CN107566691A - Photosensory assembly and camera module and its manufacture method - Google Patents
Photosensory assembly and camera module and its manufacture method Download PDFInfo
- Publication number
- CN107566691A CN107566691A CN201610516600.2A CN201610516600A CN107566691A CN 107566691 A CN107566691 A CN 107566691A CN 201610516600 A CN201610516600 A CN 201610516600A CN 107566691 A CN107566691 A CN 107566691A
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- China
- Prior art keywords
- photo
- wiring board
- sensitive cell
- photosensory assembly
- packaging body
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Photosensory assembly and camera module and its manufacture method, wherein the photosensory assembly includes an at least photo-sensitive cell, at least a forms wiring board and an at least packaging body；Wherein described photo-sensitive cell and the forms wiring board are integratedly encapsulated by the packaging body；The forms wiring board includes a wiring board main body, and has an at least window, and the photo-sensitive cell is arranged in the window.
Description
Technical field
The present invention relates to camera module field, further, is related to a photosensory assembly and camera module and its manufacture
Method.
Background technology
Traditional camera module is generally packaged by COB (Chip On Board) technique, COB encapsulation
As a kind of encapsulation technology of relative maturity, there is its advantage, while many unfavorable factors occur.
Traditional camera module generally includes a wiring board, a sensitive chip, an optical filter, a base, a drive
Dynamic device, a camera lens and capacitance resistance ware.After these parts are encapsulated in a manner of COB, the sensitive chip is mounted
In the wiring board, for the floor installation in the wiring board, the optical filter is installed in the base, and
Positioned at the photosensitive path of the sensitive chip, the driver is installed in the base, and the camera lens is mounted
In the driver, in order to positioned at the photosensitive path of the sensitive chip, and can be adjusted by the driver
Save the focal length of the camera module.
First, in existing this mode, sensitive chip is attached at wiring board upper surface, in this process,
Chip is generally attached at wiring board by way of glue bonding, and is for camera module, the uniformity of optical axis
One and its important aspect, therefore higher is required to the respective planarization of wiring board of sensitive chip herein,
In order to which the follow-up camera lens primary optical axis is consistent with the central optical axis of the sensitive chip.Secondly, base is with viscous
The mode connect is fixed in the wiring board, and optical filter, driver and lens assembly are all using the base as base
Plinth, thus planarization to the base itself and mounted planarization require it is higher.
3rd, the sensitive chip is electrically connected to the wiring board, and the capacitance-resistance that wiring board protrudes above by gold thread
Device, therefore when installing the base, it is necessary to the space of reserved gold thread and the capacitance resistance ware so that gold thread
With capacitance resistance ware in all directions all without being touched, this causes unnecessary space hold.And on the other hand,
Dust debris are becomed easily infected by capacitance resistance ware, these dust debris can influence module imaging, form pitch-black point.
4th, and relatively important one side, the development of various smart machines, such as smart mobile phone are answered, it is right
The lightening of camera module requires more and more higher, is developed so far, in the case where camera module is extremely miniaturized,
Almost each short space is to camera module and its important, and in this assembling mode, the photosensitive core
The space that piece and the wiring board and the capacitance resistance ware each independently take so that the size of camera module is not
Easily reduce.In the structure of this attaching type, because the sensitive chip has certain thickness, therefore pacifying
When filling miscellaneous part, it is necessary to need that the base is installed, provided for institute's sensitive chip and protrude from the wiring board
Locus.
5th, the highly desirable requirement for meeting optical imagery of camera module, in this assembling mode, chip
Attach in the circuit board, and the optical filter is carried on the base, therefore the back focal length of camera module is larger,
The whole height of camera module is larger.
The content of the invention
It is an object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein described
Photosensory assembly includes a photo-sensitive cell, a forms wiring board and a packaging body, the photo-sensitive cell and the forms
Wiring board is integratedly encapsulated by the packaging body.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
Photo-sensitive cell and the forms wiring board is stated integratedly to be encapsulated by the packaging body in a manner of space is overlapping, so as to
Reduce the relative altitude of the photo-sensitive cell and the forms wiring board.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
Stating forms wiring board has a window, accommodates the photo-sensitive cell, so that the photo-sensitive cell and the window
The relative altitude of body wiring board reduces, and reduces the height of camera module.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
The window for stating forms wiring board is through hole so that the photo-sensitive cell and the circuit panel element it is relatively high
Spend adjustable, adapt to the wiring board of different-thickness.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
The bottom for stating photo-sensitive cell is revealed in outside, so as to increase the heat dispersion of the photo-sensitive cell.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
State photo-sensitive cell and the forms wiring board is electrically connected by connecting line, the connecting line is by packaging body one
Encapsulation.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
Stating photosensory assembly includes an optical filter, and the optical filter is arranged at the photo-sensitive cell, blocks the photosensitive member
Part avoids being contaminated, and reduces the back focal length of the camera module.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
Stating packaging body includes a camera lens part, integratedly upwardly extends, suitable for installing the camera lens of camera module, so as to be mirror
Head provides smooth, stable mounting condition.
It is another object of the present invention to provide a photosensory assembly and camera module and its manufacture method, wherein institute
The bottom of the photosensory assembly can be extended downward into by stating packaging body, and the photosensory assembly is encapsulated from bottom.
In order to realize the object above and other objects of the present invention and advantage of the present invention, an aspect of of the present present invention
A photosensory assembly is provided, it includes an at least photo-sensitive cell；An at least forms wiring board；An at least packaging body,
Wherein described photo-sensitive cell and the forms wiring board are integratedly encapsulated by the packaging body, the encapsulation bodily form
Into an optical window of the corresponding photo-sensitive cell, the forms wiring board includes a wiring board main body, and the circuit
Plate main body has an at least window, and the photo-sensitive cell is arranged in the window.
In certain embodiments, the window is a groove, and the photo-sensitive cell is arranged in the groove.
In certain embodiments, photo-sensitive cell and the wiring board main body is electrically connected by an at least electrical connecting element,
Described electrical connecting element one end connects the photo-sensitive cell, and the other end connects the top surface of the wiring board main body, and
And the top surface for the wiring board main body being connected with the other end of the photo-sensitive cell is located at the window
Outside mouthful.
In certain embodiments, photo-sensitive cell and the wiring board main body is electrically connected by an at least electrical connecting element,
Described electrical connecting element one end connects the photo-sensitive cell, and the other end connects the top surface of the wiring board main body, and
And the top surface for the wiring board main body being connected with the other end of the photo-sensitive cell is located at the window
Within mouthful.
In certain embodiments, the window is a through hole, and the photo-sensitive cell is arranged in the through hole.
In certain embodiments, the photo-sensitive cell is electrically connected by an at least electrical connecting element, the electrical connection
Element one end connects the photo-sensitive cell, and the other end connects the top surface of the wiring board main body.
In certain embodiments, the photosensory assembly includes a substrate, and the substrate is arranged at the photosensitive member
Below part.
In certain embodiments, the photosensory assembly includes a substrate, and the substrate is in groove-like, the substrate
It is arranged in the window, the photo-sensitive cell is housed inside the substrate.
In certain embodiments, the packaging body integratedly encapsulates the electrical connecting element.
In certain embodiments, the photosensory assembly includes an at least electronic component, and protrusion or part protrude from
Wiring board main body, electronic component described in the packaging body integral packaging.
In certain embodiments, the photo-sensitive cell includes a photosensitive area and non-photo-sensing area, the packaging body one
Ground encapsulation at least a portion non-photo-sensing area.
In certain embodiments, the photosensory assembly also includes the barriers of an annular, and the barriers are set
Around the photosensitive area of photo-sensitive cell.
In certain embodiments, the packaging body surface is step-like structure.
In certain embodiments, the packaging body surface is planar structure.
