CN105704354A - Camera module, photosensitive assembly thereof and manufacturing method - Google Patents

Camera module, photosensitive assembly thereof and manufacturing method Download PDF

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Publication number
CN105704354A
CN105704354A CN201610142925.9A CN201610142925A CN105704354A CN 105704354 A CN105704354 A CN 105704354A CN 201610142925 A CN201610142925 A CN 201610142925A CN 105704354 A CN105704354 A CN 105704354A
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CN
China
Prior art keywords
photosensory assembly
encapsulation part
wiring board
main body
board main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610142925.9A
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Chinese (zh)
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CN105704354B (en
Inventor
田中武彦
赵波杰
王明珠
梅其敏
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201910423894.8A priority Critical patent/CN110324516B/en
Priority to CN201610142925.9A priority patent/CN105704354B/en
Priority to US15/075,192 priority patent/US10750071B2/en
Publication of CN105704354A publication Critical patent/CN105704354A/en
Priority to KR1020217005344A priority patent/KR102294537B1/en
Priority to PCT/CN2017/076041 priority patent/WO2017157211A1/en
Priority to EP17765753.3A priority patent/EP3429183A4/en
Priority to KR1020217005352A priority patent/KR102360319B1/en
Priority to JP2018548099A priority patent/JP7071926B2/en
Priority to US16/082,533 priority patent/US20190148429A1/en
Priority to KR1020187029304A priority patent/KR20180132684A/en
Priority to TW106108217A priority patent/TWI754632B/en
Priority to TW108135670D priority patent/TWI758644B/en
Priority to TW108135674A priority patent/TW202019155A/en
Priority to TW108135670A priority patent/TW202017356A/en
Priority to TW108135672A priority patent/TWI742441B/en
Priority to TW108135671A priority patent/TWI769403B/en
Priority to TW108135674D priority patent/TWI758645B/en
Priority to TW106203507U priority patent/TWM559558U/en
Priority to US15/461,413 priority patent/US9876949B2/en
Priority to US15/460,236 priority patent/US10084949B2/en
Priority to US15/460,231 priority patent/US9876948B2/en
Priority to US15/460,235 priority patent/US10277792B2/en
Priority to US15/784,171 priority patent/US10237460B2/en
Priority to US16/101,509 priority patent/US10367983B2/en
Priority to US16/436,934 priority patent/US10735637B2/en
Application granted granted Critical
Publication of CN105704354B publication Critical patent/CN105704354B/en
Priority to US16/908,723 priority patent/US11303789B2/en
Priority to US16/919,065 priority patent/US11706516B2/en
Priority to US17/685,587 priority patent/US11743569B2/en
Priority to US17/847,569 priority patent/US20230019091A1/en
Priority to US18/203,252 priority patent/US20230300442A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

The invention discloses a camera module, a photosensitive assembly thereof and a manufacturing method. The photosensitive assembly comprises a packaging part and a photosensitive part, wherein the photosensitive part comprises a circuit board main body and a photosensitive chip; and the packaging part is integrally packaged and formed on the circuit board main body and the photosensitive chip.

Description

Camera module and photosensory assembly thereof and manufacture method
Technical field
The present invention relates to camera module field, further, relate to a camera module and photosensory assembly thereof and manufacture method。
Background technology
COB (ChipOnBoard, chip package) technique is a technical process particularly important in camera module assembling manufacture process。The camera module that traditional COB technique is made for wiring board, sensitive chip, microscope base, motor drive and assemble through parts such as camera lenses。
As it is shown in figure 1, the camera module schematic diagram that the COB technique being traditional manufactures。Described camera module includes a wiring board 1P, a sensitive chip 2P, a support 3P, an optical filter 4P, a motor 5P and a camera lens 6P。Described sensitive chip 2P is installed in described wiring board 1P, described optical filter 4P is installed in described support 3P, described camera lens 6P is installed in described motor 5P, and described motor 5P is installed in described support 3P, in order to described camera lens 6P is positioned on the photosensitive path of described sensitive chip 2P。
It is worth mentioning that, described wiring board plate 1P has been usually installed some circuit devcies 11P, such as resistance, electric capacity etc., these circuit devcies 11P protrudes from described wiring board 1P surface, described support 3P then needs to be installed on the described wiring board 1P with described circuit devcie 11P, and the assembling matching relationship between wiring board 1P described in traditional COB technique, described circuit devcie 11P and described support 3P has some unfavorable factors, and limit camera module to a certain extent to lightening development。
It will also be appreciated that described sensitive chip is electrically connected to described wiring board typically by some gold threads 21P, in order to the information transmission between described sensitive chip 2P and described line plate plate 1P。And based on the characteristic of described gold thread 21P and structure, described gold thread 21P generally curvedly bends, and protrudes from the surface of described wiring board, therefore, the assembling process of described sensitive chip is also the same with described circuit devcie 11P, and camera module exists similar influence factor。
Specifically, first, described circuit devcie 11P and described gold thread 21P is directly exposed to the surface of described wiring board 1P, therefore in the process of follow-up assembling, such as paste described support 3P, weld the processes such as described motor 5P, inevitably it is affected, solder resist during welding, dusts etc. are easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 2P is positioned at the space being interconnected, therefore contamination by dust thing is easy to affect sensitive chip 2P, such impact is likely to result in the camera module after assembling and there is the bad phenomenon such as dirty stain, reduce product yield。
Secondly, described support 3P is positioned at the outside of described circuit devcie 11P, therefore when installing described support 3P and described wiring board 1P, need reserved certain safe distance between described support 3P and described circuit devcie 11P, and in the horizontal direction and upwardly direction be required for reserved safe distance, this increases the demand of camera module thickness to a certain extent so that it is thickness is difficult to reduce。
3rd, in the COB process assembled, described support 3P is glued to described wiring board 1P by paste such as glue, it is typically conducted AA (ActiveArrangement calibrates automatically) technique when pasting, it is exactly adjust described support 3P, the central axis of described wiring board 1P and described motor 5P, reach horizontal direction consistent with vertical direction, therefore to meet AA technique, need to be required for presetting more glue between described support 3P and described wiring board 1P and described microscope base and described motor 5P, make to leave adjustment space each other, and this demand adds the thickness requirements to camera module on the one hand to a certain extent, its thickness is made to be difficult to reduce, on the other hand, repeatedly pasting assembling process, to easily cause the inclination of assembling inconsistent, and to described microscope base 3P, the planarization of described wiring board 1P and described motor 5P requires higher。
In addition, in traditional COB technique, described wiring board 1P provides most basic fixing, support carrier, therefore, described wiring board 1P itself is required possess certain structural strength, this requirement makes described wiring board 1P have bigger thickness, thus the pre-add thickness requirements of camera module again from another point of view。
Along with various electronic products, the development of smart machine, camera module is also increasingly to high-performance, lightening direction is developed, and in the face of high pixel, the various high performance demand for development such as high imaging quality, electronic devices and components in circuit get more and more, the area of chip is increasing, drive resistance, the Passive components such as electric capacity increase accordingly, this makes the specification of electronic device increasing, assemble difficulty constantly to increase, the overall dimensions of camera module is increasing, and from above-mentioned, microscope base, traditional assembling mode of wiring board and component etc. is also the very big restriction of the lightening development of camera module to a certain extent。
Summary of the invention
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes an encapsulation part and a photographic department, and described encapsulation part encapsulated moulding is in described photographic department。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photographic department includes a sensitive chip and a wiring board main body, described sensitive chip is electrically connected to described wiring board main body by least one connecting line, described encapsulation part is coated with described connecting line so that it is will not be directly exposed to outside。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said connecting line is coated on inside described encapsulation part integratedly by the manufacture passing through to mold。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes at least one component, and described component is coated in described encapsulation part, so as not to be directly exposed to outside。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said component is coated on inside described encapsulation part integratedly by the manufacture passing through to mold。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said sensitive chip has a photosensitive area and a non-photo-sensing district, described encapsulation part is molded into the non-photo-sensing district of described sensitive chip, reduces described photosensory assembly and by the length and width size of the camera module of its assembling。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said wiring board main body has an inner groovy, and described sensitive chip is arranged in described inner groovy, thus reducing the requirement for height to described encapsulation part。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said encapsulation part includes a cladding section and an optical filter construction section, described optical filter construction section one molding is connected to described cladding section, described optical filter construction section is suitable to a mounted optical filter, from the optical filter mounting bracket extra without offer。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said encapsulation part includes a camera lens construction section, and it upwardly extends integratedly, is suitable to install a camera lens therein。
It is an object of the present invention to provide one based on the photosensory assembly of moulding technology and camera module and manufacture method thereof, wherein said camera lens construction section has screw thread, in order to be spirally connected a camera lens。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method; wherein said photosensory assembly includes an optical filter; it is arranged at the top of described sensitive chip described optical filter molding; described sensitive chip is protected thereby through described optical filter; and can reduce by the back focal length of the camera module of its assembling so that the height of camera module is less。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes a back-up coat, it is connected to the bottom side of described wiring board main body described back-up coat lamination, thus increasing the structural strength of described wiring board main body, so that adopting the described wiring board main body that thickness is less, and the heat-sinking capability of described wiring board main body can be improved。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said circuit main body has at least one reinforced hole, described encapsulation part extends into described reinforced hole, thus the bonding force strengthened between described encapsulation part and described photosensory assembly, and increase the structural strength of described wiring board main body。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said encapsulation part is suitable to a mounted motor or a camera lens, can as traditional support, the support fixed position of described motor or described camera lens is provided, and by the molded advantage of described encapsulation part, there is good flatness, thus obtaining reducing shooting membrane module to assemble heeling error。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said camera module adopts the mode of molding to carry out assembly, thus changing traditional camera module COB technique。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, it adopts the mode of molding to manufacture described photosensitive circuit pack, thus molded, integration described photosensory assembly。
It is an object of the present invention to provide a camera module and photosensory assembly thereof and manufacture method, wherein said photosensory assembly includes a motor attachment structure, in order to connect motor, thus changing traditional motor welding manner。
For other purposes and the advantage of the object above and the present invention that realize the present invention, an aspect of of the present present invention provides the photosensory assembly of a camera module, comprising: an encapsulation part and a photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip。
According to one embodiment of the invention, encapsulation part described in described photosensory assembly forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light。
According to one embodiment of the invention, the bottom of the described through hole of encapsulation part described in described photosensory assembly is skewed in what be gradually increased from the bottom to top。
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly is suitable to install the camera lens of described camera module, motor or optical filter。
According to one embodiment of the invention, encapsulation part top described in described photosensory assembly has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor。
According to one embodiment of the invention, sensitive chip described in described photosensory assembly includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part。
According to one embodiment of the invention, photographic department described in described photosensory assembly includes at least one component, described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside。
According to one embodiment of the invention, component described in described photosensory assembly selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay。
According to one embodiment of the invention, photographic department described in described photosensory assembly includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reduce the back focal length of described camera module so that it is highly reduce。
According to one embodiment of the invention, photographic department described in described photosensory assembly includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body。
According to one embodiment of the invention, back-up coat described in described photosensory assembly is metallic plate, to strengthen the heat dispersion of described photographic department。
According to one embodiment of the invention, photographic department described in described photosensory assembly includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly。
According to one embodiment of the invention, screen layer described in described photosensory assembly is metallic plate or wire netting。
According to one embodiment of the invention, in described photosensory assembly, wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body。
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is groove-like, in order to when molding described encapsulation part, moulding material will not be spilt by described reinforced hole。
According to one embodiment of the invention, reinforced hole described in described photosensory assembly is through hole, so that the moulding material of described encapsulation part and described wiring board main body are fully contacted, and easily fabricated。
