CN205430411U

CN205430411U - Array module of making a video recording and wiring board assembly thereof

Info

Publication number: CN205430411U
Application number: CN201620200264.6U
Authority: CN
Inventors: 王明珠; 赵波杰; 田中武彦; 陈飞帆; 丁亮; 蒋恒
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-03-15
Filing date: 2016-03-15
Publication date: 2016-08-03
Anticipated expiration: 2026-03-15
Also published as: CN206294240U; CN206272706U; CN206212113U; CN206294241U; CN206272707U; CN206272705U; CN206272704U

Abstract

A array module of making a video recording and wiring board assembly thereof, wherein the wiring board assembly that the module was made a video recording to the array includes: a circuit board and a disjunctor potting part, the circuit board is used for two at least sensitization chips of electric connection, state the integrative encapsulation of disjunctor potting part the circuit board.

Description

Array camera module and circuit board module thereof

Technical field

The utility model relates to camera module field, further, relating to an array camera module and circuit board module thereof.

Background technology

At present, the most integrated more function of most electronic product, this trend makes product transboundary emerge in an endless stream, such as mobile phone formed after being highly integrated by initial communication equipment one integrate communication, image, surf the Net, variation, the three-dimensional function arrival mobile electronic device such as navigation.

But, the camera module being configured in mobile electronic device at present is single-lens camera module mostly, and this single-lens camera module is either the most to have met user's application demand multi-functional for mobile electronic device in the quality of image or effect in shooting.

Occurred and ever more popular be the camera module having more than a camera lens, such as twin-lens camera module, twin-lens camera module provides the style of shooting of apish eyes structure, and all many-sides such as this twin-lens camera module shoots with scanning, hand gesture location identification, color fidelity, rapid focus, panorama deeply in 3D shooting, background blurring shooting suffer from the performance more more excellent than single-lens camera module, therefore, the camera module having more than a camera lens is the important directions of the development of camera module industry from now on.During utilizing twin-lens camera module filmed image, twin-lens camera module utilizes two imaging modules with differences in spatial location to obtain image from two positions respectively, then, after the Image compounding two imaging modules shot respectively according to image combining method, the final image of many camera lenses camera module is obtained.It is understandable that, in this process, the uniformity of the image effects such as the resolving power of each imaging modules of many camera lenses camera module, shading, color, and the deviation value in level, vertically, longitudinally three directions, be the important indicator of the image quality weighing twin-lens camera module.

But, current stage manufacture, the structure of the technique and twin-lens camera module assembling twin-lens camera module cannot ensure the most far away the image quality of twin-lens camera module.Fig. 1 shows the twin-lens camera module of prior art, and it includes that a wiring board 10P, two microscope base 20P and two image-forming module 30P, each described image-forming module 30P include a motor lens assembly 31P respectively.Each described microscope base 20P is individually located in the homonymy of described wiring board 10P, and each described microscope base 20P is linked together by described wiring board 10P, each described motor lens assembly 31P is separately positioned on each described microscope base 20P, to be supported by each described microscope base 20P.It is understandable that, from the point of view of the packaging technology of the described twin-lens camera module of prior art, each described microscope base 20P is mounted on described wiring board 10P individually, thus the more difficult to govern controls such as the size between each described microscope base 20P, position can be caused, to such an extent as to make the size between each described twin-lens camera module support, the isoparametric uniformity in position poor.nullFrom the point of view of the structure of the described twin-lens camera module of prior art，Each described microscope base 20P is independently，And each described microscope base 20P is only attached by described wiring board 10P，Owing to described wiring board 10P generally selects PCB，So that of wiring board 10P itself is more soft and easily deformable，At this moment，The overall rigidity of described twin-lens camera module is difficult to ensure that，When described twin-lens camera module is assembled complete after use during，Such structure is easily caused each element of described image-forming module 30P，Relative size between the most described motor lens assembly 31P is unstable、Position of related features is big，And the optical axis of each described image-forming module 30P easily deviates the generation of the problems such as default position，Once any one in these situations occurs，The image quality of described twin-lens camera module will be given，The final imaging effect of such as Image compounding etc. brings uncontrollable factor or bigger adverse effect.

In addition, the assembling of many camera lenses camera module is based on traditional COB (ChipOnBoard chip package) technique, the circuit devcie 11P of protrusion it is generally of on described wiring board 10P, and a sensitive chip 12P is installed on described wiring board, described sensitive chip 12P is generally connected to described wiring board 10P by gold thread 121P, and described protrusion the most curved for gold thread 121P and described wiring board main body, therefore, these described circuit devcie 11P protruded and described gold thread 121P serve unfavorable factor for the assembling also band of camera module.

Described circuit devcie 11P and described gold thread 21P is directly exposed to the surface of described wiring board 10P, therefore during follow-up assembling, such as paste described microscope base 20P, weld the processes such as described motor lens assembly 31P, inevitably it is affected, solder resist during welding, dusts etc. are easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 12P is positioned at the space being interconnected, therefore dust pollutant is easy to affect described sensitive chip 12P, there is the bad phenomenon such as pitch-black point in the camera module after such impact is likely to result in assembling, reduce product yield.

Secondly, described microscope base 20P is positioned at the outside of described circuit devcie 11P, therefore when installing described microscope base 20P and described wiring board 10P, need reserved certain safe distance between described microscope base 20P and described circuit devcie 11P, and in the horizontal direction and upwardly direction is required for reserved safe distance, this increases the demand of camera module thickness to a certain extent so that it is thickness is difficult to reduce.

Additionally, mold the molding of relative single camera for multi-cam, relate to the coordination problem between multiple camera module, require between multiple camera lenses that optical axis is consistent, and the uniformity of multiple camera lens optical axis based on traditional COB technique is more difficult to get guarantee.And multi-cam module overall volume is relatively big, intensity and flatness to wiring board are more sensitive, and therefore the thickness of wiring board is bigger.