In certain embodiments, the packaging body includes a cradle portion and a camera lens part, camera lens part outside edge
The cradle portion integratedly extends, be internally formed it is step-like, the cradle portion be used for install an optical filter, it is described
Camera lens part is used to install a camera lens.
In certain embodiments, it is smooth inside the camera lens part, suitable for installing a non-threaded camera lens.
In certain embodiments, there is helicitic texture inside the camera lens, suitable for installing a threaded camera lens.
In certain embodiments, the wiring board main body has a reinforced hole, and the packaging body extends into described
Reinforced hole.
In certain embodiments, the wiring board main body has a reinforced hole, and the packaging body passes through the reinforcing
Hole, extend to the wiring board bottom part body.
In certain embodiments, the photosensory assembly includes an optical filter, and the optical filter is attached to the sense
Optical element.
In certain embodiments, the photosensory assembly includes an optical filter, and the edge of the optical filter is by the envelope
Fill body integral packaging.
In certain embodiments, the photosensory assembly includes a backboard, and the backboard is mounted on the wiring board
Bottom part body.
In certain embodiments, the integral packaging mode is molded mode.
According to a further aspect of the invention, the present invention provides a camera module, and it includes described photosensory assembly；
An at least camera lens, the camera lens are located at the photosensitive path of the photo-sensitive cell of the photosensory assembly.
In certain embodiments, the camera module includes an at least driver, and the camera lens is installed in described
Driver, the driver are installed in the photosensory assembly.
In certain embodiments, the camera module includes an at least support, and the support is installed in the sense
Optical assembly.
In certain embodiments, the camera module includes multiple photo-sensitive cells and multiple camera lenses, shape
Into an array camera module.
In certain embodiments, the forms wiring board of each photosensory assembly is integrally connected.
According to a further aspect of the invention, the present invention also provides the manufacture method of a photosensory assembly, and it includes step
Suddenly：
(A) photo-sensitive cell is set in a window of a forms wiring board；
(B) photo-sensitive cell and the forms wiring board are electrically connected；With
(C) packaging body joined integrally with the photo-sensitive cell and the forms wiring board is formed, and is caused
The packaging body forms an optical window relative with the photo-sensitive cell.
In certain embodiments, wherein in the step (C), the photo-sensitive cell and the forms wiring board
Between be in contact, the packaging body is integrally connected the photo-sensitive cell and the forms wiring board.
In certain embodiments, wherein in the step (C), the photo-sensitive cell and the forms circuit
Between plate separately, the packaging body is integrally connected and is filled in the photo-sensitive cell and the forms wiring board
Between to reinforce the photo-sensitive cell and the forms wiring board.
In certain embodiments, wherein in the step (C), the photo-sensitive cell and the forms wiring board
Between by a medium mediate contact, the packaging body is integrally connected the photo-sensitive cell, the medium and institute
State forms wiring board.
Brief description of the drawings
Fig. 1 is the camera module schematic perspective view according to first preferred embodiment of the present invention.
Fig. 2 is the camera module decomposing schematic representation according to first preferred embodiment of the present invention.
Fig. 3 is the camera module schematic cross-sectional view according to first preferred embodiment of the present invention.
Fig. 4 is the manufacturing process according to the photosensory assembly of the camera module of first preferred embodiment of the present invention
Schematic diagram.
Fig. 5 A and 5B are the encapsulation according to the photosensory assembly of the camera module of first preferred embodiment of the invention
Two kinds of equivalent implementations of body.
Fig. 6 is the first change according to the photosensory assembly of the camera module of first preferred embodiment of the present invention
Shape embodiment.
Fig. 7 is second of change according to the photosensory assembly of the camera module of first preferred embodiment of the present invention
Shape embodiment.
Fig. 8 according to the present invention second preferred embodiment camera module schematic cross-sectional view.
Fig. 9 according to the present invention second preferred embodiment camera module photosensory assembly decomposing schematic representation.
Figure 10 according to the present invention second preferred embodiment camera module photosensory assembly deformation implementation side
Formula.
Figure 11 is the schematic cross-sectional view according to the camera module of the 3rd preferred embodiment of the present invention.
Figure 12 is the photosensory assembly schematic perspective view according to the camera module of the 3rd preferred embodiment of the present invention.
Figure 13 is the deformation reality according to the photosensory assembly of the camera module of the 3rd preferred embodiment of the present invention
Apply mode.
Figure 14 is the camera module schematic cross-sectional view according to the 4th preferred embodiment of the present invention.
Figure 15 is the variant embodiment according to the camera module of the 4th preferred embodiment of the present invention.
Figure 16 is the schematic cross-sectional view according to the camera module of the 5th preferred embodiment of the present invention.
Figure 17 is the deformation reality according to the photosensory assembly of the camera module of the 5th preferred embodiment of the present invention
Apply mode.
Figure 18 is the camera module schematic cross-sectional view according to the camera module of the 6th preferred embodiment of the present invention.
Figure 19 is the deformation implementation according to the photosensory assembly of the camera module of the 6th preferred embodiment of the present invention
Mode.
Figure 20 is the camera module schematic cross-sectional view according to the 7th preferred embodiment of the present invention.
Figure 21 is the camera module schematic cross-sectional view according to the 8th preferred embodiment of the present invention.
Figure 22 is the camera module schematic cross-sectional view according to the 9th preferred embodiment of the present invention.
Figure 23 is the photosensory assembly manufacture method block diagram according to the above preferred embodiment of the present invention.
Embodiment
Describe to be used to disclose the present invention below so that those skilled in the art can realize the present invention.In describing below
Preferred embodiment be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.With
The general principle of the invention defined in lower description can apply to other embodiments, deformation program, improvement side
Case, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ",
" under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the instruction such as " outer "
Orientation or position relationship be to be based on orientation shown in the drawings or position relationship, its be for only for ease of describe this hair
Bright and simplified description, rather than indicate or imply that signified device or element must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore above-mentioned term is not considered as limiting the invention.
As shown in Figures 1 to 4, be according to the present invention first preferred embodiment camera module.It is described to take the photograph
As module includes an at least photosensory assembly 10, at least a camera lens 20 and an at least optical filter 30.
The optical filter 30 is installed in the photosensory assembly 10, positioned at the photosensitive road of the photosensory assembly 10
Footpath.The camera lens 20 is located at the photosensitive path of the photosensory assembly 10.Ground illustrate during IMAQ,
The light reflected by destination object is entered inside the camera module by the camera lens 20, described in light warp
The photosensory assembly 10 is reached after the optical effect of camera lens 20 and the optical filter 30, by described photosensitive group
The photosensitization of part 10, photoelectric conversion is carried out, converts light signals into electric signal, and then can be by described
Electronic equipment of the photosensory assembly 10 by electric signal transmission to the application camera module, realizes the reproduction of image,
Complete the image acquisition process of a destination object.
Further, the camera module can also include an at least driver 40, and the camera lens 20 is installed in
The driver 40, the driver 40 are installed in the photosensory assembly 10, to cause the camera lens 20
The camera module can be adjusted positioned at the photosensitive path of the photosensory assembly 10, and by the driver 40
Focal length.The driver 40 may be implemented as a motor, citing ground but be not limited to, voice coil motor, pressure
Electric notor.That is, in this embodiment in accordance with the invention, the camera module is a dynamic burnt camera module
AFM(Automatic Focus Model).Certainly, in other embodiments of the invention, the shooting mould
Group can also be other types, for example focus camera module FFM (Fix Focus Model).The skill of this area
Art personnel are it should be appreciated that the type of the camera module is not the limitation of the present invention.
The optical filter 30 can be cutoff filter, wafer scale cutoff filter or smalt filter
Mating plate.Those skilled in the art is it should be appreciated that the particular type of the optical filter 30 is not this hair
Bright limitation.