According to one embodiment of the invention, photographic department described in described photosensory assembly includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside。
According to one embodiment of the invention, connecting line described in described photosensory assembly is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel。
According to one embodiment of the invention, the material of wiring board main body described in described photosensory assembly can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC。
According to one embodiment of the invention, the material of encapsulation part described in described photosensory assembly is selected from combination: one or more in epoxy resin nylon, LCP or PP。
According to one embodiment of the invention, photosensory assembly described in described photosensory assembly includes a motor attachment structure, it includes at least one lead-in wire, described lead-in wire is arranged at described encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes a motor link, is revealed in described encapsulation part, in order to connect a motor pin。
According to one embodiment of the invention, described in described photosensory assembly, lead-in wire is arranged at described encapsulation part surface。
According to one embodiment of the invention, in described photosensory assembly, lead-in wire is set inside encapsulation part described in。
According to one embodiment of the invention, described photosensory assembly includes a motor attachment structure, it includes at least one lead-in wire and pin groove, described lead-in wire is arranged at described encapsulation part, and it being electrically connected to described wiring board main body, described pin groove is arranged at described encapsulation part upper end, and described lead-in wire includes a motor link, described motor link circuit is in described groove bottom wall, in order to a motor pin is electrically connected to described motor link when being plugged in described pin groove。
According to one embodiment of the invention, described photosensory assembly includes a motor attachment structure, it includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described encapsulation part, extended to the top of described encapsulation part by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove。
According to one embodiment of the invention, described photosensory assembly includes a motor attachment structure, and it includes at least one engraving circuit, and described engraving circuit is arranged at described encapsulation part, is electrically connected to described wiring board main body, in order to electrically connect a motor pin。
According to one embodiment of the invention, carve circuit described in described photosensory assembly in the way of laser formation, be arranged at described encapsulation part。
According to one embodiment of the invention, carve circuit described in described photosensory assembly and the surface of described encapsulation part is set。
Another aspect of the present invention provides the photosensory assembly of a camera module, and it includes an encapsulation part and a photographic department；Described photographic department includes a wiring board main body, a sensitive chip and an optical filter, and described encapsulation part encapsulated moulding is in described wiring board main body, described sensitive chip and described optical filter。
Another aspect of the present invention provides the manufacture method of the photosensory assembly of a camera module, and it includes step: encapsulated moulding one encapsulation part in a wiring board main body and a sensitive chip。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: attaches described sensitive chip in a wiring board main body, and is electrically connected by least one connecting line。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be coated with described connecting line by described encapsulation part。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: extend a described encapsulation part non-photo-sensing district to described sensitive chip。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: form a mounting groove on described encapsulation part top, in order to install an optical filter, motor or camera lens。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arranges at least one reinforced hole in described wiring board main body, and makes described encapsulation part extend into described reinforced hole。。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be coated with a screen layer in described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: bury a lead-in wire underground to described encapsulation part, and makes described lead-in wire electrically connect described wiring board main body, in order to connect a motor。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arranges a pin groove to described encapsulation part upper end, and makes a motor link of described lead-in wire be revealed in described pin groove。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arrange at least one circuit junction extremely described wiring board main body, and a pin groove extremely described encapsulation part is set, described circuit junction is made to be revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when inserting described pin groove。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: arranging an engraving circuit to described encapsulation part, described engraving circuit is electrically connected to described wiring board main body, in order to electrically connect a motor。
According to one embodiment of the invention, carve circuit described in the manufacture method of described photosensory assembly in the way of laser formation, be arranged at described encapsulation part。
Another aspect of the present invention provides the manufacture method of the photosensory assembly of a camera module, and it includes step: encapsulate an encapsulation part on a wiring board main body, a sensitive chip and an optical filter。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: attaches described sensitive chip in a wiring board main body, and is electrically connected by least one connecting line。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: cover described optical filter on described sensitive chip, to protect described sensitive chip。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: be coated with described connecting line and described optical filter by described encapsulation part。
According to one embodiment of the invention, the manufacture method of described photosensory assembly includes step: extend described encapsulation part to described optical filter edge。
Another aspect of the present invention one camera module, comprising: described photosensory assembly and a camera lens；Described camera lens is positioned at the photosensitive path of the described sensitive chip of described photosensory assembly。
According to one embodiment of the invention, described camera module includes a support, and described support is installed in described photosensory assembly, and described camera lens is installed on described support。
According to one embodiment of the invention, described camera module includes a motor, and described camera lens is installed in described motor, and described motor is installed on described photosensory assembly。
According to one embodiment of the invention, described camera module includes an optical filter, and described optical filter is installed in described photosensory assembly。
According to one embodiment of the invention, described camera module includes an optical filter, and described optical filter is installed in described support。
Accompanying drawing explanation
Fig. 1 is the camera module cut-away view of tradition COB technique。
Fig. 2 is the axonometric chart of the photosensory assembly of first preferred embodiment according to the present invention。
Fig. 3 is the cut-away view of the photosensory assembly of first preferred embodiment according to the present invention。
Fig. 4 is the manufacture process schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention。
Fig. 5 is the manufacture method schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention。
Fig. 6 A, 6B and Fig. 6 C are the different embodiment schematic diagrams of the motor attachment structure of the photosensory assembly of first preferred embodiment according to the present invention。
Fig. 7 is the camera module cut-away view of first preferred embodiment according to the present invention。
Fig. 8 is the camera module exploded view of first preferred embodiment according to the present invention。
Fig. 9 is another camera module cut-away view of first preferred embodiment according to the present invention。
Figure 10 is the exploded view of another camera module of first preferred embodiment according to the present invention。
Figure 11 is the cut-away view of the photosensory assembly of second preferred embodiment according to the present invention。
Figure 12 is the camera module cut-away view of second preferred embodiment according to the present invention。
Figure 13 is the sectional view of the photosensory assembly of the 3rd preferred embodiment according to the present invention。
Figure 14 is the camera module cut-away view of the 3rd preferred embodiment according to the present invention。
Figure 15 is another camera module cut-away view of the 3rd preferred embodiment according to the present invention。
Figure 16 is the cut-away view of the photosensory assembly of the 4th preferred embodiment according to the present invention。
Figure 17 is the photosensory assembly manufacture method schematic diagram of the 4th preferred embodiment according to the present invention。
Figure 18 is the camera module cut-away view of the 4th preferred embodiment according to the present invention。
Figure 19 is another camera module cut-away view of the 4th preferred embodiment according to the present invention。
Figure 20 is the photosensory assembly cut-away view of the 5th preferred embodiment according to the present invention。
Figure 21 is the photosensory assembly exploded view of the 5th preferred embodiment according to the present invention。
Figure 22 is the module photosensory assembly cut-away view of the 6th preferred embodiment according to the present invention。
Figure 23 is the 6th the camera module sectional view being preferably preferable to carry out according to the present invention。
Figure 24 is the camera module sectional view of the 7th preferred embodiment according to the present invention。
Figure 25 A and 25B is the beneficial effect comparison diagram of the camera module of the above preferred embodiment according to the present invention。
Detailed description of the invention
It is described below for disclosing the present invention so that those skilled in the art are capable of the present invention。Preferred embodiment in being described below is only used as citing, it may occur to persons skilled in the art that other apparent modification。The ultimate principle of the present invention defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention。
What it will be understood by those skilled in the art that is, in the exposure of the present invention, term " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore above-mentioned term is not considered as limiting the invention。
With reference to Fig. 2 to Fig. 8, it is illustrated according to the photosensory assembly of the first of the present invention preferred embodiment and camera module。Described photosensory assembly 10 camera module described in assembly。Described photosensory assembly 10 includes encapsulation part 11 and a photographic department 12, is connected to described photographic department 12, for instance the mode of molding forms integrative-structure described encapsulation part 11 integral packaging。
Described photographic department 12 includes wiring board main body 122 and a sensitive chip 121, and described sensitive chip 121 is arranged in described wiring board main body 122。According to this embodiment of the invention, it is connected to described wiring board main body 122 described sensitive chip 121 molding。Especially, described encapsulation part 11 (MoldingonChip, MOC) in the way of being molded into chip is molded into described photographic department 12。
According to this embodiment of the present invention, described photographic department 12 includes a connection line (not shown) and at least one component 123。Described connection line defaults in described wiring board main body 122, and described component 123 is electrically connected to described connection line and described sensitive chip 121, for the photosensitive work process of described sensitive chip 121。Described component 123 is arranged at described wiring board main body 122 projectedly。Described component 123 it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123 is coated on inside it by described encapsulation part 11, hence in so that described component 123 will not be directly exposed in space, more specifically, it is not exposed in the environment communicated with described sensitive chip 121, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123, without affecting described sensitive chip 121, it is different from the existing way that in tradition camera module, circuit devcie exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123 surface, avoid polluting described sensitive chip 121 and make camera module that the bad phenomenon such as dirty stain occur。
It is worth mentioning that, in this embodiment in accordance with the invention, protrude wiring board main body 122 described in for described component 123 to illustrate, and in other embodiments of the invention, described component 123 can be embedded in described wiring board main body 123 and non-bulging in described wiring board main body, those skilled in the art is it should be appreciated that the shape of described component 123, type and arrange the restriction that position is not the present invention。
Described encapsulation part 11 forms a through hole 1100, in order to provide photosensitive path for described sensitive chip 121。
This preferred embodiment according to the present invention, described photographic department 12 includes at least one connecting line 124, is used for electrically connecting described sensitive chip 121 and described wiring board main body 122。Further, each described connecting line 124 may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124 curvedly connects described sensitive chip 121 and described wiring board main body 122。
It is worth mentioning that, it is internal that each described connecting line 124 is molded into described encapsulation part 11, such that it is able to each described connecting line 124 is coated with by described encapsulation part 11, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124 will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124 simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121 and described wiring board main body 122, this point is totally different from prior art。
The bottom of the described through hole 1100 of described encapsulation part 11 is skewed in what be gradually increased from the bottom to top, it is possible to understand that the present invention in the shape of described through hole 1100 be not limited to this tilted shape。
It is worth mentioning that; described encapsulation part 11 is coated with described component 123 and described connecting line 124; have and protect described component 123 and described connecting line 124 and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11 is not limited to be coated with described component 123 or described connecting line 124。It is to say, in other embodiments of the invention, described encapsulation part 11 can directly be molded into the described wiring board main body 122 of the described component 123 not protruded, it is also possible to be molded into outside described component 123, the diverse location such as surrounding。
Further, described sensitive chip 121 has photosensitive area 1211 and a non-photo-sensing district 1212, and it is peripheral that described non-photo-sensing district 1212 is surrounded on described photosensitive area 1211。Described photosensitive area 1211 is used for carrying out photosensitization, and described connecting line 124 is connected to described non-photo-sensing district 1212。