Utility model content

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, wherein said circuit board module includes a disjunctor encapsulation part and a wiring board portion, described disjunctor encapsulation part encapsulated moulding is in described wiring board portion, and described disjunctor encapsulation part is suitable to corresponding multiple camera lens.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, wherein said circuit board module includes a wiring board main body and at least one component, described component protrudes from described wiring board main body, described component is coated with by described disjunctor encapsulation part, from without being directly exposed to outside.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, and wherein said array camera module includes multiple sensitive chip, and described disjunctor encapsulation part is around the outside of each described sensitive chip.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, and wherein said disjunctor encapsulation part includes an optical filter construction section, is suitable to install multiple optical filter, from without the most independent support member.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, wherein said wiring board main body has multiple inner groovy, each described sensitive chip is arranged in described inner groovy, so that reducing the relative altitude of described sensitive chip and described wiring board main body, thus reduce the requirement for height to described disjunctor encapsulation part.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, wherein said wiring board main body has multiple path and multiple external groove, described external groove is communicated in described path, and described external groove installs described sensitive chip with being suitable to upside-down mounting.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, and wherein said wiring board portion includes a back-up coat, is arranged at described wiring board bottom part body lamination, to strengthen structural strength and the heat dispersion of described wiring board main body.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, and wherein said wiring board main body of stating has at least one reinforced hole, and described disjunctor encapsulation part extends into described reinforced hole, thus strengthens the structural strength of described line plate main body.

A purpose of the present utility model is to provide an array camera module and circuit board module thereof, and wherein said disjunctor encapsulation part includes a camera lens construction section, is suitable to install multiple camera lens, thus provides installation site for described camera lens.

In order to realize above utility model purpose, one side of the present utility model provides the circuit board module of an array camera module, comprising: a wiring board portion, it is for being electrically connected with at least two sensitive chips of described array camera module；With a disjunctor encapsulation part；Described disjunctor encapsulation part integral packaging is in described wiring board portion.

According to an embodiment of the present utility model, disjunctor encapsulation part described in described circuit board module forms at least two through hole, and each described through hole is relative with each described sensitive chip, to provide described sensitive chip passage of light.

According to an embodiment of the present utility model, disjunctor encapsulation part top described in described circuit board module is plane, for support, camera lens, motor or the optical filter of installing described array camera module.

According to an embodiment of the present utility model, disjunctor encapsulation part top described in described circuit board module has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, to be respectively used to install support, optical filter, camera lens or the motor of described array camera module.

According to an embodiment of the present utility model, disjunctor encapsulation part described in described circuit board module includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and inside is step-like, in order to install optical filter and the camera lens of described array camera module.

According to an embodiment of the present utility model, described in described circuit board module, optical filter construction section has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, form described the first step-like rank, so that installing described optical filter, described camera lens construction section has at least two camera lens mounting grooves, and each described camera lens mounting groove is communicated in the described through hole of correspondence, form described step-like second-order, in order to the camera lens of described array camera module is installed.

According to an embodiment of the present utility model, camera lens construction section described in described circuit board module has at least two camera lens inwalls, and each described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.

According to an embodiment of the present utility model, described in described circuit board module, wiring board portion includes at least one component, described component protrudes from described wiring board main body, and described disjunctor encapsulation part is coated with described component, so that described component will not be directly exposed to outside.

According to an embodiment of the present utility model, component described in described circuit board module selects to combine: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.

According to an embodiment of the present utility model, wiring board portion described in described circuit board module includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.

According to an embodiment of the present utility model, back-up coat described in described circuit board module is metallic plate, to strengthen the heat dispersion in described wiring board portion.

According to an embodiment of the present utility model, wiring board portion described in described circuit board module includes a screen layer, and described screen layer wraps up described wiring board main body and described disjunctor encapsulation part, to strengthen the electromagnetism interference performance of described circuit board module.

According to an embodiment of the present utility model, screen layer described in described circuit board module is metallic plate or wire netting.

According to an embodiment of the present utility model, in described circuit board module, wiring board main body has at least one reinforced hole, and described disjunctor encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.

According to an embodiment of the present utility model, reinforced hole described in described circuit board module is groove-like.

According to an embodiment of the present utility model, reinforced hole described in described circuit board module is through hole, so that the moulding material of described disjunctor encapsulation part is fully contacted with described wiring board main body and easily fabricated.

According to an embodiment of the present utility model, in described circuit board module, wiring board main body has at least two paths, is suitable to each described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.

According to an embodiment of the present utility model, described in described circuit board module, path is step-like, in order to provide stable installation site for described sensitive chip.

According to an embodiment of the present utility model, the material of wiring board main body described in described circuit board module can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.

According to an embodiment of the present utility model, the material of disjunctor encapsulation part described in described circuit board module is selected from combination: one or more in epoxy resin, nylon, LCP or PP.

According to an embodiment of the present utility model, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes that a motor connects end, is revealed in described disjunctor encapsulation part, in order to connect a motor pin.

According to an embodiment of the present utility model, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part upper end, described lead-in wire includes that a motor connects end, described motor connects end line in described groove bottom wall, in order to a motor pin is electrically connected to described motor and connects end when being plugged in described pin groove.

According to an embodiment of the present utility model, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part, the top of described disjunctor encapsulation part is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.

According to an embodiment of the present utility model, circuit board module described in described circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described disjunctor encapsulation part, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.

According to an embodiment of the present utility model, carve circuit described in described circuit board module in the way of laser formation, be arranged at described disjunctor encapsulation part.

Another aspect of the present utility model provides an array camera module, and it includes the circuit board module described in, at least camera lens and at least sensitive chip；Each described camera lens is positioned at the photosensitive path of the described sensitive chip of correspondence, and each described sensitive chip is electrically connected to described circuit board module.

According to another embodiment of the present utility model, described camera module includes that a support, described support are installed in described circuit board module, and described camera module includes that at least two optical filters, each described optical filter are installed in described support.

According to another embodiment of the present utility model, described camera module includes that at least two motors, each described camera lens are installed in the described motor of correspondence, and each described motor is installed on described circuit board module.

According to another embodiment of the present utility model, described camera module includes that at least two optical filters, each described optical filter are installed in described circuit board module.

Accompanying drawing explanation

Fig. 1 is that cuing open of prior art twin-lens camera module shows schematic diagram.

Fig. 2 A is the array camera module according to first preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Fig. 2 B is another array camera module according to first preferred embodiment of the present utility model and wiring board cut-away view thereof.

Fig. 3 is the manufacture process schematic diagram of the circuit board module according to first preferred embodiment of the present utility model.

Fig. 4 is the circuit board module manufacture method schematic diagram according to first preferred embodiment of the present utility model.

Fig. 5 A, 5B and 5C are the different embodiments of the motor attachment structure of the molding circuit pack according to first preferred embodiment of the present utility model.

Fig. 6 is another array camera module schematic diagram according to first preferred embodiment of the present utility model.

