JPH0956671A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the hard length in the connection and fixation of a solid image pickup element to a circuit board. SOLUTION: A circuit board 4 is set so that the base electrode 46 of the circuit board 4 has a positional relation opposed to a connecting electrode 3a disposed in the groove part 33a of a package part 33, and is inserted to the groove part 33a so as to gradually get into it. Thereupon, the end surface of one end part of the circuit board 4 makes contact with the front wall 33d of the package part 33. The connecting electrode 33b is then laid into the state opposed to the base electrode 46. A laser beam is emitted toward the connecting electrode 33b through a through hole 33c formed on the package part 33. The solder applied to at least one of the connecting electrode 33b and the base electrode 46 is fused thereby to connect and fix a solid image pickup element 30 to the circuit board 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device built in a distal end portion of an endoscope, and more particularly to shortening a hard length of the image pickup device.

[0002]

2. Description of the Related Art In recent years, a slender insertion portion is inserted into a body cavity through a narrow lumen to observe the inside of the body, such as a medical endoscope, a machine, a chemical plant, or the like, or a machine. Industrial endoscopes used for observing and inspecting objects inside are widely used.

As such an endoscope, there is an electronic endoscope in which an image pickup device having a solid-state image pickup device such as a CCD is arranged at the tip of the insertion portion. In this electronic endoscope, the slender endoscope insertion part has to be inserted into the meandering tube or the lumen with the small diameter as described above, so that the insertion part of the endoscope can be smoothly inserted. Therefore, it has been desired to reduce the outer diameter of the distal end portion of the endoscope having the built-in imaging device and to shorten the hard length.

In Japanese Patent Laid-Open No. 2-299629, in order to shorten the hard length of the distal end portion of the endoscope insertion portion, the lead extending from the solid-state image pickup device is extended from the end portion of the package, and this package is A structure for connecting and fixing the extended lead and the electrode of the circuit board is shown.

[0005]

However, the package portion of the solid-state image pickup device of the image pickup device is provided with a plurality of leads extending to the outside, and the circuit board and the signal cable are connected to these leads. There is. In particular, since the circuit board and the leads are generally connected by soldering, when the circuit board and the leads are connected by soldering, the circuit board is slightly separated from the solid-state image sensor and fixedly connected. Was. This is for avoiding the fillet formed to spread to the root part of the lead when the package and the lead of the solid-state image pickup device are fixed by brazing, for example. On the other hand, there is a drawback that the influence of the fillet increases the length.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an image pickup apparatus for shortening the rigid length when the solid-state image pickup element and the circuit board are connected and fixed.

[0007]

An image pickup device of the present invention is an image pickup device having a solid-state image pickup element and a circuit board to which the solid-state image pickup element is connected, wherein the package portion of the solid-state image pickup element includes: While providing a groove portion for disposing one end portion of the circuit board, an electrode portion corresponding to the solid-state imaging device is provided in this groove portion, and one end portion of the circuit board is inserted into the groove portion to provide an electrode portion provided in the groove portion. And the circuit board are connected and fixed.

According to this structure, first, one end portion of the circuit board is inserted into the groove portion provided in the package portion, and the circuit board is also inserted into the groove portion of the package portion. Then, the tip end surface of one end of the circuit board comes into contact with the groove, and the circuit board faces the electrode section provided in the package section of the solid-state imaging device. In this state, the rigid length of the image pickup device is shortened by connecting and fixing the electrode part provided in the package part and the circuit board.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to a first embodiment of the present invention, FIG. 1 is a cross-sectional view illustrating a schematic configuration of an endoscope imaging apparatus, and FIG. 2 is a perspective view illustrating a schematic configuration of a package unit. FIG. 4 is a diagram illustrating a connection between a solid-state image sensor and a circuit board.

As shown in FIG. 1, the image pickup apparatus 1 of this embodiment
Is disposed at the tip of the endoscope insertion portion, and is mainly composed of an objective lens unit 2 and a solid-state image pickup device unit 3, and in the solid-state image pickup device unit 3, a circuit board 4 and the like. Is built in.