This preferred embodiment according to the present invention, described encapsulation part 11 extends the described non-photo-sensing district 1212 of described sensitive chip 121, thus described sensitive chip 121 is fixed on described wiring board main body 122 by the mode lamination molded。By such mode, as being molded into the mode (MoldingonChip of chip, MOC) the inside mouldable scope of described encapsulation part 11 is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122 and described encapsulation part 11, reduce the length and width size of described photosensory assembly 10 further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, the protruding ground of described encapsulation part 11 is outside the described photosensitive area 1211 of described sensitive chip 121, especially, described encapsulation part 11 closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10 is used to assemble described camera module, described sensitive chip 121 is sealed in inside, form space in a closing。
Specifically, when manufacturing described photosensory assembly 10, a traditional wiring board can be chosen as described wiring board main body 122, described wiring board main body 122 arranges sensitive chip 121 described in, described sensitive chip 121 is electrically connected by described connecting line 124, and then described molding wiring board main body 122 after preliminary assembling and molding on sensitive chip 121 parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11, or form described encapsulation part 11 with mould pressing process conventional in semiconductor packages。Described wiring board main body 122 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc.。Described encapsulation part 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc.。The material that described encapsulation part 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin。It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention。
It is worth mentioning that, based on the molded mode of the described photosensory assembly 10 of the present invention, described photosensory assembly 10 is more suitable for layout operation, once completes the manufacture of the described photosensory assembly 10 of more amount, such as can reach 90, and traditional wiring board once can only produce at most 8。
Further, described encapsulation part 11 includes cladding section 111 and an optical filter construction section 112, it is integrally connected to described cladding section 111 described optical filter construction section 112 molding, described cladding section 111 molding is connected to described wiring board main body 122, is used for being coated with described component 123 and described connecting line 124。Described optical filter construction section 112 is used for installing an optical filter 20, that is, when described photosensory assembly 10 is used to assemble described camera module, the described optical filter 20 of described camera module is installed in described optical filter construction section 112, described optical filter 20 is positioned on the photosensitive path of described sensitive chip 121, and extra optical filter mounting bracket need not be provided。That is, described encapsulation part 11 has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112 top can by the technology mode of mold, make it have good planarization, so that described optical filter 20 is entirely mounted, this point is also an advantage over traditional camera module。
Further, described optical filter construction section 112 has a mounting groove 1121, described mounting groove 1211 is communicated in described through hole 1100, provides sufficient installing space for described optical filter 20 so that described optical filter 20 will not protrude from the top surface of described camera lens construction section 112。It is to say, described encapsulation part 11 upper end arranges described mounting groove, such that it is able to described optical filter 20 is installed on wherein。Especially, described optical filter 20 is a cutoff filter IRCF。
It is worth mentioning that, in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing optical filter, and in other enforcements of the present invention, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove is not the restriction of the present invention。
It is noted that the inwall of described encapsulation part 11 can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121 can receive more light being coated with while described connecting line 124。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11 is not the restriction of the present invention。
Further, this preferred embodiment according to the present invention, described photosensory assembly 10 includes a motor attachment structure 13, for connecting a motor 40 of described camera module。Described motor 40 has at least one motor pin 41。Described motor attachment structure 13 includes at least one lead-in wire 131, and each described lead-in wire 131 is used for electrically connecting described motor 40 and described wiring board main body 122。Each described lead-in wire 131 is electrically connected to wiring board main body 122。Further, described lead-in wire 131 is electrically connected to the connection circuit of described wiring board main body 122。Described lead-in wire 131 is arranged at described encapsulation part 11, and extends to the top of described encapsulation part 11。Described lead-in wire 131 includes a motor link 1311, is revealed in the top of described encapsulation part 11, for electrically connecting the described pin 41 of described motor 40。It is noted that described lead-in wire 131 can be arranged by embedding manner when forming described encapsulation part 11。In traditional connected mode, such as driving the parts such as motor is all be connected to wiring board by arranging independent wire, manufacturing process relative complex, and the mode burying described lead-in wire 114 when this molding of the present invention underground can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected。Especially, in the one of the present invention implements, described lead-in wire 131 is a wire, is embedded in described encapsulation part 11 internal。Citing ground, described motor pin 41 can be connected to described motor link 1311 by anisotropic conductive film, it is also possible to is connected to described motor link 1311 by the mode welded。
It is worth mentioning that, the position that the burial place of described lead-in wire 131 and the described motor link 1311 of described lead-in wire 131 show in described encapsulation part 11 can be arranged as required to, such as, in one embodiment of this invention, the described motor link 1311 of described lead-in wire 131 can be arranged at the periphery of described encapsulation part 11, the i.e. top surface of described encapsulation part 11, the top surface of described optical filter construction section 112, and in another embodiment of the invention, described motor link 1311 can be arranged in described encapsulation part 11 and enclose, i.e. described mounting groove 121 bottom surface of described encapsulation part 11, such that it is able to provide described motor 40 different installation site。In other words, when described motor 40 needs to be mounted to described encapsulation part top, described motor link 1311 is arranged at described encapsulation part periphery top surface, when described motor 40 needs to be mounted to described mounting groove 121, described motor link 1311 is arranged in described encapsulation part 11 and encloses, i.e. described mounting groove groove bottom。
That is, when manufacturing described photosensory assembly 10, first mount 121, described photosensitive core, then in described wiring board main body 122 and described sensitive chip 121, described encapsulation part 11 is molded in the way of MOC, and described lead-in wire 131 can be set inside described encapsulation part 11 with embedding manner when molding, and make described lead-in wire 131 be electrically connected to described wiring board main body 122, and make the described motor link 1311 of described lead-in wire 131 be shown in the top of described encapsulation part, in order to it is connected to the described pin 41 of described motor 40。Citing ground, when described photosensory assembly 10 is used to assemble described shooting molding, the each described pin 41 of described motor 40 is connected to the described motor link 1311 of described lead-in wire 131 by the mode welded, so that described motor 40 is electrically connected to described wiring board main body 122, and needing, independent wire is set described motor 40 and described wiring board main body 122 are connected, and the length of the described pin 42 of described motor 40 can be reduced。
It is worth mentioning that, the burial place of described lead-in wire 131 can be arranged as required to, such as, in one embodiment of the invention, it is possible to be arranged at the inside of described encapsulation part 11, described lead-in wire 131 is hidden, and in another embodiment, described lead-in wire 131 can be embedded in the surface of described encapsulation part 11, and those skilled in the art is it should be appreciated that the position of described lead-in wire 131 is not the restriction of the present invention。
It it is an Equivalent embodiments of the described motor attachment structure of the above preferred embodiment according to the present invention with reference to Fig. 6 A。Described motor attachment structure 13 includes at least one pin groove 133, and described pin groove 133 is for holding the described pin 41 of the described motor 40 of described camera module。Described pin groove 133 is arranged at described encapsulation part 11 upper end。Described motor attachment structure 13 includes each described lead-in wire 134 of at least one lead-in wire 134 for electrically connecting described motor 40 and described wiring board main body 122。Described lead-in wire 134 is arranged at described encapsulation part 11, and extends upwardly to the groove bottom wall of the described pin groove 133 of described encapsulation part 11。Described lead-in wire 134 includes a motor link 1341, is revealed in the groove bottom wall of the described pin groove 133 of described encapsulation part 11, for electrically connecting the described pin 41 of described motor 40。Especially, in one embodiment, described motor link 1341 may be implemented as a pad。Described lead-in wire 134 may be implemented as a wire, is embedded in described encapsulation part 11 internal。
That is, when manufacturing described photosensory assembly 10, first mount 121, described photosensitive core, then in described wiring board main body 122 and described sensitive chip 121, described encapsulation part 11 is molded in the way of MOC, and the described pin groove 133 of default predetermined length, and described lead-in wire 134 can be set embedding manner when molding, and make described lead-in wire 134 be electrically connected to described wiring board main body 122, and make the described motor link 1341 of described lead-in wire 134 be shown in the groove bottom wall of described pin groove 133 of described encapsulation part 11, so that being connected to the described pin 41 of described motor 40。Citing ground, when described photosensory assembly 10 is used to assemble described shooting molding, the each described pin 41 of described motor 40 inserts described pin groove 133, and the described motor link 1341 of described lead-in wire 134 it is connected to by the mode welded, so that described motor 40 is electrically connected to described wiring board main body 122, and needing, independent wire is set described motor 40 and described wiring board main body 122 are connected, and make can stably the connecting of described pin 42 of described motor 40, it is prevented that outside unwanted touches described motor pin 41。Especially, described lead-in wire 134 may be implemented as a wire, is embedded in described encapsulation part 11 internal。
It is worth mentioning that, the burial place of described lead-in wire 134 can be arranged as required to, such as, in one embodiment of the invention, it is possible to be arranged at the inside of described encapsulation part 11, described lead-in wire 134 is hidden, and in another embodiment, described lead-in wire 134 can be embedded in the surface of described encapsulation part 11, and those skilled in the art is it should be appreciated that the position of described lead-in wire 134 is not the restriction of the present invention。
With reference to Fig. 6 B, it it is another Equivalent embodiments of the motor attachment structure of the above preferred embodiment according to the present invention。Described motor attachment structure 13 includes a pin groove 135, and described pin groove 135 is for holding the described pin 41 of the described motor 40 of described camera module。Described pin groove 135 is arranged at described encapsulation part 11。Described motor attachment structure 13 includes at least one circuit junction 132, and described circuit junction 132 defaults in described wiring board main body 122, and is electrically connected in described wiring board main body the described connection line of 122。Further, each described pin groove 135 is extended to described wiring board main body 122 by the top of described encapsulation part 11, and described circuit junction 132 is shown。In a way of example, described motor pin 41 is adapted for insertion into described pin groove 135, and can be welded to connect with described circuit junction 132。
That is, when manufacturing described photosensory assembly 10, described wiring board main body 122 is preset each described circuit junction 132, and then mount 121, described photosensitive core, then in described wiring board main body 122 and described sensitive chip 121, in the way of MOC, mold described encapsulation part 11 and the described pin groove 135 of default predetermined length, and described circuit junction 132 is shown by described pin groove 135, in order to it is connected to the described pin 41 of described motor 40。Citing ground, when described photosensory assembly 10 is used to assemble described shooting molding, the each described pin 41 of described motor 40 inserts described pin groove 135, and it is connected to the described circuit junction 132 in wiring board main body 122 by the mode welded, so that described motor 40 is electrically connected to described wiring board main body 122, and make can stably the connecting of described pin 41 of described motor 40, it is prevented that outside unwanted touches described motor pin 41。
With reference to Fig. 6 C, it it is above-mentioned another Equivalent embodiments being preferable to carry out inner motor attachment structure according to the present invention。Described motor attachment structure 13 includes at least one engraving circuit 136, and described engraving circuit 136 is for electrically connecting the parts such as described connection line in described wiring board main body 122, described sensitive chip 121 and motor。Citing ground but be not limited to, described engraving circuit 136 can pass through the setting when forming described encapsulation part 11 of the mode of laser formation (LDS)。Citing ground, in one embodiment of this invention, described engraving circuit 136 is arranged at the surface of described encapsulation part 11 in traditional connected mode by the mode of laser direct forming, such as driving the parts such as motor is all be connected to wiring board by arranging independent wire, manufacturing process relative complex, and the mode arranging described engraving circuit 136 when this molding of the present invention can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected。More specifically, the forming process of described engraving circuit 136 is it may be that presently described encapsulation part 11 arranges engraving groove, then in described engraving groove, circuit is set in the way of plating。
With reference to Fig. 2 to Fig. 5 and Fig. 7 and Fig. 8, being a camera module of first preferred embodiment according to the present invention, described camera module can be a dynamic burnt camera module (AutomaticFocusModel, AFM)。Described camera module includes motor 40 and a camera lens 30 described in optical filter 20, described in photosensory assembly 10, described in。
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed in described motor 40, and described motor 40 is installed on described molding circuit pack 10。
Further, described optical filter 20 is installed in the described mounting groove 1121 of the described optical filter construction section 112 of the described encapsulation part 11 of described photosensory assembly 10。Described motor 40 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10。It is to say, described optical filter 20 is installed in the described mounting groove of described encapsulation part 11, described camera lens 30 is installed in described motor 40, and described motor 40 is installed in the top of described encapsulation part 11。