The photosensory assembly 10 includes an at least photo-sensitive cell 11, one at least forms wiring board 12 and one at least
Packaging body 13.The photo-sensitive cell 11 and the space of forms wiring board 12 are arranged overlappingly, so as to reduce
The relative altitude of the photo-sensitive cell 11 and the forms wiring board 12.The photo-sensitive cell 11 and the window
Body wiring board 12 is integratedly encapsulated by the packaging body 13.
The packaging body 13 has an at least optical window 134, for providing passage of light for the photo-sensitive cell 11.
That is, the light entered by the camera lens 20 reaches the photo-sensitive cell 11 through the optical window 134
And carry out photoelectric conversion.
In this embodiment in accordance with the invention, the packaging body 13 is internally formed step-like structure, in order to pacify
Fill the optical filter 30.Certainly, the step-like structure can be used for installing the driver 40 or described
Camera lens 20, those skilled in the art is it should be appreciated that the installing component of the packaging body 13 is not this
The limitation of invention.
The photo-sensitive cell 11 includes a top surface 111 and a basal surface 112.The top surface 111 with it is described
Camera lens 10 is relative, for carrying out photoelectric conversion.
Further, the top surface 111 of the photo-sensitive cell 11 includes a photosensitive area 1111 and a non-photo-sensing
Area 1112, the photosensitive area 1111 is photosensitive for carrying out, and the non-photo-sensing area 1112 is electrically connected to the forms
Wiring board 12, so as to which the photosensitive area 1111 to be carried out to the electric signal transmission after photoelectric conversion in the forms line
Road plate 12.In one embodiment, the photo-sensitive cell 11 may be implemented as square CCD or CMOS
Chip, the non-photo-sensing area 1112 are surrounded on the periphery of photosensitive area 1111.The forms wiring board 12 can
With the electric signal including pre-buried circuit, transmitted for handling the photo-sensitive cell 11.
The packaging body 13 integratedly encapsulates at least a portion non-photo-sensing area 1112 of the photo-sensitive cell 11.
That is, the packaging body 13 can encapsulate the portion in the non-photo-sensing area 1112 of the photo-sensitive cell 11
Subregion, the Zone Full in the non-photo-sensing area 1112 of the photo-sensitive cell 11 can also be encapsulated.
The photo-sensitive cell 11 is electrically connected to the forms wiring board 12 by an at least electrical connecting element 14,
So as to realize the electric signal transmission of the photo-sensitive cell 11 and the forms wiring board 12.The electrical connecting element
14 can be connecting element made of one or more in gold, silver, copper, aluminium, conductive non-metals, citing
Ground but it is not limited to, gold thread, silver wire, copper cash, aluminum steel.In a kind of manufacture, the electrical connecting element
14 are arranged at the photo-sensitive cell 11 and the forms wiring board 12 by W/B (Wired/Bond) technique.Enter
One step, the electrical connecting element 14 connect the non-photo-sensing area 1112 of the photosensitive element and the forms circuit
Plate 12.
The photosensory assembly 10 includes an at least electronic component 123, and the electronic component 123 protrudes institute
State forms wiring board 12.The electronic component 123 is electrically connected to the forms wiring board 12.The electronics
Component 123 can be resistance, electric capacity, driving element, Signal Processing Element, memory element etc..The electricity
Sub- component 123 is the electronic component 123 of the forms wiring board 12, completes the transmission of electric signal,
In other embodiment, without the electronic component 123 protruded or the electronic component can also be buried
Located at the forms wiring board 12.Those skilled in the art is it should be appreciated that the electronic component 123
Type and set-up mode, be not the present invention limitation.
The electronic component 123 and the electrical connecting element 14 are packaged in the packaging body 13, change sentence
Talk about, the electrical connecting element 14 and the electronic component 123 are wrapped up by the packaging body 13, so as to not
Environment can be externally exposed.In existing mode, connect gold thread and capacitance resistance ware and be commonly exposed to outside, one
The dust being infected with aspect gold thread and capacitance resistance ware can influence the image quality of camera module, on the other hand, it is necessary to
The installing space of reserved gold thread and capacitance resistance ware, therefore cause the space waste of camera module.
The forms wiring board 12 includes a wiring board main body 121, and the forms wiring board 12 has a window
Mouth 122.The window 122 is arranged at the wiring board main body 121, so as to form a forms shape wiring board.
The photo-sensitive cell 11 is housed inside in the window 122, is additionally taken so as to reducing the photo-sensitive cell
Space.
That is, the photo-sensitive cell 11 is housed inside in the window 122 of the forms wiring board 12,
So that the photo-sensitive cell 11 sinks relative to the position of the wiring board main body 121 so that the photosensitive member
The relative altitude of part 11 and the circuit edition owner body 121 reduces.When the top surface of the photo-sensitive cell 11
When 111 height are not higher than the top surface 1211 of the wiring board main body 121, the wiring board main body 11 is
The photo-sensitive cell 11 provides sufficient space environment, and the photo-sensitive cell 11 and the wiring board main body
121 whole height is showed only as the height of the wiring board main body 121.
The wiring board main body 121 has a top surface 1211 and a bottom surface 1212, and the packaging body 13 encapsulates
In the top surface 1211 of the wiring board main body 121 and the top surface 111 of the photo-sensitive cell 11
The non-photo-sensing area 1112.The size of the window 122 of the forms wiring board 12 can be according to described
The size of photo-sensitive cell 11 is configured, can be suitable with the size of the photo-sensitive cell 11 so that the window
Mouth 122 is suitable to accommodate the photo-sensitive cell 11 or less than the photo-sensitive cell 11, is being easy to accommodate
While photo-sensitive cell 11, it is easy to adjust the photo-sensitive cell 11.In a kind of implementation process, in institute
A gap 125 can be reserved by stating between photo-sensitive cell 11 and the forms wiring board 12, be easily installed, and logical
Cross the packaging body 13 and fill the gap 125, the fixed photo-sensitive cell 11.Reference picture 3, in one kind
In embodiment, the packaging body 13 enters the gap, fills the wiring board main body 121 and the sense
Space between optical element 11, and cause the packaging body 13 to extend into the position of gap 125 and institute
State photo-sensitive cell 11 the basal surface 112 and the wiring board main body 121 the height of the bottom surface 1212 it is big
Body is consistent.So, the packaging body 13 can reinforce the photo-sensitive cell 11 and the forms wiring board 12.
Reference picture 5A, in another embodiment, the packaging body 13 are introduced into the gap 125, and make
Obtain the top surface 111 of packaging body 13 and photo-sensitive cell 11 and the top surface 1211 of the wiring board main body 121
Height it is unanimous on the whole, and during implementation, glued by bonding agent, such as glue, be bonded the photosensitive member
Part 11 and the wiring board main body 121, stop that the packaging body 13 enters the gap 125.Reference picture 5B,
In another embodiment, the packaging body 13 extends into the gap, and passes through the gap 125
Coat the bottom of the photosensory assembly 10.Those skilled in the art it should be appreciated that the gap and
The relation in the packaging body and the gap can be arranged as required to, the size in the gap and the encapsulation
The position that body 13 extends in the gap, it is not the limitation of the present invention.
It is noted that in a further embodiment, the wiring board main body 121 can not also be with the sense
The gap 125 separately is formed between optical element 11, and can directly contact.It is noted that
When the packaging body 13 reinforces the forms wiring board 12 and the photo-sensitive cell 11, unlike prior art
In need assist side bottom to increase stiffening plate, the packaging body can play the benefit to the forms wiring board
Pretend use.Certainly, the dorsal part of the forms wiring board 12 of the invention can also further set stiffening plate
Further to strengthen the package strength of the photosensory assembly.
During the photosensory assembly 10 is manufactured, first a circuit board substrate is opened a window, formation has
The forms wiring board 12 of the window 122, is then arranged at the window 122 by the photo-sensitive cell 11
Interior (photo-sensitive cell 11 and the forms wiring board 12 can also being fixed by glue), then by institute
State photo-sensitive cell 11 and the wiring board main body 121 is electrically connected by the electrical connecting element 14, such as
The mode of bonding, and then by the non-photo-sensing area 1112 of the photo-sensitive cell 11, institute by way of integral packaging
Electrical connecting element 14, the electronic component 123, the forms wiring board 12 is stated integratedly to be encapsulated.