First, the structure of the objective lens unit 2 will be described. The objective lens unit 2 is for forming an observation image on a solid-state image pickup device, which will be described later, provided on the solid-state image pickup device unit 3, and includes a first lens group 21 and a second lens. Group 22, a first lens frame 23 that houses the first lens group 21, a second lens frame 24 that houses the second lens group 22, a first lens frame 23 and a second lens frame 23. The insulating member 26 is fitted to the outer circumference of the lens frame 24, and the third lens frame 25 is fitted to the outer circumference of the insulating member 26.

Next, the structure of the solid-state image pickup device unit 3 will be described. Solid-state image sensor 3 of the solid-state image sensor unit 3
0 is a chip protection member 31 made of an optical material.
And a chip 32 having an image pickup section and a package section 33, and a cover glass 5 is joined to the front of the chip protection member 31. The image pickup section of the chip 32 and the optical axis of the cover glass 5 are centered so as to coincide with each other.

A light-shielding mask 6 for preventing stray light is arranged on the front surface of the cover glass 5. The light-shielding mask 6 is inserted into the outer periphery of the cover glass 5 and fixed by an adhesive (not shown) to be fixed to the cover glass 5 by a solid-state image sensor holder 7 which is integrated with the cover glass 5. It is sandwiched between 7 and the cover glass 5.

The method of disposing the light-shielding mask 6 on the front surface of the cover glass 5 is not limited to the above-described method. 7 is adhered and fixed to the side of the light shielding mask 6, and the solid-state image sensor 30 with the cover glass 5 is inserted into the solid-state image sensor holder 7 to which the light-shield mask 6 is adhered and fixed. It may be sandwiched between the image pickup element holder 7 and the cover glass 5 and arranged on the front surface of the cover glass 5. At this time, the solid-state image pickup device 30 with the cover glass 5 and the solid-state image pickup device holder 7 are bonded to each other with a size of about 1/2 of the width of the side surface of the cover glass 5 and applied all around. It is designed to be integrated with the agent.

Next, the circuit board 4 will be described. A plurality of ICs 41, electronic components 42, etc. are arranged on the circuit board 4 to form a signal processing circuit for processing the signals of the solid-state image sensor 30. Then, the solid-state image sensor drive signal, the solid-state image sensor output signal, the solid-state image sensor drive power supply, etc., which are the input / output signals of the solid-state image sensor 30, all pass through the circuit board 4.

A signal cable 43 composed of a plurality of coaxial shield signal lines and a simple line 43a (hereinafter referred to as a signal line) is inserted in the solid-state image pickup device unit 3, and the signal line of the signal cable 43 is inserted. 43a, 43
a. . . And the signal line connection lands 44, 44. . . And are connected correspondingly. Further, the solid-state image sensor 30 and the circuit board 4 are connected as described later.

The solid-state image sensor 30 and the circuit board 4 are
The tip of the shield member 8 is covered with a shield member 8 fixed so as to be electrically connected to the solid-state image sensor holder 7, and the outer periphery of the shield member 8 is covered with an insulating coating tube 9.

On the other hand, the inside of the shield member 8 is filled with an adhesive 45 to seal the solid-state image pickup device 30, the circuit board 4, and the signal cable 43. A protective tube 43b that covers the outer cover of the signal cable 43 is held and fixed at the rear end of the covering tube 9 that is formed so as to protrude from the shield member 8.

After adjusting the positional relationship between the second lens frame 24 and the solid-state image pickup device holder 7 fitted on the outer peripheral surface of the second lens frame 24, focusing is performed,
The imaging device 1 is configured by fitting and joining.

Now, the connection between the solid-state image pickup device 30 and the circuit board 4 will be described. As shown in FIG. 2, one end portion of the circuit board 4 is inserted into the package portion 33 of the solid-state imaging device 30, for example, the groove portion 3 formed by cutting out in a U shape.
3a is provided. On the side wall surface of the groove portion 33a, the connection electrode 3 is formed as an electrode portion for connection with the solid-state imaging device 30.
3b, 33b. . . (In the figure, there are four for simplification). Further, the package portion 33 is provided with, for example, a through hole 33c for laser light irradiation so as to be orthogonal to the connection electrode 33b.