Fig. 7 is the array camera module according to second preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Fig. 8 is the array camera module according to the 3rd preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Fig. 9 is the array camera module according to the 4th preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Figure 10 is the array camera module according to the 5th preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Figure 11 is the array camera module according to the 6th preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Figure 12 is the array camera module according to the 7th preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Figure 13 is the array camera module according to the 8th preferred embodiment of the present utility model and the cut-away view of circuit board module thereof.

Figure 14 is the array camera module according to the 9th preferred embodiment of the present utility model and the sectional view of circuit board module thereof.

Detailed description of the invention

Hereinafter describe and be used for disclosing the utility model so that those skilled in the art are capable of the utility model.Preferred embodiment in below describing is only used as citing, it may occur to persons skilled in the art that other obvious modification.The general principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.

It will be understood by those skilled in the art that is, in exposure of the present utility model, term " longitudinally ", " laterally ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, the most above-mentioned term is it is not intended that to restriction of the present utility model.

If Fig. 2 A to Fig. 4 is the array camera module according to first preferred embodiment of the present utility model and circuit board module thereof.Described array camera module can be applied to various electronic equipment, can be by described array camera module shooting object or the image of personage with auxiliary user, the most described array camera module can be used for shooting object or the image data such as the image of personage or video.Preferably, described array camera module can be applied to a mobile electronic device, and the most described mobile electronic device can be but not limited to mobile phone or panel computer equipment.

As shown in Fig. 2 B to Fig. 4, described array camera module of the present utility model illustrates content of the present utility model and advantage as a example by following description is implemented as the array camera module of a twin-lens by it.Described array camera module includes circuit board module 10, two camera lens 50 and two sensitive chips 30.

It is worth mentioning that, disclose the utility model for convenience, in this embodiment of the present utility model, illustrate as a example by the described array camera module that two described camera lenses 50 are constituted, and in other embodiments of the present utility model, the quantity of involved camera lens 50 can be more, such as two or more, those skilled in the art is it should be appreciated that the quantity of described camera lens 50 is not the restriction of array camera module of the present utility model.

Further, each described sensitive chip 30 is installed in described module circuit board module respectively, each described camera lens 50 is installed on described circuit board module 10, and each described camera lens 50 is positioned at the photosensitive path of each described sensitive chip 30 of correspondence position, described circuit board module 10 can be coupled to described electronic equipment.Those skilled in the art is it should be appreciated that a described camera lens 50 and a described sensitive chip 30 can cooperate for filmed image.Specifically, subject, the reflection of object or person thing light by as described in understand after camera lens 50 by as described in sensitive chip 30 receive to carry out photoelectric conversion, in other words, described sensitive chip 30 can convert optical signal into the signal of telecommunication, and the described signal of telecommunication can be transferred into described electronic equipment by described circuit board module 10, thus generates the image relevant to reference object on described electronic equipment.

Described circuit board module 10 includes disjunctor encapsulation part 11 and a wiring board portion 12, is connected to described wiring board portion 12 described disjunctor encapsulation part 11 integral packaging, molding be connected to as described in wiring board portion 12.More specifically, described disjunctor encapsulation part 11 (MoldingOnBoard, MOB) molding by the way of being molded into wiring board is connected to described wiring board portion 12.

Described wiring board portion 12 includes a wiring board main body 121, described disjunctor encapsulation part 11 forms two through hole 1100, so that described disjunctor encapsulation part 11 is respectively around outside each described sensitive chip 30, and provide the passage of light of each described camera lens 50 and corresponding described sensitive chip 30.Each described sensitive chip 30 is arranged at the wiring board main body 121 of position corresponding to each described through hole 1100.

Described disjunctor encapsulation part 11 includes connector 114 and two outer ring bodies 115, described connector 114 molding is connected integrally between described two outer ring bodies 115, and outer ring body described in two 115 is divided into adjacent two parts, form two through hole 1100, sensitive chip 30 described in two is positioned at the both sides of described connector 114, thus is suitable to be used for assembling described array camera module.It is noted that described connector 114 is the common portion of camera lens 50 described in two, i.e. when installing described camera lens 50, each described camera lens 50 each accounts for the part by described connector 114 correspondence.

Described wiring board portion 12 includes a connection line (not shown) and at least one component 122.Described connection line defaults in described wiring board main body 121, and described component 122 is electrically connected to described connection line and described sensitive chip 30, for the photosensitive course of work of described sensitive chip 30.Described component 122 it may be that citing ground but be not limited to, resistance, electric capacity, diode, triode, potentiometer, relay, driver etc..

In this embodiment of the present utility model, the corresponding each described sensitive chip 30 of each described component 122, in order to coordinate the work of each described sensitive chip 30.

It is worth mentioning that, described component 122 can be coated on inside by described disjunctor encapsulation part 11, hence in so that described component 122 will not be directly exposed in space, more specifically, it is not exposed in the enclosed environment communicated with described sensitive chip 30, is different from the existing way of component 122 in traditional camera module, such as capacitance resistance ware, thus prevent dust, foreign material from staying in component 122, pollute sensitive chip 30.In this embodiment, protrude by described component 122 and illustrate as a example by described wiring board main body 121, in other embodiments of utility model, it is internal that described component 122 is embedded in described wiring board main body 121, and it is non-bulging in described wiring board main body 121, those skilled in the art is it should be appreciated that the structure of described component 121, type and to arrange position be not restriction of the present utility model.

It is worth mentioning that; described disjunctor encapsulation part 11 is coated with described component 122 and has the advantage protected in terms of the advantage of described component 122 and corresponding camera module; it will be understood by those skilled in the art that described disjunctor encapsulation part 11 is not limited to be coated with described component 122.It is to say, in other embodiments of the present utility model, described disjunctor encapsulation part 11 can directly be molded into the wiring board of the described component 122 not protruded, it is also possible to be to be molded into the diverse locations such as the outside of described component 122, surrounding.

It is worth mentioning that, in an embodiment of the present utility model, described disjunctor encapsulation part 11 is protrudingly around outside described sensitive chip 30, especially, described disjunctor encapsulation part 11 closes connection integratedly so that it is have good sealing, thus when each described camera lens 50 is installed in described disjunctor encapsulation part 11, each described sensitive chip 30 is sealed in inside respectively, forms space in each self-corresponding closing.