The material of the wiring board main body 121 can be Rigid Flex RG (Rigid Flex), flexible printing
Circuit board FPC (Flex Print Circuit), rigid printed circuit boards PCB (Printed Circuit Board),
Ceramic substrate (without soft board) etc..
It is noted that the packaging area in the non-photo-sensing area 1112 of the photo-sensitive cell 11 can be according to demand
Setting, that is to say, that the non-photo-sensing area 1112 can all be encapsulated, and can also partly be encapsulated,
Those skilled in the art is it should be appreciated that the size and shape of the packaging area are not the present invention's
Limitation.
In the present invention, the packaging body 13 is integrally formed by molding (Molding) technology mode, area
Not in traditional base, wiring board is adhered to.When manufacturing the photosensory assembly 10, by the photo-sensitive cell
11 and the forms wiring board 12 be put into mould, and apply moulding material in backward mould, formed after solidification pre-
Shape the packaging body 13 of shape, and by the packaging body 13 by the photo-sensitive cell 11 and forms circuit
Plate 12 is fixed.The moulding material can select nylon, LCP, and (Liquid Crystal Polymer, liquid crystal are high
Molecularly Imprinted Polymer), PP (Polypropylene, polypropylene), epoxy resin and other thermoplastics or thermosetting material
Material.
The mode of this integral packaging, reduce the process of traditional glue bonding base, and the packaging body
13 are manufactured by way of molding, and shape easily controls, profile pattern is preferable, therefore can be described
Optical filter 30, the driver 40 and the camera lens 20 provide smooth mounting condition, help to ensure that
The uniformity of the camera module optical axis.On the other hand, reduce traditional glue bonding space, help to drop
The height of the low camera module.Further, in an embodiment of the present invention, the photo-sensitive cell 11 is set
It is placed in the window 122, then carries out integral packaging, therefore need not when forming the packaging body 13
The thickness of the photo-sensitive cell 11 is considered, so as to further provide the possibility for reducing the camera module height
Space.
The packaging body 13 overlooks structure in a ring, citing ground but is not limited to, square, circular, triangle,
In order to provide installation site for the optical filter 30, the driver 40 or the camera lens 20, so as to work as
When the driver 40 or the camera lens 20 are installed in the packaging body 13, the interior environment of a closing is formed.
And by the integral packaging advantage of mold, it is ensured that the surface of packaging body 13 it is smooth, so as to be institute
State optical filter 30, the camera lens 20 or the driver 40 and smooth mounting condition is provided.
According to this embodiment of the present invention, the window 122 is a through hole, that is to say, that the window
122 are communicated in the both sides of the wiring board main body 121, so as to provide and can adjust for the photo-sensitive cell 11
Space.In other words, the photo-sensitive cell 11 is in the window 122 and the wiring board main body 121
Relative position, can be arranged as required to.
It is noted that in the present invention, the photo-sensitive cell 11 and the forms wiring board 12 pass through institute
The encapsulation of the one of packaging body 13 is stated, can be with so as to when the photo-sensitive cell 11 is arranged in window 122
Extra support member is not needed to fix the photo-sensitive cell 11 so that the position of the photo-sensitive cell 11 can
Relatively free to choose.In other words, the packaging body 13 from top be respectively the He of photo-sensitive cell 11
The wiring board main body 121 provides fixation, without the wiring board main body 121 or miscellaneous part
From other directions, such as lower section, support, fixation are provided for the photo-sensitive cell 11.And by described
The integral packaging effect of packaging body 13, can strengthen the wiring board main body 121 and the photo-sensitive cell 11
Structural strength.
Further, it is arranged at according to this embodiment of the present invention, the photo-sensitive cell 11 close to the window
The position of the lower section of mouth 122, described one end of electrical connecting element 14 is connected to the non-sense of the photo-sensitive cell 11
Light area 1112, the other end of the connection are connected to the wiring board main body 121 through the window 122.
Further, the bottom surface of the basal surface 112 of the photo-sensitive cell 11 and the wiring board main body 121
1212 is highly relatively uniform, so that the bottom of the photosensory assembly 10 is opposed flattened, be not in obvious
Step.In other words, the bottom of the basal surface 112 of the photo-sensitive cell 11 and the wiring board main body
Face 1212 generally flushes.
In this fashion, the basal surface 112 of the photo-sensitive cell 11 is revealed in exterior space, therefore is increased
The strong heat sinking function of the photo-sensitive cell 11, and in the mode different from attaching, the quilt of basal surface 112
Wiring board stops that heat dispersion is poor.
Citing ground, the present invention provide the manufacture method of two kinds of forms wiring boards 12, in one approach,
Substrate layer is first opened up into the window 122, the size of the window 122 determines according to the photo-sensitive cell 11,
Then lamination sets each substrate layer, and circuit is buried between predetermined each substrate layer, so as to form one
The forms wiring board 12 with the window 122.In another approach, substrate is arranged with being laminated,
And bury circuit, and embedded route putting according to the photo-sensitive cell 11 by projected route between each substrate layer
Depending on seated position, the window 122 is then opened on the substrate layer of lamination, the window 122 is in embedded electricity
Within road, determined according to the shape of the photo-sensitive cell 11, that is to say, that circuit will not be damaged.
As shown in fig. 6, it is the photosensory assembly 10 according to the camera module of first preferred embodiment of the present invention
The first variant embodiment.Different from above-mentioned embodiment, in this embodiment, the sense
The height of the top surface 1211 of the top surface 111 of optical element 11 and the wiring board main body 121 is with respect to one
Cause.That is, the institute of the top surface 111 of the photo-sensitive cell 11 and the wiring board main body 121
State top surface 1211 generally to flush, in the lower position headspace of the photo-sensitive cell 11.It is neat in upper surface
In the case of flat, the photo-sensitive cell 11 and the forms wiring board 12 are passed through into the electrical connecting element 14
It is electrically connected.
During this photo-sensitive cell 11 is manufactured, the tool of a boss shape can be provided, it is described to support
Photo-sensitive cell 11, so that the upper surface flush of the photo-sensitive cell 11 and the forms wiring board 12,
Integral packaging then is carried out to the photo-sensitive cell 11 and the forms wiring board 12, forms the packaging body
13, so as to be consolidated by the relative position of the packaging body 13 photo-sensitive cell 11 and the forms line plate
It is fixed.
As shown in fig. 7, it is the photosensory assembly 10 according to the camera module of first preferred embodiment of the present invention
Second of variant embodiment.Different above-mentioned embodiments, it is in this embodiment, described photosensitive
Element 11 includes a barriers 15, and the barriers 15 are arranged at the packaging body 13 and the photosensitive member
The position that part 11 connects, for preventing influence of the packaging body 13 to the inside region of photo-sensitive cell 11,
Such as the pollution to the photosensitive area 1111, i.e. the barriers 15 are arranged at the outside of photosensitive area 111,
In order to during manufacture, stop that the moulding material of fluid state enters the photosensitive area 1111, and
The photo-sensitive cell 11 is protected during encapsulating mould operation.
The barriers 15 in a ring or frame-shaped construction, are arranged on the photo-sensitive cell 11.That is,
The position that the inward flange and the photo-sensitive cell 11 of the packaging body 13 connect is obstructed by the barriers 15.
The barriers 15 can be formed by colloid, or the plastic components of predetermined shape.
During this photosensory assembly 10 is manufactured, to the photo-sensitive cell 11 and the forms wiring board
, it is necessary to set the barriers 15 on the photo-sensitive cell 11 before 12 progress integral packagings, for example it is coated with
Glue, and then be boundary with the barriers 15, the packaging body 13 is formed, so that the packaging body
13 materials will not pollute the photo-sensitive cell 11 positioned at the region of the inner side of barriers 15.