On the other hand, one end of the circuit board 4 is provided with connection electrodes 33b, 33 for connecting the solid-state image pickup device.
b,. . . Substrate electrodes 46 connected to the respective electrodes are provided. Since the circuit is formed only on the one plane side on the circuit board 4, the substrate electrode 46 is also provided only on the one plane side.

Therefore, as shown in FIG. 3, the board electrode 46 of the circuit board 4 and the groove portion 33a of the package portion 33 are formed.
The circuit board 4 is gradually inserted into the groove 33a in a positional relationship where the connection electrode 33b provided in the above is opposed. Then, the end surface 4a at one end of the circuit board 4 contacts the front wall 33d of the package portion 33. At this time, the connection electrode 33b of the package portion 33 and the substrate electrode 46 of the circuit board 4 are arranged to face each other.

Then, the connecting electrode 33b of the package portion 33 and the board electrode 46 of the circuit board 4 are joined. When joining the connection electrode 33b and the substrate electrode 46,
As shown in FIG. 3, the through hole 3 formed in the package portion 33.
Laser light is radiated toward the connection electrode 33b via 3c to melt the solder applied to at least one of the connection electrode 33b and the substrate electrode 46 for solder connection, or on the circuit board 4. The substrate electrode 46 is made to project from the rear end surface of the package portion 33 of the solid-state imaging device 30,
The substrate electrode 4 protruding from the rear end surface of the package portion 33
The solid-state imaging device 30 and the circuit board 4 are connected by irradiating 6 with a laser beam to melt the solder applied to at least one of the connection electrode 33b and the substrate electrode 46 to make solder connection.

In this way, one end of the circuit board is inserted into the groove provided in the package of the solid-state image pickup device,
By connecting the connection electrode of the package portion and the substrate electrode of the circuit board, the absolute length when the circuit board and the solid-state imaging device are connected can be shortened, and the hard length of the imaging device can be shortened.

Further, one end of the circuit board is inserted into a groove provided in the package portion of the solid-state image pickup device, the circuit board is supported by the package portion of the solid-state image pickup element, and a laser is provided from a through hole provided in the package portion. By irradiating light, the solder applied to at least one of the connection electrode and the board electrode is melted, and the connection electrode of the package portion and the board electrode of the circuit board can be stably connected by solder connection. . Due to this, even if stress such as tilting is applied to the image pickup device, the connection portion between the connection electrode of the package portion and the board electrode of the circuit board is located in the groove portion,
Since the stress does not directly act to peel off the solder connection portion, the solid-state image sensor input / output signal is reliably transmitted.

FIG. 4 is a sectional view showing the schematic arrangement of an image pickup apparatus for an endoscope according to the second embodiment of the present invention. In the present embodiment, the IC 41 of the circuit board 4 and the electronic component 4 are provided on the end face of the package portion 33 of the solid-state image pickup device 30 on the near side.
A plurality of solid-state image sensor leads (hereinafter abbreviated as leads) 34 are projected from the solid-state image sensor 30 from one side where 2 is not provided. Therefore, the signal cable 43 inserted in the solid-state image pickup device unit 3 is divided into the signal lines 43a, 43a. . . The lead 34 side and the circuit board 4
It is branched in two ways with the circuit side of.

The signal line 43a branched to the lead 34 side is directly connected and fixed to the lead 34 by soldering or the like, and the drive signal is transmitted to the solid-state image pickup device 30, for example.
In addition, the coaxial shield portion 43d of the signal line 43a is connected to the conductive wire 4
7 is wound around to be connected to a conductive wire, and the other end of the conductive wire 47 is GN of the electronic component 42 mounted on the circuit board 4.
It is electrically connected to the D electrode.