Especially, the described motor pin 41 of described motor 40 is electrically connected to the described circuit junction 132 of described photosensory assembly, is electrically connected to described wiring board main body 122 thereby through described lead-in wire 131。Described motor pin 41 can be connected to the described motor link 1311 of described lead-in wire 131 by conductive adhesive film, it is also possible to is connected to described motor link 1311 by the mode welded。
Especially, when described pin is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40 and described photographic department 12, thus reducing the technical process of motor welding。
It is worth mentioning that, in this embodiment in accordance with the invention, in the way of described lead-in wire 131 connects described motor 40, illustrate that the present invention electrically connects the mode of motor, and described in other embodiments of the present invention, the described motor attachment structure 13 of different modes can be selected to connect described motor 40, such as, choose Fig. 6 A, 6B, the mode of example in 6C, that is, described 6A, 6B, different motor attachment structures corresponding in 6C can combine from different photosensory assemblies, thus providing different motor connected mode, those skilled in the art should be understood that, mode shown in figure, it it is not the restriction of the present invention。
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention。
With reference to Fig. 2 to Fig. 5 and Fig. 9 and Figure 10, another camera module according to the first of the present invention preferred embodiment。Described camera module can be one focus module (FixFocusModel, FFM)。Described camera module includes optical filter 20 and a camera lens 30 described in photosensory assembly 10, described in。
Described optical filter 20 is installed in described photosensory assembly 10, and described camera lens 30 is installed on described photosensory assembly 10。
More specifically, described optical filter 20 is installed in the described mounting groove 1121 of the described optical filter construction section 112 of the described encapsulation part 11 of described photosensory assembly 10。Described camera lens 30 is by the top of the described optical filter construction section 112 by the described encapsulation part 11 being installed on described photosensory assembly 10。It is to say, described optical filter is installed in described mounting groove, described camera lens 30 is installed in described encapsulation part 11 top。
It will also be appreciated that, described camera lens 30 is installed in described optical filter construction section 112 top of the described encapsulation part 11 of described photosensory assembly 10, thus described encapsulation part 11 is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30, but assemble and be but different from tradition COB technical process。The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11 is fixed on described wiring board main body 122 by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11 and described wiring board main body 122, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11 is coated with described component 123 and described connecting line 124, traditional cradling function and component 123 and described connecting line 124 can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11 of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce。Additionally, described encapsulation part 11 replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles。And described encapsulation part 11 is coated with described connecting line 124, and described encapsulation part 11 extends to the non-photo-sensing district 1212 of described sensitive chip 121 so that described encapsulation part 11 can to contract, thus reducing the horizontal length and width size of described camera module further。
With reference to Figure 11 and Figure 12, according to the camera module photosensory assembly of the second of the present invention preferred embodiment and camera module。Described photosensory assembly 10A is camera module described in assembly, thus obtaining the camera module of moulding type。Described photosensory assembly 10A is connected to described photographic department 12A with including an encapsulation part 11A and a photographic department 12A, described encapsulation part 11A molding。
Described photographic department 12A includes an a wiring board main body 122A and sensitive chip 121A, and described sensitive chip 121A is arranged on described wiring board main body 122A。According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121A molding。
According to this embodiment of the present invention, described photographic department 12A includes a connection line (not shown) and at least one component 123A。Described connection line defaults in described wiring board main body 122A, described component 123A and is electrically connected to described connection line and described sensitive chip 121A, for the photosensitive work process of described sensitive chip 121A。Described component 123A is arranged at described wiring board main body 122A projectedly。Described component 123A it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123A is coated on inside it by described encapsulation part 11A, hence in so that described component 123A will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121A environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123A, without affecting described sensitive chip 121A, it is different from the existing way that in tradition camera module, component 123A exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123A surface, avoid polluting described sensitive chip 121A and make camera module that the bad phenomenon such as dirty stain occur。
Described encapsulation part 11A forms a through hole 1100A, in order to provide photosensitive path for described sensitive chip 121A。
This preferred embodiment according to the present invention, described photographic department 12A includes at least one connecting line 124A, is used for electrically connecting described sensitive chip 121A and described wiring board main body 122A。Further, each described connecting line 124A may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124A curvedly connects described sensitive chip 121A and described wiring board main body 122A。It is worth mentioning that, each described connecting line 124A is molded into inside described encapsulation part 11A, such that it is able to each described connecting line 124A is coated with by described encapsulation part 11A, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124A will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124A simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121A and described wiring board main body 122A, this point is totally different from prior art。
It is worth mentioning that; described encapsulation part 11A is coated with described component 123A and described connecting line 124A; there is protection described component 123A and described connecting line 124A and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11A is not limited to be coated with described component 123A or described connecting line 124A。It is to say, in other embodiments of the invention, described encapsulation part 11A can directly be molded into the described wiring board main body 122A of the described component 123A not protruded, it is also possible to be molded into outside described component 123A, the diverse location such as surrounding。
What be different from above preferred embodiment is, described wiring board main body 122A has an inner groovy 1222A, described sensitive chip 121A is arranged in described inner groovy 1222A, so that the relative altitude of described sensitive chip 121A and described wiring board main body 122A reduces, thus when described encapsulation part 11A is coated with described sensitive chip 121A, reduce the requirement for height to described encapsulation part 11A, thus reducing the height of the described photosensory assembly 10A camera module assembled。
Further, described sensitive chip 121A has an a photosensitive area 1211A and non-photo-sensing district 1212A, described non-photo-sensing district 1212A to be surrounded on described photosensitive area 1211A peripheral。Described photosensitive area 1211A is used for carrying out photosensitization, and described connecting line 124A is connected to described non-photo-sensing district 1212A。
This preferred embodiment according to the present invention, described encapsulation part 11A extends the described non-photo-sensing district 1212A of described sensitive chip 121A, thus described sensitive chip 121A is fixed on described wiring board main body 122A by the mode lamination molded。By such mode, as being molded into the mode (Moldingonchip of chip, MOC) the inside mouldable scope of described encapsulation part 11A is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122A and described encapsulation part 11A, reduce the length and width size of described photosensory assembly 12A further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, described encapsulation part 11A projection ground is outside the described photosensitive area 1211A of described sensitive chip 121A, especially, described encapsulation part 11A closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10A is used to assemble described camera module, described sensitive chip 121A is sealed in inside, form space in a closing。
Further, described encapsulation part 11A includes an a cladding section 111A and optical filter construction section 112A, it is integrally connected to described cladding section 111A described optical filter construction section 112A molding, described cladding section 111A molding is connected to described wiring board main body 122A, is used for being coated with described component 123A and described connecting line 124A。Described optical filter construction section 112A is used for installing an optical filter 20A, that is, when described photosensory assembly 10A is used to assemble described camera module, the optical filter 20A of described camera module is installed in described optical filter construction section 112A, described optical filter 20A is positioned on the photosensitive path of described sensitive chip 121A, and extra optical filter 20A mounting bracket need not be provided。That is, described encapsulation part 11A has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112A top can by the technology mode of mold, make it have good planarization, so that described optical filter 20A is entirely mounted, this point is also an advantage over traditional camera module。
Further, described optical filter construction section 112A has a mounting groove 1121A, described support slot is communicated in described through hole 1100A, provides sufficient installing space for described optical filter 20A so that described optical filter 20A will not protrude from the top surface of optical filter construction section 112A。It is to say, described encapsulation part 11A upper end arranges described mounting groove, thus by the described encapsulation part 11A that is installed on stable for described optical filter 20A, and the top of described encapsulation part 11A will not be protruded from。
It is noted that the inwall of described molding can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121A can receive more light being coated with while described connecting line 124A。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11A is not the restriction of the present invention。
With reference to Figure 11 and Figure 12, the camera module according to the second of the present invention preferred embodiment。Described camera module can be a dynamic burnt camera module (AutomaticFocusModel, AFM)。Described camera module includes photosensory assembly 10A described in, optical filter 20A described in, a motor 40A and camera lens 30A described in。
Described optical filter 20A is installed in described photosensory assembly 10A, described camera lens 30A and is installed in described motor 40A, described motor 40A and is installed on described molding circuit pack 10A。
Further, described optical filter 20A is installed in the described mounting groove 1121A of the described optical filter construction section 112A of the described encapsulation part 11A of described photosensory assembly 10A。Described motor 40A is installed in the described optical filter construction section 112A top of the described encapsulation part 11A of described photosensory assembly 10A。It is to say, described optical filter 20A is installed in the described mounting groove of described encapsulation part 11A, described camera lens 30A is installed in described motor 40A, and described motor 40A is installed in the top of described encapsulation part 11A。
Especially, described motor 40A is electrically connected to described photosensory assembly 10A by described motor attachment structure 13, the described motor pin 41A of described motor 4A0 is electrically connected to the described circuit junction 132 of described photosensory assembly 10, is electrically connected to described wiring board main body 122 thereby through described lead-in wire 131。Described motor pin 41 can be connected to the described motor link 1311 of described lead-in wire 131 by conductive adhesive film, it is also possible to is connected to described motor link 1311 by the mode welded。
Especially, when described motor pin 41A is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40A and described photographic department 12, thus reducing the technical process of motor welding。
It is worth mentioning that, in this embodiment in accordance with the invention, in the way of described lead-in wire 131 connects described motor 40A, illustrate that the present invention electrically connects the mode of motor, and described in other embodiments of the present invention, the described motor attachment structure 13 of different modes can be selected to connect described motor 40A, such as, choose Fig. 6 A, 6B, the mode of example in 6C, that is, described 6A, 6B, different motor attachment structures corresponding in 6C can be combined with the described photosensory assembly 10A in the present embodiment, thus providing different motor connected mode, those skilled in the art should be understood that, mode shown in figure, it it is not the restriction of the present invention。
In other embodiments of the invention, described photosensory assembly 10A can also be assembled as one and focus camera module, and those skilled in the art is not it should be appreciated that the type of described camera module is the restriction of the present invention。
With reference to Figure 13 and Figure 14, according to the photosensory assembly of the 3rd of the present invention the preferred embodiment and camera module。Described photosensory assembly 10B is camera module described in assembly, thus obtaining the camera module of moulding type。Described photosensory assembly 10B is connected to described photographic department 12B with including an encapsulation part 11B and a photographic department 12B, described encapsulation part 11B molding。
Described photographic department 12B includes an a wiring board main body 122B and sensitive chip 121B, and described sensitive chip 121B is arranged on described wiring board main body 122B。According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121B molding。
According to this embodiment of the present invention, described photographic department 12B includes a connection line (not shown) and at least one component 123B。Described connection line defaults in described wiring board main body 122B, described component 123B and is electrically connected to described connection line and described sensitive chip 121B, for the photosensitive work process of described sensitive chip 121B。Described component 123B is arranged at described wiring board main body 122B projectedly。Described component 123B it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123B is coated on inside it by described encapsulation part 11B, hence in so that described component 123B will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121B environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123B, without affecting described sensitive chip 121B, it is different from the existing way that in tradition camera module, component 123B exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123B surface, avoid polluting described sensitive chip 121B and make camera module that the bad phenomenon such as dirty stain occur。
Described encapsulation part 11B forms a through hole 1100B, in order to provide photosensitive path for described sensitive chip 121B。