With reference to Fig. 3 and Fig. 4, specifically, when manufacturing described circuit board module 10, can mold at a traditional wiring board as described wiring board main body 121 on described wiring board main body 121 surface.Such as, in one embodiment, injection machine can be used, wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) by insert molding (insertmolding) technique carries out integral packaging, such as molded packages, form described disjunctor encapsulation part 11, or form described disjunctor encapsulation part 11 by mould pressing process conventional in semiconductor packages.Further, each described sensitive chip 30 is mounted on described wiring board main body 121, then each described sensitive chip 30 is electrically connected with described wiring board main body 121, such as play gold thread electrical connection.Described wiring board main body 121 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described disjunctor encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described disjunctor encapsulation part 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, being illustrative only of the present utility model can be not restriction of the present utility model in the way of enforcement.

In other embodiments of the present utility model, the process manufacturing described circuit board module 10 can also is that, first described wiring board 121 is carried out SMT technique, and then each described sensitive chip 30 is mounted on described wiring board main body 121, and each described sensitive chip 30 is electrically connected with described wiring board main body 121, such as play gold thread electrical connection, then described wiring board main body 121 will be carried out integral packaging, such as molded packages, described disjunctor encapsulation part 11 is formed by the way of insert molding, or form described disjunctor encapsulation part 11 by mould pressing process conventional in semiconductor packages.Those skilled in the art is it should be appreciated that the manufacturing sequence of described circuit board module 10 is not restriction of the present utility model.

It will also be appreciated that, each described camera lens 50 is installed in the described disjunctor encapsulation part 11 of described circuit board module 10, thus described disjunctor encapsulation part 11 is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 50, but assemble and be but different from tradition COB technical process.The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described disjunctor encapsulation part 11 (MoldingOnBoard by the way of being molded into wiring board, MOB) it is fixed on described wiring board main body 121, need not paste fixation procedure, molding mode is relative to pasting the fixing controllability with more preferable connective stability and technical process, and between described disjunctor encapsulation part 11 and described wiring board main body 121, need not the glue space that reserved AA adjusts, therefore the headspace that tradition camera module AA adjusts is reduced, the thickness making array camera module is reduced；On the other hand, described disjunctor encapsulation part 11 is coated on described component 122, traditional cradling function and component 122 can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described disjunctor encapsulation part 11 of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce.Additionally, described disjunctor encapsulation part 11 replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that described array camera module assembles.

It will also be appreciated that, the shape of described disjunctor encapsulation part 11 can more it needs to be determined that, such as extend internally in described component 122 position, form a protuberance, thus increase the width of described disjunctor encapsulation part 11 correspondence, and there is no the position of described component 122, described disjunctor molded section 11 as one man extends, form the shape of comparison rule, and width is less.Those skilled in the art is it should be appreciated that the concrete shape of described disjunctor encapsulation part 11 is not restriction of the present utility model.

Further, described disjunctor encapsulation part 11 includes cladding section 111 and an optical filter construction section 112, being integrally connected to described cladding section 111, described cladding section 111 molding is connected to described wiring board main body 121, is used for being coated with described component 122 described optical filter construction section 112 molding.Described optical filter construction section 112 is for installing two optical filters 40, and described optical filter 40 may be implemented as but is not limited to cutoff filter (IRCF).

That is, when described circuit board module 10 is used for assembling described array camera module, the each described optical filter 40 of described array camera module is installed in described optical filter construction section 112, described optical filter 40 is positioned on the photosensitive path of corresponding described sensitive chip 30, and need not provide extra optical filter 40 mounting bracket.That is, described disjunctor encapsulation part 11 has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112 top can be by the technology mode of mold, make it have good planarization, so that described optical filter 40 is entirely mounted, this point is also an advantage over traditional camera module.

Further, described optical filter construction section 112 forms two mounting grooves 1121, each described mounting groove 1121 is respectively communicated with in corresponding described through hole 1100, provides sufficient installing space for described optical filter 40 so that described optical filter 40 will not protrude from the top surface of optical filter construction section 112.It is to say, described disjunctor encapsulation part 11 upper end arranges mounting groove 1121 described in two, thus each by the described disjunctor encapsulation part 11 that is installed on stable for described optical filter 40, and the top of described disjunctor encapsulation part 11 will not be protruded from.

It is worth mentioning that, in this embodiment of the present utility model, described mounting groove 1121 may be used for installing described optical filter 40, and in of the present utility model other are implemented, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described array camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove 1211 is not restriction of the present utility model.

According to this embodiment of the present utility model, described sensitive chip 30 is connected to described wiring board main body 121 by least one connecting line 31, and is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Especially, the described connecting line 31 of described sensitive chip 30 can be connected to described wiring board main body 121 by traditional COB mode, citing ground but be not limited to, the mode of welding.It is to say, described sensitive chip 30 and the connection of described wiring board main body 121 can make full use of existing ripe interconnection technique, to reduce the cost of improvement technology, traditional technique and equipment are made full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art it should be appreciated that, described sensitive chip 30 can also be realized by the connected mode of other any utility model purpose of the present utility model being capable of with the connection of described wiring board main body 121, and the utility model is unrestricted in this regard.

It is worth mentioning that, in this embodiment of the utility model, each described sensitive chip 30 is arranged at the upper surface of described wiring board main body 121, described disjunctor encapsulation part 11 is around the outside of described sensitive chip 30, when manufacturing described circuit board module 10, different manufacturing sequence can be selected, citing ground but be not limited to, in one embodiment, sensitive chip 30 described in two can be first installed in described wiring board main body 121, then outside each described sensitive chip 30, the moulding one-tenth of described wiring board main body 121 upper mold described disjunctor encapsulation part 11, and the described component 122 that will protrude above described wiring board main body 121 is coated on inside it.And in another embodiment of the present utility model, can be first in the moulding one-tenth of described wiring board main body 121 upper mold described disjunctor encapsulation part 11, and the described component 122 that will protrude above described wiring board main body 121 is coated on inside it, then described sensitive chip 30 is installed on described wiring board main body 121 so that it is be positioned at the inner side of described disjunctor encapsulation part 11.

In this embodiment of the present utility model, illustrate as a example by the array camera module of the composition of two camera lenses 50, described array camera module can be in a kind of mode being carried out, and by the advantage of moulding technology, consistent installation environment is provided with camera lens described in two 50, so that described array camera module obtains more excellent optical property for optical filter described in two 40.In other embodiments of the present utility model, described array camera module can also include two or more camera module, correspondingly, described circuit board module 10 forms plural through hole 1100, those skilled in the art is not it should be appreciated that the quantity of described camera lens 50 is restriction of the present utility model.