On the other hand, the signal line 43 branched to the circuit board 4 side
a further branches into a core wire portion 43e and a shield portion 43f, connects the core wire portion 43e to the land 44 on the circuit board 4, and connects the coaxial shield portion 43f to the GND of the electronic component 42.
Conductive connection to the electrode.

The other structure is the same as that of the first embodiment, and the same members are designated by the same reference numerals and the description thereof will be omitted.

By configuring the image pickup device as described above, it is not necessary to connect the solid-state image pickup device and the signal line via the circuit board, for example, the signal line for transmitting the drive signal of the solid-state image pickup device is connected to the lead. Since signals can be directly connected to each other without interposing a circuit such as a component between the signal line and the like, the circuit space on the circuit board can be effectively used without adversely affecting the rigid length of the imaging device, or , Can be reduced. As a result, the circuit board can be made compact and its substantial length can be shortened, so that further miniaturization and shortening of the hard length of the circuit board after the image pickup device is assembled can be realized. Other functions and effects are the same as those of the first embodiment.

FIGS. 5 and 6 relate to the third embodiment of the present invention, FIG. 5 is a diagram for explaining a connection state between the solid-state image pickup device and the circuit board, and FIG. 6 is a connecting portion of the circuit board with the solid-state image pickup device. It is a figure which shows the positional relationship of a bump.

As shown in FIG. 5, the circuit board 4 of this embodiment
A bump electrode 48 is formed on the substrate electrode 46 which is a connection portion between the solid-state imaging device 30 and the solid-state imaging device 30, and the connection electrode 33b of the solid-state imaging device 30 and the substrate electrode 46 are connected by bump bonding. There is. The bump electrode 48 is a transmission contact portion for transmitting a solid-state image sensor drive signal, which is an input / output signal of the solid-state image sensor, a solid-state image sensor output signal, and a solid-state image sensor drive power supply. For example, as shown in FIG. Are arranged in a staggered pattern.

The bump electrode 48 and the circuit board 4 have a positional relationship shown by a dashed line in the insertion state before joining, and the circuit board 4 provided with the bump electrode 48 is smoothly provided in the groove portion 33e of the solid-state image pickup device 30. The clearance 49 is preset so as to be inserted into the groove 33e. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

As described above, the area of the electrode portion can be reduced by bump-bonding the connection electrode of the solid-state image pickup element, which serves as a contact portion of the output signal of the solid-state image pickup element, and the substrate electrode of the circuit board. It is possible to efficiently arrange the contact portions on the circuit board by making the facing intervals of the contacts dense. As a result, the circuit board can be downsized and the length of the circuit board after the image pickup device is assembled can be shortened, so that the rigid length of the image pickup device can be shortened. Other actions and effects are the same as those of the first
And the same as the second embodiment.

By the way, in the conventional imaging apparatus for endoscopes,
A lead extending from the solid-state image sensor is connected to one end of a circuit board made of, for example, ceramic. In recent years, when miniaturizing a solid-state imaging device, the opposing width between leads projecting oppositely becomes smaller, and it tends to be difficult to fit a circuit board between the opposing leads.

Further, since the circuit board is housed between the leads facing each other, when the thickness of the board is reduced to accommodate the circuit board, the absolute mechanical strength may be weakened due to the reduced thickness of the board. Therefore, there is a demand for an image pickup apparatus that includes a substrate that can ensure mechanical strength and can accommodate a narrow lead facing interval.

As shown in FIG. 7, the image pickup apparatus 1 of this embodiment
A cover glass 72 is centered and joined to the solid-state imaging device 71 of A so as to coincide with the optical axis of the solid-state imaging device 71. On the front surface of the cover glass 72, a light-shielding mask 73 is arranged so as to be sandwiched between the cover glass 72 and the solid-state image sensor holder 74. Then, leads 71 a and 71 b extend from the bottom surface of the solid-state imaging device 71 so as to face each other.