This preferred embodiment according to the present invention, described photographic department 12B includes at least one connecting line 124B, is used for electrically connecting described sensitive chip 121B and described wiring board main body 122B。Further, each described connecting line 124B may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124B curvedly connects described sensitive chip 121B and described wiring board main body 122B。
It is worth mentioning that, each described connecting line 124B is molded into inside described encapsulation part 11B, such that it is able to each described connecting line 124B is coated with by described encapsulation part 11B, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124B will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124B simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121B and described wiring board main body 122B, this point is not to be provided in prior art completely。
It is worth mentioning that; described encapsulation part 11B is coated with described component 123B and described connecting line 124B; there is protection described component 123B and described connecting line 124B and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11B is not limited to be coated with described component 123B or described connecting line 124B。It is to say, in other embodiments of the invention, described encapsulation part 11B can directly be molded into the described wiring board main body 122B of the described component 123B not protruded, it is also possible to be molded into outside described component 123B, the diverse location such as surrounding。
Further, described sensitive chip 121B has an a photosensitive area 1211B and non-photo-sensing district 1212B, described non-photo-sensing district 1212B to be surrounded on described photosensitive area 1211B peripheral。Described photosensitive area 1211B is used for carrying out photosensitization, and described connecting line 124B is connected to described non-photo-sensing district 1212B。
This preferred embodiment according to the present invention, described encapsulation part 11B extends the described non-photo-sensing district 1212B of described sensitive chip 121B, thus described sensitive chip 121B is fixed on described wiring board main body 122B by the mode lamination molded。By such mode, as being molded into the mode (MoldingonChip of chip, MOC) the inside mouldable scope of described encapsulation part 11B is expanded, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122B and described encapsulation part 11B, reduce the length and width size of described molding photographic department 12B part further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, described encapsulation part 11B projection ground is outside the described photosensitive area 1211B of described sensitive chip 121B, especially, described encapsulation part 11B closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10B is used to assemble described camera module, described sensitive chip 121B is sealed in inside, form space in a closing。
Specifically, when manufacturing described photosensory assembly 10B, a traditional wiring board can be chosen as described wiring board main body 122B, described wiring board main body 122B arranges sensitive chip 121B described in, by described sensitive chip 121B by described connecting line 124B electrical connection, and then described molding wiring board main body 122B after preliminary assembling and molding on sensitive chip 121B parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11B, or form described encapsulation part 11B with mould pressing process conventional in semiconductor packages。Described wiring board main body 122B can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc.。Described encapsulation part 11B formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc.。The material that described encapsulation part 11B can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin。It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention。
Further, described encapsulation part 11B top end surface is smooth, be suitable to an optical filter 20B is installed, that is, when described photosensory assembly 10B is used to assemble described camera module, the optical filter 20B of described camera module is installed in the top end surface of described encapsulation part 11B so that described optical filter 20B is positioned on the photosensitive path of described sensitive chip 121B, and need not provide extra optical filter 20B mounting bracket。That is, described encapsulation part 11B has the function of conventional stent herein, but it is based on the advantage of moulding technology, described mould top 11B can by the technology mode of mold, make it have good planarization, so that described optical filter 20B is entirely mounted, this point is also an advantage over traditional camera module。
What be different from above preferred embodiment is, in this embodiment in accordance with the invention, the described photographic department 12B of described photosensory assembly 10B includes a back-up coat 125B, it is connected to described wiring board main body 122B bottom, in order to strengthen the structural strength of described wiring board main body 122B described back-up coat 125B lamination。That is, on described wiring board main body 122B, the region bottom at described encapsulation part 11B and described sensitive chip 121B place mounts described back-up coat 125B, so that described wiring board main body 122B reliablely and stablely supports described encapsulation part 11B and described sensitive chip 121B。
Further, described back-up coat 125B is a metallic plate, described metallic plate is attached at the bottom of described wiring board main body 122B, increase the structural strength of described wiring board main body 122B, on the other hand, increasing the heat dispersion of described photosensory assembly 10B, can effectively scatter and disappear the described sensitive chip 121B heat sent。
It is worth mentioning that, described wiring board main body 122B can adopt FPC (FlexPrintCircuit, flexible printed-circuit board), and the rigidity of described FPC is strengthened by described back-up coat 125B so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described photosensory assembly 10B。It is to say, the selectable range of described wiring board main body 122B is more extensive, for instance PCB (PrintedCircuitBoard, rigid printed circuit boards), FPC, RF (RigidFlex, Rigid Flex)。Increase the structural strength of described wiring board main body 122B by described back-up coat 125B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 122B, the height making described photosensory assembly 10B reduces further, and the height being assembled the camera module obtained by it reduces。
It is worth mentioning that, in this embodiment in accordance with the invention, described back-up coat 125 is plate-shaped is overlapped in described wiring board main body 122B, and in other embodiments of the invention, described back-up coat 125B can extend to the described encapsulation part 11B sidewall of parcel, thus while strengthening the structural strength of described photosensory assembly 10B, strengthening its anti-electromagnetic interference capability。
It is noted that the inwall of described encapsulation part can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121B can receive more light being coated with while described connecting line 124B。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11B is not the restriction of the present invention。
With reference to Figure 13 and Figure 14, the camera module according to the 3rd of the present invention the preferred embodiment。Described camera module can be one focus module (FixFocusModel, FFM)。Described camera module includes photosensory assembly 10B described in, an optical filter 20B and camera lens 30B described in。
Described optical filter 20B is installed in described photosensory assembly 10B, and described camera lens 30B is installed on described photosensory assembly 10B。
More specifically, described optical filter 20B is installed in the described encapsulation part 11B top of described photosensory assembly 10B。Described camera lens 30B is by the top by the described encapsulation part 11B being installed on described photosensory assembly 10B。Especially, described optical filter 20B and described camera lens 30B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B。
It will also be appreciated that, described camera lens 30B is installed in the top of the described encapsulation part 11B of described photosensory assembly 10B, thus described encapsulation part 11B is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30B, but assemble and be but different from tradition COB technical process。The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11B is fixed on described wiring board main body 122B by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11B and described wiring board main body 122B, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11B is coated with described component 123B and described connecting line 124B, traditional cradling function and component 123B and described connecting line 124B can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11B of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce。Additionally, described encapsulation part 11B replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles。And described encapsulation part 11B is coated with described connecting line 124B, and described encapsulation part 11B extends to the non-photo-sensing district 1212B of described sensitive chip 121B so that described encapsulation part 11B can to contract, thus reducing the horizontal length and width size of described camera module further。
With reference to Figure 13 and Figure 15, will be illustrated according to another camera module of the 3rd of the present invention the preferred embodiment。Described camera module can be a dynamic burnt camera module。Described camera module includes photosensory assembly 10B described in, optical filter 20B, a motor 40B and a camera lens 30B described in one。
Described optical filter 20B is installed in described photosensory assembly 10B, described camera lens 30B and is installed in described motor 40B, and described motor 40B is installed on described molding circuit pack。
Further, described optical filter 20B is installed in the top of the described encapsulation part 11B of described photosensory assembly 10B。Described motor 40B is installed on the top of the described encapsulation part 11B of described photosensory assembly 10B。Especially, described optical filter 20B and described motor 40B can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11B。
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention。
Especially, described motor 40B is electrically connected to described photosensory assembly 10B by described motor attachment structure 13, the described motor pin 41B of described motor 4B0 is electrically connected to the described circuit junction 132 of described photosensory assembly 10, is electrically connected to described wiring board main body 122 thereby through described lead-in wire 131。Described motor pin 41B can be connected to the described motor link 1311 of described lead-in wire 131 by conductive adhesive film, it is also possible to is connected to described motor link 1311 by the mode welded。
Especially, when described motor pin 41B is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40B and described photographic department 12, thus reducing the technical process of motor welding。
It is worth mentioning that, in this embodiment in accordance with the invention, in the way of described lead-in wire 131 connects described motor 40B, illustrate that the present invention electrically connects the mode of motor, and described in other embodiments of the present invention, the described motor attachment structure 13 of different modes can be selected to connect described motor 40B, such as, choose Fig. 6 A, 6B, the mode of example in 6C, that is, described 6A, 6B, different motor attachment structures corresponding in 6C can be combined with the described photosensory assembly 10B in the present embodiment, thus providing different motor connected mode, those skilled in the art should be understood that, mode shown in figure, it it is not the restriction of the present invention。
With reference to Figure 16 and Figure 18, will be illustrated according to the photosensory assembly of the 4th of the present invention the preferred embodiment and camera module。Described photosensory assembly 10C is camera module described in assembly, thus obtaining the camera module of moulding type。Described photosensory assembly 10C is connected to described photographic department 12C with including an encapsulation part 11C and photographic department 12C, described encapsulation part 11C molding。
Described photographic department 12C includes an a wiring board main body 122C and sensitive chip 121C, and described sensitive chip 121C is arranged on described wiring board main body 122C。According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121C molding。
According to this embodiment of the present invention, described photographic department 12C includes a connection line (not shown) and at least one component 123C。Described connection line defaults in described wiring board main body 122C, described component 123C and is electrically connected to described connection line and described sensitive chip 121C, for the photosensitive work process of described sensitive chip 121C。Described component 123C is arranged at described wiring board main body 122C projectedly。Described component 123C it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123C is coated on inside it by described encapsulation part 11C, hence in so that described component 123C will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121C environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123C, without affecting described sensitive chip 121C, it is different from the existing way that in tradition camera module, component 123C exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123C surface, avoid polluting described sensitive chip 121C and make camera module that the bad phenomenon such as dirty stain occur。
Described encapsulation part 11C forms a through hole 1100C, in order to provide photosensitive path for described sensitive chip 121C。
This preferred embodiment according to the present invention, described photographic department 12C includes at least one connecting line 124C, is used for electrically connecting described sensitive chip 121C and described wiring board main body 122C。Further, each described connecting line 124C may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124C curvedly connects described sensitive chip 121C and described wiring board main body 122C。
It is worth mentioning that, each described connecting line 124C is molded into inside described encapsulation part 11C, such that it is able to each described connecting line 124C is coated with by described encapsulation part 11C, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124C will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124C simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121C and described wiring board main body 122C, this point is not to be provided in prior art completely。
It is worth mentioning that; described encapsulation part 11C is coated with described component 123C and described connecting line 124C; there is protection described component 123C and described connecting line 124C and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11C is not limited to be coated with described component 123C or described connecting line 124C。It is to say, in other embodiments of the invention, described encapsulation part 11C can directly be molded into the described wiring board main body 122C of the described component 123C not protruded, it is also possible to be molded into outside described component 123C, the diverse location such as surrounding。
Further, described sensitive chip 121C has an a photosensitive area 1211C and non-photo-sensing district 1212C, described non-photo-sensing district 1212C to be surrounded on described photosensitive area 1211C peripheral。Described photosensitive area 1211C is used for carrying out photosensitization, and described connecting line 124C is connected to described non-photo-sensing district 1212C。