As shown in Figure 8 and Figure 9, according to the camera module of second preferred embodiment of the present invention.Different from upper
Preferred embodiment is stated, the window 122A is a groove structure, that is to say, that the photo-sensitive cell 11
It is housed inside in the groove structure, so that the table of the photo-sensitive cell 11 and the forms wiring board 12
The relative altitude in face reduces.Further, when the depth of the groove structure is more than or equal to the photo-sensitive cell
During 11 thickness, the integral thickness of the photo-sensitive cell 11 and the forms wiring board 12 shows as the window
The thickness of body wiring board 12.
The corresponding window bottom 124A of the window 122A, the photo-sensitive cell 11 are arranged at the window bottom 124A.
In other words, the window bottom 124A supports the photo-sensitive cell 11.The size of the window 122A can be with
The size of the photo-sensitive cell 11 matches, so that the photo-sensitive cell 11 and the wiring board main body
121 flush.Certainly, can also be deposited between the photo-sensitive cell 11 and the wiring board main body 121
In gap, then the sensitive chip and the wiring board main body 121 are fixed by bonding agent.
In this embodiment in accordance with the invention, the electrical connecting element 14 is electrically connected to the He of photo-sensitive cell 11
The wiring board main body 121.That is, institute of the connection of electrical connecting element 14 in window 122A
State the wiring board top surface outside photo-sensitive cell 11 and window 122A.
As shown in Figure 10 according to the change of the photosensory assembly 10 of the camera module of second preferred embodiment of the present invention
Shape embodiment.Different from above preferred embodiment, the electrical connecting element 14 is arranged at the window
In the window 122A of body wiring board.Further, the one end of electrical connecting element 14 connection is described photosensitive
The non-photo-sensing area 1112 of element 11, the other end are connected to the window bottom corresponding to the window 122A
PCB surface 124A.Relative to above-mentioned embodiment, due to will be described in the wiring board main body 121
The PCB surface 124A at window bottom sets electric connection structure, and the electrical connection is completed in less space
The termination process that is electrically connected of element 14 and the photo-sensitive cell 11, therefore technology difficulty is greater than above-mentioned embodiment.
Relatively above-mentioned first preferred embodiment, compares, the groove of second embodiment in terms of manufacture craft
The difficulty of processing of the window 122 of shape is greater than the window 122A of through hole shape.Due to the thickness of wiring board
Degree is smaller, and groove is set on the less wiring board of thickness, and craft precision requires higher, and if by described in
Electrical connecting element 14 is arranged in groove, and circuit is set equivalent on thinner wiring board, and difficulty is higher,
Therefore overall to consider, the window 122A and the electrical connecting element 14 of through hole shape are connected to outside
Mode is more suitable for implementing, and provides the space that more photo-sensitive cells 11 can be adjusted, and heat dispersion
Preferably.
As is illustrated by figs. 11 and 12, be according to the present invention the 3rd preferred embodiment camera module.It is different
It is preferable to carry out in above-mentioned, in this embodiment, the photosensory assembly 10 includes an optical filter 30B,
The optical filter 30B is attached to the photo-sensitive cell 11.That is, the optical filter 30B blocks institute
Photo-sensitive cell 11 is stated, so as to reduce pollution to the photo-sensitive cell 11 and mould to the photo-sensitive cell 11
Damage.
In this embodiment, the upper surface of packaging body 13 can be a smooth planar structure, without
Need to be arranged to step-like structure to install the optical filter 30B.Driver 40 or the camera lens 20 quilt
By being installed on the packaging body 13.
Citing ground, the optical filter 30B can be connected to the photo-sensitive cell 11 by way of bonding.
In other embodiment, the optical filter 30B can also be connected to the photo-sensitive cell by way of absorption
11, those skilled in the art is it should be appreciated that the tool of the optical filter 30B and the photo-sensitive cell 11
Body connected mode, it is not the limitation of the present invention.
In this fashion, the optical filter 30B is arranged at the photo-sensitive cell 11, therefore is taken the photograph described
As in module, it is not necessary to the optical filter 30B is installed on the packaging body 13, and in this fashion,
The distance of the optical filter 30B and the photo-sensitive cell 11 reduces, therefore after reducing the camera module
Focal length, so that the height of the camera module can further reduce.
, can be to the photo-sensitive cell 11 and the forms line during the photosensory assembly 10 is manufactured
Before road plate 12 carries out integral packaging, the optical filter 30B is attached on the photo-sensitive cell 11, so as to logical
Cross the photo-sensitive cell 11 and block the photo-sensitive cell 11, particularly block the described of the photo-sensitive cell 11
Photosensitive area 1111, so as to during integral packaging, block, protect by the optical filter 30B described in
Photo-sensitive cell 11, prevent the encapsulating material of the packaging body 13 from polluting the photo-sensitive cell 11, so as to improve into
As quality.Certainly, in other embodiments of the present invention, can also be set after the packaging body 13 is formed
The optical filter 30B, reduce the back focal length of camera module, those skilled in the art is it should be appreciated that institute
Optical filter 30B setting order is stated, is not the limitation of the present invention.
As shown in figure 13, be according to the present invention the 3rd preferred embodiment camera module photosensory assembly 10
A variant embodiment.Different from above-mentioned embodiment, in this embodiment, the photosensitive member
Part 11 is attached to the photo-sensitive cell 11, and the filter including optical filter a 30B, the optical filter 30B
Mating plate 30B outward flange is by the integral packaging of packaging body 13.That is, the photo-sensitive cell 11, institute
Forms wiring board 12 and the optical filter 30B are stated all by the integral packaging of packaging body 13, so that by described in
Filter element is fixed., will when manufacturing this photosensory assembly 10, it is necessary to before the packaging body 13 is formed
The optical filter 30B is overlapped in the photo-sensitive cell 11, can be bonded by glue, can also be without viscous
Connect, and the optical filter 30B is fixed by way of integral packaging.
As shown in figure 14, be according to the present invention the 4th preferred embodiment camera module.Different from above-mentioned
Embodiment, the photosensory assembly 10, which includes packaging body a 13C, the packaging body 13C, includes a support
A portion 131C and camera lens part 132C.The cradle portion 131C is used to install the optical filter 30, the camera lens
Portion 132C user installations camera lens 20.
Further, integratedly upwardly extended along the cradle portion 131C outside the camera lens part 132C, it is internal
Form step-like structure.The cradle portion 131C includes one first supporting table 1311C, the optical filter 30
It is installed in the first supporting table 1311C.The camera lens part 132C includes one second supporting table 1321C,
The camera lens 20 is installed in the second supporting table 1321C, that is to say, that the first supporting table 1311C
Two stage stage structures are formed with the second supporting table 1321C.
The camera lens part integratedly extends, in order to provide stable installation environment for the camera lens 20.According to
This embodiment of the present invention, the depth of the camera lens part can highly determine according to the camera lens 20, so as to
In being stably installed the camera lens 20, the precision of camera module is improved.
In this fashion, an installation environment is provided for the camera lens 20, forms one and focus camera module, and
Smooth, stable installation environment can be provided for the camera lens 20 by the integral packaging mode of mold.
Further, in this embodiment, it is smooth inside the camera lens part, suitable for installing non-threaded camera lens
20。
As shown in figure 15, be according to the present invention the 4th preferred embodiment camera module deformation implementation side
Formula.Different from above-mentioned preferred embodiment, in this embodiment, the camera lens part 132C's is interior
Portion has a helicitic texture 1322C, suitable for installing a threaded camera lens.Certainly it is described in other implementations
Other different structures are can also be inside camera lens part, in order to install different types of camera lens.
As shown in figure 16, be according to the present invention the 5th preferred embodiment camera module schematic cross-sectional view.