A plurality of signal lines 7 are provided in the solid-state image pickup device unit.
A signal cable 75 accommodating 5a and 75b is inserted and extends from the signal cable 75. For example,
The signal line 75a for transmitting the drive signal of the solid-state image sensor 71 is directly connected to the lead 71b.

The leads 71a and the circuit board 76 are connected via a connection board 77 which is a board for connection.
The connection substrate 77 is, for example, a flexible substrate that is thin and has flexibility so that it can be connected in correspondence with a narrow lead facing width. On the other hand, the circuit board 76 is
For example, it is a hard board such as a ceramic board, and is connected to the connection board 77 on the connection land 76a of the circuit board 76. The connection board 7 having flexibility
7, the connecting portion between the connection board 77 and the hard circuit board 76 and its peripheral portion are fixed by an adhesive 78.

As shown in FIG. 8, the connection board 7 having flexibility.
7, a pattern 77a for transmitting an output signal (Vout) from the solid-state image sensor 71, a pattern 77b for transmitting a driving power source of the solid-state image sensor 71, and a GND pattern 77c.
Are provided. At one end of these patterns, a land 77 that becomes a connection portion with the lead of the solid-state image sensor 71 is formed.
d, 77e, 77f are provided, and the circuit board 7 is provided at the other end.
Lands 77g, 77h, and 77i serving as connection portions with 6 are provided. Further, the drive power source (V
An electronic component 79 such as a capacitor is provided between the dd) pattern 77b and the GND 77c.

On the other hand, as shown in FIG. 7, an IC 80 is provided on the circuit board 76. That is, the connection board 77 provided with the electronic component 79 and the circuit board 76 provided with the IC 80 constitute a signal processing circuit for processing a signal of the solid-state imaging device 71.

The shield member 81 covers the solid-state image pickup device 71, the connection board 77, and the circuit board 76,
The tip of the shield member 81 is electrically connected and fixed to the solid-state image sensor holder 74. The outer periphery of the shield member 81 is covered with an insulating coating tube 82, while the shield member 81 is filled with an adhesive agent 83 so that the solid-state imaging device 71, the connection board 77, and the circuit board 7 are provided.
6 is sealed.

The rear end of the covering tube 82 extends from the shield member 81.
The extended portion is held and fixed to a protective member 75c that covers the outer skin of the signal cable 75.

Further, as the solid-state image pickup device is downsized, the lead facing width dimension A tends to become smaller. If the board thickness when connecting and fixing the circuit board to the lead is B, and if the relationship B <A does not hold between the facing width A and the board thickness B, the circuit board is held between the facing widths. It is not possible.

By configuring the image pickup apparatus 1A as described above, the input / output signals of the solid-state image pickup element 71 are generated by the circuit formed by combining the flexible connection board 77 and the hard circuit board 76. That is, the output signal of the solid-state image sensor that has passed through the connection board 77 enters the circuit board 76 and the IC 8
The signal is amplified by 0 and transmitted to a signal processor (not shown) through the signal line 75b and the signal cable 75.

As described above, even if the width of the leads facing each other is set to be narrow, one end of the thin and flexible connecting substrate is arranged between the leads to connect the leads to the other end. By connecting the to a rigid circuit board to configure the imaging device, the leads and the circuit board can be connected to each other even if the lead facing width interval is reduced in response to the miniaturization of the solid-state imaging device. Can be easily done via. Also,
Since the thickness of the circuit board can be secured sufficiently,
The strength of the imaging device is secured.

By the way, in an endoscope in which a bending portion is connected to the rear side of a distal end portion having a built-in image pickup device, the rear end of the hard portion of the image pickup device may hit a bending piece forming the bending portion to prevent bending. It was Therefore, there is a demand for an endoscope in which the rear end of the hard portion of the imaging device and the bending piece do not hit each other.

Therefore, as shown in FIG. 9, the endoscope insertion portion 90 of the present embodiment is provided with a tip frame 91, and the tip frame 91 is provided with a nozzle 93 communicating with a channel 92. . Further, the front end portion of the light guide 95 is exposed to the illumination lens 94 arranged at the front end, and the light guide 95 is inserted through the front end frame 91 and extends to the base end side.