This preferred embodiment according to the present invention, described encapsulation part 11C extends the described non-photo-sensing district 1212C of described sensitive chip 121C, thus described sensitive chip 121C is fixed on described wiring board main body 122C by the mode lamination molded。By such mode, mode (Moldingonthechip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11C, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122C and described encapsulation part 11C, reduce the length and width size of described photosensory assembly further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, described encapsulation part 11C projection ground is outside the described photosensitive area 1211C of described sensitive chip 121C, especially, described encapsulation part 11C closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10C is used to assemble described camera module, described sensitive chip 121C is sealed in inside, form space in a closing。
Specifically, when manufacturing described photosensory assembly 10C, a traditional wiring board can be chosen as described wiring board main body 122C, described wiring board main body 122C arranges sensitive chip 121C described in, by described sensitive chip 121C by described connecting line 124C electrical connection, and then described molding wiring board main body 122C after preliminary assembling and molding on sensitive chip 121C parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11C, or form described encapsulation part 11C with mould pressing process conventional in semiconductor packages。Described wiring board main body 122C can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc.。Described encapsulation part 11C formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc.。The material that described encapsulation part 11C can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin。It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention。
Described photosensory assembly 10C with farther including an optical filter 20C, described optical filter 20C molding lamination is arranged on described sensitive chip 121C。The edge of described optical filter 20C is molded into described encapsulation part 11C, thus fixing described optical filter 20C。It is noted that described optical filter 20C is covered in above described sensitive chip 121C, by described sensitive chip 121C and external environment condition isolation, described sensitive chip 121C is protected to sustain damage and prevent the entrance of dust。
When manufacturing described photosensory assembly 10C, first described sensitive chip 121C is attached at described wiring board main body 122C, and it is connected to described sensitive chip 121C and described wiring board main body 122C by described, and then described optical filter 20C is attached on described sensitive chip 121C, further, described wiring board main body 122C and described sensitive chip 121C and described optical filter 20C is molded, forms described encapsulation part 11C。When molding, owing to described optical filter 20C is covered on described sensitive chip 121C, therefore, it is possible to prevent the mould injury for described sensitive chip 121C of molding, and owing to the distance of described optical filter 20C and described sensitive chip 121C reduces, therefore can so that being reduced by the back focal length of the camera module of its assembling, thus reducing the height of described camera module, on the other hand, owing to being not necessary for the described optical filter 20C support parts providing extra, the thickness of described camera module is therefore also made to be further reduced to a certain extent。
It is noted that the inwall of described encapsulation part 10C can according to the shape of described connection and arrange, be such as set to skewed, thus many light such as can receive being coated with while described connecting line 124C to make described sensitive chip 121C。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11C is not the restriction of the present invention。
With reference to Figure 16 to Figure 18, the camera module according to the 4th of the present invention the preferred embodiment。Described camera module can be one focus module。Described camera module includes photosensory assembly 10C described in an one and camera lens 30C。Described camera lens 30C is installed on described photosensory assembly 10C, assembles and forms described camera module。
Especially, described camera lens 30C can be fixed on the top of the described encapsulation part 11C of described photosensory assembly 10C by bonding mode, and by the feature of Making mold in moulding technology, the top making described encapsulation part 11C has good planarization, good mounting condition is provided, thus obtaining the camera module of high-quality for described camera lens 30C。
It is worth mentioning that, described camera lens 30C is installed in the top of the described encapsulation part 11C of described photosensory assembly 10C, thus described encapsulation part 11C is equivalent to the function of the support in tradition camera module, there is provided support, fixed position for described camera lens 30C, but assemble and be but different from tradition COB technical process。The support of the camera module of tradition COB technique is fixed on wiring board in the way of stickup, and described encapsulation part 11C is fixed on described wiring board main body 122C by moulding technology, fixation procedure need not be pasted, molding mode is relative to pasting the fixing controllability with better connective stability and technical process, and the AA glue space adjusted need not be reserved between described encapsulation part 11C and described wiring board main body 122C, therefore the tradition camera module AA headspace adjusted is reduced so that the thickness of camera module is reduced；On the other hand, described encapsulation part 11C is coated with described component 123C and described connecting line 124C, traditional cradling function and component 123C and described connecting line 124C can spatially be overlapped, need not as tradition camera module, reserved safe distance around circuit devcie, so that the height with the described encapsulation part 11C of cradling function can be arranged on less scope, thus further provide the space that camera module thickness can reduce。Additionally, described encapsulation part 11C replaces traditional support, it is to avoid the heeling error that support brings when pasting and assembling, reduce the cumulative limit that camera module assembles。And described encapsulation part 11C is coated with described connecting line 124C, and described encapsulation part 11C extends to the non-photo-sensing district 1212C of described sensitive chip 121C so that described encapsulation part 11C can to contract, thus reducing the horizontal length and width size of described camera module further。And, described optical filter 20C is molded inside it by described photosensory assembly 10C, therefore when assembling described camera module, need not again carry out the stickup installation process of optical filter, thus reducing camera module packaging technology process, improving work efficiency, these are all an advantage over prior art。
With reference to Figure 16, Figure 17 and Figure 19, it is that another camera module of the 4th preferred embodiment according to the present invention will be illustrated。Described camera module can be a dynamic burnt camera module (AutomaticFocusModel, AFM)。Described camera module includes photosensory assembly 10C described in, a motor 40C and a camera lens 30C。
Described camera lens 30C is installed in described motor 40C, described motor 40C and is installed on described photosensory assembly 10C, in order to regulate described camera module focal length by described motor 40C。Described motor 40C is installed on the top of the described encapsulation part 11C of described photosensory assembly 10C。
Especially, described motor 40C is electrically connected to described photosensory assembly 10C by described motor attachment structure 13, the described motor pin 41C of described motor 40C is electrically connected to the described circuit junction 132 of described photosensory assembly 10C, is electrically connected to described wiring board main body 122 thereby through described lead-in wire 131。Described motor pin 41C can be connected to the described motor link 1311 of described lead-in wire 131 by conductive adhesive film, it is also possible to is connected to described motor link 1311 by the mode welded。
Especially, when described motor pin 41C is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40C and described photographic department 12, thus reducing the technical process of motor welding。
It is worth mentioning that, in this embodiment in accordance with the invention, in the way of described lead-in wire 131 connects described motor 40C, illustrate that the present invention electrically connects the mode of motor, and described in other embodiments of the present invention, the described motor attachment structure 13 of different modes can be selected to connect described motor 40C, such as, choose Fig. 6 A, 6B, the mode of example in 6C, that is, described 6A, 6B, different motor attachment structures corresponding in 6C can be combined with the described photosensory assembly 10C in the present embodiment, thus providing different motor connected mode, those skilled in the art should be understood that, mode shown in figure, it it is not the restriction of the present invention。
It will be apparent to a skilled person that the structure of above-mentioned camera module and type are only used as citing, illustrate described camera module can effective mode, be not the restriction of the present invention。
With reference to Figure 20 and Figure 21, will be illustrated according to the photosensory assembly of the 5th of the present invention the preferred embodiment and camera module。Described photosensory assembly 10F is camera module described in assembly, thus obtaining the described camera module of moulding type。Described photosensory assembly 10F is connected to described photographic department 12F with including an encapsulation part 11F and a photographic department 12F, described encapsulation part 11F molding。
Described photographic department 12F includes an a wiring board main body 122F and sensitive chip 121F, and described sensitive chip 121F is arranged on described wiring board main body 122F。According to this embodiment of the invention, it is connected to described circuit main body 122F described sensitive chip 121F molding。
According to this embodiment of the present invention, described photographic department 12F includes a connection line (not shown) and at least one component 123F。Described connection line defaults in described wiring board main body 122F, described component 123F and is electrically connected to described connection line and described sensitive chip 121F, for the photosensitive work process of described sensitive chip 121F。Described component 123F is arranged at described wiring board main body 122F projectedly。Described component 123F it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123F is coated on inside it by described encapsulation part 11F, hence in so that described component 123F will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121F environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123F, without affecting described sensitive chip 121F, it is different from the existing way that in tradition camera module, component 123F exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123F surface, avoid polluting described sensitive chip 121F and make camera module that the bad phenomenon such as dirty stain occur。
Described encapsulation part 11F forms a through hole 1100F, in order to provide photosensitive path for described sensitive chip 121F。
This preferred embodiment according to the present invention, described photographic department 12F includes at least one connecting line 124F, is used for electrically connecting described sensitive chip 121F and described wiring board main body 122F。Further, each described connecting line 124F may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124F curvedly connects described sensitive chip 121F and described wiring board main body 122F。
It is worth mentioning that, each described connecting line 124F is molded into inside described encapsulation part 11F, such that it is able to each described connecting line 124F is coated with by described encapsulation part 11F, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124F will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124F simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121F and described wiring board main body 122F, this point is not to be provided in prior art completely。
It is worth mentioning that; described encapsulation part 11F is coated with described component 123F and described connecting line 124F; there is protection described component 123F and described connecting line 124F and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11F is not limited to be coated with described component 123F or described connecting line 124F。It is to say, in other embodiments of the invention, described encapsulation part 11F can directly be molded into the described wiring board main body 122F of the described component 123F not protruded, it is also possible to be molded into outside described component 123F, the diverse location such as surrounding。
Further, described sensitive chip 121F has an a photosensitive area 1211F and non-photo-sensing district 1212F, described non-photo-sensing district 1212F to be surrounded on described photosensitive area 1211F peripheral。Described photosensitive area 1211F is used for carrying out photosensitization, and described connecting line 124F is connected to described non-photo-sensing district 1212F。
This preferred embodiment according to the present invention, described encapsulation part 11F extends the described non-photo-sensing district 1212F of described sensitive chip 121F, thus described sensitive chip 121F is fixed on described wiring board main body 122F by the mode lamination molded。By such mode, mode (Moldingonchip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11F, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122F and described encapsulation part 11F, reduce the length and width size of described molding photographic department 12F part further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, described encapsulation part 11F projection ground is outside the described photosensitive area 1211F of described sensitive chip 121F, especially, described encapsulation part 11F closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10F is used to assemble described camera module, described sensitive chip 121F is sealed in inside, form space in a closing。
Specifically, when manufacturing described photosensory assembly 10F, a traditional wiring board can be chosen as described wiring board main body 122F, described wiring board main body 122F arranges sensitive chip 121F described in, by described sensitive chip 121F by described connecting line 124F electrical connection, and then described molding wiring board main body 122F after preliminary assembling and molding on sensitive chip 121F parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11F, or form described encapsulation part 11F with mould pressing process conventional in semiconductor packages。Described wiring board main body 122F can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc.。Described encapsulation part 11F formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc.。The material that described encapsulation part 11F can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin。It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention。
Further, described encapsulation part 11F includes an a cladding section 111F and optical filter construction section 112F, it is integrally connected to described cladding section 111F described optical filter construction section 112F molding, described cladding section 111F molding is connected to described wiring board main body 122F, is used for being coated with described component 123F and described connecting line 124F。Described optical filter construction section 112F is used for installing an optical filter 20F, that is, when described photosensory assembly 10F is used to assemble described camera module, the optical filter 20F of described camera module is installed in described optical filter construction section 112F, described optical filter 20F is positioned on the photosensitive path of described sensitive chip 121F, and extra optical filter 20F mounting bracket need not be provided。That is, described encapsulation part 11F has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112F top can by the technology mode of mold, make it have good planarization, so that described optical filter 20F is entirely mounted, this point is also an advantage over traditional camera module。