With reference to Fig. 6, at one preferably in embodiment of the present utility model, each described camera lens 50 can include that an optical lens 50, each described optical lens 50 can be directly connected in the described disjunctor encapsulation part 11 of described circuit board module 10 respectively.That is, in this embodiment, described camera lens 50 is tight shot assembly, the focal length of the most described camera lens 50 cannot freely be adjusted, it will be appreciated by those skilled in the art that is, described optical lens 50 described by the utility model can be directly connected in described disjunctor encapsulation part 11, is connected to the situation of described disjunctor by a housing including described optical lens 50.And in preferably embodiment of the present utility model, with reference to Fig. 2 B, described array camera module includes a motor 60, each described motor 60 is installed in described disjunctor encapsulation part 11, described camera lens 50 can be drivingly coupled to described motor 60, thus described motor 60 can drive described optics to move along the photosensitive path of described sensitive chip 30, to adjust the focal length of described camera lens 50.That is, in this embodiment, described camera lens 50 is that zoom lens 50 assembly, the focal length of the most described camera lens 50 can be adjusted, such as user, when using described twin-lens 50 camera module filmed image, can adjust shooting effect by adjusting the focal length of described camera lens 50.

It is worth mentioning that, according to this preferred embodiment of the present utility model, described disjunctor encapsulation part 11 can be used to support installs each described optical filter 40, each described camera lens 50 or each described motor 60, there is the function of conventional stent, and based on the advantage molded, described disjunctor encapsulation part 11 can control planarization and the uniformity of described disjunctor encapsulation part by mould, thus be each described colour filter of described array camera module, 40, each described camera lens 50 provides smooth and consistent installation environment with each described motor 60, thus it is easier to ensure that the uniformity of each camera lens optical axis, the array camera module that this point is traditional is not readily reachable by.

It will also be appreciated that, described disjunctor encapsulation part 11 disjunctor integratedly is molded to wiring board main body 121, enhance the structural strength of described wiring board main body, the array camera module of the most relatively conventional COB mode, the described wiring board main body 121 of array camera module of the present utility model can reach less thickness, and disclosure satisfy that each camera lens and each motor strength requirement.On the other hand, described disjunctor encapsulation part 11, so that the distance between each described camera lens 50 reduces, therefore reduces the horizontal length and width size of described array camera module further.

Further, according to this preferred embodiment of the present utility model, described circuit board module 10 includes at least two motor attachment structures 13, is respectively used to connect two motors 60 of described array camera module.Each described motor 60 has at least one motor pin 61.Each described motor attachment structure 13 includes at least one lead-in wire 131, and each described lead-in wire 131 is used for electrically connecting described motor 60 and described wiring board main body 121.Each described lead-in wire 131 is electrically connected to wiring board main body 121.Further, each described lead-in wire 131 is electrically connected to the connection circuit of described wiring board main body 121.Described lead-in wire 131 is arranged at described disjunctor encapsulation part 11, and extends to the top of described disjunctor encapsulation part 11.Described lead-in wire 131 includes that a motor connects end 1311, is revealed in the top of described disjunctor encapsulation part 11, for electrically connecting the described pin 61 of described motor 60.It is noted that described lead-in wire 131 can be arranged by embedding manner when forming described disjunctor encapsulation part 11.In traditional connected mode, such as driving the parts such as motor is all to be connected to wiring board by arranging single wire, manufacturing process is relative complex, and the mode burying described lead-in wire 131 when this molding of the present utility model underground can replace the technical process such as traditional motor welding, and it is more stable that circuit is connected.Especially, in implementing of the present utility model one, described lead-in wire 131 is a wire, is embedded in described disjunctor encapsulation part 11 internal.Citing ground, described motor pin 61 can be connected to described motor by anisotropic conductive film and connect end 1311, it is also possible to is connected to described motor by the way of welding and connects end 1311.

It is worth mentioning that, the position that the burial place of described lead-in wire 131 and the described motor connection end 1311 of described lead-in wire 131 show in described disjunctor encapsulation part 11 can be arranged as required to, such as, in an embodiment of the present utility model, the described motor of described lead-in wire 131 connects end 1311 can be arranged at the periphery of described disjunctor encapsulation part 11, the top surface of the most described disjunctor encapsulation part 11, the top surface of described optical filter construction section 112, and in another embodiment of the present utility model, described motor connection end 1311 encloses in can being arranged at described disjunctor encapsulation part 11, described mounting groove 1121 bottom surface of the most described disjunctor encapsulation part 11, such that it is able to provide described motor 60 different installation site.In other words, when described motor 60 needs to install to described disjunctor encapsulation part top, described motor connects end 1311 and is arranged at described disjunctor encapsulation part periphery top surface, when described motor 60 needs to install to described mounting groove 1121, described motor connection end 1311 encloses in being arranged at described disjunctor encapsulation part 11, the most described mounting groove 1121 bottom surface.

That is, when manufacturing described circuit board module 10, can first mount each described sensitive chip 30 to described wiring board main body 121, in described wiring board main body 121, in the way of MOB, then mold described disjunctor encapsulation part 11, and described lead-in wire 131 can be set inside described disjunctor encapsulation part 11 with embedding manner when molding, and make described lead-in wire 131 be electrically connected to described wiring board main body 121, and make the described motor connection end 1311 of described lead-in wire 131 be shown in the top of described disjunctor encapsulation part, so that being connected to the described motor pin 61 of described motor 60.Citing ground, when described circuit board module 10 is used for assembling described shooting molding, the each described pin 41 of described motor 60 is connected to the described motor of described lead-in wire 131 by the way of welding and connects end 1311, so that described motor 60 is electrically connected to described wiring board main body 121, and needing, single wire is set described motor 60 and described wiring board main body 121 are connected, and the length of the described motor pin 61 of described motor 60 can be reduced.

It is an Equivalent embodiments of the described motor attachment structure according to above preferred embodiment of the present utility model with reference to Fig. 5 A.Each described motor attachment structure 13 includes a pin groove 133, and described pin groove 133 is for accommodating the described motor pin 61 of the described motor 60 of described array camera module.Described pin groove 133 is arranged at described disjunctor encapsulation part 11 upper end.Described motor attachment structure 13 includes that at least one lead-in wire 134 each described lead-in wires 134 are for electrically connecting described motor 60 and described wiring board main body 121.Described lead-in wire 134 is arranged at described disjunctor encapsulation part 11, and extends upwardly to the groove bottom wall of the described pin groove 133 of described disjunctor encapsulation part 11.Described lead-in wire 134 includes that a motor connects end 1341, is revealed in the groove bottom wall of the described pin groove 133 of described disjunctor encapsulation part 11, for electrically connecting the described motor pin 61 of described motor 60.Especially, in one embodiment, described motor connection end 1341 may be implemented as a pad.Described lead-in wire 134 may be implemented as a wire, is embedded in described disjunctor encapsulation part 11 internal.