The image pickup device 96 has an objective lens system 9 on the tip side.
7, the objective lens system 97 is provided by being fitted and fixed in the tip frame 91, and a cover glass 98 is provided at the tip of the objective lens system 97, and an observation hole 99 formed in the tip frame 91.
Is provided at a predetermined position.

The bending portion 100 is connected to the insertion portion substrate side of the tip insertion portion 90, and the first bending piece 101 is fitted and fixed to the outer periphery of the tip frame 91. The two bending pieces 102 are connected by a first joint shaft 103.

On the other hand, the coating tube 104 is coated on the exterior of the image pickup device 96, and the coating tube end 104 is covered.
“A” is the rearmost end of the hard portion of the imaging device 96.

The first joint shaft 103 has an image pickup device 96.
Is located closer to the insertion portion substrate portion side than the coated tube end 104a, which is the rearmost end of the rigid portion, and is arranged so that the rigid portion of the imaging device 96 fits into at least the first bending piece 101.

Further, the hard portion of the image pickup device 96 is arranged in the first bending piece 101.

Further, the shoulder opening dimension (C dimension) of the first bending piece 101 is larger than the set value of the normal bending piece, and the bending angle at the first joint shaft 103 is about 10 ° or more.

As a result, the rear end of the hard portion of the image pickup device does not hit the bending piece, so that the bending of the bending portion cannot be prevented, and the bending can be smoothly applied from the tip.

By the way, when performing cannulation using a side-viewing type endoscope in which a treatment tool is protruded from the side surface of the endoscope, if a cannula without a habit is used, the nipple of the cannula causes the nipple to stick to the nipple. You may not be able to approach smoothly. For this reason, an endoscope that can smoothly approach the nipple has been desired.

As shown in FIG. 10, a distal end frame 111 is provided on the distal end side of the insertion portion of the side view type endoscope 110 shown in this embodiment.
The front end frame 111 is provided with a curved portion 112.
The frontmost bending piece 112a constituting the above is connected.

The front end frame 111 has a channel 1
A forceps outlet 115 for communicating with 13 and for leading out the distal end portion of the treatment tool 114 to the outside is formed.

The outer periphery from the connecting portion between the tip frame 111 and the bending piece 112a to the bending portion 112 has a protective member 116.
And is fixed to the tip frame 111.

On the other hand, a cover 117 made of synthetic resin, which is continuously connected to the protection member 116, is fixed to the outer periphery of the tip frame 111. An opening 118 communicating with the forceps outlet 115 is formed on one side of the tip of the cover 117.
Are formed.

Forceps outlet 115 in the tip frame 111.
Inside the treatment instrument 11 drawn out from the forceps outlet 115.
A raising stand 119 for raising 4 is provided.
The raising base 119 is provided inside the forceps outlet 115 so as to be located on the distal end side thereof, and one end thereof is rotated via the pivot pin 120 in a direction orthogonal to the insertion direction of the treatment tool 114. It is freely pivoted.

The tip of the operating wire 121 is connected to the pivoting tip side of the raising base 119. The tip frame 111 is provided with a guide groove 122 that allows the fulcrum of the pivot pin 120 to move.

That is, as shown in FIG. 11, for example, the guide groove 122 is provided in the same direction as the insertion direction of the treatment tool. Further, the substrate end of the operation wire 121 is connected to the tip frame 1.
11 is inserted through the insertion hole 123, is guided to the inside of the bending portion 112, and is connected to a raising operation mechanism (not shown) via a flexible tube portion (not shown).

By constructing the side-view type endoscope 110 as described above, by operating the raising lever of the raising operation mechanism, the operating wire 121 is pulled and the raising base 119 is moved to the pivot pin 120. The fulcrum is pivoted to raise the treatment tool 114.