Further, described optical filter construction section 112F has a mounting groove 1121F, described support slot is communicated in described through hole 1100F, provides sufficient installing space for described optical filter 20F so that described optical filter 20F will not protrude from the top surface of optical filter construction section 112F。It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from。
It is noted that the inwall of described encapsulation part 11F can according to the shape of described connecting line 124F and arrange, be such as set to skewed, thus many light such as can receive being coated with while described connecting line 124F to make described sensitive chip 121F。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11F is not the restriction of the present invention。
Being different from above preferred embodiment, described wiring board main body 122F has at least one reinforced hole 1221F, described encapsulation part 11F and extends in described reinforced hole 1221F, thus strengthening the structural strength of described wiring board main body 122F。In other words, two kinds of different materials be combined with each other, thus forming composite structure so that the structural strength as the described wiring board main body 122F of matrix strengthens。
The position of described reinforced hole 1221F can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically。Setting by described reinforced hole 1221F makes the structural strength of described wiring board main body 122F strengthen, such that it is able to reduce the thickness of described wiring board main body 122F, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described photosensory assembly 10F。
It is noted that in this embodiment in accordance with the invention, described reinforced hole 1221F is groove-like, thus when manufacturing described photosensory assembly 10F, the moulding material of described encapsulation part 11F will not be spilt by described reinforced hole 1221F。
Similar with above preferred embodiment, described photosensory assembly 10F can be assembled as and focus module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10F is the restriction of the present invention。
With reference to Figure 22 and, will be illustrated according to the photosensory assembly of the 6th of the present invention the preferred embodiment and camera module。Described photosensory assembly 10G is camera module described in assembly, thus obtaining the described camera module of moulding type。Described photosensory assembly 10G is connected to described photographic department 12G with including an encapsulation part 11G and photographic department 12G, described encapsulation part 11G molding。
Described photographic department 12G includes an a wiring board main body 122G and sensitive chip 121G, and described sensitive chip 121G is arranged on described wiring board main body 122G。According to this embodiment of the invention, it is connected to described circuit version main body described sensitive chip 121G molding。
According to this embodiment of the present invention, described photographic department 12G includes a connection line (not shown) and at least one component 123G。Described connection line defaults in described wiring board main body 122G, described component 123G and is electrically connected to described connection line and described sensitive chip 121G, for the photosensitive work process of described sensitive chip 121G。Described component 123G is arranged at described wiring board main body 122G projectedly。Described component 123G it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay or driver etc.。
It is worth mentioning that, described component 123G is coated on inside it by described encapsulation part 11G, hence in so that described component 123G will not be directly exposed in space, more specifically, be not exposed to in the described sensitive chip 121G environment communicated, thus when being assembled into described camera module, will not the pollutant such as covered with dust on described component 123G, without affecting described sensitive chip 121G, it is different from the existing way that in tradition camera module, component 123G exposes, such as capacitance resistance ware, mode thereby through molding cladding prevents dust, foreign material stay in described component 123G surface, avoid polluting described sensitive chip 121G and make camera module that the bad phenomenon such as dirty stain occur。
Described encapsulation part 11G forms a through hole 1100G, in order to provide photosensitive path for described sensitive chip 121G。
This preferred embodiment according to the present invention, described photographic department 12G includes at least one connecting line 124G, is used for electrically connecting described sensitive chip 121G and described wiring board main body 122G。Further, each described connecting line 124G may be implemented as, specifically but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc.。Low especially, described connecting line 124G curvedly connects described sensitive chip 121G and described wiring board main body 122G。
It is worth mentioning that, each described connecting line 124G is molded into inside described encapsulation part 11G, such that it is able to each described connecting line 124G is coated with by described encapsulation part 11G, without being directly exposed to outside, thus when assembling described camera module, make described connecting line 124G will not be subject to any touching damage, reduce the environmental factors impact on individual described connecting line 124G simultaneously, such as temperature, making the communication stable connection between described sensitive chip 121G and described wiring board main body 122G, this point is not to be provided in prior art completely。
It is worth mentioning that; described encapsulation part 11G is coated with described component 123G and described connecting line 124G; there is protection described component 123G and described connecting line 124G and more had the advantage of the aspect such as camera module of performance; but those skilled in the art is it should be appreciated that described encapsulation part 11G is not limited to be coated with described component 123G or described connecting line 124G。It is to say, in other embodiments of the invention, described encapsulation part 11G can directly be molded into the described wiring board main body 122G of the described component 123G not protruded, it is also possible to be molded into outside described component 123G, the diverse location such as surrounding。
Further, described sensitive chip 121G has an a photosensitive area 1211G and non-photo-sensing district 1212G, described non-photo-sensing district 1212G to be surrounded on described photosensitive area 1211G peripheral。Described photosensitive area 1211G is used for carrying out photosensitization, and described connecting line 124G is connected to described non-photo-sensing district 1212G。
This preferred embodiment according to the present invention, described encapsulation part 11G extends the described non-photo-sensing district 1212G of described sensitive chip 121G, thus described sensitive chip 121G is fixed on described wiring board main body 122G by the mode lamination molded。By such mode, mode (Moldingonchip) being molded into chip expand as described in the inside mouldable scope of encapsulation part 11G, such that it is able to reduce the structural moiety in the outside of described wiring board main body 122G and described encapsulation part 11G, reduce the length and width size of described molding photographic department 12G further, reduce by the length and width size of the described camera module of its assembling。
In this embodiment in accordance with the invention, described encapsulation part 11G projection ground is outside the described photosensitive area 1211G of described sensitive chip 121G, especially, described encapsulation part 11G closes connection integratedly, make that there is good sealing, thus when described photosensory assembly 10G is used to assemble described camera module, described sensitive chip 121G is sealed in inside, form space in a closing。
Specifically, when manufacturing described photosensory assembly 10G, a traditional wiring board can be chosen as described wiring board main body 122G, described wiring board main body 122G arranges sensitive chip 121G described in, by described sensitive chip 121G by described connecting line 124G electrical connection, and then described molding wiring board main body 122G after preliminary assembling and molding on sensitive chip 121G parts, as with injection machine, by insert molding (molding) technique, the wiring board after carrying out SMT technique (SurfaceMountTechnology surface mount process) is carried out molding and form described encapsulation part 11G, or form described encapsulation part 11G with mould pressing process conventional in semiconductor packages。Described wiring board main body 122G can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc.。Described encapsulation part 11G formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc.。The material that described encapsulation part 11G can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (LiquidCrystalPolymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can adopt epoxy resin。It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, be illustrative only the mode that can implement of the present invention, be not the restriction of the present invention。
Further, described encapsulation part 11G includes an a cladding section 111G and optical filter construction section 112G, it is integrally connected to described cladding section 111G described optical filter construction section 112G molding, described cladding section 111G molding is connected to described wiring board main body 122G, is used for being coated with described component 123G and described connecting line 124G。Described optical filter construction section 112G is used for installing an optical filter 20G, that is, when described photosensory assembly 10G is used to assemble described camera module, the optical filter 20G of described camera module is installed in described optical filter construction section 112G, described optical filter 20G is positioned on the photosensitive path of described sensitive chip 121G, and extra optical filter 20G mounting bracket need not be provided。That is, described encapsulation part 11G has the function of conventional stent herein, but it is based on the advantage of moulding technology, described optical filter construction section 112G top can by the technology mode of mold, make it have good planarization, so that described optical filter 20G is entirely mounted, this point is also an advantage over traditional camera module。
Further, described optical filter construction section 112G has a mounting groove 1121G, described support slot is communicated in described through hole 1100G, provides sufficient installing space for described optical filter 20G so that described optical filter 20G will not protrude from the top surface of optical filter construction section 112G。It is to say, described encapsulation part 11F upper end arranges described mounting groove 1121F, in order to described optical filter 20F is installed on described encapsulation part 11F and the top of described encapsulation part 11F will not be protruded from。
It is noted that the inwall of described encapsulation part 11G can according to the shape of described connection and arrange, be such as set to skewed, thus making described sensitive chip 121G can receive more light being coated with while described connecting line 124G。Those skilled in the art is it should be appreciated that the shape of described encapsulation part 11G is not the restriction of the present invention。
Being different from above preferred embodiment, described wiring board main body 122G has at least one reinforced hole 1221G, described encapsulation part 11G and extends in described reinforced hole 1221G, thus strengthening the structural strength of described wiring board main body 122G。In other words, two kinds of different materials be combined with each other, thus forming composite structure so that the structural strength as the described wiring board main body 122G of matrix strengthens。
The position of described reinforced hole 1221G can select as required, and the structural strength demand according to described wiring board is arranged, such as structure symmetrically。Setting by described reinforced hole 1221G makes the structural strength of described wiring board main body 122G strengthen, such that it is able to reduce the thickness of described wiring board main body 122G, reduces by the thickness of the camera module of its assembling, and improves the heat dispersion of described photosensory assembly 10G。
It is worth mentioning that, this preferred embodiment according to the present invention, described reinforced hole 1221G is perforation, say, that through described wiring board main body 122G, the both sides making described wiring board main body 122G connect, thus when manufacturing described photosensory assembly 10G, the moulding material of described encapsulation part 11G is combined with described wiring board main body 122G fully, form more firmly composite structure, and the structure of relatively described groove, described perforation is easier to processing and manufacturing。
With reference to Figure 22 and 23, described camera module includes photosensory assembly 10G described in, optical filter 20G, a motor 40G and a camera lens 30G described in one。
Described optical filter 20G is installed in described photosensory assembly 10G, described camera lens 30G and is installed in described motor 40G, and described motor 40G is installed on described molding circuit pack。
Further, described optical filter 20G is installed in the described mounting groove of the described encapsulation part 11G of described photosensory assembly 10G。Described motor 40G is installed on the top of the described encapsulation part 11G of described photosensory assembly 10G。Especially, described optical filter 20G and described motor 40G can coordinate configuration according to specific needs in the concrete installation site of described encapsulation part 11G。
Especially, described motor 40G is electrically connected to described photosensory assembly 10G by described motor attachment structure 13, the described motor pin 41G of described motor 4G0 is electrically connected to the described circuit junction 132 of described photosensory assembly 10, is electrically connected to described wiring board main body 122 thereby through described lead-in wire 131。Described motor pin 41G can be connected to the described motor link 1311 of described lead-in wire 131 by conductive adhesive film, it is also possible to is connected to described motor link 1311 by the mode welded。
Especially, when described motor pin 41G is adhered to described circuit junction by conducting resinl attaching mode, it may not be necessary to welding lead connects the described wiring board main body 122 of described horse 40G and described photographic department 12, thus reducing the technical process of motor welding。
It is worth mentioning that, in this embodiment in accordance with the invention, in the way of described lead-in wire 131 connects described motor 40G, illustrate that the present invention electrically connects the mode of motor, and described in other embodiments of the present invention, the described motor attachment structure 13 of different modes can be selected to connect described motor 40G, such as, choose Fig. 6 A, 6B, the mode of example in 6C, that is, described 6A, 6B, different motor attachment structures corresponding in 6C can be combined with the described photosensory assembly 10G in the present embodiment, thus providing different motor connected mode, those skilled in the art should be understood that, mode shown in figure, it it is not the restriction of the present invention。
Similar with above preferred embodiment, described photosensory assembly 10G can be assembled as and focus module or dynamic burnt module, and those skilled in the art is not it should be appreciated that the assembling application mode of described photosensory assembly 10G is the restriction of the present invention。With reference to photosensory assembly and camera module that Figure 24 is the 7th preferred embodiment according to the present invention。What be different from above preferred embodiment is, described photosensory assembly 10 includes a screen layer 126I, described screen layer 126I wraps up described wiring board main body 122 and described encapsulation part 11, thus while strengthening the structural strength of described wiring board main body 122, strengthening the anti-electromagnetic interference capability of described photosensory assembly 10。