That is, when manufacturing described circuit board module 10, first mount described sensitive chip 30, then in described wiring board main body 122, described disjunctor encapsulation part 11 is molded in the way of MOB, and the described pin groove 133 of default predetermined length, and described lead-in wire 134 can be set with embedding manner when molding, and make described lead-in wire 134 be electrically connected to described wiring board main body 122, and make the described motor of described lead-in wire 134 connect the groove bottom wall that end 1341 is shown in the described pin groove 133 of described disjunctor encapsulation part 11, so that being connected to the described pin 41 of described motor 60.Citing ground, when described circuit board module 10 is used for assembling described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 133, and the described motor being connected to described lead-in wire 134 by the way of welding connects end 1341, so that described motor 60 is electrically connected to described wiring board main body 122, and needing, single wire is set described motor 60 and described wiring board main body 122 are connected, and make can stably the connecting of described motor pin 61 of described motor 60, prevent from outside unwanted touching described motor pin 61.Especially, described lead-in wire 134 may be implemented as a wire, is embedded in described disjunctor encapsulation part 11 internal.

With reference to Fig. 5 B, it it is another Equivalent embodiments of motor attachment structure according to above preferred embodiment of the present utility model.Each described motor attachment structure 13 includes a pin groove 135, and described pin groove 135 is for accommodating the described motor pin 61 of the described motor 60 of described array camera module.Described pin groove 135 is arranged at described disjunctor encapsulation part 11.Described motor attachment structure 13 includes that at least one circuit junction 132, described circuit junction 132 default in described wiring board main body 122, and is electrically connected to the described connection line of 122 in described wiring board main body.Further, each described pin groove 135 is extended to described wiring board main body 122 by the top of described disjunctor encapsulation part 11, and described circuit junction 132 is shown.In a kind of way of example, described motor pin 61 is adapted for insertion into described pin groove 135, and can be welded to connect with described circuit junction 132.

That is, when manufacturing described circuit board module 10, described wiring board main body 122 is preset each described circuit junction 132, and then mount 121, described photosensitive core, then in described wiring board main body 122, in the way of MOB, mold described disjunctor encapsulation part 11, and the described pin groove 135 of default predetermined length, and described circuit junction 132 is shown by described pin groove 135, in order to it is connected to the described motor pin 61 of described motor 60.Citing ground, when described circuit board module 10 is used for assembling described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 135, and by the way of welding the described circuit junction 132 that is connected in wiring board main body 122, so that described motor 60 is electrically connected to described wiring board main body 122, and the described motor pin 61 of described motor 60 can stably be connected, prevent from outside unwanted touching described motor pin 61.

With reference to Fig. 5 C, it is according to above-mentioned another Equivalent embodiments being preferable to carry out inner motor attachment structure of the present utility model.Described motor attachment structure 13 includes an engraving circuit 136, and described engraving circuit 136 is for electrically connecting the parts such as described connection line, described sensitive chip 30 and motor in described wiring board main body 122.Citing ground but be not limited to, described engraving circuit 136 can by laser formation (LDS) by the way of formed described disjunctor encapsulation part 11 time setting.In traditional connected mode, such as driving the parts such as motor is all to be connected to wiring board by arranging single wire, manufacturing process is relative complex, and the mode arranging described engraving circuit 136 when this molding of the present utility model can replace the technical process such as traditional motor welding, and it is more stable that circuit is connected.More specifically, the forming process of described engraving circuit 136 is it may be that presently described disjunctor encapsulation part 11 arranges engraving groove, then arranging circuit in the way of plating in described engraving groove.

In first embodiment of the present utility model, the described motor 60 of described array camera module is connected to the mode of described disjunctor encapsulation and illustrates as a example by the connected mode of described motor attachment structure 13, the mode of lead-in wire 131 as described in described employing, and in other embodiments of the present utility model, the connected mode of described motor 60 can also be corresponding with Fig. 5 A, 5B and 5C connected mode be combined, use described pin groove 133 with go between 134, as described in pin groove 135 and as described in circuit junction 132.And in an embodiment of the present utility model, with reference to Fig. 2 A, described motor 60 can be connected to described circuit board module 10 by the way of traditional, such as by the way of welding.Those skilled in the art is it should be appreciated that the connected mode of described motor 60 and described circuit board module 10 is not the utility model restriction.

As it is shown in fig. 7, be the array camera module according to second preferred embodiment of the present utility model and circuit board module 10 thereof.Not being both with above preferred embodiment, described circuit board module 10 includes wiring board main body 121A.In described wiring board main body 121A includes the described inner groovy 1211A that two inner groovy 1211A, each described sensitive chip 30 are arranged at correspondence.It is different from circuit board module 10 in above-described embodiment, described sensitive chip 30 arranges in described inner groovy 1211A, and described sensitive chip 30 is accommodated therein, described sensitive chip 30 is made will not substantially to protrude from the upper surface of described wiring board main body 121A, make the height reduction of described sensitive chip 30 the most described disjunctor encapsulation part 11, thus reduce the described sensitive chip 30 height limitation to described disjunctor encapsulation part 11, it is provided that reduce the possibility of height further.

Further, described sensitive chip 30 is connected to described wiring board main body 121 by described connecting line 31, and is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.It is to say, described sensitive chip 30 and described connecting line 31 are all located in the described inner groovy 1211A of described wiring board main body 121A.In one embodiment, when manufacturing described circuit board module 10, need first in described wiring board main body 121A, to arrange described inner groovy 1211A.It is to say, open described inner groovy 1211A on traditional wiring board so that it is be suitable to accommodate and install described sensitive chip 30.

Being different from above preferred embodiment, described circuit board module 10 includes that wiring board main body 121B, described wiring board main body 121B have two path 1212B, and the bottom of each described path 1212B is suitable to install described sensitive chip 30.Each described path 1212B makes the described upper and lower both sides of wiring board main body 121B be connected, thus when described sensitive chip 30 is installed on described wiring board main body 121B upward by the back side of described wiring board main body 121B and photosensitive area, the photosensitive area of described sensitive chip 30 is able to receive that the light entered by described camera lens 50.