Here, by pushing the treatment tool 114 into the endoscope, the pivot pin 120 is moved to the distal end frame 11.
It moves along the guide groove 122 provided in 1. As a result, as shown in FIG. 11, the fulcrum position of the pivot pin is 120
Move from a to 120b. Pivot pin 1 as shown
When the fulcrum of 20 is located at the position of the code 120b, the code 1 is
Since the rotation angle is larger than in the position of 20a,
The treatment tool 114 rises at a larger angle.

Since the fulcrum of the pivot pin can be changed as described above, the raising angle can be further increased as compared with the conventional rotation of the raising base at one fulcrum. As a result, it is possible to easily approach the endoscope treatment by bending the treatment tool largely.

[Additional Notes] 1. In an imaging device having a solid-state image sensor and a circuit board to which the solid-state image sensor is connected, a package section of the solid-state image sensor is provided with a groove section for disposing one end section of the circuit board, and the groove section is provided with the An imaging device in which an electrode portion corresponding to a solid-state image sensor is provided, one end portion of the circuit board is inserted into the groove portion, and the electrode portion provided in the groove portion and the circuit board are connected and fixed.

2. In the package part of the solid-state image sensor,
The imaging device according to appendix 1, wherein the electrode portion provided in the groove is provided with a through hole for irradiating a laser beam.

3. 3. The image pickup device according to appendix 2, wherein the electrode portion or the circuit board of the package of the solid-state image pickup element is irradiated with a laser beam to melt the solder applied to at least one of the electrode portion and the circuit board and connect and fix the solder with the solder.

4. 2. The image pickup device according to attachment 1, wherein bump electrodes for electrically connecting and fixing the electrode part of the package part of the solid-state image pickup device and the circuit board are formed.

5. In an imaging device in which a circuit board is connected to leads extending from a solid-state imaging device, the lead and the circuit board are connected via a flexible board.

6. 6. The imaging device according to appendix 5, wherein a signal processing circuit of a solid-state imaging device is formed by the soft substrate and the hard substrate.

7. The imaging device according to appendix 5, wherein the flexible substrate connected to the leads has a thickness smaller than the width of the leads facing each other.

[0074]

As described above, according to the present invention, it is possible to provide an image pickup apparatus for shortening the rigid length when the solid-state image pickup element and the circuit board are connected and fixed.

[Brief description of drawings]

1 to 3 relate to a first embodiment of the present invention, and FIG. 1 is a cross-sectional view illustrating a schematic configuration of an imaging device of an endoscope.

FIG. 2 is a perspective view showing a schematic configuration of a package unit.

FIG. 3 is a diagram illustrating a connection between a solid-state image sensor and a circuit board.

FIG. 4 is a cross-sectional view showing a schematic configuration of an image pickup device for an endoscope according to a second embodiment of the present invention.

5 and 6 relate to a third embodiment of the present invention,
FIG. 5 is a diagram illustrating a connection state between the solid-state image sensor and the circuit board.

FIG. 6 is a diagram showing a positional relationship between a connection portion of a circuit board with a solid-state image sensor and bumps.

FIG. 7 is a cross-sectional view showing a schematic configuration of an imaging device.

FIG. 8 is a perspective view showing a flexible substrate.

FIG. 9 is an explanatory diagram showing a relationship between an imaging device provided at the distal end of the endoscope and a bending piece.

FIG. 10 is a cross-sectional view illustrating a configuration of a tip portion of a side-view type endoscope.

FIG. 11 is a view for explaining the action of the guide groove.

[Explanation of symbols]

 4 ... Circuit board 30 ... Solid-state image sensor 33 ... Package part 33a ... Groove part 33b ... Connection electrode (electrode part) 46 ... Board electrode

Claims (1)

[Claims] 1. An imaging device having a solid-state image sensor and a circuit board to which the solid-state image sensor is connected, wherein a package part of the solid-state image sensor is provided with a groove for disposing one end of the circuit board. An electrode part corresponding to the solid-state imaging device is provided in the groove part, and one end part of the circuit board is inserted into the groove part to connect and fix the electrode part provided in the groove part and the circuit board. Image pickup device.