating tube 21 ... Electric substrate 21a ... Electrical component 22 ... Signal Cable bundle 22a …… Signal cable 22aa …… Cable connection 23 …… Protective tube 30, 30A …… Connector member 30a, 30Aa …… Main body 30b, 30c, 30Ab, 30Ac …… Contact pin 30d, 30e, 30Ad, 30Ae …… Lead pin receiving hole 30f, 30g …… Connector agent patent attorney Susumu Ito

Claims (5)

A cover glass, a solid-state imaging device, a circuit board on which a signal cable connection member is disposed, and an electrical connection member that includes a flexible substrate or a wire that connects the solid-state imaging device and the circuit board. In the solid-state image sensor unit,
A solid-state imaging device unit, wherein a predetermined part that can be visually recognized on the exterior is configured to be asymmetric in the vertical direction or the horizontal direction. The light-shielding plate disposed between the cover glass and the light-receiving surface of the solid-state image sensor is formed asymmetric in the vertical direction or the left-right direction on the surface facing the light-receiving surface of the solid-state image sensor. The solid-state imaging device unit according to claim 1. 2. The solid-state image sensor unit according to claim 1, wherein an opening that is asymmetric in the vertical direction or the left-right direction is formed on the surface facing the solid-state image sensor in the light shielding plate. The plurality of signal connection portions disposed on the circuit board are formed with different appearance shapes, and the plurality of signal connection portions are disposed asymmetrically in the vertical direction or the horizontal direction. The solid-state imaging device unit according to claim 1. The solid-state imaging device unit according to claim 1, wherein the plurality of electrical components mounted on the circuit board are arranged so as to be asymmetric in the vertical direction or the horizontal direction.

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