Further, described wiring board master has two external groove 1213B, and each described external groove 1213B is communicated in the described path 1212B of correspondence, it is provided that the installation site of described sensitive chip 30.Especially, when described sensitive chip 30 is installed in described external groove 1213B, the outer surface of described sensitive chip 30 is consistent with the surface of described wiring board main body 121B, is generally aligned in the same plane, thus ensures the profile pattern of described circuit board module 10.

In this embodiment of the present utility model, described path 1212B is step-like, consequently facilitating install described sensitive chip 30, provides stable installation site for described sensitive chip 30, and makes its photosensitive area represent in interior space.

It is noted that in this embodiment of the present utility model, it is provided that a kind of be different from traditional chip mounting means, i.e. flip-chip mode (FlipChip, FC).Described sensitive chip 30 is installed on described wiring board main body 121B from the direction, the back side of described wiring board main body 121B, rather than as above-described embodiment needs the front from described wiring board main body 121B, i.e., from the top of described wiring board main body 121B, and the photosensitive area of described sensitive chip 30 is installed on described wiring board main body 121B upward.Such structure and mounting means, make described sensitive chip 30 and described disjunctor encapsulation part 11 relatively independent, the installation of described sensitive chip 30 will not be affected by described disjunctor encapsulation part 11, and the molded impact on described sensitive chip 30 of described disjunctor encapsulation part 11 is the least.In addition, described sensitive chip 30 is embedded in the lateral surface of described wiring board main body 121B, and the medial surface of described wiring board main body 121B will not be protruded from, so that reserve bigger space inside described wiring board main body 121B, the height making described disjunctor encapsulation part 11 will not be by the height limitation of described sensitive chip 30 so that described disjunctor encapsulation part 11 can reach less height.

It is noted that in other embodiments of the present utility model, described optical filter 40 is installed in the upper end of described path 1212B, that is, need not be installed on described optical filter 40 described disjunctor encapsulation part 11, thus reduce the back focal length of described array camera module, reduce the height of described shooting.Especially, described optical filter 40 can be carried out example is cutoff filter IRCF.

Fig. 9 is the array camera module according to the 4th preferred embodiment of the present utility model and the cut-away view of circuit board module 10 thereof.

Described circuit board module 10 includes a back-up coat 123C, is connected to described wiring board main body 121 bottom, in order to strengthen the structural strength of described wiring board main body 121 described back-up coat 123C lamination.That is, in described wiring board main body 121, the region bottom at described disjunctor encapsulation part 11 and described sensitive chip 30 place mounts described back-up coat 123C, so that described wiring board main body 121 reliablely and stablely supports described disjunctor encapsulation part 11 and described sensitive chip 30.

Further, described back-up coat 123C is a metallic plate, and described metallic plate is attached at the bottom of described wiring board main body 121, increase the structural strength of described wiring board main body 121, on the other hand, increase the heat dispersion of described circuit board module, the heat that the described sensitive chip 30 that can effectively scatter and disappear sends.

It is worth mentioning that, described wiring board main body 121 can use FPC (FlexPrintCircuit, flexible printed-circuit board), and by the rigidity of FPC described in described back-up coat 123C so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described circuit board module.It is to say, the selectable range of described wiring board main body 121 is more extensive, such as PCB (PrintedCircuitBoard, rigid printed circuit boards), FPC, RG (RigidFlex, Rigid Flex).Increase the structural strength of described wiring board main body 121 by described back-up coat 123B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 121, the height making described circuit board module reduces further, and the height being assembled the camera module obtained by it reduces.

Being different from above preferred embodiment, described wiring board main body 121D has at least one reinforced hole 1214D, and described disjunctor encapsulation part 11 extends in described reinforced hole 1214D, thus strengthens the structural strength of described wiring board main body 121D.

The position of described reinforced hole 1214D can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1214D makes the structural strength of described wiring board main body 121D strengthen, such that it is able to reduce the thickness of described wiring board main body 121D, reduces the thickness of the camera module assembled by it, and improves the heat dispersion of described circuit board module.

It is noted that described reinforced hole 1214D is groove-like, thus when manufacturing described circuit board module, the moulding material of described disjunctor encapsulation part 11 will not be spilt by described reinforced hole 1214D.

Figure 11 is the array camera module according to the 6th preferred embodiment of the present utility model and the cut-away view of circuit board module 10 thereof.

Being different from above preferred embodiment, described wiring board main body 121E has at least one reinforced hole 1214E, and described disjunctor encapsulation part 11 extends in described reinforced hole 1214E, thus strengthens the structural strength of described wiring board main body 121E.

The position of described reinforced hole 1214E can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1214E makes the structural strength of described wiring board main body 121E strengthen, such that it is able to reduce the thickness of described wiring board main body 121E, reduces the thickness of the camera module assembled by it, and improves the heat dispersion of described circuit board module.

It is worth mentioning that, described reinforced hole 1214E is perforation, that is, through described wiring board main body 121E so that the both sides connection of described wiring board main body 121E, thus when manufacturing described circuit board module, the moulding material of described disjunctor encapsulation part 11 is combined with described wiring board main body 121E fully, forming more firm composite structure, and the structure of the most described groove-like, described perforation is easier to processing and manufacturing.

Be different from above preferred embodiment is, described disjunctor encapsulation part 11F includes cladding section 111F, an optical filter construction section 112F and a camera lens construction section 113F, described optical filter construction section 112F and described camera lens construction section 113F molds the most integratedly and is connected to described cladding section 111F, described cladding section 111F molding is connected to described wiring board main body 121, is used for being coated with described component 122 and described connecting line 31.Described optical filter construction section 112F is used for installing described optical filter 40, that is, when described circuit board module is used for assembling described array camera module, the optical filter 40 of described array camera module is installed in described optical filter construction section 112F, described optical filter 40 is positioned on the photosensitive path of described sensitive chip 30, and need not provide extra optical filter 40 mounting bracket.That is, described disjunctor encapsulation part 11F has the function of conventional stent herein, but advantage based on moulding technology, described optical filter construction section 112F top can be by the technology mode of mold, make it have good planarization, so that described optical filter 40 is entirely mounted, this point is also an advantage over traditional camera module.Described camera lens construction section 113F is used for installing described camera lens 50, that is, when described circuit board module is used for assembling described array camera module, described camera lens 50 is installed in inside the described camera lens construction section 11F3 of described disjunctor encapsulation part 11F, in order to provide stable installation site for described camera lens 50.