Different from above preferred embodiment, the photosensory assembly 10 includes a substrate 16, the quilt of substrate 16
It is arranged at the lower section of photo-sensitive cell 11.
Further, the bottom surface 1212 of the height of the bottom of substrate 16 and the wiring board main body 121
It is highly unanimous on the whole, so that the bottom of the photosensory assembly 10 keeps smooth.In other words, the substrate
The remaining space of the window 122 of the 16 fillings lower section of photo-sensitive cell 11, so that working as the photosensitive member
The thickness of part 11 be less than the wiring board main body 121 thickness, and the photo-sensitive cell 11 be arranged in it is close
Described in the wiring board main body 121 during the position of top surface 1211, the bottom of the photosensory assembly 10 is still able to
Keep smooth, be not in obvious ledge structure.
The substrate 16 can strengthen the photosensory assembly 10 and structural strength, and heat dispersion.It is real one
Apply in example, the substrate 16 can be metallic plate or plastic plate.And in another embodiment, the substrate 16
It can be a film layer, the lower surface 112 of the photo-sensitive cell 11 is attached to, in order to protect the sense
Optical element 11, strengthen the heat dispersion and structural strength of the photo-sensitive cell.Citing ground but be not limited to, institute
It is a metal coating to state film layer.
The substrate 16 can be connected to the wiring board main body 121 by way of bonding, or pass through bonding
Mode be connected to the photo-sensitive cell 11.
Certainly, in other embodiments, the substrate 16 can be arranged under the wiring board main body 121
Side, such as when the thickness of the photo-sensitive cell 11 is more than the thickness of the wiring board main body 121, Ke Yitong
The difference in height between photo-sensitive cell 11 and the wiring board main body 121 described in the polishing of substrate 16 is crossed, so as to
So that the bottom of photosensory assembly 10 keeps smooth.
As shown in figure 17, be according to the present invention the 5th preferred embodiment camera module photosensory assembly
One variant embodiment.Different from above-mentioned embodiment, the forms wiring board 12 includes a substrate 16D,
The substrate 16D is housed inside in the window 122 of the forms wiring board 12.The substrate 16D is in
Groove-like structure, the photo-sensitive cell 11 are housed inside the substrate 16D.That is, the substrate 16D
Pass through an installation site for the photo-sensitive cell 11 so that the photo-sensitive cell 11 and the wiring board main body
121 upper surface is concordant, and the height of the lower surface of the substrate 16D and the bottom surface of the wiring board main body 121
Spend unanimous on the whole so that the bottom of photosensory assembly 10 is smooth.
As shown in figure 18, be according to the present invention the 6th preferred embodiment camera module.Different from above-mentioned
Embodiment, the wiring board main body 121 of the forms wiring board 12 have an at least reinforced hole 1213,
The packaging body 13 extends into the reinforced hole 1213, so as to strengthen the structure of the wiring board main body 121
Intensity.The quantity and depth of the reinforced hole 1213 can arrange as needed, be arranged at the forms circuit
Plate 12 is not provided with the position of circuit.
In this embodiment, the reinforced hole 1213 is shrinkage pool, that is to say, that the wiring board main body
121 both sides connect not over the reinforced hole 1213.
Figure 19 is the deformation reality according to the photosensory assembly 10 of the camera module of the 6th preferred embodiment of the present invention
Apply mode.Different from above-mentioned embodiment, the wiring board main body 121 of the forms wiring board 12
The reinforced hole 1213E is extended into at least a reinforced hole 1213E, the packaging body 13, and it is described
Reinforced hole 1213E is perforation.That is, the wiring board can be connected by the reinforced hole 1213E
The both sides of main body 121.
Further, the packaging body 13 extends to the wiring board main body 121 by the reinforced hole 1213E
With the bottom of the photo-sensitive cell 11, so as to the bottom of photosensory assembly 10 formed an encapsulated layer 133E.
The encapsulated layer 133E enhances the structural strength of the photosensory assembly 10.
That is, in this embodiment, the packaging body 13 is not only arranged at the wiring board master
The top of body 121 and the photo-sensitive cell 11, also it is integrally provided to the photo-sensitive cell 11 and the sense
The bottom of optical element 11.Certainly in other embodiments, the encapsulated layer 133E can only be arranged at the line
The lower section of road plate main body 121, and be not provided with below the photo-sensitive cell 11.
As shown in figure 20, be according to the present invention the 7th preferred embodiment camera module.Different from above-mentioned
Preferred embodiment, the photosensory assembly 10 include a backboard 17, and the backboard 17 is arranged at described
The bottom of wiring board main body 121, to strengthen the structural strength of the wiring board main body 121 so that described photosensitive group
The bottom of part 10 is smooth.In one embodiment, the backboard 17 can be metallic plate, so as to strengthen the sense
While the structural strength of optical assembly 10, increase the heat dispersion of the photosensory assembly 10.And in another implementation
In example, the backboard 17 can be a film layer, be attached to the He of the lower surface 112 of the photo-sensitive cell 11
The bottom surface 1212 of the wiring board 121, in order to protect the photo-sensitive cell 11 and the wiring board main body 121,
Strengthen the heat dispersion and structural strength of the photo-sensitive cell.Citing ground but be not limited to, the film layer is a gold medal
Belong to coating.
It is the camera module according to the 8th preferred embodiment of the present invention as shown in figure 21.Different from above-mentioned reality
Example is applied, the camera module includes a support 50, and the support 50 is installed in the packaging body 13,
The optical filter 30 is installed in the support 50.
Further, the support 50 can form a bending structure, in order to which one end is described suitable for being installed in
Packaging body 13, the other end are suitable to support the optical filter 30.
The support 50 can inwardly, extend downwardly, so as to reduce the optical filter 30 and the photo-sensitive cell
11 distance, reduce the back focal length of the camera module.
In this embodiment, it is that the optical filter 30 provides an installation site by the support 50, and
It is not the installation site that the optical filter 30 is directly provided by the packaging body 13, it is worth mentioning at this point that, figure
Shown in the support 50 structure only as signal, be not the present invention limitation.Due to the optical filtering
The structural strength of piece 30 is smaller, therefore the installation site needed when mounted is larger, and by structural strength compared with
Big support 50, the width requirement of the installation site to the integral packaging portion can be reduced.
The support 50, which is overlooked, to be a closed annular or frame-shaped construction, can also be selectively arranged at institute
State one side of packaging body 13 or optical filter 30 or multiple sides.
As shown in figure 22, be according to the present invention the 9th preferred embodiment camera module.Different from above-mentioned
Embodiment, the camera module are an array camera modules, and the array camera module includes two senses
Optical assembly 10, two camera lenses 20, two 40 and two optical filters 30 of driver.
It is noted that the present invention is disclosed for convenience, in this embodiment in accordance with the invention, with two institutes
The double of the composition of camera lens 20 are stated to take the photograph exemplified by module to illustrate, and in other embodiments of the invention, it is described
The quantity of camera lens 20 can be more, such as three or more than three, those skilled in the art should manage
Solution, the quantity of the camera lens 20 and the quantity of corresponding assembly, such as driver 40, support 50, filter
The quantity of piece 30 is not the limitation of the present invention.
More specifically, in this embodiment in accordance with the invention, the forms circuit of two photosensory assemblies 10
Plate 12 is integrally connected, in order to form the structure of array.Two packaging bodies 13 can be structure as a whole,
That is, two square window structures are once formed, in order to be respectively that two offer of camera lenses 20 light lead to
Road.
Multiple embodiments and different embodiments are disclosed in the present invention, in the course of the description, for the ease of
Succinctly, it is explicitly described, only in each embodiment and embodiment, describes some distinguishing characteristics, still
In specific implementation process, the different characteristic in different embodiments and embodiment can be carried out as needed
Combination, so as to form different camera modules or photosensory assembly 10, what those skilled in the art should be understood
It is that the camera module and the photosensory assembly 10 are not limited to the content that single embodiment or embodiment disclose.