Further, described screen layer 126I is a metal level, it is possible to for platy structure or network structure。
With reference to Figure 25 A and 25B, the comparison schematic diagram according to the camera module of above preferred embodiment of the present invention and tradition camera module。In Figure 25 A, left side represents traditional camera module, and right side represents the camera module in the present invention。In Figure 25 B, left side represents traditional wiring board manufacture process, and right side represents the photosensory assembly manufacture process of the present invention。
Summary content, it is possible to seeing clearly, photosensory assembly and the camera module of the present invention have the advantage that
1, the length and width size of camera module, packed part and component can be reduced, as can be overlapping on capacitance resistance ware segment space；Traditional scheme support outside electric capacity, and need to need reserved certain safe distance, and the solution of the present invention can directly utilize electric capacity space, directly filling plastic cement around electric capacity。
2, reduce module to tilt, the alternative existing plastic stent design of packed part, reduce accumulated tolerance；
3, molding promotes circuit board structure intensity, under equivalent constructions intensity, because packed part can be played a supporting role, it is possible to increasing intensity, it is thinner that wiring board can do, and reduces module height；
4, in height space, traditional scheme electric capacity and base need reserved assembling safe space, and moulding technology can not be reserved, and reduces module height；Traditional scheme electric capacity top distance bracket needs reserved safety clearance, it is prevented that interfere, and new departure can direct filling plastic cement around electric capacity。
5, resistance capacitor device can be wrapped up by molding, it is possible to avoids the module dirt stain that capacitance resistance ware region solder resist, dust etc. are put bad, improving product yield；
6, being suitable for high efficiency scale of mass production, the photosensory assembly of the present invention is more suitable for a large amount of layout operation。Based on the molded mode of the described photosensory assembly of the present invention, described photosensory assembly is more suitable for layout operation, once completes the manufacture of the photosensory assembly of more amount, such as can reach 80 to 90, and traditional wiring board once can only produce at most 8。
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as citing and are not limiting as the present invention。The purpose of the present invention is completely and be effectively realized。The function of the present invention and structural principle are shown in an embodiment and illustrate, without departing under described principle, embodiments of the present invention can have any deformation or amendment。

Claims (44)

1. the photosensory assembly of a camera module, it is characterised in that including:
One encapsulation part；With
One photographic department；Described photographic department includes a wiring board main body and a sensitive chip, and described encapsulation part encapsulated moulding is in described wiring board main body and described sensitive chip。
2. photosensory assembly according to claim 1, wherein said encapsulation part forms a through hole, and described through hole is relative with described sensitive chip, to provide described sensitive chip passage of light。
3. photosensory assembly according to claim 2, the bottom of the described through hole of wherein said encapsulation part is skewed in what be gradually increased from the bottom to top。
4. photosensory assembly according to claim 2, wherein said encapsulation part top is that plane is suitable to install the camera lens of described camera module, motor or optical filter。
5. photosensory assembly according to claim 2, wherein said encapsulation part top has a mounting groove, and described mounting groove is communicated in described through hole, for installing the optical filter of described camera module, camera lens or motor。
6. photosensory assembly according to claim 2, wherein said sensitive chip includes a photosensitive area and a non-photo-sensing district, described non-photo-sensing district is peripheral around described photosensitive area, described encapsulation part molding extends to the described non-photo-sensing district of described sensitive chip, the mouldable scope inside to extend described encapsulation part, reduces the Outside Dimensions of described encapsulation part。
7. photosensory assembly according to claim 2, wherein said photographic department includes at least one component, and described component protrudes from described wiring board main body, and described encapsulation part is coated with described component, so that described component will not be directly exposed to outside。
8. photosensory assembly according to claim 7, wherein said component selects combination: the one or more of which in resistance, electric capacity, diode, triode, potentiometer, relay and relay。
9. photosensory assembly according to claim 8, wherein said photographic department includes an optical filter, described optical filter is covered in described sensitive chip, described encapsulation part takes shape in described wiring board main body, described sensitive chip and described optical filter, so that protecting described sensitive chip by described optical filter, and reduce the back focal length of described camera module so that it is highly reduce。
10. photosensory assembly according to claim 2, wherein said photographic department includes a back-up coat, and described back-up coat lamination is arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body。
11. photosensory assembly according to claim 11, wherein said back-up coat is metallic plate, to strengthen the heat dispersion of described photographic department。
12. photosensory assembly according to claim 2, wherein said photographic department includes a screen layer, and described screen layer wraps up described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly。
13. photosensory assembly according to claim 12, wherein said screen layer is metallic plate or wire netting。
14. photosensory assembly according to claim 2, wherein wiring board main body has at least one reinforced hole, and described encapsulation part extends into described reinforced hole, and reinforced hole is groove-like or through hole, in order to strengthen the structural strength of described wiring board main body。
15. according to the arbitrary described photosensory assembly of claim 1 to 14, wherein said photographic department includes at least one connecting line, each described connecting line electrically connects described sensitive chip and described wiring board main body, and described encapsulation part is coated with described connecting line, so that described connecting line will not be directly exposed to outside。
16. photosensory assembly according to claim 15, wherein said connecting line is selected from combination: the one in gold thread, silver wire, copper cash or aluminum steel。
17. photosensory assembly according to claim 15, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC。
18. photosensory assembly according to claim 15, the material of wherein said encapsulation part is selected from combination: one or more in epoxy resin, nylon, LCP or PP。
19. photosensory assembly according to claim 15, wherein said photosensory assembly includes a motor attachment structure, it includes at least one lead-in wire, described lead-in wire is arranged at described encapsulation part, and it is electrically connected to described wiring board main body, described lead-in wire includes a motor link, is revealed in described encapsulation part, in order to connect a motor pin。
20. photosensory assembly according to claim 19, wherein said lead-in wire is arranged at described encapsulation part surface。
21. photosensory assembly according to claim 19, wherein lead-in wire is arranged at inside described encapsulation part。
22. photosensory assembly according to claim 15, wherein said photosensory assembly includes a motor attachment structure, it includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described encapsulation part, and it being electrically connected to described wiring board main body, described pin groove is arranged at described encapsulation part upper end, and described lead-in wire includes a motor link, described motor link circuit is in described groove bottom wall, in order to a motor pin is electrically connected to described motor link when being plugged in described pin groove。
23. photosensory assembly according to claim 15, wherein said photosensory assembly includes a motor attachment structure, it includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described encapsulation part, extended to the top of described encapsulation part by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove。
24. photosensory assembly according to claim 15, wherein said photosensory assembly includes a motor attachment structure, and it includes at least one engraving circuit, and described engraving circuit is arranged at described encapsulation part, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin。
25. photosensory assembly according to claim 22, wherein said engraving circuit is arranged at described encapsulation part in the way of laser formation。
26. photosensory assembly according to claim 24, wherein said engraving circuit is set the surface of described encapsulation part。
27. the manufacture method of the photosensory assembly of a camera module, it is characterised in that include step: encapsulated moulding one encapsulation part in a wiring board main body and a sensitive chip。
28. the manufacture method of photosensory assembly according to claim 27, including step: attach described sensitive chip in a wiring board main body, and electrically connected by least one connecting line。
29. the manufacture method of photosensory assembly according to claim 28, including step: be coated with described connecting line by described encapsulation part。
30. the manufacture method of photosensory assembly according to claim 28, including step: extend a described encapsulation part non-photo-sensing district to described sensitive chip。
31. the manufacture method of photosensory assembly according to claim 28, including step: form a mounting groove on described encapsulation part top, in order to install an optical filter, motor or camera lens。
32. the manufacture method of photosensory assembly according to claim 28, including step: arrange at least one reinforced hole in described wiring board main body, and make described encapsulation part extend into described reinforced hole。
33. the manufacture method of photosensory assembly according to claim 28, including step: attach a back-up coat at described wiring board main body bottom, to strengthen the structural strength of described wiring board main body。
34. the manufacture method of photosensory assembly according to claim 28, including step: be coated with a screen layer in described wiring board main body and described encapsulation part, to strengthen the electromagnetism interference performance of described photosensory assembly。
35. the manufacture method according to the arbitrary described photosensory assembly of claim 27 to 34, including step: bury a lead-in wire underground to described encapsulation part, and described lead-in wire is made to electrically connect described wiring board main body, in order to connect a motor。
36. the manufacture method of photosensory assembly according to claim 35, including step: arrange a pin groove to described encapsulation part upper end, and make a motor link of described lead-in wire be revealed in described pin groove。
37. the manufacture method according to the arbitrary described photosensory assembly of claim 27 to 34, including step: arrange at least one circuit junction extremely described wiring board main body, and a pin groove extremely described encapsulation part is set, described circuit junction is made to be revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when inserting described pin groove。
38. the manufacture method according to the arbitrary described photosensory assembly of claim 27 to 34, including step: arranging an engraving circuit to described encapsulation part, described engraving circuit is electrically connected to described wiring board main body, in order to electrically connect a motor。
39. the manufacture method of the photosensory assembly according to claim 38, wherein said engraving circuit is arranged at described encapsulation part in the way of laser formation。
40. a camera module, it is characterised in that including:
One according to the arbitrary described photosensory assembly of claim 1 to 26；With
One camera lens；Described camera lens is positioned at the photosensitive path of the described sensitive chip of described photosensory assembly。
41. the camera module according to claim 73, wherein said camera module includes a support, and described support is installed in described photosensory assembly, and described camera lens is installed in described support。
42. the camera module according to claim 73, wherein said camera module includes a motor, and described camera lens is installed in described motor, and described motor is installed in described photosensory assembly。
43. the camera module according to claim 73, wherein said camera module includes an optical filter, and described optical filter is installed in described photosensory assembly。
44. want its camera module described in 73 according to right, wherein said camera module includes an optical filter, and described optical filter is molded into described sensitive chip。
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CN201910423894.8A CN110324516B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201610142925.9A CN105704354B (en) 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method
US15/075,192 US10750071B2 (en) 2016-03-12 2016-03-20 Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
KR1020217005344A KR102294537B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
PCT/CN2017/076041 WO2017157211A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
EP17765753.3A EP3429183A4 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
KR1020217005352A KR102360319B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
JP2018548099A JP7071926B2 (en) 2016-03-12 2017-03-09 Camera module and its photosensitive parts and their manufacturing method
US16/082,533 US20190148429A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
KR1020187029304A KR20180132684A (en) 2016-03-12 2017-03-09 Camera module, its photosensitive part and method of manufacturing the same
TW108135674D TWI758645B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135670D TWI758644B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135674A TW202019155A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW108135670A TW202017356A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW108135672A TWI742441B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135671A TWI769403B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW106108217A TWI754632B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW106203507U TWM559558U (en) 2016-03-12 2017-03-13 Camera module and light-sensing component
US15/460,231 US9876948B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,235 US10277792B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,236 US10084949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/461,413 US9876949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/784,171 US10237460B2 (en) 2016-03-12 2017-10-15 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/101,509 US10367983B2 (en) 2016-03-12 2018-08-12 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/436,934 US10735637B2 (en) 2016-03-12 2019-06-11 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/908,723 US11303789B2 (en) 2016-03-12 2020-06-22 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/919,065 US11706516B2 (en) 2016-03-12 2020-07-01 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/685,587 US11743569B2 (en) 2016-03-12 2022-03-03 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/847,569 US20230019091A1 (en) 2016-03-12 2022-06-23 Camera module, and photosensitive component thereof and manufacturing method therefor
US18/203,252 US20230300442A1 (en) 2016-03-12 2023-05-30 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

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