Further, described optical filter construction section 112F has two mounting groove 1121F, described mounting groove 1121F and is communicated in the described through hole 1100F of correspondence, provides sufficient installing space for each described optical filter 40 so that each described optical filter 40 is stable to be installed.Described camera lens construction section 113F has two camera lens mounting groove 1131F, each described camera lens mounting groove 1131F and is communicated in the described through hole 1100F of correspondence, and the most each described camera lens 50 provides sufficient installing space.

In other words, described optical filter construction section 112F and described camera lens construction section 113F upwardly extends integratedly, and it is internally formed step-like structure, it is respectively described optical filter 40 and described camera lens 50 provides and supports fixed position, from without providing extra parts to install described optical filter 40 and described camera lens 50.

Described camera lens construction section 113F has two camera lens inwall 1132F, and each described camera lens inwall 1132F is respectively in closed annular, and being suitable to camera lens 50 provides installing space.It is noted that each described camera lens inwall 1132F surfacing of described camera lens construction section 1132F, thus be suitable to install threadless described camera lens 50, formed and focus module.Especially, described camera lens 50 can be fixed on described camera lens construction section 113F by the way of bonding.

With reference to Figure 13, it is the circuit board module according to the 9th preferred embodiment of the present utility model and camera module.Be different from above preferred embodiment is, described circuit board module 10 includes a screen layer 126, described screen layer 126 wraps up described wiring board main body 122 and described disjunctor encapsulation part 11, thus while strengthening the structural strength of described wiring board main body 122, strengthen the anti-electromagnetic interference capability of described circuit board module 10.

With reference to Figure 14, according to camera module and the circuit board module thereof of the of the present utility model ten preferred embodiment.Being different from above preferred embodiment, described camera module includes at least one support 70, is used for installing each described optical filter 40, each described camera lens 50 or each described motor 60.According to this embodiment of the present utility model, described support 70 is installed in described disjunctor encapsulation part 11, and each described optical filter 40 is installed in described support 70, and each described motor 60 is installed in described support 70.The concrete shape of described support 70 can be arranged as required to, and such as arranges boss, in order to installs each described optical filter.Shown support 70 can be a disjunctor support, say, that can be with the multiple described optical filter 40 of once mounting, it is also possible to be support unit, namely installs a described optical filter 40.In this embodiment of the present utility model, described support 70 is preferably disjunctor support.Those skilled in the art is it should be appreciated that the concrete shape of described support 70 is not restriction of the present utility model.

It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as the utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown the most in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.

Claims

1. the circuit board module of an array camera module, it is characterised in that including:

One wiring board portion, it is for being electrically connected with at least two sensitive chips of described array camera module；With

One disjunctor encapsulation part；Described disjunctor encapsulation part integral packaging is in described wiring board portion.

Described circuit board module the most according to claim 1, wherein said disjunctor encapsulation part forms at least two through hole, and each described through hole is relative with each described sensitive chip, to provide described sensitive chip passage of light.

Circuit board module the most according to claim 2, wherein said disjunctor encapsulation part top is plane, for support, camera lens, motor or the optical filter of installing described array camera module.

Circuit board module the most according to claim 2, wherein said disjunctor encapsulation part top has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, to be respectively used to install support, optical filter, camera lens or the motor of described array camera module.

Circuit board module the most according to claim 2, wherein said disjunctor encapsulation part includes a cladding section, an optical filter construction section and a camera lens construction section, described optical filter construction section and described camera lens construction section are upwards molded extension by described cladding section successively, and inside is step-like, in order to install optical filter and the camera lens of described array camera module.

Circuit board module the most according to claim 5, wherein said optical filter construction section has at least two mounting grooves, each described mounting groove is communicated in the described through hole of correspondence, form described the first step-like rank, so that installing described optical filter, described camera lens construction section has at least two camera lens mounting grooves, and each described camera lens mounting groove is communicated in the described through hole of correspondence, form described step-like second-order, in order to the camera lens of described array camera module is installed.

Circuit board module the most according to claim 6, wherein said camera lens construction section has at least two camera lens inwalls, and each described camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.

8. according to the arbitrary described circuit board module of claim 1 to 7, wherein said wiring board portion includes at least one component, described component protrudes from described wiring board main body, and described disjunctor encapsulation part is coated with described component, so that described component will not be directly exposed to outside.

Circuit board module the most according to claim 8, wherein said component selects to combine: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay.

Circuit board module the most according to claim 8, wherein wiring board main body has at least two paths, is suitable to each described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.

11. circuit board modules according to claim 10, wherein said path is step-like, in order to provide stable installation site for described sensitive chip.

12. circuit board modules according to claim 8, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.

13. circuit board modules according to claim 8, the material of wherein said disjunctor encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP.

14. circuit board modules according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes that a motor connects end, is revealed in described disjunctor encapsulation part, in order to connect a motor pin.

15. circuit board modules according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described disjunctor encapsulation part, and it is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part upper end, described lead-in wire includes that a motor connects end, described motor connects end line in described groove bottom wall, in order to a motor pin is electrically connected to described motor and connects end when being plugged in described pin groove.

16. circuit board modules according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described disjunctor encapsulation part, the top of described disjunctor encapsulation part is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.

17. circuit board modules according to claim 8, wherein said circuit board module includes at least two motor attachment structures, each described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described disjunctor encapsulation part, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.

18. circuit board modules according to claim 17, wherein said engraving circuit is arranged at described disjunctor encapsulation part in the way of laser formation.

19. an array camera modules, it is characterised in that including:

One according to the arbitrary described circuit board module of claim 1 to 18；

At least two camera lenses；With

At least two sensitive chips；Each described camera lens is positioned at the photosensitive path of the described sensitive chip of correspondence, and each described sensitive chip is electrically connected to described circuit board module.

20. array camera modules according to claim 19, wherein said array camera module includes at least one support, described support is installed in described circuit board module, and described array camera module includes that at least optical filter, each described optical filter are installed in described support.

21. array camera modules according to claim 19, wherein said array camera module includes that at least two motors, each described camera lens are installed in the described motor of correspondence, and each described motor is installed on described circuit board module.

22. array camera modules according to claim 19, wherein said array camera module includes that at least two optical filters, each described optical filter are installed in described circuit board module.