Reference picture 23, according to the above preferred embodiment of the present invention, the present invention provides the system of a photosensory assembly 10
Make method 1000, the step of manufacture method 1000 of the photosensory assembly 10：
1100：An at least photo-sensitive cell 11 is set in a window 122 of a forms wiring board 12；
1200：Electrically connect the photo-sensitive cell 11 and the forms wiring board 12；With
1300：A packaging body 13 joined integrally with the photo-sensitive cell and the forms wiring board 12 is formed,
And the packaging body 13 is caused to form an optical window 131 relative with the photo-sensitive cell.
In the step 1100, the window 122 can be groove or through hole.
Step can also be included in the step 1100：Form the forms circuit with an at least window 122
Plate 12；
In the step 1100, the photo-sensitive cell 11 can be arranged at close to the forms wiring board 12
The side of upper surface so that the photo-sensitive cell 11 and the top surface of forms wiring board 12 flush.The sense
Optical element 11 can also be arranged at close to the side of the lower surface of forms wiring board 12 so that described photosensitive
Element 11 and the bottom surface of forms wiring board 12 flush.It is understood that above-mentioned top surface and basal surface are big
The mode that body flushes is only used as illustrating, and is not intended to limit the present invention.
In the step 1200, the photo-sensitive cell 11 and institute are electrically connected by an at least electrical connecting element 14
State forms wiring board 12.Described connecting line one end connects the photo-sensitive cell 11, and the other end is connected to the window
The top surface of body wiring board 12.
In the step 1300, photo-sensitive cell 11 described in integral packaging, the electrical connecting element 14 and convex
For the electronic component 123 of the forms wiring board 12.
Methods described 1000 can also include step 1400：Adhere to an optical filter 30 in the photo-sensitive cell 11.
The step 1400 can be before the step 1300, can also be after the step 1300.It is described
The mode of attachment can be the mode of bonding.
Methods described 1000 can also include step 1500：Opened up in the main body of forms wiring board 12 to
A few reinforced hole 1213.
Methods described 1000 can also include step 1600：A backboard 17 is attached in the forms wiring board 12
Bottom.
In one embodiment, in the step 1300, the photo-sensitive cell and the forms wiring board it
Between be in contact, the packaging body is integrally connected the photo-sensitive cell and the forms wiring board.
In another embodiment, in the step 1300, the photo-sensitive cell and the forms wiring board it
Between separately, the packaging body is integrally connected and is filled between the photo-sensitive cell and the forms wiring board
To reinforce the photo-sensitive cell and the forms wiring board.
In another embodiment, in the step 1300, between the photo-sensitive cell and the forms wiring board
By a medium mediate contact, the packaging body is integrally connected the photo-sensitive cell, the medium and the window
Body wiring board.For example first surrounding at least part region in the non-photo-sensing area of the photo-sensitive cell is entered by glue
Row solidifies and causes the photo-sensitive cell and the forms wiring board mediate contact.
The mode of the integral packaging is molded mode, for example uses insert molding by injection machine
Or compression molding (compression molding) technique processing.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as
Illustrate and be not intended to limit the present invention.The purpose of the present invention completely and effectively realizes.The present invention function and
Structural principle shows and illustrated in embodiment, under without departing from the principle, embodiments of the present invention
Can there are any deformation or modification.
Claims (32)
- A 1. photosensory assembly, it is characterised in that including：An at least photo-sensitive cell；An at least forms wiring board；WithAn at least packaging body, wherein the photo-sensitive cell and the forms wiring board by the packaging body integratedly Encapsulation, the packaging body form an optical window of the corresponding photo-sensitive cell, and the forms wiring board includes a circuit Plate main body, and the wiring board main body has an at least window, the photo-sensitive cell is arranged in the window.
- 2. photosensory assembly according to claim 1, wherein window are a groove, the photo-sensitive cell quilt It is arranged in the groove.
- 3. photosensory assembly according to claim 2, wherein the photo-sensitive cell and wiring board main body pass through An at least electrical connecting element electrically connects, and described electrical connecting element one end connects the photo-sensitive cell, other end connection The top surface of the wiring board main body, and the wiring board master being connected with the other end of the photo-sensitive cell The top surface of body is located at outside the window.
- 4. photosensory assembly according to claim 2, wherein the photo-sensitive cell and wiring board main body pass through An at least electrical connecting element electrically connects, and described electrical connecting element one end connects the photo-sensitive cell, other end connection The top surface of the wiring board main body, and the wiring board master being connected with the other end of the photo-sensitive cell The top surface of body is located within the window.
- 5. photosensory assembly according to claim 1, wherein the window is a through hole, the photosensitive member Part is arranged in the through hole.
- 6. photosensory assembly according to claim 5, wherein the photo-sensitive cell passes through at least one electrical connection Element electrically connects, and described electrical connecting element one end connects the photo-sensitive cell, and the other end connects the wiring board master The top surface of body.
- 7. photosensory assembly according to claim 6, wherein the photosensory assembly includes a substrate, it is described Substrate is arranged at below the photo-sensitive cell.
- 8. photosensory assembly according to claim 6, wherein the photosensory assembly includes a substrate, it is described Substrate is in groove-like, and the substrate is arranged in the window, and the photo-sensitive cell is housed inside the substrate.
- 9. according to any described photosensory assembly of claim 3 to 8, wherein the packaging body integratedly encapsulates The electrical connecting element.
- 10. photosensory assembly according to claim 9, wherein the photosensory assembly includes an at least electronics Component, protrusion or part protrude from wiring board main body, electronic component described in the packaging body integral packaging.
- 11. photosensory assembly according to claim 9, wherein the photo-sensitive cell include a photosensitive area and Non-photo-sensing area, the packaging body integratedly encapsulate at least a portion non-photo-sensing area.
- 12. photosensory assembly according to claim 11, wherein the photosensory assembly also includes an annular Barriers, the barriers are arranged at around the photosensitive area of photo-sensitive cell.
- 13. photosensory assembly according to claim 9, wherein the packaging body surface is step-like structure.
- 14. photosensory assembly according to claim 9, wherein the packaging body surface is planar structure.
- 15. photosensory assembly according to claim 9, wherein the packaging body includes a cradle portion and one Camera lens part, integratedly extend along the cradle portion outside the camera lens part, be internally formed step-like, the support Portion is used to install an optical filter, and the camera lens part is used to install a camera lens.
- 16. photosensory assembly according to claim 15, wherein it is smooth inside the camera lens part, suitable for peace Fill a non-threaded camera lens.
- 17. photosensory assembly according to claim 15, wherein there is helicitic texture inside the camera lens, Suitable for installing a threaded camera lens.
- 18. photosensory assembly according to claim 9, wherein the wiring board main body has a reinforced hole, The packaging body extends into the reinforced hole.
- 19. photosensory assembly according to claim 9, wherein the wiring board main body has a reinforced hole, The packaging body passes through the reinforced hole, extends to the wiring board bottom part body.
- 20. photosensory assembly according to claim 9, wherein the photosensory assembly includes an optical filter, The optical filter is attached to the photo-sensitive cell.
- 21. photosensory assembly according to claim 9, wherein the photosensory assembly includes an optical filter, The edge of the optical filter is by the packaging body integral packaging.
- 22. photosensory assembly according to claim 9, wherein the photosensory assembly includes a backboard, institute State backboard and be mounted on the wiring board bottom part body.
- 23. photosensory assembly according to claim 9, wherein the integral packaging mode is molded Mode.
- A 24. camera module, it is characterised in that including：At least one according to any described photosensory assembly of claim 1 to 23；WithAn at least camera lens；The camera lens is located at the photosensitive path of the photo-sensitive cell.
- 25. camera module according to claim 24, wherein the camera module includes at least one driving Device, the camera lens are installed in the driver, and the driver is installed in the photosensory assembly.
- 26. camera module according to claim 24, wherein the camera module includes an at least support, The support is installed in the photosensory assembly.
- 27. camera module according to claim 24, wherein the camera module includes multiple senses Optical element and multiple camera lenses, form an array camera module.
- 28. camera module according to claim 27, wherein the forms line of each photosensory assembly Road plate is integrally connected.
- 29. the manufacture method of a photosensory assembly, it is characterised in that including step：(A) photo-sensitive cell is set in a window of a forms wiring board；(B) photo-sensitive cell and the forms wiring board are electrically connected；With(C) packaging body joined integrally with the photo-sensitive cell and the forms wiring board is formed, and is caused The packaging body forms an optical window relative with the photo-sensitive cell.
- 30. manufacture method according to claim 29, wherein in the step (C), it is described photosensitive It is in contact between element and the forms wiring board, the packaging body is integrally connected the photo-sensitive cell and described Forms wiring board.
- 31. manufacture method according to claim 29, wherein in the step (C), it is described photosensitive Between element and the forms wiring board separately, the packaging body is integrally connected and is filled in the photosensitive member To reinforce the photo-sensitive cell and the forms wiring board between part and the forms wiring board.
- 32. manufacture method according to claim 29, wherein in the step (C), it is described photosensitive The sense is integrally connected by a medium mediate contact, the packaging body between element and the forms wiring board Optical element, the medium and the forms wiring board.
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210308539.8A CN114845014A (en) | 2016-07-03 | 2016-07-03 | Photosensitive assembly, camera module and manufacturing method thereof |
| CN201610516600.2A CN107566691B (en) | 2016-07-03 | 2016-07-03 | Photosensitive assembly, camera module and manufacturing method thereof |
| US15/473,565 US10321028B2 (en) | 2016-07-03 | 2017-03-29 | Photosensitive assembly and camera module and manufacturing method thereof |
| KR1020207026503A KR102248312B1 (en) | 2016-07-03 | 2017-06-02 | Photosensitive component, and camera module and manufacturing method therefor |
| KR1020197001783A KR20190020096A (en) | 2016-07-03 | 2017-06-02 | Sensitive parts, camera module and manufacturing method thereof |
| PCT/CN2017/086998 WO2018006673A1 (en) | 2016-07-03 | 2017-06-02 | Photosensitive component, and camera module and manufacturing method therefor |
| KR1020217011305A KR102464978B1 (en) | 2016-07-03 | 2017-06-02 | Photosensitive component, and camera module and manufacturing method therefor |
| EP17823485.2A EP3484139B1 (en) | 2016-07-03 | 2017-06-02 | Photosensitive component, and camera module |
| US16/322,946 US11388320B2 (en) | 2016-07-03 | 2017-06-02 | Photosensitive component, and camera module and manufacturing method therefor |
| JP2018568346A JP6806808B2 (en) | 2016-07-03 | 2017-06-02 | Photosensitive assembly, camera module and its manufacturing method |
| US16/392,595 US10582097B2 (en) | 2016-07-03 | 2019-04-23 | Photosensitive assembly and camera module and manufacturing method thereof |
| JP2020200168A JP7289286B2 (en) | 2016-07-03 | 2020-12-02 | Photosensitive assembly and camera module and manufacturing method thereof |
| US17/540,642 US11627239B2 (en) | 2016-07-03 | 2021-12-02 | Photosensitive assembly and camera module and manufacturing method thereof |
| US17/829,721 US11729483B2 (en) | 2016-07-03 | 2022-06-01 | Photosensitive component, and camera module and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610516600.2A CN107566691B (en) | 2016-07-03 | 2016-07-03 | Photosensitive assembly, camera module and manufacturing method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210308539.8A Division CN114845014A (en) | 2016-07-03 | 2016-07-03 | Photosensitive assembly, camera module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107566691A true CN107566691A (en) | 2018-01-09 |
| CN107566691B CN107566691B (en) | 2022-05-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109218582A (en) * | 2018-09-29 | 2019-01-15 | Oppo广东移动通信有限公司 | Mould group and preparation method thereof, camera and electronic device |
| CN109361834A (en) * | 2018-10-15 | 2019-02-19 | 信利光电股份有限公司 | Camera module structure |
| CN109451205A (en) * | 2018-10-15 | 2019-03-08 | 信利光电股份有限公司 | A kind of novel camera module |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN110839124A (en) * | 2018-08-16 | 2020-02-25 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| WO2020038139A1 (en) * | 2018-08-21 | 2020-02-27 | 宁波舜宇光电信息有限公司 | Camera module, molding photosensitive assembly and manufacturing method therefor, and electronic device |
| CN111355871A (en) * | 2018-12-21 | 2020-06-30 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN111866321A (en) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light |
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| WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120018830A1 (en) * | 2010-07-26 | 2012-01-26 | Wen Chang Lin | Packaging device of image sensor |
| CN102782574A (en) * | 2010-01-11 | 2012-11-14 | 弗莱克斯电子有限责任公司 | Camera module with molded tape flip chip imager mount and method of manufacture |
| CN103915393A (en) * | 2012-12-28 | 2014-07-09 | 群丰科技股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN105681637A (en) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Array camera module and photosensitive assembly thereof and manufacturing method |
| CN105681640A (en) * | 2016-03-28 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN105704354A (en) * | 2016-03-12 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof and manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593116A (en) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | Thinned image capture module and manufacturing method thereof |
| TWI650016B (en) * | 2013-08-22 | 2019-02-01 | 新力股份有限公司 | Imaging device, manufacturing method and electronic device |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
-
2016
- 2016-07-03 CN CN202210308539.8A patent/CN114845014A/en active Pending
- 2016-07-03 CN CN201610516600.2A patent/CN107566691B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102782574A (en) * | 2010-01-11 | 2012-11-14 | 弗莱克斯电子有限责任公司 | Camera module with molded tape flip chip imager mount and method of manufacture |
| US20120018830A1 (en) * | 2010-07-26 | 2012-01-26 | Wen Chang Lin | Packaging device of image sensor |
| CN103915393A (en) * | 2012-12-28 | 2014-07-09 | 群丰科技股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN105704354A (en) * | 2016-03-12 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof and manufacturing method |
| CN105681637A (en) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Array camera module and photosensitive assembly thereof and manufacturing method |
| CN105681640A (en) * | 2016-03-28 | 2016-06-15 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
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| CN109361834A (en) * | 2018-10-15 | 2019-02-19 | 信利光电股份有限公司 | Camera module structure |
| CN109451205A (en) * | 2018-10-15 | 2019-03-08 | 信利光电股份有限公司 | A kind of novel camera module |
| CN111355871A (en) * | 2018-12-21 | 2020-06-30 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| US11991429B2 (en) | 2019-03-13 | 2024-05-21 | Lg Innotek Co., Ltd. | Camera module |
| CN113574853B (en) * | 2019-03-13 | 2024-01-19 | Lg伊诺特有限公司 | Camera module |
| CN113574853A (en) * | 2019-03-13 | 2021-10-29 | Lg伊诺特有限公司 | Camera module |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN111866321B (en) * | 2019-04-30 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light |
| CN111866321A (en) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light |
| WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
| WO2021027905A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module, and electronic device |
| CN113992835A (en) * | 2021-12-27 | 2022-01-28 | 江西联益光学有限公司 | Camera module, assembling method thereof and electronic module |
| CN116435375A (en) * | 2023-06-14 | 2023-07-14 | 苏州中航天成电子科技有限公司 | Stamping cover plate structure for self-positioning of optical window |
| CN116435375B (en) * | 2023-06-14 | 2023-09-15 | 苏州中航天成电子科技有限公司 | Stamping cover plate structure for self-positioning of optical window |
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| CN107566691B (en) | 2022-05-27 |
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